TWI645009B - Laminated adhesive sheets and laminated bodies - Google Patents
Laminated adhesive sheets and laminated bodies Download PDFInfo
- Publication number
- TWI645009B TWI645009B TW103116612A TW103116612A TWI645009B TW I645009 B TWI645009 B TW I645009B TW 103116612 A TW103116612 A TW 103116612A TW 103116612 A TW103116612 A TW 103116612A TW I645009 B TWI645009 B TW I645009B
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive layer
- meth
- dielectric constant
- laminated
- adhesive
- Prior art date
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- 230000001070 adhesive effect Effects 0.000 title claims abstract description 259
- 239000000853 adhesive Substances 0.000 title claims abstract description 256
- 239000012790 adhesive layer Substances 0.000 claims abstract description 308
- 239000010410 layer Substances 0.000 claims abstract description 77
- 238000000034 method Methods 0.000 claims abstract description 42
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 96
- -1 2-ethylhexyl Chemical group 0.000 claims description 60
- 239000000178 monomer Substances 0.000 claims description 55
- 239000011347 resin Substances 0.000 claims description 47
- 229920005989 resin Polymers 0.000 claims description 47
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 24
- 238000004519 manufacturing process Methods 0.000 claims description 23
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 19
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical group COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 15
- 230000003287 optical effect Effects 0.000 claims description 13
- 125000000524 functional group Chemical group 0.000 claims description 11
- 150000002148 esters Chemical group 0.000 claims description 10
- 239000003522 acrylic cement Substances 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 6
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 4
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 claims description 4
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 4
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 4
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 3
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 3
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical group C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 claims description 2
- YOSXAXYCARLZTR-UHFFFAOYSA-N prop-2-enoyl isocyanate Chemical compound C=CC(=O)N=C=O YOSXAXYCARLZTR-UHFFFAOYSA-N 0.000 claims 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 abstract description 39
- 239000000203 mixture Substances 0.000 description 34
- 229920001577 copolymer Polymers 0.000 description 14
- 238000006116 polymerization reaction Methods 0.000 description 11
- 229920002799 BoPET Polymers 0.000 description 9
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 9
- 229920000058 polyacrylate Polymers 0.000 description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- 239000003963 antioxidant agent Substances 0.000 description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 8
- 238000005259 measurement Methods 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 230000003078 antioxidant effect Effects 0.000 description 6
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 5
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 5
- 125000003277 amino group Chemical group 0.000 description 5
- 239000003431 cross linking reagent Substances 0.000 description 5
- 239000002002 slurry Substances 0.000 description 5
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 4
- VVJKKWFAADXIJK-UHFFFAOYSA-N Allylamine Chemical compound NCC=C VVJKKWFAADXIJK-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 230000001186 cumulative effect Effects 0.000 description 4
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 4
- 239000012948 isocyanate Substances 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Chemical class 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000004840 adhesive resin Substances 0.000 description 3
- 229920006223 adhesive resin Polymers 0.000 description 3
- 239000001913 cellulose Substances 0.000 description 3
- 229920002678 cellulose Polymers 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 150000002430 hydrocarbons Chemical group 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 2
- 229920005601 base polymer Polymers 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000003518 caustics Substances 0.000 description 2
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 2
- 229940018557 citraconic acid Drugs 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000006059 cover glass Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
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- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
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- 239000004926 polymethyl methacrylate Substances 0.000 description 2
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- 239000004814 polyurethane Substances 0.000 description 2
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 2
- 239000013464 silicone adhesive Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 150000003505 terpenes Chemical class 0.000 description 2
- 235000007586 terpenes Nutrition 0.000 description 2
- NIQKTSYVQOBNKP-UHFFFAOYSA-N 1,2,3-triethylpyrene Chemical compound C1=CC=C2C=CC3=C(CC)C(CC)=C(CC)C4=CC=C1C2=C43 NIQKTSYVQOBNKP-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
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- IVIDDMGBRCPGLJ-UHFFFAOYSA-N 2,3-bis(oxiran-2-ylmethoxy)propan-1-ol Chemical compound C1OC1COC(CO)COCC1CO1 IVIDDMGBRCPGLJ-UHFFFAOYSA-N 0.000 description 1
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 1
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- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
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- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
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- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
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- 239000000155 melt Substances 0.000 description 1
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- 239000001301 oxygen Substances 0.000 description 1
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- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
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- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/025—Electric or magnetic properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2405/00—Adhesive articles, e.g. adhesive tapes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
- C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
本發明之課題在於發現一種更準確地控制相對介電常數之方法,且提供一種藉由該控制方法而相對介電常數得到控制之黏著片。本發明係關於一種積層黏著片,其特徵在於:其係至少具有第1黏著劑層與第2黏著劑層者,且第1黏著劑層與第2黏著劑層之頻率1MHz下之相對介電常數之差的絕對值為0.5以上。進而,本發明係關於一種積層黏著片,其特徵在於:具有頻率1MHz下之相對介電常數未達4之第1黏著劑層、與頻率1MHz下之相對介電常數為4以上之第2黏著劑層。 The problem of the present invention is to find a method for controlling the relative permittivity more accurately, and to provide an adhesive sheet whose relative permittivity is controlled by the control method. The invention relates to a laminated adhesive sheet, which is characterized in that it has at least a first adhesive layer and a second adhesive layer, and the relative dielectric properties of the first adhesive layer and the second adhesive layer at a frequency of 1 MHz. The absolute value of the difference between the constants is 0.5 or more. Furthermore, the present invention relates to a laminated adhesive sheet, which is characterized by a first adhesive layer having a relative dielectric constant of 4 or less at a frequency of 1 MHz and a second adhesive layer having a relative dielectric constant of 4 or more at a frequency of 1 MHz.剂 层。 The agent layer.
