TWI645752B - Circuit component and its electronic component configuration carrier - Google Patents

Abstract

A circuit component includes an electronic component configuration carrier, a first electronic component, a second electronic component, and at least one wire. The two arrangement faces of the carrier body of the electronic component configuration carrier are respectively provided with a first attachment layer and a second attachment layer. The first electronic component and the second electronic component are respectively provided with a first attaching structure and a second attaching structure, so as to be selectively attached to the first attaching layer and the second of the electronic component configuration carrier The same or different ones in the attached layer. The wire is directly connected to the first electronic component and the second electronic component, or connects the first electronic component and the second through a wire crossing passage penetrating through the first attaching layer, the carrier body and the second attaching layer The electronic component is electrically connected to the first electronic component and the second electronic component.

Description

Circuit component and its electronic component configuration carrier

The present invention relates to a circuit component and an electronic component configuration carrier board, and more particularly to a circuit component comprising a plurality of electronic components attached to an electronic component configuration carrier board and electrically connecting the electronic components. And an electronic component configuration carrier board having an attachment layer for attaching electronic components.

In the design and output of electronic circuits, the universal welding plate is often used as a carrier, which is also known as a hole plate. The universal welding plate is provided with a plurality of welding plate perforations and corresponding welding pads, and electronic components and wires are utilized. The welding method is electrically connected and structurally connected to the universal welding plate, and an electronic circuit is set up. However, the problems generated by the prior art will be described below with schematic and textual descriptions.

Referring to the first and second figures, the first figure shows a perspective view of a prior art universal soldering plate; the second figure shows a perspective view of a prior art wire jumper configuration. As shown in the first figure and the second figure, the universal welding board PA1 is also called a hole board, and is a general-purpose board. For erecting electronic circuits, the universal soldering plate PA1 has a plurality of perforations, and only the perforations PA11a, PA11b, PA11c, PA11d, PA11e, PA11f and a plurality of corresponding perforated solder pads are indicated on the figure, and only the solder pads PA12a are marked on the figure. PA12b, PA12c, PA12d, PA12e, and PA12f, a plurality of electronic components PA2a, PA2b, PA2c, and PA2d are respectively inserted into the via holes PA11a, PA11b, PA11c, and PA11d.

The electronic component PA2a is electrically connected to the electronic component PA2c via the wire PA3a. The electronic component PA2b is electrically connected to the electronic component PA2d via the wire PA3b, and soldered by using the solders PA4a, PA4b, PA4c, and PA4d as solder, and the electronic component PA2a and the wire are connected. One end of the PA3a is connected to the bonding pad PA12a, the other end of the electronic component PA2c and the wire PA3a is connected to the bonding pad PA12c, one end of the electronic component PA2b and the wire PA3b is connected to the bonding pad PA12b, and the other end of the electronic component PA2d and the wire PA3b is connected to the bonding pad PA12d.

However, if the solders PA4a, PA4b, PA4c, and PA4d are still not completely melted, removing the heat source may result in poor circuit connection, or uneven soldering of PA4a, PA4b, PA4c, and PA4d, or solder pads PA12a, PA12b, and PA12c. When PA12d, PA12e, and PA12f are processed, there is a problem that the soldering area is not uniform, and the circuit may not be turned on or the electronic components may fall off. The solders of PA4a, PA4b, PA4c, and PA4d have heavy metals and toxic compounds, although Containing only trace amounts does not cause significant harm to the human body, but it still affects human health.

Welding uses high temperature to melt conductive solders PA4a, PA4b, PA4c, PA4d, and electronic components PA2a, PA2b, The PA2c, PA2d, and the wires PA3a and PA3b are joined to the perforated solder pads PA12a to PA12f, and since the high temperature is required, the soldering behavior itself is dangerous. If the electronic components PA2a, PA2b, PA2c, PA2d or the wires PA3a and PA3b are soldered incorrectly, the cooled solders PA4a, PA4b, PA4c, and PA4d are heated, and the solders PA4a, PA4b, PA4c, and PA4d are removed, and the electronic components PA2a, PA2b, PA2c, PA2d, wires PA3a and PA3b are separated from the universal soldering plate PA1, which is time-consuming and does not necessarily completely remove the solders PA4a, PA4b, PA4c, PA4d. The common way is to re-weld using another universal soldering plate. The welding plate PA1 is used for one-time welding.

