TWI649795B - Display panel - Google Patents

Abstract

A display panel includes a first substrate, a second substrate, a third substrate, The first adhesive layer, the plurality of first conductive pads, the plurality of second conductive pads, and the plurality of first connection lines. The first substrate has a first sidewall, and a plurality of first signal lines are disposed on an inner surface of the first substrate and extend to the first sidewall. The second substrate is opposite to the first substrate and has a second side wall. The third substrate has a third sidewall, and the first, second, and third sidewalls are on the same side as the side of the display panel. The first adhesive layer is disposed between the first and third substrates or between the second and third substrates. The first conductive pad covers the first and second side walls of the portion and is electrically connected to the first signal line. The third sidewall of the second conductive pad covers a portion, and a distance between two adjacent first conductive pads is greater than a distance between two adjacent second conductive pads.

Description

Display panel

The present invention relates to a display panel, and more particularly to a display panel with fan-in wires.

Display panels have been widely used in different fields and environments. The common aspect ratios of screen sizes are 4: 3, 16: 9, 16:10 and other standard specifications. In order to use more applications, the display panel can be arbitrarily cut to resize the display panel. After cutting, it will still be limited by the process of the side packaging technology (such as used in the process of connecting the display panel and the circuit board). The uniformity of the temperature / pressure or the accuracy of the alignment of the two) makes the circuit board followed by the display panel with poor accuracy, which causes the display signal to be abnormal, which causes the problem of discontinuous display.

The invention provides a display panel, which can improve the problem of discontinuous display screens.

An embodiment of the invention provides a display panel. Display panel with side And includes a first substrate, a second substrate, a third substrate, a first adhesive layer, a plurality of first conductive pads, a plurality of second conductive pads, and a plurality of first connection lines. The first substrate has a first sidewall, a plurality of first signal lines are disposed on an inner surface of the first substrate, and the first signal lines extend to the first sidewall. The second substrate has a second sidewall, and the second substrate is disposed opposite to the first substrate, and a display medium layer is disposed between the first substrate and the second substrate. The third substrate has a third sidewall, and the first sidewall, the second sidewall, and the third sidewall are located on a side of the display panel. The first adhesive layer is disposed between the first substrate and the third substrate or between the second substrate and the third substrate. The first conductive pad covers at least part of the first side wall and at least part of the second side wall, respectively, wherein the first conductive pad is electrically connected to the corresponding first signal line, and the distance between two adjacent first conductive pads is Is d1. The second conductive pads respectively cover at least part of the third side wall, and a distance between two adjacent second conductive pads is d2, and d1> d2. The first connection line connects one end of one of the corresponding first conductive pads and one end of one of the corresponding second conductive pads, respectively.

Based on the above, in a display panel according to an embodiment of the present invention, the distance between two adjacent conductive pads (for example, the first conductive pad) is greater than the distance between two adjacent another conductive pads (for example, the second conductive pad). Pads) (for example, the distance d1> the distance d2), so that the pads used to connect the circuit board can be fan-in (Fan-in) from the conductive pads (eg, the first conductive pads) covering part of the first sidewall. ) To another conductive pad (eg, the second conductive pad) covering a portion of the third sidewall, such as a vertical fan-in circuit design on the side of the display panel), so that it can be used in the side packaging process Has a good process tolerance space to improve the accuracy of the circuit board and the display panel To improve the display discontinuity.

In order to make the above features and advantages of the present invention more comprehensible, embodiments are hereinafter described in detail with reference to the accompanying drawings.

100, 200, 300, 400, 500, 600‧‧‧ display panels

100a, 200a, 300a, 400a, 500a, 600a

SB1‧‧‧First substrate

SB1a‧‧‧Inner surface

SB2‧‧‧Second substrate

SB3‧‧‧The third substrate

S1‧‧‧First side wall

S2‧‧‧Second sidewall

S3‧‧‧ Third side wall

ADL1‧‧‧The first adhesive layer

ADL2‧‧‧Second Adhesive Layer

CP1‧‧‧The first conductive pad

CP2‧‧‧Second conductive pad

CP3‧‧‧The third conductive pad

CP4‧‧‧Fourth conductive pad

CP5‧‧‧Fifth conductive pad

CP6‧‧‧The sixth conductive pad

CL1‧‧‧The first connection line

CL2‧‧‧Second connection cable

SGL1‧‧‧The first signal line

SGL2‧‧‧Second Signal Line

SGL3‧‧‧The third signal line

PX‧‧‧ subpixel

TFT‧‧‧active element

PE‧‧‧Pixel electrode

TA‧‧‧Touch Array

LC‧‧‧Display media layer

LS‧‧‧Light source

FB‧‧‧Frame

BLU1, BLU2, BLU3‧‧‧ backlight module

FPC1‧‧‧The first flexible circuit board

FPC2‧‧‧Second flexible circuit board

FPC3‧‧‧The third flexible circuit board

d1, d2, d3, d4, d5, d6‧‧‧ pitch

D1‧‧‧ first direction

D2‧‧‧ Second direction

S‧‧‧Source

D‧‧‧ Drain

G‧‧‧Gate

FIG. 1 is a schematic perspective view of a display panel according to an embodiment of the present invention.

FIG. 2 is a schematic perspective view of a display panel according to another embodiment of the present invention.

3 is a schematic perspective view of a display panel according to another embodiment of the present invention.

FIG. 4 is a schematic perspective view of a display panel according to another embodiment of the present invention.

FIG. 5 is a schematic perspective view of a display panel according to another embodiment of the present invention.

FIG. 6 is a schematic perspective view of a display panel according to another embodiment of the present invention.

Hereinafter, the present invention will be explained more fully with reference to the drawings of this embodiment. However, the present invention may be embodied in various forms and should not be limited to the embodiments described herein. The thicknesses of layers and regions in the drawings are exaggerated for clarity. The same or similar reference numbers indicate the same or similar elements, and the following paragraphs will not repeat them one by one. In addition, the directional terms mentioned in the embodiments, such as: up, down, left, right, front, or rear, are only directions referring to the attached drawings. Therefore, the directional terms used are used to illustrate and not to limit the present invention.

In the drawings, the layers, films, panels, and regions have been enlarged for clarity. And other thickness. Throughout the description, the same reference numerals denote the same elements. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to a physical and / or electrical connection. However, "electrically connected" or "coupled / coupled" may mean that there are other components between the two components.

As used herein, "about", "approximately" or "substantially" includes the stated value and an average value within an acceptable deviation range of a particular value determined by one of ordinary skill in the art, taking into account the measurements in question and the measurements A specific number of related errors (ie, limitations of the measurement system). For example, "about" may mean within one or more standard deviations of the stated value, or within ± 30%, ± 20%, ± 10%, ± 5%. Furthermore, "about", "approximately" or "substantially" as used herein may select a more acceptable range of deviations or standard deviations based on optical properties, etching properties, or other properties, and all properties can be applied without one standard deviation .

