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TWI651659B - Sensing module and electronic devices thereof - Google Patents

Sensing module and electronic devices thereof Download PDF

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Publication number
TWI651659B
TWI651659B TW107108498A TW107108498A TWI651659B TW I651659 B TWI651659 B TW I651659B TW 107108498 A TW107108498 A TW 107108498A TW 107108498 A TW107108498 A TW 107108498A TW I651659 B TWI651659 B TW I651659B
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sensing
block
opening
unit
sensing module
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TW107108498A
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Chinese (zh)
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TW201939351A (en
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葉陳光
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鴻海精密工業股份有限公司
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Abstract

本發明提供一種人臉辨識的感測模組,用於一電子裝置上。本發明之感測模組包含一蓋板以及一感測單元。前述蓋板包含一第一區塊、一第二區塊以及一第三區塊。前述感測單元設置於前述蓋板中,包含一第一感測部以及一第二感測部。前述第一感測部固定於前述第一區塊中。前述第二感測部固定於前述第二區塊中。前述第一感測部具有一第一感測鏡頭以及一第一感測殼體。前述第一區塊具有一第一開孔。前述第一感測殼體固定於前述第一開孔中,使一第一光線由前述第一開孔進入前述第一感測鏡頭。前述第二感測部具有一第二感測鏡頭以及一第二感測殼體。前述第二區塊具有一第二開孔。前述第二感測殼體固定於前述第二開孔中,使一第二光線由前述第二開孔進入前述第二感測鏡頭。 The invention provides a sensing module for face recognition, which is used on an electronic device. The sensing module of the present invention comprises a cover and a sensing unit. The cover plate includes a first block, a second block and a third block. The sensing unit is disposed in the cover plate and includes a first sensing portion and a second sensing portion. The first sensing portion is fixed in the first block. The second sensing portion is fixed in the second block. The first sensing portion has a first sensing lens and a first sensing housing. The first block has a first opening. The first sensing housing is fixed in the first opening, so that a first light enters the first sensing lens from the first opening. The second sensing portion has a second sensing lens and a second sensing housing. The second block has a second opening. The second sensing housing is fixed in the second opening, so that a second light enters the second sensing lens from the second opening.

Description

感測模組及其電子裝置 Sensing module and electronic device thereof

本發明係關於一種感測模組,尤其是一種用於電子裝置之人臉辨識感測模組。 The invention relates to a sensing module, in particular to a face recognition sensing module for an electronic device.

智慧手機的功能隨著人們的需求越來越多。目前,智慧手機有各種的解鎖或是身分辨識的方式,例如密碼、指紋辨識、虹膜辨識等等。最近又增加了人臉辨識的功能,使智慧手機在安全性上更加地進步。一般人臉辨識感測模組設置於智慧手機正面的上方,靠近智慧手機原本的前鏡頭與喇叭的位置,以方便使用者進行人臉辨識。而智慧手機的無邊框設計的趨勢要求使得前鏡頭、喇叭以及人臉辨識感測模組的體積跟寬度能夠越小越好。此外,由於人臉辨識模組的深度感測器需要進行光學校正,並且如果因為受力或震動產生位移就會無法準確辨識。 The function of smart phones is increasing with the needs of people. At present, smart phones have various unlocking or identity recognition methods, such as password, fingerprint recognition, iris recognition and so on. Recently, the function of face recognition has been added to make smart phones more secure in terms of security. The general face recognition sensing module is disposed above the front of the smart phone, close to the position of the original front lens and the speaker of the smart phone, so as to facilitate the user to perform face recognition. The trend of the borderless design of smart phones requires that the volume and width of the front lens, speaker and face recognition sensing module can be as small as possible. In addition, since the depth sensor of the face recognition module needs to be optically corrected, if it is displaced due to force or vibration, it cannot be accurately identified.

因此,需要一種模組化方便安裝於電子裝置上的人臉辨識感測模組。 Therefore, there is a need for a face recognition sensing module that is modularized for easy installation on an electronic device.

