TWI650605B - Array substrate and method for testing the same - Google Patents

Abstract

The array substrate includes a first test group, a second test group, and a pixel array. The first test set includes a first test pad, and the first test pad of the first test set is electrically connected to the first drive unit. The second test set includes a first test pad, and the first test pad of the second test set is electrically connected to the second drive unit, and is electrically connected to the first test pad of the corresponding first test group. The pixel array includes a first signal line. The first signal line is electrically connected between the first driving unit and the second driving unit.

Description

Array substrate and array substrate test method

The present invention relates to an array substrate and a test method thereof, and more particularly to a test method for an array substrate and an array substrate having a first test group and a second test group.

As the demand for display panels increases, the development of array substrates has become a major trend. After the active array area in the array substrate is manufactured, it is necessary to test the pixel array in the active array area, for example, testing of electrical characteristics, otherwise the abnormal components will affect the display effect of the array substrate.

There is still a need for a test method for array substrates and array substrates that are easy to test.

The disclosure relates to a method for testing an array substrate and an array substrate. The array substrate of one embodiment of the present disclosure includes a first test pad electrically connected to the first test group and a first test pad of the second test group, so that only one signal is needed to be provided to the first test pad of the first test group. Then, the signal can be transmitted to the first test pad of the second test group, and the components of the pixel array can be effectively tested.

According to an embodiment of the present disclosure, an array substrate is proposed. The array substrate includes a first test group, a second test group, and a pixel array. The first test set includes a first test pad, and the first test pad of the first test set is electrically connected to the first drive unit. The second test set includes a first test pad, and the first test pad of the second test set is electrically connected to the second drive unit, and is electrically connected to the first test pad of the corresponding first test group. The pixel array includes a first signal line. The first signal line is electrically connected between the first driving unit and the second driving unit.

According to still another embodiment of the present disclosure, a test method for an array substrate is proposed. The method includes the following steps. First, an array substrate as described above is provided. Thereafter, a test connector is contacted with the first test set to provide a plurality of test signals to the pixel array.

In order to better understand the above and other aspects of the present invention, the following detailed description of the embodiments and the accompanying drawings

The term "electrical connection" as used herein may mean that two or more elements are in direct physical or electrical contact with each other, or are indirectly in physical or electrical contact with each other. Indirect physical or electrical contact is exemplified as The two components can be physically or electrically contacted by an intermediate component. The intermediate component can be a switch (such as a thin film transistor) or a resistor, a capacitor, etc., and the "electrical connection" can also mean that two or more components operate with each other. Or action.

The present disclosure provides an array substrate and an array substrate testing method thereof. The array substrate of the present disclosure includes a first test pad electrically connected to the first test group of the first driving unit and a first test pad electrically connected to the second test group of the second driving unit, and the first test group The first test pad can be electrically connected to the first test pad of the second test group, so that only one signal is provided on one side to the first test pad of the first test group, and no additional test signal is needed for the second test group. The first test pad can transmit the signal to the first test pad of the second test group, and does not cause the problem of insufficient power in the central region of the pixel region, so that the pixel array can be effectively tested.

FIG. 1 is a top view of an array substrate 10 in accordance with an embodiment of the present disclosure.

Referring to FIG. 1 , the array substrate 10 may include a substrate 100 , a first test group 110 , a second test group 120 , a third test group 130 , a fourth test group 140 , a pixel array 160 , and a connection structure 170 . The first test group 110, the second test group 120, the third test group 130, the fourth test group 140, the pixel array 160, and the connection structure 170 are located on the substrate 100. The substrate 100 is, for example, a glass substrate or a plastic substrate.

The first test set 110 includes a first test pad 112 (eg, a first test pad 1121, 1122, ...) and a second test pad 114 (eg, a second test pad 1141, 1142, ...). The first test pads 112 of the first test group 110 (for example, the first test pads 1121, 1122, ...) are electrically connected to the first driving unit 151. The second test set 120 includes a first test pad 122 (eg, a first test pad 1221, 1222...) and a second test pad 124 (eg, a second test pad 1241, 1242...). The first test pads 122 of the second test group 120 (eg, the first test pads 1221, 1222, ...) are electrically connected to the second driving unit 152 and electrically connected to the first test of the corresponding first test group 110, respectively. Pad 112 (eg, first test pads 1121, 1122...). That is, the first test pad 1121 of the first test group 110 can be electrically connected to the first test pad 1221 of the second test group 120, and the first test pad 1122 of the first test group 110 can be electrically connected to the second test. The first test pad 1222 of group 120. The first test group 110 and the second test group 120 may further include a dummy test pad (not shown). The third test group 130 and the fourth test group 140 are similar to the first test group 110 and the second test group 120 and are electrically connected to each other by another connection structure, that is, the test pads of the third test group 130 are respectively The test pads corresponding to the fourth test group 140 are electrically connected, and are not described herein.

