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TWI663610B - Inductive components and electrical and electronic equipment - Google Patents

Inductive components and electrical and electronic equipment Download PDF

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Publication number
TWI663610B
TWI663610B TW107108235A TW107108235A TWI663610B TW I663610 B TWI663610 B TW I663610B TW 107108235 A TW107108235 A TW 107108235A TW 107108235 A TW107108235 A TW 107108235A TW I663610 B TWI663610 B TW I663610B
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Taiwan
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magnetic core
particle diameter
cumulative particle
magnetic
coil body
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TW107108235A
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Chinese (zh)
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TW201903790A (en
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小島章伸
佐藤桂一郎
佐藤昭
中林亮
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日商阿爾卑斯阿爾派股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type
    • H01F17/04Fixed inductances of the signal type with magnetic core
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/24Magnetic cores
    • H01F27/255Magnetic cores made from particles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/29Terminals; Tapping arrangements for signal inductances
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F37/00Fixed inductances not covered by group H01F17/00

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

本發明提供一種即便於電感元件小型化之情形時亦能夠適當地確保絕緣耐壓之電感元件。 本發明之電感元件係具有由被絕緣性材料被覆之導電性金屬材捲繞而成之線圈體、自線圈體延伸之一對端子板、及於內部至少埋入有線圈體之磁芯者,且一對端子板之各者中之一端部位於磁芯外,該電感元件進而具備電性連接於一對端子板之各者並且將磁芯之表面之一部分覆蓋的一對塗佈型電極,磁芯含有磁性粉末,磁性粉末之體積基準之累積粒度分佈係10%累積粒徑D10為1.8 μm以上且3.0 μm以下,50%累積粒徑D50為4 μm以上且5 μm以下,且90%累積粒徑D90為7 μm以上且10 μm以下。The present invention provides an inductive element capable of appropriately ensuring insulation withstand voltage even when the inductive element is miniaturized. The inductive element of the present invention includes a coil body wound with a conductive metal material covered with an insulating material, a pair of terminal plates extending from the coil body, and a magnetic core in which at least the coil body is embedded, And one end portion of each of the pair of terminal plates is located outside the magnetic core, and the inductance element further includes a pair of coating-type electrodes electrically connected to each of the pair of terminal plates and covering a portion of the surface of the magnetic core, The magnetic core contains magnetic powder. The cumulative particle size distribution of the magnetic powder on a volume basis is 10% cumulative particle diameter D10 is 1.8 μm or more and 3.0 μm or less, 50% cumulative particle diameter D50 is 4 μm or more and 5 μm or less, and 90% cumulative The particle diameter D90 is 7 μm or more and 10 μm or less.

Description

電感元件及電子電氣機器Inductive components and electrical and electronic equipment

本發明係關於一種於磁芯中埋入有線圈之電感元件及具備該電感元件之電子電氣機器。 The present invention relates to an inductive element having a coil embedded in a magnetic core and an electronic and electrical equipment provided with the inductive element.

於專利文獻1中記載有一種電感元件,其特徵在於:其係具有由被絕緣性材料被覆之導電性金屬材捲繞而成之線圈體、自上述線圈體延伸之一對端子板、及於內部至少埋入有上述線圈體之磁芯者,且上述一對端子板之各者中之一端部位於上述磁芯外,該電感元件進而具備電性連接於上述一對端子板之各者之一對塗佈型電極,上述一對塗佈型電極之各者具有設置於以沿上述線圈體之捲繞軸之方向為面內方向之上述磁芯之側面之一部分上的側面塗佈部分,上述磁芯係磁性粉末之集合體,上述磁芯中之位於第1區域之磁性粉末之密度低於上述磁芯中之位於第2區域之磁性粉末之密度,該第1區域包含較上述線圈體之外側面更靠外側之區域以及使上述線圈體之外側面於沿上述線圈體之捲繞軸之方向延長而獲得之曲面之外周側之區域,該第2區域包含較上述線圈體之內側面更靠內側之區域以及使上述線圈體之內側面於沿上述線圈體之捲繞軸之方向延長而獲得之曲面之內周側之區域。 Patent Document 1 describes an inductance element, which includes a coil body wound from a conductive metal material covered with an insulating material, a pair of terminal plates extending from the coil body, and At least one of the cores of the coil body is embedded therein, and one end of each of the pair of terminal plates is located outside the magnetic core, and the inductance element further includes a component electrically connected to each of the pair of terminal plates. A pair of coating electrodes, each of the pair of coating electrodes having a side coating portion provided on a portion of a side surface of the magnetic core with a direction along a winding axis of the coil body as an in-plane direction, The magnetic core is a collection of magnetic powders. The density of the magnetic powder in the first region in the magnetic core is lower than the density of the magnetic powder in the second region in the magnetic core. The first region contains a higher density than the coil body. A region further outside the outer side surface and a region on the outer peripheral side of the curved surface obtained by extending the outer side surface of the coil body in the direction of the winding axis of the coil body, the second area including the coil body The inner side surface closer to the inner area of the coil and causing the inner side surface of the extension member and the inner circumferential surface area of the obtained side of the direction of winding axis of the coil body.

[先前技術文獻] [Prior technical literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2017-11042號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2017-11042

如專利文獻1所揭示之具備線圈封入壓粉磁心之電感元件多被用作用以驅動智慧型手機等移動通信終端之顯示部之零件。對於移動通信終端繼續存在薄型化或小型化等要求,對於提高最大顯示亮度等提高顯示部之能力之要求亦繼續存在。以此種要求之存在為背景,而對電感元件要求應對小型化(包含低背化)及絕緣耐壓之提昇(對驅動電壓之高電壓化之應對)之基本上自相矛盾之要求。 As disclosed in Patent Document 1, an inductive element including a coil-enclosed powder magnetic core is often used as a component for driving a display portion of a mobile communication terminal such as a smart phone. For mobile communication terminals, requirements such as thinness and miniaturization continue to exist, and requirements for increasing the display section's capabilities such as increasing the maximum display brightness also continue to exist. Based on the existence of such requirements, the requirements for inductive components to meet miniaturization (including low backing) and insulation withstand voltage (to cope with high voltage driving voltage) are basically contradictory requirements.

本發明係以該現狀為背景,目的在於提供一種即便於電感元件小型化之情形時亦能夠適當地確保絕緣耐壓之電感元件。本發明之目的亦在於提供一種安裝有上述電感元件之電子電氣機器。 The present invention is based on this situation, and an object thereof is to provide an inductive element capable of appropriately ensuring an insulation withstand voltage even when the inductive element is miniaturized. It is also an object of the present invention to provide an electronic and electrical machine equipped with the above-mentioned inductance element.

為解決上述問題而提供之本發明於一態樣中係一種電感元件,其特徵在於:其係具有由被絕緣性材料被覆之導電性金屬材捲繞而成之線圈體、自上述線圈體延伸之一對端子板、及於內部至少埋入有上述線圈體之磁芯者,且上述一對端子板之各者中之一端部位於上述磁芯外,該電感元件進而具備電性連接於上述一對端子板之各者並且將上述磁芯之表面之一部分覆蓋的一對電極,上述磁芯含有磁性粉末,上述磁性粉末之體積基準之累積粒度分佈係10%累積粒徑D10為1.8μm以上且3.0μm以下,50%累積粒徑D50為4μm以上且5μm以下,且90%累積粒徑D90為7μm以上且10μm以下。藉由如上述般設定電感元件之壓粉芯中所含有之磁性粉末之粒度分佈,能夠適當地維持電感元件之磁特性並且提昇絕緣特性。 The present invention provided in order to solve the above-mentioned problems is, in one aspect, an inductance element characterized in that it includes a coil body wound from a conductive metal material covered with an insulating material, and extends from the coil body. A pair of terminal plates, and a magnetic core having at least the coil body embedded therein, and one end of each of the pair of terminal plates is located outside the magnetic core, and the inductance element is further provided with an electrical connection to the above Each of a pair of terminal plates and a pair of electrodes covering a part of the surface of the magnetic core, the magnetic core contains magnetic powder, and the cumulative particle size distribution of the magnetic powder on a volume basis is 10% and the cumulative particle diameter D10 is 1.8 μm or more And 3.0 μm or less, 50% cumulative particle diameter D50 is 4 μm or more and 5 μm or less, and 90% cumulative particle diameter D90 is 7 μm or more and 10 μm or less. By setting the particle size distribution of the magnetic powder contained in the powder core of the inductance element as described above, it is possible to appropriately maintain the magnetic characteristics of the inductance element and improve the insulation characteristics.

於上述電感元件中,存在如下情形:就更穩定地實現適當地維持電 感元件之磁特性並且提昇絕緣特性之觀點而言,較佳為自上述90%累積粒徑D90減去上述10%累積粒徑D10所得之差為5μm以上且7μm以下。又,於上述電感元件中,存在如下情形:就更穩定地實現適當地維持電感元件之磁特性並且提昇絕緣特性之觀點而言,較佳為上述50%累積粒徑D50與自上述90%累積粒徑D90減去上述10%累積粒徑D10所得之差的積為20μm2以上且35μm2以下。 In the above-mentioned inductance element, there is a case where it is preferable to subtract the above-mentioned 10% accumulated particle diameter from the above-mentioned 90% accumulated particle diameter D90 from the viewpoint of more stably realizing appropriately maintaining the magnetic characteristics of the inductive element and improving the insulation characteristics. The difference obtained by the diameter D10 is 5 μm or more and 7 μm or less. In addition, in the above-mentioned inductance element, there is a case where the 50% cumulative particle diameter D50 and the 90% cumulative particle diameter are preferable from the viewpoint of more stably realizing appropriately maintaining the magnetic characteristics of the inductor element and improving the insulation characteristics. The product of the difference between the particle diameter D90 minus the 10% cumulative particle diameter D10 is 20 μm 2 or more and 35 μm 2 or less.