有鑑於此,本發明之目的為提供一種人臉辨識感測模組,用於電子裝置上,例如智慧手機。本發明之感測模組將深度感測單元與攝像單元以及發光單元安裝在同一個蓋板上以形成模組化的結構。並且,在蓋板上保留空間 以配合電子裝置原有的元件(例如喇叭等元件)的位置。以此方式,本發明之感測模組中用於人臉辨識的深度感測單元可直接在蓋板上進行校正,避免了安裝在電子裝置內部之後的校正過程。並且,本發明之感測模組具有體積小、寬度小、耐用性佳以及容易與電子裝置結合的優點。 In view of this, an object of the present invention is to provide a face recognition sensing module for use on an electronic device, such as a smart phone. The sensing module of the present invention mounts the depth sensing unit and the imaging unit and the light emitting unit on the same cover to form a modular structure. Also, reserve space on the cover To match the position of the original components of the electronic device (such as components such as speakers). In this way, the depth sensing unit for face recognition in the sensing module of the present invention can be directly corrected on the cover plate, avoiding the correction process after being installed inside the electronic device. Moreover, the sensing module of the present invention has the advantages of small size, small width, good durability, and easy combination with an electronic device.

為達上述目的,本發明提供一種人臉辨識的感測模組,用於一電子裝置上。本發明之感測模組包含一蓋板以及一感測單元。前述蓋板包含一第一區塊、一第二區塊以及一第三區塊。前述感測單元設置於前述蓋板中,包含一第一感測部以及一第二感測部。前述第一感測部固定於前述第一區塊中。前述第二感測部固定於前述第二區塊中。前述第一感測部具有一第一感測鏡頭以及一第一感測殼體。前述第一區塊具有一第一開孔。前述第一感測殼體固定於前述第一開孔中,使一第一光線由前述第一開孔進入前述第一感測鏡頭。前述第二感測部具有一第二感測鏡頭以及一第二感測殼體。前述第二區塊具有一第二開孔。前述第二感測殼體固定於前述第二開孔中,使一第二光線由前述第二開孔進入前述第二感測鏡頭。 To achieve the above objective, the present invention provides a sensing module for face recognition for use on an electronic device. The sensing module of the present invention comprises a cover and a sensing unit. The cover plate includes a first block, a second block and a third block. The sensing unit is disposed in the cover plate and includes a first sensing portion and a second sensing portion. The first sensing portion is fixed in the first block. The second sensing portion is fixed in the second block. The first sensing portion has a first sensing lens and a first sensing housing. The first block has a first opening. The first sensing housing is fixed in the first opening, so that a first light enters the first sensing lens from the first opening. The second sensing portion has a second sensing lens and a second sensing housing. The second block has a second opening. The second sensing housing is fixed in the second opening, so that a second light enters the second sensing lens from the second opening.

為達上述目的,本發明也提供一種包含前述感測模組之電子裝置。 To achieve the above object, the present invention also provides an electronic device including the foregoing sensing module.

綜上所述,本發明之感測模組將深度感測單元與攝像單元以及發光單元安裝在同一個蓋板上以形成模組化的結構。並且,在蓋板上保留空間以配合電子裝置原有的元件(例如喇叭等元件)的位置。以此方式,本發明之感測模組中用於人臉辨識的深度感測單元可直接在蓋板上進行校正,避免了安裝在電子裝置內部之後的校正過程。並且,本發明之感測模組具有體積小、寬度小、耐用性佳以及容易與電子裝置結合的優點。 In summary, the sensing module of the present invention mounts the depth sensing unit and the imaging unit and the light unit on the same cover to form a modular structure. Also, a space is reserved on the cover to match the position of the original components of the electronic device, such as components such as speakers. In this way, the depth sensing unit for face recognition in the sensing module of the present invention can be directly corrected on the cover plate, avoiding the correction process after being installed inside the electronic device. Moreover, the sensing module of the present invention has the advantages of small size, small width, good durability, and easy combination with an electronic device.

