TWI664389B - Apparatus and method for measuring thickness or height variation of object - Google Patents
Apparatus and method for measuring thickness or height variation of object Download PDFInfo
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- 238000001514 detection method Methods 0.000 claims abstract description 51
- 238000005259 measurement Methods 0.000 claims description 41
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- 238000000691 measurement method Methods 0.000 claims description 8
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
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Abstract
本發明揭示一種設置至對象物體的上部而測定上述對象 物體的厚度或高度變化的裝置及方法。所揭示的測定裝置包括:光源,射出探測光;光聚焦部,對上述探測光進行聚焦而照射至上述對象物體;光感測部,檢測自上述對象物體的反射面出射的反射光的變化,且包括夏克-哈特曼感測器;及運算部,利用藉由上述光感測部而檢測到的上述反射光的變化計算上述反射面的高度變化。 The present invention discloses an object which is installed on an upper part of an object to measure the object. Device and method for changing thickness or height of an object. The disclosed measuring device includes a light source that emits detection light, a light focusing unit that focuses the detection light and irradiates the target object, and a light sensing unit that detects a change in reflected light emitted from a reflection surface of the target object, It further includes a Shack-Hartman sensor; and a computing unit that calculates a change in height of the reflecting surface by using a change in the reflected light detected by the light sensing unit.
Description
本發明是有關於一種測定裝置及測定方法,詳細而言,有關於一種可測定物體的厚度或高度變化、或測定物體的形狀的裝置及方法。 The present invention relates to a measuring device and a measuring method, and more particularly, to a device and a method capable of measuring a change in the thickness or height of an object or a shape of an object.
夏克-哈特曼(shack-hartmann)感測器是一種於天體望遠鏡或驗光儀等領域中測定於特定區域反射的光波面(light wavefront)的應變或像差的裝置,通常用於利用以此方式測定到的光波面的應變或像差於特定區域中測定面的形狀。 A shack-hartmann sensor is a device that measures the strain or aberration of a light wavefront reflected from a specific area in the field of astronomical telescopes or optometry, and is usually used to use The strain or aberration of the light wave surface measured in this way is smaller than the shape of the measurement surface in a specific area.
然而,夏克-哈特曼感測器存在無法測定物體的整體厚度或高度變化的極限。例如,於欲測定堆載於如平台的表面的基準面上的具有不同的厚度的晶圓之間的厚度差時,夏克-哈特曼感測器無法測定上述厚度差或於測定中會存在較大制約。其原因在於,照射至物體的探測光(probe light)的尺寸需大至涵蓋所有晶圓及基準面的程度,且基準面成為探測光的反射面而基準面與測定面的高度差不應超過夏克-哈特曼感測器的測定極限(例如,探 測光波長的約30倍左右)。 However, the Shack-Hartman sensor has a limit that cannot measure the change in the overall thickness or height of an object. For example, when measuring the thickness difference between wafers with different thicknesses stacked on a reference surface such as a surface of a platform, a Shack-Hartman sensor cannot measure the thickness difference or may There are major constraints. The reason is that the size of the probe light irradiated to the object needs to be large enough to cover all wafers and reference planes, and the reference plane becomes the reflection plane of the probe light, and the height difference between the reference plane and the measurement plane should not exceed The limit of measurement for a Shack-Hartman sensor (for example, About 30 times the metering wavelength).
根據本發明的一實施例,提供一種可測定物體的高度、厚度或高度變化,或測定物體的形狀的裝置及方法。 According to an embodiment of the present invention, an apparatus and method for measuring the height, thickness, or height change of an object, or measuring the shape of an object are provided.
於本發明的一態樣中,提供一種測定裝置,其是設置至對象物體的上部而測定對象物體的厚度或高度變化的裝置,測定裝置包括:光源,射出探測光(probe light);光聚焦部,對探測光進行聚焦而照射至對象物體;光感測部,檢測自對象物體的反射面出射的反射光的變化,且包括夏克-哈特曼(shack-hartmann)感測器;及運算部,利用藉由光感測部而檢測到的反射光的變化計算反射面的高度變化。 In one aspect of the present invention, there is provided a measuring device that is provided on an upper portion of a target object and measures a change in thickness or height of the target object. The measuring device includes a light source that emits probe light; light focusing A light detecting unit that focuses the detection light and irradiates the target object; a light sensing unit that detects a change in the reflected light emitted from the reflective surface of the target object, and includes a shack-hartmann sensor; and The computing unit calculates a change in the height of the reflecting surface using a change in the reflected light detected by the light sensing unit.
此處,夏克-哈特曼感測器可檢測反射光的光波面(light wavefront)變化。 Here, the Shack-Hartman sensor can detect a change in the light wavefront of the reflected light.
測定裝置可更包括分束器(beam splitter),分束器設置至光源與光聚焦部之間,使探測光及反射光中的任一者透射且反射探測光及反射光中的另一者。測定裝置能夠以可相對於對象物體進行上下移動的方式設置。 The measuring device may further include a beam splitter. The beam splitter is provided between the light source and the light focusing portion, and transmits either one of the detection light and the reflected light and reflects the other of the detection light and the reflected light. . The measurement device can be installed so that it can move up and down with respect to a target object.
運算部可利用以數式表示藉由光感測部而檢測到的反射光的變化的澤尼克多項式(Zernike polynomials)計算反射面的高度變化。此處,反射面的高度變化可與澤尼克多項式的散焦 (defocus)項係數值的變化對應。 The arithmetic unit may calculate a change in the height of the reflecting surface by using a Zernike polynomials that expresses a change in the reflected light detected by the light sensing unit in a mathematical expression. Here, the height variation of the reflecting surface can be related to the defocus of the Zernike polynomial. The (defocus) term coefficient value changes.
對象物體可堆載至平台。於該情形時,平台可包括反射測定束的反射面。 Objects can be stacked on the platform. In this case, the platform may include a reflective surface that reflects the measurement beam.
於另一態樣中,提供一種測定方法,其是利用包括光源、光聚焦部、光感測部及運算部的測定裝置測定對象測定物體的厚度或高度變化的方法,光源射出探測光,光聚焦部對探測光進行聚焦,光感測部包括檢測反射光的變化的夏克-哈特曼感測器,運算部計算高度變化,測定方法至少包括如下步驟:於設定測定裝置的基準點後,將與基準點上下移動對應的校正資料(calibration data)輸入至運算部的步驟;於平台裝載(loading)對象物體的步驟;藉由光聚焦部向對象物體照射自光源射出的探測光的步驟;由光感測部檢測自對象物體的反射面出射的反射光的變化的步驟;及運算部利用藉由光感測部而檢測到的反射光的變化計算反射面的高度變化的步驟。 In another aspect, a measurement method is provided, which is a method of measuring a change in the thickness or height of an object to be measured by a measurement device including a light source, a light focusing portion, a light sensing portion, and a calculation portion. The light source emits detection light. The focusing unit focuses the detection light. The light sensing unit includes a Shaker-Hartman sensor that detects changes in the reflected light. The computing unit calculates the height change. The measuring method includes at least the following steps: after setting the reference point of the measuring device , The step of inputting calibration data corresponding to the up and down movement of the reference point to the arithmetic unit; the step of loading the target object on the platform; the step of irradiating the target object with the detection light emitted from the light source by the light focusing unit A step of detecting a change in the reflected light emitted from the reflective surface of the target object by the light sensing portion; and a step of calculating a change in the height of the reflective surface by using the change in the reflected light detected by the light sensing portion by the computing portion.