於上述電感元件中,上述導電性金屬材亦可為帶狀。於該情形時,上述線圈體較佳為扁繞捲。於扁繞捲之情形時,能夠使線圈體中進行捲繞後位於相鄰位置之導電性金屬材之間之電位差與例如於α捲之情形時位於相鄰位置之導電性金屬材之間之電位差相比穩定地減小。因此,被覆導電性金屬材之絕緣性材料之絕緣性對電感元件之絕緣特性造成之影響之程度較低。因此,藉由如上述般適當地管理壓粉芯之磁性粉末之粒度分佈,能夠使電感元件之絕緣特性穩定地提昇。 In the above-mentioned inductance element, the conductive metal material may be in a strip shape. In this case, the coil body is preferably a flat wound coil. In the case of flat winding, the potential difference between the conductive metal materials located adjacent to each other after winding in the coil body can be made between the conductive metal materials located adjacent to each other in the case of α winding, for example. The potential difference steadily decreases. Therefore, the degree of influence of the insulating property of the insulating material covering the conductive metal material on the insulating characteristics of the inductance element is low. Therefore, by appropriately managing the particle size distribution of the magnetic powder of the powder core as described above, the insulation characteristics of the inductance element can be stably improved.

於上述電感元件中,上述磁性粉末亦可至少一部分包含非晶質磁性材料。非晶質磁性材料與結晶質磁性材料相比為硬質,因此,於作為由磁性粉末形成磁芯之步驟、例如進行壓粉成形時,磁性粉末之形狀不易變化。因此,若針對作為形成磁芯之前之原料構件之磁性粉末,以具有如上所述之粒度分佈之方式進行製備,則所獲得之磁芯中所包含之磁性粉末之粒度分佈亦大致成為上述粒度分佈。如此,藉由磁性粉末之至少一部分包含非晶質磁性材料,能夠容易地獲得具備如下磁芯之電感元件,該磁芯包含具有上述粒度分佈之磁性粉末。 In the inductance element, the magnetic powder may include at least a part of an amorphous magnetic material. The amorphous magnetic material is harder than the crystalline magnetic material, and therefore, the shape of the magnetic powder is not easily changed as a step of forming a magnetic core from a magnetic powder, for example, by powder compacting. Therefore, if the magnetic powder used as a raw material component before the formation of the magnetic core is prepared in a manner having a particle size distribution as described above, the particle size distribution of the magnetic powder contained in the obtained magnetic core also roughly becomes the particle size distribution described above. . As described above, by including at least a portion of the magnetic powder with an amorphous magnetic material, an inductive element including a magnetic core including the magnetic powder having the above-mentioned particle size distribution can be easily obtained.

於上述電感元件中,上述電極亦可包含塗佈型電極。例如,藉由包含導電膏之塗佈之步驟形成之塗佈型電極因容易製造,故而較佳。電極亦 可具有塗佈型電極與藉由其他方法(可列舉鍍覆、濺鍍等作為具體例)形成之電極之積層構造。再者,若考慮最近對電感元件之小型化之強烈要求,則亦存在電極較佳為包含如上述之其他方法之電極而非塗佈型電極之情形。 In the inductance element, the electrode may include a coating electrode. For example, a coating-type electrode formed by a step of applying a conductive paste is preferable because it is easy to manufacture. Electrode also It may have a laminated structure of a coating-type electrode and an electrode formed by other methods (for example, plating, sputtering, etc. may be cited as specific examples). Furthermore, if the recent strong demand for miniaturization of an inductance element is considered, there are also cases where the electrode is preferably an electrode including other methods as described above rather than a coated electrode.

作為另一態樣,本發明提供一種安裝有上述電感元件之電子電氣機器。 As another aspect, the present invention provides an electronic and electrical machine in which the above-mentioned inductance element is mounted.

利用本發明之電感元件,能夠適當地維持磁特性並且提昇絕緣特性。因此,根據本發明,提供一種即便於電感元件小型化之情形時亦能夠適當地確保絕緣耐壓之電感元件。又,根據本發明,亦提供一種安裝有該電感元件之電子電氣機器。 With the inductance element of the present invention, it is possible to appropriately maintain magnetic characteristics and improve insulation characteristics. Therefore, according to the present invention, it is possible to provide an inductive element capable of appropriately securing an insulation withstand voltage even when the inductive element is miniaturized. In addition, according to the present invention, there is also provided an electronic and electrical equipment in which the inductance element is mounted.

10‧‧‧線圈體 10‧‧‧ Coil Body

10P‧‧‧捲繞體 10P‧‧‧rolled body

20‧‧‧端子板 20‧‧‧Terminal plate

25‧‧‧端子板 25‧‧‧Terminal plate

30‧‧‧磁芯 30‧‧‧ core

31‧‧‧第1成形構件 31‧‧‧The first forming member

32‧‧‧第2成形構件 32‧‧‧ 2nd forming member

33‧‧‧狹縫 33‧‧‧Slit

34‧‧‧狹縫 34‧‧‧Slit

40‧‧‧塗佈型電極 40‧‧‧ coated electrode

40a‧‧‧側面塗佈部分 40a‧‧‧Side coating part

45‧‧‧塗佈型電極 45‧‧‧ Coated electrode

45a‧‧‧側面塗佈部分 45a‧‧‧Side coating part

50‧‧‧壓製機 50‧‧‧Press

51‧‧‧模具本體 51‧‧‧Mould body

52‧‧‧上模 52‧‧‧Mould

53‧‧‧下模 53‧‧‧Die

54‧‧‧模腔 54‧‧‧cavity

100‧‧‧電感元件 100‧‧‧ Inductive element

100P‧‧‧臨時組裝體 100P‧‧‧Temporary assembly

101‧‧‧最接近端子板20之導電性帶體 101‧‧‧ the conductive strip closest to terminal board 20

102‧‧‧最接近端子板25之導電性帶體 102‧‧‧The conductive strip closest to the terminal board 25

BM‧‧‧導電性帶體 BM‧‧‧Conductive tape

D10‧‧‧10%累積粒徑 D10‧‧‧10% cumulative particle size

D50‧‧‧50%累積粒徑 D50‧‧‧50% cumulative particle size

D90‧‧‧90%累積粒徑 D90‧‧‧90% cumulative particle size

EP1‧‧‧導電路徑 EP1‧‧‧ conductive path

EP2‧‧‧導電路徑 EP2‧‧‧ conductive path

EP3‧‧‧導電路徑 EP3‧‧‧ conductive path

G1‧‧‧端子板20與導電性帶體101之間 G1‧‧‧Terminal plate 20 and conductive tape body 101

G2‧‧‧塗佈型電極40與導電性帶體101之間 G2 ‧‧‧ between coated electrode 40 and conductive tape 101

HP1‧‧‧中空部 HP1‧‧‧ Hollow

HP2‧‧‧中空部 HP2‧‧‧ Hollow

P‧‧‧箭頭 P‧‧‧ Arrow

P1‧‧‧施加點 P1‧‧‧application point

P2‧‧‧施加點 P2‧‧‧ applied point

PR1‧‧‧電壓施加端子 PR1‧‧‧Voltage application terminal

PR2‧‧‧電壓施加端子 PR2‧‧‧voltage application terminal

X1‧‧‧方向 X1‧‧‧ direction

X2‧‧‧方向 X2‧‧‧ direction

Y1‧‧‧方向 Y1‧‧‧ direction

Y2‧‧‧方向 Y2‧‧‧ direction

Z1‧‧‧方向 Z1‧‧‧ direction

Z2‧‧‧方向 Z2‧‧‧ direction

圖1係將本發明之一實施形態之電感元件之整體構成局部透視地表示之立體圖。 FIG. 1 is a perspective view showing a part of the overall structure of an inductance element according to an embodiment of the present invention in a perspective perspective.

圖2係(a)將圖1所示之電感元件之整體構成局部透視地表示之俯視圖、及(b)圖2(a)之A-A剖視圖。 FIG. 2 is (a) a plan view showing a part of the entire structure of the inductance element shown in FIG. 1 in a perspective view, and (b) a cross-sectional view taken along A-A in FIG. 2 (a).

圖3係對形成於磁芯內之導電路徑進行說明之圖。 FIG. 3 is a diagram illustrating a conductive path formed in a magnetic core.

圖4係(a)表示用以形成圖1所示之電感元件之捲繞體之整體構成的立體圖、(b)表示包含用以形成圖1所示之電感元件之磁性粉末之成形構件中之一個的立體圖、及(c)表示包含用以形成圖1所示之電感元件之磁性粉末之成形構件中之另一個的立體圖。 FIG. 4 is a perspective view showing the overall structure of a wound body used to form the inductance element shown in FIG. 1, and FIG. 4B is a perspective view of a molded member including magnetic powder used to form the inductance element shown in FIG. 1. A perspective view of one and (c) show a perspective view of the other of a molded member including magnetic powder for forming the inductance element shown in FIG. 1.

圖5係表示使用圖4所示之構件製造電感元件之過程的剖視圖。 FIG. 5 is a cross-sectional view showing a process of manufacturing an inductance element using the component shown in FIG. 4.

圖6係表示對實施例中所使用之磁性粉末之一種測定體積基準之累積 粒度分佈所得之結果的曲線圖。 FIG. 6 shows the accumulation of a measured volume basis for the magnetic powder used in the examples. A graph of the results from the particle size distribution.

圖7係表示關於實施例之環形磁芯之絕緣破壞電場與50%累積粒徑D50之關係的曲線圖。 FIG. 7 is a graph showing the relationship between the dielectric breakdown electric field and the 50% cumulative particle diameter D50 of the toroidal core of the embodiment.

圖8係表示關於實施例之環形線圈之相對磁導率μ與50%累積粒徑D50之關係的曲線圖。 FIG. 8 is a graph showing the relationship between the relative permeability μ and the 50% cumulative particle diameter D50 of the toroidal coil of the embodiment.

