TWI645980B - Identification card module preparation layer and manufacturing method thereof - Google Patents

Abstract

The invention relates to an identification card module preparation layer and a manufacturing method thereof. The identification card module preparation layer comprises a substrate, a plurality of identification card modules and two release layers, and the plurality of identification layers are identified by the two release layers. The card module is wrapped in the substrate to provide a protection effect. When the user needs to input the code to each identification card module, since one of the release layers is provided with an operation hole, the identification card module is provided. The chip and the fingerprint identification component can communicate with the outside, and the user can directly input the code through the preliminary layer of the identification card module, thereby effectively improving the prior art, and directly bending and damaging each of the identification card modules. The disadvantage of the identification card module is to provide a preliminary layer of the identification card module.

Description

Identification card module preparation layer and manufacturing method thereof

The invention relates to an identification card module preparation layer, in particular to an identification card module preparation layer which is convenient for subsequent processing and can avoid the identification card module being damaged, and a manufacturing method thereof.

The identification card has gradually become an indispensable item in life. With Radio Frequency IDentification (RFID), users can easily transmit specific messages by means of induction. In the process of manufacturing existing identification cards, After the step of inputting the code directly into an identification card module, the identification card module is processed and combined with a printing layer to form an identification card.

However, since the identification card module is covered with electronic components and is easily bent, in the above processing process, it is easy to cause damage due to the identification of the identification card module, which causes a disadvantage of high cost in the manufacturing process of the existing identification card. So there is indeed something to be improved.

In order to solve the defect that the existing identification card is easy to be damaged due to the bending of the identification card module, the present invention utilizes an identification card module preparation layer, and covers a plurality of identification card modules through the two release layers. In a substrate, a protection effect is provided, and when the user inputs the code, the identification card module can be directly used to prepare the layer, thereby effectively improving the disadvantages of the prior art, and further described below.

The invention relates to an identification card module preparation layer, which is a carrier in the process of manufacturing an identification card for providing protection and avoiding damage of the identification card module during processing. The identification card module preparation layer comprises a substrate. a plurality of identification card modules and two release layers, wherein: the substrate is provided with a plurality of receiving holes at intervals; the plurality of identification card modules are respectively detachably embedded in one of the substrates In the hole, each identification card module includes a base film and at least one input component, the at least one input component is disposed on one side of the base film; and the two release layers respectively pass through a glue layer and the substrate And the plurality of identification card modules are combined and located on the two sides of the substrate and the plurality of identification card modules, and the two release layers are disposed at positions corresponding to the at least one input component of each identification card module. Operate the hole.

Further, the identification card module preparation layer, wherein each identification card module is provided with a plurality of input elements, the plurality of input elements are located on the same side of the identification card module, and the plurality of input elements comprise a wafer , a button and a fingerprint identification component.

Further, the identification card module preparation layer, wherein each identification card module is combined with the substrate in the same direction, such that one of the release layers has a plurality of operation holes, and the plurality of operation holes are respectively located with the identification cards The corresponding position of each input element of the module.

Preferably, the identification card module is provided in a pre-layer, wherein the substrate is provided with a plurality of positioning portions at intervals, and the two release layers are respectively provided with a plurality of corresponding positions corresponding to the plurality of positioning portions. Release layer positioning section.

The invention includes a method for manufacturing a preliminary layer of an identification card module, wherein the identification card module preparation layer is a carrier in the process of manufacturing the identification card, for providing protection and avoiding damage of the identification card module during processing, The manufacturing method of the identification layer of the identification card module includes the following steps: Providing a substrate: preparing a substrate and a first release layer, wherein the substrate is provided with a plurality of accommodating holes spaced apart and penetrating, and coating a surface on a surface of the first release layer Bonding with the first release layer; providing an identification card module: preparing a plurality of identification card modules, each identification card module comprising a base film and at least one input component, wherein the at least one input component is disposed on the base film One side of the plurality of identification card modules are respectively disposed in one of the receiving holes; and the second release layer is combined: a second release layer is prepared, and the second release layer is provided with a plurality of operation holes. After the substrate and the plurality of identification card modules are coated with the adhesive on the side away from the first release layer, the second release layer is bonded to the substrate, and the second release layer is bonded to the substrate. When bonding, the plurality of operating holes are in communication with at least one input element of each of the identification card modules.

