TWI663237B - Thermosensitive adhesive agent, thermosensitive adhesive sheet and thermosensitive adhesive tape - Google Patents
Thermosensitive adhesive agent, thermosensitive adhesive sheet and thermosensitive adhesive tape Download PDFInfo
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- TWI663237B TWI663237B TW104107874A TW104107874A TWI663237B TW I663237 B TWI663237 B TW I663237B TW 104107874 A TW104107874 A TW 104107874A TW 104107874 A TW104107874 A TW 104107874A TW I663237 B TWI663237 B TW I663237B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
本發明之感溫性黏著劑,係含有第1側鏈結晶性聚合物,在未達前述第1側鏈結晶性聚合物之融點之溫度時黏著力會降低,且進一步含有具有小於前述第1側鏈結晶性聚合物之重量平均分子量的第2側鏈結晶性聚合物。藉此,可得到下述效果:即使在高溫環境下(例如200℃以上)亦具有可固定玻璃等之耐熱性,且從高溫環境下冷卻而曝露於低溫環境下時,可將所固定之玻璃等剝離。 The temperature-sensitive adhesive of the present invention contains a first side chain crystalline polymer, and the adhesive force decreases when the temperature does not reach the melting point of the first side chain crystalline polymer, and further contains less than the first The weight average molecular weight of the side chain crystalline polymer is the second side chain crystalline polymer. Thereby, the following effects can be obtained: even in a high-temperature environment (for example, 200 ° C or higher), the heat resistance of glass can be fixed, and when the glass is cooled from a high-temperature environment and exposed to a low-temperature environment, the fixed glass can be And so on.
Description
本發明係關於一種即使在高溫環境下(例如200℃以上),亦具有可固定玻璃等之耐熱性,且從高溫環境下冷卻而曝露於低溫環境下時,可將所固定之玻璃等剝離的感溫性黏著劑。 The present invention relates to a heat-resistant glass that can be fixed even in a high-temperature environment (for example, 200 ° C or higher), and can be peeled off when the glass is fixed when cooled from a high-temperature environment and exposed to a low-temperature environment. Thermosensitive adhesive.
在觸控面板、有機EL元件(OLED)等之製造步驟中,為有效率地進行基板加工,有時會使用黏著劑、黏著片、黏著膠帶等以固定基板。例如,於日本專利文獻1中記載一種含有特定之增黏劑及側鏈結晶性聚合物的黏著片。 In the manufacturing steps of a touch panel, an organic EL element (OLED), and the like, in order to efficiently process a substrate, an adhesive, an adhesive sheet, an adhesive tape, or the like is sometimes used to fix the substrate. For example, Japanese Patent Document 1 describes an adhesive sheet containing a specific tackifier and a side chain crystalline polymer.
於觸控面板、有機EL元件等之製造步驟,係存在將基板曝露於200℃以上之高溫環境下之製程。例如,使用以往之黏著片等,將塑膠製基板固定於玻璃製之基座時,即使曝露於高溫條件下之後,亦可將基板從基座剝離。 In the manufacturing steps of touch panels, organic EL elements, etc., there is a process of exposing the substrate to a high temperature environment above 200 ° C. For example, when a plastic substrate is fixed to a glass substrate using a conventional adhesive sheet or the like, the substrate can be peeled from the substrate even after being exposed to a high temperature condition.
但,在使用以往之黏著片等,將玻璃製之基板固定於玻璃製基座時,若曝露於高溫環境下,黏著成分對玻璃的密著性升高而難以從基座將基板剝離。又,即 使很難剝離,若為柔軟之薄膜狀基板,例如亦可以捲取方式將基板彎曲剝離,惟如為玻璃基板時,並無法彎曲而剝離。如此地,以往之黏著劑、黏著片、黏著膠帶等係未想到將玻璃基板固定於玻璃製基座。 However, when a glass substrate is fixed to a glass substrate using a conventional adhesive sheet or the like, if it is exposed to a high temperature environment, the adhesion of the adhesive component to the glass increases, and it is difficult to peel the substrate from the substrate. Again, ie It is difficult to peel off, and if it is a flexible film substrate, for example, the substrate can be bent and peeled off by winding. However, if it is a glass substrate, it cannot be peeled off by bending. In this manner, conventional adhesives, adhesive sheets, adhesive tapes, and the like have not been thought of fixing a glass substrate to a glass base.
[專利文獻1]日本特開2012-102212號公報 [Patent Document 1] Japanese Patent Application Publication No. 2012-102212
本發明之課題係提供一種即使在高溫環境下(例如200℃以上),亦具有可固定玻璃等之耐熱性,且從高溫環境下冷卻而曝露於低溫環境下時,可將所固定之玻璃等剝離的感溫性黏著劑。 The object of the present invention is to provide a heat-resistant glass that can be fixed even in a high-temperature environment (for example, 200 ° C or higher), and when the glass is cooled from a high-temperature environment and exposed to a low-temperature environment, the fixed glass can be fixed. Peeling thermosensitive adhesive.
本發明之感溫性黏著劑,係含有第1側鏈結晶性聚合物,在未達前述第1側鏈結晶性聚合物融點之溫度時黏著力會降低,且進一步含有具有小於前述第1側鏈結晶性聚合物之重量平均分子量的第2側鏈結晶性聚合物。 The temperature-sensitive adhesive of the present invention contains a first side chain crystalline polymer, and the adhesive force decreases when it does not reach the melting point of the first side chain crystalline polymer, and further contains The second side chain crystalline polymer is a weight average molecular weight of the side chain crystalline polymer.
若依據本發明之感溫性黏著劑,可得到下述效果:即使在高溫環境下(例如200℃以上),亦具有可固定玻璃等之耐熱性,且從高溫環境下冷卻而曝露於低溫環 境下時,可將所固定之玻璃等剝離。 According to the temperature-sensitive adhesive according to the present invention, the following effects can be obtained: even in a high-temperature environment (for example, 200 ° C or higher), it has heat resistance for fixing glass and the like, and is cooled from a high-temperature environment and exposed to a low-temperature ring. In the environment, the fixed glass can be peeled off.
1a、1b‧‧‧表玻璃 1a, 1b‧‧‧ watch glass
2‧‧‧基座 2‧‧‧ base
3‧‧‧固定具 3‧‧‧ Fixture
4‧‧‧感溫性黏著片 4‧‧‧Temperature-sensitive adhesive sheet
第1圖係用以說明實施例中之剝離強度的測定方法之示意圖。 FIG. 1 is a schematic diagram for explaining a method for measuring peel strength in the examples.
以下,詳細說明本發明之一實施形態的感溫性黏著劑。本實施形態之感溫性黏著劑係含有:第1側鏈結晶性聚合物、及具有小於第1側鏈結晶性聚合物之重量平均分子量的第2側鏈結晶性聚合物。 Hereinafter, a temperature-sensitive adhesive according to an embodiment of the present invention will be described in detail. The temperature-sensitive adhesive of this embodiment contains a first side chain crystalline polymer and a second side chain crystalline polymer having a weight-average molecular weight smaller than that of the first side chain crystalline polymer.
所謂「側鏈結晶性聚合物」係具有融點之 聚合物。此處,「融點」係藉由某平衡製程,最初係整合成有秩序配列之聚合體的特定部分成為無秩序狀態之溫度,使用示差熱掃描熱量計(DSC),以10℃/分鐘之測定條件測定所得之值。 The so-called `` side-chain crystalline polymer '' has a melting point. polymer. Here, the "melting point" refers to the temperature at which a specific part of the polymer that is integrated into an orderly arrangement initially becomes disordered by a certain equilibrium process. The differential scanning calorimeter (DSC) is used to measure the temperature at 10 ° C / min Conditionally measured value.
