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TWI663412B - System for assisting array layout board identification and recording defect location - Google Patents

System for assisting array layout board identification and recording defect location Download PDF

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TWI663412B
TWI663412B TW107128753A TW107128753A TWI663412B TW I663412 B TWI663412 B TW I663412B TW 107128753 A TW107128753 A TW 107128753A TW 107128753 A TW107128753 A TW 107128753A TW I663412 B TWI663412 B TW I663412B
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unit
circuit board
image
identification
assisting
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TW107128753A
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TW202009505A (en
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邱詩彰
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皓琪科技股份有限公司
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Abstract

一種協助陣列排版之電路板辨識且記錄缺陷位置的系統,該電路板是由多個重複單元電路所構成,該系統包括:一工作平台,包括一移動載台,該移動載台表面具有一個辨識圖像及至少一定位治具,該定位治具供該電路板靠置定位;一觀察單元,位於該工作平台上方,能放大觀察該電路板;一光學取像單元,位於該工作平台上方,能拍攝該移動載台表面之辨識圖像;一接收單元,接收該電路板的基本資料;一顯示單元,顯示該電路板之多個單元電路的位置分佈型態;一輸入單元,輸入點選訊息;一運算控制單元,連接該光學取像單元、該接收單元、該顯示單元、以及該輸入單元,在接收到該點選訊息時,比較不同時間點所拍攝該辨識圖像差異,換算出該電路板移動距離及角度,依據該基本資料定義此時於該觀察單元正下方之該單元電路為缺陷並予以記錄。A system for assisting array layout in identifying and recording defect locations on a circuit board. The circuit board is composed of a plurality of repeating unit circuits. The system includes: a working platform including a mobile stage, and the surface of the mobile stage has an identification. An image and at least one positioning jig for the circuit board to lean against; an observation unit located above the work platform to zoom in and observe the circuit board; an optical imaging unit located above the work platform, Can capture the identification image of the surface of the mobile stage; a receiving unit that receives the basic information of the circuit board; a display unit that displays the position distribution pattern of the multiple unit circuits of the circuit board; an input unit that inputs the point selection Message; an arithmetic control unit connected to the optical imaging unit, the receiving unit, the display unit, and the input unit; when receiving the click message, comparing the differences in the identified images taken at different time points and converting them The moving distance and angle of the circuit board, according to the basic data, define the unit circuit immediately below the observation unit at this time as a defect and Record.

Description

協助陣列排版之電路板辨識且記錄缺陷位置的系統System for assisting array layout board identification and recording defect location

本發明為一種用於陣列排版之電路板檢查的技術領域,尤其指一種用於辨識電路板上缺陷位置及同時記錄的系統。The invention relates to the technical field of circuit board inspection for array typesetting, in particular to a system for identifying defect locations on a circuit board and recording at the same time.

電子工業中,印刷電路板等電子元件於製造過程中,為了大量生產及製造,會以多個單元電路重複排版方式出貨給後段SMT打件廠或IC封裝廠。該電路板呈片狀或長條狀(strip),每個電路板是由多個重複單元電路所構成,當出貨至封裝測試廠後,再將該單元電路封裝、切割製成單元電子零件。然而,所生產之該電路板,所有單元電路皆為良品的機率很低,製造商會預先進行檢查,記錄其中不良品單元的數量及位置,最後將符合約定良率的該電路板出貨至後段封裝測試廠,同時,必須將該記錄隨貨送出。隨著工業自動化的趨勢,記錄不良品數量及位置的資料也必須為數位資料,便於封裝測試廠記錄分析,及進行後續自動化封裝作業。In the electronics industry, during the manufacturing process, electronic components such as printed circuit boards are mass-produced and manufactured, and will be shipped to multiple SMT parts manufacturing plants or IC packaging plants in the repeat layout of multiple unit circuits. The circuit board is in the form of a strip or a strip, and each circuit board is composed of a plurality of repeating unit circuits. After shipment to a packaging test factory, the unit circuit is packaged and cut into unit electronic parts. . However, the circuit board produced has a low probability that all unit circuits are good. The manufacturer will check in advance, record the number and location of defective units, and finally ship the circuit board that meets the agreed yield to the later stage. The packaging test facility must also ship this record with the shipment. With the trend of industrial automation, the data recording the number and location of defective products must also be digital data, which is convenient for the packaging test factory to record and analyze, and to carry out subsequent automated packaging operations.