圖9係表示關於實施例之環形磁芯之絕緣破壞電場與自90%累積粒徑D90減去10%累積粒徑D10所得之差之關係的曲線圖。 FIG. 9 is a graph showing the relationship between the insulation breakdown electric field of the toroidal core of the example and the difference obtained by subtracting the 10% cumulative particle diameter D10 from the 90% cumulative particle diameter D90.

圖10係表示關於實施例之環形線圈之相對磁導率μ與自90%累積粒徑D90減去10%累積粒徑D10所得之差之關係的曲線圖。 FIG. 10 is a graph showing the relationship between the relative permeability μ of the toroidal coil of the example and the difference obtained by subtracting the 10% cumulative particle diameter D10 from the 90% cumulative particle diameter D90.

圖11係表示關於實施例之環形磁芯之絕緣破壞電場和50%累積粒徑D50與自90%累積粒徑D90減去10%累積粒徑D10所得之差之積之關係的曲線圖。 FIG. 11 is a graph showing the relationship between the product of the dielectric breakdown electric field and the difference between the 50% cumulative particle diameter D50 and the difference obtained by subtracting the 10% cumulative particle diameter D10 from the 90% cumulative particle diameter D90 in the toroidal magnetic core of the embodiment.

圖12係表示關於實施例之環形線圈之相對磁導率μ和50%累積粒徑D50與自90%累積粒徑D90減去10%累積粒徑D10所得之差之積之關係的曲線圖。 FIG. 12 is a graph showing the relationship between the product of the relative permeability μ and the 50% cumulative particle diameter D50 and the difference obtained by subtracting the 10% cumulative particle diameter D10 from the 90% cumulative particle diameter D90 of the toroidal coil of the embodiment.

以下,一面參照圖式一面對本發明之實施形態進行說明。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

圖1係將本發明之一實施形態之電感元件之整體構成局部透視地表示之立體圖。圖2(a)係將圖1所示之電感元件之整體構成局部透視地表示之俯視圖。圖2(b)係圖2(a)之A-A剖視圖。 FIG. 1 is a perspective view showing a part of the overall structure of an inductance element according to an embodiment of the present invention in a perspective perspective. FIG. 2 (a) is a plan view showing a part of the entire structure of the inductance element shown in FIG. 1 in perspective. Fig. 2 (b) is a sectional view taken along the line A-A of Fig. 2 (a).

本發明之一實施形態之電感元件100具有如下構造:具有包含磁性粉末之成形體且於大致立方體或長方體之磁芯30中埋入有線圈體10。作為扁繞線圈之線圈體10係將包含被絕緣性材料被覆之導電性金屬材且剖面為 長方形之帶狀體即導電性帶體捲繞而形成。線圈體10係以導電性帶體之板面與捲繞軸(沿Z1-Z2方向之方向)大致垂直(即,成為沿X-Y面之面)且決定線圈體10之厚度方向之導電性帶體之側端面與捲繞軸平行之朝向,以導電性帶體之板面彼此沿捲繞軸重疊之方式捲繞。因此,線圈體10之上下端面(Z1-Z2方向之兩端面)係以沿線圈體10之線圈之捲繞軸之方向為法線。如圖1及圖2所示,線圈體10係以導電性帶體成為橢圓形之方式捲繞。線圈體10之捲繞之俯視形狀並不限定於橢圓形。線圈體10之捲繞之俯視形狀亦可為真圓形,可由業者適當選擇。再者,線圈體10之剖面形狀並無限定。線圈體10之剖面形狀亦可為圓形。於線圈體10之剖面形狀如上述般為長方形等矩形之情形時,能夠提高線圈體10之佔有率,故而較佳。 An inductance element 100 according to an embodiment of the present invention has a structure in which a coil body 10 is embedded in a magnetic core 30 having a substantially cubic or rectangular parallelepiped shape and having a molded body including magnetic powder. The coil body 10, which is a flat-wound coil, is composed of a conductive metal material covered with an insulating material and has a cross section of A rectangular belt-shaped body, that is, a conductive belt body is formed by winding. The coil body 10 is a conductive tape body in which the plate surface of the conductive tape body is substantially perpendicular to the winding axis (direction along the Z1-Z2 direction) (that is, a surface along the XY plane) and determines the thickness direction of the coil body 10 The side end surface is oriented parallel to the winding axis, and is wound such that the plate surfaces of the conductive tape body overlap each other along the winding axis. Therefore, the upper and lower end faces (both end faces in the Z1-Z2 direction) of the coil body 10 have a direction along the winding axis of the coil of the coil body 10 as a normal line. As shown in FIG. 1 and FIG. 2, the coil body 10 is wound so that the conductive tape body has an oval shape. The plan view shape of the coil body 10 is not limited to an elliptical shape. The winding shape of the coil body 10 in plan view may also be a true circle, which can be appropriately selected by the industry. The cross-sectional shape of the coil body 10 is not limited. The cross-sectional shape of the coil body 10 may be circular. When the cross-sectional shape of the coil body 10 is rectangular, such as a rectangle, as described above, the occupancy rate of the coil body 10 can be increased, which is preferable.

導電性金屬材之具體組成不受限定。較佳為銅、銅合金、鋁、鋁合金等良導體。被覆導電性金屬材之絕緣性材料之種類不受限定。可列舉琺瑯等樹脂系材料作為較佳之材料之具體例。於線圈體10為扁繞線圈之情形時,位於外側面側之絕緣性材料容易被拉伸,因此,較佳為使用即便進行此種拉伸絕緣性亦不易下降之材料。 The specific composition of the conductive metal material is not limited. Good conductors such as copper, copper alloy, aluminum, and aluminum alloy are preferred. The type of the insulating material covering the conductive metal material is not limited. Specific examples of the preferable material include a resin-based material such as enamel. In the case where the coil body 10 is a flat-wound coil, the insulating material located on the outer surface side is easily stretched. Therefore, it is preferable to use a material that does not easily fall in insulation even if such stretching is performed.

於線圈體10已被捲繞成橢圓狀之狀態下,構成線圈體10之導電性帶體之兩個端部突出並進而被回折,從而靠近導電性帶體之末端之部分構成端子板20、25。 In a state where the coil body 10 has been wound into an oval shape, both ends of the conductive tape body constituting the coil body 10 protrude and are then folded back, so that a portion near the end of the conductive tape body constitutes the terminal plate 20, 25.

如圖1所示,構成線圈體10之導電性帶體之一端部首先向谷折方向大致呈直角彎曲,繼而向峰折方向大致呈直角彎曲,進而向谷折方向大致呈直角再次彎折,該最後之彎折部至導電性帶體之末端之部分構成端子板20。構成線圈體10之導電性帶體之一端部於峰折部至第二次之谷折部之間,自磁芯30之內部突出,該部分至導電性帶體之末端之部分位於磁芯 30外。藉由如上述般將構成線圈體10之導電性帶體之一端部彎折,從而自線圈體10延伸之端子板20位於以沿磁芯30中之線圈體10之捲繞軸之方向為法線之面(以下,稱為「磁芯30之上表面」)上,且端子板20之一端部位於磁芯30外。 As shown in FIG. 1, one end portion of the conductive tape body constituting the coil body 10 is first bent at a right angle to the valley fold direction, then bent at a right angle to the peak fold direction, and then bent again at a right angle to the valley fold direction. The portion from the bent portion to the end of the conductive tape body constitutes the terminal plate 20. One end portion of the conductive band body constituting the coil body 10 is between the peak-fold portion and the second valley-fold portion, and protrudes from the inside of the magnetic core 30. The portion from the portion to the end of the conductive band body is located in the magnetic core 30 outside. By bending one of the ends of the conductive tape body constituting the coil body 10 as described above, the terminal plate 20 extending from the coil body 10 is positioned in a direction along the winding axis of the coil body 10 in the magnetic core 30. The surface of the wire (hereinafter, referred to as "upper surface of the magnetic core 30"), and one end portion of the terminal plate 20 is located outside the magnetic core 30.

構成線圈體10之導電性帶體之另一端部首先向峰折方向大致呈直角彎折,繼而向谷折方向大致呈直角三次彎折,該最後之彎折部至導電性帶體之末端之部分構成端子板25。構成線圈體10之導電性帶體之另一端部於第一次之谷折部至第二次之谷折部之間,自磁芯30之內部突出,該部分至導電性帶體之末端之部分位於磁芯30外。藉由如上述般將構成線圈體10之導電性帶體之一端部彎折,從而自線圈體10延伸之端子板25位於磁芯30之上表面上,且端子板25之一端部位於磁芯30外。 The other end portion of the conductive tape body constituting the coil body 10 is first bent at a right angle in the direction of the peak fold, and then bent three times at a right angle in the direction of the valley fold. Forms a terminal plate 25. The other end portion of the conductive band body constituting the coil body 10 is protruded from the inside of the magnetic core 30 between the first valley fold portion and the second valley fold portion, and this portion reaches the end of the conductive band body. Partly outside the magnetic core 30. By bending one end portion of the conductive tape body constituting the coil body 10 as described above, the terminal plate 25 extending from the coil body 10 is located on the upper surface of the magnetic core 30, and one end portion of the terminal plate 25 is located on the magnetic core. 30 outside.

於圖1或圖2所示之電感元件100中,線圈體10與端子板20、25係由同一構件(導電性帶體)構成,但並不限定於此。亦可於構成線圈體10之導電性帶體之端部另外接合構件,由該構件構成端子板20、25。 In the inductance element 100 shown in FIG. 1 or FIG. 2, the coil body 10 and the terminal plates 20 and 25 are made of the same member (conductive belt body), but the invention is not limited to this. A member may be separately joined to the end of the conductive tape body constituting the coil body 10, and the terminal plates 20 and 25 may be constituted by the member.

