TWI655890B - Fixture for electroplating or electroless plating process and machine - Google Patents

Abstract

A fixture for an electroplating or electroless plating process includes: a carrier; and a carrier protective layer, which is disposed on the carrier during the electroplating or electroless plating process, and has a recess formed to carry a Substrate to be plated; an upper cover protection layer, which is combined with the carrier protection layer to hold the substrate to be plated during the electroplating or electroless plating process, thereby the upper cover protects and laminates a ring shape on a surface of the substrate to be plated An edge area; and an upper cover, which is combined with the carrier during the electroplating or electroless plating process to fix the carrier protective layer and the upper cover protective layer.

Description

Jig for electroplating or electroless plating process and its machine

The invention relates to a jig for electroplating or electroless plating process and a machine using the same, and particularly relates to a jig for electroplating or electroless plating process and a machine using the same. The substrate to be plated The areas that come into contact with the processing solution of the electroplating or electroless plating process will only be in the areas to be plated.

In the metallization process of solar cells, the front and back electrodes are usually printed by screen printing, and high temperature sintering is used to form the front and back metal contacts. However, the material cost of traditional screen printing metal paste is too high. Recently, the industry expects to replace it with electroplated metal electrode technology, but electroplating technology requires a seed layer to provide electrons with an external bias voltage, usually based on physical vapor deposition (PVD) such as sputtering or vapor deposition. The seed layer is grown by methods such as plating and then combined with electroplating technology to form metallized electrodes. However, the cost of vacuum equipment is relatively high.

Therefore, using electroless plating technology instead of screen printing or physical vapor deposition (PVD) technology, the first metal seed layer can be deposited on the front and back of the battery, and then directly contact plating or forward bias The method of pressure plating completes the front and back multilayer metallization process. However, if the metal electrode of a solar cell is made by electroplating or electroless plating, the cell contacts the area of the electroplated or electroless chemical solution, and the entire area will be covered with a metal plating layer. Prevent the edges of the cell from being plated with metal. Due to the effect of the edge metal effect, a short circuit phenomenon will be formed on the front and back sides of the battery sheet, resulting in low battery efficiency.

Therefore, there is a need for a jig and a machine thereof for an electroplating or electroless plating process, which can overcome the above problems.

An object of the present invention is to provide a jig for use in an electroplating or electroless plating process and a machine thereof. The area where the substrate to be plated contacts the processing solution of the electroplating or electroless plating process is only in the area to be plated.

According to the above object, the present invention provides a jig for an electroplating or electroless plating process, including: a carrier; and a carrier protective layer, which is placed on the carrier during the electroplating or electroless plating process and formed. There is a recess, which is used to carry a substrate to be plated; an upper cover protection layer is combined with the carrier protection layer to hold the substrate to be plated when the electroplating or electroless plating process is performed, thereby the upper cover is protected and laminated An annular edge region on one surface of the substrate to be plated; and an upper cover, which is combined with the carrier during the electroplating or electroless plating process to fix the carrier protection layer and the upper cover protection layer.

According to the jig for electroplating or electroless plating process according to the present invention, if a metal electrode of a solar cell is produced by electroplating or electroless plating technology, a single cell (that is, a substrate to be plated) contacts the electroplating or electroless plating process. The liquid area will only be in the area to be plated. Since the edges of the single-cell battery and the other side of the surface to be plated are not plated with metal, it will not cause short-circuits on the front and back of the battery, resulting in low battery efficiency.