100‧‧‧感測模組 100‧‧‧Sensing module

100A、100B‧‧‧半成品 100A, 100B‧‧‧ semi-finished products

110‧‧‧蓋板 110‧‧‧ cover

111‧‧‧第一區塊 111‧‧‧First block

111a‧‧‧第一開孔 111a‧‧‧First opening

111b‧‧‧第三開孔 111b‧‧‧ third opening

112‧‧‧第二區塊 112‧‧‧Second block

112a‧‧‧第二開孔 112a‧‧‧Second opening

112b‧‧‧第四開孔 112b‧‧‧fourth opening

113‧‧‧第三區塊 113‧‧‧ Third block

113a‧‧‧第五開孔 113a‧‧‧5th opening

120‧‧‧感測單元 120‧‧‧Sensor unit

121‧‧‧第一感測部 121‧‧‧First Sensing Department

121a‧‧‧第一感測鏡頭 121a‧‧‧first sensing lens

121b‧‧‧第一感測殼體 121b‧‧‧First sensing housing

121c‧‧‧第一感測電路板 121c‧‧‧First sensing circuit board

122‧‧‧第二感測部 122‧‧‧Second Sensing Department

122a‧‧‧第二感測鏡頭 122a‧‧‧Second sensing lens

122b‧‧‧第二感測殼體 122b‧‧‧Second sensing housing

122c‧‧‧第二感測電路板 122c‧‧‧Second sensing circuit board

122d‧‧‧連接電路板 122d‧‧‧Connected circuit board

131‧‧‧第一連接器 131‧‧‧First connector

132‧‧‧第二連接器 132‧‧‧Second connector

140‧‧‧發光單元 140‧‧‧Lighting unit

141‧‧‧發光元件 141‧‧‧Lighting elements

142‧‧‧發光元件控制器 142‧‧‧Lighting element controller

150‧‧‧攝像單元 150‧‧‧ camera unit

151‧‧‧攝像頭 151‧‧‧Webcam

152‧‧‧攝像殼體 152‧‧‧ camera housing

153‧‧‧攝像連接器 153‧‧‧ Camera connector

154‧‧‧攝像控制板 154‧‧‧ Camera Control Board

200‧‧‧電子裝置 200‧‧‧Electronic devices

210‧‧‧觸控面板 210‧‧‧Touch panel

220‧‧‧喇叭 220‧‧‧ Horn

230‧‧‧殼體 230‧‧‧ housing

圖1A為本發明之感測模組之立體示意圖;圖1B為圖1A之感測模組另一角度之立體示意圖。 1A is a perspective view of a sensing module of the present invention; FIG. 1B is a perspective view of another sensing angle of the sensing module of FIG. 1A.

圖2為具有圖1A之感測模組之電子裝置示意圖。 2 is a schematic diagram of an electronic device having the sensing module of FIG. 1A.

圖3A為圖1A之感測模組之爆炸示意圖;圖3B為圖1A之感測模組另一角度之爆炸示意圖。 FIG. 3A is a schematic exploded view of the sensing module of FIG. 1A; FIG. 3B is a schematic exploded view of the sensing module of FIG. 1A at another angle.

圖4A至圖4C為圖1A之感測模組之組裝流程示意圖。 4A-4C are schematic diagrams showing the assembly process of the sensing module of FIG. 1A.

以下將參照相關圖式,說明本發明較佳實施例之一種感測模組,其中相同的元件將以相同的參照符號加以說明。 In the following, a sensing module according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings, wherein like elements will be described with the same reference numerals.

請先參考圖1A、圖1A、圖2、圖3A與圖3B,圖1A為本發明之感測模組之立體示意圖;圖1B為圖1A之感測模組另一角度之立體示意圖;圖2為具有圖1A之感測模組之電子裝置示意圖;圖3A為圖1A之感測模組之爆炸示意圖;圖3B為圖1A之感測模組另一角度之爆炸示意圖。如圖1A、圖1B與圖2所示,本發明之感測模組100為一種人臉辨識感測模組。本發明的感測模組100可設置於一電子裝置200的內部。前述電子裝置200可為一手機、一平板電腦或是一手提電腦。如圖2所示,前述電子裝置200以一手機為例。前述感測模組100固定於前述電子裝置200之殼體230內部,且位於前述電子裝置200之觸控面板210的上方靠近喇叭220的位置。當使用者要利用人臉辨識的功能開啟前述電子裝置200時,使用者只要舉起前述電子裝置200使前述感測模組100面對使用者的臉部,就可以利用前述感測模組100進行人臉辨識。 1A, FIG. 1A, FIG. 2, FIG. 3A and FIG. 3B, FIG. 1A is a perspective view of the sensing module of the present invention; FIG. 1B is a perspective view of another sensing angle of the sensing module of FIG. 2 is a schematic diagram of an electronic device having the sensing module of FIG. 1A; FIG. 3A is an exploded view of the sensing module of FIG. 1A; and FIG. 3B is a schematic exploded view of the sensing module of FIG. 1A at another angle. As shown in FIG. 1A, FIG. 1B and FIG. 2, the sensing module 100 of the present invention is a face recognition sensing module. The sensing module 100 of the present invention can be disposed inside an electronic device 200. The foregoing electronic device 200 can be a mobile phone, a tablet computer or a laptop computer. As shown in FIG. 2, the electronic device 200 is exemplified by a mobile phone. The sensing module 100 is fixed inside the casing 230 of the electronic device 200 and located above the touch panel 210 of the electronic device 200 near the horn 220. When the user wants to use the face recognition function to turn on the electronic device 200, the user can use the sensing module 100 by lifting the electronic device 200 to face the sensing module 100 facing the user's face. Perform face recognition.