於光源與光聚焦部之間,可設置使探測光及反射光中的任一者透射且反射探測光及反射光中的另一者的分束器。 A beam splitter may be provided between the light source and the light focusing portion to transmit either one of the detection light and the reflected light and reflect the other of the detection light and the reflected light.
運算部可利用以數式表示藉由光感測部而檢測到的反射光的變化的澤尼克多項式計算反射面的高度變化。此處,反射面的高度變化可與澤尼克多項式的散焦項係數值的變化對應。 The computing unit may calculate a change in the height of the reflecting surface using a Zernike polynomial that expresses a change in the reflected light detected by the light sensing unit in a mathematical expression. Here, the change in the height of the reflecting surface may correspond to the change in the defocus term coefficient value of the Zernike polynomial.
校正資料可包括因基準點上下移動引起的澤尼克多項式的散焦項係數值的變化。 The correction data may include a change in the defocus term coefficient value of the Zernike polynomial caused by the reference point moving up and down.
將校正資料輸入至運算部的步驟可至少包括如下步 驟:於平台裝載基準物體的步驟;於基準物體上設定測定裝置的基準點的步驟;測定因基準點上下移動引起的散焦項係數值的變化的步驟;及將校正資料儲存至運算部的步驟。 The steps for inputting the calibration data to the calculation part may include at least the following steps Step: a step of loading a reference object on the platform; a step of setting a reference point of the measuring device on the reference object; a step of measuring a change in a defocus term coefficient value caused by the vertical movement of the reference point; and a step of storing correction data in the calculation section step.
此處,測定因基準點上下移動引起的散焦項係數值的變化的步驟可至少包括如下步驟:光感測部檢測因基準點上下移動引起的反射光的光波面變化的步驟;及運算部利用藉由光感測部而檢測到的反射光的光波面變化測定散焦項係數值的變化的步驟。 Here, the step of measuring a change in the defocus term coefficient value caused by the vertical movement of the reference point may include at least the following steps: a step of the light sensing unit detecting a change in a light wave surface of the reflected light caused by the vertical movement of the reference point; and a calculation unit A step of measuring a change in a defocus term coefficient value using a change in a light wave surface of the reflected light detected by the light sensing section.
將校正資料輸入至運算部的步驟可包括如下步驟:於平台上設定測定裝置的基準點的步驟;測定因基準點上下移動引起的散焦項係數值的變化的步驟;及將校正資料儲存至運算部的步驟。 The step of inputting the correction data to the arithmetic unit may include the following steps: a step of setting a reference point of the measuring device on the platform; a step of measuring a change in a defocus term coefficient value caused by the vertical movement of the reference point; and storing the correction data to Steps of the arithmetic unit.
此處,測定因基準點上下移動引起的散焦項係數值的變化的步驟可至少包括如下步驟:光感測部檢測因基準點上下移動引起的反射光的光波面變化的步驟;及運算部利用藉由光感測部而檢測到的反射光的光波面變化測定散焦項係數值的變化的步驟。 Here, the step of measuring a change in the defocus term coefficient value caused by the vertical movement of the reference point may include at least the following steps: a step of the light sensing unit detecting a change in a light wave surface of the reflected light caused by the vertical movement of the reference point; and a calculation unit A step of measuring a change in a defocus term coefficient value using a change in a light wave surface of the reflected light detected by the light sensing section.
根據本發明的實施例,可藉由如下方式測定對象物體的反射面的高度變化:光聚焦部對探測光進行聚焦而照射至對象物體,包括夏克-哈特曼感測器的光感測部檢測自對象物體反射的反射光的光波面變化,運算部利用藉由光感測部而檢測到的反射光 的光波面變化計算散焦項的係數值。藉此,可有效且準確地測定例如晶圓或板狀物體的對象物體的厚度或高度變化。並且,若向對象物體掃描自光源出射的探測光,則可測定與掃描線或掃描面積對應的對象物體的形狀。另外,藉由包括夏克-哈特曼感測器的光感測部測定的厚度或高度變化與光感測部的傾斜程度無關,因此於設置測定裝置時,能夠於光學上較為容易的方式排列光感測部。 According to the embodiment of the present invention, the height change of the reflective surface of the target object can be measured by: the light focusing portion focuses the detection light and irradiates the target object, including light sensing by a Shack-Hartmann sensor The detection unit detects a light wave surface change of the reflected light reflected from the target object, and the calculation unit uses the reflected light detected by the light sensing unit. Calculate the coefficient value of the defocus term of the light wave surface change. This makes it possible to effectively and accurately measure changes in the thickness or height of a target object such as a wafer or a plate-like object. In addition, when the probe light emitted from the light source is scanned toward the target object, the shape of the target object corresponding to the scan line or scan area can be measured. In addition, the change in thickness or height measured by the light sensor section including the Shack-Hartmann sensor has nothing to do with the degree of inclination of the light sensor section. Therefore, when the measurement device is installed, it can be optically easier. Arrange the light sensing section.
50‧‧‧平台 50‧‧‧platform
51‧‧‧基準物體 51‧‧‧ reference object
55‧‧‧對象物體 55‧‧‧Object
100‧‧‧測定裝置 100‧‧‧ measuring device
110‧‧‧光源 110‧‧‧light source
120‧‧‧分束器 120‧‧‧ Beamsplitter
130‧‧‧光聚焦部 130‧‧‧light focusing section
140‧‧‧光感測部 140‧‧‧Light Sensor
150‧‧‧運算部 150‧‧‧ Computing Department
401~407‧‧‧步驟 401 ~ 407‧‧‧step
L1‧‧‧探測光 L1‧‧‧Probe Light
L2‧‧‧反射光 L2‧‧‧Reflected light
P‧‧‧基準點 P‧‧‧ benchmark
S‧‧‧反射面 S‧‧‧Reflective surface
S1‧‧‧反射面 S1‧‧‧Reflective surface
S2‧‧‧反射面 S2‧‧‧Reflective surface
t1‧‧‧厚度 t1‧‧‧thickness
t、t2‧‧‧厚度 t, t2‧‧‧thickness
W‧‧‧光波面 W‧‧‧ light wave surface
△h‧‧‧高度變化 △ h‧‧‧height change
圖1是概略性地表示本發明的例示性的實施例的測定裝置的圖。 FIG. 1 is a diagram schematically showing a measurement device according to an exemplary embodiment of the present invention.
圖2a至圖2c是用以說明利用圖1所示的測定裝置測定物體的厚度或高度變化的原理的圖。 2a to 2c are diagrams for explaining a principle of measuring a change in thickness or height of an object using the measurement device shown in FIG. 1.
圖3是例示性地表示根據於圖2a至圖2c中與反射面的高度對應地檢測到的反射光的變化計算出的散焦項係數值的圖。 FIG. 3 is a diagram exemplarily showing a defocus term coefficient value calculated from a change in the reflected light detected in accordance with the height of the reflecting surface in FIGS. 2a to 2c.
