TWI647985B - Circuit board automatic cutting apparatus and method - Google Patents

Abstract

The invention discloses a circuit board automatic cutting device and method, and belongs to the technical field of cutting. The utility model comprises a mechanical arm, a photographing unit, a displacement sensor, a cutting unit, and a control unit connected with the robot arm, the photographing unit, the displacement sensor and the cutting unit, and the vacuum chuck is arranged on the robot arm; Position information of the cutting groove on the circuit board, and sensing the groove bottom line of the cutting groove on the circuit board by the displacement sensor, and adjusting the relative movement of the robot arm and the cutting unit in the depth direction of the cutting groove by the control unit, The cutting unit makes the cutting depth of the cutting board consistent according to the position information of the cutting groove.

Description

Circuit board automatic cutting device and method

The present invention relates to the field of cutting technology, and in particular to a circuit board automatic cutting apparatus and method.

At present, in the production process of printed circuit boards, in order to improve production efficiency and cost, a plurality of single-chip printed circuit boards are usually combined on one substrate to form a multi-piece printed circuit board for production, and in multiple pieces. After the printed circuit board completes the patch and the plug-in program, the multi-piece printed circuit board is cut to be divided into a plurality of single-chip printed circuit boards. FIG. 1 is a schematic diagram of a multi-chip circuit board having a plurality of cutting grooves 1 cut into a plurality of single sheets by cutting the cutting blades along the cutting grooves 1 on the circuit board. Piece of printed circuit board.

In the prior art, the working method of cutting the multi-piece printed circuit board is manual operation, and the operator needs to hold the circuit board with both hands, and the cutting slot of the circuit board is caught between the upper blade and the lower blade in the cutting device. After the card is clamped, the foot switch is manually stepped on, the upper blade moves laterally, and the circuit board is cut and separated by the upper and lower blades to complete the cutting action on the multi-piece circuit board.

Due to the low degree of automation of the existing circuit board cutting equipment and the labor requirements of the operator, there is a problem that the cutting efficiency of the circuit board is low and the labor cost is high.

The invention relates to a circuit board automatic cutting device and method for improving the efficiency of circuit board cutting and saving labor cost.

According to a first aspect of the present invention, a circuit board automatic cutting apparatus is provided, including a mechanical arm, a photographing unit, a displacement sensor, and a cutting unit, and further comprising: the mechanical arm, the photographing unit, and the displacement sensor a control unit connected to the cutting unit, the mechanical arm is mounted with a vacuum chuck; wherein: the mechanical arm is configured to move a circuit board adsorbed to the vacuum chuck relative to the cutting unit for The cutting unit performs cutting on the circuit board; the photographing unit is configured to photograph the circuit board adsorbed on the vacuum chuck to obtain position information of the cutting slot on the circuit board; the displacement sensing And a bottom line for sensing the cutting groove of the cutting groove adsorbed on the circuit board of the vacuum chuck; the control unit is configured to be at a depth of the cutting groove according to a groove bottom line of the cutting groove Adjusting, in direction, the mechanical arm to move relative to the cutting unit to make a cutting depth consistent when cutting the circuit board; the cutting unit is configured to use position information according to the cutting slot With respect to the cutting unit for moving the cutting board.

In conjunction with the first aspect, in a first possible implementation, the displacement sensor senses a groove bottom line of the cutting groove in a non-contact manner.

In conjunction with the first aspect, in a second possible implementation, in a depth direction of the cutting slot, the control unit adjusts the mechanical arm to perform the opposite direction to the cutting unit in a direction opposite to the change in the bottom line of the groove mobile.

In conjunction with the second possible implementation of the first aspect, in a third possible implementation, the control unit identifies an inflection point of a groove bottom line of the cutting slot; when the inflection point is higher than a reference plane In the inflection point, the control unit adjusts a depth direction movement of the mechanical arm away from the cutting groove; when the inflection point is a lower inflection point lower than the reference surface, the control unit adjusts the orientation of the mechanical arm The depth direction of the cutting groove is moved.

In combination with the first aspect, in a fourth possible implementation, a flatness detector is further included; the flatness detector is configured to detect the flatness information of the vacuum chuck after the vacuum chuck is mounted to the mechanical arm .