如圖1A、圖1B、圖3A與圖3B所示,本發明之感測模組100包含一蓋板110以及一感測單元120。前述蓋板110包含一第一區塊111、一第二區塊112以及一第三區塊113。前述第一區塊111、前述第二區塊112與前述第三區塊呈一直線排列,即本發明之感測模組100之長軸的方向。前述第三區塊113介於前述第一區塊111與前述第二區塊112之間。前述第一區塊111與前述第二區塊112在同一平面上。前述第三區塊113之平面低於前述第一區塊111與前述第二區塊112之平面。換句話說,前述第三區塊113是前述蓋板110的一塊凹陷區塊,例如一長方形的凹陷區塊。前述蓋板110可由強度較高不易變形的材質所製成,例如金屬或是高強度的塑膠類,以使前述感測模組100不容易受到外力而變形。以此方式,當前述感測模組100設置於前述電子裝置200之殼體230內部時,前述電子裝置200之喇叭220或是其他元件可放置在前述第三區塊113中,使前述感測模組100能夠配合前述電子裝置200本身原有的結構,而 不會增加額外的體積。 As shown in FIG. 1A , FIG. 1B , FIG. 3A and FIG. 3B , the sensing module 100 of the present invention includes a cover 110 and a sensing unit 120 . The cover plate 110 includes a first block 111, a second block 112, and a third block 113. The first block 111 and the second block 112 are arranged in line with the third block, that is, the direction of the long axis of the sensing module 100 of the present invention. The third block 113 is interposed between the first block 111 and the second block 112. The first block 111 is on the same plane as the second block 112. The plane of the third block 113 is lower than the plane of the first block 111 and the second block 112. In other words, the third block 113 is a recessed block of the cover plate 110, such as a rectangular recessed block. The cover plate 110 can be made of a material with high strength and deformation, such as metal or high-strength plastic, so that the sensing module 100 is not easily deformed by external force. In this manner, when the sensing module 100 is disposed inside the housing 230 of the electronic device 200, the speaker 220 or other components of the electronic device 200 can be placed in the third block 113 to enable the sensing. The module 100 can cooperate with the original structure of the electronic device 200 itself, and No extra volume will be added.