側鏈結晶性聚合物係以上述之未達融點之 溫度結晶化,且以融點以上之溫度進行相轉移而顯示流動性。亦即,側鏈結晶性聚合物係依照溫度変化而成為可逆性結晶狀態或流動狀態,故具有感溫性。若側鏈結晶性聚合物冷卻至未達融點,會進行結晶化而黏著力降低。另一方面,若側鏈結晶性聚合物加熱至融點以上即顯示流動性,故黏著力恢復。其結果,本實施形態之感溫性黏著劑 可重複使用。 The side chain crystalline polymer is based on the above-mentioned melting point It crystallizes at temperature, and undergoes phase transfer at a temperature above the melting point to show fluidity. That is, since the side-chain crystalline polymer is reversible in a crystalline state or a fluid state according to a temperature change, it has a temperature sensitivity. When the side-chain crystalline polymer is cooled to a temperature lower than the melting point, crystallization proceeds and the adhesive force decreases. On the other hand, when the side-chain crystalline polymer is heated above the melting point, it exhibits fluidity, and thus the adhesive force is restored. As a result, the temperature-sensitive adhesive of this embodiment reusable.
本實施形態之感溫性黏著劑所含之第1側鏈結晶性聚合物係只要為側鏈結晶性聚合物即可,並無特別限定,可舉例如使包含具有碳數16以上之直鏈狀烷基的(甲基)丙烯酸酯之單體成分聚合所得之聚合體等。又,「(甲基)丙烯酸酯」係指「丙烯酸酯」或「甲基丙烯酸酯」。此碳數16以上之直鏈狀烷基為發揮側鏈結晶性聚合物之側鏈結晶性部位作用。亦即,側鏈結晶性聚合物係於側鏈具有碳數16以上之直鏈狀烷基的梳形之聚合物,此側鏈藉由分子間力等整合成有秩序之排列並結晶化。 The first side chain crystalline polymer contained in the temperature-sensitive adhesive of this embodiment is not particularly limited as long as it is a side chain crystalline polymer, and for example, a straight chain having a carbon number of 16 or more may be included. A polymer obtained by polymerizing a monomer component of an alkyl-like (meth) acrylate. The "(meth) acrylate" means "acrylate" or "methacrylate". The linear alkyl group having 16 or more carbon atoms functions as a side chain crystalline portion of the side chain crystalline polymer. That is, the side chain crystalline polymer is a comb-shaped polymer having a linear alkyl group having 16 or more carbon atoms in the side chain, and the side chain is integrated into an orderly arrangement and crystallized by an intermolecular force.
具有碳數16以上之直鏈狀烷基的(甲基)丙 烯酸酯係可舉例如(甲基)丙烯酸鯨蠟酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸二十烷酯、(甲基)丙烯酸二十二烷酯等之具有碳數16至22之直鏈狀烷基的(甲基)丙烯酸酯。此(甲基)丙烯酸酯係可只使用1種,亦可併用2種以上。此(甲基)丙烯酸酯於單體成分中較佳係以10至90重量%,更佳係以20至80重量%之比率含有。 (Meth) propane having a linear alkyl group having 16 or more carbon atoms Examples of the acrylates include carbon numbers such as cetyl (meth) acrylate, stearyl (meth) acrylate, eicosyl (meth) acrylate, and behenyl (meth) acrylate. (Meth) acrylates of 16 to 22 linear alkyl groups. These (meth) acrylic acid esters may be used alone or in combination of two or more. The (meth) acrylic acid ester is preferably contained in the monomer component at a ratio of 10 to 90% by weight, and more preferably at a ratio of 20 to 80% by weight.
於單體成分中,亦可含有可與具有碳數16 以上之直鏈狀烷基的(甲基)丙烯酸酯共聚合之其他的單體。其他之單體係可舉例如極性單體、具有碳數16以上之直鏈狀烷基以外之烷基的(甲基)丙烯酸酯等。 The monomer component may contain a carbon number of 16 Other monomers copolymerized by the (meth) acrylates of the above linear alkyl groups. Examples of other single systems include polar monomers, (meth) acrylates having an alkyl group other than a linear alkyl group having 16 or more carbon atoms, and the like.
極性單體係可舉例如丙烯酸、甲基丙烯 酸、巴豆酸、依康酸、馬來酸、富馬酸等之具有羧基的乙烯性不飽和單體;(甲基)丙烯酸2-羥乙酯、(甲基)丙烯酸2-羥丙酯、(甲基)丙烯酸2-羥己酯等之具有羥基的乙烯性不飽和單體等。此等之極性單體係可只使用1種,亦可併用2種以上。極性單體係於單體成分中較佳係以20重量%以下、更佳係以1至15重量%之比率含有。 Examples of polar monosystems include acrylic acid and methacrylic acid. Acid, crotonic acid, itaconic acid, maleic acid, fumaric acid and other ethylenically unsaturated monomers having a carboxyl group; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, An ethylenically unsaturated monomer having a hydroxyl group, such as 2-hydroxyhexyl (meth) acrylate. These polar single systems can be used alone or in combination of two or more. The polar mono system is preferably contained in the monomer component at 20% by weight or less, and more preferably at a ratio of 1 to 15% by weight.
具有碳數16以上之直鏈狀烷基以外之烷基 的(甲基)丙烯酸酯係可舉例如具有碳數1至6之烷基的(甲基)丙烯酸酯,可列舉如:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丁酯及(甲基)丙烯酸己酯等。此(甲基)丙烯酸酯係可只使用1種,亦可併用2種以上。此(甲基)丙烯酸酯係於單體成分中較佳係以10至90重量%、更佳係以20至80重量%之比率含有。 Alkyl groups other than linear alkyl groups having 16 or more carbon atoms Examples of the (meth) acrylates include (meth) acrylates having an alkyl group having 1 to 6 carbon atoms, and examples thereof include (meth) acrylate, (meth) acrylate, and (form) Butyl acrylate, hexyl (meth) acrylate, and the like. These (meth) acrylic acid esters may be used alone or in combination of two or more. The (meth) acrylic acid ester is preferably contained in the monomer component at a ratio of 10 to 90% by weight, and more preferably at a ratio of 20 to 80% by weight.
進一步,於單體成分可含有反應性氟化合 物。反應性氟化合物係指具有顯示反應性之官能基的氟化合物。顯示反應性之官能基係可舉例如乙烯基、烯丙基、(甲基)丙烯酸基、(甲基)丙烯醯基、(甲基)丙烯醯氧基等之具有乙烯性不飽和雙鍵的基;環氧基(含有環氧丙基及環氧基環烷基)、氫硫基、卡必醇基(羥甲基)、羧基、矽醇基、酚基、胺基、羥基等。 Further, the monomer component may contain reactive fluorination Thing. The reactive fluorine compound refers to a fluorine compound having a functional group that exhibits reactivity. Reactive functional groups include, for example, vinyl, allyl, (meth) acrylic, (meth) acrylfluorenyl, (meth) acrylfluorenyl, and the like having ethylenically unsaturated double bonds. Group; epoxy group (containing epoxy propyl and epoxy cycloalkyl group), hydrogen thio group, carbitol (hydroxymethyl) group, carboxyl group, silanol group, phenol group, amino group, hydroxyl group, and the like.
反應性氟化合物之具體例係可舉例如下述 一般式(I)所示之化合物等。 Specific examples of the reactive fluorine compound include, for example, the following A compound represented by the general formula (I) and the like.
R1-CF3 (I) R 1 -CF 3 (I)
式中,R1係表示CH2=CHCOOR2-或CH2=C(CH3)COOR2-。又,R2係表示伸烷基。 In the formula, R 1 represents CH 2 = CHCOOR 2 -or CH 2 = C (CH 3 ) COOR 2- . R 2 represents an alkylene group.