一對塗佈型電極40、45於磁芯30之上表面電性連接於端子板20、25之各者,進而具有設置於磁芯30之側面之一部分上之側面塗佈部分40a、45a。如圖1所示,塗佈型電極40、45亦設置於構成線圈體10之導電性帶體中之自磁芯30突出之部分所位於之磁芯30之側面及與該側面對向之側面之一部分。又,雖未圖示,但亦可於塗佈型電極40、45上賦予包含鎳、錫等金屬元素之鍍覆膜,以使與向電路基板安裝時所使用之焊料之密接性良好。或者,亦可藉由濺鍍或鍍覆等方法於磁芯30上形成電極膜來代替塗佈型電極40、45。 The pair of coated electrodes 40 and 45 are electrically connected to each of the terminal plates 20 and 25 on the upper surface of the magnetic core 30, and further have side coated portions 40 a and 45 a provided on one of the side surfaces of the magnetic core 30. As shown in FIG. 1, the coated electrodes 40 and 45 are also provided on the side of the core 30 and the side opposite to the side where the protruding portion of the core 30 in the conductive tape body constituting the coil body 10 is located. Part of it. Although not shown, a plating film containing metal elements such as nickel and tin may be provided on the coating electrodes 40 and 45 to improve the adhesion with the solder used when mounting the circuit board. Alternatively, instead of the coating electrodes 40 and 45, an electrode film may be formed on the magnetic core 30 by a method such as sputtering or plating.

如圖2(a)所示,線圈體10係埋入至磁芯30之內部。由於線圈體10係 扁繞捲之線圈,故而構成線圈體10之導電性帶體以沿Z1-Z2方向之捲繞軸為中心進行捲繞。因此,如圖2(b)所示,於線圈體10中於Z1-Z2方向上相鄰之導電性帶體之間之電位差相對較小。因此,於使用電感元件100時,於該等相鄰之導電性帶體之間產生絕緣破壞之可能性較低。因此,導電性帶體中覆蓋導電性金屬材之絕緣性材料之絕緣性對電感元件100之絕緣特性造成之影響輕微。 As shown in FIG. 2 (a), the coil body 10 is embedded inside the magnetic core 30. Since the coil body 10 series Since the coil is wound flat, the conductive tape body constituting the coil body 10 is wound around the winding axis in the direction Z1-Z2. Therefore, as shown in FIG. 2 (b), the potential difference between the conductive tape bodies adjacent in the Z1-Z2 direction in the coil body 10 is relatively small. Therefore, when the inductive element 100 is used, the possibility of insulation damage between the adjacent conductive tape bodies is low. Therefore, the insulating property of the insulating material covering the conductive metal material in the conductive tape body slightly affects the insulation characteristics of the inductance element 100.

另一方面,與線圈體10連續地設置之2個端子板20、25中之端子板20係如圖1所示般,與線圈體10之Z1-Z2方向Z1側端部連續。因此,構成線圈體10之導電性帶體之中,位於Z1-Z2方向Z2側端部且最接近端子板20之導電性帶體101與端子板20之間之電位變得大於另一端子板25與最接近端子板25之導電性帶體102之間之電位。因此,於電感元件100中,在端子板20與導電性帶體101之間G1容易產生絕緣破壞。又,由於端子板20與塗佈型電極40電性連接,故而塗佈型電極40與導電性帶體101之間G2亦為容易產生絕緣破壞之部分。因此,構成磁芯30之構件對電感元件100之絕緣特性造成支配性影響。 On the other hand, as shown in FIG. 1, the terminal plate 20 of the two terminal plates 20 and 25 provided continuously with the coil body 10 is continuous with the end portion on the Z1 side in the Z1-Z2 direction of the coil body 10. Therefore, among the conductive strips constituting the coil body 10, the potential between the conductive strip 101 and the terminal plate 20 located at the end of the Z2 side in the Z1-Z2 direction and closest to the terminal plate 20 becomes larger than that of the other terminal plate. The potential between 25 and the conductive tape body 102 closest to the terminal plate 25. Therefore, in the inductive element 100, insulation breakdown easily occurs between the terminal plate 20 and the conductive tape body 101. In addition, since the terminal plate 20 and the coating electrode 40 are electrically connected, G2 between the coating electrode 40 and the conductive tape body 101 is also a portion prone to insulation breakdown. Therefore, the components constituting the magnetic core 30 have a dominant influence on the insulation characteristics of the inductance element 100.

磁芯30具有含有磁性粉末且包含磁性粉末之成形體之部分。藉由雷射繞射、散射法測定磁芯30中所含有之磁性粉末而獲得之體積基準之累積粒度分佈均以自小粒徑側之累積計,10%累積粒徑D10為1.8μm以上且3.0μm以下,50%累積粒徑D50為4μm以上且5μm以下,且90%累積粒徑D90為7μm以上且10μm以下。 The magnetic core 30 includes a portion of a molded body containing a magnetic powder and a magnetic powder. The volume-based cumulative particle size distribution obtained by measuring the magnetic powder contained in the magnetic core 30 by laser diffraction and scattering methods is based on the accumulation from the small particle diameter side, and the 10% cumulative particle diameter D10 is 1.8 μm or more and 3.0 μm or less, 50% cumulative particle diameter D50 is 4 μm or more and 5 μm or less, and 90% cumulative particle diameter D90 is 7 μm or more and 10 μm or less.

磁芯30中所含有之磁性粉末因製造上之原因或獲取容易性之原因等,不包含單一粒徑之粉末,而包含不同粒徑之粉末之混合體從而具有特定之粒度分佈。包含具有該特定粒度分佈之磁性粉末之磁芯30一般而言以 磁性粉末之中粒徑相對較大之粗粒或中粒相鄰之方式配置而構成作為磁芯30之外形,並以填充形成於該等相鄰之粗粒或中粒之間之間隙之方式定位細粒之磁性粉末。 The magnetic powder contained in the magnetic core 30 does not include a powder having a single particle diameter, but has a specific particle size distribution because it includes a powder having a single particle diameter due to manufacturing reasons or availability. A magnetic core 30 containing a magnetic powder having the specific particle size distribution is generally Among the magnetic powders, relatively coarse particles or medium particles having a relatively large particle size are arranged adjacent to each other to constitute the outer shape of the magnetic core 30, and are used to fill a gap formed between the adjacent coarse particles or medium particles. Position fine magnetic powder.

此處,對電感元件100之絕緣特性造成影響之若干因子之中,磁芯30之絕緣破壞電場係基於提高對磁芯30中之相隔之2點(例如於磁芯30具有環狀之形狀之情形時,為各底面之各1點)施加之電壓而產生絕緣破壞從而於2點間流動電流時之電壓進行定義。於產生該絕緣破壞時,在被施加有電壓之2點間,電流於電阻最低之導電路徑流動。 Here, among several factors that affect the insulation characteristics of the inductive element 100, the insulation destruction electric field of the magnetic core 30 is based on improving the separation of two points in the magnetic core 30 (e.g., the magnetic core 30 has a ring shape) In this case, the voltage when a voltage is applied to each point on each bottom surface to cause insulation breakdown and a current flows between the two points is defined. When this insulation failure occurs, between two points to which a voltage is applied, a current flows in the conductive path having the lowest resistance.

圖3係用以對形成於磁芯30內之導電路徑進行說明之概念圖。如圖3所示,使電壓施加端子PR1、PR2與磁芯30之相隔之2個施加點P1、P2之各者接觸。此時形成於2個施加點P1、P2之間之導電路徑係以自位於一施加點P1之磁性粉末以念珠相連之方式經由複數個磁性粉末而到達至位於另一施加點P2之磁性粉末之方式形成。位於被施加有電壓之2點P1、P2之間之磁性粉末由於如上所述般具有特定之粒徑分佈,故而粒徑相對較大之粗粒或中粒以相鄰之方式定位,且以填充該等粗粒或中粒之間隙之方式定位細粒。因此,如圖3所示,形成於2個施加點P1、P2之間之導電路徑不僅可形成在構成外形之粗粒或中粒主體地流動之導電路徑EP1,而且亦能夠形成除粗粒及中粒以外亦通過細粒之導電路徑EP2、EP3。 FIG. 3 is a conceptual diagram for explaining a conductive path formed in the magnetic core 30. As shown in FIG. 3, the voltage application terminals PR1 and PR2 are brought into contact with each of two separated application points P1 and P2 of the magnetic core 30. At this time, the conductive path formed between the two application points P1 and P2 reaches the magnetic powder located at the other application point P2 through a plurality of magnetic powders by way of a rosary connection from the magnetic powder located at one application point P1. Way to form. The magnetic powder between two points P1 and P2 to which a voltage is applied has a specific particle size distribution as described above, so coarse or medium particles with a relatively large particle size are positioned adjacently and filled with Fine grains are positioned in the way of the coarse or medium grains. Therefore, as shown in FIG. 3, the conductive path formed between the two application points P1 and P2 can not only form the conductive path EP1 flowing in the coarse grain or medium grain constituting the outer shape, but also can form a coarse grain and Besides the medium grains, it also passes the conductive paths EP2 and EP3 of the fine grains.

導電路徑中所包含之磁性粉末之內部之導電性相對較高,因此,位於在導電路徑中相鄰之磁性粉末之各者之表面的氧化膜或表面絕緣被膜、位於相鄰之磁性粉末之間的包含有機系成分等之黏合劑成分等非導電性之物質會對導電路徑整體之電阻造成支配性影響。 The internal conductivity of the magnetic powder contained in the conductive path is relatively high. Therefore, the oxide film or the surface insulation coating on the surface of each of the adjacent magnetic powders in the conductive path is located between the adjacent magnetic powders. Non-conductive materials, such as binder components including organic components, dominate the resistance of the entire conductive path.