在電路板品質檢查中,人工目檢(visual inspect)也是其中一環,但是將目檢結果予以記錄並再轉換為數位資料,就會增加額外的作業時間及流程。如何利用設備的輔助,於人工目檢作業中,同時記錄缺陷位置並換轉為數據資料,將有助於廠商簡化檢查作業流程,加速作業時間,提升產線速率。In the board quality inspection, manual visual inspection is also a part of the process, but recording the visual inspection results and converting them into digital data will increase the extra work time and process. How to use the assistance of equipment to record the defect location and convert it into data during manual visual inspection will help manufacturers simplify the inspection process, speed up the operation time, and increase the production line rate.

如圖4所示,為習用設備之架構方塊圖,包括一X-Y軸移動平台41,該X-Y軸移動平台41在同一時間內僅能作X軸或Y軸的位置調整。一觀察單元42,固定於該X-Y軸移動平台41上方,用以放大觀察放置於該X-Y軸移動平台41上的電路板,辨識出電路板上的單元電路何者為良品或不良品。一顯示單元43,用以顯示該電路板內複數個單元電路的位置分佈型態。一輸入單元44,輸入點選訊息。一運算控制單元45,與前述各單元連接,在該輸入單元44輸入點選訊息後,能依該X-Y軸移動平台41的X軸與Y軸移動距離,換算於該觀察單元42正下方之該單元電路的位置,記錄該單元電路所代表的序號。藉此當操作者在辨識該電路板上該單元電路為良品或不良品時,就可同步以數位方式記錄不良品所在的序號。然而習用設備在使用上有一大缺點,該X-Y軸移動平台41在操作上,由於須配合內部精密機械結構計算其位置,因此同一時間內僅能作X軸或Y軸的位置調整,容易造成移動的不順暢或消耗太多時間,經實際分析上,利用此設備進行辨識缺陷作業,反而增加更多操作時間,而且成本是較高的,因此本發明人思考是否能設計出符合人性的操作模式及設備,滿足操作者的需求。As shown in FIG. 4, it is a block diagram of the structure of a conventional device, including an X-Y-axis moving platform 41. The X-Y-axis moving platform 41 can only adjust the position of the X-axis or Y-axis at the same time. An observation unit 42 is fixed above the X-Y-axis moving platform 41 to magnify and observe the circuit board placed on the X-Y-axis moving platform 41 to identify which unit circuit on the circuit board is a good product or a defective product. A display unit 43 is used to display the position distribution patterns of the plurality of unit circuits in the circuit board. An input unit 44 inputs a click message. An arithmetic control unit 45 is connected to each of the foregoing units. After the input information is input in the input unit 44, the movement distance between the X axis and the Y axis of the platform 41 according to the XY axis can be converted to the distance directly below the observation unit 42. Location of the unit circuit. Record the serial number represented by the unit circuit. Thereby, when the operator recognizes that the unit circuit on the circuit board is a good product or a defective product, the serial number of the defective product can be recorded digitally in synchronization. However, conventional equipment has a major disadvantage in use. The XY-axis moving platform 41 is operated in accordance with the internal precision mechanical structure to calculate its position. Therefore, only the X-axis or Y-axis position can be adjusted at the same time, which is likely to cause movement. Is not smooth or consumes too much time. In actual analysis, using this device to identify defect operations, but it adds more operating time, and the cost is higher, so the inventor thinks whether it is possible to design a human-friendly operation mode And equipment to meet the needs of the operator.

本發明之主要目的是提供一種協助陣列排版之電路板辨識且記錄缺陷位置的系統,以適合人性的操作模式,讓操作人員在移動電路板更為快速及方便,且在辨識作業中同步記錄缺陷位置,最後以數位資料輸出,縮短作業時間,提升生產效率。The main object of the present invention is to provide a system for assisting the layout of a circuit board for array typesetting and recording the position of defects, so that the operator can move the circuit board more quickly and conveniently in a human-friendly operation mode, and synchronously record defects during the identification operation Position, and finally output as digital data to shorten the operation time and improve production efficiency.