1‧‧‧ jig

1’‧‧‧Jig

1 ”‧‧‧Jig

1 '' '‧‧‧Jig

10‧‧‧Substrate to be plated

10a‧‧‧First substrate to be plated

10b‧‧‧Second substrate to be plated

101‧‧‧ surface

101a‧‧‧ surface

101b‧‧‧ surface

1011‧‧‧Circular edge area

1011a‧‧‧Circular edge area

1011b‧‧‧Circular edge area

1012‧‧‧ Area to be plated

1012a‧‧‧ Area to be plated

1012b‧‧‧ Area to be plated

11‧‧‧ carrier

111‧‧‧Perforated carrier

112‧‧‧ Front

113‧‧‧ back

12‧‧‧ carrier protection layer

12a‧‧‧First carrier protection layer

12b‧‧‧Second carrier protection layer

121‧‧‧ recess

121a‧‧‧Concave

121b‧‧‧Concave

122‧‧‧ Perforation of carrier protection layer

122a‧‧‧Perforated protective cover

122b‧‧‧Perforated protective cover

13‧‧‧ Cover protection

13a‧‧‧First cover

13b‧‧‧Second top cover protective layer

131‧‧‧ raised

131a‧‧‧ raised

131b‧‧‧ raised

132‧‧‧ Perforated protective cover

132a‧‧‧ Perforated protective cover

132b‧‧‧ Perforated protective cover

14‧‧‧ Upper cover

14a‧‧‧First cover

14b‧‧‧Second top cover

141‧‧‧ Perforation of the first upper cover

141a‧‧‧perforation of the first cover

141b‧‧‧ Perforated first cover

142‧‧‧ Perforated second upper cover

142a‧‧‧ Perforation of the second upper cover

142b‧‧‧ Perforation of the second upper cover

15‧‧‧Screw

15a‧‧‧screw

15b‧‧‧screw

151‧‧‧ shaft area

152‧‧‧Nut area

16‧‧‧ conductive structure

16a‧‧‧First conductive structure

16b‧‧‧Second conductive structure

2‧‧‧machine

2’‧‧‧machine

2 ”‧‧‧machine

20‧‧‧Substrate to be plated

20’‧‧‧Substrate to be plated

201‧‧‧ surface

2012‧‧‧Area to be plated

21‧‧‧The first jig

21’‧‧‧Second Jig

22‧‧‧ trough

23‧‧‧treatment fluid

24‧‧‧ Bracket

241‧‧‧Rotate

FIG. 1a is a schematic plan view of a jig for an electroless plating process according to a first embodiment of the present invention.

FIG. 1b is a schematic sectional view of the assembly of the jig used for the electroless plating process along the section line 1b-1b of FIG. 1a.

FIG. 1c is a schematic sectional view of the assembly of the jig used for the electroless plating process along the section line 1c-1c of FIG. 1a.

2 is a schematic exploded cross-sectional view of a jig for an electroless plating process according to a first embodiment of the present invention.

FIG. 3 is a schematic plan view of a jig for an electroless plating process according to another embodiment of the present invention.

4 is a schematic cross-sectional view of a jig for a plating process according to a first embodiment of the present invention.

FIG. 5a and FIG. 5b are schematic sectional views of a combination of a jig for an electroless plating process according to a second embodiment of the present invention.

FIG. 6 is a schematic cross-sectional view of a jig for a plating process according to a second embodiment of the present invention.

FIG. 7 is a schematic cross-sectional view of a machine for a plating or electroless plating process according to a first embodiment of the present invention.

FIG. 8 is a partial perspective view of a machine for a plating or electroless plating process according to the first embodiment of the present invention.

FIG. 9 is a partial perspective view of a machine for a plating or electroless plating process according to a second embodiment of the present invention.

FIG. 10 is a partial perspective view of a machine for a plating or electroless plating process according to a third embodiment of the present invention.

In order to make the foregoing objects, features, and characteristics of the present invention more comprehensible, the related embodiments of the present invention are described in detail below with reference to the drawings.