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted to have meanings consistent with their meanings in the context of the related art and the present invention, and will not be interpreted as idealized or excessive Formal meaning unless explicitly defined as such in this article.

This text refers to a cross-sectional view as a schematic diagram of an idealized embodiment. Exemplary embodiment. Accordingly, variations in the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Therefore, the embodiments described herein should not be construed as limited to the particular shape of the area as shown herein, but include shape deviations caused by, for example, manufacturing. For example, a region shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, the acute angles shown may be round. Therefore, the regions shown in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of patenting.

FIG. 1 is a schematic perspective view of a display panel according to an embodiment of the present invention.

1, the display panel 100 includes a first substrate SB1, a second substrate SB2, a third substrate SB3, a first adhesive layer ADL1, a plurality of first conductive pads CP1, a plurality of second conductive pads CP2, and a plurality of First connection line CL1.

The first substrate SB1 has a first sidewall S1. In some embodiments, a plurality of first signal lines SGL1 (eg, data lines), a plurality of second signal lines SGL2 (eg, scan lines), or other suitable signals may be disposed on the inner surface SB1a of the first substrate SB1. Cables (such as common electrode cables, power supply cables, or other suitable signal cables) and multiple sub-pixel PX.

The first signal line SGL1 extends to the first sidewall S1 and is interleaved with the second signal line SGL2. In some embodiments, the plurality of first signal lines SGL1 may be arranged substantially along a predetermined direction (for example, the first direction D1) (for example, they may be arranged along an extension direction of the second signal line SGL2); The signal line SGL2 can be arranged substantially along a predetermined direction (for example, the second direction D2) (for example, it can be arranged along the extending direction of the first signal line SGL1). In this embodiment, the first signal lines SGL1 and The second signal line SGL2 can be described by taking a data line and a scan line as examples, but the present invention is not limited thereto.

A plurality of sub-pixels PX may be arrayed on the inner surface of the first substrate SB1. Each sub-pixel PX may include an active element TFT and a pixel electrode PE. The active device TFT can be electrically connected to the pixel electrode PE. The active device TFT may include a gate G, a source S, and a drain D. In some embodiments, the gate G may be electrically connected to the corresponding second signal line SGL2 (for example, a scanning line), and the source S may be electrically connected to the corresponding first signal line SGL1 (for example, a data line). The drain electrode D may be electrically connected to the corresponding pixel electrode PE. In some embodiments, the gate G and the second signal line SGL2 (for example, a scan line) may be formed by the same patterned conductive layer, and the second signal line SGL2 (for example: a scan line) and the first signal line SGL1 (for example: : Data line) can belong to different patterned conductive layers. The active device TFT can be a bottom-gate transistor, a top-gate transistor, a three-dimensional transistor, or other suitable transistors. The gate G of the bottom-gate transistor is located below the semiconductor layer (not labeled), the gate G of the top-gate transistor is located above the semiconductor layer (not labeled), and the semiconductor layer of the three-dimensional transistor (not labeled) The channel extension of) is not located on a plane. The semiconductor layer can be a single-layer or multi-layer structure, and its material includes amorphous silicon, microcrystalline silicon, nanocrystalline silicon, polycrystalline silicon, single crystal silicon, organic semiconductor materials, oxide semiconductor materials, nano carbon tubes / rods, others A suitable material, or a combination of the foregoing. In some embodiments, the pixel electrode PE may optionally further include a plurality of slits (not shown) having different extending directions or a plurality of slits having substantially the same extending direction, but the present invention is not limited thereto.

The second substrate SB2 has a second sidewall S2, and the second substrate SB2 and the first substrate SB2 The substrates SB1 are oppositely disposed. In some embodiments, a display medium layer LC, such as a liquid crystal layer, may be disposed between the first substrate SB1 and the second substrate SB2, but is not limited thereto. The display medium layer LC (for example, a liquid crystal layer) includes liquid crystal molecules that can be rotated or switched by a horizontal electric field or liquid crystal molecules that can be rotated or switched by a vertical electric field. However, the present invention is not limited to This is limited. In other embodiments, the display medium layer LC may also be a self-luminous material (for example, organic materials, inorganic materials, quantum dots / rods, perovskite and its derivatives, or other suitable materials), or in addition to liquid crystal materials. Other non-self-luminous materials (for example: electrophoresis, electro-wetting, electro-dust, or other suitable materials). In some embodiments, the first substrate SB1 may be an active array substrate, and the second substrate SB2 may be a color conversion substrate. In other embodiments, the first substrate SB1 may be an active array and color conversion substrate, and the second substrate SB2 may not be used as a color conversion substrate. The color conversion material of the color conversion substrate may be a color filter material, a quantum dot / rod, or other suitable materials, or a combination or stack of at least two of the foregoing.

The third substrate SB3 has a third side wall S3, and the first side wall S1, the second side wall S2, and the third side wall S3 are located on the side 100a of the display panel 100, and can be regarded as the first to third side walls S1 to S3 and the display panel 100. The side 100a is on the same side. In some embodiments, preferably, the first to third sidewalls S1 to S3 are substantially coplanar (eg, substantially flush) with the side 100a of the display panel 100. In some embodiments, although the first side wall S1 to the third side wall S3 are located on the side 100a of the display panel 100, at least one of the first side wall S1 to the third side wall S3 may be substantially uneven from the first side wall. At least one of the side wall S1 to the third side wall S3, wherein the unevenness The level of flatness does not affect the subsequent assembly process. In some embodiments, the size of the third substrate SB3 may be substantially the same as the size of the first substrate SB1 or the size of the first substrate SB1 and the size of the second substrate SB2. In some embodiments, the first substrate SB1 may be closer to the third substrate SB3, and the second substrate SB2 may be farther from the third substrate SB3, but is not limited thereto. In other embodiments, the second substrate SB2 may be closer to the third substrate SB3, and the first substrate SB1 may be farther from the third substrate SB3.

In some embodiments, the third substrate SB3 can be used as a light guide structure (for example, a light guide plate) of the display panel 100 so that the display panel 100 has a thin design. For example, when the display panel 100 may further include a backlight module BLU1 having a plurality of light sources LS and a frame FB accommodating the light sources LS, the frame FB may be disposed below the third substrate SB3, and the light source LS is loaded The frame FB is disposed on one side of the third substrate SB3 (for example, an edge-type backlight module). In this case, when the third substrate SB3 can be used as a light guide plate, a light guide structure (such as a light guide plate) can be omitted from the backlight module BLU1, so that the display panel 100 has a thin design. In other embodiments, the multiple light sources LS of the backlight module BLU1 may also be located below the third substrate SB3 and between the third substrate SB3 and the frame FB.