為達上述之目的,本發明係提供一種協助陣列排版之電路板辨識且記錄缺陷位置的系統,該電路板是由多個重複單元電路所構成,該系統包括:一工作平台,包括一移動載台,該移動載台表面具有一個辨識圖像及至少一定位治具,該定位治具供該電路載具靠置定位;一觀察單元,位於該工作平台上方,能放大觀察該電路板;一光學取像單元,位於該工作平台上方,能拍攝該辨識圖像,且定義該移動載台承載該電路板的初始狀態所拍攝圖像為基準位置圖像;一接收單元,接收該電路板的基本資料;一顯示單元,依據該基本資料顯示該電路板之多個該單元電路的位置分佈型態;一輸入單元,輸入點選訊息;一運算控制單元,連接該光學取像單元、該接收單元、該顯示單元、以及該輸入單元,該運算控制單元在接收到該點選訊息時,定義該光學取像單元此時所拍攝圖像為點選位置圖像,比較該基準位置圖像與該點選位置圖像中之該辨識圖像差異,換算出該電路板移動的距離及角度,依據該基本資料定義此時於該觀察單元正下方該單元電路為缺陷並予以記錄。In order to achieve the above-mentioned object, the present invention provides a system for assisting the layout of a circuit board to identify and record defect locations. The circuit board is composed of a plurality of repeating unit circuits. The system includes a working platform including a mobile carrier. Platform, the mobile carrier surface has an identification image and at least one positioning jig for the circuit carrier to lean against; an observation unit, located above the working platform, can zoom in and observe the circuit board; An optical image capturing unit, which is located above the working platform, can capture the identification image, and defines the image captured by the mobile carrier in the initial state of the circuit board as a reference position image; a receiving unit that receives the circuit board Basic information; a display unit that displays the position distribution pattern of multiple circuit units of the circuit board according to the basic data; an input unit for inputting click information; an arithmetic control unit connected to the optical image pickup unit and the receiver Unit, the display unit, and the input unit, and the arithmetic control unit defines the optical imaging unit when receiving the click message The captured image is the selected position image, the difference between the reference position image and the selected position image is compared, and the distance and angle of the circuit board movement are converted. This is defined according to the basic data The circuit of the unit immediately below the observation unit was defective and recorded.

在本發明的實施例中,該移動載台表面的該辨識圖像與該定位治具間隔一定距離,該距離供該移動載台承載該電路板任意移動後,該光學取像單元乃能拍攝到該辨識圖像。In the embodiment of the present invention, the identification image on the surface of the mobile stage is spaced a certain distance from the positioning jig, and the distance is for the mobile stage to carry the circuit board to move arbitrarily, and the optical imaging unit can shoot To the recognition image.

在本發明的實施例中,該辨識圖像不會與該移動載台表面顏色相同,且在該辨識圖像旋轉角度在90度內,須能辨識出前後狀態的差異,該辨識圖像為非單一圓形圖像,例如十字架圖像、方型圖像、三角型圖像。In the embodiment of the present invention, the identification image will not be the same color as the surface of the mobile stage, and the difference between the front and rear states must be recognized when the rotation angle of the identification image is within 90 degrees, and the identification image is Non-single circular images, such as cross images, square images, triangular images.

在本發明的實施例中,是比較該基準位置圖像與該點選位置圖像中該辨識圖像的偏移距離及角度,進行圖像單位轉換尺寸單元且計算出該電路板實際移動的角度及距離。In the embodiment of the present invention, the offset distance and angle of the identification image in the reference position image and the selected position image are compared, the image unit is converted into a size unit, and the actual movement of the circuit board is calculated. Angle and distance.

在本發明的實施例中,該基本資料包括該電路板圖像及尺寸、該單元電路的分佈位置、尺寸及數量。In the embodiment of the present invention, the basic information includes an image and a size of the circuit board, a distribution position, a size, and a quantity of the unit circuit.

以下係藉由特定的具體實施例說明本發明之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。本發明亦可藉由其他不同的具體實例加以施行或應用,本發明說明書中的各項細節亦可基於不同觀點與應用在不悖離本發明之精神下進行各種修飾與變更。The following is a description of specific embodiments of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific examples, and various details in the description of the present invention can also be modified and changed based on different viewpoints and applications without departing from the spirit of the present invention.