Description
本發明係關於一種積層黏著片及積層體。具體而言,本發明係關於一種相對介電常數得到控制之積層黏著片,且係可發揮所需之黏著性之積層黏著片。 The invention relates to a laminated adhesive sheet and a laminated body. Specifically, the present invention relates to a laminated adhesive sheet having a controlled relative dielectric constant, and is a laminated adhesive sheet capable of exhibiting desired adhesiveness.
近年來,於各種領域中,廣泛使用液晶顯示器(LCD)等顯示裝置、或觸控面板等與顯示裝置組合而使用之輸入裝置。於製造該等顯示裝置或輸入裝置時,於貼合光學構件之用途中,使用透明之雙面黏著片,於貼合顯示裝置與輸入裝置時,亦使用透明之雙面黏著片(例如,專利文獻1~3)。 In recent years, a display device such as a liquid crystal display (LCD) or an input device used in combination with a display device such as a touch panel has been widely used in various fields. When manufacturing such display devices or input devices, use transparent double-sided adhesive sheets for the purpose of bonding optical components, and also use transparent double-sided adhesive sheets (for example, patents) when bonding display devices and input devices. References 1 to 3).
於此種顯示裝置或輸入裝置中,對黏著片不僅要求黏著物性,亦要求絕緣特性等各種功能。例如,於專利文獻4中,揭示有介電常數不同之積層型之黏著片。又,於專利文獻5中,揭示有具有特定之介電常數或介質損耗正切之單層型之黏著片。提出如此藉由控制黏著片之介電常數而提高觸控面板之動作性能等。 In such a display device or an input device, various functions such as an adhesive property and an insulation property are required for the adhesive sheet. For example, Patent Document 4 discloses a multi-layer type adhesive sheet having a different dielectric constant. Furthermore, Patent Document 5 discloses a single-layer type adhesive sheet having a specific dielectric constant or a dielectric loss tangent. It is proposed to improve the operation performance of the touch panel by controlling the dielectric constant of the adhesive sheet.
[專利文獻1]日本專利特開2003-238915號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2003-238915
[專利文獻2]日本專利特開2003-342542號公報 [Patent Document 2] Japanese Patent Laid-Open No. 2003-342542
[專利文獻3]日本專利特開2004-231723號公報 [Patent Document 3] Japanese Patent Laid-Open No. 2004-231723
[專利文獻4]日本專利4093355號公報 [Patent Document 4] Japanese Patent No. 4093355
[專利文獻5]國際公開2010/147047號說明書 [Patent Document 5] International Publication No. 2010/147047
如上所述,要求根據對顯示裝置或輸入裝置所要求之性能,將黏著片之介電常數控制為特定範圍。然而,相對介電常數為物質固有之物性值,故而精度良好地控制並不容易,要求發現更準確地控制相對介電常數之方法。 As described above, it is required to control the dielectric constant of the adhesive sheet to a specific range according to the performance required for a display device or an input device. However, the relative permittivity is a property value inherent in a substance, so it is not easy to control it with good accuracy, and it is required to find a method for controlling the relative permittivity more accurately.
因此,本發明者等人為了解決此種先前技術之課題,以發現更準確地控制相對介電常數之方法,並提供一種藉由該控制方法而相對介電常數得到控制之黏著片為目的而推進研究。 Therefore, in order to solve such a problem of the prior art, the inventors have found a method of controlling the relative dielectric constant more accurately, and provided an adhesive sheet whose relative dielectric constant is controlled by the control method. Advance research.
本發明者等人為了解決上述課題而進行銳意研究,結果發現:於至少具有第1黏著劑層與第2黏著劑層之積層黏著片中,將第1黏著劑層之相對介電常數及厚度、與第2黏著劑層之相對介電常數及厚度以成為特定條件之方式進行調整,藉此可調整積層黏著片之相對介電常數。以如此之方式,本發明者等人成功地獲得相對介電常數得到控制之積層黏著片,從而完成本發明。 The present inventors conducted intensive research in order to solve the above-mentioned problems, and as a result, found that in a laminated adhesive sheet having at least a first adhesive layer and a second adhesive layer, the relative dielectric constant and thickness of the first adhesive layer The relative dielectric constant and thickness of the second adhesive layer are adjusted in such a way as to become a specific condition, whereby the relative dielectric constant of the laminated adhesive sheet can be adjusted. In this way, the present inventors have succeeded in obtaining a laminated adhesive sheet with a controlled relative dielectric constant, thereby completing the present invention.
具體而言,本發明具有以下之構成。 Specifically, this invention has the following structures.