The first adhesive layer ADL1 may be disposed between the first substrate SB1 and the third substrate SB3 or between the second substrate SB2 and the third substrate SB3. In this embodiment, the first substrate SB1 is disposed between the second substrate SB2 and the third substrate SB3 as an example for description. Therefore, the first adhesive layer ADL1 may be disposed between the first substrate SB1 and the third substrate SB3. The material of the first adhesive layer ADL1 may be an insulating material, such as acrylic resin, epoxy resin, glass frit, Or other suitable materials. In some embodiments, the thickness of the first adhesive layer ADL1 is, for example, less than 100 μm, so as to prevent the first adhesive layer ADL1 from being too thick and causing obvious depressions during the side-grinding process, resulting in subsequent formation of fan-in wires (such as subsequent instructions The first connecting line CL1) mentioned above is prone to breakage.

The first conductive pad CP1 may cover at least part of the first side wall S1 and at least part of the second side wall S2, respectively. The first conductive pad CP1 is electrically connected to a corresponding signal line (for example, the first signal line SGL1). And the pitch of two adjacent first conductive pads CP1 is d1, wherein the pitch can be the distance between the center lines of two adjacent first conductive pads CP1 including two adjacent first pads A spacing of a conductive pad CP1 plus two half widths of two first conductive pads CP1 located next to a spacing or a spacing of two adjacent first conductive pads CP1 ) Add a width of the first conductive pad CP1. In some embodiments, the distance d1 between two adjacent first conductive pads CP1 may be greater than or equal to about 100 microns and less than or equal to about 700 microns (for example, 100 μm ≦ d1 ≦ 700 μm), but is not limited thereto. For example, for a 55-inch FHD display, the distance d1 between two adjacent first conductive pads CP1 may be about 210 μm, but it is not limited thereto, and the distance may be designed according to the design requirements and / or the size of the display d1. The first conductive pad CP1 may have a single-layer or multi-layer structure, and its material may include a metal, an alloy, a metal oxide, a metal nitride, a metal oxynitride, a transparent conductive material, or other suitable materials. In some embodiments, the first conductive pad CP1 may be fabricated on the side 100 a of the display panel 100 by gravure printing, pad printing, screen printing, yellow plating etching, or other suitable methods.

The second conductive pads CP2 respectively cover at least part of the third sidewall S3. The pitch of two adjacent second conductive pads CP2 is d2, and d1> d2, wherein the pitch may be two phases. The distance between the center lines of adjacent second conductive pads CP2 includes a spacing of two adjacent second conductive pads CP2 plus two second conductive pads CP2 located next to a spacing. About half the width or a spacing of two adjacent second conductive pads CP2 plus a width of a second conductive pad CP2. In this way, the display panel 100 can present a vertical fan-in circuit design on the side 100a, so that the pads used to connect the circuit board can be fanned in from the first conductive pad CP1 to the second conductive pad CP2, and so on. The side packaging process can have a good process tolerance space to improve the accuracy of the circuit board adhering to the display panel, thereby improving the problem of discontinuous display screens. In some embodiments, a distance d2 between two adjacent second conductive pads CP2 may be greater than or equal to 20 micrometers and less than or equal to 700 micrometers (for example, 20 μm ≦ d2 ≦ 700 μm), but is not limited thereto. In this embodiment, the distance d2 between two adjacent second conductive pads CP2 is described by taking 180 μm as an example. The present invention is not limited thereto, and the distance d1 may be designed according to design requirements and / or the size of the display. The second conductive pad CP2 may have a single-layer or multi-layer structure, and its material may include a metal, an alloy, a metal oxide, a metal nitride, a metal oxynitride, a transparent conductive material, or other suitable materials. In some embodiments, the second conductive pad CP2 may be fabricated on the side 100 a of the display panel 100 by gravure transfer printing, pad printing, screen printing, yellow plating etching, or other suitable methods.

It should be noted that the distance d2 between two adjacent second conductive pads CP2 must take into account multiple connection pads of the circuit board (such as the connection used to connect the second conductive pad CP2). The spacing between pads) and the stability of the process. On the other hand, if the distance d2 between two adjacent second conductive pads CP2 is too small, there will be no applicable circuit board. For example, if the spacing between the connection pads is too small, the process stability of the circuit board is not good, and the spacing between each connection pad is uneven (exceeding the allowable error).

In some embodiments, in order to ensure that the bonding area of the second conductive pad CP2 and the connection pad of the circuit board (for example, the area of the bonding pin structure) is greater than about 5000 μm ² , the height of the second conductive pad CP2 is about 300 μm; The width of the second conductive pad CP2 is, for example, about 15 μm or more and about 100 μm or less, and the thickness of the third substrate SB3 is, for example, at least about 0.7 mm to about 4 mm, but is not limited thereto.

The first connection line CL1 is respectively connected to one end of one of the corresponding first conductive pads CP1 and one end of one of the corresponding second conductive pads CP2. The first connection line CL1 may have a single-layer or multi-layer structure, and a material thereof may include a metal, an alloy, a metal oxide, a metal nitride, a metal oxynitride, a transparent conductive material, or other suitable materials. In some embodiments, the first connecting line CL1 may be fabricated on the side 100 a of the display panel 100 by gravure transfer printing, pad printing, screen printing, coating yellow etching, or other suitable methods. The width of the first connection line CL1 is, for example, about 15 μm or more and about 70 μm or less. In this embodiment, the width of the first connection line CL1 is described by taking about 20 μm as an example, but the present invention is not limited thereto. In addition, the width of each first connection line CL1 can be designed to be different in line width, length, and / or cross-sectional area, so as to compensate for the difference in resistance between the wires. If the first connection line CL1 is limited by the type of material and the formation method (for example: printing), if the line width is too small, it will cause The stability of the process is not good.

In this embodiment, one end of the first connection line CL1 is connected to the corresponding first conductive pad CP1, and extends from the first side wall S1 to the third side wall S3 (for example, the side wall passing through the first adhesive layer ADL1) , So that the other end of the first connection line CL1 is connected to the corresponding second conductive pad CP2. In this embodiment, the distance d1 between two adjacent first conductive pads CP1 is described by taking about 210 μm as an example; the width of the first connection line CL1 is described by taking about 20 μm as an example; The pitch d2 of the conductive pad CP2 is described with an example of about 180 μm. In the above-mentioned case, the height of the first connection line CL1 (for example, between the first conductive pad CP1 and the corresponding second conductive pad CP2 Vertical distance) may be at least about 1062 μm, but is not limited thereto.

In some embodiments, the display panel 100 may further include at least one first flexible circuit board FPC1. The first flexible circuit board FPC1 may be disposed on the third side wall S3 of the third substrate SB3. The first flexible circuit board FPC1 may cover at least a part of the second conductive pad CP2 and is electrically connected to the first signal line SGL1. In this way, since the display panel 100 and the first flexible circuit board FPC1 are signal-connected at the side 100a, the width of the frame can be reduced to meet the requirements of a narrow or frameless display panel. The first flexible circuit board FPC1 may include a connection pad (not shown) and a driving circuit (not shown). In some embodiments, the first flexible circuit board FPC1 may be connected to the second conductive connection pad of the first flexible circuit board FPC1 through a conductive adhesive (for example, anisotropic conductive adhesive (ACF) or other suitable conductive adhesive). The pad CP2 makes the first flexible circuit board FPC1 and the first signal line SGL1 electrically connected.