須知,本說明書所附圖式繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供熟悉此技藝之人士瞭解與閱讀,並非用以限定本發明可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本發明所能產生之功效及所能達成之目的下,均應落在本發明所揭示之技術內容得能涵蓋之範圍內。It should be noted that the structures, proportions, sizes, etc. shown in the drawings of this specification are only used to match the content disclosed in the description for those familiar with this technology to understand and read, and are not intended to limit the limitations that the present invention can implement. Conditions, so it does not have technical significance, any structural modification, proportional relationship change, or size adjustment shall fall within the scope of the present disclosure without affecting the effects and objectives that can be achieved by the present invention. The technical content must be within the scope.

如圖1及圖2所示,為本發明協助陣列排版之電路板辨識且記錄缺陷位置的系統方塊圖及立體示意圖。該系統包括:一工作平台11、一觀察單元12、一光學讀取單元13、一接收單元14、一顯示單元15、一輸入單元16、以及一運算控制單元17,本發明是用於採用陣列排版之電路板的辨識作業,如圖2所示,該電路板2是由多個重複單元電路21整齊排列而成,形狀呈片狀或長條狀(strip),本發明的系統能於辨識過程中能同步以數位資料記錄不良品之單元電路的序號。As shown in FIG. 1 and FIG. 2, it is a system block diagram and a three-dimensional schematic diagram of a circuit board for assisting array layout in the present invention to identify and record defect locations. The system includes: a working platform 11, an observation unit 12, an optical reading unit 13, a receiving unit 14, a display unit 15, an input unit 16, and an operation control unit 17. The present invention is used to adopt an array The typesetting circuit board is identified as shown in FIG. 2. The circuit board 2 is composed of a plurality of repeating unit circuits 21 arranged neatly in a sheet or strip shape. The system of the present invention can identify the During the process, the serial number of the unit circuit of the defective product can be recorded with digital data synchronously.

該工作平台11包括一移動載台111,該移動載台111能進行水平任意方向的移動,且不會有縱向(Z軸)的偏移。該移動載台111表面具有一個辨識圖像112及至少一定位治具113,該定位治具113供該電路板2靠置定位。該定位治具113數量、型式及所在位置並不限圖中單一種型式,只須供該電路板2靠置定位或能固定的結構皆可。該辨識圖像112是作為辨識該移動載台111是否被旋轉或移動的參考點,因此本發明中該辨識圖像112不會與該移動載台111表面顏色相同,且在該辨識圖像112旋轉後仍能辨識出前後位置的差異點,其中所能旋轉角度限90度內。在本實施例中,該辨識圖像112為非單一圓形圖像,例如十字架圖像、方型圖像、三角型圖像。另外該移動載台111表面的該辨識圖像112與該定位治具113間隔一段距離,該距離供該移動載台111承載該電路載具2任意移動後,該光學取像單元13乃能拍攝到該辨識圖像112。The working platform 11 includes a moving stage 111. The moving stage 111 can move in any horizontal direction without any longitudinal (Z-axis) offset. The moving stage 111 has an identification image 112 and at least one positioning jig 113 on the surface, and the positioning jig 113 is used for positioning the circuit board 2 against. The number, type, and location of the positioning fixture 113 are not limited to a single type in the figure, and only the structure for the circuit board 2 to be positioned or fixed can be used. The identification image 112 is used as a reference point for identifying whether the mobile stage 111 is rotated or moved. Therefore, in the present invention, the identification image 112 is not the same as the surface color of the mobile stage 111, and the identification image 112 is After the rotation, the difference between the front and rear positions can be identified, and the rotation angle is limited to 90 degrees. In this embodiment, the identification image 112 is a non-single circular image, such as a cross image, a square image, and a triangular image. In addition, the identification image 112 on the surface of the mobile stage 111 is spaced a distance from the positioning jig 113. The distance is for the mobile stage 111 to carry the circuit carrier 2 to move arbitrarily, and the optical imaging unit 13 can shoot. To the identification image 112.

該觀察單元12是位於該工作平台11的正上方,用以放大觀察該電路板,在本實施例中該觀察單元12為光學顯微鏡或電子顯微鏡等其中一種,能以高倍率方式清楚觀察疑似缺陷位置影像,以判斷正確與否。另外該觀察單元12若為電子顯微鏡,亦可利用該顯示單元15輔助放大顯示,便於觀察。The observation unit 12 is located directly above the work platform 11 for magnifying and observing the circuit board. In this embodiment, the observation unit 12 is one of an optical microscope or an electron microscope, and can clearly observe suspected defects at a high magnification. Position the image to determine whether it is correct or not. In addition, if the observation unit 12 is an electron microscope, the display unit 15 can also be used to assist the magnified display for easy observation.