Further, in the manufacturing method of the identification layer module preparation layer, in the step of disposing the substrate, the substrate is provided with a plurality of positioning portions at intervals, and the first release layer is at a position corresponding to the plurality of positioning portions. A plurality of first release layer positioning portions are disposed, and when the substrate is combined with the first release layer, the plurality of positioning portions are associated with the plurality of first release layer positioning portions.

Further, in the manufacturing method of the identification layer module preparation layer, in the step of bonding the second release layer, the substrate is spaced apart from the plurality of positioning portions, and the second release layer is in the plurality of positioning portions Corresponding positions are provided with a plurality of second release layer positioning portions, and when the second release layer is combined with the substrate, the plurality of second release layer positioning portions are corresponding to the plurality of positioning portions .

Further, the method for manufacturing the identification layer of the identification card module, wherein each of the identification card modules comprises a plurality of input elements, the plurality of input elements comprising a wafer, a button and a fingerprint identification component, and the second release type a plurality of operation holes are disposed at intervals and through the layer, wherein in the step of bonding the second release layer, when the second release layer is combined with the substrate, the plurality of operation holes are respectively associated with each identification card module The wafer is in communication with the fingerprint recognition component.

Furthermore, in the method of manufacturing the identification layer of the identification card module, after the step of bonding the second release layer is completed, a step of rolling and standing is performed, whereby the two release layers and the substrate and the majority are The air between the identification card modules is pushed out and the two release layers are tightly coupled to the substrate, and each identification card module is covered.

The invention includes a method for manufacturing a preliminary layer of an identification card module, which comprises the method for manufacturing a preliminary layer of the identification card module, wherein after the step of rolling and standing is completed, a step of inputting a code is performed, and then After removing the two release layers, a step of combining the printed layers and cutting is performed, and after cutting, the plurality of identification card modules are separated, and an identification card is formed.

According to the above technical feature, when the user needs to input the code to each identification card module, the user can directly connect each chip and each fingerprint identification component to the outside due to the operation hole of the second release layer. The input code of the identification card module is used to input the code, and the protection effect can be provided through the two release layers, thereby effectively improving the prior art, when directly inputting to each identification card module, it is easy to bend and damage each identification card module. The disadvantage of the group is to provide a preliminary layer of the identification card module.

10‧‧‧Substrate

103, 104‧‧‧ Sealing layer

11‧‧‧ accommodating holes

12‧‧‧ Positioning Department

20‧‧‧ Identification Card Module

201‧‧‧ basement membrane

21‧‧‧ wafer

22‧‧‧ button

23‧‧‧Finger ID

30‧‧‧First release layer

31‧‧‧First release layer positioning

40‧‧‧Second release layer

41‧‧‧Second release layer positioning

42‧‧‧Operation hole

50‧‧‧First print layer

60‧‧‧Second printed layer

61‧‧‧Use holes

A‧‧‧ Identification card module preparation layer

B‧‧‧ Identification Card

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a partially exploded perspective view of a preferred embodiment of the present invention.

2 is a perspective view of the identification card module of the preferred embodiment of the present invention.

Figure 3 is an exploded perspective view of a preferred embodiment of the present invention.

Figure 4 is a side elevational view, partially in section, of a preferred embodiment of the present invention.

Figure 5 is a schematic illustration of the operation of a preferred embodiment of the present invention.

Figure 6 is a schematic view showing the state of use of the preferred embodiment of the present invention.

Figure 7 is a flow diagram of the fabrication of a preferred embodiment of the present invention.

Figure 8 is a flow diagram of the fabrication of an identification card using a preferred embodiment of the present invention.

In order to understand the technical features and practical functions of the present invention in detail and in accordance with the contents of the specification, the following is a detailed description of the preferred embodiment shown in the drawings. The preferred embodiment is as shown in FIG. 1 to FIG. 3 . The identification card module preparation layer A includes a substrate 10 , a plurality of identification card modules 20 , and two release layers 30 , 40 . There are a plurality of accommodating holes 11 and a plurality of locating portions 12, wherein the plurality of accommodating holes 11 are spaced through the two sides of the substrate 10, and are linearly arranged along the length direction and the width direction of the substrate 10, and each of the accommodating holes 11 The shape of the hole 11 is matched with the plurality of identification card modules 20; the plurality of positioning portions 12 are a plurality of perforations spaced apart from each other at positions close to opposite sides of the substrate 10.