In addition, the wires PA3a and PA3b which are commonly used in the universal soldering plate PA1 are single-core wires. If the wires PA3a and PA3b are connected to each other to easily cause a short circuit, the electronic components PA2a, PA2d and the wires PA3b which are electrically connected are translated. To the perforation PA11e and the perforation PA11f or to route the wire PA3b along the path of the perforation PA11b to the perforation PA11e to the perforation PA11f to the perforation PA11d to bypass the wire PA3a, so that there is no problem of short circuit between the wires PA3a and PA3b, but it may cause The problem that the wire PA3b is wasted and the wiring is time-consuming, and the space utilization rate of the universal soldering plate PA1 is low.

In view of the prior art, the conventional universal soldering plate not only has the above problem of inconveniently arranging electronic components, but also has the problem of low space utilization. Therefore, the main object of the present invention is to provide a circuit assembly and an electronic component configuration carrier board thereof, which can be repeatedly attached and detached and attached to the attaching layer by the attaching structure. The purpose of arranging electronic components multiple times, and using DuPont wire to complete the electrical connection between electronic components, thereby reducing the space required for electrical connections (especially bridging electrical connections) and greatly improving space utilization. .

The present invention solves the problems of the prior art, and one of the necessary technical means is to provide an electronic component configuration carrier, and the electronic component configuration carrier includes a carrier body, a first attachment layer and a second sticker. Attachment. The carrier body has a first arrangement surface and a second arrangement surface opposite to each other. The first attachment layer and the second attachment layer are respectively disposed on the first arrangement surface and the second arrangement surface.

The carrier body is provided with a plurality of through-holes penetrating through the carrier body, and the first attaching layer and the second attaching layer are respectively provided with a plurality of first through holes and second through holes corresponding to the through holes of the carrier. And the plurality of first perforations, the carrier perforations and the second perforations respectively enclose a plurality of wire crossing passages corresponding to each other.

On the basis of one of the above-mentioned necessary technical means, an auxiliary technical means derived from the above-mentioned electronic component configuration carrier is that the carrier body is a flexible plate type structure.

On the basis of one of the above-mentioned necessary technical means, one of the auxiliary technical means derived from the above-mentioned electronic component configuration carrier is that the first attachment layer can be a devil felt needle hook layer or a devil felt plush layer, and The second attachment layer can be another devil felt hook layer or a devil felt plush layer.

On the basis of one of the above-mentioned necessary technical means, one of the auxiliary technical means derived from the above-mentioned electronic component configuration carrier is that the first perforation and the second perforation are cross-shaped perforations for the purpose of the wires. The wires are routed and extended to assist in positioning the wires.

The present invention solves the problems of the prior art, and another necessary technical means is to provide a circuit component, and the circuit component includes an electronic component configuration carrier, a first electronic component, a second electronic component, and at least a wire.

The electronic component configuration carrier includes a carrier body, a first attachment layer and a second attachment layer. The carrier body has a first arrangement surface and a second arrangement surface opposite to each other. The first attachment layer and the second attachment layer are respectively disposed on the first arrangement surface and the second arrangement surface.

The first electronic component and the second electronic component are respectively provided with a first attaching layer and a second attaching layer, so as to be removably attached to the same one of the first attaching layer and the second attaching layer Or different. The wire is used to electrically connect the first electronic component with the second electronic component.

On the basis of the above-mentioned other necessary technical means, one of the auxiliary technical means derived from the above circuit component is that the carrier body of the electronic component is configured with the carrier, the first attaching layer and the second attaching layer are respectively provided with a plurality of corresponding The grounding plate is perforated, the first perforation and the second perforation, and a plurality of wire crossing passages are formed, wherein the first perforation and the second perforation are cross-shaped perforations for the wires according to the laying and extending directions of the wires Auxiliary positioning.