該光學讀取單元13位於該工作平台11的上方,用以拍攝該辨識圖像112。在本實施例中該光學讀取單元13為數位照相機或數位攝影機。該光學讀取單元13是與該運算控制單元17連接並適時提供所拍攝的圖像。當該移動載台111承載該電路板2,在初始狀態,可由該光學讀取單元13拍攝圖像並定義為基準位置圖像。此可為未使用狀態,即該觀察單元12正下方為序號1之單元電路21。The optical reading unit 13 is located above the work platform 11 and is used to capture the identification image 112. In this embodiment, the optical reading unit 13 is a digital camera or a digital video camera. The optical reading unit 13 is connected to the arithmetic control unit 17 and provides a captured image in a timely manner. When the mobile stage 111 carries the circuit board 2, in the initial state, an image can be captured by the optical reading unit 13 and defined as a reference position image. This may be an unused state, that is, the unit circuit 21 with the serial number 1 is directly below the observation unit 12.

該接收單元14用以接收該電路板2的基本資料,該基本資料包括該電路板圖像及尺寸、該單元電路21的分佈位置、尺寸、數量、序號等 。另外該電路板2記錄多個該單元電路21的方式一般為採用序號表示。 該接收單元14接收方式可採鍵盤輸入,或掃描該電路板2的2D Code而獲得相關資料並予以儲存。The receiving unit 14 is used to receive basic data of the circuit board 2, and the basic data includes the image and size of the circuit board, the distribution position, size, number, and serial number of the unit circuit 21. In addition, the manner in which the circuit board 2 records a plurality of the unit circuits 21 is generally represented by a serial number. The receiving unit 14 can use a keyboard input method, or scan the 2D Code of the circuit board 2 to obtain relevant data and store it.

該顯示單元15在本實施例為一顯示器,是根據該基本資料顯示該電路板2之多個該單元電路21的分佈型態,例如分佈圖像、該電路板圖像,或是以記錄不良品位置的圖像等。此部份主要供操作者了解那些單元電路已辨識出良品或不良品,或是否已記錄。The display unit 15 is a display in this embodiment, and displays the distribution pattern of the plurality of unit circuits 21 of the circuit board 2 according to the basic information, such as a distribution image, the circuit board image, or a recording Good location images, etc. This section is mainly for the operator to know which unit circuits have identified good or bad products or whether they have been recorded.

該輸入單元16用以輸入點選訊息。在本實施例中該輸入單元16為滑鼠、鍵盤或腳踏板輸入器,但並不以此為限,亦可為能觸發一訊號的按揵。該輸入單元16主要用以通知該光學讀取單元13再度拍攝圖像,並定義此時所拍攝圖像為點選位置圖像。The input unit 16 is used for inputting a click message. In this embodiment, the input unit 16 is a mouse, keyboard, or pedal input device, but it is not limited to this, and it can also be a push button that can trigger a signal. The input unit 16 is mainly used to notify the optical reading unit 13 to capture an image again, and to define the captured image as the selected position image at this time.

該運算控制單元17,連接該光學取像單元13、該接收單元14、該顯示單元15、以及該輸入單元16,用以控制各單元運作、接收所傳送的訊息及資料,並加以運算及分析。例如接收到該輸入單元16的點選訊息後,定義該光學取像單元13此時所拍攝圖像為點選位置圖像,比較該基準位置圖像與該點選位置圖像中該辨識圖像113的差異,例如前後位置偏移距離、偏移角度、旋轉角度等,再由畫素單元轉換為尺寸單元,換算出該電路板2實際移動的距離及角度,依據該接收單元14所提供的該基本資料,換算此時是那一個該單元電路21位於該觀察單元12的正方下方,定義此時於該觀察單元12正下方為該單元電路21為缺陷並予以記錄。如此即可在辨識後同步獲得該電路板2中該單元電路21為不良品的位置、序號及數量。The calculation control unit 17 is connected to the optical imaging unit 13, the receiving unit 14, the display unit 15, and the input unit 16 to control the operation of each unit, receive the transmitted messages and data, and perform calculation and analysis. . For example, after receiving the click message from the input unit 16, the image captured by the optical imaging unit 13 at this time is defined as the click position image, and the reference position image and the identification image in the click position image are compared. The differences in image 113, such as the front-to-back position offset distance, offset angle, rotation angle, etc., are then converted from the pixel unit to the size unit, and the actual distance and angle of the circuit board 2 are converted. According to the receiving unit 14 provides The basic information of the conversion is that the unit circuit 21 is located under the square of the observation unit 12 at this time. It is defined that the unit circuit 21 is defective and recorded under the observation unit 12 at this time. In this way, the position, serial number, and quantity of the unit circuit 21 in the circuit board 2 as defective products can be obtained synchronously after identification.