As shown in FIG. 2, the plurality of identification card modules 20 are combined with the substrate 10 and disposed in one of the receiving holes 11, each of the identification card modules 20 includes a base film 201 and a plurality of An input component, the plurality of input components including a chip 21, a button 22, and a fingerprint recognition component 23, wherein the wafer 21, the button 22, and the fingerprint recognition component 23 are respectively disposed on one side of the base film 201 at intervals. The chip 21, the button 22 and the fingerprint recognition component 23 are electrically connected to each other, and the wafer 21, the button 22 and the fingerprint recognition component 23 are located on the same side of the identification card module 20, and the plurality of identifications are When the card module 20 is combined with the substrate 10, each of the identification card modules 20 faces in the same direction.

As shown in FIG. 1 , FIG. 3 and FIG. 4 , the two transparent release layers 30 and 40 are a first release layer 30 and a second release layer 40 , respectively. The substrate 10 and the plurality of identification card modules 20 are bonded to each other through a glue layer 103, 104, wherein the first release layer 30 is at a position corresponding to the plurality of positioning portions 12. A plurality of first release layer positioning portions 31 are provided, Therefore, when the first release layer 30 is combined with the substrate 10, the plurality of positioning portions 12 are aligned with each other to form a positioning effect, and each of the first release layer positioning portions 31 is a mark point or an inner diameter. The same perforation as the plurality of positioning portions 12, such that when the first release layer 30 is combined with the substrate 10, the marking point or the perforation can correspond to the center of the corresponding positioning portion 12; the second separation The pattern layer 40 is provided with a plurality of second release layer positioning portions 41 and a plurality of operation holes 42 . The plurality of second release layer positioning portions 41 are disposed on the second release layer 40 and the plurality of positioning portions 12 . Corresponding positions, when the second release layer 40 is combined with the substrate 10, and the plurality of positioning portions 12 are aligned with each other to form a positioning effect, and each of the second release layer positioning portions 41 is a mark. a point or a perforation having the same inner diameter as the plurality of positioning portions 12, such that when the second release layer 40 is combined with the substrate 10, the marking point or the perforation is corresponding to the center of the corresponding positioning portion 12 The plurality of operating holes 42 are spaced apart and are respectively located in the second release layer 40 and the plurality of Fingerprint card 21 do not correspond to the element 23 of the module 20 the position of the wafer, each wafer 21 with the fingerprint recognition system 23 elements wherein each through hole 42 and the operation of a communication with the outside.

According to the above technical features, when the user needs to input the code to each of the identification card modules 20, the wafers 21 and the fingerprint identification elements 23 and the external portions are caused by the plurality of operation holes 42 of the second release layer 40. In connection, the user can directly input the code A through the identification card module A, and can provide packaging and protection through the two adhesive layers 103, 104 and the two release layers 30, 40. The effect is that the surface layer A of the identification card module has a flat surface, which effectively improves the shortcomings of the prior art, which is easy to bend and damage each identification card module 20 when directly inputting the identification card module 20, thereby providing an identification card. Module preparation layer A.

Please refer to FIG. 5 and FIG. 6. After completing the input operation of the code, the user can further remove the two release layers 30 and 40 of the preliminary layer A of the identification card module, and respectively fit on both sides. The first printing layer 50 and the second printing layer 60 have a detailed method of covering the two printing layers 50 and 60 respectively after the two sealing layers 103 and 104, and performing the steps of hot pressing to make the two sealing layers. Layers 103, 104 soften and The two printed layers 50, 60 are bonded, and the combination of the identification card module preparation layer A and the two printed layers 50, 60 is completed after the two sealants 103, 104 are re-solidified.

The second printed layer 60 is provided with a plurality of use holes 61 and a plurality of mark portions 62. The plurality of use holes 61 are spaced apart and are respectively located on the second print layer 60 and the plurality of identification card modules 20 The position corresponding to the fingerprint recognition element 23 is such that each of the wafers 21 and each of the fingerprint recognition elements 23 communicate with the outside through one of the use holes 61; the plurality of mark portions 62 are spaced apart from the second print layer. 60 is away from a side surface of the substrate 10, and is respectively located at a position corresponding to the button 22 of each of the identification card modules 20. After the above steps are completed, a plurality of identification cards B as shown in FIG. 6 are obtained by cutting.