FIG. 1a is a schematic plan view of a jig for an electroless plating process according to a first embodiment of the present invention. FIG. 1b is a schematic sectional view of the assembly of the jig used for the electroless plating process along the section line 1b-1b of FIG. 1a. The jig 1 for the electroless plating process of the present embodiment is an electrode metallization process applied to a single solar cell. Please refer to FIG. 1 a and FIG. 1 b. The jig 1 used for the electroless plating process includes a carrier 11, a carrier protective layer 12, a cover protective layer 13 and a cover 14. The carrier protection layer 12 is disposed on a front surface 112 of the carrier 11 during the electroless plating process, and a recess 121 is formed to carry a substrate 10 (such as a solar cell) to be plated.该 上盖 The cover The protective layer 13 is combined with the carrier protective layer 12 to hold the substrate 10 to be plated during the electroless plating process, whereby the cover protective layer 13 is pressed against the annular edge region 1011 of one surface 101 of the substrate 10 to be plated. (The annular edge region 1011 surrounds the region 1012 to be plated on the surface 101). In particular, the top cover protective layer 13 and the ring-shaped edge region 1011 are completely in contact with each other without leaking liquid. The upper cover 14 is combined with the carrier 11 during the electroless plating process to fix the carrier protection layer 12 and the upper cover protection layer 13. The carrier 11 and the upper cover 14 can be made of a heat-resistant / acid-resistant hard insulating material, such as glass fiber, heat-resistant plastic, or Teflon. The carrier protection layer 12 and the cover protection layer 13 may be made of a heat-resistant / acid-resistant soft insulating material, such as silicon rubber or rubber.

The electroless plating process can generally be called Autocatalytic Plating. First, a catalytic surface is formed on the surface of the work, or the catalytic action of the surface of the work is used to chemically reduce the metal ions into a metal state. Precipitation. First, hypophosphite (reducing agent) is oxidized to phosphite ions. The released charge can reduce metal ions (such as nickel ions). Metals (such as nickel) are deposited on the catalytically active surface, and the precipitated metal (For example, nickel), and the catalytic reaction continues to proceed, so the precipitation reaction proceeds in a chain, the plating layer has a layered structure, and the thickness can be arbitrarily controlled.

FIG. 1c is a schematic sectional view of the assembly of the jig used for the electroless plating process along the section line 1c-1c of FIG. 1a. 1c, the upper cover 14 includes a plurality of first upper cover perforations 141, the upper cover protective layer 13 includes a plurality of raised portions 131, and the raised portions 131 pass through when the upper cover 14 is combined with the upper protective layer 13 respectively. The first upper covers are exposed through the through holes 141. The raised portions 131 can avoid the problem that the carrier protection layer 12 and the upper cover protection layer 13 are not easily separated after being closely combined, and the solar cell chip can be easily taken out.

2 is a schematic exploded cross-sectional view of a jig for an electroless plating process according to a first embodiment of the present invention. Please refer to FIG. 2, the upper cover 14 further includes a plurality of second upper cover perforations 142, and the combination of the upper cover 14 and the carrier 11 is to pass a plurality of screws 15 through the second upper cover perforations 142 to lock the load. Block 11. The carrier 11 includes a plurality of carrier perforations 111, the carrier protection layer 12 includes a plurality of carrier protection layer perforations 122, and the cover protection layer 13 includes a plurality of cover protection layer perforations 132. The holes 111, the carrier protective layer perforations 122, the upper cover protective layer perforations 132, and the second upper cover perforations 142 are sequentially correspondingly passed by the screws 15 respectively, and each of the carrier protective layer perforations 122 The aperture diameter (for example, aperture 7mm) and the aperture diameter (for example, aperture 7mm) of each of the cover protective layer perforations 132 are larger than the corresponding aperture diameter (for example, aperture 5mm) of the carrier perforation 111 and the aperture diameter (for example, aperture 5 of the second upper cover) For example, the diameter is 5 mm), thereby preventing the carrier protection layer 12 and the upper cover protection layer 13 from being raised or warped during the fixture locking process, which causes the problem of liquid leakage during the electroless plating process. The hole diameter of the second upper cover perforation 142 particularly refers to the diameter of the shaft region 151 corresponding to the screw 15, rather than the diameter of the nut region 152 of the screw 15.