接著就本發明實際運作的方式作一說明:Next, a description is given of the actual operation of the present invention:

如圖2所示,亦為初始狀態圖。於該移動載台111上將該電路板2靠置於該定位冶具113,此時該電路板2中序號為1之單元電路21已被調整至該觀察單元12的正下方,或是將該電路板2最角落的單元電路21移至該觀察單元12的正下方,此時此位置的單元電路21可視為B1位置。此時該光學讀取單元13拍攝該辨識圖像112並定義為該基準位置圖像,其中該辨識圖像112所在位置可視為C1位置。As shown in Figure 2, it is also the initial state diagram. Place the circuit board 2 on the moving stage 111 against the positioning tool 113. At this time, the unit circuit 21 with the serial number 1 in the circuit board 2 has been adjusted directly below the observation unit 12, or The unit circuit 21 at the corner of the circuit board 2 is moved directly below the observation unit 12. At this time, the unit circuit 21 at this position can be regarded as the B1 position. At this time, the optical reading unit 13 captures the identification image 112 and defines it as the reference position image, where the position of the identification image 112 can be regarded as the C1 position.

如圖3所示,辨識該電路板2疑似缺陷的過程中,操作者能水平任意方向移動該移動載台111,透過觀察該觀察單元12正下方的該單元電路21,經人工目視判定是否有缺陷。若發現缺陷存在,透過該輸入單元16輸入點選訊號,此時位於該觀察單元12中心正下方於該單元電路21的位置可視為B2。該運算控制單元17在接收到該點選訊息時,定義該光學取像單元13此時所拍攝圖像為點選位置圖像,該辨識圖像112所在位置可視為C2位置。比較該基準位置圖像與該點選位置圖像的中該辨識圖像112差異,即計算C1位置與C2位置的旋轉位移量,換算出該電路板2移動的距離及角度,再由B1位置推算出B2位置的所在位置,依據該接收單元14所提供該電路板2的基本資料,就可推算及定義此時於該觀察單元12正下方該單元電路21為缺陷並予以記錄。As shown in FIG. 3, during the process of identifying the suspected defect of the circuit board 2, the operator can move the mobile stage 111 horizontally and in any direction. By observing the unit circuit 21 directly below the observation unit 12, it can be judged visually by human eyes. defect. If a defect is found, a click signal is input through the input unit 16, and at this time, the position of the unit circuit 21 directly below the center of the observation unit 12 can be regarded as B2. When the arithmetic control unit 17 receives the click message, it defines the image captured by the optical imaging unit 13 as the click position image, and the position of the identification image 112 can be regarded as the C2 position. Compare the difference between the reference position image and the selected image 112 in the identified image 112, that is, calculate the rotational displacement of the C1 position and the C2 position, convert the distance and angle that the circuit board 2 moves, and then calculate the B1 position The position of the B2 position is calculated, and based on the basic data of the circuit board 2 provided by the receiving unit 14, the unit circuit 21 immediately below the observation unit 12 at this time can be estimated and defined as a defect and recorded.

綜合以上所述,本發明協助陣列排版之電路板辨識且記錄缺陷位置的系統,在操作過程中,由於該移動載台111能水平任意方向移動,方便操作者快速將該電路板2移動至該觀察單元12正下方放大觀察,過程中利用光學讀取單元13、輸入單元16及運算控制單元17同步換算及記錄缺陷位置,藉此提升操作效率,亦能將相關資料數位化,以利後續資料輸出及封裝作業的進行,符合專利之申請要件。To sum up, the system for assisting the array typesetting circuit board identification and recording defect location in the present invention, during the operation, since the moving stage 111 can move in any direction horizontally, it is convenient for the operator to quickly move the circuit board 2 to the The observation unit 12 is enlarged and viewed directly below. During the process, the optical reading unit 13, the input unit 16, and the operation control unit 17 are used to synchronously convert and record the position of the defect, thereby improving the operation efficiency and digitizing related data to facilitate subsequent data. The output and packaging operations are carried out in accordance with the requirements of the patent application.