[1]一種積層黏著片,其特徵在於:其係至少具有第1黏著劑層與第2黏著劑層者,且上述第1黏著劑層與上述第2黏著劑層之頻率1MHz下之相對介電常數之差的絕對值為0.5以上。 [1] A laminated adhesive sheet, which is characterized in that it has at least a first adhesive layer and a second adhesive layer, and the relative frequency between the first adhesive layer and the second adhesive layer at a frequency of 1 MHz The absolute value of the difference between the electric constants is 0.5 or more.
[2]如[1]之積層黏著片,其係至少具有第1黏著劑層與第2黏著劑層者,且具有頻率1MHz下之相對介電常數未達4之第1黏著劑層、與頻率1MHz下之相對介電常數為4以上之第2黏著劑層。 [2] The laminated adhesive sheet according to [1], which has at least a first adhesive layer and a second adhesive layer, and has a first adhesive layer with a relative dielectric constant of less than 4 at a frequency of 1 MHz, and The second adhesive layer having a relative dielectric constant of 4 or more at a frequency of 1 MHz.
[3]如[1]或[3]之積層黏著片,其中上述第1黏著劑層之頻率1MHz 下之相對介電常數未達3。 [3] The laminated adhesive sheet according to [1] or [3], wherein the frequency of the first adhesive layer is 1 MHz The relative permittivity below does not reach 3.
[4]如[1]至[3]中任一項之積層黏著片,其中上述第1黏著劑層與上述第2黏著劑層之各層之厚度為10μm以上。 [4] The laminated adhesive sheet according to any one of [1] to [3], wherein the thickness of each of the first adhesive layer and the second adhesive layer is 10 μm or more.
[5]如[1]至[4]中任一項之積層黏著片,其中上述第1黏著劑層與上述第2黏著劑層之厚度之比為1:99~99:1。 [5] The laminated adhesive sheet according to any one of [1] to [4], wherein a ratio of the thickness of the first adhesive layer to the second adhesive layer is 1:99 to 99: 1.
[6]如[1]至[5]中任一項之積層黏著片,其中上述第1黏著劑層與上述第2黏著劑層為丙烯酸系黏著劑層。 [6] The laminated adhesive sheet according to any one of [1] to [5], wherein the first adhesive layer and the second adhesive layer are acrylic adhesive layers.
[7]如[1]至[6]中任一項之積層黏著片,其中上述第1黏著劑層與上述第2黏著劑層包含(甲基)丙烯酸酯。 [7] The laminated adhesive sheet according to any one of [1] to [6], wherein the first adhesive layer and the second adhesive layer include a (meth) acrylate.
[8]如[1]至[7]中任一項之積層黏著片,其進而具有第3黏著劑層。 [8] The laminated adhesive sheet according to any one of [1] to [7], which further has a third adhesive layer.
[9]如[1]至[8]中任一項之積層黏著片,其進而具有樹脂層。 [9] The laminated adhesive sheet according to any one of [1] to [8], which further has a resin layer.
[10]如[9]之積層黏著片,其中上述樹脂層設置於上述第1黏著劑層與上述第2黏著劑層之間。 [10] The laminated adhesive sheet according to [9], wherein the resin layer is provided between the first adhesive layer and the second adhesive layer.
[11]如[9]之積層黏著片,其中於上述樹脂層上積層有上述第1黏著劑層,經由上述第1黏著劑層而於與上述樹脂層相反側積層有上述第2黏著劑層。 [11] The laminated adhesive sheet according to [9], wherein the first adhesive layer is laminated on the resin layer, and the second adhesive layer is laminated on the side opposite to the resin layer via the first adhesive layer. .
[12]如[9]至[11]中任一項之積層黏著片,其中上述樹脂層之頻率1MHz下之相對介電常數為2~10。 [12] The laminated adhesive sheet according to any one of [9] to [11], wherein the relative dielectric constant of the resin layer at a frequency of 1 MHz is 2 to 10.
[13]一種積層體,其係將如[1]至[12]中任一項之積層黏著片貼合於至少1個光學構件而形成。 [13] A laminated body formed by bonding the laminated adhesive sheet according to any one of [1] to [12] to at least one optical member.
[14]如[13]之積層體,其中上述光學構件中之至少1個為ITO(Indium Tin Oxides,氧化銦錫)玻璃或ITO膜。 [14] The laminated body according to [13], wherein at least one of the optical members is ITO (Indium Tin Oxides) glass or ITO film.
[15]一種相對介電常數調整方法,其特徵在於:其係調整至少具有2層黏著劑層之積層黏著片之相對介電常數之方法,且上述積層黏著片具有頻率1MHz下之相對介電常數未達4之第1黏著劑層、與頻率 1MHz下之相對介電常數為4以上之第2黏著劑層,藉由分別調整第1黏著劑層之頻率1MHz下之相對介電常數及厚度、與第2黏著劑層之頻率1MHz下之相對介電常數及厚度,而調整上述積層黏著片之相對介電常數。 [15] A relative dielectric constant adjustment method, characterized in that it is a method for adjusting the relative dielectric constant of a laminated adhesive sheet having at least two adhesive layers, and the laminated adhesive sheet has a relative dielectric constant at a frequency of 1 MHz First adhesive layer with constant less than 4 and frequency The second adhesive layer having a relative dielectric constant of 1 or more at 1 MHz is 4 or more. By adjusting the relative dielectric constant and thickness of the first adhesive layer at 1 MHz, the relative dielectric constant and thickness of the second adhesive layer at 1 MHz are adjusted. Dielectric constant and thickness, and adjust the relative dielectric constant of the laminated adhesive sheet.