In a second aspect, a circuit board automatic cutting method is provided, which utilizes the circuit board automatic cutting device of the present invention, the method comprising: taking a picture of the circuit board adsorbed on the vacuum chuck to obtain the circuit board Position information of the cutting groove; and sensing a groove bottom line of the cutting groove adsorbed on the circuit board of the vacuum chuck; Adjusting, according to the groove bottom line of the cutting groove, the movement of the mechanical arm relative to the cutting unit in a depth direction of the cutting groove, so that the cutting unit cuts the circuit according to position information of the cutting groove The cutting depth is the same when the board is used.

In conjunction with the second aspect, in a first possible implementation, the sensing a groove bottom line of the cutting groove on the circuit board comprises: sensing a groove bottom line of the cutting groove in a non-contact manner.

With reference to the second aspect, in a second possible implementation, the adjusting the movement of the mechanical arm relative to the cutting unit in the depth direction of the cutting slot according to the groove bottom line of the cutting groove comprises: In the depth direction of the cutting groove, the mechanical arm is adjusted to move relative to the cutting unit in a direction opposite to a change in the groove bottom line.

In conjunction with the second possible implementation of the second aspect, in a third possible implementation, the adjusting the mechanical arm in a direction opposite to the bottom line of the groove in the depth direction of the cutting slot Moving relative to the cutting unit includes: identifying an inflection point of the groove bottom line of the cutting groove; adjusting the depth direction of the mechanical arm facing the cutting groove when the inflection point is an upper inflection point higher than the reference surface When the inflection point is lower than the lower inflection point of the reference plane, the mechanical arm is adjusted to move in the depth direction of the cutting groove.

With reference to the second aspect, in a fourth possible implementation, the method further includes: The flatness information of the vacuum chuck is detected after the vacuum chuck is mounted to the robot arm.

In order to better understand the above and other aspects of the present invention, the following detailed description of the embodiments and the accompanying drawings

1‧‧‧Cutting trough

2‧‧‧Transport belt

10‧‧‧Feeding unit

20‧‧‧ mechanical arm

21‧‧‧vacuum suction cup

30‧‧‧Photo unit

40‧‧‧Cutting unit

41‧‧‧Rotary cutter

42‧‧‧ fixed seat

43‧‧‧Motor

44‧‧‧ shaft

50‧‧‧ Displacement Sensor

60‧‧‧ flatness detector

S51~S53‧‧‧Steps

1 is a schematic view of a multi-chip circuit board of the prior art; FIG. 2 is a plan view of an automatic cutting device for a circuit board according to an embodiment of the present invention; and FIG. 3 is a side view of an automatic cutting device for a circuit board provided by an embodiment of the present invention; FIG. 4 is a schematic structural view of a cutting unit according to an embodiment of the present invention; FIG. 5 is a flow chart of a method for automatically cutting a circuit board according to an embodiment of the present invention.

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. Some embodiments of the invention, rather than all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

Embodiment 1

Embodiments of the present invention provide a circuit board automatic cutting device for automatically cutting a multi-piece circuit board to be divided into a plurality of single-chip boards. Referring to FIG. 2 and FIG. 3, the circuit board automatic cutting device is provided. The utility model comprises a frame (not labeled), a feeding unit 10, a robot arm 20, a photographing unit 30, a cutting unit 40, a displacement sensor 50 and a control unit (not shown); wherein the feeding unit 10, the robot arm 20, The photographing unit 30, the cutting unit 40, and the displacement sensor 50 are all electrically connected to the control unit; the robot arm 20, the photographing unit 30, the cutting unit 40, and the displacement sensor 50 are all mounted on the frame, and the control unit is installed on the machine. The interior of the rack.

The vacuum arm 21 is mounted on the robot arm 20, and the vacuum chuck 21 is detachably mounted on the free end (ie, the gripping end) of the robot arm 20. The mechanical arm 20 can suck, adsorb and release the circuit board by the vacuum chuck 21. In practical applications, in order to fully adsorb the circuit board, vacuum chucks matching the size specifications of the circuit board can be installed according to different processing machines.