The pixel array 160 may include a first signal line 161 and a second signal line 162. For convenience of explanation and observation, the first picture omits the drawing of the first signal line 161 and the part of the second signal line 162, and the drawing of the pixel structure is omitted. The pixel array 160 can be a thin film transistor pixel array that is well known to those skilled in the art for use in display panels. The first signal line 161 can be a scan line electrically connected between the first driving unit 151 and the second driving unit 152. The first driving unit 151 and the second driving unit 152 may both be gate driving circuits. For example, the first driving unit 151 can be electrically connected between the first signal line 1611 and the first test pad 1121. The second driving unit 152 is electrically connected between the first signal line 1611 and the first test pad 1221. Each of the first signal lines 161 extends along the X direction, and the plurality of first signal lines 1611, 1612, 1613, 1614, . . . are arranged along the Y direction. The second signal line 162 can be a data line. The plurality of second signal lines 1621, 1622, 1623, 1624, ... can be electrically connected to the corresponding second test pads 1141, 1142, ..., 1241, 1242, ..., respectively. The second signal line 162 is electrically connected to the third driving unit 153 (for example, a source driving circuit), and the third driving unit 153 is electrically connected to the first circuit board 105 (for example, a flexible circuit board), and the first The circuit board 105 can be electrically connected to the second circuit board 107 (for example, a hard circuit board). Each of the second signal lines 162 extends in the Y direction, and the plurality of second signal lines 1621, 1622, 1623, 1624, ... are arranged along the X direction. The X direction can be perpendicular to the Y direction. In an embodiment, each of the first test pads 112 and 122 is electrically connected to the plurality of first signal lines 161 through the first driving unit 151 and the second driving unit 152 respectively. Each of the second test pads 114 and 124 can be electrically connected to the plurality of second signal lines 162, respectively. In this embodiment, the third driving unit 153, the first circuit board 105, and the second circuit board 107 may be disposed on the first side 160a of the pixel array 160. The first test group 110, the second test group 120, the third test group 130, and the fourth test group 140 may be disposed outside the range of the opposite substrate (for example, a color filter; not shown) of the display panel. And, for example, it can be disposed on the second side 160b of the pixel array 160. The second side 160b can be opposite the first side 160a. In other embodiments, the first test group 110, the second test group 120, the third test group 130, the fourth test group 140, the third driving unit 153, the first circuit board 105, and the second circuit board 107 may be disposed on The first side 160a of the pixel array 160.

The connection structure 170 can be connected between at least two corresponding first test pads. For example, the connection structure 170 can electrically connect the first test pad 1121 of the first test group 110 and the first test pad 1221 of the second test group 120, or the first test pad 1122 of the first test group 110 and the The first test pads 1222 of the second test group 120 are electrically connected. The connection structure 170 can include control pads 1711, 1712, wires 1721, 1722, 1723 and switches 1731, 1732, 1733, 1734 electrically connected to each other. The wires 1721, 1722, 1723 can be composed of metal. The switches 1731, 1732, 1733, 1734 can be thin film transistors. For example, the first test pad 1121 of the first test group 110 is electrically connected to the first test pad 1221 of the second test group 120 through the switch 1731, the wire 1721, and the switch 1733. The first test pad 1122 of the first test group 110 is electrically connected to the first test pad 1222 of the second test group 120 through the switch 1732, the wire 1722, and the switch 1734. The gates of the switches 1731, 1732, 1733, and 1734 are electrically connected to each other by wires 1723 and electrically connected to the control pads 1711 and 1712. In an embodiment, if the switching signal is applied to the control pad 1711 or 1712, the switches 1731, 1732, 1733, and 1734 can be turned on together, so that the signal applied to the first test pad 1121 of the first test group 110 can be The switch 1731, the wire 1721 and the switch 1733 are transmitted to the first test pad 1221 of the second test group 120, or the signal applied to the first test pad 1221 of the second test group 120 can be passed through the switch 1733, the wire 1721 and the switch 1731. The signal is transmitted to the first test pad 1121 of the first test group 110; the signal applied to the first test pad 1122 of the first test group 110 can also be transmitted to the second test group 120 by the switch 1732, the wire 1722 and the switch 1734. The first test pad 1222 or the signal applied to the first test pad 1222 of the second test set 120 can be transmitted to the first test pad 1122 of the first test set 110 by the switch 1734, the wire 1722 and the switch 1732. In one embodiment, the control pad 1713 can be adjacent to the third test group 130 and electrically connected to the switch (not shown) of the third test group 130. The control pad 1714 can be adjacent to the fourth test group 140 and electrically The switch is connected to the fourth test group 140 (not shown). The control pad 1711 is located between the first test group 110 and the third test group 130. The control pad 1713 and the control pad 1714 are located between the third test group 130 and the fourth test group 140. The control pad 1712 is located in the example. Between the fourth test group 140 and the second test group 120. For the electrical connection relationship between the control pad 1713 and the control pad 1714 and other components, reference may be made to the foregoing description, and details are not described herein.