前述感測單元120設置於前述蓋板110中,且包含一第一感測部121以及一第二感測部121。前述感測單元120為一深度感測單元(Depth Sensor)用來辨識人臉3D影像。前述第一感測部121與前述第二感測部122為二紅外光感測元件(IR Sensing Element)。前述第一感測部121固定於前述第一區塊111中。前述第二感測部121固定於前述第二區塊中112中。前述第一感測部121具有一第一感測鏡頭121a、一第一感測殼體121b以及一第一感測電路板121c。前述第一感測鏡頭112a固定於前述第一感測殼體121b中。前述第一區塊111具有一第一開孔111a。前述第一感測殼體121b固定於前述第一開孔111a中,使一第一光線由前述第一開孔111a進入前述第一感測鏡頭121a。前述第一感測電路板121c用於控制前述第一感測部121。前述感測電路板121c進一部連接至一第一連接器131,以使前述第一感測部121透過前述第一連接器131電連接於前述電子裝置200。前述第二感測部122具有一第二感測鏡頭122a、一第二感測殼體122b以及一第二感測電路板122c。前述第二感測鏡頭122a固定於前述第二感測殼體122b中。前述第二區塊112具有一第二開孔112a。前述第二感測殼體122b固定於前述第二開孔112a中,使一第二光線由前述第二開孔112a進入前述第二感測鏡頭122a。前述第二感測電路板122c用於控制前述第二感測部122。前述感測電路板122c進一步連接至一第二連接器132,以使前述第二感測部122透過前述第二連接器132電連接於前述電子裝置200。以此方式,可確保前述感測單元120之第一感測部121與第二感測部122在同一個蓋板上。前述第一感測部121與前述第二感測部122分別組裝在前述蓋板110之第一區塊111與第二區塊112後,可直接進行校正。使前述感測模組100安裝於前述電子裝置200內時,不需要再校正前述第一感測部121與前述第二感測部122。同時,前述第一感測部121與前述第二感測部122固定在同一蓋板110上,避免後續因為震動的關係使前述第一感測部121與前述第二感測部122產生移位造成前述感測單元120失效。 The sensing unit 120 is disposed in the cover plate 110 and includes a first sensing portion 121 and a second sensing portion 121 . The sensing unit 120 is a depth sensing unit (Depth Sensor) for recognizing a human face 3D image. The first sensing unit 121 and the second sensing unit 122 are two infrared sensing elements (IR Sensing Element). The first sensing portion 121 is fixed in the first block 111. The second sensing portion 121 is fixed in the second block 112. The first sensing unit 121 has a first sensing lens 121a, a first sensing housing 121b, and a first sensing circuit board 121c. The aforementioned first sensing lens 112a is fixed in the aforementioned first sensing housing 121b. The first block 111 has a first opening 111a. The first sensing housing 121b is fixed in the first opening 111a, so that a first light enters the first sensing lens 121a from the first opening 111a. The first sensing circuit board 121c is used to control the first sensing unit 121. The sensing circuit board 121c is connected to a first connector 131 to electrically connect the first sensing unit 121 to the electronic device 200 through the first connector 131. The second sensing portion 122 has a second sensing lens 122a, a second sensing housing 122b, and a second sensing circuit board 122c. The aforementioned second sensing lens 122a is fixed in the aforementioned second sensing housing 122b. The second block 112 has a second opening 112a. The second sensing housing 122b is fixed in the second opening 112a, so that a second light enters the second sensing lens 122a from the second opening 112a. The second sensing circuit board 122c is configured to control the second sensing portion 122. The sensing circuit board 122c is further connected to a second connector 132 such that the second sensing portion 122 is electrically connected to the electronic device 200 through the second connector 132. In this way, it can be ensured that the first sensing portion 121 of the sensing unit 120 and the second sensing portion 122 are on the same cover. The first sensing portion 121 and the second sensing portion 122 are respectively assembled in the first block 111 and the second block 112 of the cover 110, and can be directly corrected. When the sensing module 100 is mounted in the electronic device 200, the first sensing unit 121 and the second sensing unit 122 need not be corrected. At the same time, the first sensing portion 121 and the second sensing portion 122 are fixed on the same cover 110 to prevent the first sensing portion 121 and the second sensing portion 122 from being displaced due to the vibration. The aforementioned sensing unit 120 is disabled.

前述感測模組100進一步具有一攝像單元150,設置於前述第一區塊111上。前述攝像單元為一RGB攝像單元。前述攝像單元150包含一攝像頭 151、一攝像殼體152、一攝像連接器153以及一攝像控制板154。前述第一區塊111進一步具有一第三開孔111b。前述攝像殼體152固定於前述第三開孔111b中,第一第三光線由前述第三開孔111b進入前述攝像頭151。前述攝像控制板154用於控制前述攝像單元150。前述攝像連接器153連接前述攝像控制板154以及前述電子裝置200,使前述攝像單元150連接於前述電子裝置200。前述攝像單元150可設置於前述第一感測部121之左邊或右邊。 The sensing module 100 further includes an imaging unit 150 disposed on the first block 111. The aforementioned imaging unit is an RGB imaging unit. The camera unit 150 includes a camera 151. An imaging housing 152, a camera connector 153, and an imaging control panel 154. The first block 111 further has a third opening 111b. The imaging housing 152 is fixed in the third opening 111b, and the first third light enters the camera 151 through the third opening 111b. The aforementioned imaging control panel 154 is used to control the aforementioned imaging unit 150. The imaging connector 153 is connected to the imaging control board 154 and the electronic device 200, and the imaging unit 150 is connected to the electronic device 200. The camera unit 150 can be disposed to the left or the right of the first sensing unit 121.