The robot arm 20 is for moving the circuit board adsorbed to the vacuum chuck 21 relative to the cutting unit 40 for the cutting unit 40 to cut the circuit board. Specifically, after the circuit board is transported from the previous workstation to the feeding unit 10 and raised to a height by the lifting mechanism of the feeding unit 10, the robot arm 20 is supplied by the vacuum chuck 21 under the control of the control unit. The circuit board 10 picks up the circuit board, and the adsorption circuit board moves to the top of the photographing unit 30, so that the photographing unit 30 takes a picture of the circuit board, and at the same time, the displacement sensor 50 is adapted to sense the groove bottom line of the cutting groove on the circuit board; Then, the robot arm 20 moves the circuit board adsorbed to the vacuum chuck 21 relative to the cutting unit 40. The cutting unit 40 cuts the circuit board and moves the cut circuit board to the conveyor belt 2.

By the operation of the mechanical arm and the vacuum chuck, it is not necessary to rely on manual operation during the cutting process of the circuit board, which saves labor cost and improves the cutting efficiency of the circuit board. Preferably, the mechanical arm is a six-axis robot, and the six-axis robot has the characteristics of high operational precision when cutting the circuit board.

The photographing unit 30 is fixedly mounted at a middle position of the surface of the rack, and is disposed close to the end side of the feeding unit 10. When the robot arm 20 is moved to the upper side of the photographing unit 30 by the vacuum chuck 21, the photographing unit 30 takes an image of the circuit board from below the circuit board to obtain the position information of the cutting groove on the circuit board, wherein The image of the circuit board can be sent to the control unit by the photographing unit 30, and the received image is processed by the control unit, and the position information of the cutting slot of the circuit board is obtained according to the processing result. The circuit board image captured by the photographing unit 30 may be an overall image of the circuit board, or may be a plurality of area images obtained by respectively capturing a plurality of areas of the circuit board, and send the plurality of area images to the image. The control unit processes the plurality of area images by the control unit and acquires position information of the cutting slots of the circuit board according to the processing result.

Preferably, the photographing unit 30 is a CCD (charge coupled device) camera or a CMOS (Complementary Metal Oxide Semiconductor) camera to ensure the captured image quality of the circuit board.

Taking photos of the circuit board adsorbed on the vacuum chuck 21 by the photographing unit 30 to obtain the position information of the cutting groove of the circuit board, thereby entering the circuit board There is no need to manually align the cutting grooves on the circuit board with the cutting unit during cutting, which saves labor costs.

Continuing to refer to FIG. 2 and FIG. 3 , the displacement sensor 50 and the photographing unit 30 are fixedly mounted on the frame in parallel and close to the cutting unit 40 , and the displacement sensor 50 is configured to sense the circuit adsorbed to the vacuum chuck 21 . The groove bottom line of the cutting groove on the board, when a plurality of cutting grooves are distributed on the circuit board, the displacement sensor 50 simultaneously senses the groove bottom line of each cutting groove. In this embodiment, the cutting groove is a V-CUT groove (generally a PCB material) at the junction of the circuit board contig, and the groove bottom line is a position in the V-CUT groove aligned with the cutting.

Due to the unbalanced adsorption force of the vacuum chuck 21 on the circuit board, the circuit board may be deformed, and the points on the bottom line of the cutting groove may have different displacements in the depth direction of the cutting groove, so that the displacement is sensed. The detector senses the bottom line of the cutting groove of the cutting plate adsorbed on the vacuum chuck, which can facilitate the subsequent control unit to adjust the relative movement of the robot arm and the cutting unit according to the groove bottom line in the depth direction of the cutting groove, thereby avoiding the inconsistent adsorption force of the vacuum suction cup. The resulting problem of different cutting depths ensures the cutting quality of the board.

In order to enhance the accuracy of the displacement sensor 50 sensing the groove bottom line of the cutting groove, and further ensuring the cutting precision of the circuit board, preferably, the displacement sensor 50 senses the groove bottom line of the cutting groove in a non-contact manner.

Referring to FIG. 2, the cutting unit 40 is disposed opposite to the robot arm 20 in a recessed structure of the frame, and the cutting unit 40 is configured to perform a circuit board moving relative to the cutting unit 40 according to the position information of the cutting slot. Cutting.