因此,於形成於被施加有電壓之2點間之導電路徑中之在構成外形之 粗粒或中粒主體地流動之導電路徑EP1中,構成導電路徑之磁性粉末之數量相對較少,因此,位於導電路徑之非導電性之物質之量相對變少,而導電路徑之電阻值容易變低。相對於此,於形成於被施加有電壓之2點間之導電路徑中之不僅通過構成外形之粗粒或中粒而且亦通過細粒之導電路徑EP2、EP3中,構成導電路徑之磁性粉末之數量相對較多,因此,位於導電路徑之非導電性之物質之量相對變多,從而導電路徑之電阻值容易變高。 Therefore, among the conductive paths formed between two points to which a voltage is applied, In the conductive path EP1 flowing mainly in coarse or medium grains, the amount of magnetic powder constituting the conductive path is relatively small. Therefore, the amount of non-conductive substances located in the conductive path is relatively small, and the resistance value of the conductive path is easy. Go low. On the other hand, among the conductive paths formed between two points to which a voltage is applied, not only the coarse or medium grains constituting the outer shape but also the fine-grained conductive paths EP2 and EP3 constitute the magnetic powder constituting the conductive path. The number is relatively large. Therefore, the amount of non-conductive substances located in the conductive path is relatively increased, so that the resistance value of the conductive path is likely to be high.

如上所述,於產生絕緣破壞時,於形成於被施加有電壓之2點P1、P2之間之導電路徑中之電阻最低之導電路徑中流動電流。因此,於圖3所示之3個導電路徑EP1、EP2、EP3之中,於產生絕緣破壞時電流流動之導電路徑係在構成外形之粗粒或中流主體地流動且通過細粒之量較少之導電路徑EP1。 As described above, when insulation breakdown occurs, a current flows in the conductive path having the lowest resistance among the conductive paths formed between the two points P1 and P2 to which a voltage is applied. Therefore, among the three conductive paths EP1, EP2, and EP3 shown in FIG. 3, the conductive path for the current to flow when an insulation failure occurs is that the coarse particles or medium currents constituting the shape mainly flow and the amount of fine particles is small. Of conductive path EP1.

根據以上之說明可明確,具有特定粒度分佈之磁性粉末之中,對絕緣破壞之產生容易性造成較大影響的為粗粒或中粒之磁性粉末,細粒之磁性粉末對絕緣破壞之產生容易性造成之影響相對較低。即,於磁芯30中所包含之磁性粉末中粗粒之磁性粉末較多之情形時,導電路徑之電阻值容易變低,結果為,電感元件100容易產生絕緣破壞。 According to the above description, it is clear that among magnetic powders with a specific particle size distribution, coarse or medium grain magnetic powders have a greater impact on the susceptibility to insulation damage. Fine-grained magnetic powders easily cause insulation damage. The impact of sex is relatively low. That is, when there are many coarse-grained magnetic powders among the magnetic powders contained in the magnetic core 30, the resistance value of the conductive path is likely to be lowered, and as a result, the inductor 100 is liable to cause insulation breakdown.

如此,就提高絕緣特性之觀點而言,較佳為粗粒之磁性粉末較少,因此,本發明之一實施形態之電感元件100之磁芯30中所包含的磁性粉末之體積基準之累積粒度分佈係90%累積粒徑D90為10μm以下。即,於構成磁芯30之磁性粉末中超過10μm之粒徑者以體積基準計少至未達10%。藉此,能夠提昇電感元件100之絕緣特性。 In this way, from the viewpoint of improving the insulation characteristics, it is preferable that the magnetic powder with coarse grains is small. Therefore, the volume-based cumulative particle size of the magnetic powder included in the magnetic core 30 of the inductor element 100 according to an embodiment of the present invention The distribution system 90% cumulative particle diameter D90 is 10 μm or less. That is, those having a particle size exceeding 10 μm in the magnetic powder constituting the magnetic core 30 are as small as less than 10% on a volume basis. Thereby, the insulation characteristics of the inductive element 100 can be improved.

又,於磁性粉末之體積基準之累積粒度分佈中,於90%累積粒徑D90 為10μm以下之情形時,磁性粉末之體積基準之累積粒度分佈中之50%累積粒徑D50為5μm以下,藉此,尤其能夠提高磁芯30之絕緣破壞電場。 In addition, in the cumulative particle size distribution based on the volume basis of the magnetic powder, the cumulative particle size at 90% is D90. When it is 10 μm or less, the 50% cumulative particle size D50 in the cumulative particle size distribution of the volume basis of the magnetic powder is 5 μm or less, whereby the insulation destruction electric field of the magnetic core 30 can be particularly increased.

如上所述,就提高磁芯30之絕緣破壞電場之觀點而言,磁性粉末較佳為全部為細粒,但於磁性粉末之粒度分佈過度偏向細粒側之情形時,有於構成磁芯30之材料中黏合劑成分等非磁性材料之比率容易升高之傾向。磁芯30中非磁性材料之比率升高會引起相對磁導率等磁特性之下降。又,於磁性粉末之粒徑過小之情形時,有時亦會產生獲取容易性或操作性下降等不良情況。 As described above, from the viewpoint of increasing the dielectric breakdown electric field of the magnetic core 30, the magnetic powder is preferably all fine particles. However, when the particle size distribution of the magnetic powder is excessively deviated to the fine particle side, the magnetic core 30 may be constituted. The ratio of non-magnetic materials such as the binder component in the materials tends to increase. An increase in the ratio of non-magnetic materials in the magnetic core 30 causes a decrease in magnetic characteristics such as relative permeability. Further, when the particle diameter of the magnetic powder is too small, disadvantages such as ease of acquisition and reduction in operability may occur.

因此,就提高電感元件100之絕緣特性並且適當地維持磁特性等之觀點而言,電感元件100之磁芯30中所包含之磁性粉末之體積基準之累積粒度分佈係10%累積粒徑D10設為1.8μm以上且3.0μm以下,50%累積粒徑D50設為4μm以上且5μm以下,且90%累積粒徑D90設為7μm以上且10μm以下。就更穩定地實現適當地維持電感元件100之磁特性之觀點而言,上述10%累積粒徑D10較佳為2.0μm以上,更佳為2.3μm以上。就更穩定地實現提高電感元件100之絕緣特性之觀點而言,上述90%累積粒徑D90較佳為9.0μm以下,更佳為8.8μm以下。 Therefore, from the viewpoint of improving the insulation characteristics of the inductive element 100 and appropriately maintaining the magnetic characteristics, etc., the cumulative particle size distribution of the volume basis of the magnetic powder contained in the magnetic core 30 of the inductive element 100 is 10% of the cumulative particle diameter D10. It is 1.8 μm or more and 3.0 μm or less, the 50% cumulative particle diameter D50 is set to 4 μm or more and 5 μm or less, and the 90% cumulative particle size D90 is set to 7 μm or more and 10 μm or less. From the viewpoint of more stably realizing proper maintenance of the magnetic characteristics of the inductive element 100, the 10% cumulative particle diameter D10 is preferably 2.0 μm or more, and more preferably 2.3 μm or more. From the viewpoint of achieving a more stable improvement in the insulation characteristics of the inductive element 100, the 90% cumulative particle diameter D90 is preferably 9.0 μm or less, and more preferably 8.8 μm or less.

於上述中,自90%累積粒徑D90減去10%累積粒徑D10所得之差(D90-D10,以下,亦存在記載為「△D」之情形)更佳為5μm以上且7μm以下。於△D為5μm以上之情形時,電感元件100之相對磁導率μ等磁特性容易更穩定地提高。又,於△D為7μm以下之情形時,磁芯30之絕緣破壞電場容易更穩定地提高。又,於上述中,進而較佳為將50%累積粒徑D50與△D相乘所得之值即D50×△D為20μm2以上且35μm2以下。於D50×△D為20μm2以上之情形時,電感元件100之相對磁導率μ等磁特性容易更穩定 地提高。又,於D50×△D為35μm2以下之情形時,磁芯30之絕緣破壞電場容易更穩定地提高。 In the above, the difference obtained by subtracting the 10% cumulative particle diameter D10 from the 90% cumulative particle diameter D90 (D90-D10, hereinafter may also be described as “ΔD”) is more preferably 5 μm or more and 7 μm or less. When ΔD is 5 μm or more, the magnetic characteristics such as the relative permeability μ of the inductance element 100 can be improved more stably. When ΔD is 7 μm or less, the dielectric breakdown electric field of the magnetic core 30 is likely to increase more stably. Further, among the above, it is more preferable that D50 × ΔD, which is a value obtained by multiplying the 50% cumulative particle diameter D50 and ΔD, is 20 μm 2 or more and 35 μm 2 or less. When D50 × ΔD is 20 μm 2 or more, the magnetic characteristics such as the relative permeability μ of the inductance element 100 can be improved more stably. When D50 × ΔD is 35 μm 2 or less, the dielectric breakdown electric field of the magnetic core 30 is likely to increase more stably.

磁性粉末之組成及組織不受限定。存在就提高磁特性之觀點而言磁性粉末較佳為Fe基合金之情形。又,磁性粉末既可為結晶質亦可為非晶質(amorphous),還可為包含20nm左右或20nm以下之微細結晶之所謂之奈米結晶質。作為Fe基之結晶質磁性材料之具體例,可列舉Fe-Si-Cr系合金、Fe-Ni系合金、Fe-Co系合金、Fe-V系合金、Fe-Al系合金、Fe-Si系合金、Fe-Si-Al系合金、羰基鐵及純鐵。 The composition and structure of the magnetic powder are not limited. From the viewpoint of improving the magnetic characteristics, there is a case where the magnetic powder is preferably an Fe-based alloy. The magnetic powder may be crystalline or amorphous, and may be so-called nanocrystalline containing fine crystals of about 20 nm or less. Specific examples of the Fe-based crystalline magnetic material include Fe-Si-Cr-based alloys, Fe-Ni-based alloys, Fe-Co-based alloys, Fe-V-based alloys, Fe-Al-based alloys, and Fe-Si-based alloys. Alloys, Fe-Si-Al based alloys, carbonyl iron and pure iron.