前述感測模組100進一步具有一發光單元140連接於前述第二感測部122。前述第二感測部122之第二感測電路板122c進一部連接至一連接電路板122d。前述發光單元140設置於前述連接板電路板122d上。前述發光單元140具有一發光元件141以及一發光元件控制器142。前述發光元件141為一LED發光元件。前述第二區塊112進一步具有一第四開孔112b。前述第三區塊113具有一第五開孔113a。前述發光元件141設置於前述第四開孔112b中,使前述發光元件141所發出的光線射出前述第四開孔112b。前述發光元件控制器142設置於前述第五開孔113a中。此時,前述連接電路板122d由前述第二區塊112延伸到前述第三區塊113,使前述發光元件控制器142對應於前述第三區塊113之第五開孔113a。因此,前述發光元件控制器142與前述發光元件141排列方向平形於前述感測模組100之長軸的方向,以縮小前述感測模組100之寬度。另外,將前述發光元件控制器142放置凹陷的前述第三區塊113的第五開孔113a的方式,可將低前述感測模組100的厚度與體積,同時又保留了前述電子裝置200的元件(例如前述喇叭220)所需要的空間,使本發明之感測模組100體積小且容易與前述電子裝置200結合。 The sensing module 100 further includes a light emitting unit 140 connected to the second sensing portion 122. The second sensing circuit board 122c of the second sensing portion 122 is connected to a connecting circuit board 122d. The light emitting unit 140 is disposed on the connecting board circuit board 122d. The light emitting unit 140 has a light emitting element 141 and a light emitting element controller 142. The light-emitting element 141 is an LED light-emitting element. The second block 112 further has a fourth opening 112b. The third block 113 has a fifth opening 113a. The light-emitting element 141 is disposed in the fourth opening 112b, and emits light emitted by the light-emitting element 141 from the fourth opening 112b. The light-emitting element controller 142 is disposed in the fifth opening 113a. At this time, the connection circuit board 122d extends from the second block 112 to the third block 113, so that the light-emitting element controller 142 corresponds to the fifth opening 113a of the third block 113. Therefore, the light-emitting element controller 142 and the light-emitting element 141 are arranged in a direction parallel to the long axis of the sensing module 100 to reduce the width of the sensing module 100. In addition, the manner in which the light-emitting element controller 142 is placed in the recessed third opening 113a of the third block 113 can lower the thickness and volume of the sensing module 100 while preserving the electronic device 200. The space required for the component (for example, the aforementioned speaker 220) makes the sensing module 100 of the present invention small in size and easily combined with the aforementioned electronic device 200.

前述第一感測部121、前述攝像頭151、前述發光元件控制器142、前述發光元件141以及前述第二感測部122以一直線之方式排列在前述蓋板110上,並且平形於前述第一區塊111、前述第二區塊112與前述第三區塊113所在之直線,使本發明之感測模組100之寬度達到最小之設計。 The first sensing unit 121, the camera 151, the light-emitting element controller 142, the light-emitting element 141, and the second sensing unit 122 are arranged in a line on the cover plate 110, and are flattened in the first area. The block 111, the second block 112 and the straight line of the third block 113 are used to minimize the width of the sensing module 100 of the present invention.

以此方式,本發明之感測模組100將感測單元120、攝像單元130與發光單元140固定在同一蓋板110上,以形成一模組化的結構。本發明之感測模組100安裝前述電子裝置200內時,可避免額外的校正流程,並且避免震動而 使前述感測單元120、攝像單元130與發光單元140產生位移而失效。並且,本發明之感測模組100預先保留前述電子裝置200之元件(例如喇叭220)所需要的空間,使感測模組100容易與電子裝置200原本之結構進行結合,不需要改變電子裝置200的結構或增加額外的體積。 In this manner, the sensing module 100 of the present invention fixes the sensing unit 120, the imaging unit 130, and the light emitting unit 140 on the same cover 110 to form a modular structure. When the sensing module 100 of the present invention is installed in the electronic device 200, an additional calibration process can be avoided and vibration can be avoided. The sensing unit 120, the imaging unit 130, and the light emitting unit 140 are displaced to be disabled. Moreover, the sensing module 100 of the present invention pre-retains the space required for the components of the electronic device 200 (for example, the speaker 220), so that the sensing module 100 can be easily combined with the original structure of the electronic device 200 without changing the electronic device. 200 structure or add extra volume.