On the basis of the above-mentioned other necessary technical means, one of the auxiliary technical means derived from the above circuit component is that the first attachment layer is a devil felt plush layer or a devil felt needle hook layer, and the second attachment layer For another devil felt plush layer or a devil felt needle hook layer, and the first attachment Both the structure and the second attachment structure have a devil felt plush layer and a devil felt needle hook layer.

On the basis of the above-mentioned other necessary technical means, one of the auxiliary technical means derived from the above circuit components is that the wire is a DuPont wire. In addition, at least one of the first electronic component and the second electronic component may be a solderless universal circuit board (commonly known as a "breadboard"). Preferably, the solderless universal circuit board can be pre-wired with specific electronic components and functional circuits.

As described above, in the circuit assembly provided by the present invention, the electronic component can be repeatedly attached and detached to the electronic component configuration carrier by means of attachment, and the attachment method is not dangerous and does not affect human health. The impact is also achieved, and the purpose of deploying electronic components can be achieved multiple times. In addition, the use of DuPont wire and the two-attachment layer to make the wire between the wires will not cause a short circuit problem, and the space required for reducing the electrical connection (especially the cross-connecting electrical connection) also greatly increases the electronic component configuration load. Board space utilization.

PA1‧‧‧ million welding plate

PA11a-PA11f‧‧‧Perforation

PA12a-PA12d‧‧‧ solder pad

PA2a-PA2d‧‧‧ electronic components

PA3a, PA3b‧‧‧ wire

PA4a-PA4d‧‧‧ solder

1‧‧‧Electronic component configuration carrier

11‧‧‧ Carrier board body

12‧‧‧First Attachment

13‧‧‧Second Attachment

100, 100a, 100b‧‧‧ circuit components

111‧‧‧First configuration surface

112‧‧‧Second configuration surface

113‧‧‧ Carrier perforation

121‧‧‧First perforation

131‧‧‧Second perforation

2a‧‧‧First electronic components

2b, 2c‧‧‧ second electronic components

2d‧‧‧ third electronic components

2e-2h‧‧‧Electronic components

21a‧‧‧First electronic component body

21b, 21c‧‧‧ second electronic component body

21d‧‧‧The third electronic component body

21c-21h‧‧‧Electronic component body

22a‧‧‧First attached structure

22b, 22c‧‧‧second attachment structure

22d‧‧‧ Third Attachment Structure

22e-22h‧‧‧ Attachment structure

3, 3a, 3b‧‧‧ wires

T, Ta, Tb, Tc, Td‧‧‧ wire crossing channels

The first figure shows a perspective view of a prior art universal soldering plate; the second figure shows a perspective view of a prior art wire jumper configuration; and the third figure shows the electronic component configuration of the circuit component provided by the first embodiment of the present invention. FIG. 4 is a perspective view showing the electronic component configuration carrier of the circuit component provided by the present invention; 5 is a perspective view showing a connection relationship between an electronic component, a wire, and an electronic component configuration carrier in the first embodiment of the present invention; a sixth diagram showing a cross-sectional view of the fifth diagram; In a second embodiment of the invention, a cross-sectional view of the electronic component, the wire and the electronic component configuration carrier connection relationship; and the eighth figure shows the electronic component, the wire and the electronic component in the third embodiment of the present invention A three-dimensional schematic diagram of the connection relationship of the carrier boards.

Specific embodiments of the present invention will be described in more detail below with reference to the drawings. Advantages and features of the present invention will be apparent from the description and appended claims. It should be noted that the drawings are all in a very simplified form and both use non-precise proportions, and are only for convenience and clarity to assist the purpose of the embodiments of the present invention.

Please refer to the third to sixth figures, wherein the third figure shows a perspective exploded view of the electronic component configuration carrier of the circuit component provided by the first embodiment of the present invention; and the fourth figure shows the circuit provided by the present invention. FIG. 5 is a perspective view showing the electronic component configuration carrier of the component; FIG. 5 is a perspective view showing the connection relationship between the electronic component, the wire and the electronic component configuration carrier in the first embodiment of the present invention; A schematic cross-sectional view of the five figures. A circuit assembly 100 includes an electronic component configuration carrier 1, a first electronic component 2a, a second electronic component 2b, and a wire 3. The electronic component configuration carrier 1 includes a carrier body 11 , a first attachment layer 12 and a second attachment layer 13 .