Referring to Fig. 4, the cutting unit 40 includes a rotary cutter 41, a fixed seat 42 and a motor 43 and a rotary shaft 44 which are disposed on the fixed base 42, the rotary shaft 44 is horizontally disposed, and the rotary cutter 41 is mounted on the rotary shaft 44, wherein the rotary cutter The thickness of 41 is less than or equal to the width of the cutting groove, and the circumference of the rotary cutter 41 is provided with serrations, and the serrations are evenly distributed. Thus, it is possible to avoid the occurrence of burrs and burrs when cutting the circuit board, thereby ensuring the cutting quality of the circuit board.

Under the driving of the motor 43, the rotating shaft 44 drives the rotating cutter 41 to rotate to cut the circuit board along the cutting groove in a predetermined rotating direction. For example, the rotation direction of the rotary cutter 41 can be set such that when the robot arm 20 moves the circuit board from the left to the right relative to the cutting unit 40 by the vacuum chuck 21, the rotary cutter 41 rotates in the counterclockwise direction to cut the circuit board to be cut. The path may also set the rotation direction of the rotary cutter 41 to be such that when the robot arm 20 moves the circuit board from the right to the left relative to the cutting unit 40 by the vacuum chuck 21, the rotary cutter 41 rotates in the clockwise direction to cut the circuit board. The path to be cut is not limited in this embodiment of the present invention.

The control unit is connected to the robot arm 20, the photographing unit 30, the cutting unit 40 and the displacement sensor 50, and the control unit is configured to adjust the mechanical arm 20 relative to the cutting unit in the depth direction of the cutting slot according to the groove bottom line of the cutting groove. 40 is moved so that the cutting depth when cutting the board is uniform. Specifically, in the depth direction of the cutting groove, the control unit adjustment robot 20 moves relative to the cutting unit 40 in the opposite direction to the change in the groove bottom line. More specifically, the control unit adjusts the relative movement of the robot arm 20 and the cutting unit 40 in the depth direction of the cutting groove by recognizing the inflection point on the groove bottom line of the cutting groove. Among them, when the inflection point is higher than the reference plane When the upper inflection point is reached, the control unit adjusts the movement of the mechanical arm 20 away from the cutting groove in the depth direction; when the inflection point is the lower inflection point lower than the reference surface, the control unit adjusts the movement of the robot arm 20 toward the depth direction of the cutting groove. Preferably, the reference plane is a plane parallel to the cutting unit 40, such as a horizontal plane, but the invention is not limited thereto.

In this way, by the control unit adjusting the relative movement of the robot arm and the cutting unit in the depth direction of the cutting groove according to the groove bottom line, it is possible to avoid the inconsistent cutting depth of the circuit board due to the unbalanced adsorption force of the vacuum chuck acting on the circuit board. The problem is to ensure the cutting quality of the board.

Further, referring to FIG. 2 and FIG. 3, the circuit board automatic cutting device further includes a flatness detector 60, and the flatness detector 60 is sequentially mounted on the rack in parallel with the photographing unit 30 and the displacement sensor 50. And the flatness detector 60 is close to the cutting unit 40. The flatness detector 60 is for detecting the flatness information of the vacuum chuck 21 after the vacuum chuck 21 is attached to the robot arm 20. Specifically, the vacuum chuck 21 has a fixing frame and a plurality of uniformly arranged suction cups, and the plurality of suction cups are fixed to the fixing frame, and the fixing frame is detachably coupled to the mechanical arm 20. Each time the vacuum chuck 21 needs to be replaced for processing different types of machines, the vacuum chuck 21 to be adapted to the corresponding model is mounted on the robot arm 20 by the fixing frame, and the flat arm is used before the robot arm 20 is operated to grasp the circuit board. The degree detector 60 detects the flatness of the holder to prevent the deformation of the vacuum chuck 21 from causing unevenness in the front stage of the robot arm 20 when the board is taken. The flatness detector 60 may be a laser leveler; when the detected flatness information is uneven, the warning information is output to alert the relevant personnel to adjust the vacuum chuck 21 until the vacuum chuck 21 is flat.