[16]如[15]之相對介電常數調整方法,其中上述第1黏著劑層之頻率1MHz下之相對介電常數及厚度、與上述第2黏著劑層之頻率1MHz下之相對介電常數及厚度係使用下述式(1)進行調整,
(式(1)中,ε表示積層黏著片整體之相對介電常數,d表示積層黏著片整體之厚度;又,εn表示各黏著劑層之相對介電常數,dn表示各黏著劑層之厚度;再者,n表示黏著劑層之層數)。 (In formula (1), ε represents the relative dielectric constant of the entire laminated adhesive sheet, d represents the thickness of the entire laminated adhesive sheet; and ε n represents the relative dielectric constant of each adhesive layer, and d n represents each adhesive layer Thickness; furthermore, n represents the number of layers of the adhesive layer).
[17]如[16]之相對介電常數調整方法,其中於上述式(1)中,於ε1~εn為固定之條件下,以成為特定之ε之方式決定d1~dn。 [17] The relative dielectric constant adjustment method according to [16], wherein in the above formula (1), d 1 to d n are determined so as to become a specific ε under the condition that ε 1 to ε n are fixed.
[18]如[16]之相對介電常數調整方法,其中於上述式(1)中,於εn與dn為固定之條件下,以成為特定之ε之方式決定ε1~εn-1、與d1~dn-1。 [18] The relative permittivity adjustment method according to [16], wherein in the above formula (1), ε 1 and ε n- are determined to be specific ε under the condition that ε n and d n are fixed. 1. With d 1 ~ d n-1 .
[19]如[16]至[18]中任一項之相對介電常數調整方法,其中於上述式(1)中,n為2。 [19] The relative dielectric constant adjustment method according to any one of [16] to [18], wherein n is 2 in the above formula (1).
[20]一種積層黏著片之製造方法,其特徵在於:其係製造至少具有2層黏著劑層之積層黏著片之方法,且藉由如[16]至[19]中任一項之相對介電常數調整方法而調節積層黏著片之相對介電常數。 [20] A method for manufacturing a laminated adhesive sheet, which is characterized in that it is a method for producing a laminated adhesive sheet having at least two adhesive layers, and through the relative introduction of any one of [16] to [19] The dielectric constant adjustment method adjusts the relative dielectric constant of the laminated adhesive sheet.
根據本發明,可提供一種更準確地控制積層黏著片中之相對介電常數之方法。因此,於本發明中,可獲得具有所需之相對介電常數之積層黏著片。又,於本發明中,可準確地控制積層黏著片中之相對介電常數,故而可提高積層黏著片之生產效率,且可滿足於製造積層體時所要求之詳細之需求。 According to the present invention, a method for more accurately controlling the relative permittivity in a laminated adhesive sheet can be provided. Therefore, in the present invention, a laminated adhesive sheet having a desired relative dielectric constant can be obtained. In addition, in the present invention, the relative dielectric constant in the laminated adhesive sheet can be accurately controlled, so the production efficiency of the laminated adhesive sheet can be improved, and the detailed requirements required when manufacturing the laminated body can be met.
1‧‧‧第1黏著劑層 1‧‧‧ the first adhesive layer
2‧‧‧第2黏著劑層 2‧‧‧ 2nd adhesive layer
3‧‧‧第3黏著劑層 3‧‧‧ the third adhesive layer
5‧‧‧樹脂層 5‧‧‧ resin layer
10‧‧‧積層黏著片 10‧‧‧ laminated adhesive sheet
圖1(a)~(d)係本發明之積層黏著片之概略剖面圖。 1 (a) to (d) are schematic cross-sectional views of a laminated adhesive sheet according to the present invention.
圖2(a)、(b)係表示本發明之積層黏著片之另一態樣之概略剖面圖。 2 (a) and (b) are schematic cross-sectional views showing another aspect of the laminated adhesive sheet of the present invention.
以下,對本發明詳細地進行說明。於以下記載之構成要件之說明係基於代表性之實施形態或具體例而完成,但本發明並不限定於此種實施形態。再者,於本說明書中,用「~」表示之數值範圍意指包含於「~」前後記載之數值作為下限值及上限值之範圍。 Hereinafter, the present invention will be described in detail. The description of the constituent elements described below is completed based on a representative embodiment or a specific example, but the present invention is not limited to such an embodiment. In addition, in this specification, a numerical range indicated by "~" means a range including numerical values described before and after "~" as a lower limit value and an upper limit value.