Please refer to FIG. 1a again. In this embodiment, the upper cover 14 has a ring shape, the first upper cover perforations 141 and the second upper cover perforations 142 are alternately arranged along a circular path with each other, and the first The upper cover perforations 141 are provided at four corners. The design of the first upper cover perforations 141 and the second upper cover perforations 142 with the protrusions 131 and the screws 15 can produce uniform positioning and locking effects. Please refer to FIG. 3. In another embodiment, the first upper cover perforations 141 and the second upper cover perforations 142 are also alternately arranged along a circular path, but the second upper cover perforations 142 are disposed at four corners. . The design of the first upper cover perforations 141 and the second upper cover perforations 142 in combination with the protrusions 131 and the screws 15 can also produce uniform positioning and locking effects.

4 is a schematic cross-sectional view of a jig for a plating process according to a first embodiment of the present invention. The jig 1 'used in the electroplating process of the present embodiment is an electrode metallization process applied to a single solar cell. The jig '1 for the electroplating process of the first embodiment is substantially similar to the jig 1 for the electroless plating process of the first embodiment. Similar components are marked with similar reference numerals, and the difference lies in the use of the first embodiment. The jig 1 ′ in the electroplating process further includes a conductive structure 16, which is disposed in the carrier 11 and passes through the carrier protective layer 13 to electrically contact the substrate 10 to be plated. The conductive structure 16 is further electrically connected to a negative electrode (not shown) of an external power source.

According to the jig for electroplating or electroless plating process of the present invention, if metal electrodes for solar cells are produced by electroplating or electroless plating, The area where the substrate to be plated comes into contact with the processing solution of the electroplating or electroless plating process is only in the area to be plated. Since the edges of the single-cell battery and the other side of the surface to be plated are not plated with metal, it will not cause short-circuits on the front and back of the battery, resulting in low battery efficiency.

FIG. 5a and FIG. 5b are schematic sectional views of a combination of a jig for an electroless plating process according to a second embodiment of the present invention. The jig 1 "for the electroless plating process of the second embodiment is substantially similar to the jig 1 for the electroless plating process of the first embodiment. Similar components are denoted by similar reference numerals, and the difference lies in the second embodiment. The jig 1 ”for electroless plating process is an electrode metallization process applied to a two-piece solar cell. Please refer to Fig. 5a and Fig. 5b. The jig 1 "for electroless plating process includes: a carrier 11, a first and a second carrier protective layer 12a, 12b, a first and a second cover protection Layers 13a, 13b, and a first and a second upper cover 14a, 14b. The first and the second carrier protection layers 12a, 12b are respectively disposed on the front surface 112 of the carrier 11 in the electroless plating process. And a back surface 113, and respectively formed with a first and a second recessed portion 121a, 121b, the first and the second recessed portions 121a, 121b are used to carry a first and a substrate to be plated 10a, 10b. And the second upper cover protection layers 13a, 13b are combined with the first and the second carrier protection layers 11a, 11b respectively during the electroless plating process to hold the first and the second substrates 10a to be plated, respectively And 10b, whereby the first and second overlying protective layers 13a and 13b are respectively pressed against the annular edge region 1011a of one surface 101a of the first substrate to be plated 10a and the surface 101b of the second substrate 10b to be plated. An annular edge region 1011b (the annular edge regions 1011a, 1011b surround the to-be-plated regions 1012a, 1012b of the surfaces 101a, 101b). In particular, the first and the second upper cover protective layers 13a, 13b and the ring-shaped edge regions 1011a, 1011b are completely tight and leak-proof.

The first upper cover 14a is combined with the carrier 11 during the electroless plating process to fix the first carrier protection layer 12a and the first upper cover protection layer 13a. The second upper cover 14b is combined with the carrier 11 during the electroless plating process to fix the second carrier protection layer 12b and the second upper cover protection layer 13b. The carrier 11 and the first and second upper covers 14a and 14b may be made of a heat-resistant / acid-resistant hard insulating material, such as glass Fiber, heat-resistant plastic, etc., or Teflon. The first and the second carrier protection layers 12a, 12b and the first and the second upper cover protection layers 13a, 13b may be made of a heat-resistant / acid-resistant soft insulating material, such as silicon rubber or rubber.