The present invention is a method for manufacturing a spare layer of an identification card module. The preferred embodiment is as shown in FIG. 1, FIG. 5 and FIG. 7, and includes the following steps: The substrate is provided with a substrate 10 and a first release layer 30. The substrate 10 is provided with a plurality of accommodating holes 11 and a plurality of positioning portions 12, and the first release layer 30 is provided. A plurality of first release layer positioning portions 31 are coated with a glue on a surface of the first release layer 30 to cause a first separation of the plurality of positioning portions 12 of the substrate 10 from the first release layer 30. After the layer positioning portion 31 corresponds, the substrate 10 is bonded to the first release layer 30.

The identification card module is provided: a plurality of identification card modules 20 are prepared. As shown in FIG. 2, each identification card module 20 includes a base film 201, a wafer 21, a button 22, and a fingerprint recognition component 23, and the wafer 21 The button 22 and the fingerprint recognition component 23 are disposed on one side of the base film 201, so that the plurality of identification card modules 20 are respectively disposed in one of the receiving holes 11 in the same direction, so that the plurality of identifications are recognized. The card module 20 is combined with the substrate 10 and the first release layer 30, and when the plurality of identification card modules 20 are combined with the substrate 10, each of the identification card modules 20 faces in the same direction.

Combining the second release layer: preparing a second release layer 40, the second release layer 40 is provided with a plurality of second release layer positioning portions 41 and a plurality of operation holes 42 in the substrate 10 and the plurality of Identification After applying a glue to one side of the card module 20 away from the first release layer 30, the plurality of second release layer positioning portions 41 are associated with the plurality of positioning portions 12 of the substrate 10, and then the first When the second release layer 40 is bonded to the substrate 10 and the second release layer 40 is bonded to the substrate 10, the plurality of operation holes 42 are in communication with the respective wafers 21 and the fingerprint recognition elements 23.

Rolling and standing: rolling a surface of the two release layers 30, 40 with a roller module to provide a cold pressing effect, whereby the two release layers 30, 40 and the substrate 10 and the majority The air between the identification card modules 20 is pushed out and the two release layers 30, 40 are closely adhered to the substrate 10. Further, after standing, the substrate 10 and the plurality of identification card modules 20 The adhesive between the two release layers 30, 40 will be cured and form a glue layer 103, 104, respectively, which will tightly cover the identification card modules 20 to provide a flat package. And the effect of the protection, and forming an identification card module preparation layer A, preferably, the identification card module preparation layer A has a flat surface.

According to the manufacturing method of the identification card module preparation layer A, a method for manufacturing the identification card B can be further provided. Referring to FIG. 8, the rolling method of the manufacturing method of the identification layer module A is performed. After the step of standing, perform the following steps: Input code: using the second release layer 40 of the identification card module preparation layer A, inputting a code to each identification card module 20, and the user can directly press each button through the second release layer 40. 22, and each of the wafers 21 and the fingerprint recognition elements 23 can be operated through the operation holes 42.

Combining the printing layer and cutting: After completing the input of the code, please refer to FIG. 3 and FIG. 4, the two release layers 30 and 40 of the preliminary layer A of the identification card module can be removed, and correspondingly respectively The first printed layer 50 and the second printed layer 60 are provided with a plurality of use holes 61 at positions corresponding to the wafer 21 and the fingerprint recognition component 23 of each of the identification card modules 20. And a plurality of marking portions 62 are disposed at positions corresponding to the buttons 22 of the identification card modules 20, and the two printing layers 50, 60 are pasted and combined with the preliminary layer A of the identification card module, and then subjected to hot press forming. After cutting, the plurality of identification card modules 20 can be separated and formed into an identification card B, respectively.

The substrate 10 is disposed on the first release layer 30, so that the plurality of identification card modules 20 can be accommodated in the receiving holes 11 of the substrate 10 and used. After the step of combining the second release layer 40, the subsequent steps of the identification card can be facilitated to effectively improve the operation efficiency, and the existing identification card manufacturing process can be avoided, and the identification card module is easily bent. The disadvantage of damage is to provide a method of manufacturing the identification layer of the identification card module.

The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any one of ordinary skill in the art can use the present invention without departing from the scope of the present invention. Equivalent embodiments for making local changes or modifications made by the technical content, and without departing from the technical solutions of the present invention, are still within the scope of the technical solutions of the present invention.