(積層黏著片) (Laminated Adhesive Sheet)
本發明係關於一種至少具有第1黏著劑層與第2黏著劑層之積層黏著片。於本發明之積層黏著片中,第1黏著劑層與第2黏著劑層之頻率1MHz下之相對介電常數之差的絕對值為0.5以上。又,較佳為本發明之積層黏著片之第1黏著劑層之頻率1MHz下之相對介電常數未達4,第2黏著劑層之頻率1MHz下之相對介電常數為4以上。再者,本發明之積層黏著片可作為至少具有第1黏著劑層與第2黏著劑層之雙面黏著片而發揮功能。 The present invention relates to a laminated adhesive sheet having at least a first adhesive layer and a second adhesive layer. In the multilayer adhesive sheet of the present invention, the absolute value of the relative dielectric constant difference between the first adhesive layer and the second adhesive layer at a frequency of 1 MHz is 0.5 or more. The relative dielectric constant of the first adhesive layer of the laminated adhesive sheet of the present invention at a frequency of 1 MHz is preferably less than 4, and the relative dielectric constant of the second adhesive layer at a frequency of 1 MHz is 4 or more. Furthermore, the laminated adhesive sheet of the present invention can function as a double-sided adhesive sheet having at least a first adhesive layer and a second adhesive layer.
圖1(a)~(d)係本發明之積層黏著片10之概略剖面圖。如圖1(a)~(c)所示,積層黏著片10具有第1黏著劑層1與第2黏著劑層2。於圖1(a)~(c)中,積層黏著片10僅包含第1黏著劑層1與第2黏著劑層2,但亦可具有其他功能層或黏著劑層。例如,如圖1(d)所示,本發明之積層黏著片10除了具有第1黏著劑層1與第2黏著劑層2以外,亦可具有第3 黏著劑層3。再者,於積層黏著片10具有除黏著劑層以外之其他功能層之情形時,第1黏著劑層1、第2黏著劑層2及第3黏著劑層3中之至少任一者配置於最外層。 1 (a)-(d) are schematic cross-sectional views of a laminated adhesive sheet 10 according to the present invention. As shown in FIGS. 1 (a) to (c), the laminated adhesive sheet 10 includes a first adhesive layer 1 and a second adhesive layer 2. In FIGS. 1 (a) to (c), the laminated adhesive sheet 10 includes only the first adhesive layer 1 and the second adhesive layer 2, but may also have other functional layers or adhesive layers. For example, as shown in FIG. 1 (d), the laminated adhesive sheet 10 of the present invention may have a third adhesive layer in addition to the first adhesive layer 1 and the second adhesive layer 2. 胶 胶剂 层 3。 Adhesive layer 3. Furthermore, when the laminated adhesive sheet 10 has a functional layer other than the adhesive layer, at least any one of the first adhesive layer 1, the second adhesive layer 2 and the third adhesive layer 3 is disposed on Outermost.
於本發明之積層黏著片中,第1黏著劑層與第2黏著劑層之相對介電常數之差的絕對值為0.5以上。第1黏著劑層與第2黏著劑層之相對介電常數之差的絕對值較佳為1以上,更佳為2以上。可藉由將第1黏著劑層與第2黏著劑層之相對介電常數差設為如上所述之範圍,而容易地進行積層黏著片之相對介電常數之調整,進一步精度良好地調整積層黏著片之相對介電常數。 In the laminated adhesive sheet of the present invention, the absolute value of the difference between the relative dielectric constants of the first adhesive layer and the second adhesive layer is 0.5 or more. The absolute value of the difference between the relative dielectric constants of the first adhesive layer and the second adhesive layer is preferably 1 or more, more preferably 2 or more. By adjusting the relative dielectric constant difference between the first adhesive layer and the second adhesive layer to the range described above, the relative permittivity of the laminated adhesive sheet can be easily adjusted, and the laminated layer can be adjusted with good accuracy. Relative permittivity of the adhesive sheet.
於本發明中,第1黏著劑層之頻率1MHz下之相對介電常數較佳為未達4,更佳為未達3,進而較佳為未達2.5,更進而較佳為未達2。可藉由將第1黏著劑層之頻率1MHz下之相對介電常數設為上述範圍內,而進一步高效率地控制積層黏著片整體之相對介電常數。又,亦可將積層黏著片整體之相對介電常數抑制為較低。 In the present invention, the relative dielectric constant of the first adhesive layer at a frequency of 1 MHz is preferably less than 4, more preferably less than 3, even more preferably less than 2.5, and even more preferably less than 2. By setting the relative dielectric constant of the first adhesive layer at a frequency of 1 MHz to be within the above range, the relative dielectric constant of the entire laminated adhesive sheet can be further efficiently controlled. In addition, the relative permittivity of the entire laminated adhesive sheet can be suppressed to be low.
第2黏著劑層之頻率1MHz下之相對介電常數較佳為4以上,更佳為4.5以上,進而較佳為5以上,更進而較佳為5.5以上。可藉由如此將第1黏著劑層之頻率1MHz下之相對介電常數與第2黏著劑層之頻率1MHz下之相對介電常數設定為特定範圍,而控制積層黏著片整體之相對介電常數。 The relative dielectric constant of the second adhesive layer at a frequency of 1 MHz is preferably 4 or more, more preferably 4.5 or more, still more preferably 5 or more, and still more preferably 5.5 or more. The relative dielectric constant of the first adhesive layer at a frequency of 1 MHz and the relative dielectric constant of the second adhesive layer at a frequency of 1 MHz can be set to a specific range, and the relative dielectric constant of the entire laminated adhesive sheet can be controlled .
再者,本發明中之相對介電常數(ε)可利用JIS-C-2138中規定之方法而求出。 The relative dielectric constant (ε) in the present invention can be obtained by a method specified in JIS-C-2138.