The embodiment of the invention provides an automatic cutting device for a circuit board. Since the operation of the vacuum suction cup by the mechanical arm enables the manual operation in the circuit board cutting process, the labor cost is saved and the cutting efficiency of the circuit board is improved. In addition, the circuit board sucked on the vacuum chuck is photographed by the photographing unit to obtain the position information of the cutting groove of the circuit board, thereby eliminating the need to manually cut the cutting groove on the circuit board when cutting the circuit board. The unit saves the labor cost; in addition, the displacement sensor senses the groove bottom line of the cutting groove adsorbed on the vacuum chuck, and the control unit adjusts the arm and the cutting unit according to the groove bottom line in the depth direction of the cutting groove. Relative movement, so that the cutting unit cuts the circuit board according to the position information of the cutting groove, so that the problem of different cutting depth due to the inconsistent adsorption force of the vacuum suction cup can be avoided, thereby ensuring the cutting quality of the circuit board.

Embodiment 2

Based on the same inventive concept as the circuit board automatic cutting device in the first embodiment, the embodiment of the present invention further provides a circuit board automatic cutting method, which utilizes the circuit board automatic cutting device in the first embodiment, as shown in FIG. 5, the method The process is described as follows:

S51: Taking a picture of the circuit board adsorbed on the vacuum chuck 21 to obtain the position information of the cutting groove on the circuit board.

Specifically, when the mechanical arm 20 moves the suction board to the upper side of the photographing unit 30 by the vacuum chuck 21, the photographing unit 30 photographs the circuit board adsorbed on the vacuum chuck 21 to obtain the position information of the cutting groove on the circuit board.

S52: Sense the groove bottom line of the cutting groove adsorbed on the circuit board of the vacuum chuck 21.

Specifically, the groove bottom line of the cutting groove is sensed in a non-contact manner.

In this way, the accuracy of the displacement sensor 50 sensing the groove bottom line of the cutting groove can be enhanced to further ensure the cutting precision of the circuit board.

It should be noted that, in the embodiment of the present invention, the execution order of step S51 and step S52 is not specifically limited. In practical applications, step S51 and step S52 are simultaneously performed, which is a preferred solution to further improve the cutting efficiency of the circuit board.

S53: The mechanical arm 20 is moved relative to the cutting unit 40 in the depth direction of the cutting groove, so that the cutting unit 40 has the same cutting depth when cutting the circuit board according to the position information of the cutting groove.

Specifically, the process may include: in the depth direction of the cutting groove, the adjustment robot 20 moves relative to the cutting unit 40 in a direction opposite to the change in the groove bottom line.

Wherein, in the depth direction of the cutting groove, the process of adjusting the movement direction of the mechanical arm 20 relative to the cutting unit 40 in the opposite direction to the change of the groove bottom line may include: identifying an inflection point of the groove bottom line of the cutting groove; and when the inflection point is higher than the reference surface When the upper inflection point is reached, the adjustment arm 20 moves in the depth direction away from the cutting groove; when the inflection point is the lower inflection point lower than the reference surface, the adjustment arm 20 moves toward the depth direction of the cutting groove.

The reference plane is a plane parallel to the cutting unit 40, such as a horizontal plane, but the invention is not limited thereto. It is also possible to use a point at which the curvature value on the bottom line of the groove exceeds the preset curvature threshold as an inflection point, for example, a curve in which the cutting groove of the circuit board adsorbed on the vacuum chuck 21 is wavy, and the surface of the reference surface corresponding to the preset curvature threshold is located. The upper inflection point is a point in which the positive direction exceeds the preset curvature threshold, and the lower inflection point is a point in which the negative direction exceeds the preset curvature threshold. The preset curvature threshold can be set according to actual needs. The smaller the preset curvature threshold is, the more inflection points are identified, and the more the cutting depth of the subsequent circuit board is ensured.

In the embodiment of the present invention, by adjusting the inflection point on the bottom line of the groove of the cutting groove, the relative movement of the robot arm and the cutting unit is adjusted in the depth direction of the cutting groove, thereby reducing the amount of calculation of the data of the control unit, and improving The adjustment speed of the arm also ensures the same cutting depth when the cutting unit cuts the board.

Due to the unbalanced adsorption force of the vacuum chuck 21 on the circuit board, the circuit board may be deformed, and the points on the bottom line of the cutting groove may have different displacements in the depth direction of the cutting groove. The bottom line of the groove is non-linear, and the bottom line of the groove may be decomposed into curved lines and/or wavy lines and/or circular lines and/or trapezoidal lines. The control unit adjusts the relative movement of the robot arm to the cutting unit in the depth direction of the cutting groove according to the linear change of the groove bottom line, thereby enabling the cutting depth of the circuit board to be kept uniform.