作為非晶質磁性材料之具體例,可列舉Fe-Si-B系合金、Fe-P-C系合金及Co-Fe-Si-B系合金。上述非晶質磁性材料既可包含1種材料,亦可包含複數種材料。構成非晶質磁性材料之粉末的磁性材料較佳為選自由上述材料所組成之群中之1種或2種以上之材料,其等之中,較佳為含有Fe-P-C系合金,更佳為由Fe-P-C系合金構成。作為Fe-P-C系合金之具體例,可列舉組成式以Fe100原子%-a-b-c-x-y-z-tNiasnbCrcPxCyBzSit表示且0原子%≦a≦10原子%、0原子%≦b≦3原子%、0原子%≦c≦6原子%、6.8原子%≦x≦13原子%、2.2原子%≦y≦13原子%、0原子%≦z≦9原子%、0原子%≦t≦7原子%之Fe基非晶質合金。於上述組成式中,Ni、Sn、Cr、B及Si為任意添加元素。 Specific examples of the amorphous magnetic material include Fe-Si-B-based alloys, Fe-PC-based alloys, and Co-Fe-Si-B-based alloys. The amorphous magnetic material may include one material or a plurality of materials. The magnetic material constituting the powder of the amorphous magnetic material is preferably one or two or more materials selected from the group consisting of the above materials, and among these, it is more preferable to contain an Fe-PC-based alloy, more preferably It is made of Fe-PC based alloy. Specific examples of the Fe-PC alloy include a composition formula represented by Fe 100 atomic% -abcxyzt Ni a sn b Cr c P x C y B z Si t and 0 atomic% ≦ a ≦ 10 atomic% and 0 atomic%. ≦ b ≦ 3 atom%, 0 atom% ≦ c ≦ 6 atom%, 6.8 atom% ≦ x ≦ 13 atom%, 2.2 atom% ≦ y ≦ 13 atom%, 0 atom% ≦ z ≦ 9 atom%, 0 atom% ≦ t ≦ 7 atomic% Fe-based amorphous alloy. In the above composition formula, Ni, Sn, Cr, B, and Si are arbitrary addition elements.

磁芯30之磁性粉末亦可至少一部分包含非晶質磁性材料。非晶質合金與結晶質合金相比為硬質,因此,於由磁性粉末形成磁芯30之步驟、例如進行壓粉成形時,磁性粉末之形狀不易變化。因此,若針對作為形成磁芯30之前之原料構件的磁性粉末,以具有如上所述之粒度分佈之方式進行製備,則所獲得之磁芯30中所包含之磁性粉末之粒度分佈亦大致成為上述 粒度分佈。如此,藉由磁性粉末之至少一部分包含非晶質磁性材料,而能夠容易地獲得具備如下磁芯30之電感元件100,該磁芯30包含具有上述粒度分佈之磁性粉末。 At least a part of the magnetic powder of the magnetic core 30 may include an amorphous magnetic material. The amorphous alloy is harder than the crystalline alloy, and therefore, the shape of the magnetic powder is unlikely to change during the step of forming the magnetic core 30 from the magnetic powder, for example, by powder compacting. Therefore, if the magnetic powder used as a raw material component before the magnetic core 30 is prepared in such a manner as to have a particle size distribution as described above, the particle size distribution of the magnetic powder contained in the obtained magnetic core 30 also becomes substantially as described above. Particle size distribution. As described above, by including at least a portion of the magnetic powder with an amorphous magnetic material, the inductive element 100 including the magnetic core 30 including the magnetic powder having the above-mentioned particle size distribution can be easily obtained.

亦可對磁芯30之磁性粉末之表面實施絕緣處理。作為此種表面絕緣處理,可例示磷酸處理、磷酸鹽處理、氧化處理等。亦可將磷酸系之玻璃材料藉由機械熔融法塗佈於磁性粉末之表面。於該情形時,於直至形成為磁芯30或電感元件100之期間,將磁性粉末加熱至對磁性粉末進行塗佈之磷酸系之玻璃材料之玻璃轉移溫度以上,藉此,尤其能夠提高電感元件100之絕緣特性。再者,如上述般加熱至玻璃轉移溫度以上之磷酸系之玻璃材料之塗佈亦存在至少一部分結晶化之情形。 The surface of the magnetic powder of the magnetic core 30 may be insulated. Examples of such a surface insulation treatment include phosphoric acid treatment, phosphate treatment, and oxidation treatment. It is also possible to apply a phosphoric acid-based glass material to the surface of a magnetic powder by a mechanical melting method. In this case, the magnetic powder is heated to a temperature equal to or higher than the glass transition temperature of the phosphoric acid-based glass material coated with the magnetic powder until it is formed into the magnetic core 30 or the inductive element 100, whereby the inductive element can be particularly improved. 100 insulation properties. Furthermore, at least a part of the coating of the phosphoric acid-based glass material heated to a temperature above the glass transition temperature as described above may be crystallized.

本發明之一實施形態之電感元件100之製造方法不受限定。若採用以下說明之製造方法,則能夠有效率地製造電感元件100。 The manufacturing method of the inductance element 100 according to an embodiment of the present invention is not limited. If the manufacturing method described below is used, the inductance element 100 can be manufactured efficiently.

本發明之一實施形態之電感元件100之製造方法包含:以沿線圈體10之捲繞軸之方向(Z1-Z2方向)為加壓方向之成形加工、及於藉由成形加工而獲得之成形製造物之表面形成塗佈型電極40、45之步驟。又,於較佳之一例中,上述成形加工包含藉由加壓成形使複數個成形構件一體化之作業。 The manufacturing method of the inductive element 100 according to an embodiment of the present invention includes a forming process in which a direction along the winding axis of the coil body 10 (Z1-Z2 direction) is a pressing direction, and a forming process obtained by the forming process. A step of forming the coated electrodes 40 and 45 on the surface of the article. In a preferred example, the forming process includes an operation of integrating a plurality of forming members by press forming.

圖4(a)係表示用以形成圖1所示之電感元件100之捲繞體10P之整體構成的立體圖。圖4(b)係表示包含用以形成電感元件100之磁性粉末之成形構件之一個(第1成形構件31)的立體圖。圖4(c)係表示包含用以形成電感元件100之磁性粉末之成形構件之另一個(第2成形構件32)的立體圖。圖5係表示使用上述捲繞體10P以及第1成形構件31及第2成形構件32製造電感元件100之過程的剖視圖。 FIG. 4 (a) is a perspective view showing the overall configuration of the wound body 10P for forming the inductance element 100 shown in FIG. FIG. 4 (b) is a perspective view showing one of the forming members (the first forming member 31) including the magnetic powder for forming the inductance element 100. FIG. FIG. 4 (c) is a perspective view showing the other (second formed member 32) of a formed member including magnetic powder for forming the inductance element 100. FIG. 5 is a cross-sectional view showing a process of manufacturing the inductance element 100 using the wound body 10P and the first molded member 31 and the second molded member 32.

如圖4(a)所示,將導電性帶體BM捲繞而準備捲繞體10P。圖4(a)所示之捲繞體10P與電感元件100所具備之包含線圈體10之導電性帶體之形狀不同,處於未進行其兩端之最後之谷折之狀態、即以相當於端子板20、25之部分之板面以沿捲繞體10P之捲繞軸之方向(Z1-Z2方向)為面內方向之方式配置之狀態。 As shown in FIG. 4 (a), a conductive tape body BM is wound to prepare a wound body 10P. The shape of the wound body 10P shown in FIG. 4 (a) is different from that of the conductive tape body including the coil body 10 included in the inductance element 100. The plate surfaces of the portions of the terminal plates 20 and 25 are arranged in such a manner that the directions along the winding axis (Z1-Z2 direction) of the wound body 10P are in-plane directions.

圖4(b)所示之第1成形構件31係構成磁芯30之一部分(磁芯30之下表面側)之構件。第1成形構件31具有能夠收容捲繞體10P之一部分之中空部HP1,於該中空部HP1內載置捲繞體10P。 The first forming member 31 shown in FIG. 4 (b) is a member constituting a part of the magnetic core 30 (the lower surface side of the magnetic core 30). The first forming member 31 has a hollow portion HP1 that can accommodate a part of the wound body 10P, and the wound body 10P is placed in the hollow portion HP1.

圖4(c)所示之第2成形構件32係構成磁芯30之另一部分(磁芯30之上表面側)之構件。第2成形構件32具有能夠收容捲繞體10P之一部分之中空部HP2,進而以相當於捲繞體10P之端子板20、25之部分可位於第2成形構件32外之方式具備狹縫33、34。於收容有捲繞體10P之一部分之第1成形構件31上載置第2成形構件32,並於中空部HP2內收容捲繞體10P之一部分,藉此,可獲得電感元件100之臨時組裝體100P(圖5)。 The second forming member 32 shown in FIG. 4 (c) is a member constituting another part of the magnetic core 30 (the upper surface side of the magnetic core 30). The second forming member 32 has a hollow portion HP2 capable of accommodating a part of the wound body 10P, and further includes slits 33 such that portions corresponding to the terminal plates 20 and 25 of the wound body 10P can be located outside the second forming member 32. 34. The second forming member 32 is placed on the first forming member 31 containing a part of the wound body 10P, and a part of the wound body 10P is housed in the hollow portion HP2, thereby obtaining a temporary assembly 100P of the inductance element 100. (Figure 5).

如圖5所示,將該臨時組裝體100P載置於配置在壓製機50之模具本體51內之上模52與下模53之間之模腔54內。而且,對上模52及下模53進行加壓。加壓之朝向係如圖5中利用箭頭P所示般,為上模52與下模53相接近之朝向。 As shown in FIG. 5, the temporary assembly 100P is placed in a mold cavity 54 disposed between an upper mold 52 and a lower mold 53 in the mold body 51 of the press 50. Then, the upper mold 52 and the lower mold 53 are pressurized. The direction of pressing is as shown by the arrow P in FIG. 5 and is the direction in which the upper mold 52 and the lower mold 53 are close to each other.