伸烷基係可舉例如亞甲基、伸乙基、三亞甲基、伸丙基、四亞甲基、五亞甲基、六亞甲基等之碳數1至6之直鏈或分枝的伸烷基等。 The alkylene system can be, for example, a straight or branched chain having 1 to 6 carbon atoms, such as methylene, ethylene, trimethylene, propylene, tetramethylene, pentamethylene, and hexamethylene. Alkylene and so on.
一般式(I)所示之化合物之具體例係可舉例如以下述式(Ia)所示之2,2,2-三氟乙基丙烯酸酯、式(Ib)所示之2,2,2-三氟乙基甲基丙烯酸酯等。 Specific examples of the compound represented by the general formula (I) include, for example, 2,2,2-trifluoroethyl acrylate represented by the following formula (Ia), and 2,2,2 represented by the formula (Ib) -Trifluoroethyl methacrylate and the like.
反應性氟化合物係可使用市販品,例如「Viscoat3F」、「Viscoat 3FM」、「Viscoat 4F」、「Viscoat 8F」、「Viscoat 8FM」(任一者均為大阪有機化學工業(股)製)、「Light ester M-3F」(共榮社化學(股)製)等已在市售。 Commercially available reactive fluorine compounds are available, such as "Viscoat3F", "Viscoat 3FM", "Viscoat 4F", "Viscoat 8F", "Viscoat 8FM" (Either are manufactured by Osaka Organic Chemical Industries, Ltd.), "Light ester M-3F" (manufactured by Kyoeisha Chemical Co., Ltd.) and others are now commercially available.
反應性氟化合物係可只使用1種,亦可併用2種以上。進一步,反應性氟化合物係於單體成分中較佳係以10重量%以下、更佳係以5重量%以下之比率含有。 The reactive fluorine compounds may be used alone or in combination of two or more. Furthermore, the reactive fluorine compound is preferably contained in the monomer component at a ratio of 10% by weight or less, and more preferably at a ratio of 5% by weight or less.
第1側鏈結晶性聚合物之較佳的組成係丙 烯酸二十二烷酯28至34重量%、丙烯酸甲酯54至64重量%、丙烯酸4至6重量%、及式(Ia)所示之2,2,2-三氟乙基丙烯酸酯4至6重量%。第1側鏈結晶性聚合物之其他之較佳的組成係丙烯酸硬脂酯26至30重量%、丙烯酸甲酯58至66重量%、丙烯酸4至6重量%、及式(Ia)所示之2,2,2-三氟乙基丙烯酸酯4至6重量%。第1側鏈結晶性聚合物係單體成分之中,以丙烯酸甲酯之比率最多者為佳。 The preferred composition of the first side chain crystalline polymer is C. Behenyl enoate 28 to 34% by weight, methyl acrylate 54 to 64% by weight, acrylic acid 4 to 6% by weight, and 2,2,2-trifluoroethyl acrylate 4 represented by formula (Ia) To 6% by weight. Other preferable compositions of the first side chain crystalline polymer are 26 to 30% by weight of stearyl acrylate, 58 to 66% by weight of methyl acrylate, 4 to 6% by weight of acrylic acid, and the formula (Ia) 2,2,2-trifluoroethyl acrylate 4 to 6% by weight. Among the first side chain crystalline polymer-based monomer components, the ratio of methyl acrylate is the largest.
單體成分之聚合方法係無特別限定,可舉 例如溶液聚合法、塊狀聚合法、懸浮聚合法、乳化聚合法等。例如,採用溶液聚合法時,混合單體成分與溶劑,依需要而添加聚合起始劑或鏈轉移劑,只要一邊攪拌,一邊以40至90℃左右使之反應2至10小時左右即可。 The polymerization method of the monomer component is not particularly limited, and examples thereof Examples include solution polymerization, block polymerization, suspension polymerization, and emulsion polymerization. For example, in the case of a solution polymerization method, a monomer component and a solvent are mixed, and a polymerization initiator or a chain transfer agent is added as needed, as long as it is stirred at about 40 to 90 ° C. for 2 to 10 hours.
第1側鏈結晶性聚合物之重量平均分子量 並無特別限定,較佳係大於100000,更佳係300000至800000,最佳係400000至700000。重量平均分子量係以凝膠滲透色層分析(GPC)測定,將所得之測定值換算聚苯乙烯之值。 Weight average molecular weight of the first side chain crystalline polymer It is not particularly limited, but it is preferably greater than 100,000, more preferably 300,000 to 800,000, and most preferably 400,000 to 700,000. The weight average molecular weight is measured by gel permeation chromatography (GPC), and the obtained measured value is converted into a value of polystyrene.
本實施形態之感溫性黏著劑所含之第1側 鏈結晶性聚合物係例如若考量基板加工之製程中的固定及剝離,以具有10至60℃之融點為較佳,以具有20至60℃之融點為更佳。若融點為如此之溫度,在基板加工之高溫環境下的製程,因感溫性黏著劑具有黏著性,故可將被黏體確實地固定。另一方面,為剝離被黏體而進行冷卻時, 可以比較少的冷卻能量冷卻至未達融點的溫度。融點係可藉由改變單體成分之組成等而調整。 The first side contained in the temperature-sensitive adhesive of this embodiment The chain crystalline polymer is, for example, when fixing and peeling in a substrate processing process are considered, a melting point of 10 to 60 ° C is preferred, and a melting point of 20 to 60 ° C is more preferred. If the melting point is at such a temperature, the process in a high-temperature environment of substrate processing, because the temperature-sensitive adhesive has adhesiveness, the adherend can be reliably fixed. On the other hand, when cooling is performed to peel the adherend, It can be cooled to a temperature below the melting point with relatively little cooling energy. The melting point can be adjusted by changing the composition of the monomer components and the like.
本實施形態之感溫性黏著劑所含之第2側鏈結晶性聚合物係只要具有小於第1側鏈結晶性聚合物的重量平均分子量者即可,並無特別限定。 The second side chain crystalline polymer contained in the temperature-sensitive adhesive of this embodiment is not particularly limited as long as it has a weight average molecular weight smaller than that of the first side chain crystalline polymer.
將以往之感溫性黏著劑固定於被黏體之狀 態,若曝露於高溫環境下,感溫性黏著劑變柔軟而按照存在於被黏體之表面的凹凸形狀。因此,冷卻之時,顯現所謂之錨定效果,感溫性黏著劑之黏著力亦高於初期黏著力,產生剝離不良。 Fixing the conventional temperature-sensitive adhesive to the adherend In the state, if exposed to a high temperature environment, the temperature-sensitive adhesive becomes soft and conforms to the uneven shape existing on the surface of the adherend. Therefore, when cooling, the so-called anchoring effect appears, and the adhesive force of the thermosensitive adhesive is higher than the initial adhesive force, resulting in poor peeling.
推測第2側鏈結晶性聚合物係使高溫環境 下之感溫性黏著劑對被黏體之潤濕性降低,而使感溫性黏著劑難以按照存在於被黏體表面之凹凸形狀。其結果,可抑制錨定效果之顯現,並提高剝離性。 The second side chain crystalline polymer is presumed to have a high temperature environment The lower temperature-sensitive adhesive has lower wettability to the adherend, making it difficult for the temperature-sensitive adhesive to follow the uneven shape existing on the surface of the adherend. As a result, it is possible to suppress the development of the anchoring effect and improve the peelability.
