TWI654920B - Liquid immersion cooling system - Google Patents

Abstract

An immersion cooling system includes a carrier tray, a motherboard, a liquid barrier, and a cooling assembly. The motherboard includes a substrate and a heat generating component. The substrate is stacked on the carrier. The heating element is electrically disposed on the substrate. The liquid barrier cover is stacked on the substrate and covers the heat generating component to form a liquid storage space together with the substrate. The liquid storage space is for accommodating a coolant. The cooling assembly is located in the reservoir space and is in thermal contact with the heating element.

Description

Immersion cooling system

This invention relates to a cooling system, and more particularly to a miniaturized immersion cooling system for use in the field of servers.

In the existing server-specific immersion cooling system, most of the building ice water is led to the cooling tank of the system, and the heat dissipation row installed inside the cooling tank can be used to reduce the temperature of the high temperature liquid or vapor in the cooling tank. However, in order to reduce the heat dissipation power required for heating per unit of servo, the current cooling tank capacity is mostly the cabinet size. That is to say, a large cooling system is used to cool multiple servers in order to reduce the average heat dissipation power of individual servers.

The existing large-scale immersion cooling system is required to introduce ice water into the building. If the user's machine room is not easy to introduce ice water into the building, the user's interest in using the immersion cooling system of the building's ice water will be reduced. If a small number of servers are built into the same capacity cooling slot, the average heat dissipation power of a single server will be higher than the full load of the server. Therefore, users with a small number of servers or who cannot introduce building ice water into the equipment room cannot use it. In this way, how to cool down the individual servers without reliance on the ice water of the building and the immersion cooling method will be one of the problems that the R&D personnel have to solve.

SUMMARY OF THE INVENTION The present invention is directed to an immersion cooling system in which individual servers are capable of cooling individual servers without relying on building ice water or by immersion cooling by independently storing coolant in a single server.

An immersion cooling system disclosed in one embodiment of the present invention includes a carrier tray, a motherboard, a liquid barrier, and a cooling assembly. The motherboard includes a substrate and at least one heat generating component. The substrate is stacked on the carrier. The heating element is electrically disposed on the substrate. The liquid barrier cover is stacked on the substrate and covers the heat generating component to form a liquid storage space together with the substrate. The liquid storage space is for accommodating a coolant. The cooling assembly is located in the reservoir space and is in thermal contact with the heating element.

According to the immersion cooling system disclosed in the above embodiments, since each servo device has an independent liquid storage space, the cooling liquid for cooling is independently stored and circulated in the individual liquid storage spaces. That is to say, each servo device dissipates heat only by the coolant in its own liquid storage space. In this way, each server has a separate immersion cooling system, which not only saves the inconvenience of quoting the cold water of the building, but also avoids the actual installation number of the server is less than the maximum sharing number of the sink and the single server is allocated. The problem of excessive heat dissipation.

The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the principles of the invention, and to provide a further explanation of the scope of the invention.

Please refer to Figure 1 to Figure 3. 1 is a perspective view of an immersion cooling system in accordance with an embodiment of the present invention. 2 is an exploded perspective view of the immersion cooling system of FIG. 1. 3 is a schematic cross-sectional view of the immersion cooling system of FIG. 1. The immersion cooling system 1 of the present embodiment is a miniaturized immersion cooling system for a server device, comprising a carrier 10, a motherboard 20, a liquid barrier 30, a cooling assembly 40, and an internal heat dissipating component 50. And an external heat dissipating component 60.

The motherboard 20 includes a substrate 21 and a heat generating component 22. The substrate 21 is stacked on the carrier 10 . The heating element 22 is an electronic component, such as a central processing unit, and is electrically disposed on the substrate 21.

The liquid barrier cover 30 includes an annular side plate 31, a cover plate 32 and an extension plate 33. The annular side plate 31 is stacked on the substrate 21. The extension plate 33 protrudes from the outer side of the annular side plate 31. The cover plate 32 includes a first plate portion 321 and a second plate portion 322 that are connected. The first plate portion 321 has opposite first faces 3211 and second faces 3212. The second plate portion has an opposite first surface 3221 and a second surface 3222. The first plate portion 321 of the cover plate 32 covers the extension plate 33, and the second plate portion 322 of the cover plate 32 covers the annular side plate 31, so that the first surface 3211, 3221 faces the substrate 21, and the second plate portion 322. The annular side plate 31 and the substrate 21 together form a liquid storage space 70. The liquid storage space 70 accommodates the cooling liquid, and the cooling liquid can be a liquid having cooling and electrical insulation effects such as deionized water or oil. In this way, each server device has a separate immersion cooling system, which not only saves the inconvenience of introducing cold water into the building, but also avoids the fact that the actual installation number of the server is less than the maximum sharing number of the water tank and the heat dissipation of a single server is generated. The problem of excessive power.

In the present embodiment, the cooling assembly 40 is a passive cooling assembly. The passive cooling assembly described herein is a cooling assembly that uses a gas vaporized by a coolant as a power source to drive a coolant flow to achieve a cooling effect. In other embodiments, the cooling assembly employed in the immersion cooling system may include a fan or pump to drive the active cooling assembly of the coolant flow by a fan or pump.