然而,上述實施例僅例示性說明本發明之功效,而非用於限制本發明,任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下,對上述實施例進行修飾與改變。此外,在上述該些實施例中之元件的數量僅為例示性說明,亦非用於限制本發明。因此本發明之權利保護範圍,應如以下之申請專利範圍所列。However, the above-mentioned embodiments merely illustrate the effectiveness of the present invention, but are not intended to limit the present invention. Any person skilled in the art can modify and change the above-mentioned embodiments without departing from the spirit and scope of the present invention. . In addition, the number of components in the above-mentioned embodiments is merely illustrative, and is not intended to limit the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the following patent application scope.

11‧‧‧工作平台11‧‧‧Working Platform

111‧‧‧移動載台 111‧‧‧mobile carrier

112‧‧‧辨識圖像 112‧‧‧Identify the image

113‧‧‧定位治具 113‧‧‧Positioning fixture

12‧‧‧觀察單元 12‧‧‧observation unit

13‧‧‧光學讀取單元 13‧‧‧Optical Reading Unit

14‧‧‧接收單元 14‧‧‧Receiving unit

15‧‧‧顯示單元 15‧‧‧display unit

16‧‧‧輸入單元 16‧‧‧Input unit

2‧‧‧電路板 2‧‧‧Circuit Board

21‧‧‧單元電路 21‧‧‧unit circuit

B1‧‧‧位置 B1‧‧‧Location

B2‧‧‧位置 B2‧‧‧Location

C1‧‧‧位置 C1‧‧‧Location

C2‧‧‧位置 C2‧‧‧Location

圖1為本發明協助陣列排版之電路板辨識且記錄缺陷位置的系統之方塊。 圖2為本發明協助陣列排版之電路板辨識且記錄缺陷位置的系統之立體示意圖。 圖3為本發明協助陣列排版之電路板辨識且記錄缺陷位置的系統之作動示意圖。 圖4為習用電路板辨識設備之方塊圖。FIG. 1 is a block diagram of a system for assisting array typesetting of a circuit board to identify and record defect locations according to the present invention. FIG. 2 is a schematic perspective view of a system for assisting array typesetting to identify and record defect locations on a circuit board according to the present invention. FIG. 3 is a schematic diagram of the operation of the system for assisting array typesetting to identify and record defect locations on a circuit board. FIG. 4 is a block diagram of a conventional circuit board identification device.

Claims (8)