The carrier body 11 has a first arrangement surface 111 and a pair The first arrangement surface 111 is opposite to the second arrangement surface 112 and is provided with a plurality of carrier plate perforations extending through the first arrangement surface 111 and the second arrangement surface 112 (only one of the carrier plate through holes 113 is indicated in the figure). In addition, the carrier body 11 can be a flexible plate type structure, thereby flexing according to various different use requirements and use environment space restrictions.

The first attaching layer 12 is disposed on the first arranging surface 111 and is provided with a plurality of first through holes corresponding to the carrier plate through holes 113 (only one of the first through holes 121 is indicated in the figure). The second attaching layer 13 is disposed on the second arranging surface 112 and has a plurality of second through holes corresponding to the carrier plate through holes 113 (only one of the second through holes 131 is indicated in the figure). The plurality of first perforations, the perforations of the carrier plates and the second perforations are configured to form a plurality of wire crossing passages (only one of the wires crossing the passage T is indicated in the figure).

Preferably, the first attaching layer 12 and the second attaching layer 13 can be one of the devil felt plush layer, the devil felt needle hook layer, both of which are devil felt plush layers or two All of them are devil felt needle hook layers for attaching the first electronic component 2a and the second electronic component 2b. In addition, a plurality of electronic component configuration carriers can be attached to each other in accordance with different usage environments or structures.

Preferably, the carrier plate through hole 113 can be a circular through hole, and the first through hole 121 and the second through hole 131 can be of a cross shape for assisting positioning of the wire 3 according to the arrangement and extension direction of the wire 3.

The first electronic component 2a includes a first electronic component body 21a and a first attachment structure 22a. The first electronic component 2a attaches the first electronic component body 21a to the first attaching layer 12 in a removably attachable manner by the first attaching structure 22a. The second electronic component 2b includes the second electron The component body 21b and the second attaching structure 22b. The second electronic component 2b attaches the second electronic component body 21b to the second attachment layer 13 in a removably attachable manner by the second attachment structure 22b.

Preferably, the first attaching structure 22a can have both a devil felt plush layer and a devil felt hook layer, and the second attaching structure 22b can also have a devil felt plush layer and a devil felt hook surface. The layer so that the first attaching structure 22a and the second attaching structure 22b are not attached because the first attaching layer 12 and the second attaching layer 13 are devil felt plush or devil felt hooks There are restrictions.

Preferably, the first attaching structure 22a and the second attaching structure 22b may be a sheet-like structure respectively disposed on one or more surfaces of the first electronic component body 21a and the second electronic component body 22a. In this configuration, one of the first attachment structure 22a and the second attachment structure 22b may be disposed adjacent to the first attachment in the electronic component body 21a or the second electronic component body 22a according to actual needs. The layer 12 and the second attachment layer 13 are attached to the first attachment layer 12 and the second attachment layer 13 respectively by the first attachment structure 22a and the second attachment structure 22b.

Preferably, when the first electronic component body 21a and the second electronic component body 21b are cylindrical structures (such as columnar resistors), the first attaching structure 22a and the second attaching structure 22b may surround the first A cylindrical peripheral surface of the electronic component body 21a and the second electronic component body 21b. With the above structure, when the first electronic component body 21a and the second electronic component body 21b are close to the first attaching layer 12 and the second attaching layer 13 at any angle of the circumferential surface of the cylinder, respectively, The first attaching structure 22a and the second attaching structure 22b make the first electronic component 2a and the second electronic zero group The piece 2b is firmly attached to the first attachment layer 12 and the second attachment layer 13.

The first electronic component 2a is coupled to the second electronic component 2b by a wire 3 passing through the wire through the channel Tb, whereby the first electronic component 2a and the second electronic component 2b are electrically connected to each other. In addition, the wire 3 can cooperate with the configuration of the first electronic component 2a and the second electronic component 2b or the electronic component to configure the use space of the carrier 1 through the wire through the channel Ta, Tb, Tc or Td.

In addition, in the embodiment, the DuPont line can be used as the above-mentioned wire 3, and both ends of the DuPont line can be the female end, so that the first electronic component 2a and the second electronic component 2b are plugged and connected. And electrically connected.