In the second embodiment, the jig 1 "for an electroless plating process also includes a plurality of screws 15a, 15b (which is similar to the screw 15 of FIG. 1b), and the first and second upper covers 14a, 14b also include The plurality of first upper cover perforations 141a, 141b (similar to the first upper cover perforation 141 of FIG. 1b), and the first and the second upper cover protective layers 13a, 13b also include a plurality of protrusions 131a, 131b (similar to FIG. 1b's raised portion 131). The first and second upper covers 14a, 14b also include a plurality of second upper cover perforations 142a, 142b (similar to the second upper cover perforations 142 of FIG. 2). The carrier 11 also includes Multiple carrier perforations 111a, 111b (similar to carrier perforations 111 of FIG. 2), the first and second carrier protective layers 12a, 12b also include multiple carrier perforations 122a, 122b (similar to the figure) 1b's carrier protection layer perforation 122), and the first and second cover protection layers 13a, 13b also include a plurality of cover protection layer perforations 132a, 132b (similar to the cover protection layer perforation 132 of FIG. 1b). Second Examples of the screw, the perforation of the first cover, the protrusion, the perforation of the second cover, the perforation of the carrier, the perforation of the carrier protective layer, and the perforation of the upper protective layer The functions of the screws, the perforation of the first upper cover, the protrusions, the perforation of the second upper cover, the perforation of the carrier, the perforation of the carrier protective layer, and the perforation of the upper cover are similar to the functions of the first embodiment, and need not be described in detail.

FIG. 6 is a schematic cross-sectional view of a jig for a plating process according to a second embodiment of the present invention. The jig 1 '' 'used in the electroplating process of the present embodiment is an electrode metallization process applied to a two-piece solar cell. The jig used for the electroplating process of the second embodiment is substantially similar to the jig 1 ”used for the electroless plating process of the second embodiment. Similar components are labeled with similar reference numerals, and the difference lies in the use of the second embodiment. The jig 1 '' 'for the electroplating process further includes a first and a second conductive structure 16a, 16b, which are disposed in the carrier 11 and pass through the first and the second carrier protection layers 12a and 12b, respectively. The first and second substrates 10a and 10b are electrically contacted. The first and the second conductive structures 16a and 16b are respectively electrically connected to a negative electrode (not shown) of an external power source.

According to the invention, the jig used for electroplating or electroless plating process, if When electroplating or electroless plating is used to make metal electrodes for solar cells, the area where any one of the two battery cells (that is, the first and second substrates to be plated) comes into contact with the processing solution of the electroplating or electroless plating process is only in the area to be plated . Since the edge of any one of the two-cell battery and the other side of the surface to be plated will not be plated with metal, it will not cause a short circuit between the front and back of the battery, resulting in low battery efficiency.

FIG. 7 is a schematic cross-sectional view of a machine for a plating or electroless plating process according to a first embodiment of the present invention. FIG. 8 is a partial perspective view of a machine for a plating or electroless plating process according to the first embodiment of the present invention. Please refer to FIG. 7 and FIG. 8. The machine 2 used for the electroplating or electroless plating process includes a tank 22 and a first jig 21. The tank 22 is used for containing a processing solution 23 in one of the electroplating or electroless plating processes. The first jig 21 may be a jig 1 for an electroless plating process according to the present invention, a jig 1 for electroplating, a jig 1 for electroless plating, or a jig 1 for electroplating. ', The first jig 21 is used to immerse the at least one substrate 20 to be plated in the processing liquid 23 contained in the tank body 22. In this embodiment, the first jig 21 is used for The jig 1 "of the electroplating process is taken as an example for illustration, as shown in FIG. 7. The machine 2 for the electroplating or electroless plating process further includes a bracket 24 connected to the first jig 21. The bracket 24 is used for driving the first jig 21 to move in the processing liquid 23, such as rotating or linearly moving.