圖4是用以說明本發明的另一例示性的實施例的測定方法的流程圖(flow chart)。 FIG. 4 is a flow chart for explaining a measurement method according to another exemplary embodiment of the present invention.
圖5a及圖5b是表示圖4所示的測定方法的具體實施例的圖。 5a and 5b are diagrams showing specific examples of the measurement method shown in FIG. 4.
圖6a及圖6b是表示圖4所示的測定方法的另一實施例的圖。 6a and 6b are diagrams showing another example of the measurement method shown in FIG. 4.
以下,參照隨附圖式,詳細地對本發明的實施例進行說明。以下所例示的實施例並不限定本發明的範圍,而是為了向本技術領域具通常知識者說明本發明而提供。於圖中,相同的參照符號表示相同的構成要素,為了說明的明確性,可誇張地表示各構成要素的尺寸或厚度。並且,於說明為特定的物質層存在於基板或其他層時,上述物質層能夠以與基板或其他層直接相接的方式存在,亦可於上述物質層與上述基板或上述其他層之間存在其他第三層。另外,於以下實施例中,構成各層的物質僅為示例,除此之外,亦可使用其他物質。 Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments illustrated below do not limit the scope of the present invention, but are provided to explain the present invention to those skilled in the art. In the figure, the same reference numerals denote the same constituent elements, and the size or thickness of each constituent element may be exaggerated for clarity of explanation. In addition, when it is described that a specific material layer exists on a substrate or other layer, the material layer may exist in direct contact with the substrate or other layer, or may exist between the material layer and the substrate or other layer. The other third layer. In addition, in the following examples, the substances constituting each layer are merely examples, and other substances may be used in addition to the examples.
圖1是概略性地表示本發明的例示性的實施例的測定裝置的圖。圖1所示的測定裝置100可測定物體的厚度或高度變化、或測定物體的形狀。 FIG. 1 is a diagram schematically showing a measurement device according to an exemplary embodiment of the present invention. The measuring device 100 shown in FIG. 1 can measure the thickness or height change of an object, or measure the shape of an object.
參照圖1,測定裝置100可設置至堆載於平台50的對象物體55的上部。本實施例的測定裝置100可包括光源110、光聚焦部130、光感測部140及運算部150。此處,於光源110與光聚焦部130之間,可更設置分束器(beam splitter)120。 Referring to FIG. 1, the measurement device 100 may be provided on an upper portion of a target object 55 stacked on the platform 50. The measurement device 100 in this embodiment may include a light source 110, a light focusing unit 130, a light sensing unit 140, and a computing unit 150. Here, a beam splitter 120 may be further provided between the light source 110 and the light focusing portion 130.
光源110射出為了測定對象物體55的高度而照射至對象物體55的探測光(probe light)L1。如上所述般自光源110射出的探測光L1可透射分束器120。此處,分束器120可使探測光L1與下文將述的反射光L2中的任一者透射且反射探測光L1與反射光L2中的另一者。於圖1中例示性地表示有分束器120使探測光L1透射且使反射光L2反射的情形。然而,本實施例並不限定 於此,分束器120亦能夠以反射探測光L1且使反射光L2透射的方式構成。經由此種分束器120的探測光L1於藉由光聚焦部130而聚焦後,照射至堆載於平台50的對象物體55。 The light source 110 emits probe light L1 that is radiated to the target object 55 in order to measure the height of the target object 55. The probe light L1 emitted from the light source 110 can be transmitted through the beam splitter 120 as described above. Here, the beam splitter 120 may transmit any one of the detection light L1 and the reflected light L2 to be described later and reflect the other of the detection light L1 and the reflected light L2. FIG. 1 exemplarily shows a case where the beam splitter 120 transmits the probe light L1 and reflects the reflected light L2. However, this embodiment is not limited Here, the beam splitter 120 may be configured to reflect the probe light L1 and transmit the reflected light L2. The detection light L1 passing through the beam splitter 120 is focused by the light focusing unit 130 and then irradiated to the target object 55 stacked on the stage 50.
藉由光聚焦部130聚焦而照射於對象物體55的探測光L1自對象物體55的反射面反射。以此方式自對象物體55反射的反射光L2可於經由光聚焦部130而於分束器120反射後,由光感測部140檢測。於本實施例中,光感測部140可包括可檢測反射光L2的光波面(light wavefront)變化的夏克-哈特曼(shack-hartmann)感測器。夏克-哈特曼感測器對反射光L2的光波面的應變或像差進行測定,藉此可檢測反射光L2相對於探測光L1的光波面變化。 The probe light L1 focused by the light focusing unit 130 and irradiated to the target object 55 is reflected from the reflection surface of the target object 55. The reflected light L2 reflected from the target object 55 in this manner can be detected by the light sensing unit 140 after being reflected by the beam splitter 120 through the light focusing portion 130. In this embodiment, the light sensor 140 may include a shack-hartmann sensor capable of detecting a change in the light wavefront of the reflected light L2. The Shack-Hartmann sensor measures the strain or aberration of the light wave surface of the reflected light L2, thereby detecting the change of the light wave surface of the reflected light L2 with respect to the detection light L1.
運算部150可利用藉由光感測部140而檢測到的反射光L2的變化測定對象物體55的反射面的高度變化。具體而言,若光感測部140檢測到反射光L2的光波面變化,則向運算部150發送與上述光波面變化對應的電氣訊號。另外,運算部150可藉由將藉由光感測部140而檢測到的反射光L2的光波面變化構成為作為數學模型的澤尼克多項式(Zernike polynomials)而測定對象物體55的反射面的高度變化。澤尼克多項式可由多個項構成,此處構成澤尼克多項式的各項是指光學像差(aberration),且彼此獨立(orthogonal)。構成此種澤尼克多項式的項中的散焦(defocus)項的係數值可決定對象物體55的厚度或高度變化。於之後敍述該內容的詳細說明。 The computing unit 150 can measure the change in the height of the reflecting surface of the object 55 using the change in the reflected light L2 detected by the light sensing unit 140. Specifically, if the light sensing unit 140 detects a change in the light wave surface of the reflected light L2, it sends an electrical signal corresponding to the change in the light wave surface to the computing unit 150. In addition, the calculation unit 150 can measure the height of the reflection surface of the target object 55 by constructing a Zernike polynomials as a mathematical model by changing the light wave surface of the reflected light L2 detected by the light sensing unit 140. Variety. The Zernike polynomials can be composed of multiple terms. The terms constituting the Zernike polynomials here refer to optical aberrations and are independent of each other. The coefficient value constituting the defocus term among the terms of such Zernike polynomials can determine the thickness or height change of the target object 55. The detailed description of this content will be described later.
測定裝置100能夠以可相對於對象物體55進行上下移動的方式設置。例如,於圖1中,測定裝置100可沿z方向上下移動,或堆載有對象物體55的平台50沿z方向上下移動。並且,測定裝置100及平台50均可沿z方向移動。 The measurement device 100 can be installed so that it can move up and down with respect to the target object 55. For example, in FIG. 1, the measurement device 100 can move up and down in the z direction, or the platform 50 on which the object 55 is stacked can move up and down in the z direction. Both the measurement device 100 and the stage 50 can move in the z direction.
圖2a至圖2c是用以說明利用圖1所示的測定裝置測定物體的厚度或高度變化的原理的圖。 2a to 2c are diagrams for explaining a principle of measuring a change in thickness or height of an object using the measurement device shown in FIG. 1.
