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TWI653291B - 聚合體摻合物組成物、撓性金屬疊層體及撓性印刷基板 - Google Patents

聚合體摻合物組成物、撓性金屬疊層體及撓性印刷基板 Download PDF

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Publication number
TWI653291B
TWI653291B TW105100011A TW105100011A TWI653291B TW I653291 B TWI653291 B TW I653291B TW 105100011 A TW105100011 A TW 105100011A TW 105100011 A TW105100011 A TW 105100011A TW I653291 B TWI653291 B TW I653291B
Authority
TW
Taiwan
Prior art keywords
resin
general formula
polymer blend
metal foil
blend composition
Prior art date
Application number
TW105100011A
Other languages
English (en)
Chinese (zh)
Other versions
TW201631038A (zh
Inventor
Yu Yamamoto
山本佑
Tomoharu Kurita
栗田智晴
Shota Inoue
井上翔太
Original Assignee
Toyobo Co., Ltd.
日商東洋紡股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyobo Co., Ltd., 日商東洋紡股份有限公司 filed Critical Toyobo Co., Ltd.
Publication of TW201631038A publication Critical patent/TW201631038A/zh
Application granted granted Critical
Publication of TWI653291B publication Critical patent/TWI653291B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW105100011A 2015-01-09 2016-01-04 聚合體摻合物組成物、撓性金屬疊層體及撓性印刷基板 TWI653291B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015002901 2015-01-09
JP2015-002901 2015-01-09

Publications (2)

Publication Number Publication Date
TW201631038A TW201631038A (zh) 2016-09-01
TWI653291B true TWI653291B (zh) 2019-03-11

Family

ID=56355832

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105100011A TWI653291B (zh) 2015-01-09 2016-01-04 聚合體摻合物組成物、撓性金屬疊層體及撓性印刷基板

Country Status (3)

Country Link
JP (1) JP6589887B2 (fr)
TW (1) TWI653291B (fr)
WO (1) WO2016111130A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017099172A1 (fr) * 2015-12-09 2017-06-15 東レ株式会社 Résine, bouillie, et stratifié mettant en œuvre ceux-ci ainsi que procédé de fabrication de celui-ci
KR102414438B1 (ko) * 2016-07-21 2022-06-29 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 폴리이미드 수지필름 및 폴리이미드 수지필름의 제조방법
CN111533909B (zh) * 2020-06-08 2023-04-25 武汉柔显科技股份有限公司 一种聚酰胺酰亚胺、聚酰胺酰亚胺薄膜及显示装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3287025B2 (ja) * 1992-09-18 2002-05-27 住友電気工業株式会社 絶縁電線
JPH06196025A (ja) * 1992-12-22 1994-07-15 Sumitomo Electric Ind Ltd 絶縁電線
JP5176886B2 (ja) * 2007-11-12 2013-04-03 東洋紡株式会社 フレキシブル金属積層体及びフレキシブルプリント基板
JP4883432B2 (ja) * 2010-05-31 2012-02-22 東洋紡績株式会社 フレキシブル金属張積層体

Also Published As

Publication number Publication date
JP6589887B2 (ja) 2019-10-16
WO2016111130A1 (fr) 2016-07-14
JPWO2016111130A1 (ja) 2017-10-12
TW201631038A (zh) 2016-09-01

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MM4A Annulment or lapse of patent due to non-payment of fees