TWI664320B - 自碘類蝕刻廢液回收Ａｕ與重製蝕刻溶液之方法 - Google Patents
自碘類蝕刻廢液回收Ａｕ與重製蝕刻溶液之方法 Download PDFInfo
- Publication number
- TWI664320B TWI664320B TW107103638A TW107103638A TWI664320B TW I664320 B TWI664320 B TW I664320B TW 107103638 A TW107103638 A TW 107103638A TW 107103638 A TW107103638 A TW 107103638A TW I664320 B TWI664320 B TW I664320B
- Authority
- TW
- Taiwan
- Prior art keywords
- etching solution
- iodine
- cathode
- electrolysis
- etching
- Prior art date
Links
- 238000005530 etching Methods 0.000 title claims abstract description 72
- 229910052740 iodine Inorganic materials 0.000 title claims abstract description 29
- 239000011630 iodine Substances 0.000 title claims abstract description 29
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000007788 liquid Substances 0.000 title description 5
- 239000002699 waste material Substances 0.000 title description 2
- 229910021607 Silver chloride Inorganic materials 0.000 claims abstract description 6
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 claims abstract description 6
- 239000000243 solution Substances 0.000 description 60
- 238000005868 electrolysis reaction Methods 0.000 description 38
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 238000011084 recovery Methods 0.000 description 11
- 238000007654 immersion Methods 0.000 description 6
- 238000001556 precipitation Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 238000006722 reduction reaction Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- XMBWDFGMSWQBCA-UHFFFAOYSA-M iodide Chemical compound [I-] XMBWDFGMSWQBCA-UHFFFAOYSA-M 0.000 description 3
- 229940006461 iodide ion Drugs 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000005341 cation exchange Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- -1 iodide ions Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- WRTMQOHKMFDUKX-UHFFFAOYSA-N triiodide Chemical compound I[I-]I WRTMQOHKMFDUKX-UHFFFAOYSA-N 0.000 description 2
- 229940006158 triiodide ion Drugs 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 150000002496 iodine Chemical class 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000010979 pH adjustment Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B1/00—Electrolytic production of inorganic compounds or non-metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B15/00—Operating or servicing cells
- C25B15/08—Supplying or removing reactants or electrolytes; Regeneration of electrolytes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
- C25C1/20—Electrolytic production, recovery or refining of metals by electrolysis of solutions of noble metals
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Hydrology & Water Resources (AREA)
- Environmental & Geological Engineering (AREA)
- Water Supply & Treatment (AREA)
- Inorganic Chemistry (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017025928A JP6167254B1 (ja) | 2017-02-15 | 2017-02-15 | ヨウ素系エッチング廃液からのＡｕ回収とエッチング溶液を再生する方法 |
| JPJP2017-025928 | 2017-02-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201837237A TW201837237A (zh) | 2018-10-16 |
| TWI664320B true TWI664320B (zh) | 2019-07-01 |
Family
ID=59351307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107103638A TWI664320B (zh) | 2017-02-15 | 2018-02-01 | 自碘類蝕刻廢液回收Ａｕ與重製蝕刻溶液之方法 |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP6167254B1 (ja) |
| CN (1) | CN109312482B (ja) |
| MY (1) | MY188325A (ja) |
| PH (1) | PH12018502401B1 (ja) |
| SG (1) | SG11201809683PA (ja) |
| TW (1) | TWI664320B (ja) |
| WO (1) | WO2018150811A1 (ja) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12534390B2 (en) | 2023-07-14 | 2026-01-27 | Claros Technologies Inc. | Methods and systems of nitrate removal in aqueous systems for improved PFAS destruction |
| US20250019286A1 (en) | 2023-07-14 | 2025-01-16 | Claros Technologies Inc. | Methods and Systems of Nitrate Removal in Aqueous Systems for Improved PFAS Destruction |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201512104A (zh) * | 2013-05-31 | 2015-04-01 | Asahipretec Corp | 含金的碘系蝕刻液的處理方法及處理裝置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60177192A (ja) * | 1984-02-23 | 1985-09-11 | Shinko Electric Ind Co Ltd | 金および銀が共存する金めつき剥離廃液からの金および銀の分離回収方法 |
| JPH01184281A (ja) * | 1988-01-14 | 1989-07-21 | Tanaka Kikinzoku Kogyo Kk | ヨウ素による化学エッチング方法 |
| JP2003105570A (ja) * | 2001-09-28 | 2003-04-09 | Kawasaki Kasei Chem Ltd | 貴金属の回収方法ならび回収装置 |
-
2017
- 2017-02-15 JP JP2017025928A patent/JP6167254B1/ja active Active
-
2018
- 2018-01-19 MY MYPI2018704266A patent/MY188325A/en unknown
- 2018-01-19 WO PCT/JP2018/001580 patent/WO2018150811A1/ja not_active Ceased
- 2018-01-19 CN CN201880001547.XA patent/CN109312482B/zh active Active
- 2018-01-19 SG SG11201809683PA patent/SG11201809683PA/en unknown
- 2018-02-01 TW TW107103638A patent/TWI664320B/zh active
- 2018-11-14 PH PH12018502401A patent/PH12018502401B1/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201512104A (zh) * | 2013-05-31 | 2015-04-01 | Asahipretec Corp | 含金的碘系蝕刻液的處理方法及處理裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| SG11201809683PA (en) | 2018-11-29 |
| JP6167254B1 (ja) | 2017-07-19 |
| WO2018150811A1 (ja) | 2018-08-23 |
| CN109312482B (zh) | 2021-01-12 |
| TW201837237A (zh) | 2018-10-16 |
| MY188325A (en) | 2021-11-30 |
| CN109312482A (zh) | 2019-02-05 |
| JP2018131655A (ja) | 2018-08-23 |
| PH12018502401A1 (en) | 2019-09-23 |
| PH12018502401B1 (en) | 2019-09-23 |
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