The array substrate 10 provided by one embodiment of the present disclosure has a first driving unit 151 and a second driving unit 152 on opposite sides (for example, the left side and the right side) of the pixel array 160, and the first test is performed by the connection structure 170. The first test pads 112 of the group 110 can be electrically connected to the first test pads 122 of the corresponding second test group 120, so that the driving signals of the first driving unit 151 and the second driving unit 152 can be connected in series. If only one side of the first test group 110 is driven for testing, that is, when the signal is transmitted through the first driving unit 151 to one end of the first signal line 1611, the same signal can also be transmitted to the corresponding interface by the connection structure 170. On one side of the second test group 120, and transmitted to the other end of the corresponding first signal line 1611 through the second driving unit 152, there is no problem of signal attenuation.

For example, when the first test signal is applied to the first test pad 1121 of the first test group 110, the first test signal can drive the first signal line 161 (for example, 1611) by the first driving unit 151, and A test signal can be transmitted to the first test pad 1221 of the second test group 120 through the connection structure 170, and then the corresponding first signal line 161 (for example, 1611) can be driven through the second drive unit 152, so that the entire first signal is The line (for example, 1611) fully obtains the first test signal and transmits it to each of the transistors (not shown) corresponding to the connected pixels in the pixel array. When the second test signal is applied to the first test pad 1122 of the first test group 110, the second test signal can drive the first signal line 161 (for example, 1612) by the first driving unit 151, and the second test signal can be The first test pad 1222 of the second test group 120 is transmitted by the connection structure 170, and the corresponding first signal line 161 (for example, 1612) is driven by the second driving unit 152, so that the entire first signal line (for example, 1612) fully obtain the second test signal and transmit it to each transistor (not shown) corresponding to the connected pixel array. In this way, the problem that the central region of the pixel array caused by the one-sided driving has an attenuation region due to insufficient thrust can be avoided, so that the pixel array on the other side can be normally driven, so that the array test can be performed.

In addition, the connection structure 170 of one embodiment of the present disclosure includes switches 1731, 1732, 1733, 1734 and control pads 1711, 1712, which can provide more signal control than the embodiment in which the switch and the control pad are not provided. The selectivity. After the array test is completed, the wires 1721, 1722 may be left on the substrate 100, or the wires 1721, 1722 may be cut off, and then the subsequent process of the display panel is performed. The embodiment of retaining the wires 1721, 1722 on the substrate 100 avoids the problem of corrosion causing the cut edges to expose the wires as compared to the comparative example of the cut wires.

FIG. 2 is a top view of the array substrate 20 in accordance with still another embodiment of the present disclosure. The array substrate 20 is similar to the array substrate 10 except that the connection structure 270 is a wire 270, and the connection structure 270 of the array substrate 20 does not have a control pad and a switch.

Referring to FIG. 2, the first test group 210, the second test group 220, the third test group 230, and the fourth test group 240 may be similar to the first test group 110, the second test group 120, and the first array substrate 10, respectively. The third test group 130 and the fourth test group 140. Connection structure 270 includes wires 2721 and 2122. The wires 2721 and 2122 can be similar to the wires 1721 and 1722 of the array substrate 10, respectively. The first test pad 2121 of the first test group 210 is electrically connected to the first test pad 2221 of the second test group 220. The first test pad 2122 of the first test group 210 is electrically connected to the first test pad 2222 of the second test group 220. When the first test signal is applied to the first test pad 2121 of the first test group 210, the first test signal can drive the first signal line 161 (for example, 1611) by the first driving unit 151, and the first test signal can be The first test pad 2221 of the second test group 220 is transmitted to the second test unit 220 by the connection structure (for example, the wire 2721), and the corresponding first signal line 161 (for example, 1611) is driven by the second drive unit 152, so that the entire first The signal line (for example, 1611) fully obtains the first test signal and transmits it to each transistor (not shown) corresponding to the connected pixel array. When the second test signal is applied to the first test pad 2122 of the first test group 210, the first test signal can be driven by the first driving unit 151 to drive the first signal line 161 (for example, 1612), and the second test signal can be The first test pad 2222 of the second test group 220 is transmitted to the second test unit 220 by the connection structure (for example, the wire 2722), and the corresponding first signal line 161 (for example, 1612) is driven by the second drive unit 152, so that the entire first The signal line (for example, 1612) sufficiently obtains the second test signal and transmits it to each of the transistors (not shown) connected to the pixel array. In this way, the central region of the pixel array caused by the one-side driving can be prevented from starting the attenuation region due to insufficient thrust, so that the pixel array on the other side can be normally driven, so that the array test can be performed.