請參考圖4A至圖4C,為圖1A所示之感測模組100之組裝流程示意圖。如圖4A所示,先將前述發光單元140以及前述第二感測部122組裝在已經組裝好前述第二連接器144之前述連接電路板122d上以形成一半成品100A。接著,將圖4A所示的半成品100A與前述第一感測部121安裝在前述蓋板110中。此時,前述第一感測殼體121b對應於前述第一開孔111a;前述發光元件控制器142對應於前述第五開孔113a;前述發光元件141對應於前述第四開孔112b;前述第二感測殼體122b對應於前述第二開孔112a。前述第一連接器131與前述第二連接器132朝外以便於連接至前述電子裝置200。並且,對前述第一感測部121以及第二感測部122進行校正,再用膠與前述蓋板110結合,以形成如圖4B所示之半成品100B。最後,將前述攝像單元150安裝在圖4B所示之半成品100B中。前述攝像單元150之攝像殼體152對應於前述第三開孔111b。前述攝像單元150之攝像連接器153朝外以便於與前述電子裝置200連接。並且,對前述攝像單元150進行校正後用膠與前述蓋板110結合,以形成本發明之感測模組100,如圖4C所示。此時,前述第一感測部121、前述攝像頭151、前述發光元件控制器142、前述發光元件141以及前述第二感測部122以一直線之方式排列在前述蓋板110上,並且平形於前述第一區塊111、前述第二區塊112與前述第三區塊113所在之直線,使本發明之感測模組100之寬度達到最小之設計。 Please refer to FIG. 4A to FIG. 4C , which are schematic diagrams showing the assembly process of the sensing module 100 shown in FIG. 1A . As shown in FIG. 4A, the light emitting unit 140 and the second sensing portion 122 are first assembled on the connecting circuit board 122d on which the second connector 144 has been assembled to form a half finished product 100A. Next, the semi-finished product 100A shown in FIG. 4A and the first sensing portion 121 are mounted in the cover plate 110. In this case, the first sensing housing 121b corresponds to the first opening 111a; the light emitting element controller 142 corresponds to the fifth opening 113a; the light emitting element 141 corresponds to the fourth opening 112b; The second sensing housing 122b corresponds to the aforementioned second opening 112a. The aforementioned first connector 131 and the aforementioned second connector 132 face outward to facilitate connection to the aforementioned electronic device 200. Then, the first sensing portion 121 and the second sensing portion 122 are corrected, and the cover plate 110 is bonded with the glue to form the semi-finished product 100B as shown in FIG. 4B. Finally, the aforementioned image pickup unit 150 is mounted in the semi-finished product 100B shown in Fig. 4B. The imaging housing 152 of the aforementioned imaging unit 150 corresponds to the aforementioned third opening 111b. The camera connector 153 of the aforementioned imaging unit 150 faces outward to facilitate connection with the aforementioned electronic device 200. Moreover, after the image capturing unit 150 is corrected, the glue is combined with the cover plate 110 to form the sensing module 100 of the present invention, as shown in FIG. 4C. At this time, the first sensing unit 121, the camera 151, the light-emitting element controller 142, the light-emitting element 141, and the second sensing unit 122 are arranged in a line on the cover plate 110, and are flattened in the foregoing. The straight line of the first block 111, the second block 112 and the third block 113 is such that the width of the sensing module 100 of the present invention is minimized.

綜上所述,本發明之感測模組將深度感測單元與攝像單元以及發光單元安裝在同一個蓋板上以形成模組化的結構。並且,在蓋板上保留空間以配合電子裝置原有的元件(例如喇叭等元件)的位置。以此方式,本發明之感測模組中用於人臉辨識的深度感測單元可直接在蓋板上進行校正,避免了安裝在電子裝置內部之後的校正過程。並且,本發明之感測模組具有體積小、寬度小、耐用性佳以及容易與電子裝置結合的優點。 In summary, the sensing module of the present invention mounts the depth sensing unit and the imaging unit and the light unit on the same cover to form a modular structure. Also, a space is reserved on the cover to match the position of the original components of the electronic device, such as components such as speakers. In this way, the depth sensing unit for face recognition in the sensing module of the present invention can be directly corrected on the cover plate, avoiding the correction process after being installed inside the electronic device. Moreover, the sensing module of the present invention has the advantages of small size, small width, good durability, and easy combination with an electronic device.

以上所述僅為舉例性,而非為限制性者。任何未脫離本發明之精神與範疇,而對其進行之等效修改或變更,均應包含於後附之申請專利範圍中。 The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.