In this embodiment, the display panel 100 may include at least two first flexible circuit boards FPC1, which are respectively connected to corresponding second conductive pads CP2 (as shown in FIG. 1). In this way, the size or position of the connection pad in the first flexible circuit board FPC1 can be improved as the size of the first flexible circuit board FPC1 is enlarged, resulting in poor accuracy. In addition, since the distance d1 between two adjacent first conductive pads CP1 is greater than the distance d2 between two adjacent second conductive pads CP2 (eg, a vertical fan-in structure), two adjacent first It is difficult for a flexible circuit board FPC1 to collide with each other or the pressing mechanism to interfere with each other.

Based on the above, since the distance d1 between two adjacent first conductive pads CP1 is greater than the distance d2 between two adjacent second conductive pads CP2 (eg, d1> d2), the pads used to connect the circuit board can be The first conductive pad CP1 covering part of the first side wall S1 is fan-in to the second conductive pad CP2 covering part of the third side wall S3 (for example, the display panel 100 has a vertical fan-in circuit design on the side 100a), so When the side packaging process is performed, a good process tolerance space can be provided to improve the accuracy of the circuit board adhering to the display panel, thereby improving the problem of discontinuous display screens.

FIG. 2 is a schematic perspective view of a display panel according to another embodiment of the present invention. 3 is a schematic perspective view of a display panel according to another embodiment of the present invention. It should be noted that the display panels 200 and 300 are substantially the same as the display panel 100. The difference is that the size of the third substrate SB3 of the display panels 200 and 300 is smaller than the size of the first substrate SB1, so the same or similar components are used the same Or similar symbols, the connection relationship, materials and process of the remaining components have been described in detail in the foregoing, so they will not be repeated hereafter.

Please refer to FIGS. 2 and 3. The size of the third substrate SB3 of the display panels 200 and 300 may be smaller than that of the first substrate SB1. For example, for the side 200a of the display panel 200 (for example, the side extending along the first direction D1), the area of the third substrate SB3 on the third side wall S3 may be substantially the same as that of the first substrate SB1 on the first The area of the sidewall S1, and for the other side of the display panel 200 (for example, the side extending along the second direction D2), the area of the sidewall of the third substrate SB3 on this side may be smaller than that of the first substrate SB1 on this side. Sidewall area. In some embodiments, the display panels 200 and 300 may further include backlight modules BLU2 and BLU3, respectively. The backlight modules BLU2 and BLU3 may include a plurality of light sources LS and a frame FB accommodating the light sources LS. In this embodiment, the light source LS is described using an inorganic light emitting element, such as an inorganic light emitting diode (LED) as an example, but the present invention is not limited thereto. In other embodiments, the light source LS may also be an organic light emitting element, such as an organic light emitting diode (LED), but is not limited thereto.

In some embodiments, as shown in FIG. 2, the backlight module BLU2 of the display panel 200 is disposed below the third substrate SB3 (or considered as the first substrate SB1), and the light source LS is further disposed below the first substrate SB1. (Such as below the first substrate SB1 exposed by the third substrate SB3), and the backlight module BLU2 can be regarded as a direct type backlight module. In addition, in some embodiments, the third substrate SB3 can be used as the light guiding structure of the display panel 200. In this way, the light scattered by the light source LS to the surroundings can be concentrated on the first substrate SB1, thereby improving the light output. Furthermore, the display panel 200 can be made thinner.

In other embodiments, as shown in FIG. 3, the backlight module BLU3 of the display panel 300 is disposed below the first substrate SB1, and the backlight module BLU3 includes at least The light guide plate LG and a plurality of light sources LS disposed on one side of the light guide plate LG are included, and the backlight module BLU3 can be regarded as a side-type backlight module. Therefore, the display panel 300 can be designed to be thinner. In other embodiments, the multiple light sources LS of the backlight module BLU3 may be located below the third substrate SB3 and the light guide plate LG and between the third substrate SB3 and the frame FB and the light guide plate LG and the frame FB.

4 is a schematic perspective view of a display panel according to yet another embodiment of the present invention. The display panel 400 is substantially the same as the display panel 100. The difference is that the third substrate SB3 of the display panel 400 is disposed on the second substrate SB2. For example, the second substrate SB2 is located between the third substrate SB3 and the first substrate SB1, and the first adhesive layer ADL1 may be disposed between the third substrate SB3 and the second substrate SB2. Identical or similar components are assigned the same or similar reference numerals. The connection relationship, materials, and manufacturing process of the remaining components have been described in detail in the foregoing, so they will not be repeated hereafter. It should be noted that the backlight module BLU1 is omitted in FIG. 4 to clearly show the relative positions and connections between the multiple connection lines, multiple conductive pads, and multiple flexible circuit boards of the display panel 400 on the side 400a. relationship.

Referring to FIG. 4, the third substrate SB3 is disposed on the second substrate SB2 and can be used as a protective substrate (for example, a protective glass substrate) or a touch substrate. In this embodiment, the third substrate SB3 is described by taking a touch substrate as an example. Therefore, the display panel 400 may include a touch array TA, a plurality of third conductive pads CP3, a plurality of fourth conductive pads CP4, and A plurality of second connecting lines CL2.

The touch array TA is disposed between an inner surface of the third substrate SB3 and an outer surface of the second substrate SB2, and the touch array TA can extend to the third sidewall S3. In addition, The first adhesive layer ADL1 is disposed between an outer surface of the second substrate SB2 and an inner surface of the third substrate SB3. In some embodiments, the touch array TA may be a capacitive touch array, which is an input device controlled by the charged characteristics of a touch object (such as a finger, a pen, or other suitable touch objects). For example, when a touch object touches the touch array TA or slides on the touch array TA, the capacitance on the touch array TA will change. By detecting this change in capacitance, The cursor movement amount representing the touching object can be calculated. In other embodiments, the touch array TA may also be a resistive touch array, or other suitable touch arrays. In addition, the touch array TA may include a plurality of touch electrodes arranged in an array, and the pattern of each touch electrode may be rectangular, diamond, mesh, or other suitable patterns, which is not limited in the present invention.