3A-3C are side views showing a test method of the array substrate 10 in accordance with an embodiment of the present disclosure.

Referring to FIG. 3A, an array substrate 10 of the embodiment shown in FIG. 1 is provided. A first test joint 310 or a second test joint 320 to be tested on the array substrate 10 is provided. The first test connector 310 includes a first set of test probes 312 and a second set of test probes 314. The second test joint 320 includes a first set of test probes 322 and a second set of test probes 324. In this step, only the first test joint 310 or only the second test joint 320 may be provided.

Referring to FIG. 3B , the first test connector 310 approaches the array substrate 10 and is in contact with the first test group 110 and the third test group 130 , for example, the first set of test probes 312 and the second set of test probes 314 . Contacting the first test group 110 and the third test group 130 respectively, a plurality of test signals are applied and provided to the pixel array 160 (shown in FIG. 1). In an embodiment, the first test probe 312 provides the first test signal to the first test pad 1121 of the first test group 110. The first test signal can be transmitted to the pixel array 160 by the first driving unit 151. One end of the first signal line 1611 can be transmitted to the first test pad 1221 of the second test group 120 through the connection structure 170, and then transmitted to the other end of the corresponding first signal line 1611 through the second drive unit 152. (pictured in Figure 1). The first test probe 312 provides a second test signal to the first test pad 1122 of the first test group 110. The second test signal can be transmitted to the first signal line in the pixel array 160 by the first driving unit 151. One end of 1612 can be transmitted to the first test pad 1222 of the second test group 120 through the connection structure 170, and then transmitted to the other end of the corresponding first signal line 1612 through the second drive unit 152 (shown on the first Figure).

In this embodiment, the array substrate 10 can include a connection structure 170, and the connection structure 170 can include control pads 1711, 1712, wires 1721, 1722, 1723, and switches 1731, 1732, 1733, 1734 electrically connected to each other (shown in Figure 1). In one embodiment, the first test connector 310 can provide a switching signal to the control pad 1711 or 1713, and simultaneously turn on the switches 1731, 1732, 1733, and 1734, so that the wire 1721 can be electrically connected to the corresponding two first test pads. (for example, between 1121 and 1221). In other embodiments, the connection structure of the array substrate may be at least one wire, and does not include a control pad and a switch (such as the array substrate 20 of FIG. 2). The first test connector 310 only passes through the first set of test probes 312 and The second set of test probes 314 provides test signals to the first test group and the third test set, and does not provide switching signals to the array substrate.

Referring to FIG. 3C, if the first test connector 310 is not used for testing, the second test connector 320 can be used to approach the array substrate 10 and contact the second test group 120 and the fourth test group 140, for example, the first The set of test probes 322 and the second set of test probes 324 are in contact with the fourth test set 140 and the second test set 120, respectively, and a plurality of test signals are applied and provided to the pixel array 160 (shown in FIG. 1). In one embodiment, the second set of test probes 324 provides a third test signal to the first test pad 1221 of the second test set 120. The third test signal can be transmitted to the pixel array 160 by the second drive unit 152. One end of the first signal line 1611 can be transmitted to the first test pad 1121 of the first test group 110 through the connection structure 170, and then transmitted to the other end of the corresponding first signal line 1611 through the first drive unit 151 ( Shown in Figure 1). The second set of test probes 324 provides a fourth test signal to the first test pad 1222 of the second test group 120. The fourth test signal can be transmitted to the first signal line in the pixel array 160 by the second driving unit 152. One end of 1612 can be transmitted to the first test pad 1122 of the first test group 120 through the connection structure 170, and then transmitted to the other end of the corresponding first signal line 1612 through the first drive unit 151 (shown in FIG. 1 ).