第2側鏈結晶性聚合物基本上係可藉由與 第1側鏈結晶性聚合物之相同方法而得。亦即,將包含上述具有碳數16以上之直鏈狀烷基的(甲基)丙烯酸酯、極性單體、具有碳數16以上之直鏈狀烷基以外的烷基之(甲基)丙烯酸酯等的單體成分,以上述之溶液聚合法、塊狀聚合法、懸浮聚合法、乳化聚合法等聚合而得。依需要,於單體成分中亦可含有上述反應性氟化合物。 The second side chain crystalline polymer is basically It is obtained by the same method as the first side chain crystalline polymer. That is, the (meth) acrylic acid containing the (meth) acrylic acid ester having a linear alkyl group having 16 or more carbon atoms, a polar monomer, and an alkyl group other than the linear alkyl group having a carbon number of 16 or more Monomer components such as esters are obtained by polymerization by the aforementioned solution polymerization method, block polymerization method, suspension polymerization method, and emulsion polymerization method. The above-mentioned reactive fluorine compound may be contained in a monomer component as needed.
在第2側鏈結晶性聚合物之聚合反應中,因 使重量平均分子量小於第1側鏈結晶性聚合物,故例如較第1側鏈結晶性聚合物之聚合反應更增加聚合起始劑或鏈轉移劑之添加量而調整至所希望之重量平均分子量即可。 第2側鏈結晶性聚合物之重量平均分子量較佳係100000以下,更佳係4000至100000,再更佳係4000至40000,最佳係5000至30000。 In the polymerization reaction of the second side chain crystalline polymer, Since the weight average molecular weight is smaller than the first side chain crystalline polymer, for example, the polymerization initiator of the first side chain crystalline polymer is added to increase the amount of the polymerization initiator or chain transfer agent to adjust the desired weight average molecular weight. Just fine. The weight average molecular weight of the second side chain crystalline polymer is preferably 100,000 or less, more preferably 4,000 to 100,000, even more preferably 4,000 to 40,000, and most preferably 5,000 to 30,000.
第2側鏈結晶性聚合物相對於第1側鏈結晶 性聚合物100重量份,較佳係以1至20重量份,更佳係以1至15重量份,再更佳係以1至10重量份,最佳係以1至5重量份之比率含有。 The second side chain crystalline polymer is crystallized with respect to the first side chain 100 parts by weight, preferably 1 to 20 parts by weight, more preferably 1 to 15 parts by weight, even more preferably 1 to 10 parts by weight, and most preferably 1 to 5 parts by weight .
第2側鏈結晶性聚合物較佳之組成係丙烯 酸二十二烷酯33至47重量%、丙烯酸硬脂酯32至38重量%、丙烯酸甲酯17至23重量%、及丙烯酸4至6重量%。 第2側鏈結晶性聚合物係以單體成分中之丙烯酸二十二烷酯之比率最多者為佳。 Preferred composition of the second side chain crystalline polymer is propylene Behenic acid acid ester 33 to 47% by weight, stearyl acrylate 32 to 38% by weight, methyl acrylate 17 to 23% by weight, and acrylic acid 4 to 6% by weight. The second side chain crystalline polymer is preferably the one having the highest ratio of behenyl acrylate in the monomer component.
本實施形態之感溫性黏著劑可依需要而進一步含有增黏劑。增黏劑可舉例如松脂系樹脂、萜烯系樹脂、烴系樹脂、環氧基系樹脂、聚醯胺系樹脂、酚系樹脂、酮系樹脂等,並無特別限定。增黏劑係可只使用1種,亦可併用2種以上。此等之中,從第1側鏈結晶性聚合物及第2側鏈結晶性聚合物之相溶性的觀點,以松脂系樹脂為佳。 The temperature-sensitive adhesive of this embodiment may further contain a tackifier as needed. Examples of the tackifier include rosin-based resins, terpene-based resins, hydrocarbon-based resins, epoxy-based resins, polyamide-based resins, phenol-based resins, and ketone-based resins. Tackifiers can be used alone or in combination of two or more. Among these, from the viewpoint of compatibility of the first side chain crystalline polymer and the second side chain crystalline polymer, a rosin resin is preferred.
增黏劑之軟化點並無特別限定,例如50至 250℃左右,較佳係90至200℃左右。若使軟化點為90至140℃,較佳為90至110℃,則有剝離性提高之傾向。又,軟化點係依據JIS K 5902所規定之環球法來測定。 The softening point of the thickener is not particularly limited, for example, 50 to About 250 ° C, preferably about 90 to 200 ° C. When the softening point is 90 to 140 ° C, preferably 90 to 110 ° C, the peelability tends to be improved. The softening point is measured in accordance with the ring and ball method specified in JIS K 5902.
松脂系樹脂係可舉例如松脂衍生物等。松 脂衍生物係可舉例如膠質松脂、木質松脂、松油松脂等之未改性松脂(生松脂)以醇類進行酯化而成之松脂的酯化合物或氫化松脂、歧化松脂、聚合松脂等之改性松脂以醇類進行酯化而成的改性松脂之酯化合物等的松脂酯類;未改性松脂、改性松脂、各種松脂衍生物等松脂類之金屬鹽;對未改性松脂、改性松脂、各種松脂衍生物等以酸觸媒加成酚而進行熱聚合所得之松脂酚樹脂等。 Examples of the turpentine resin system include a turpentine derivative. loose Examples of the lipid derivative include turpentine esters, hydrogenated turpentine, disproportionated turpentine, and polymerized turpentine, such as gum turpentine, lumber turpentine, and pine turpentine. Turpentine esters such as ester compounds of modified turpentine obtained by esterifying modified turpentine with alcohols; metal salts of turpentine such as unmodified turpentine, modified turpentine, and various turpentine derivatives; Modified turpentine, various turpentine derivatives, etc. are pinolol resins obtained by thermally polymerizing phenol with an acid catalyst.
此等之松脂衍生物之中,以松脂之酯化合 物較佳,例如市售之「Super esterA-100」、「Super ester A-125」、「PENSEL D-160」(任一者均為荒川化學工業(股)製)等。 Among these turpentine derivatives, the ester of turpentine is combined Good products such as commercially available "Super ester A-100", "Super ester A-125", and "PENSEL D-160" (each of which is manufactured by Arakawa Chemical Industries, Ltd.) and the like.
松脂之酯化合物以外之增黏劑係例如市售 之松脂改性特殊合成樹脂的「Hariester KT-3」及「Hariester DS-90」(Harima化成(股)製)、脂環族飽和烴系樹脂之「ARKON P-100」(荒川化學工業(股)製)等。 Tackifiers other than turpentine ester compounds are commercially available, for example "Hariester KT-3" and "Hariester DS-90" (made by Harima Kasei Co., Ltd.) of turpentine modified special resins, "ARKON P-100" (Arakawa Chemical Industries, Ltd.) ) System) and so on.
增黏劑係相對於第1側鏈結晶性聚合物100 重量份,較佳係以200重量份以下,更佳係以150重量份以下,最佳係以100重量份以下之比率含有。若使增黏劑之含量,相對於第1側鏈結晶性聚合物100重量份,較佳係5至40重量份,更佳係15至35重量份,最佳係25至 35重量份時,則有提升剝離性之傾向。 Tackifier based on the first side chain crystalline polymer 100 Part by weight is preferably 200 parts by weight or less, more preferably 150 parts by weight or less, and most preferably 100 parts by weight or less. If the content of the tackifier is 100 parts by weight of the first side chain crystalline polymer, it is preferably 5 to 40 parts by weight, more preferably 15 to 35 parts by weight, and most preferably 25 to At 35 parts by weight, there is a tendency to improve the peelability.
本實施形態之感溫性黏著劑係在不阻礙本實施形態之效果的範圍,亦可含有交聯劑。例如,交聯劑係為使第1側鏈結晶性聚合物彼此間、第2側鏈結晶性聚合物彼此間、或第1側鏈結晶性聚合物與第2側鏈結晶性聚合物交聯所使用。交聯劑可舉例如金屬螯合物化合物、氮環丙烷化合物、異氰酸酯化合物、環氧基化合物等。此等之中,就更提升耐熱性之點,以金屬螯合物化合物較佳。交聯反應係添加交聯劑而以90至110℃加熱1至20分鐘左右來進行。 The temperature-sensitive adhesive of this embodiment is a range which does not inhibit the effect of this embodiment, and may contain a crosslinking agent. For example, the crosslinking agent is to crosslink the first side chain crystalline polymers, the second side chain crystalline polymers, or the first side chain crystalline polymer and the second side chain crystalline polymer. Used by. Examples of the crosslinking agent include a metal chelate compound, an aziridine compound, an isocyanate compound, and an epoxy compound. Among these, in view of further improving heat resistance, a metal chelate compound is preferable. The crosslinking reaction is performed by adding a crosslinking agent and heating at 90 to 110 ° C. for about 1 to 20 minutes.