The inner heat dissipating component 50 is disposed on the first surface 3221 of the second plate portion 322 and has a fin shape. The outer heat dissipating component 60 is disposed on the second surface 3212 of the first plate portion 321 and the second surface 3222 of the second plate portion 322, and extends outward in a sheet shape like a fin. Specifically, the inner heat dissipating member 50 extends from the first surface 3221 of the second plate portion 322 to the liquid storage space 70, and the heat dissipating member 50 exchanges heat with the dielectric liquid or vapor in the tank, thereby transferring the electrons. The waste heat from the component is removed from the inside of the tank to the outside of the tank. The outer heat dissipating component 60 extends outward from the second surface 3212 of the first plate portion 321 and the second surface 3222 of the second plate portion 322 for guiding heat in the slot out of the slot. In this way, the server can not only cool down through the cooling component 40, but also increase the heat dissipation area of each servo device through the internal heat dissipating component 50 and the external heat dissipating component 60, thereby achieving better heat dissipation.

The immersion cooling system 1 in this embodiment can be applied to a 2U server, but the invention is not limited thereto. In other embodiments, the immersion cooling system can also be of other heights.

In addition, in the present embodiment, the outer heat dissipating member 60 is an outer heat dissipating member 60 that extends outward from the second surface 3212 of the first plate portion 321 and the second surface 3222 of the second plate portion 322. In other embodiments, the outer heat dissipating component 60 may be disposed only on the second surface 3212 of the first plate portion 321 or the second surface 3222 disposed only on the second plate portion 322 .

Furthermore, in the present embodiment, the cover 32 and the inner heat dissipating member 50 and the outer heat dissipating member 60 are integrally formed. In other embodiments, the inner and outer heat dissipating elements can be separate components and disposed on the cover. In addition, in other embodiments, the cover plate and the annular side panel may also be integrally formed.

According to the immersion cooling system of the above embodiment, since each servo device has an independent liquid storage space, the cooling liquid for cooling is independently stored and circulated in the individual liquid storage spaces. That is to say, the heat of each servo device is only dissipated by the coolant in its own liquid storage space. In this way, each server has an independent cooling system, which not only saves the inconvenience of introducing cold water into the building, but also avoids the actual installation of the server less than the maximum sharing number of the sink and the heat dissipation allocated by a single server. The problem of excessive power.

In addition, since the inner and outer surfaces of the cover are respectively provided with internal and external heat dissipating components, the servo device can not only dissipate heat through the immersion liquid cooling type cooling component, but also increase the heat dissipating area of each servo device through the inner and outer heat dissipating components, thereby further Achieve better heat dissipation.

While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The patent protection scope of the invention is subject to the definition of the scope of the patent application attached to the specification.

1‧‧‧Immersion cooling system

10‧‧‧Package

20‧‧‧ motherboard

21‧‧‧Substrate

22‧‧‧heating components

30‧‧‧Liquid hood

31‧‧‧Ring side panels

32‧‧‧ Cover

321‧‧‧First Board

3211‧‧‧ first side

3212‧‧‧ second side

322‧‧‧ Second Board

3221‧‧‧ first side

3222‧‧‧ second side

33‧‧‧ Extension board

40‧‧‧cooling components

50‧‧‧ internal heat dissipation components

60‧‧‧ external heat dissipating components

70‧‧‧Liquid space

1 is a perspective view of an immersion cooling system in accordance with an embodiment of the present invention. 2 is an exploded perspective view of the immersion cooling system of FIG. 1. 3 is a schematic cross-sectional view of the immersion cooling system of FIG. 1.

Claims (10)

An immersion cooling system comprising: a carrier; a motherboard comprising a substrate and at least one heat generating component, the substrate being stacked on the carrier, the at least one heat generating component being electrically disposed on the substrate; a liquid shield And superposing on the substrate and covering the at least one heating element to form a liquid storage space together with the substrate, the liquid storage space for accommodating a cooling liquid; and a cooling component located in the liquid storage space, And in thermal contact with the at least one heating element. The immersion cooling system of claim 1, wherein the liquid barrier cover comprises an annular side plate and a cover plate, the annular side plate is stacked on the substrate, and the cover plate is disposed on the annular side plate to enable the The substrate, the annular side plate and the cover plate together form the liquid storage space. The immersion cooling system of claim 2, wherein the cover plate and the annular side plate are integrally formed. The immersion cooling system of claim 2, wherein the liquid barrier further comprises an extension plate protruding from an outer side of the annular side plate, the cover plate comprising a first plate portion connected thereto a second plate portion, the first plate portion of the cover plate covers the extension plate, and the second plate portion of the cover plate covers the annular side plate to make the substrate, the annular side plate and the cover plate The first plate portion forms the liquid storage space. The immersion cooling system of claim 4, wherein the first plate portion and the second plate portion each have an opposite first surface and a second surface, the first surfaces facing the substrate, The liquid-cooled servo device further includes an inner heat dissipating component disposed on the first surface of the second plate portion. The immersion cooling system of claim 5, wherein the first plate portion and the second plate portion each have an opposite first surface and a second surface, the first surfaces facing the substrate, The liquid-cooled servo device further includes an external heat dissipating component disposed on the second surface of the first plate portion and the second surface of the second plate portion. The immersion cooling system of claim 6, wherein the cover, the inner heat dissipating component and the outer heat dissipating component are integrally formed. The immersion cooling system of claim 1, wherein the cooling component is a passive cooling component. The immersion cooling system of claim 1, wherein the cooling component is an active cooling component. The immersion cooling system of claim 1, wherein the immersion cooling system has a height of 2 U.