When the electroplating process is performed, the processing solution 23 of the electroplating process may be a plating solution (providing metal ions) for forming a metal layer on a surface 201 of a surface 201 of the substrate 20 to be plated by electroplating. When the electroless plating process is carried out, according to different stages, the treatment liquid 23 of the electroless plating process may be a sensitizing solution, an activating solution, or an electroless plating solution (providing ions to be plated with metal) to apply a metal layer. An electroless plating method is formed on a region to be plated 2012 of one surface 201 of the substrate 20 to be plated.

FIG. 9 is a partial perspective view of a machine for a plating or electroless plating process according to a second embodiment of the present invention. Please refer to FIG. 9 and FIG. 7. The machine 2 ′ for the electroplating or electroless plating process of the second embodiment is substantially similar to the machine 2 for the electroplating or electroless plating process of the second embodiment. Similar components are marked. Similar reference numerals differ in that the machine 2 'used for the electroplating or electroless plating process in the second embodiment further includes at least a second jig 21', and the second jig 21 'can be used in the present invention. Treatment of electroless plating process Jig 1, jig 1 'for electroplating, jig 1 "for electroless plating, or jig 1'" for electroplating, the at least one second jig 21 'is also used to place at least one The plated substrate 20 'is immersed in the processing liquid 23 accommodated in the tank body 22, and the bracket 24 is also connected to the second jig 21'. The bracket 24 is used for the first jig 21 and the at least one first The two jigs 21 'move in the processing liquid 23, such as a rotational movement 241. The first jig 21 and the at least one second jig 21' have their normal directions perpendicular to the tangent direction of the rotational movement 241. The arrangement is especially suitable for the system of vertical plating solution circulation, for example, in the case of the plating solution tank, the spraying holes of the plating solution are sprayed from the bottom to the top. The machine 2 'for the plating or electroless plating process can be added more Cells are plated or electroless-plated at the same time to increase production capacity.

FIG. 10 is a partial perspective view of a machine for a plating or electroless plating process according to a third embodiment of the present invention. Please refer to FIG. 10. The machine 2 ′ used for the electroplating or electroless plating process of the third embodiment is substantially similar to the machine 2 ′ used for the electroplating or electroless plating process of the second embodiment. The difference is that the first jig 21 and the at least one second jig 21 'of the machine 2 "for the electroplating or electroless plating process of the third embodiment are moved in parallel with the direction of the normal line 241 is arranged in a tangential direction, and is particularly suitable for two systems including a horizontal plating liquid circulation or a vertical plating liquid circulation system. For example, in a plating solution tank, the plating solution spray holes are sprayed from one side to the opposite side. Or, in the plating solution tank, the plating solution spray holes are sprayed from bottom to top. This machine 2 "for electroplating or electroless plating process can add more battery cells to perform electroplating or electroless plating process at the same time to increase production capacity.

In summary, it is only a description of the preferred implementations or examples of the technical means adopted by the present invention to solve the problem, and is not intended to limit the scope of patent implementation of the present invention. That is, all changes and modifications that are consistent with the meaning of the scope of patent application of the present invention, or made according to the scope of patent of the present invention, are covered by the scope of patent of the present invention.

Claims (8)