第1黏著劑層與第2黏著劑層之厚度之比較佳為1:99~99:1。可藉由如此調整第1黏著劑層與第2黏著劑層之厚度,而控制積層黏著片整體之相對介電常數。 The thickness ratio of the first adhesive layer and the second adhesive layer is preferably 1:99 to 99: 1. By adjusting the thickness of the first adhesive layer and the second adhesive layer in this way, the relative dielectric constant of the entire laminated adhesive sheet can be controlled.
於本發明之積層黏著片中,可藉由以特定之條件設置第1黏著劑層與第2黏著劑層,而控制積層黏著片整體之相對介電常數。具體而 言,可藉由分別調整第1黏著劑層之相對介電常數及厚度、與第2黏著劑層之相對介電常數及厚度,而控制積層黏著片之相對介電常數。 In the laminated adhesive sheet of the present invention, the relative permittivity of the entire laminated adhesive sheet can be controlled by setting the first adhesive layer and the second adhesive layer under specific conditions. Specifically and In other words, the relative dielectric constant of the laminated adhesive sheet can be controlled by adjusting the relative dielectric constant and thickness of the first adhesive layer and the relative dielectric constant and thickness of the second adhesive layer, respectively.
於本發明中,第1黏著劑層之相對介電常數及厚度、與第2黏著劑層之相對介電常數及厚度可使用下述式(1)進行調整。 In the present invention, the relative permittivity and thickness of the first adhesive layer and the relative permittivity and thickness of the second adhesive layer can be adjusted using the following formula (1).
此處,式(1)中,ε表示積層黏著片整體之相對介電常數,d表示積層黏著片整體之厚度。又,εn表示各黏著劑層之相對介電常數,dn表示各黏著劑層之厚度。再者,n表示黏著劑層之層數。 Here, in formula (1), ε represents the relative dielectric constant of the entire laminated adhesive sheet, and d represents the thickness of the entire laminated adhesive sheet. In addition, ε n represents the relative dielectric constant of each adhesive layer, and d n represents the thickness of each adhesive layer. In addition, n represents the number of layers of the adhesive layer.
於本發明中,於形成具有某特定之相對介電常數之積層黏著片時,可使用上述式(1)而算出第1黏著劑層之相對介電常數及厚度、與第2黏著劑層之相對介電常數及厚度。即,若對積層黏著片要求之相對介電常數確定,且決定求出之積層黏著片之厚度,則可算出第1黏著劑層與第2黏著劑層之相對介電常數與厚度。 In the present invention, when forming a laminated adhesive sheet having a specific relative dielectric constant, the above-mentioned formula (1) can be used to calculate the relative dielectric constant and thickness of the first adhesive layer, and the relative dielectric constant and thickness of the second adhesive layer. Relative dielectric constant and thickness. That is, if the relative dielectric constant required for the laminated adhesive sheet is determined and the thickness of the laminated adhesive sheet is determined, the relative dielectric constant and thickness of the first adhesive layer and the second adhesive layer can be calculated.
於本發明中,具體而言,較佳為於如下所述之條件下調整介電常數。例如,於上述式(1)中,可於ε1~εn為固定之條件下,以成為特定之ε之方式,決定d1~dn。又,於上述式(1)中,可於εn與dn為固定之條件下,決定ε1~εn-1、與d1~dn-1。 In the present invention, specifically, it is preferable to adjust the dielectric constant under the conditions described below. For example, in the above-mentioned formula (1), d 1 to d n may be determined so as to become a specific ε under the condition that ε 1 to ε n are fixed. In the above formula (1), ε 1 to ε n-1 and d 1 to d n-1 can be determined under the condition that ε n and d n are fixed.
藉由如此配合積層黏著片之態樣而設定條件,而可使用上述式(1),選擇具有滿足被接著體之黏著物性之黏著劑,且形成具有所需之相對介電常數之積層黏著片。 By setting the conditions in accordance with the appearance of the laminated adhesive sheet, the above formula (1) can be used to select an adhesive having the adhesive physical properties of the adherend, and form a laminated adhesive sheet having the required relative dielectric constant. .
再者,於本發明中,於上述式(1)中,n較佳為2~6,更佳為2~4,進而較佳為2或3。藉由使用上述式(1),而可簡便地調整具有2層 以上之黏著劑層之積層黏著片之相對介電常數。 Furthermore, in the present invention, in the formula (1), n is preferably 2 to 6, more preferably 2 to 4, and even more preferably 2 or 3. By using the above formula (1), two layers can be easily adjusted. The relative dielectric constant of the laminated adhesive sheet of the above adhesive layer.
本發明之積層黏著片亦可具有第3黏著劑層。於積層黏著片具有第3黏著劑層之情形時,第3黏著劑層可為具有與不鄰接之第1黏著劑層或第2黏著劑層相同之相對介電常數之黏著劑層,亦可為具有與鄰接之第1黏著劑層或第2黏著劑層相同之相對介電常數之黏著劑層。即,第3黏著劑層可具有與鄰接之黏著劑層相同之相對介電常數,亦可具有不同之相對介電常數。又,於依序積層第1黏著劑層、第2黏著劑層及第3黏著劑層之情形時,第1黏著劑層與第3黏著劑層之相對介電常數亦可相同。 The laminated adhesive sheet of the present invention may have a third adhesive layer. In the case where the laminated adhesive sheet has a third adhesive layer, the third adhesive layer may be an adhesive layer having the same relative dielectric constant as the first adhesive layer or the second adhesive layer which are not adjacent to each other, or may be It is an adhesive layer which has the same relative dielectric constant as the adjacent 1st adhesive layer or 2nd adhesive layer. That is, the third adhesive layer may have the same relative permittivity as the adjacent adhesive layer, or may have a different relative permittivity. When the first adhesive layer, the second adhesive layer, and the third adhesive layer are sequentially stacked, the relative dielectric constants of the first adhesive layer and the third adhesive layer may be the same.