金屬螯合物化合物係可舉例如多價金屬之 乙醯丙酮配位化合物、多價金屬之乙醯乙酸酯配位化合物等。多價金屬可舉例如鋁、鎳、鉻、鐵、鈦、鋅、鈷、錳、鋯等。金屬螯合物化合物係可只使用1種,亦可併用2種以上。此等之中,以鋁之乙醯丙酮配位化合物或乙醯乙酸酯配位化合物較佳,以三乙醯丙酮鋁更佳。 Examples of metal chelate compounds include polyvalent metals. Acetylacetone complexes, polyvalent metal acetoacetate complexes, etc. Examples of the polyvalent metal include aluminum, nickel, chromium, iron, titanium, zinc, cobalt, manganese, zirconium, and the like. The metal chelate compound may be used alone or in combination of two or more. Among these, an acetoacetone complex or an acetoacetate complex of aluminum is preferred, and an aluminum triacetamate acetone complex is more preferred.
交聯劑相對於第1側鏈結晶性聚合物100 重量份,較佳係以0.1至20重量份,更佳係以0.5至15重量份,最佳係以1至15重量份之比率含有。當交聯劑採用金屬螯合物化合物時,金屬螯合物化合物相對於第1側鏈結晶性聚合物100重量份,較佳係以0.1至20重量份,更佳係以5至12重量份,最佳係以8至12重量份之比率 含有。 Crosslinking agent with respect to the first side chain crystalline polymer 100 It is preferably contained in an amount of 0.1 to 20 parts by weight, more preferably 0.5 to 15 parts by weight, and most preferably 1 to 15 parts by weight. When the metal chelate compound is used as the cross-linking agent, the metal chelate compound is preferably 0.1 to 20 parts by weight, and more preferably 5 to 12 parts by weight relative to 100 parts by weight of the first side chain crystalline polymer. , The best ratio is 8 to 12 parts by weight contain.
本實施形態之感溫性黏著劑之使用方法係 並無特別限定,可直接使用感溫性黏著劑,亦可依需要而將感溫性黏著劑與溶劑混合使用。或,如下述,可將本實施形態之感溫性黏著劑加工成感溫性黏著片、感溫性黏著膠帶等而使用。 The method of using the temperature-sensitive adhesive of this embodiment is It is not particularly limited, and the thermosensitive adhesive may be used directly, or the thermosensitive adhesive may be mixed with a solvent as required. Alternatively, the thermosensitive adhesive of the present embodiment can be processed into a thermosensitive adhesive sheet, a thermosensitive adhesive tape, or the like and used as described below.
感溫性黏著片可列舉例如無基材之片狀形態。如此之無基材之感溫性黏著片係例如在離型薄膜(塗布有聚矽氧等之離型劑的聚對苯二甲酸乙二酯薄膜等)塗佈本實施形態之感溫性黏著劑後加熱(使之交聯)而得。一般,感溫性黏著劑在塗布後,為於感溫性黏著劑之上進一步貼黏離型薄膜,使感溫性黏著片以離型薄膜挾住。離型薄膜較佳係具有5至500μm,更佳係具有25至250μm之厚度,於感溫性黏著片使用時剝離。感溫性黏著片較佳係具有5至200μm,更佳係具有10至100μm之厚度。 Examples of the temperature-sensitive adhesive sheet include a sheet-like form without a substrate. Such a substrate-free temperature-sensitive adhesive sheet is, for example, a temperature-sensitive adhesive of this embodiment coated on a release film (a polyethylene terephthalate film coated with a release agent such as polysiloxane). It is obtained by heating (crosslinking) after the agent. Generally, after the temperature-sensitive adhesive is applied, a release film is further stuck on the temperature-sensitive adhesive, so that the temperature-sensitive adhesive sheet is held by the release film. The release film preferably has a thickness of 5 to 500 μm, and more preferably has a thickness of 25 to 250 μm, and is peeled off when the thermosensitive adhesive sheet is used. The temperature-sensitive adhesive sheet preferably has a thickness of 5 to 200 μm, and more preferably has a thickness of 10 to 100 μm.
塗布方法並無特別限定,可舉例如混合感 溫性黏著劑與溶劑而調製塗布液,藉塗佈器等而塗布塗布液之方法。塗佈器可舉例如刮刀塗佈器、輥輪塗佈器、壓延塗佈器、缺角輪塗佈器、凹版塗佈器、桿棒塗佈器等。 The coating method is not particularly limited, and examples thereof include a mixed feeling A method of preparing a coating liquid with a warm adhesive and a solvent, and applying the coating liquid by an applicator or the like. Examples of the applicator include a blade applicator, a roll applicator, a calender applicator, a notch wheel applicator, a gravure applicator, and a rod applicator.
將本實施形態之感溫性黏著劑作為感溫性黏著膠帶使 用時,只要將包含本實施形態之感溫性黏著劑之黏著劑層積層於薄膜狀或片狀之基材的至少單面即可。基材係可舉例如:聚苯乙烯、聚對苯二甲酸乙二酯、聚丙烯、聚酯、聚醯胺、聚醯亞胺、聚碳酸酯、乙烯-乙酸乙烯酯共聚物、乙烯-丙烯酸乙酯共聚物、乙烯-丙烯共聚物、聚氯乙烯等之合成樹脂製之基材。 The thermosensitive adhesive of this embodiment is used as a thermosensitive adhesive tape In use, the adhesive including the thermosensitive adhesive of this embodiment may be laminated on at least one side of a film-like or sheet-like substrate. Examples of the substrate system include polystyrene, polyethylene terephthalate, polypropylene, polyester, polyamide, polyimide, polycarbonate, ethylene-vinyl acetate copolymer, and ethylene-acrylic acid. Base material made of synthetic resins such as ethyl ester copolymer, ethylene-propylene copolymer, and polyvinyl chloride.
基材可為單層構造或多層構造之任一者, 一般具有5至500μm左右,較佳係具有25至250μm左右之厚度。於基材上,就提高對黏著劑層之密著性而言,可施予例如電暈放電處理、電漿處理、噴砂處理、化學蝕刻處理、底漆處理等之表面處理。 The substrate can be a single layer structure or a multilayer structure, Generally, it has a thickness of about 5 to 500 μm, and preferably has a thickness of about 25 to 250 μm. On the substrate, in order to improve the adhesion to the adhesive layer, surface treatments such as corona discharge treatment, plasma treatment, sandblasting treatment, chemical etching treatment, and primer treatment can be applied.
於基材積層黏著劑層之方法係如上述,只 要混合感溫性黏著劑與溶劑而調製塗布液,並以塗佈器等塗布塗布液即可。黏著劑層較佳係具有5至60μm,更佳係具有10至60μm,最佳係具有10至50μm之厚度。 The method of laminating the adhesive layer on the substrate is as described above, only It is sufficient to prepare a coating liquid by mixing a thermosensitive adhesive and a solvent, and apply the coating liquid with a coater or the like. The adhesive layer preferably has a thickness of 5 to 60 μm, more preferably 10 to 60 μm, and most preferably has a thickness of 10 to 50 μm.