The third conductive pads CP3 can respectively cover at least a part of the third sidewall S3, and the third conductive pads CP3 are electrically connected to the touch array TA. The distance between two adjacent third conductive pads CP3 is d3. In some embodiments, the distance d3 between two adjacent third conductive pads CP3 may be greater than or equal to about 50 μm and less than or equal to about 1000 μm (for example, 50 μm ≦ d3 ≦ 1000 μm), but is not limited thereto, wherein the pitch The distance between the center lines of two adjacent third conductive pads CP3 may include a spacing of two adjacent third conductive pads CP3 plus two third conductive pads located next to a spacing Each of the pads CP3 is about half the width or a spacing of two adjacent third conductive pads CP3 plus a third conductive pad CP3 width. In some embodiments, the third conductive pad CP3 may be located between two adjacent first flexible circuit boards FPC1, but is not limited thereto. The third conductive pad CP3 can further cover a part of the sidewall of the first adhesive layer ADL1. The third conductive pad CP3 may be Single-layer or multi-layer structure, and its material includes metal, alloy, metal oxide, metal nitride, metal oxynitride, transparent conductive material, or other suitable materials. In some embodiments, the third conductive pad CP3 may be fabricated on the side 400a of the display panel 400 by gravure transfer printing, pad printing, screen printing, yellow plating etching, or other suitable methods.

The fourth conductive pad CP4 may respectively cover at least a part of the third sidewall S3. The distance between two adjacent fourth conductive pads CP4 is d4, and d3> d4, wherein the pitch may be two adjacent ones. The distance between the center lines of the fourth conductive pads CP4 includes a spacing of two adjacent fourth conductive pads CP4 plus about half each of the two fourth conductive pads CP4 located next to a spacing. The width is a spacing of two adjacent fourth conductive pads CP4 plus a width of a fourth conductive pad CP4. In this way, the display panel 400 can present a vertical fan-in circuit design on the side 400a, so that the pads used to connect the circuit board are fan-in from the third conductive pad CP3 to the fourth conductive pad CP4, and then on the side The edge packaging process has a good process tolerance space, thereby improving the accuracy of the circuit board and the display panel. For example, the circuit board used to connect the fourth conductive pad CP4 does not easily collide with two adjacent first flexible circuit boards FPC1 or interfere with the pressing mechanism.

In some embodiments, a distance d4 between two adjacent fourth conductive pads CP4 may be greater than or equal to about 30 μm and less than or equal to about 700 μm (for example, 30 μm ≦ d4 ≦ 700 μm), but is not limited thereto. In some embodiments, the fourth conductive pad CP4 is located between two adjacent first flexible circuit boards FPC1, but is not limited thereto. Fourth conductive pad CP4 may be disposed on the third conductive pad CP3. The fourth conductive pad CP4 may have a single-layer or multi-layer structure, and a material thereof may include a metal, an alloy, a metal oxide, a metal nitride, a metal oxynitride, a transparent conductive material, or other suitable materials. In some embodiments, the fourth conductive pad CP4 can be fabricated on the side 400 a of the display panel 400 by gravure transfer printing, pad printing, screen printing, yellow plating etching, or other suitable methods.

The second connection line CL2 can respectively connect one end of one of the corresponding third conductive pads CP3 and one end of one of the corresponding fourth conductive pads CP4. The second connection line CL2 may have a single-layer or multi-layer structure, and its material may include a metal, an alloy, a metal oxide, a metal nitride, a metal oxynitride, a transparent conductive material, or other suitable materials. In some embodiments, the second connection line CL2 can be fabricated on the side 400 a of the display panel 400 by gravure transfer printing, pad printing, screen printing, coating yellow light etching, or other suitable methods. The width of the second connection line CL2 is, for example, about 15 μm or more and about 70 μm or less. In this embodiment, the width of the second connection line CL2 is described by taking about 20 μm as an example, but the present invention is not limited thereto. In addition, the width of each second connection line CL2 can be designed to be different, so as to compensate for the resistance difference between the wires (for example, the resistance difference caused by the different length of each second connection line CL2). If the second connection line CL2 is limited by the type of material and the forming method (for example, printing), if the line width is too small, a problem of poor process stability may occur.

In some embodiments, the display panel 400 may further include at least one second flexible circuit board FPC2. The second flexible circuit board FPC2 may be disposed on the third substrate SB3. The third sidewall S3, in which at least one second flexible circuit board FPC2 covers at least a portion of the fourth conductive pad CP4 and is electrically connected to the touch array TA. In this way, since the touch array TA and the second flexible circuit board FPC2 are signal-connected at the side 400a of the display panel 400, in addition to the requirements of a narrow or borderless display panel, the border of the display panel can be achieved. You can also achieve good touch performance. The second flexible circuit board FPC2 may include a connection pad (not shown) and a driving circuit (not shown). In some embodiments, the second flexible circuit board FPC2 may be connected to the fourth conductive connection pad of the second flexible circuit board FPC2 through a conductive adhesive (for example, anisotropic conductive adhesive (ACF) or other suitable conductive adhesive). The pad CP4 enables the second flexible circuit board FPC2 to be electrically connected to the touch array TA.

5 is a schematic perspective view of a display panel according to another embodiment of the present invention. The display panel 500 is substantially the same as the display panel 400. The difference is that the display panel 500 further includes a plurality of third signal lines SGL3, a plurality of first The five conductive pads CP5, a plurality of sixth conductive pads CP6, and a plurality of third connecting lines CL3, so the same or similar components use the same or similar reference numerals, and the connection relationships, materials and processes of the remaining components have been described in detail in the foregoing. The description is not repeated here. It should be noted that the backlight module BLU1 is also omitted in FIG. 5 to clearly show the relative positions of the multiple connection lines, multiple conductive pads, and multiple flexible circuit boards of the display panel 500 on the side 500a. Connection relationship.

Referring to FIG. 5, the display panel 500 further includes a plurality of third signal lines SGL3, a plurality of fifth conductive pads CP5, a plurality of sixth conductive pads CP6, and a plurality of third connection lines CL3.

The third signal line SGL3 is disposed on the inner surface of the first substrate SB1, and the third signal line SGL3 extends to the first side wall S1. The first signal line SGL1 and the third signal line SGL3 have different electrical signals. In some embodiments, the first signal line SGL1 and the third signal line SGL3 may be alternately arranged substantially along a predetermined direction (for example, the first direction D1) (for example, substantially along the extending direction of the second signal line SGL2) , But not limited to this.