一種協助陣列排版之電路板辨識且記錄缺陷位置的系統,該電路板是由多個重複的單元電路所構成,該系統包括: 一工作平台,包括一移動載台,該移動載台表面具有一辨識圖像及至少一定位治具,該定位治具供該電路板靠置定位; 一觀察單元,位於該工作平台上方,能放大觀察該電路板; 一光學取像單元,位於該工作平台上方,能拍攝該辨識圖像,且定義該移動載台承載該電路板於初始狀態所拍攝圖像為基準位置圖像; 一接收單元,接收該電路板的基本資料; 一顯示單元,依據該基本資料顯示該電路板之多個該單元電路的分佈型態; 一輸入單元,輸入點選訊息; 一運算控制單元,連接該光學取像單元、該接收單元、該顯示單元、以及該輸入單元,該運算控制單元在接收到該點選訊息時,定義該光學取像單元此時所拍攝圖像為點選位置圖像,比較該基準位置圖像與該點選位置圖像中的該辨識圖像差異,換算出該電路板移動距離及角度,依據該基本資料定義此時於該觀察單元正下方該單元電路為缺陷並予以記錄。A system for assisting array typesetting circuit board identification and recording defect location, the circuit board is composed of a plurality of repeated unit circuits, the system includes: a working platform including a mobile stage, the surface of the mobile stage has a An identification image and at least one positioning jig for positioning the circuit board against the positioning; an observation unit located above the work platform to zoom in and observe the circuit board; an optical imaging unit located above the work platform Can capture the identification image, and define the mobile carrier to carry the image captured by the circuit board in the initial state as a reference position image; a receiving unit that receives basic information of the circuit board; a display unit based on the basic The data shows the distribution pattern of the multiple unit circuits of the circuit board; an input unit for inputting the click information; an arithmetic control unit connected to the optical imaging unit, the receiving unit, the display unit, and the input unit, When the arithmetic control unit receives the click message, the image captured by the optical imaging unit is defined as the click position image. Compare the difference between the reference position image and the identified image in the selected position image, and convert the circuit board's moving distance and angle. According to the basic data, the unit circuit immediately below the observation unit is defined as a defect and Be documented. 如申請專利範圍第1項所述之協助陣列排版之電路板辨識且記錄缺陷位置的系統,其中移動載台表面的該辨識圖像與該定位治具間隔一段距離,該距離供該移動載台承載該電路板任意移動後,該光學取像單元乃能拍攝到該辨識圖像。The system for assisting array typesetting circuit board identification and recording defect position as described in the first patent application scope, wherein the identification image on the surface of the moving stage is spaced apart from the positioning jig, and the distance is provided for the moving stage After the circuit board is arbitrarily moved, the optical image capturing unit can capture the identification image. 如申請專利範圍第1項所述之協助陣列排版之電路板辨識且記錄缺陷位置的系統,其中該辨識圖像不會與該移動載台表面顏色相同,且在該辨識圖像旋轉角度在90度內,仍必須能辨識出前後狀態的差異。As described in item 1 of the scope of the patent application, the system for assisting array typesetting circuit board identification and recording defect locations, wherein the identification image will not be the same color as the surface of the moving stage, and the rotation angle of the identification image is 90 °. Within the range, it is still necessary to be able to identify the difference between the front and back status. 如申請專利範圍第1項所述之協助陣列排版之電路板辨識且記錄缺陷位置的系統,其中是比較該基準位置圖像與該點選位置圖像的該辨識圖像之間的偏移距離及角度,進行圖像單位轉換尺寸單元且計算出該電路板實際移動的角度及距離。The system for assisting array typesetting circuit board identification and recording defect position as described in the first patent application scope, wherein the offset distance between the reference position image and the selected position image is compared. And angle, perform image unit conversion size unit and calculate the actual angle and distance of the circuit board. 如申請專利範圍第1項所述之協助陣列排版之電路板辨識且記錄缺陷位置的系統,其中該基本資料包括該電路板圖像及尺寸、該單元電路的分佈位置、尺寸及數量。As described in item 1 of the scope of the patent application, a system for assisting the layout of a printed circuit board of an array to identify and record the location of defects, wherein the basic information includes the image and size of the printed circuit board, the location, size, and quantity of the unit circuits. 如申請專利範圍第1項所述之協助陣列排版之電路板辨識且記錄缺陷位置的系統,其中該移動載台能進行水平任意方向的移動,且不會有縱向(Z軸)的偏移。As described in item 1 of the scope of the patent application, the system for assisting the layout of the array board to identify and record the position of the defect, wherein the mobile stage can move in any horizontal direction without any longitudinal (Z-axis) offset. 如申請專利範圍第1項所述之協助陣列排版之電路板辨識且記錄缺陷位置的系統,其中該觀察單元為光學顯微鏡或電子顯微鏡。As described in item 1 of the scope of the patent application, the system for assisting the layout of the array board to identify and record the position of the defect, wherein the observation unit is an optical microscope or an electron microscope. 如申請專利範圍第1項所述之協助陣列排版之電路板辨識且記錄缺陷位置的系統,其中該輸入單元為滑鼠或腳踏板輸入器。As described in item 1 of the scope of the patent application, the system for assisting the layout of the array board to identify and record defect locations, wherein the input unit is a mouse or a pedal input.
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TW201418738A (en) * 2012-11-02 2014-05-16 Kinsus Interconnect Tech Corp Terminal inspection system

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US20030155908A1 (en) * 2002-02-20 2003-08-21 Tohoku Pioneer Corporation Test mark and electronic device incorporating the same
CN1982904A (en) * 2005-12-12 2007-06-20 艾普特佩克股份有限公司 Apparatus, unit and method for testing image sensor packages
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