於基材之兩面積層黏著劑層時,各黏著劑 層之厚度可為相同,亦可為相異。形成各黏著劑層之感溫性黏著劑之組成可為相同,亦可為相異。進一步,若於單面積層包含本實施形態之感溫性黏著劑之黏著劑層,可於另一面積層包含本實施形態之感溫性黏著劑以外之黏著劑(例如感壓性黏著劑等)的黏著劑層。感壓性黏著劑係可舉例如天然膠系黏著劑、合成膠系黏著劑、苯乙烯-丁二烯乳膠基材黏著劑、丙烯酸系黏著劑等。 When the adhesive layer is applied to two areas of the substrate, each adhesive The thicknesses of the layers can be the same or different. The composition of the thermosensitive adhesives forming the respective adhesive layers may be the same or different. Further, if the adhesive layer of the thermosensitive adhesive of this embodiment is included in a single-area layer, an adhesive other than the thermosensitive adhesive of this embodiment (such as a pressure-sensitive adhesive) may be included in another area layer. Adhesive layer. Examples of the pressure-sensitive adhesive system include natural rubber-based adhesives, synthetic rubber-based adhesives, styrene-butadiene latex-based adhesives, and acrylic-based adhesives.
進一步,於感溫性黏著膠帶之黏著劑層之 表面一般係積層離型薄膜,此離型薄膜係於感溫性黏著膠帶之使用時剝離。離型薄膜係使用以上述之感溫性黏著片所說明之離型薄膜。 Further, in the adhesive layer of the thermosensitive adhesive tape The surface is generally laminated with a release film, and this release film is peeled off when the temperature-sensitive adhesive tape is used. The release film is a release film described using the above-mentioned thermosensitive adhesive sheet.
本實施形態之感溫性黏著劑係具有即使在 高溫環境下(例如200℃以上)亦可固定玻璃等之耐熱性,且從高溫環境下進行冷卻而曝露於低溫環境下時,發揮可剝離已固定之玻璃等的效果。例如,本實施形態之感溫性黏著劑曝露於200℃以上之高溫環境下之後,在5℃之玻璃-玻璃間的剝離強度較佳係10N/676mm2以下。如此地,因剝離強度低,即使將玻璃製之基板固定於玻璃製之基座,冷卻後亦可將玻璃基板剝離。 The temperature-sensitive adhesive of this embodiment has heat resistance that can fix glass and the like even in a high-temperature environment (for example, 200 ° C or higher), and exhibits peelability when it is cooled from a high-temperature environment and exposed to a low-temperature environment. The effect of fixed glass, etc. For example, after exposing the temperature-sensitive adhesive of this embodiment to a high-temperature environment of 200 ° C. or higher, the peel strength between glass and glass at 5 ° C. is preferably 10 N / 676 mm 2 or less. In this way, since the peeling strength is low, the glass substrate can be peeled after cooling even if the glass substrate is fixed to the glass base.
因此,本實施形態之感溫性黏著劑係在例 如包含玻璃基板曝露於200℃以上之高溫環境下的製程之觸控面板、有機EL元件等的製造步驟中,適宜使用來作為用以暫固定玻璃基板之黏著劑。 Therefore, the temperature-sensitive adhesive of this embodiment is an example For example, in the manufacturing steps of a touch panel, an organic EL element, and the like including a process in which a glass substrate is exposed to a high temperature environment of 200 ° C or higher, it is suitable as an adhesive for temporarily fixing the glass substrate.
以下,舉出實施例及比較例具體地說明本發明,但本發明係不受此等之實施例限定。 Hereinafter, the present invention will be specifically described with examples and comparative examples, but the present invention is not limited by these examples.
將表1所示之單體以表1所示之比率加入於反應容器中。表1所示之單體係以下述。 The monomers shown in Table 1 were added to the reaction vessel at the ratio shown in Table 1. The single system shown in Table 1 is as follows.
C22A:丙烯酸二十二烷酯 C22A: behenyl acrylate
C18A:丙烯酸硬脂酯 C18A: stearyl acrylate
C1A:丙烯酸甲酯 C1A: methyl acrylate
AA:丙烯酸 AA: Acrylic
V3F:反應性氟化合物(上述式(Ia)所示之2,2,2-三氟乙基丙烯酸酯:大阪有機化學工業(股)製之「Viscoat 3F」) V3F: Reactive fluorine compound (2,2,2-trifluoroethyl acrylate represented by the above formula (Ia): "Viscoat 3F" manufactured by Osaka Organic Chemical Industry Co., Ltd.)
然後,將相對於單體混合物100重量份為200重量份之溶劑加入反應容器中。溶劑係使用乙酸乙酯:甲苯=8:2(重量比)之混合溶劑。進一步,將作為聚合起始劑之日油公司製「Peroyl OPP」以0.3重量份之比率加入反應容器之後,以55℃攪拌4小時,使此等之單體共聚合,得到第1側鏈結晶性聚合物。所得之第1側鏈結晶性聚合物之重量平均分子量為600000,融點為55℃。重量平均分子量係以GPC測定,為將所得之測定值換算聚苯乙烯之值。融點係使用DSC以10℃/分鐘之測定條件所測定之值。 Then, 200 parts by weight of a solvent relative to 100 parts by weight of the monomer mixture was added to the reaction container. As the solvent, a mixed solvent of ethyl acetate: toluene = 8: 2 (weight ratio) was used. Furthermore, "Peroyl OPP" manufactured by Nippon Oil Corporation was added as a polymerization initiator to the reaction container at a ratio of 0.3 parts by weight, and then stirred at 55 ° C for 4 hours to copolymerize these monomers to obtain a first side chain crystal. Sexual polymer. The weight average molecular weight of the obtained first side chain crystalline polymer was 600,000, and the melting point was 55 ° C. The weight average molecular weight is measured by GPC, and is a value obtained by converting the obtained measured value into polystyrene. The melting point is a value measured using DSC under measurement conditions of 10 ° C / minute.
將表1所示之單體以表1所示之比率加入反應容器中。然後,將相對於單體混合物100重量份為100重量份之溶劑加入反應容器中。溶劑係使用甲苯。進一步,分別將作為聚合起始劑之日油公司製「Perhexyl PV」1.0重量份、作為鏈轉移劑之十二烷基硫醇6.0重量份之比率加入反應容器之後,以60℃攪拌2小時。繼而,在回流溫度進一步攪拌3小時,使此等之單體共聚合,得到第2側鏈結晶性聚合物。所得之第2側鏈結晶性聚合物之重量平均分子量為8000,融點為51℃。 The monomers shown in Table 1 were added to the reaction vessel at the ratio shown in Table 1. Then, 100 parts by weight of a solvent relative to 100 parts by weight of the monomer mixture was added to the reaction container. As the solvent, toluene was used. Furthermore, 1.0 parts by weight of "Perhexyl PV" manufactured by Nippon Oil Co., Ltd. as a polymerization initiator and 6.0 parts by weight of dodecyl mercaptan as a chain transfer agent were added to the reaction vessel, and then stirred at 60 ° C for 2 hours. Then, these monomers were further stirred at the reflux temperature for 3 hours, and these monomers were copolymerized to obtain a second side chain crystalline polymer. The weight average molecular weight of the obtained 2nd side chain crystalline polymer was 8000, and the melting point was 51 ° C.
相對於合成例1所得之第1側鏈結晶性聚合物100重量份,以合成例2所得之第2側鏈結晶性聚合物1重量份、及作為交聯劑之三乙醯丙酮鋁(川研Fine Chemical(股)製)10重量份之比率混合。然後,於所得之混合物加入乙酸乙酯以使固形分成為30重量%之方式調製塗布液。 With respect to 100 parts by weight of the first side-chain crystalline polymer obtained in Synthesis Example 1, 1 part by weight of the second side-chain crystalline polymer obtained in Synthesis Example 2 and aluminum triacetamate (Sichuan) (Ken Fine Chemical Co., Ltd.) was mixed at a ratio of 10 parts by weight. Then, ethyl acetate was added to the obtained mixture to prepare a coating solution such that the solid content was 30% by weight.