於圖2a中,表示有自光源110射出的探測光L1於藉由光聚焦部130聚焦而入射至反射面S後,自反射面S反射的情況。參照圖2a,自光源110射出而透射分束器120的探測光L1於藉由光聚焦部130聚焦後,入射至反射面S。此處,探測光L1可於反射面S上聚焦而形成聚光點。接著,探測光L1可於反射面S反射,反射光L2在分束器120反射後,入射至光感測部140。 FIG. 2 a shows a state where the detection light L1 emitted from the light source 110 is focused by the light focusing unit 130 and is incident on the reflection surface S, and then is reflected from the reflection surface S. Referring to FIG. 2 a, the detection light L1 emitted from the light source 110 and transmitted through the beam splitter 120 is focused by the light focusing portion 130 and then incident on the reflection surface S. Here, the detection light L1 can be focused on the reflection surface S to form a light-condensing point. Then, the detection light L1 can be reflected on the reflecting surface S, and the reflected light L2 is reflected by the beam splitter 120 and then incident on the light sensing part 140.
包括夏克-哈特曼感測器的光感測部140可檢測自反射面S反射的反射光L2的光波面變化。於圖2a中,自反射面S反射的反射光L2的光波面W與探測光L1相同,均為平面波面(plane wavefront),因此無反射光L2的光波面變化。如上所述,可將無反射光L2的光波面的變化的反射面S設定為成為高度測定基準的基準面(reference surface)。此處,基準面的高度例如可設定為“0”。 The light sensing part 140 including a Shack-Hartman sensor can detect a change in the light wave surface of the reflected light L2 reflected from the reflection surface S. In FIG. 2a, the light wave surface W of the reflected light L2 reflected from the reflection surface S is the same as the detection light L1, and both are plane wavefronts, so there is no change in the light wave surface of the reflected light L2. As described above, it is possible to set the reflecting surface S that changes the light wave surface of the non-reflected light L2 as a reference surface that serves as a reference for height measurement. Here, the height of the reference plane can be set to "0", for example.
如上所述,若無自反射面S反射的反射光L2的光波面變化,則於儲存於運算部150的澤尼克多項式中,散焦項的係數值可成為“0”。於該情形時,反射面S的高度可設定為與基準面 的高度相同的“0”。 As described above, if there is no change in the light wave surface of the reflected light L2 reflected from the self-reflecting surface S, the coefficient value of the defocus term in the Zernike polynomial stored in the arithmetic unit 150 can be "0". In this case, the height of the reflecting surface S can be set to be equal to the reference surface. The height is the same as "0".
於圖2b中,表示有自光源110射出的探測光L1於藉由光聚焦部130聚焦而入射至反射面S後反射的情況。於圖2b中,反射面S設置於高於基準面的位置,於該情形時,反射面S的高度可具有“正(+)”值。參照圖2b,自光源110射出而透射分束器120的探測光L1於藉由光聚焦部130而聚焦後,入射至反射面S。此處,由於反射面S設置於高於基準面的位置,因此經由光聚焦部130的探測光L1會於反射面S上散焦。另外,此種探測光L1可於反射面S反射,反射光L2於在分束器120反射後,入射至光感測部140。於該情形時,在分束器120反射出的反射光L2可一面擴散一面入射至光感測部140。 FIG. 2b shows a state where the detection light L1 emitted from the light source 110 is focused by the light focusing unit 130 and is incident on the reflection surface S and then reflected. In FIG. 2b, the reflective surface S is disposed at a position higher than the reference surface. In this case, the height of the reflective surface S may have a “positive (+)” value. Referring to FIG. 2 b, the detection light L1 emitted from the light source 110 and transmitted through the beam splitter 120 is focused by the light focusing portion 130 and then incident on the reflection surface S. Here, since the reflection surface S is disposed at a position higher than the reference surface, the detection light L1 passing through the light focusing section 130 is defocused on the reflection surface S. In addition, such detection light L1 may be reflected on the reflection surface S, and the reflected light L2 is reflected by the beam splitter 120 and then incident on the light sensing unit 140. In this case, the reflected light L2 reflected by the beam splitter 120 may be incident on the light sensing portion 140 while being diffused.
包括夏克-哈特曼感測器的光感測部140可檢測自反射面S出射的反射光L2的光波面變化。如圖2b所示,自位於高於基準面的位置的反射面S反射的反射光L2的光波面W會變成凸出形態而入射至光感測部140。如上所述,若藉由光感測部140而檢測到的反射光L2的光波面變成凸出形態,則於儲存於運算部150的澤尼克多項式中,散焦項的係數可具有“正(+)”值。 The light sensing unit 140 including a Shack-Hartman sensor can detect a change in a light wave surface of the reflected light L2 emitted from the reflection surface S. As shown in FIG. 2b, the light wave surface W of the reflected light L2 reflected from the reflection surface S located at a position higher than the reference surface becomes a convex shape and is incident on the light sensing unit 140. As described above, if the light wave surface of the reflected light L2 detected by the light sensing section 140 becomes convex, the coefficient of the defocus term in the Zernike polynomial stored in the computing section 150 may have a "positive ( +) "Value.
於圖2c中,表示有自光源110射出的探測光L1於藉由光聚焦部130聚焦而入射至反射面S後反射的情況。於圖2c中,反射面S可設置於低於基準面的位置,於該情形時,反射面S的高度可具有“負(-)”值。參照圖2c,自光源110射出而透射分束器120的探測光L1於藉由光聚焦部130聚焦後,入射至反射面 S。此處,由於反射面S設置於低於基準面的位置,因此經由光聚焦部130的探測光L1可於反射面S上散焦。另外,此種探測光L1可於反射面S反射,反射光L2於在分束器120反射後,入射至光感測部140。於該情形時,在分束器120反射出的反射光L2可一面收斂一面入射至光感測部140。 FIG. 2C shows a case where the probe light L1 emitted from the light source 110 is focused by the light focusing section 130 and is incident on the reflection surface S and then reflected. In FIG. 2 c, the reflective surface S may be disposed at a position lower than the reference surface. In this case, the height of the reflective surface S may have a “negative (-)” value. Referring to FIG. 2c, the detection light L1 emitted from the light source 110 and transmitted through the beam splitter 120 is focused by the light focusing portion 130 and then incident on a reflecting surface S. Here, since the reflection surface S is disposed at a position lower than the reference surface, the detection light L1 passing through the light focusing portion 130 can be defocused on the reflection surface S. In addition, such detection light L1 may be reflected on the reflection surface S, and the reflected light L2 is reflected by the beam splitter 120 and then incident on the light sensing unit 140. In this case, the reflected light L2 reflected by the beam splitter 120 may be incident on the light sensor 140 while converging.