In this embodiment, the second test connector 320 can provide a switching signal to the control pad 1712 or 1714, and simultaneously open the switches 1731, 1732, 1733, and 1734, so that the wires 1722 can be electrically connected to the corresponding two first test pads. (for example, between 1122 and 1222) (shown in Figure 1). In other embodiments, the connection structure of the array substrate can be at least one wire, and does not include a control pad and a switch (such as the array substrate 20 of FIG. 2). The second test connector 320 only passes through the first set of test probes 322 and The second set of test probes 324 provide test signals to the second test set and the fourth test set and do not provide switching signals to the array substrate.

One embodiment of the present disclosure provides an array substrate and a test method therefor. The array substrate of one embodiment of the present invention has a first driving unit and a second driving unit. The first test pads of the first test group are electrically connected to the first test pads of the corresponding second test group. The driving signals of the first driving unit and the second driving unit may be connected in series. When the single-side driving is performed, the driving unit on the other side can also transmit signals at the same time, so that the central region of the pixel array caused by the one-side driving can be prevented from starting the attenuation region due to insufficient thrust, so that the other side The pixel array can be driven normally, so the array test can be performed.

One embodiment of the present disclosure provides a method of testing an array substrate. The method for testing an array substrate according to an embodiment of the present invention, wherein the first test pad of the first test group is electrically connected to the first test pad of the corresponding second test group, respectively, The driving signals of the second driving unit are connected together, and when the testing operation is performed, only the single test connector can be used to contact the first test group 110 and/or the third test group 130 without being associated with the fourth test group 140 or the first test group. The two test groups 120 are in contact, or only the single test connector is used to contact the fourth test group 140 and/or the second test group 120 without contacting the first test group 110 and the third test group 130, thus avoiding The problem of not being able to simultaneously lower the needle with multiple test joints, on the other hand, can greatly reduce the test steps and time and speed up the test.

In conclusion, the present invention has been disclosed in the above embodiments, but it is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

10, 20‧‧‧ array substrate

100‧‧‧Base

105‧‧‧First board

107‧‧‧Second circuit board

110‧‧‧First Test Group

112, 122, 212, 222, 1121, 1122, ..., 1221, 1222, ..., 2121, 2122, ..., 2221, 2222...‧‧‧ first test pad

114, 1141, 1142..., 124, 1241, 1242...‧‧‧second test pad

120‧‧‧Second test group

130‧‧‧The third test group

140‧‧‧Fourth Test Group

151‧‧‧First drive unit

152‧‧‧Second drive unit

153‧‧‧3rd drive unit

160‧‧‧ pixel array

160a‧‧‧ first side

160b‧‧‧ second side

161, 1611, 1612, 1613, 1614...‧‧‧ first signal line

162, 1621, 1622, 1623, 1624...‧‧‧second signal line

170‧‧‧ Connection structure

310‧‧‧First test connector

320‧‧‧Second test connector

312, 322‧‧‧First set of test probes

314, 324‧‧‧Second test probes

1711, 1712, 1713, 1714‧‧‧ control pads

1721, 1722, 1723‧‧‧ wires

1731, 1732, 1733, 1734‧‧ switch

FIG. 1 is a top view of an array substrate in accordance with an embodiment of the present disclosure. FIG. 2 is a top view of an array substrate according to still another embodiment of the present disclosure. 3A-3C are side views showing a test method of an array substrate according to an embodiment of the present disclosure.

Claims (5)

An array substrate includes: a first test group, the first test set includes a plurality of first test pads, the first test pads of the first test set are electrically connected to a first drive unit; a test group, the second test set includes a plurality of first test pads, the first test pads of the second test set are electrically connected to a second drive unit and electrically connected to the corresponding first test group The first test pad; a pixel array, the pixel array includes a first signal line, the first signal line is electrically connected between the first driving unit and the second driving unit; and a connection a structure, the connection structure is connected between at least two corresponding first test pads, wherein the connection structure comprises one control pad electrically connected to each other, a wire and a switch, wherein the two first test pads are corresponding One of the switches is located between the switch and one of the first drive unit and the second drive unit, wherein the control pad is located between the first test group and the second test group. The array substrate of claim 1, wherein the first test group and the second test group further comprise a plurality of second test pads; the pixel array further comprises a plurality of second signal lines, The second signal line is electrically connected to the corresponding second test pads, wherein the first test group, the second test group and the control pad are all located on the same side of the pixel array. The array substrate of claim 1, wherein the control pad, the wire and the switch are located on the same side of the pixel array. A method for testing an array substrate, comprising: Providing an array substrate as described in claim 1; and contacting a test connector with the first test group to provide a plurality of test signals to the pixel array. The method of claim 4, further comprising: providing a switching signal to the control pad to turn on the switch to electrically connect the wire between the corresponding two first test pads.