Preferably, the automatic cutting method of the circuit board further includes: The flatness information of the vacuum chuck 21 is detected after the vacuum chuck 21 is attached to the robot arm 20.

Specifically, the vacuum chuck 21 has a fixing frame and a plurality of uniformly arranged suction cups, and the plurality of suction cups are fixed to the fixing frame, and the fixing frame is detachably coupled to the mechanical arm 20. Each time the vacuum chuck 21 needs to be replaced for processing different types of machines, the vacuum chuck 21 to be adapted to the corresponding model is mounted on the robot arm 20 by the fixing frame, and the flat arm is used before the robot arm 20 is operated to grasp the circuit board. The degree detector 60 detects the flatness of the holder to prevent the deformation of the vacuum chuck 21 from causing unevenness in the front stage of the robot arm 20 when the board is taken.

Specifically, the flatness detector 60 detects the flatness information of the vacuum chuck 21, and the flatness detector 60 can be a laser leveler; when the detected flatness information is uneven, the warning information is output to warn the relevant The person adjusts the vacuum chuck 21 until it is ensured that the vacuum chuck 21 is flat.

In the embodiment of the present invention, by detecting the flatness information of the vacuum chuck 21, it is possible to avoid the occurrence of unevenness in the front stage of the mechanical arm 20 due to the unevenness of the vacuum chuck 21, and the cutting depth of the subsequent circuit board is inconsistent. .

In the automatic cutting method of the circuit board provided by the present invention, the circuit board automatic cutting device of the present invention is used to obtain the position information of the cutting groove on the circuit board by photographing the circuit board adsorbed on the vacuum chuck, and sensing the circuit board. The groove bottom line of the cutting groove, and the adjustment arm of the cutting groove in the depth direction of the cutting groove The movement is such that the cutting unit has the same cutting depth when cutting the circuit board according to the position information of the cutting groove. Compared with the prior art, the technical solution provided by the present invention does not need to rely on manual corresponding operation in the circuit board cutting process, thereby realizing mechanical automatic cutting of the multi-piece circuit board, thereby improving the cutting efficiency and saving of the circuit board. Labor cost; in addition, by adjusting the depth direction of the cutting groove in the direction opposite to the change of the bottom line of the groove according to the groove bottom line of the cutting groove, the adsorption force acting on the circuit board due to the vacuum chuck can be avoided. The problem of inconsistent cutting depth of the board caused by the imbalance, thereby ensuring the cutting quality of the board.

All of the above optional technical solutions may be used in any combination to form an optional embodiment of the present invention, and will not be further described herein.

It should be noted that, in the automatic cutting method of the circuit board provided by the above embodiment, only the division of each functional module is illustrated. In practical applications, the above functions may be allocated according to requirements. The different functional modules are completed, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above. In addition, the circuit board automatic cutting device and the circuit board automatic cutting method embodiment provided by the above embodiments are the same concept, and the specific implementation process is described in detail in the method embodiment, and details are not described herein again.

Those skilled in the art can understand that all or part of the steps of implementing the above embodiments may be implemented by hardware, or may be executed by a program to execute related hardware, and the program may be stored in a computer readable storage. In the medium, the above-mentioned storage medium may be a read-only memory, a magnetic sheet or a compact disc or the like.

The circuit board automatic cutting device provided by the present invention utilizes the circuit board automatic cutting device of the present invention, the circuit board automatic cutting device comprises a mechanical arm, a photographing unit, a displacement sensor, a cutting unit, and a mechanical arm and a photographing unit. a control unit connected to the displacement sensor and the cutting unit, the vacuum chuck is provided on the robot arm; the position information of the cutting groove on the circuit board is obtained by photographing the photographing unit, and the cutting on the circuit board is sensed by the displacement sensor The groove bottom line of the groove, and the movement of the control arm relative to the cutting unit in the depth direction of the cutting groove by the control unit, so that the cutting unit has the same cutting depth when cutting the circuit board according to the position information of the cutting groove. Compared with the prior art, the technical solution provided by the invention does not need to rely on manual corresponding operation in the circuit board cutting process, thereby realizing mechanical automatic cutting of the multi-piece circuit board, thereby improving the cutting efficiency of the circuit board and saving labor cost. In addition, by adjusting the relative movement of the robot arm and the cutting unit in the depth direction of the cutting groove according to the groove bottom line of the cutting groove, it is possible to avoid the circuit board caused by the unbalanced adsorption force acting on the circuit board by the vacuum chuck. The problem of inconsistent cutting depth ensures the cutting quality of the board.