The fifth conductive pad CP5 can cover at least part of the first side wall S1 and at least part of the second side wall S2, respectively, and the fifth conductive pad CP5 is electrically connected to the corresponding third signal line SGL3. For example, the fifth conductive pads CP5 and the first conductive pads CP1 may be alternately arranged substantially along a predetermined direction (for example, the first direction D1) (for example, they may be substantially alternated along the extending direction of the second signal line SGL2) Permutation), but is not limited to this. In addition, a distance between two adjacent fifth conductive pads CP5 is d5. In some embodiments, the distance d5 between two adjacent fifth conductive pads CP5 may be greater than or equal to about 200 μm and less than or equal to about 1400 μm (200 μm ≦ d5 ≦ 1400 μm), but is not limited thereto. The pitch may be The distance between the center lines of two adjacent fifth conductive pads CP5 includes a spacing of two adjacent fifth conductive pads CP5 plus two fifth conductive pads located next to a spacing CP5 are each about half the width or a spacing of two adjacent fifth conductive pads CP5 plus a fifth conductive pad CP5 width. In some embodiments, the fifth conductive pad CP5 may have a single-layer or multi-layer structure, and its material includes a metal, an alloy, a metal oxide, a metal nitride, a metal oxynitride, a transparent conductive material, or other suitable materials. . In some embodiments, the fifth conductive pad CP5 may be It is fabricated on the side 500 a of the display panel 500 by gravure transfer, pad printing, screen printing, yellow photo-etching, or other suitable methods.

The sixth conductive pad CP6 may respectively cover at least part of the first sidewall S1. The distance between two adjacent sixth conductive pads CP6 is d6, and d5> d6, wherein the pitch may be two adjacent ones. The distance between the center lines of the sixth conductive pads CP6 includes a spacing of two adjacent sixth conductive pads CP6 plus about half of each of the two sixth conductive pads CP6 located next to a spacing. The width is a spacing of two adjacent sixth conductive pads CP6 plus a width of a sixth conductive pad CP6. In this way, the display panel 500 can present a vertical fan-in circuit design on the side 500a, so that the pads used to connect the circuit board are fan-in from the fifth conductive pad CP5 to the sixth conductive pad CP6, and then on the side The edge packaging process has a good process tolerance space to improve the accuracy of the circuit board and the display panel, thereby improving the problem of discontinuous display screens.

In addition, the first signal line SGL1 and the third signal line SGL3 (the two have different electrical signals) disposed on the inner surface of the first substrate SB1 are electrically connected to the second conductive pad CP2 (which is disposed on The third side wall S3) and the sixth conductive pad CP6 (which is disposed on the first side wall S1), so the side packaging processes with different signal connections can be performed on the third side wall S3 and the first side wall S1, respectively. The design does not need to consider the first signal line SGL1 and the third signal line SGL3 which are alternately arranged with two different electrical signals, and there is no problem that the pressing mechanism interferes with each other.

In some embodiments, a distance d6 between two adjacent sixth conductive pads CP6 It may be about 20 μm or more and about 700 μm or less (for example, 20 μm ≦ d6 ≦ 700 μm), but is not limited thereto. In some embodiments, the sixth conductive pad CP6 may have a single-layer or multi-layer structure, and its material may include a metal, an alloy, a metal oxide, a metal nitride, a metal oxynitride, a transparent conductive material, or other suitable materials. material. In some embodiments, the sixth conductive pad CP6 can be fabricated on the side 500 a of the display panel 500 by gravure transfer printing, pad printing, screen printing, coating yellow etching, or other suitable methods.

The third connection line CL3 can respectively connect one end of one of the corresponding fifth conductive pads CP5 and one end of one of the corresponding sixth conductive pads CP6. The third connection line CL3 may have a single-layer or multi-layer structure, and its material may include a metal, a metal oxide, a metal nitride, a metal oxynitride, a transparent conductive material, or other suitable materials. In some embodiments, the third connection line CL3 may be fabricated on the side 500 a of the display panel 500 by gravure transfer printing, pad printing, screen printing, coating yellow etching, or other suitable methods. The width of the third connection line CL3 is, for example, approximately 15 μm or more and approximately 70 μm or less. In this embodiment, the width of the third connection line CL3 is described by taking about 20 μm as an example, but the present invention is not limited thereto. In addition, the width of each third connection line CL3 can be designed to be different, so as to compensate for the resistance difference between the wires (for example, the resistance difference caused by the different length of each third connection line CL3). It should be noted that the third connection line CL3 is limited by the type of material and the forming method (for example, printing). If the line width is too small, the stability of the process may be poor.

In some embodiments, the display panel 500 further includes at least one third soft Circuit board FPC3. The third flexible circuit board FPC3 is disposed on the first sidewall S1 of the first substrate SB1, and the third flexible circuit board FPC3 covers at least a portion of the sixth conductive pad CP6 and is electrically connected to the third signal line SGL3. In this way, since the display panel 500 and the third flexible circuit board FPC3 are signal-connected at the side 500a, the width of the frame can be reduced to meet the requirements of a display panel with a narrow or no frame. The third flexible circuit board FPC3 may include a connection pad (not shown) and a driving circuit (not shown). In some embodiments, the third flexible circuit board FPC3 may be connected to the sixth conductive connection of the third flexible circuit board FPC3 with a conductive adhesive (for example, anisotropic conductive adhesive (ACF) or other suitable conductive adhesive). Pad CP6 makes the third flexible circuit board FPC3 electrically connected to the third signal line SGL3.

In this embodiment, the display panel 500 may include at least two third flexible circuit boards FPC3, which are respectively connected to corresponding sixth conductive pads CP6. In this way, the size or position of the connection pads in the third flexible circuit board FPC3 can be improved as the size of the third flexible circuit board FPC3 is enlarged, resulting in poor accuracy. In addition, since the distance d5 between two adjacent fifth conductive pads CP5 is greater than the distance d6 between two adjacent sixth conductive pads CP6 (for example, presenting a vertical fan-in structure), two adjacent second The three flexible circuit boards FPC3 will not collide with each other or interfere with each other.

FIG. 6 is a schematic perspective view of a display panel according to another embodiment of the present invention. The display panel 600 is substantially the same as the display panel 200. The difference is that the display panel 600 further includes a fourth substrate SB4, so the same or similar components are used the same. Or similar symbols, the connection relationship, materials and process of the remaining components have been described above It will be described in detail, so it will not be repeated hereafter. It should be noted that the backlight module BLU2 is omitted in FIG. 6 to clearly show the relative positions and connections between the multiple connection lines, multiple conductive pads, and multiple flexible circuit boards of the display panel 600 on the side 600a. relationship.

Referring to FIG. 6, the display panel 600 further includes a fourth substrate SB4, which can be disposed on the second substrate SB2. In some embodiments, the fourth substrate SB4 has a fourth side wall S4, and the first side wall S1, the second side wall S2, the third side wall S3, and the fourth side wall S4 may be located on the side 600a of the display panel 600, and may be regarded as the first The sidewalls S1 to S4 may be on the same side as the side 600a of the display panel 600. In some embodiments, preferably, the first to fourth side walls S1 to S4 and the side 600a of the display panel 600 may be substantially coplanar (for example, substantially flush). In some embodiments, although the first side wall S1 to the fourth side wall S4 and the side 600a of the display panel 600, at least one of the first side wall S1 to the fourth side wall S4 may be substantially uneven from the first side wall. At least one of the sidewall S1 to the fourth sidewall S4, wherein the degree of unevenness does not affect the subsequent assembly process. In addition, the second adhesive layer ADL2 may be disposed between the second substrate SB2 and the fourth substrate SB4. The material of the second adhesive layer ADL2 may be an insulating material, such as an acrylic resin, an epoxy resin, a ceramic glass glue, or the like. In some embodiments, the thickness of the second adhesive layer ADL2 is, for example, less than about 100 μm, so as to prevent the second adhesive layer ADL2 from being too thick and causing a significant depression during the side-grinding process, resulting in subsequent formation of a conductive line (such as a second connection). Line CL2) is prone to breakage.