包括夏克-哈特曼感測器的光感測部140可檢測自反射面S反射的反射光L2的光波面變化。如圖2c所示,自位於低於基準面的位置的反射面S反射的反射光L2的光波面W變成凹陷形態而入射至光感測部140。如上所述,若藉由光感測部140而檢測到的反射光L2的光波面變成凹陷形態,則於儲存於運算部150的澤尼克多項式中,散焦項的係數可具有“負(-)”值。 The light sensing part 140 including a Shack-Hartman sensor can detect a change in the light wave surface of the reflected light L2 reflected from the reflection surface S. As shown in FIG. 2c, the light wave surface W of the reflected light L2 reflected from the reflection surface S located at a position lower than the reference surface becomes a concave shape and is incident on the light sensing unit 140. As described above, if the light wave surface of the reflected light L2 detected by the light sensing section 140 becomes a concave shape, the coefficient of the defocus term in the Zernike polynomial stored in the arithmetic section 150 may have a "negative (- )"value.
圖3是例示性地表示根據於圖2a至圖2c中與反射面的高度對應地檢測到的反射光的變化計算出的散焦項係數值的圖。 FIG. 3 is a diagram exemplarily showing a defocus term coefficient value calculated from a change in the reflected light detected in accordance with the height of the reflecting surface in FIGS. 2a to 2c.
參照圖3可知,於反射面S的高度與基準面的高度相同地為“0”的情形時,澤尼克多項式的散焦項的係數成為“0”。另外,可知於反射面S的高度具有高於基準面的“正(+)”值的情形時,澤尼克多項式的散焦項的係數具有“正(+)”值。於該情形時,反射面S的高度越高,則散焦項的係數值亦越大。另一方面,可知於反射面S的高度具有低於基準面的“負(-)”值的情形時,澤尼克多項式的散焦項的係數具有“負(-)”值。於該情形時,反射面S的高度越低,則散焦項的係數值亦越小。如下所述,與如上所述的反射面S的高度變化對應的散焦項係數值的 變化可作為校正資料(calibration data)而儲存至測定裝置100的運算部150。 Referring to FIG. 3, when the height of the reflecting surface S and the height of the reference surface are the same as “0”, the coefficient of the defocus term of the Zernike polynomial becomes “0”. In addition, it can be seen that when the height of the reflecting surface S has a “positive (+)” value higher than the reference surface, the coefficient of the defocus term of the Zernike polynomial has a “positive (+)” value. In this case, the higher the height of the reflecting surface S, the larger the coefficient value of the defocus term. On the other hand, it can be seen that when the height of the reflecting surface S has a "negative (-)" value lower than the reference surface, the coefficient of the defocus term of the Zernike polynomial has a "negative (-)" value. In this case, the lower the height of the reflecting surface S, the smaller the coefficient value of the defocus term. As described below, the value of the defocus term coefficient value corresponding to the change in height of the reflecting surface S as described above The change can be stored as calibration data in the calculation unit 150 of the measurement device 100.
另一方面,以上例示性地對如下情形進行了說明:將無反射光L2的光波面變化的情形,即散焦項的係數值成為“0”的情形時的反射面S設定為成為高度測定基準的基準面。然而,本實施例並不限定於此,亦可將散焦項的係數值成為“正(+)”值或“負(-)”值的反射面S設定為基準面。於該情形時,散焦項的係數亦可與反射面S相對於基準面的高度變化對應地改變,可藉由利用以此方式計算出的散焦項係數值的變化測定反射面的高度變化而製作校正資料。 On the other hand, the above has exemplarily explained the case where the reflection surface S when the light wave surface of the unreflected light L2 is changed, that is, when the coefficient value of the defocus term is "0" is set to be a height measurement Datum of datum. However, this embodiment is not limited to this, and the reflection surface S whose coefficient value of the defocus term becomes a "positive (+)" value or a "negative (-)" value may be set as a reference surface. In this case, the coefficient of the defocus term can also be changed corresponding to the change in the height of the reflecting surface S relative to the reference plane. The change in the height of the reflecting surface can be determined by using the change in the defocus term coefficient value calculated in this way. And make calibration data.
圖4是說明本發明的另一例示性的實施例的測定方法的流程圖(flow chart)。於圖4中,表示利用圖1所示的測定裝置100測定物體的厚度或高度變化的方法。 FIG. 4 is a flow chart illustrating a measurement method according to another exemplary embodiment of the present invention. FIG. 4 shows a method of measuring a change in thickness or height of an object using the measurement device 100 shown in FIG. 1.
參照圖4,首先設定測定裝置的基準點(步驟401)。此處,基準點可如上所述般設定至高度為“0”的基準面上。如下所述,此種基準點可設定至基準物體的反射面上或平台的反射面上。 Referring to Fig. 4, first, a reference point of the measurement device is set (step 401). Here, the reference point can be set to a reference plane having a height of “0” as described above. As described below, such a reference point can be set on the reflective surface of a reference object or on the reflective surface of a platform.
接著,測定與基準點上下移動對應的散焦項的係數值(步驟402)。此處,可藉由如圖2a至圖2c所示般自基準面上下移動反射面而實現基準點上下移動,隨著此種基準點上下移動而發生反射光L2的光波面變化,於藉由光感測部140檢測此種反射光L2的光波面變化後,可利用上述光波面變化測定儲存於運算部150的澤尼克多項式的散焦項的係數值。接著,將表示因以此方式 測定到的基準點上下移動引起的散焦項係數值的變化的校正資料儲存至運算部150(步驟403)。 Next, the coefficient value of the defocus term corresponding to the vertical movement of the reference point is measured (step 402). Here, the reference point can be moved up and down by moving the reflecting surface up and down from the reference plane as shown in FIG. 2a to FIG. 2c. With this type of reference point moving up and down, the light wave surface of the reflected light L2 changes. After detecting the change in the light wave surface of the reflected light L2 by the light sensing unit 140, the coefficient value of the defocus term of the Zernike polynomial stored in the calculation unit 150 can be measured using the light wave surface change. Next, it will be shown that The correction data of the change in the defocus term coefficient value caused by the vertical movement of the measured reference point is stored in the calculation unit 150 (step 403).
其次,於平台50上裝載欲進行測定的對象物體55(步驟404)。測定裝置100於移動至上述基準點位置後,自光源110出射探測光L1而照射至對象物體55(步驟405)。此處,自光源110出射的探測光L1可於透射分束器120後,藉由光聚焦部130聚焦而照射至對象物體55。 Next, the target object 55 to be measured is loaded on the platform 50 (step 404). After the measurement device 100 moves to the above-mentioned reference point position, the detection light L1 is emitted from the light source 110 to irradiate the target object 55 (step 405). Here, the detection light L1 emitted from the light source 110 may be focused by the light focusing portion 130 after being transmitted through the beam splitter 120 and irradiated to the target object 55.
接著,光感測部140檢測自對象物體55的反射面出射的反射光L2的光波面變化(步驟406)。具體而言,經由光聚焦部130的探測光L1於對象物體55的反射面反射,以此方式反射出的反射光L2入射至光感測部140。此處,於對象物體55的反射面出射的反射光L2可於經由光聚焦部130而藉由分束器120反射後,入射至光感測部140。另外,包括夏克-哈特曼感測器的光感測部140可檢測反射光L2的光波面變化。 Next, the light sensor 140 detects a light wave surface change of the reflected light L2 emitted from the reflection surface of the target object 55 (step 406). Specifically, the detection light L1 passing through the light focusing unit 130 is reflected on the reflection surface of the target object 55, and the reflected light L2 reflected in this manner is incident on the light sensing unit 140. Here, the reflected light L2 emitted from the reflection surface of the target object 55 may be reflected by the beam splitter 120 through the light focusing portion 130 and then incident on the light sensing portion 140. In addition, the light sensing part 140 including a Shack-Hartman sensor may detect a change in a light wave surface of the reflected light L2.