將所得之塗布液塗佈於離型薄膜上,以100 ℃加熱10分鐘進行交聯反應。如此作法,得到具有25μm之厚度的感溫性黏著片。離型薄膜係使用表面塗佈有聚矽氧之具有厚度50μm的聚對苯二甲酸乙二酯薄膜。 The obtained coating solution was coated on a release film, and Cross-linking was performed by heating at 10 ° C for 10 minutes. In this way, a temperature-sensitive adhesive sheet having a thickness of 25 μm was obtained. The release film is a polyethylene terephthalate film having a thickness of 50 μm coated with polysiloxane on the surface.
除了以表2所示之比率使用表2所示之成分以外,以與實施例1同樣之順序調製塗布液,得到感溫性黏著片。增黏劑係使用軟化點為95至105℃之荒川化學工業(股)製之「Super esterA-100」。 A coating liquid was prepared in the same procedure as in Example 1 except that the components shown in Table 2 were used at the ratios shown in Table 2 to obtain a thermosensitive adhesive sheet. The thickener is "Super ester A-100" manufactured by Arakawa Chemical Industries, Ltd. with a softening point of 95 to 105 ° C.
對於實施例1至7及比較例1所得之感溫性黏著片,以下述之方法評價(1)耐熱性、(2)剝離性及(3)剝離強度。結果表示於表2中。 About the temperature-sensitive adhesive sheet obtained in Examples 1 to 7 and Comparative Example 1, (1) heat resistance, (2) peelability, and (3) peel strength were evaluated by the following methods. The results are shown in Table 2.
於50℃環境中,隔著感溫性黏著片而將玻璃基板(覆蓋玻璃(50mm×70mm))固定於玻璃基座上。然後,將固定有玻璃基板的玻璃基座在200℃環境下靜置60分鐘。其後,以目視觀察玻璃基板之狀態,以下述之基準評價。○之時,判斷為即使在高溫環境下,玻璃基板亦被固定於玻璃基座,評價為具有良好的耐熱性之感溫性黏著片。 In a 50 ° C environment, a glass substrate (cover glass (50 mm × 70 mm)) was fixed to a glass base via a temperature-sensitive adhesive sheet. Then, the glass base to which the glass substrate was fixed was left still in a 200 ° C environment for 60 minutes. Then, the state of the glass substrate was visually observed, and it evaluated based on the following criteria. At ○, it was determined that the glass substrate was fixed to the glass base even in a high-temperature environment, and it was evaluated as a temperature-sensitive adhesive sheet having good heat resistance.
○:於玻璃基板未看到浮起之情形。 (Circle): A float is not seen on a glass substrate.
×:於玻璃基板可看到浮起之情形。 ×: A floating state can be seen on the glass substrate.
在上述之耐熱性中以目視觀察後,將固定有玻璃基板之玻璃基座在5℃環境下靜置5分鐘。其後,從玻璃基座以手剝離玻璃基板,以下述之基準評價。◎、○或△之情形,評價為具有良好的剝離性之感溫性黏著片。 After the above heat resistance was visually observed, the glass base to which the glass substrate was fixed was left to stand in a 5 ° C environment for 5 minutes. Thereafter, the glass substrate was peeled from the glass base by hand, and evaluated on the basis of the following criteria. In the case of ◎, ○, or △, it was evaluated as a thermosensitive adhesive sheet having good peelability.
◎:可從玻璃基座容易地剝離玻璃基板之情形。 :: When the glass substrate can be easily peeled from the glass base.
○:感覺些許阻力,但仍可從玻璃基座剝離玻璃基板之情形。 (Circle): Although some resistance is felt, a glass substrate can still be peeled from a glass base.
△:感覺到有阻力,但可從玻璃基座剝離玻璃基板之情形。 △: Resistance is felt, but the glass substrate can be peeled from the glass base.
×:玻璃基板破裂、或無法從玻璃基座剝離玻璃基板之情形。 ×: The glass substrate is cracked or the glass substrate cannot be peeled from the glass base.
如第1圖所示,於2片之表玻璃1a、1b(寬度26mm及長度76mm)中,將1片之表玻璃1a固定於基座2。固定係以固定具3握持表玻璃1a之兩端部。於表玻璃1a,將另1片之表玻璃1b於50℃環境中隔著感溫性黏著片4呈十字狀固定,靜置20分鐘。其後,升溫至200℃後靜置20分鐘。然後,冷卻至5℃靜置5分鐘後,在5℃環境中拿起表玻璃1b,測定表玻璃1b從表玻璃1a剝離時之剝離強度。將其結果表示於表2中之「5℃剝離強度」之欄。 As shown in FIG. 1, among the two pieces of watch glass 1 a and 1 b (26 mm in width and 76 mm in length), one piece of watch glass 1 a is fixed to the base 2. The fixing system holds both ends of the watch glass 1 a with the fixture 3. On the watch glass 1a, the other watch glass 1b was fixed in a cross shape through a thermosensitive adhesive sheet 4 in a 50 ° C environment, and left for 20 minutes. Then, it heated up to 200 degreeC, and left it still for 20 minutes. After cooling to 5 ° C for 5 minutes, the watch glass 1b was picked up in a 5 ° C environment, and the peel strength when the watch glass 1b was peeled from the watch glass 1a was measured. The results are shown in the "5 ° C peel strength" column in Table 2.
從表2明顯可知,含有第2側鏈結晶性聚合 物之實施例1至7的感溫性黏著片之任一者均具有良好的耐熱性及剝離性。進一步,曝露於5℃之環境下時,任一者之剝離強度均低至10N/676mm2以下(亦即,黏著力降低)。亦即,若使用本實施形態之感溫性黏著劑(感溫性黏著片),即使在高溫環境下,亦可固定玻璃基板,且從高溫環境下冷卻而曝露於低溫環境下時,已固定之玻璃基板可毫無問題地剝離。另一方面,不含第2側鏈結晶性聚合物之比較例1中,係剝離性差,實用上無法承受。 As apparent from Table 2, any of the temperature-sensitive adhesive sheets of Examples 1 to 7 containing the second side chain crystalline polymer had good heat resistance and peelability. Furthermore, when exposed to an environment at 5 ° C, the peel strength of any one was as low as 10 N / 676 mm 2 or less (that is, the adhesive force was reduced). That is, if the temperature-sensitive adhesive (temperature-sensitive adhesive sheet) of this embodiment is used, the glass substrate can be fixed even in a high-temperature environment, and when it is cooled from the high-temperature environment and exposed to a low-temperature environment, it is fixed. The glass substrate can be peeled off without any problem. On the other hand, in Comparative Example 1 which did not include the second side chain crystalline polymer, the peelability was poor, and it was practically unbearable.
在實施例6中,除了使用軟化點為120至130℃之「Super esterA-125」(荒川化學工業(股)製)取代Super esterA-100以外,以與實施例6同樣之順序調製塗布液,得到感溫性黏著片。以與實施例1同樣之順序測定所得之薄片的剝離強度的結果,為6.0N/676mm2。 In Example 6, except that "Super esterA-125" (made by Arakawa Chemical Industries, Ltd.) with a softening point of 120 to 130 ° C was used instead of Super esterA-100, the coating liquid was prepared in the same procedure as in Example 6, A thermosensitive adhesive sheet was obtained. When the peel strength of the obtained sheet was measured in the same procedure as in Example 1, it was 6.0 N / 676 mm 2 .