In some embodiments, the fourth substrate SB4 may serve as a protective substrate (for example: Protective glass substrate) or touch substrate. In this embodiment, the fourth substrate SB4 is described by taking a touch substrate as an example. The display panel 600 may include a touch array TA, a plurality of third conductive pads CP3, a plurality of fourth conductive pads CP4, and a plurality of The second connection line CL2 is not limited thereto.

The touch array TA is disposed between an inner surface of the fourth substrate SB4 and an outer surface of the second substrate SB2, and the touch array TA extends to the fourth sidewall S4. In some embodiments, the touch array TA may be a capacitive touch array, a resistive touch array, or other suitable touch arrays.

The third conductive pads CP3 may respectively cover at least a portion of the fourth sidewall S4, and the third conductive pads CP3 are electrically connected to the touch array TA. The distance between two adjacent third conductive pads CP3 is d3. In some embodiments, the distance d3 between two adjacent third conductive pads CP3 may be greater than or equal to about 50 μm and less than or equal to about 1000 μm (for example, 50 μm ≦ d3 ≦ 1000 μm), but is not limited thereto, wherein the pitch The distance between the center lines of two adjacent third conductive pads CP3 may include a spacing of two adjacent third conductive pads CP3 plus two third conductive pads located next to a spacing Each of the pads CP3 is about half the width or a spacing of two adjacent third conductive pads CP3 plus a third conductive pad CP3 width. In some embodiments, the third conductive pad CP3 may be partially located between two adjacent first flexible circuit boards FPC1, and the third conductive pad CP3 may cover a portion of the sidewall of the second adhesive layer ADL2. The material of the third conductive pad CP3 may be a conductive material, such as a metal, a metal oxide, a metal nitride, a metal oxynitride, or a combination thereof. In some embodiments, the third conductive pad CP3 may be intaglio A method such as transfer printing, pad printing, screen printing, or coating yellow etching is fabricated on the side 600a of the display panel 600.

The fourth conductive pads CP4 may respectively cover at least a portion of the second sidewall S2, and a distance between two adjacent fourth conductive pads CP4 is d4, and d3> d4. In some embodiments, the distance d4 between two adjacent fourth conductive pads CP4 may be greater than or equal to about 30 μm and less than or equal to about 700 μm (for example: 30 μm ≦ d4 ≦ 700 μm), but is not limited thereto, wherein the pitch The distance between the center lines of two adjacent fourth conductive pads CP4 may include a spacing of two adjacent fourth conductive pads CP4 plus two fourth conductive pads located next to a spacing The pads CP4 are each about half the width or a spacing of two adjacent fourth conductive pads CP4 plus a width of the fourth conductive pad CP4. In this way, the display panel 600 can present a vertical fan-in circuit design on the side 600a, so that the connection pads used to connect the circuit board (such as the second flexible circuit board FPC2) are fan-in from the third conductive pad CP3 to the fourth The conductive pad CP4 has a good process tolerance space when performing the side packaging process, thereby improving the accuracy of the circuit board and the display panel. For example, the circuit board used to connect the fourth conductive pad CP4 is not easy to be connected to an adjacent circuit board (such as a circuit board also disposed on the second sidewall S2) or a first flexible circuit disposed on the third sidewall S3. The plate FPC1 causes a problem of collision with each other or interference between the pressing mechanisms. In some embodiments, the fourth conductive pad CP4 may be partially located between two adjacent first flexible circuit boards FPC1, and it is disposed below the third conductive pad CP3. The fourth conductive pad CP4 may have a single-layer or multi-layer structure, and its material includes metal, alloy, metal oxide, metal nitride, metal oxynitride, and transparent conductive material. Materials, or other suitable materials. In some embodiments, the fourth conductive pad CP4 may be fabricated on the side 600a of the display panel 600 by gravure transfer printing, pad printing, screen printing, coating yellow etching, or other suitable methods.

The second connection line CL2 is respectively connected to one end of one of the corresponding third conductive pads CP3 and one end of one of the corresponding fourth conductive pads CP4. The second connection line CL2 may have a single-layer or multi-layer structure, and its material may include a metal, an alloy, a metal oxide, a metal nitride, a metal oxynitride, a transparent conductive material, or other suitable materials. In some embodiments, the second connection line CL2 can be fabricated on the side 600a of the display panel 600 by gravure transfer printing, pad printing, screen printing, coating yellow etching, or other suitable methods. The width of the second connection line CL2 is, for example, about 15 μm or more and about 70 μm or less, but is not limited thereto. In this embodiment, the width of the second connection line CL2 is described by taking about 20 μm as an example, but the present invention is not limited thereto. In addition, the width of each second connection line CL2 can be designed to be different, so as to compensate for the resistance difference between the wires (for example, the resistance difference caused by the different length of each second connection line CL2). It should be noted that the second connection line CL2 is limited by the type of material and the forming method (for example, printing), and if the line width is too small, it may cause the problem of poor stability in the production process.

In some embodiments, the display panel 600 may further include at least one second flexible circuit board FPC2. The second flexible circuit board FPC2 may be disposed on the second sidewall S2 of the second substrate SB2. At least one second flexible circuit board FPC2 may cover at least a part of the fourth conductive pad CP4 and is electrically connected to the touch array TA. In this way, since the touch array TA and the second flexible circuit board FPC2 are on the side of the display panel 600 600a performs signal connection, so in addition to meeting the requirements of narrow-frame or frameless display panels, good touch performance can also be achieved at the frame of the display panel. The second flexible circuit board FPC2 may include a connection pad (not shown) and a driving circuit (not shown). In some embodiments, the second flexible circuit board FPC2 may be connected to the fourth conductive connection pad of the second flexible circuit board FPC2 through a conductive adhesive (for example, anisotropic conductive adhesive (ACF) or other suitable conductive adhesive). The pad CP4 enables the second flexible circuit board FPC2 to be electrically connected to the touch array TA.