其次,利用藉由光感測部140而檢測到的反射光L2的變化測定對象物體55的反射面的高度變化(步驟407)。具體而言,藉由光感測部140而檢測到的反射光L2的光波面變化輸入至運算部150,運算部150利用此種反射光L2的光波面變化計算澤尼克多項式的散焦項的係數值。接著,將計算出的散焦項的係數值與儲存於運算部150的校正資料進行比較,藉此可測定對象物體55的反射面相對於基準點的高度變化。亦可利用以此方式測定到的反射面的高度變化測定對象物體55的厚度。 Next, the change in the height of the reflecting surface of the target object 55 is measured using the change in the reflected light L2 detected by the light sensor 140 (step 407). Specifically, the light wave surface change of the reflected light L2 detected by the light sensing unit 140 is input to the calculation unit 150, and the calculation unit 150 calculates the defocus term of the Zernike polynomial using the light wave surface change of the reflected light L2. Coefficient value. Then, the calculated coefficient value of the defocus term is compared with the correction data stored in the calculation unit 150, whereby the height change of the reflection surface of the target object 55 with respect to the reference point can be measured. The thickness of the measurement target object 55 may also be measured using the change in the height of the reflecting surface measured in this manner.
圖5a及圖5b是表示圖4所示的測定方法的具體實施例的圖。 5a and 5b are diagrams showing specific examples of the measurement method shown in FIG. 4.
參照圖5a,於平台50上裝載基準物體(reference object)51。此處,基準物體51可具有已知的厚度t1。接著,設定測定裝置100的基準點P。測定裝置100的基準點P可設定至基準物體51的反射面S1上。其次,自測定裝置100的光源110射出而透射分束器120的探測光L1於藉由光聚焦部130聚焦後,入射至基準物體51的反射面S1。接著,探測光L1可於反射面S1反射,反射光L2於在分束器120反射後,入射至光感測部140。 Referring to FIG. 5 a, a reference object 51 is loaded on the platform 50. Here, the reference object 51 may have a known thickness t1. Next, the reference point P of the measurement device 100 is set. The reference point P of the measurement device 100 can be set on the reflection surface S1 of the reference object 51. Next, the detection light L1 emitted from the light source 110 of the measurement device 100 and transmitted through the beam splitter 120 is focused by the light focusing unit 130 and then incident on the reflection surface S1 of the reference object 51. Then, the detection light L1 can be reflected on the reflecting surface S1, and the reflected light L2 is reflected by the beam splitter 120 and then incident on the light sensing part 140.
包括夏克-哈特曼感測器的光感測部140可檢測自基準物體51的反射面S1反射的反射光L2的光波面變化。於圖5a中,表示有如下情形:如圖2a所示般自基準物體51的反射面S1反射而入射於光感測部140的反射光L2的光波面W成為平面波面,因此無反射光L2的光波面變化。如上所述,無反射光L2的光波面變化的基準物體51的反射面S1可相當於成為高度測定基準的基準面。此處,基準面的高度可設定為“0”。 The light sensing part 140 including a Shack-Hartman sensor can detect a change in the light wave surface of the reflected light L2 reflected from the reflection surface S1 of the reference object 51. In FIG. 5a, there is shown a case where the light wave surface W of the reflected light L2 reflected from the reflection surface S1 of the reference object 51 and incident on the light sensing unit 140 becomes a plane wave surface as shown in FIG. 2a, so there is no reflected light L2 Light wave surface changes. As described above, the reflection surface S1 of the reference object 51 without a change in the light wave surface of the reflected light L2 may correspond to the reference surface serving as a reference for height measurement. Here, the height of the reference plane can be set to "0".
如上所述,若無自基準物體51的反射面S1反射的反射光L2的光波面變化,則於儲存於運算部150的澤尼克多項式中,散焦項的係數值可成為“0”。 As described above, if there is no change in the light wave surface of the reflected light L2 reflected from the reflection surface S1 of the reference object 51, the coefficient value of the defocus term in the Zernike polynomial stored in the arithmetic unit 150 can be "0".
其次,測定與基準點P的上下移動對應的散焦項的係數值。此處,可藉由如圖2b及圖2c所示般自基準面上下移動基準物體51的反射面S1而實現基準點P的上下移動。可藉由平台50 與測定裝置100中的至少一者上下移動而實現此種基準點P的上下移動。 Next, the coefficient value of the defocus term corresponding to the vertical movement of the reference point P is measured. Here, the reference point P can be moved up and down by moving the reflection surface S1 of the reference object 51 up and down from the reference plane as shown in FIGS. 2b and 2c. Available with platform 50 This type of vertical movement of the reference point P is achieved by moving up and down with at least one of the measurement devices 100.
隨著基準點P的上下移動而發生基準物體51的反射光L2的光波面變化,於藉由光感測部140檢測此種反射面S1的光波面變化後,可利用上述光波面變化測定儲存於運算部150的澤尼克多項式的散焦項的係數值。 The light wave surface change of the reflected light L2 of the reference object 51 occurs as the reference point P moves up and down. After detecting the light wave surface change of the reflection surface S1 by the light sensing unit 140, the light wave surface change measurement and storage can be used. The coefficient value of the defocus term of the Zernike polynomial used in the arithmetic unit 150.
具體而言,若基準物體51的反射面S1如圖2b所示般自基準面向上方移動,則基準點P的高度具有“正(+)”值,於該情形時,自基準物體51的反射面S1反射的反射光L2的光波面W會變成凸出形態而由光感測部140檢測。如上所述,若藉由光感測部140而檢測到的反射光L2的光波面變成凸出形態,則於儲存於運算部150的以數式表示反射光L2的光波面變化的澤尼克多項式中,散焦項的係數可具有“正(+)”值。 Specifically, if the reflection surface S1 of the reference object 51 moves upward from the reference plane as shown in FIG. 2b, the height of the reference point P has a “positive (+)” value. In this case, the reflection from the reference object 51 is The light wave surface W of the reflected light L2 reflected from the surface S1 becomes a convex shape and is detected by the light sensing unit 140. As described above, if the light wave surface of the reflected light L2 detected by the light sensing unit 140 becomes a convex shape, the Zernike polynomial of the light wave surface change of the reflected light L2 stored in the calculation unit 150 is represented by a formula. The coefficient of the defocus term may have a "positive (+)" value.