A jig for electroplating or electroless plating process includes: a carrier; a carrier protective layer, and is disposed on the carrier during the electroplating or electroless plating process, and a recess is formed, and the recess is used for carrying A substrate to be plated; a cover protection layer, which is combined with the carrier protection layer to hold the substrate to be plated during the electroplating or electroless plating process, whereby the cover protects and laminates a surface of the substrate to be plated An annular edge area; and an upper cover, which is combined with the carrier during the electroplating or electroless plating process to fix the carrier protective layer and the upper cover protective layer; wherein the upper cover includes a plurality of first upper cover perforations, and the upper cover protective layer It includes a plurality of raised portions, which are exposed through the perforations of the first upper covers when the upper cover is combined with the upper cover protective layer, respectively. The upper cover further includes a plurality of second upper cover perforations, the upper cover and the carrier. The combination of the seats is to lock the carrier with a plurality of screws passing through the second upper cover perforations respectively; and the carrier includes a plurality of carrier perforations, and the carrier protection layer includes a plurality of carrier protection layer perforations , That cover The layer includes a plurality of perforations of the protective cover, the perforations of the carrier, the perforations of the protective cover of the carrier, the perforations of the protective cover of the cover, and the perforations of the second upper cover, respectively, for the screws to pass through. The holes of the carrier protection layer perforations and the holes of each of the upper cover protection layers are larger than the corresponding holes of the carrier. According to the fixture for electroplating or electroless plating process described in item 1 of the scope of patent application, the apertures of the perforations of each of the carrier protection layers and the perforations of each of the overlying protective layers are larger than their corresponding ones and the second The perforation of the lid. According to the jig for electroplating or electroless plating process described in item 1 of the scope of patent application, the first upper cover perforations and the second upper cover perforations are alternately arranged along a circular path with each other. A jig for electroplating or electroless plating process includes: a carrier; a first and a second carrier protective layer are respectively disposed on a front surface of the carrier and a carrier during the electroplating or electroless plating process; A first and a second recess are formed on the back surface, respectively, the first and the second recess are used to carry a first and a second substrate to be plated; a first and a second overlying protective layer, When the electroplating or electroless plating process is performed, it is combined with the first and the second carrier protection layers to hold the first substrate to be plated and the second substrate to be plated respectively, thereby the first and the second cover The protective layer is respectively pressed against the annular edge region of one surface of the first substrate to be plated and the annular edge region of one surface of the second substrate to be plated; a first upper cover is connected with the carrier during the electroplating or electroless plating process. The base is combined to fix the first carrier protection layer and the first upper cover protection layer; and a second upper cover is combined with the carrier to fix the second carrier protection layer and the second cover during the electroplating or electroless plating process. Cover protection layer; wherein: the first and the second cover Including a plurality of perforations of the first cover, the first and the second cover protection layers include a plurality of protrusions, and the protrusions are combined with the first and the second cover protection layers at the first and the second cover. Through the perforations of the first upper lids and exposed at the same time; the first and the second upper lids further include a plurality of perforations of the second upper lids, and the combination of the first and the second upper lids and the carrier is more Screws pass through the second upper cover perforations to lock into the carrier; and the carrier includes a plurality of carrier perforations, the first and second carrier protection layers include a plurality of carrier protection layer perforations, the The first and the second cover protection layers include a plurality of cover protection layer perforations, the carrier seat perforations, the carrier protection layer perforations, the cover protection layer perforations, and the second cover cover perforations in order. The screws pass through, and the apertures of each of the carrier protective layer perforations and each of the upper cover protective layer perforations are larger than the corresponding apertures of the carrier and second cover perforations. A machine for an electroplating or electroless plating process, comprising: a tank body for containing a treatment liquid of the electroplating or electroless plating process; and a first jig, which is one of items 1 to 4 of the scope of patent application The jig for electroplating or electroless plating process according to one item is used for immersing the at least one substrate to be plated in the processing liquid contained in the tank. The machine for the electroplating or electroless plating process described in item 5 of the scope of patent application, further comprising: a bracket, the bracket is connected to the first jig, and is used for driving the first jig in the processing liquid. mobile. The machine used in the electroplating or electroless plating process as described in item 6 of the scope of patent application, further comprising: at least a second jig, which is used for one of the items 1 to 4 of the scope of patent application An electroplated or electroless plated jig, and the bracket is connected to the second jig. According to the apparatus for electroplating or electroless plating process described in item 7 of the scope of patent application, wherein the bracket is used to rotate the first jig and the at least second jig in the processing liquid.