Claims (10)

An identification card module preparation layer is a carrier in the process of manufacturing an identification card for providing protection and preventing damage of the identification card module during processing. The identification card module preparation layer comprises: a substrate. A plurality of accommodating holes are disposed in the interval; a plurality of identification card modules are respectively detachably embedded in one of the accommodating holes of the substrate, and each of the identification card modules includes a base film and At least one input component, the at least one input component is disposed on one side of the base film; and two release layers respectively coupled to the substrate and the plurality of identification card modules through a glue layer, and located at the same The substrate and the two sides of the plurality of identification card modules, and the two release layers are provided with an operation hole at a position corresponding to at least one input component of each identification card module. The identification card module preparation layer of claim 1, wherein each identification card module is provided with a plurality of input elements, the plurality of input elements are located on the same side of the identification card module, and the plurality of input elements The system includes a chip, a button and a fingerprint identification component. The identification card module preparation layer according to claim 1 or 2, wherein each of the identification card modules is combined with the substrate in the same direction, so that one of the release layers has a plurality of operation holes, and the plurality of operation holes respectively Located at a position corresponding to each input element of each identification card module. The identification card module preparation layer according to claim 3, wherein the substrate is provided with a plurality of positioning portions at intervals, and the two release layers are respectively provided with a plurality of corresponding positions corresponding to the plurality of positioning portions. Release layer positioning section. A manufacturing method for an identification card module preparation layer, wherein the identification card module preparation layer is a carrier in the process of manufacturing the identification card, for providing protection and avoiding damage of the identification card module during processing, the identification card module The manufacturing method of the group preparation layer includes the following steps: Providing a substrate: preparing a substrate and a first release layer, wherein the substrate is provided with a plurality of accommodating holes spaced apart and penetrating, and a surface of the first release layer is coated with an adhesive, and the substrate is The first release layer is bonded; the identification card module is disposed: a plurality of identification card modules are prepared, each identification card module includes a base film and at least one input component, and the at least one input component is disposed on the base film a side, the plurality of identification card modules are respectively disposed in one of the receiving holes; and the second release layer is combined: a second release layer is prepared, and the second release layer is provided with a plurality of operation holes, After the substrate and the plurality of identification card modules are coated with an adhesive on a side away from the first release layer, the second release layer is bonded to the substrate, and the second release layer is bonded to the substrate. When bonding, the plurality of operating holes are in communication with at least one input element of each of the identification card modules. The manufacturing method of the identification card module preparation layer according to claim 5, wherein in the step of disposing the substrate, the substrate is provided with a plurality of positioning portions at intervals, and the first release layer is in the plurality of positioning portions a plurality of first release layer positioning portions are disposed at corresponding positions, and when the substrate is combined with the first release layer, the plurality of positioning portions are corresponding to the plurality of first release layer positioning portions . The method of manufacturing the identification card module preparation layer according to claim 5, wherein in the step of bonding the second release layer, the substrate is spaced apart from a plurality of positioning portions, and the second release layer is a plurality of second release layer positioning portions are disposed at corresponding positions of the plurality of positioning portions, and when the second release layer is combined with the substrate, the plurality of second release layer positioning portions and the plurality of portions are The positioning unit corresponds. The method of manufacturing the identification card module preparation layer of claim 5, wherein each identification card module comprises a plurality of input elements, the plurality of input elements comprising a wafer, a button and a fingerprint identification component, and the The second release layer is provided with a plurality of operation holes at intervals and through, so that in the step of bonding the second release layer, when the second release layer is combined with the substrate, the plurality of operation holes are respectively The chip of the identification card module is in communication with the fingerprint identification component. The method of manufacturing the identification card module preparation layer according to any one of claims 5 to 8, wherein after the step of combining the second release layer is completed, a step of rolling and standing is performed, whereby the two are The air between the release layer and the substrate and the plurality of identification card modules is pushed out, and the two release layers are tightly coupled to the substrate, and each identification card module is covered. A method for manufacturing an identification card, comprising the method for manufacturing an identification card module preparation layer according to claim 9, after the step of rolling and standing is completed, performing a step of inputting a code, and then removing the two After the release layer, a step of combining the printed layers and cutting is performed, and after cutting, the plurality of identification card modules are separated, and an identification card is formed.