In conclusion, the present invention has been disclosed in the above embodiments, but it is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

Claims (10)

A circuit board automatic cutting device comprising a mechanical arm, a photographing unit, a displacement sensor and a cutting unit, and further comprising a control connected to the mechanical arm, the photographing unit, the displacement sensor and the cutting unit a vacuum chuck is mounted on the robot arm; wherein: the mechanical arm is configured to move a circuit board adsorbed to the vacuum chuck relative to the cutting unit for the cutting unit to the circuit board Performing a cutting; the photographing unit is configured to photograph the circuit board adsorbed on the vacuum chuck to obtain position information of the cutting slot on the circuit board; and the displacement sensor is configured to sense the adsorption a groove bottom line of the cutting groove on the circuit board of the vacuum chuck; the control unit configured to adjust the relative position of the robot arm in a depth direction of the cutting groove according to a groove bottom line of the cutting groove The cutting unit is moved to make the cutting depth when cutting the circuit board uniform; the cutting unit is configured to move relative to the cutting unit according to position information of the cutting groove The cutting board. The circuit board automatic cutting device of claim 1, wherein the displacement sensor senses a groove bottom line of the cutting groove in a non-contact manner. The automatic board cutting device according to claim 1, wherein the control unit adjusts the machine in a depth direction of the cutting groove The arm moves relative to the cutting unit in a direction opposite to the change in the bottom line of the groove. The automatic board cutting device of claim 3, wherein the control unit recognizes an inflection point of a groove bottom line of the cutting groove; and when the inflection point is an upper inflection point higher than a reference surface, the control The unit adjusts a movement direction of the mechanical arm away from the cutting groove; when the inflection point is lower than a lower inflection point of the reference surface, the control unit adjusts a depth direction of the mechanical arm toward the cutting groove mobile. The automatic circuit board cutting device of claim 1, further comprising a flatness detector; wherein the flatness detector is configured to detect the flatness of the vacuum chuck after the vacuum chuck is mounted to the mechanical arm Information. A circuit board automatic cutting method, which utilizes the automatic board cutting device according to any one of claims 1 to 5, wherein the method comprises: taking a photo of the circuit board adsorbed on the vacuum chuck Position information of the cutting groove on the circuit board; and sensing a groove bottom line of the cutting groove adsorbed on the circuit board of the vacuum chuck; according to the groove bottom line of the cutting groove, in the cutting The mechanical arm is moved relative to the cutting unit in the depth direction of the groove, so that the cutting unit has the same cutting depth when cutting the circuit board according to the position information of the cutting groove. The method of automatically cutting a circuit board according to claim 6, wherein the sensing the bottom line of the cutting groove on the circuit board comprises: sensing a groove bottom line of the cutting groove in a non-contact manner. The method of automatically cutting a circuit board according to claim 6, wherein the adjusting the movement of the mechanical arm relative to the cutting unit in the depth direction of the cutting groove according to the groove bottom line of the cutting groove comprises : in the depth direction of the cutting groove, the mechanical arm is adjusted to move relative to the cutting unit in a direction opposite to a change in the groove bottom line. The automatic cutting method of the circuit board of claim 8, wherein the adjusting the mechanical arm in the depth direction of the cutting groove is performed in a direction opposite to a change in the bottom line of the groove with respect to the cutting unit The moving includes: identifying an inflection point of the groove bottom line of the cutting groove; adjusting the depth direction of the mechanical arm facing the cutting groove when the inflection point is an upper inflection point higher than the reference surface; when the inflection point is When the lower inflection point of the reference surface is lower, the mechanical arm is adjusted to move in the depth direction of the cutting groove. The method of automatically cutting a circuit board according to claim 6, wherein the method further comprises: detecting the flatness information of the vacuum chuck after the vacuum chuck is mounted to the mechanical arm.