Please refer to the seventh figure. The seventh figure shows a cross-sectional view showing the connection relationship between the electronic components, the wires and the electronic component configuration carrier in the second embodiment of the present invention. A circuit component 100a includes a second electronic component 2c, a third electronic component 2d, and a second electronic component 2c, in addition to the electronic component configuration carrier 1 and the first electronic component 2a. Wire 3a and another wire 3b. Therefore, in the embodiment, the electronic component configuration carrier 1 and the first electronic component 2a will not be described again.

The second electronic component 2c and the third electronic component 2d are similar in structure to the first electronic component 2a, and include a second electronic component body 21c and a third electronic component body 21d, respectively, and have a second attachment structure. The second attachment structure 22 of the electronic component configuration carrier 1 is removably attached to the second attachment structure 22d.

In the embodiment, the first attaching layer 12 and the second attaching layer 13 are available for the third electronic in addition to the description in the first embodiment. The component 2d is attached.

Preferably, the first attaching structure 22a, the second attaching structure 22c and the third attaching structure 22d are the same as the first attaching structure 22a and the second attaching structure 22b in the first embodiment, and are not Let me repeat.

The first electronic component 2a is connected to the second electronic component 2c by a wire 3a passing through the wire through the channel Ta, and is electrically connected, and the second electronic component 2c is connected to the third electronic component 2d by a wire 3b. And electrically connected.

In this embodiment, the second electronic component body 21c is a solderless universal circuit board (also known as a "breadboard"), and can be pre-wired with specific electronic components and functional circuits.

In addition, in the embodiment, the DuPont line can be used as the wires 3a and 3b, and the two ends of the wire are respectively a male end and a female end, so that the electronic components 2a and 2d are plugged and connected, and the electronic components are plugged. 2c. In addition, the wire 3a can be configured to match the use space of the electronic component or the electronic component to configure the space of the carrier 1 to pass through the wire through the channel Ta, Tb, Tc or Td.

Please refer to FIG. 8 , which is a perspective view showing the connection relationship between the electronic components, the wires and the electronic component configuration carrier in the third embodiment of the present invention. A circuit component 100b includes a plurality of electronic components 2e, 2f, 2g, 2h and wires 3a and 3b in addition to the electronic component configuration carrier 1 of the second embodiment described above. Therefore, the above-mentioned electronic component configuration carrier 1 will not be described herein.

In the embodiment, the electronic component is configured with the carrier 1 for attaching a plurality of electronic components 2e, 2f, 2g, and 2h. this In addition, a plurality of electronic component configuration carriers can be attached to each other in accordance with different usage environments or structures.

The plurality of electronic components 2e to 2h have the same structure as the first electronic component 2a described above, and respectively include the electronic component bodies 21e, 21f, 21g, 21h, and are repeatable by the attaching structures 22e, 22f, 22g, 22h The first attachment layer 12 is attached and detached, and the relationship between the shape state of the electronic component body and the attachment structure will not be described herein.

In this embodiment, the electronic component 2e is electrically connected to the electronic component 2g by the wire 3a, and the electronic component 2f is electrically connected to the electronic component 2f by the wire 3b, and an electronic circuit with a specific function is disposed.

Preferably, the DuPont wire can be used as the wire 3a and the other wire 3b. It can be bridged as shown in the figure to solve the problem that the short circuit of the wire is connected in the prior art, the winding is time-consuming, and the space utilization of the universal welding plate is low.

Preferably, the wire 3a can configure the space of the carrier 1 according to the electronic component configuration and the electronic component, and pass through the plurality of wires through the channel T to electrically connect the electronic component 2e and the electronic component 2g. In addition, the wire 3b can also electrically connect the electronic component 2f and the electronic component 2h through a plurality of wires passing through the channel T according to the above situation.