又,第3黏著劑層亦可為具有與第1黏著劑層及第2黏著劑層之任一者均不同之相對介電常數之黏著劑層。於積層黏著片具有第3黏著劑層之情形時,第3黏著劑層之相對介電常數、與鄰接之第1黏著劑層或第2黏著劑層之相對介電常數之差的絕對值較佳為0.5以上,更佳為1以上,進而較佳為2以上。進而,較佳為所有黏著劑層間之相對介電常數之差的絕對值均為上述範圍內。即,較佳為第1黏著劑層之相對介電常數與第2黏著劑層之相對介電常數之差的絕對值為上述範圍內,較佳為第2黏著劑層之相對介電常數與第3黏著劑層之相對介電常數之差的絕對值為上述範圍內,較佳為第1黏著劑層與第3黏著劑層之相對介電常數之差的絕對值為上述範圍內。 The third adhesive layer may be an adhesive layer having a relative dielectric constant different from that of either the first adhesive layer or the second adhesive layer. When the laminated adhesive sheet has a third adhesive layer, the absolute value of the difference between the relative dielectric constant of the third adhesive layer and the relative permittivity of the adjacent first adhesive layer or the second adhesive layer is smaller. It is preferably 0.5 or more, more preferably 1 or more, and even more preferably 2 or more. Furthermore, it is preferable that the absolute value of the relative dielectric constant difference between all the adhesive layers is within the above range. That is, the absolute value of the difference between the relative permittivity of the first adhesive layer and the relative permittivity of the second adhesive layer is preferably within the above range, and the relative permittivity of the second adhesive layer and The absolute value of the difference between the relative dielectric constants of the third adhesive layer is within the above range, and the absolute value of the difference between the relative dielectric constants of the first adhesive layer and the third adhesive layer is preferably within the above range.
於積層黏著片具有3層以上之黏著劑層之情形時,於上述式(1)中,亦可於ε1與εn、d1與dn為固定之條件下,決定ε2~εn-1、與d2~dn-1。於該情形時,可藉由調整存在於積層黏著片之內側之黏著劑層之相對介電常數與厚度,而形成具有所需之相對介電常數之積層黏著片。 When the laminate composed of an adhesive sheet having a case are more than three layers layer of adhesive, in the above formula (1), also in [epsilon] 1 and ε n, d 1 and d n is fixed the condition to decide ε 2 ~ ε n -1 and d 2 to d n-1 . In this case, a laminated adhesive sheet having a desired relative permittivity can be formed by adjusting the relative dielectric constant and thickness of the adhesive layer existing on the inner side of the laminated adhesive sheet.
即,於n為3以上之積層黏著片之情形時,可預先設定作為接著於被接著體之黏著劑層(以下,稱為最外黏著劑層)之具有滿足被接著 體之適當之黏著物性之黏著劑與厚度,且可藉由使用上述(1)式,而求出用以將積層黏著片整體之介電常數設為所需者之最外黏著劑層以外之層之厚度。藉此,可獲得可同時達成所需之黏著物性與介電常數之積層黏著片。 That is, in the case of a laminated adhesive sheet in which n is 3 or more, it can be set in advance as having an adhesive layer (hereinafter, referred to as the outermost adhesive layer) to be adhered to the adherend. The proper adhesive properties and thickness of the adhesive body can be obtained by using the above formula (1) to set the dielectric constant of the entire laminated adhesive sheet to the desired outermost adhesive layer. The thickness of the layer. Thereby, a laminated adhesive sheet can be obtained that can simultaneously achieve the required adhesive physical properties and dielectric constant.
本發明之積層黏著片之第1黏著劑層與第2黏著劑層之各層之厚度較佳為10μm以上。若為上述下限值以上,則可精度良好地調整積層黏著片整體之相對介電常數。積層黏著片整體之厚度較佳為20~1000μm,尤其是最外黏著劑層之厚度較佳為10~100μm,更佳為25~50μm。藉由將最外黏著劑層之厚度於上述範圍內調整,而使其成為具有滿足被接著體之黏著物性之積層黏著片。又,於本發明之積層黏著片具有第3黏著劑層之情形時,第3黏著劑層之厚度亦較佳為上述範圍內。 The thickness of each of the first adhesive layer and the second adhesive layer of the laminated adhesive sheet of the present invention is preferably 10 μm or more. If it is more than the said lower limit value, the relative dielectric constant of the whole laminated adhesive sheet can be adjusted with high precision. The thickness of the entire laminated adhesive sheet is preferably 20 to 1000 μm, especially the thickness of the outermost adhesive layer is preferably 10 to 100 μm, and more preferably 25 to 50 μm. By adjusting the thickness of the outermost adhesive layer within the above-mentioned range, it is made into a laminated adhesive sheet having the adhesive physical properties of the adherend. When the laminated adhesive sheet of the present invention has a third adhesive layer, the thickness of the third adhesive layer is also preferably within the above range.