其次,若基準物體51的反射面S1如圖2c所示般自基準面向下方移動,則基準點P的高度具有“負(-)”值,於該情形時,自基準物體51的反射面S1反射的反射光L2的光波面會變成凹陷形態而由光感測部140檢測。如上所述,若藉由光感測部140而檢測到的反射光L2的光波面W變成凹陷形態,則於儲存於運算部150的澤尼克多項式中,散焦項的係數可具有“負(-)”值。另一方面,以上對如下情形進行了說明:將無反射光L2的光波面變化的情形,即散焦項的係數值為“0”的情形時的反射面S1設定為成為高度測定基準的基準面。然而,並不限定於此,亦可 將有反射光L2的光波面變化的情形,即散焦項的係數值具有“正(+)”值或“負(-)”值的情形時的反射面S1設定為成為高度測定基準的基準面。 Next, if the reflection surface S1 of the reference object 51 moves downward from the reference plane as shown in FIG. 2c, the height of the reference point P has a "negative (-)" value. In this case, the reflection surface S1 of the reference object 51 The light wave surface of the reflected reflected light L2 becomes a concave shape and is detected by the light sensor 140. As described above, if the light wave surface W of the reflected light L2 detected by the light sensing section 140 becomes a concave shape, the coefficient of the defocus term in the Zernike polynomial stored in the arithmetic section 150 may have a "negative ( -)"value. On the other hand, the above description has been made of the case where the reflection surface S1 is set as the reference for the height measurement when the wave surface of the unreflected light L2 changes, that is, when the coefficient value of the defocus term is "0". surface. However, it is not limited to this, and may be The reflection surface S1 when the wavefront of the reflected light L2 changes, that is, when the coefficient value of the defocus term has a "positive (+)" value or a "negative (-)" value is set as a reference for height measurement. surface.
如上所述,計算因基準點P上下移動引起的散焦項係數值的變化,將以此方式計算出的校正資料儲存至運算部150。另外,可自平台50上卸載(unloading)基準物體51。 As described above, the change in the defocus term coefficient value caused by the vertical movement of the reference point P is calculated, and the correction data calculated in this way is stored in the arithmetic unit 150. In addition, the reference object 51 may be unloaded from the platform 50.
參照圖5b,於平台50上裝載欲進行測定的對象物體55。測定裝置100於移動至上述基準點P的位置後,自光源110出射探測光L1而照射至對象物體55。此處,自光源110出射的探測光L1可於透射分束器120後,藉由光聚焦部130聚焦而照射至對象物體55。 Referring to FIG. 5 b, a target object 55 to be measured is loaded on the platform 50. After the measurement device 100 moves to the position of the reference point P, the detection light L1 is emitted from the light source 110 and irradiates the target object 55. Here, the detection light L1 emitted from the light source 110 may be focused by the light focusing portion 130 after being transmitted through the beam splitter 120 and irradiated to the target object 55.
光感測部140檢測自對象物體55的反射面S2出射的反射光L2的光波面變化。具體而言,經由光聚焦部130的探測光L1於對象物體55的反射面S2反射,反射光L2入射至光感測部140。此處,自對象物體55的反射面S2出射的反射光L2可於經由光聚焦部130而藉由分束器120反射後,入射至光感測部140。包括夏克-哈特曼感測器的光感測部140可檢測反射光L2的光波面變化。 The light sensor 140 detects a light wave surface change of the reflected light L2 emitted from the reflection surface S2 of the target object 55. Specifically, the detection light L1 via the light focusing unit 130 is reflected on the reflection surface S2 of the target object 55, and the reflected light L2 is incident on the light sensing unit 140. Here, the reflected light L2 emitted from the reflection surface S2 of the target object 55 may be reflected by the beam splitter 120 through the light focusing portion 130 and then incident on the light sensing portion 140. The light sensing part 140 including a Shack-Hartman sensor can detect a change in the wavefront of the reflected light L2.
利用藉由光感測部140而檢測到的反射光L2的變化測定對象物體55的反射面S2的高度變化。具體而言,藉由光感測部140而檢測到的反射光L2的光波面變化輸入至運算部150,運算部150利用此種反射光L2的光波面變化計算澤尼克多項式的散 焦項的係數值。另外,可藉由對以此方式計算出的散焦項的係數值與儲存於運算部150的校正資料進行比較而測定對象物體55的反射面S2的高度變化△h。另外,若對以此方式測定到的對象物體55的反射面S2的高度變化△h相加基準物體51的厚度t1,則可測定對象物體55的厚度t2。 The change in height of the reflection surface S2 of the target object 55 is measured using a change in the reflected light L2 detected by the light sensing unit 140. Specifically, the light wave surface change of the reflected light L2 detected by the light sensing unit 140 is input to the calculation unit 150, and the calculation unit 150 calculates the dispersion of the Zernike polynomial using the light wave surface change of the reflected light L2. The coefficient value of the focal term. In addition, the height change Δh of the reflection surface S2 of the target object 55 can be measured by comparing the coefficient value of the defocus term calculated in this way with the correction data stored in the arithmetic unit 150. When the thickness t1 of the reference object 51 is added to the height change Δh of the reflection surface S2 of the target object 55 measured in this manner, the thickness t2 of the target object 55 can be measured.
圖6a及圖6b是表示圖4所示的測定方法的其他實施例的圖。 6a and 6b are diagrams showing other examples of the measurement method shown in FIG. 4.
參照圖6a,設定測定裝置100的基準點P。此處,測定裝置100的基準點P可設定至平台50的反射面S1。其次,自光源110射出而透射分束器120的探測光L1於藉由光聚焦部130聚焦後,入射至平台50的反射面S1。另外,探測光L1可於反射面S1反射,反射光L2於在分束器120反射後,入射至光感測部140。 6a, the reference point P of the measurement device 100 is set. Here, the reference point P of the measurement device 100 can be set to the reflection surface S1 of the stage 50. Next, the detection light L1 emitted from the light source 110 and transmitted through the beam splitter 120 is focused by the light focusing portion 130 and then incident on the reflection surface S1 of the stage 50. In addition, the detection light L1 may be reflected on the reflecting surface S1, and the reflected light L2 is reflected by the beam splitter 120 and then incident on the light sensing unit 140.
包括夏克-哈特曼感測器的光感測部140可檢測自平台50的反射面S1反射的反射光L2的光波面變化。於圖6a中,表示有如下情形:如圖2a所示般自平台50的反射面S1反射而入射至光感測部140的反射光L2的光波面W成為平面波面,因此無反射光L2的光波面變化。如上所述,無反射光L2的光波面變化的平台50的反射面S1可相當於成為高度測定基準的基準面。此處,基準面的高度可設定為“0”。如上所述,若無自平台50的反射面S1反射的反射光L2的光波面變化,則於儲存於運算部150的澤尼克多項式中,散焦項的係數值可成為“0”。 The light sensing part 140 including a Shack-Hartman sensor may detect a change in the light wave surface of the reflected light L2 reflected from the reflection surface S1 of the platform 50. In FIG. 6a, it is shown that the light wave surface W of the reflected light L2 reflected from the reflection surface S1 of the platform 50 and incident on the light sensing unit 140 becomes a plane wave surface as shown in FIG. 2a. Light wave surface changes. As described above, the reflection surface S1 of the stage 50 where the light wave surface of the reflected light L2 does not change may correspond to a reference surface serving as a reference for height measurement. Here, the height of the reference plane can be set to "0". As described above, if there is no change in the light wave surface of the reflected light L2 reflected from the reflection surface S1 of the stage 50, the coefficient value of the defocus term in the Zernike polynomial stored in the arithmetic unit 150 can be "0".
其次,測定與基準點P的上下移動對應的散焦項的係數 值。此處,可藉由如圖2b及圖2c所示般自基準面上下移動平台50的反射面S1而實現基準點P的上下移動。可藉由平台50與測定裝置100中的至少一者上下移動而實現上述基準點P的上下移動。 Next, the coefficient of the defocus term corresponding to the up and down movement of the reference point P is measured. value. Here, the reference point P can be moved up and down by moving the reflection surface S1 of the platform 50 up and down from the reference plane as shown in FIG. 2b and FIG. 2c. The reference point P can be moved up and down by moving at least one of the stage 50 and the measurement device 100 up and down.