因此,從剝離強度之測定值,可知若使用 本實施形態之感溫性黏著劑(感溫性黏著片),從高溫環境下冷卻而曝露於低溫環境下時,已固定之玻璃基板可毫無問題地剝離。 Therefore, from the measured values of peel strength, it can be seen that if used When the temperature-sensitive adhesive (temperature-sensitive adhesive sheet) of this embodiment is cooled from a high-temperature environment and exposed to a low-temperature environment, the fixed glass substrate can be peeled off without any problem.
將表3所示之單體以表3所示之比率加入反應容器中,以與合成例1之相同方法使單體共聚合,得到第1側 鏈結晶性聚合物。所得之第1側鏈結晶性聚合物之重量平均分子量為550000,融點為25℃。 The monomers shown in Table 3 were added to the reaction vessel at the ratios shown in Table 3. The monomers were copolymerized in the same manner as in Synthesis Example 1 to obtain the first side. Chain crystalline polymer. The weight average molecular weight of the obtained first side chain crystalline polymer was 550,000, and the melting point was 25 ° C.
除了以表4所示之比率使用表4所示之成分以外,以與實施例1之相同順序調製塗布液,得到感溫性黏著片。 增黏劑係使用軟化點為95至105℃之荒川化學工業(股)製之「Super esterA-100」。 A coating liquid was prepared in the same procedure as in Example 1 except that the components shown in Table 4 were used at the ratios shown in Table 4 to obtain a thermosensitive adhesive sheet. The thickener is "Super ester A-100" manufactured by Arakawa Chemical Industries, Ltd. with a softening point of 95 to 105 ° C.
對於所得之感溫性黏著片,以與實施例1 之相同方法評價(1)耐熱性、(2)剝離性及(3)剝離強度。將結果表示於表4中。 The obtained thermosensitive adhesive sheet was the same as in Example 1 The same method was used to evaluate (1) heat resistance, (2) peelability, and (3) peel strength. The results are shown in Table 4.
從表4明顯可知,實施例9之感溫性黏著片 係具有良好的耐熱性及剝離性。進一步,可知曝露於5℃ 之環境下時,剝離強度低至10N/676mm2以下(亦即,黏著力降低)。 As apparent from Table 4, the temperature-sensitive adhesive sheet system of Example 9 has good heat resistance and peelability. Furthermore, it was found that when exposed to an environment at 5 ° C, the peel strength was as low as 10 N / 676 mm 2 or less (that is, the adhesive force was reduced).
除了以表5所示之比率將表5所示之單體加入反應容器中,使鏈轉移劑之十二烷基硫醇之添加量設為以下所示之比率以外,以與合成例2之相同方法使單體共聚合,得到第2側鏈結晶性聚合物。將所得之第2側鏈結晶性聚合物之重量平均分子量及融點呈示於表5。又,為了比較,將上述之合成例2亦表示於表5中。 The monomer shown in Table 5 was added to the reaction vessel at the ratio shown in Table 5, and the addition amount of dodecyl mercaptan of the chain transfer agent was set to the ratio shown below. A monomer was copolymerized in the same manner to obtain a second side chain crystalline polymer. Table 5 shows the weight average molecular weight and melting point of the obtained second side chain crystalline polymer. For comparison, Table 2 also shows Synthesis Example 2 described above.
合成例4:15.0重量份 Synthesis Example 4: 15.0 parts by weight
合成例5:3.0重量份 Synthesis Example 5: 3.0 parts by weight
合成例6:0.5重量份 Synthesis Example 6: 0.5 part by weight
合成例7:0.2重量份 Synthesis Example 7: 0.2 parts by weight
除了以表6所示之比率使用表6所示之成分以外,以與實施例1之相同順序調製塗布液,得到感溫性黏著片。 增黏劑係使用軟化點為95至105℃之荒川化學工業(股)製之「Super esterA-100」。 A coating liquid was prepared in the same procedure as in Example 1 except that the components shown in Table 6 were used at the ratios shown in Table 6 to obtain a thermosensitive adhesive sheet. The thickener is "Super ester A-100" manufactured by Arakawa Chemical Industries, Ltd. with a softening point of 95 to 105 ° C.
對於所得之感溫性黏著片,以與實施例1 之相同方法評價(1)耐熱性、(2)剝離性及(3)剝離強度。將結果表示於表6中。又,為了比較,上述之實施例6亦表示於表6中。 The obtained thermosensitive adhesive sheet was the same as in Example 1 The same method was used to evaluate (1) heat resistance, (2) peelability, and (3) peel strength. The results are shown in Table 6. For comparison, Example 6 described above is also shown in Table 6.
從表5及表6明顯可知,第2側鏈結晶性聚 合物具有4000至40000之重量平均分子量時,具有特別良好之剝離性。 As is clear from Tables 5 and 6, the second side chain is crystalline. When the compound has a weight average molecular weight of 4,000 to 40,000, it has particularly good peelability.
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| JP2017179004A (en) * | 2016-03-28 | 2017-10-05 | ニッタ株式会社 | Temperature-sensitive adhesive |
| JP6792509B2 (en) * | 2017-04-21 | 2020-11-25 | ニッタ株式会社 | Temperature sensitive adhesive |
| CN108559425B (en) * | 2018-05-11 | 2020-01-17 | 华南协同创新研究院 | Solvent-free adhesive for preventing warpage of FDM printing device, printing platform and manufacturing method thereof |
| JP7449138B2 (en) * | 2019-03-28 | 2024-03-13 | 積水化学工業株式会社 | Pressure sensitive adhesive composition and adhesive tape |
| KR20220075328A (en) * | 2019-09-30 | 2022-06-08 | 니타 가부시키가이샤 | Additives for dimming film and temperature-sensitive dimming film |
| CN116355559A (en) * | 2021-12-28 | 2023-06-30 | 南京清尚新材料科技有限公司 | Pressure-sensitive adhesive and adhesive sheet for low-temperature release and method for producing the same |
| TWI834405B (en) * | 2022-12-01 | 2024-03-01 | 財團法人工業技術研究院 | Double-sided adhesive and multilayer structure |
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| JPH04507425A (en) * | 1989-05-11 | 1992-12-24 | ランデック コーポレイション | temperature activated adhesive assembly |
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| JPH09249860A (en) * | 1996-03-14 | 1997-09-22 | Nitta Ind Corp | Surface protector for semiconductor wafers |
| JP2000234079A (en) * | 1999-02-15 | 2000-08-29 | Nitta Ind Corp | Sheet for processing semiconductor wafer |
| JP2000355684A (en) * | 1999-06-15 | 2000-12-26 | Nitta Ind Corp | Pressure-sensive adhesive tape for temporarily fixing part |
| JP5600604B2 (en) * | 2009-02-16 | 2014-10-01 | ニッタ株式会社 | Temperature-sensitive adhesive for flat panel display manufacturing and temperature-sensitive adhesive tape for flat panel display manufacturing |
| JP5408774B2 (en) * | 2009-04-24 | 2014-02-05 | ニッタ株式会社 | Temperature-sensitive adhesive and temperature-sensitive adhesive tape |
| JP5486900B2 (en) | 2009-11-06 | 2014-05-07 | ニッタ株式会社 | Temperature sensitive adhesive |
| JP5639438B2 (en) | 2010-10-20 | 2014-12-10 | ニッタ株式会社 | Temperature sensitive adhesive |
| JP5639446B2 (en) * | 2010-11-09 | 2014-12-10 | ニッタ株式会社 | Easy peelable adhesive sheet and easy peelable adhesive tape |
| JP6116368B2 (en) * | 2013-05-24 | 2017-04-19 | ニッタ株式会社 | Temperature sensitive adhesive |
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| JPH04507425A (en) * | 1989-05-11 | 1992-12-24 | ランデック コーポレイション | temperature activated adhesive assembly |
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| CN106133102A (en) | 2016-11-16 |
| WO2015146410A1 (en) | 2015-10-01 |
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| KR20160137994A (en) | 2016-12-02 |
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