Claims (8)

一種感測模組,包含:一蓋板,包含一第一區塊、一第二區塊以及一第三區塊;一感測單元設置於前述蓋板中,包含一第一感測部以及一第二感測部;前述第一感測部固定於前述第一區塊中;前述第二感測部固定於前述第二區塊中;其中,前述第一感測部具有一第一感測鏡頭以及一第一感測殼體;前述第一區塊具有一第一開孔;前述第一感測殼體固定於前述第一開孔中,使一第一光線由前述第一開孔進入前述第一感測鏡頭;以及前述第二感測部具有一第二感測鏡頭以及一第二感測殼體;前述第二區塊具有一第二開孔;前述第二感測殼體固定於前述第二開孔中,使一第二光線由前述第二開孔進入前述第二感測鏡頭;及一攝像單元;前述攝像單元設置於前述第一區塊上;前述攝像單元具有一攝像頭以及一攝像殼體;前述第一區塊進一步具有一第三開孔;前述攝像殼體固定於前述第三開孔中,使一第三光線由前述第三開孔進入前述攝像頭。 A sensing module includes: a cover plate, a first block, a second block, and a third block; a sensing unit is disposed in the cover plate, and includes a first sensing portion and a second sensing portion; the first sensing portion is fixed in the first block; the second sensing portion is fixed in the second block; wherein the first sensing portion has a first sense And the first sensing block; the first block has a first opening; the first sensing housing is fixed in the first opening, so that a first light is formed by the first opening Entering the first sensing lens; and the second sensing portion has a second sensing lens and a second sensing housing; the second block has a second opening; the second sensing housing Fixed in the second opening, a second light enters the second sensing lens from the second opening; and an image capturing unit; the camera unit is disposed on the first block; the camera unit has a a camera and an imaging housing; the first block further has a third opening A housing fixed to the image pickup in the third opening, so that a third opening by the aforementioned third light entering the camera. 如申請專利範圍第1項所述的感測模組,其中,前述第一區塊、前述第二區塊以及前述第三區塊呈一直線排列;前述第三區塊介於前述第一區塊與前述第二區塊之間。 The sensing module of claim 1, wherein the first block, the second block, and the third block are arranged in a line; the third block is in the first block. Between the aforementioned second block. 如申請專利範圍第2項所述的感測模組,其中,前述第三區塊之平面低於前述第一區塊與第二區塊之平面。 The sensing module of claim 2, wherein the plane of the third block is lower than the plane of the first block and the second block. 如申請專利範圍第1項所述的感測模組,其中,前述感測單元為一深度感測單元;前述第一感測部與前述第二感測部為二紅外光感測元件。 The sensing module of claim 1, wherein the sensing unit is a depth sensing unit; and the first sensing portion and the second sensing portion are two infrared light sensing elements. 如申請專利範圍第1項所述的感測模組,進一步具有一發光單元連接於前述第二感測部。 The sensing module of claim 1, further comprising a light emitting unit connected to the second sensing portion. 如申請專利範圍第5項所述的感測模組,其中,前述第二感測部具有一第二感測電路板;前述第二感測電路板連接至一連接板;前述發光單元設置於前述連接板上。 The sensing module of claim 5, wherein the second sensing portion has a second sensing circuit board; the second sensing circuit board is connected to a connecting board; The aforementioned connecting plate. 如申請專利範圍第6項所述的感測模組,其中,前述發光單元具有一發光元件以及一發光元件控制器;前述第二區塊具有一第四開孔;前述第三區塊具有一第五開孔;前述發光元件設置於前述第四開孔中,使前述發光元件所發出的光線射出前述第四開孔;前述發光元件控制器設置於前述第五開孔中。 The sensing module of claim 6, wherein the light emitting unit has a light emitting element and a light emitting element controller; the second block has a fourth opening; and the third block has a a fifth opening; the light emitting element is disposed in the fourth opening, and the light emitted by the light emitting element is emitted from the fourth opening; and the light emitting element controller is disposed in the fifth opening. 一種電子裝置,其包含如申請專利範圍第1項至第7項中任一項所述的感測模組。 An electronic device comprising the sensing module according to any one of claims 1 to 7.
TW107108498A 2018-03-13 2018-03-13 Sensing module and electronic devices thereof TWI651659B (en)

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