隨著基準點P的上下移動而發生於平台50的反射面S1反射的反射光L2的光波面變化,於藉由光感測部140檢測上述反射光L2的光波面變化後,可利用上述光波面變化測定儲存於運算部150的澤尼克多項式的散焦項的係數值。此處,由於已於上述實施例中詳細地對測定與基準點P的上下移動對應的散焦項的係數值的內容進行了說明,因此省略對上述內容的說明。如上所述,計算因基準點P上下移動引起的散焦項係數值的變化,將由此方式獲得的校正資料儲存至運算部。 The light wave surface change of the reflected light L2 reflected on the reflection surface S1 of the stage 50 as the reference point P moves up and down. After the light wave surface change of the reflected light L2 is detected by the light sensing unit 140, the light wave can be used. The surface change measures the coefficient value of the defocus term of the Zernike polynomial stored in the calculation unit 150. Here, since the content of measuring the coefficient value of the defocus term corresponding to the up and down movement of the reference point P has been described in detail in the above embodiment, the description of the above content is omitted. As described above, the change in the defocus term coefficient value caused by the vertical movement of the reference point P is calculated, and the correction data obtained in this way is stored in the arithmetic unit.
另一方面,以上對如下情形進行了說明:將無反射光L2的光波面變化的情形,即散焦項的係數值為“0”的情形時的反射面S1設定為成為高度測定基準的基準面。然而,並不限定於此,亦可將有反射光L2的光波面變化的情形,即散焦項的係數值具有“正(+)”值或“負(-)”值的情形時的反射面S1設定為成為高度測定基準的基準面。 On the other hand, the above description has been made of the case where the reflection surface S1 is set as the reference for the height measurement when the wave surface of the unreflected light L2 changes, that is, when the coefficient value of the defocus term is "0". surface. However, it is not limited to this, and the reflection in the case where the wave surface of the reflected light L2 is changed, that is, the reflection when the coefficient value of the defocus term has a "positive (+)" value or a "negative (-)" value The plane S1 is set as a reference plane that serves as a reference for height measurement.
參照圖6b,於平台50上裝載欲進行測定的對象物體55。測定裝置100於移動至上述基準點P的位置後,自光源110出射探測光L1而照射至對象物體55。此處,自光源110出射的探測光L1可於透射分束器120後,藉由光聚焦部130聚焦而照射至 對象物體55。 6b, a target object 55 to be measured is mounted on the platform 50. After the measurement device 100 moves to the position of the reference point P, the detection light L1 is emitted from the light source 110 and irradiates the target object 55. Here, the detection light L1 emitted from the light source 110 may be focused by the light focusing portion 130 after being transmitted through the beam splitter 120 and irradiated to Target object 55.
光感測部140檢測自對象物體55的反射面S2出射的反射光L2的光波面變化。具體而言,經由光聚焦部130的探測光L1於對象物體55的反射面S2反射,反射光L2入射至光感測部140。此處,自對象物體55的反射面S2出射的反射光L2可於經由光聚焦部130而藉由分束器120反射後,入射至光感測部140。另外,包括夏克-哈特曼感測器的光感測部140可檢測反射光L2的光波面變化。 The light sensor 140 detects a light wave surface change of the reflected light L2 emitted from the reflection surface S2 of the target object 55. Specifically, the detection light L1 via the light focusing unit 130 is reflected on the reflection surface S2 of the target object 55, and the reflected light L2 is incident on the light sensing unit 140. Here, the reflected light L2 emitted from the reflection surface S2 of the target object 55 may be reflected by the beam splitter 120 through the light focusing portion 130 and then incident on the light sensing portion 140. In addition, the light sensing part 140 including a Shack-Hartman sensor may detect a change in a light wave surface of the reflected light L2.
利用藉由光感測部140而檢測到的反射光L2的變化測定對象物體55的反射面S2的高度變化。具體而言,藉由光感測部140而檢測到的反射光L2的光波面變化輸入至運算部150,運算部150利用此種反射光的光波面變化計算澤尼克多項式的散焦項的係數值。另外,可藉由對計算出的散焦項的係數值與儲存於運算部150的校正資料進行比較而測定對象物體55的反射面S2的高度變化△h。此處,對象物體55的反射面S2的高度變化△h可相當於對象物體的厚度t。 The change in height of the reflection surface S2 of the target object 55 is measured using a change in the reflected light L2 detected by the light sensing unit 140. Specifically, the light wave surface change of the reflected light L2 detected by the light sensing unit 140 is input to the calculation unit 150, and the calculation unit 150 calculates the coefficient of the defocus term of the Zernike polynomial using the light wave surface change of the reflected light. value. In addition, the height change Δh of the reflection surface S2 of the target object 55 can be measured by comparing the calculated coefficient value of the defocus term with the correction data stored in the calculation unit 150. Here, the height change Δh of the reflection surface S2 of the target object 55 may correspond to the thickness t of the target object.
如上所述,可藉由如下方式測定對象物體55的反射面的高度變化:光聚焦部130對探測光L1進行聚焦而照射至對象物體55,包括夏克-哈特曼感測器的光感測部140檢測自對象物體55反射的反射光L2的光波面變化,運算部150利用藉由光感測部140而檢測到的反射光的光波面變化計算散焦項的係數值。藉此,例如可有效且準確地測定如晶圓或板狀物體等的對象物體55 的厚度或高度變化。並且,若向對象物體55掃描自光源110出射的探測光L1,則亦可測定與掃描線或掃描面積對應的對象物體55的形狀。另外,藉由包括夏克-哈特曼感測器的光感測部140而測定的厚度或高度變化與光感測部140的傾斜程度無關,因此於設置測定裝置100時,能夠以於光學上較為容易的方式排列光感測部140。 As described above, the height change of the reflecting surface of the target object 55 can be measured by the light focusing unit 130 focusing the detection light L1 and irradiating the target object 55, including the light sense of the Shack-Hartmann sensor. The detection unit 140 detects a change in the light wave surface of the reflected light L2 reflected from the target object 55, and the calculation unit 150 calculates a coefficient value of the defocus term using the change in the light wave surface of the reflected light detected by the light detection unit 140. This makes it possible, for example, to efficiently and accurately measure a target object 55 such as a wafer or a plate-like object. Thickness or height. In addition, if the detection light L1 emitted from the light source 110 is scanned toward the target object 55, the shape of the target object 55 corresponding to the scan line or scan area can also be measured. In addition, the change in thickness or height measured by the light-sensing section 140 including a Shack-Hartman sensor is independent of the degree of inclination of the light-sensing section 140. Therefore, when the measuring device 100 is installed, the optical The light sensor 140 is arranged in a relatively easy manner.
以上,對本發明的實施例進行了說明,但上述實施例僅為示例,於本技術領域內具有常識者應理解,可根據上述實施例實現各種變形及其他等同的實施例。 The embodiments of the present invention have been described above, but the above embodiments are merely examples. Those skilled in the art should understand that various modifications and other equivalent embodiments can be implemented according to the above embodiments.
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