The foregoing embodiments of the present invention are applicable not only to display panels that have not undergone a resizing process, but also to display panels that have undergone a resizing process. If it is necessary to perform the resizing process on the finished display panel, then the substrates (eg, the first substrate SB1 and the second substrate SB2) of the manufactured display panel may be cut or cut and polished, and the substrate (For example, the first substrate SB1 and the second substrate SB2) are cut or polished as the sidewalls of the substrate (for example, the first substrate SB1 and the second substrate SB2) in the previous embodiment (for example, the first sidewall S1 and the second substrate SB2). The two side walls S2), and the subsequent related component descriptions and connection relationships can refer to the foregoing embodiments. Furthermore, if the manufactured display panel is partially removed during resizing (for example, one side, two sides, or three sides of the display panel), a seal will be formed at the removed position of the display panel. The glue can avoid the display medium layer LC (for example, liquid crystal) from being reduced (for example, lost) during the resizing process and affect the display quality of the display panel. Wherein, the original sealant still exists in the place where the display panel is not removed. Cutting or cutting and grinding the substrates of the finished display panel (for example, the first substrate SB1 and the second substrate SB2), and the display panel can be adjusted according to the position required to be adjusted. The part that can be removed at the time of the inch (for example: right part, left part, lower part, upper part, middle part of a part, or other suitable part, or a combination of at least two of the foregoing) .

In summary, in the display panel of the above embodiment, since the distance between two adjacent conductive pads (for example, the first conductive pad) is larger than the distance between two adjacent another conductive pads (for example, the second conductive pad) Pads) (for example: d1> d2), so that the pads used to connect the circuit board can be fan-in from the conductive pads (such as the first conductive pads) covering part of the first side wall to the third section Another conductive pad (such as a second conductive pad) on the side wall, for example, a vertical fan-in circuit design can be presented on the side of the display panel), so that it can have a good process tolerance when performing the side packaging process. In order to improve the accuracy of the circuit board and the display panel, the problem of discontinuous display is improved.

Although the present invention has been disclosed as above with the examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some modifications and retouching without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the attached patent application.

Claims (13)

A display panel having one side includes: a first substrate having a first side wall; a plurality of first signal lines are disposed on an inner surface of the first substrate; and the first signal lines extend to the first A side wall; a second substrate having a second side wall, and the second substrate is disposed opposite to the first substrate, and a display medium layer is disposed between the first substrate and the second substrate; a third substrate, Having a third side wall, and the first side wall, the second side wall and the third side wall are located on the side of the display panel; a first adhesive layer is disposed between the first substrate and the third substrate or Between the second substrate and the third substrate; a plurality of first conductive pads respectively covering at least part of the first side wall and at least part of the second side wall, wherein the first conductive pads and corresponding ones The first signal lines are electrically connected, and a distance between two adjacent first conductive pads is d1. A plurality of second conductive pads respectively cover at least part of the third side wall, and two adjacent The distance between these second conductive pads is d2, and d1> d2 And a plurality of first connection lines, wherein the end of one end of one of the first conductive respectively connected to corresponding pads and the corresponding second conductive pads. The display panel according to item 1 of the scope of patent application, further comprising: at least a first flexible circuit board disposed on a third side wall of the third substrate, wherein the at least one first flexible circuit board covers the second conductive layers At least a part of the pad is electrically connected to the first signal lines. The display panel according to item 1 of the scope of patent application, wherein a size of the third substrate is smaller than a size of the first substrate. The display panel according to item 3 of the scope of patent application, wherein the third substrate is used as a light guide structure of the display panel. The display panel according to item 4 of the scope of the patent application, further includes a backlight module disposed below the third substrate, and the backlight module includes at least a plurality of light sources and a frame housing the light sources. The display panel according to item 4 of the scope of patent application, further includes a backlight module disposed below the first substrate, and the backlight module includes at least a light guide plate and a plurality of light guide plates disposed on one side of the light guide plate. light source. The display panel according to item 1 of the scope of patent application, further comprising: a touch array disposed between an inner surface of the third substrate and an outer surface of the second substrate, and the touch array extending to the first substrate. Three side walls, and the first adhesive layer is disposed between the outer surface of the second substrate and the inner surface of the third substrate; a plurality of third conductive pads respectively covering at least a part of the third side wall, and A third conductive pad is electrically connected to the touch array, and a distance between two adjacent third conductive pads is d3; a plurality of fourth conductive pads respectively cover at least a part of the third sidewall, wherein The distance between two adjacent fourth conductive pads is d4, and d3> d4; and a plurality of second connecting lines are respectively connected to one end of the corresponding third conductive pads and the corresponding one of the third conductive pads. One end of one of the fourth conductive pads. The display panel according to item 7 of the scope of patent application, further comprising: at least a second flexible circuit board disposed on the third side wall of the third substrate, wherein the at least one second flexible circuit board covers the fourth conductive layers At least a part of the pad is electrically connected to the touch array. The display panel according to item 8 of the scope of patent application, further comprising: a plurality of second signal lines disposed on the inner surface of the first substrate, and the second signal lines extending to the first side wall, wherein the first A signal line and the second signal lines have different electrical signals; a plurality of fifth conductive pads respectively cover at least part of the first side wall and at least part of the second side wall, and the fifth conductive pads Are electrically connected to the corresponding second signal lines, wherein the distance between two adjacent fifth conductive pads is d5; a plurality of sixth conductive pads respectively cover at least part of the first side wall, two of which The distance between adjacent sixth conductive pads is d6, and d5> d6; and a plurality of third connecting lines are respectively connected to one end of one of the corresponding fifth conductive pads and the corresponding one. One end of one of the sixth conductive pads. The display panel according to item 9 of the scope of patent application, further comprising: at least one third flexible circuit board disposed on the first side wall of the first substrate, and the at least one third flexible circuit board covering the sixth conductive layers. At least a part of the pad is electrically connected to the second signal lines. The display panel according to item 1 of the patent application scope further includes: a fourth substrate having a fourth side wall, and the first side wall, the second side wall, the third side wall, and the fourth side wall are located on the display; The side of the panel, wherein the first adhesive layer is disposed between the first substrate and the third substrate; a second adhesive layer is disposed between the second substrate and the fourth substrate; a touch array Is disposed between the inner surface of the fourth substrate and the outer surface of the second substrate, and the touch array extends to the fourth side wall; a plurality of third conductive pads respectively cover at least part of the fourth side wall Wherein the third conductive pads are electrically connected to the touch array, and a distance between two adjacent third conductive pads is d3; a plurality of fourth conductive pads respectively cover at least part of the first conductive pads. Two side walls, wherein a distance between two adjacent fourth conductive pads is d4, and d3> d4; and a plurality of second connecting lines, respectively, connecting one of the corresponding third conductive pads One end and one of the corresponding fourth conductive pads End. The display panel according to item 11 of the scope of patent application, further comprising: at least one first flexible circuit board disposed on the third side wall of the third substrate, wherein the at least one first flexible circuit board covers the second conductive layers At least a part of the pad is electrically connected to the first signal lines. The display panel according to item 12 of the scope of patent application, further comprising: at least a second flexible circuit board disposed on the second side wall of the second substrate, wherein the at least one second flexible circuit board covers the fourth At least a part of the conductive pad is electrically connected to the touch array.