In summary, compared with the prior art universal soldering plate, the solder is used as the solder, and the electronic component and the wire are fixed on the soldering pad by the welding method, and the possibility is caused during the welding and the human health is affected. Moreover, the electronic component cannot be disposed multiple times; the present invention attaches the electronic component to the electronic component configuration carrier plate by attaching and detaching the electronic component by attaching the electronic component, thereby achieving multiple repeatability. The purpose of laying out electronic components. And use the DuPont line as a wire to reduce the space required for electrical connections (especially for cross-connecting electrical connections). In addition, the electronic component configuration carrier has a first attachment layer and a second attachment layer, which can greatly improve the space utilization of the electronic component configuration carrier.

The features and spirit of the present invention will be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalents within the scope of the invention as claimed.

Claims (11)

An electronic component configuration carrier is configured to configure a first electronic component and a second electronic component, wherein the first electronic component and the second electronic component are respectively provided with a first attaching structure and a first a second attachment structure, the electronic component configuration carrier includes: a carrier body, a flexible plate structure having a first arrangement surface and a second arrangement surface opposite the first arrangement surface, And a plurality of carrier plate perforations extending through the first configuration surface and the second configuration surface; a first attachment layer disposed on the first configuration surface and having a plurality of perforations corresponding to the carrier plates a first perforation; and a second attachment layer disposed on the second arrangement surface, and having a plurality of second perforations corresponding to the perforations of the carrier plates, and the second perforation systems respectively corresponding to The carrier plate perforations and the first through holes form a plurality of wire passing passages; wherein the first electronic component is removably attached to the first attaching layer by the first attaching structure And one of the second attachment layers, and the second electron The component is removably attached to one of the first attachment layer and the second attachment layer by the second attachment structure, and at least one of the wire crossing channels is used The first electronic component and the second electronic component are electrically connected by at least one wire passing through. The electronic component configuration carrier according to claim 1, wherein the first attachment layer is a devil felt plush layer and a One of the devil's felt needle hook layer, and the second attachment layer is one of the other devil's felt plush layer and another devil's felt hook layer. The electronic component configuration carrier according to claim 1, wherein when the first attachment layer is a devil felt plush layer, the second attachment layer is another devil felt plush surface. a layer; and when the first attachment layer is a devil felt needle hook layer, the second attachment layer is another devil felt needle hook layer. The electronic component configuration carrier of the first aspect of the invention, wherein the first through holes and the second through holes are cross-shaped perforations for fixing the at least one wire passing through the wire crossing passages . A circuit assembly comprising: an electronic component configuration carrier, comprising: a carrier body, a flexible plate structure having a first arrangement surface and a second arrangement surface opposite the first arrangement surface a first attachment layer is disposed on the first configuration surface; and a second attachment layer is disposed on the second configuration surface; a first electronic component is provided with a first attachment structure, And attaching to the one of the first attaching layer and the second attaching layer by removably attaching and detaching; a second electronic component is provided with a second attaching structure, so as to be removably attachable Attached to the first attachment layer and the second attachment layer And at least one wire electrically connected to the first electronic component and the second electronic component. The circuit assembly of claim 5, wherein the carrier plate is provided with a plurality of carrier plate perforations extending through the first configuration surface and the second matching surface; the first attachment layer is provided a plurality of first perforations corresponding to the perforations of the carrier plates; the second attachment layer is provided with a plurality of second perforations corresponding to the perforations of the carrier plates, and the second perforation systems respectively correspond to the carrier plates The through holes and the first through holes form a plurality of wire crossing passages for the at least one wire to pass through. The circuit assembly of claim 5, wherein the first attachment layer is one of a devil felt plush layer and a devil felt needle layer, and the second attachment layer is One of the other devil's felt plush layers and another devil's felt needle hook layer. The circuit assembly of claim 5, wherein when the first attachment layer is a devil felt plush layer, the second attachment layer is another devil felt plush layer; When the first attachment layer is a devil felt needle hook surface layer, the second attachment layer is another devil felt needle hook surface layer. The circuit assembly of claim 5, wherein the first attachment structure has a devil felt plush layer and a magic The ghost felt hook surface layer, and the second attachment structure has another devil felt plush layer and another devil felt needle hook layer. The circuit assembly of claim 5, wherein the at least one wire is a DuPont wire. The circuit assembly of claim 5, wherein at least one of the first electronic component and the second electronic component is a solderless universal circuit board.