臨時組裝體100P之成形條件(加壓力、加壓時之溫度、加壓時間等)係根據成形構件(第1成形構件31、第2成形構件32)之組成或形狀等適當設定。於在常溫(非加熱)下進行成形之情形時,可藉由以0.5GPa至2GPa左右之加壓力加壓數秒鐘而成形磁芯(壓粉成形)。 The molding conditions (pressurization, temperature during pressurization, pressurization time, etc.) of the temporary assembly 100P are appropriately set in accordance with the composition or shape of the molded members (the first molded member 31 and the second molded member 32). In the case of forming at normal temperature (non-heating), the magnetic core can be formed by pressing at a pressure of about 0.5 GPa to 2 GPa for several seconds (powder molding).

藉由進行加壓成形,而第1成形構件31及第2成形構件32一體化,從 而形成內包線圈體10之磁芯30。又,於該加壓成形時,將以沿線圈體10之捲繞軸之方向成為板面之面內方向之方式配置之端子板20、25彎折90°,藉此,能夠於磁芯30之上表面之上配置端子板20、25。 By performing pressure forming, the first forming member 31 and the second forming member 32 are integrated, and A magnetic core 30 including the coil body 10 is formed. In addition, during this press molding, the terminal plates 20 and 25 arranged so that the direction along the winding axis of the coil body 10 becomes the in-plane direction of the plate surface can be bent by 90 °, thereby enabling the terminal plate 20 and 25 to be bent on the core 30. Terminal plates 20 and 25 are arranged on the upper surface.

第1成形構件31及第2成形構件32只要藉由預成形而形成即可。構成第1成形構件31及第2成形構件32之材料只要包含磁性粉末則並無其他限定。既可包含磁性粉末,亦可進而包含有機系成分。有機系成分較佳為使磁性粉末相互黏結之黏合劑成分。作為黏合劑成分之有機系成分之具體組成不受限定。有機系成分亦可包含樹脂材料,作為樹脂材料,可例示矽酮樹脂、環氧樹脂、酚系樹脂、三聚氰胺樹脂、尿素樹脂、丙烯酸系樹脂、烯烴樹脂等。有機系成分亦可包含如上所述之樹脂材料接受熱處理而形成之物質。該物質之組成可根據接受熱處理之樹脂材料之組成、熱處理條件等進行調整。有機系成分較佳為能夠使第1成形構件31及第2成形構件32中所包含之磁性粉末相互電性獨立。有機系成分相關之樹脂材料既可包含1種,亦可包含複數種。例如,有機系成分相關之樹脂材料亦可為如酚系樹脂之熱固性樹脂與如丙烯酸系樹脂之熱塑性樹脂之混合體。 The first forming member 31 and the second forming member 32 may be formed by pre-forming. The materials constituting the first forming member 31 and the second forming member 32 are not limited as long as they include magnetic powder. It may contain a magnetic powder and may further contain an organic component. The organic component is preferably a binder component that binds magnetic powders to each other. The specific composition of the organic component as the binder component is not limited. The organic component may include a resin material, and examples of the resin material include silicone resin, epoxy resin, phenol resin, melamine resin, urea resin, acrylic resin, and olefin resin. The organic component may include a substance formed by subjecting the resin material described above to a heat treatment. The composition of the substance can be adjusted according to the composition of the resin material subjected to heat treatment, heat treatment conditions, and the like. The organic component is preferably capable of making the magnetic powders contained in the first molded member 31 and the second molded member 32 electrically independent from each other. The resin material related to the organic component may include one kind or plural kinds. For example, the resin material related to the organic component may be a mixture of a thermosetting resin such as a phenol resin and a thermoplastic resin such as an acrylic resin.

於第1成形構件31及第2成形構件32含有有機系成分之情形時,第1成形構件31及第2成形構件32之各者中之有機系成分之含量不受限定。於有機系成分為黏合劑成分之情形時,較佳為含有可適當地發揮作為黏合劑成分之功能之量。再者,較佳為考慮到存在如下情形而設定第1成形構件31及第2成形構件32之各者中之有機系成分之含量,即,於有機系成分之含量過高之情形時,可看出具備包含第1成形構件31及第2成形構件32之磁芯30的電感元件100之磁特性下降之傾向。 When the first molded member 31 and the second molded member 32 contain an organic component, the content of the organic component in each of the first molded member 31 and the second molded member 32 is not limited. When an organic component is a binder component, it is preferable to contain the quantity which can exhibit the function as a binder component suitably. In addition, it is preferable to set the content of the organic component in each of the first formed member 31 and the second formed member 32 in consideration of the following cases, that is, when the content of the organic component is too high, It is seen that the magnetic characteristics of the inductance element 100 including the magnetic core 30 including the first molded member 31 and the second molded member 32 tend to decrease.

第1成形構件31及第2成形構件32之各者亦可含有磁性粉末及有機系 成分以外之物質。作為該物質,可列舉玻璃、氧化鋁等絕緣性之無機系成分;矽烷偶合劑等用以提昇與磁性粉末及有機系成分之密接性之偶合劑等。於第1成形構件31及第2成形構件32含有該等物質之情形時,第1成形構件31及第2成形構件32之各者中之該等物質之含量不受限定。 Each of the first forming member 31 and the second forming member 32 may contain a magnetic powder and an organic system. Substances other than ingredients. Examples of the substance include insulating inorganic components such as glass and alumina; coupling agents such as a silane coupling agent for improving adhesion with magnetic powder and organic components; and the like. When the first formed member 31 and the second formed member 32 contain these substances, the content of these substances in each of the first formed member 31 and the second formed member 32 is not limited.

磁芯30亦可於其表面及視需要於表面附近之部分具有絕緣層。藉由具有絕緣層,而能夠提高磁芯30之絕緣性。構成絕緣層之材料不受限定。作為構成絕緣層之材料之具體例,可列舉:矽酮系樹脂、環氧系樹脂、丁醛酚系樹脂、丙烯酸系樹脂等有機系材料;氧化物、氮化物、碳化物等無機系材料等。 The magnetic core 30 may have an insulating layer on its surface and a portion near the surface if necessary. By having an insulating layer, the insulation properties of the magnetic core 30 can be improved. The material constituting the insulating layer is not limited. Specific examples of the material constituting the insulating layer include organic materials such as silicone resins, epoxy resins, butyraldehyde resins, and acrylic resins; inorganic materials such as oxides, nitrides, and carbides. .

構成設置於磁芯30之上之塗佈型電極40、45之材料不受限定。就生產性優異之觀點而言,較佳為具備由銀膏等導電膏形成之金屬化層及形成於該金屬化層上之鍍覆層。形成該鍍覆層之材料不受限定。作為該材料所含有之金屬元素,可例示銅、鋁、鋅、鎳、鐵、錫等。於塗佈型電極40、45具備金屬化層及鍍覆層之情形時,作為用以形成金屬化層之導電膏之塗佈量,可例示0.05g/cm2左右,作為鍍覆層之厚度之範圍,可例示5~10μm左右。再者,於上述磁芯30中,雖形成有塗佈型電極40、45,但亦可於磁芯30上藉由鍍覆或濺鍍等方法將由銅、鋁、鋅、鎳、鐵、錫等形成之電極直接形成於磁芯30上,來代替此種塗佈型電極40、45。 The material constituting the coating electrodes 40 and 45 provided on the magnetic core 30 is not limited. From the viewpoint of excellent productivity, it is preferable to include a metallized layer formed of a conductive paste such as a silver paste, and a plating layer formed on the metallized layer. The material for forming the plating layer is not limited. Examples of the metal element contained in the material include copper, aluminum, zinc, nickel, iron, and tin. When the coated electrodes 40 and 45 are provided with a metallized layer and a plated layer, the coating amount of the conductive paste used to form the metallized layer may be exemplified by about 0.05 g / cm 2 as the thickness of the plated layer. The range is, for example, about 5 to 10 μm. Furthermore, although the coated electrodes 40 and 45 are formed in the magnetic core 30 described above, copper, aluminum, zinc, nickel, iron, and tin can also be formed on the magnetic core 30 by plating or sputtering. The formed electrodes are directly formed on the magnetic core 30 instead of the coating electrodes 40 and 45.

本發明之一實施形態之電感元件100由於磁芯30所包含之磁性粉末之粒度分佈得到適當控制,故即便於電感元件100特別小型之情形時,亦不易產生絕緣破壞。因此,本發明之一實施形態之電感元件100即便特別小型,動作穩定性亦優異。因此,安裝有本發明之一實施形態之電感元件100之電子電氣機器容易小型化。又,能夠於電子電氣機器之安裝空間安 裝多個電子零件。關於該方面,藉由電感元件100為小型,而能夠使電源切換電路、電壓升降電路、平流電路、阻擋高頻電流之電路等小型化。因此,增加電子電氣機器之電源供給電路變得容易。其結果,能夠進行更精密之電源控制,從而能夠抑制電子電氣機器之消耗電力。 Since the particle size distribution of the magnetic powder contained in the magnetic core 30 is appropriately controlled in the inductor element 100 according to an embodiment of the present invention, even when the inductor element 100 is particularly small, insulation damage is unlikely to occur. Therefore, even if the inductance element 100 according to an embodiment of the present invention is particularly small, it has excellent operation stability. Therefore, it is easy to miniaturize the electric and electronic equipment on which the inductance element 100 according to an embodiment of the present invention is mounted. In addition, it can be installed in the installation space of electrical and electronic equipment. Install multiple electronic parts. In this regard, the small size of the inductance element 100 enables miniaturization of a power switching circuit, a voltage step-up circuit, a smoothing circuit, a circuit that blocks high-frequency current, and the like. Therefore, it becomes easy to increase the power supply circuit of the electrical and electronic equipment. As a result, it is possible to perform more precise power supply control, and it is possible to suppress power consumption of electronic and electrical equipment.

以上所說明之實施形態係為了容易理解本發明而記載者,並非為了限定本發明而記載者。因此,上述實施形態所揭示之各要素意指亦包含屬於本發明之技術範圍之所有設計變更或均等物。 The embodiments described above are described for easy understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment means that it also includes all design changes or equivalents belonging to the technical scope of the present invention.

[實施例] [Example]

以下,藉由實施例等儘快一步具體地說明本發明,但本發明之範圍並不限定於該等實施例等。 Hereinafter, the present invention will be specifically described as soon as possible through examples and the like, but the scope of the present invention is not limited to these examples and the like.

(實施例1) (Example 1)

使用與上述本發明之一實施形態之電感元件之磁芯中所包含者同種之磁性粉末製作環形磁芯。環形磁芯之形狀、製造條件等如下所述。 The same type of magnetic powder as that contained in the magnetic core of the inductive element according to one embodiment of the present invention is used to make the toroidal magnetic core. The shape and manufacturing conditions of the toroidal core are as follows.

(形狀) (shape)

類型1:外徑20mm×內徑12.7mm×厚度3.0mm Type 1: outer diameter 20mm x inner diameter 12.7mm x thickness 3.0mm

類型2:外徑9mmm×內徑5mm×厚度1.0mm Type 2: outer diameter 9mmm x inner diameter 5mm x thickness 1.0mm

(磁性粉末) (Magnetic powder)

磁性粉末均係包含Fe-P-C系非晶質合金材料且利用機械熔融法實施有磷酸系玻璃之塗佈者。各實施例之磁性粉末之體積基準之累積粒度分佈係使用日機裝公司製造之「Microtrac粒度分佈測定裝置MT3300EX」予以測定。該等累積粒度分佈中之10%累積粒徑D10、50%累積粒徑D50及90%累積粒徑D90如表1所述。又,根據所獲得之粒度分佈算出之△D(D90-D10)及D50×△D亦示於表1。圖6係實施例5及實施例10中所使 用之磁性粉末之累積粒度分佈。 All of the magnetic powders are Fe-P-C-based amorphous alloy materials and are coated with phosphoric acid-based glass by a mechanical melting method. The cumulative particle size distribution of the volume basis of the magnetic powder of each example was measured using a "Microtrac particle size distribution measuring device MT3300EX" manufactured by Nikkiso Co., Ltd. The 10% cumulative particle size D10, 50% cumulative particle size D50, and 90% cumulative particle size D90 in these cumulative particle size distributions are described in Table 1. In addition, ΔD (D90-D10) and D50 × ΔD calculated based on the obtained particle size distribution are also shown in Table 1. Fig. 6 shows the results of the fifth and tenth embodiments. Cumulative particle size distribution of the magnetic powder used.

(成形) (Forming)

溫度:常溫(25℃) Temperature: normal temperature (25 ℃)

壓力:0.6~1.2GPa Pressure: 0.6 ~ 1.2GPa

(熱處理) (Heat treatment)

最高達到溫度:350~500℃ The highest temperature reached: 350 ~ 500 ℃

加熱時間:0.1~1小時 Heating time: 0.1 ~ 1 hour

以所獲得之環形磁芯之上下之底面為施加點,使用Chroma公司製造之「PROGRAMABLE HF AC TESTER MOEDL 11802」,測定絕緣耐壓(單位:V),將所獲得之絕緣耐壓除以環形磁芯之厚度(mm)而算出絕緣破壞電場(V/mm)。將算出結果示於表1。 Using the bottom surface of the obtained toroidal core as the application point, the "PROGRAMABLE HF AC TESTER MOEDL 11802" manufactured by Chroma was used to measure the insulation withstand voltage (unit: V), and the obtained insulation withstand voltage was divided by the toroidal The thickness (mm) of the core was used to calculate the dielectric breakdown electric field (V / mm). The calculation results are shown in Table 1.

又,針對在類型2之環形磁芯捲繞5次被覆銅線而獲得之環形線圈,使用阻抗分析儀(Impedance Analyzer)(HP公司製造之「4192A」),以 100kHz之條件測定相對磁導率μ。將測定結果示於表1。 In addition, an impedance analyzer ("4192A" manufactured by HP Corporation) was used for a toroidal coil obtained by winding a coated copper wire five times on a toroidal core of type 2. The relative permeability μ was measured at 100 kHz. The measurement results are shown in Table 1.

如表1及根據表1之結果製成之圖7及圖8所示,關於50%累積粒徑D50,可確認於4μm以上之情形時,相對磁導率μ穩定地成為20以上,於5μm以下之情形時,絕緣破壞電場穩定地成為100V/mm以上。於該情形時,如表1所示,10%累積粒徑D10滿足1.8μm以上且3.0μm以下,90%累積粒徑D90滿足7μm以上且10μm以下。 As shown in Table 1 and Figures 7 and 8 prepared based on the results of Table 1, when the 50% cumulative particle diameter D50 is confirmed to be 4 μm or more, the relative permeability μ is steadily 20 or more and 5 μm. In the following cases, the dielectric breakdown electric field stably becomes 100 V / mm or more. In this case, as shown in Table 1, the 10% cumulative particle diameter D10 satisfies 1.8 μm to 3.0 μm, and the 90% cumulative particle diameter D90 satisfies 7 μm to 10 μm.

又,如表1及根據表1之結果製成之圖9及圖10所示,關於△D,可確認於5μm以上之情形時,相對磁導率μ更穩定地成為20以上,於7μm以下之情形時,絕緣破壞電場更穩定地成為100V/mm以上。進而,如表1及根據表1之結果製成之圖11及圖12所示,關於D50×△D,可確認於20μm2以上之情形時,相對磁導率μ更穩定地成為20以上,於35μm2以下之情形時,絕緣破壞電場更穩定地成為100V/mm以上。再者,如表1以及圖8、圖10及圖12所示,環形磁芯之形狀(尤其是厚度)對絕緣破壞電場造成之影響輕微。 In addition, as shown in Table 1 and FIGS. 9 and 10 prepared based on the results of Table 1, when ΔD is confirmed to be 5 μm or more, the relative permeability μ is more stable to 20 or more and 7 μm or less. In this case, the dielectric breakdown electric field becomes more stable at 100 V / mm or more. Furthermore, as shown in Table 1 and Figs. 11 and 12 prepared based on the results of Table 1, it can be confirmed that when D50 × ΔD is 20 μm 2 or more, the relative permeability μ becomes more stable at 20 or more. In the case of 35 μm 2 or less, the dielectric breakdown electric field becomes more stable at 100 V / mm or more. In addition, as shown in Table 1 and FIGS. 8, 10, and 12, the shape (especially the thickness) of the toroidal core has a slight effect on the electric field of insulation breakdown.

[產業上之可利用性] [Industrial availability]

本發明之一實施形態之具備磁阻效應元件之電感元件可較佳地用作智慧型手機、筆記型電腦等可攜式電子機器中之顯示部之電源電路之構成要素。 An inductive element provided with a magnetoresistance effect element according to an embodiment of the present invention can be preferably used as a constituent element of a power circuit of a display section in a portable electronic device such as a smart phone or a notebook computer.

Claims (6)

一種電感元件,其特徵在於:其係具有由被絕緣性材料被覆之導電性金屬材捲繞而成之線圈體、自上述線圈體延伸之一對端子板、及於內部至少埋入有上述線圈體之磁芯者,且上述一對端子板之各者中之一端部位於上述磁芯外,該電感元件進而具備電性連接於上述一對端子板之各者並且將上述磁芯之表面之一部分覆蓋的一對電極,上述磁芯含有磁性粉末,上述磁性粉末之體積基準之累積粒度分佈係10%累積粒徑D10為1.8μm以上且3.0μm以下,50%累積粒徑D50為4μm以上且5μm以下,且90%累積粒徑D90為7μm以上且10μm以下,自上述90%累積粒徑D90減去上述10%累積粒徑D10所得之差為5μm以上且7μm以下。An inductance element is characterized in that it has a coil body wound by a conductive metal material covered with an insulating material, a pair of terminal plates extending from the coil body, and at least the coil is embedded in the coil body. A magnetic core, and one end of each of the pair of terminal plates is located outside the magnetic core, the inductive element further includes an electrical connection to each of the pair of terminal plates and a surface of the magnetic core. A pair of electrodes that are partially covered, the magnetic core contains magnetic powder, and the cumulative particle size distribution of the magnetic powder on a volume basis is 10% cumulative particle diameter D10 is 1.8 μm or more and 3.0 μm or less, and 50% cumulative particle diameter D50 is 4 μm or more and 5 μm or less, and the 90% cumulative particle diameter D90 is 7 μm or more and 10 μm or less. The difference obtained by subtracting the 10% cumulative particle diameter D10 from the 90% cumulative particle diameter D90 is 5 μm or more and 7 μm or less. 如請求項1之電感元件,其中上述50%累積粒徑D50與自上述90%累積粒徑D90減去上述10%累積粒徑D10所得之差的積為20μm2以上且35μm2以下。For example, the inductance element of claim 1, wherein the product of the difference between the 50% cumulative particle diameter D50 and the 90% cumulative particle diameter D90 minus the 10% cumulative particle diameter D10 is 20 μm 2 or more and 35 μm 2 or less. 如請求項1之電感元件,其中上述導電性金屬材為帶狀且上述線圈體為扁繞捲。The inductor element according to claim 1, wherein the conductive metal material is in a strip shape and the coil body is a flat wound coil. 如請求項1之電感元件,其中上述磁性粉末之至少一部分包含非晶質磁性材料。The inductive element of claim 1, wherein at least a part of the magnetic powder includes an amorphous magnetic material. 如請求項1之電感元件,其中上述電極包含塗佈型電極。The inductive element according to claim 1, wherein the electrode includes a coating electrode. 一種電子電氣機器,其安裝有如請求項1之電感元件。An electric and electronic equipment, which is equipped with an inductive element as claimed in claim 1.
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