如此,本發明係關於調整至少具有2層黏著劑層之積層黏著片之相對介電常數之方法,且係使用上述式(1)之相對介電常數調整方法者。可藉由使用本發明之相對介電常數調整方法,而容易地形成具有各種相對介電常數之積層黏著片。藉此,可精度良好地控制積層黏著片整體之相對介電常數。 Thus, the present invention is a method for adjusting the relative dielectric constant of a laminated adhesive sheet having at least two adhesive layers, and is a method for adjusting the relative dielectric constant of the above formula (1). By using the relative dielectric constant adjustment method of the present invention, a laminated adhesive sheet having various relative dielectric constants can be easily formed. Thereby, the relative dielectric constant of the entire laminated adhesive sheet can be accurately controlled.
進而,本發明亦係關於至少具有2層黏著劑層之積層黏著片之製造方法,且係包括藉由使用上述式(1)之相對介電常數調整方法而調節積層黏著片之相對介電常數之步驟的積層黏著片之製造方法者。亦可藉由使用此種製造方法,而提高積層黏著片之生產效率。 Furthermore, the present invention also relates to a method for manufacturing a laminated adhesive sheet having at least two adhesive layers, and includes adjusting the relative dielectric constant of the laminated adhesive sheet by using the relative dielectric constant adjustment method of the above formula (1). A method for manufacturing a laminated adhesive sheet in the steps. It is also possible to improve the production efficiency of the laminated adhesive sheet by using this manufacturing method.
(黏著劑) (Adhesive)
作為形成第1黏著劑層與第2黏著劑層之黏著主劑,為了不降低顯示裝置等之視認性,較佳為使用具有透明性者。例如可使用丙烯酸系黏著劑、聚矽氧系黏著劑、聚酯系黏著劑、橡膠系黏著劑、聚胺基甲酸酯系黏著劑等公知之黏著劑。其中,較佳為使用丙烯酸系黏著 劑,較佳為含有丙烯酸系聚合物作為基礎聚合物之丙烯酸系黏著劑。 As an adhesion main agent for forming the first adhesive layer and the second adhesive layer, in order not to reduce visibility of a display device or the like, it is preferable to use one having transparency. For example, a known adhesive such as an acrylic adhesive, a silicone adhesive, a polyester adhesive, a rubber adhesive, a polyurethane adhesive, or the like can be used. Among them, it is preferable to use acrylic adhesive. The agent is preferably an acrylic adhesive containing an acrylic polymer as a base polymer.
丙烯酸系聚合物含有非交聯性之(甲基)丙烯酸酯單元、及具有交聯性官能基之丙烯酸系單體單元。此處,「單體單元」係構成聚合物之重複單元。「丙烯酸系單體」係具有(甲基)丙烯醯基之化合物。「(甲基)丙烯醯基」表示丙烯醯基或甲基丙烯醯基。又,非交聯性丙烯酸系單體為不具有交聯性基之丙烯酸系單體,交聯性單體為具有交聯性基之單體。交聯性單體只要為可與非交聯性丙烯酸系單體聚合者,則可為丙烯酸系單體,亦可為非丙烯酸系單體,較佳為丙烯酸系單體。再者,作為交聯性基,可列舉:羧基、羥基、胺基、環氧基、縮水甘油基等。 The acrylic polymer contains a non-crosslinkable (meth) acrylate unit and an acrylic monomer unit having a crosslinkable functional group. Here, the "monomer unit" is a repeating unit constituting a polymer. The "acrylic monomer" is a compound having a (meth) acrylfluorenyl group. "(Meth) acrylfluorenyl" means acrylfluorenyl or methacrylfluorenyl. The non-crosslinkable acrylic monomer is an acrylic monomer having no crosslinkable group, and the crosslinkable monomer is a monomer having a crosslinkable group. As long as a crosslinkable monomer is polymerizable with a non-crosslinkable acrylic monomer, it may be an acrylic monomer or a non-acrylic monomer, and an acrylic monomer is preferable. Examples of the crosslinkable group include a carboxyl group, a hydroxyl group, an amine group, an epoxy group, and a glycidyl group.
作為非交聯性丙烯酸系單體單元,例如可列舉:使(甲基)丙烯酸之羧基之氫原子被烴基所取代之(甲基)丙烯酸酯單元。於本發明中,各黏著劑層較佳為含有(甲基)丙烯酸酯單元。 Examples of the non-crosslinkable acrylic monomer unit include a (meth) acrylic acid ester unit in which a hydrogen atom of a carboxyl group of (meth) acrylic acid is replaced with a hydrocarbon group. In the present invention, each adhesive layer preferably contains a (meth) acrylate unit.
(甲基)丙烯酸酯單元中之烴基之碳數較佳為1~18,更佳為1~8。再者,烴基亦可具有取代基,作為取代基,只要為不含交聯性基者,則並無特別限定,例如可列舉:甲氧基、乙氧基等烷氧基。 The carbon number of the hydrocarbon group in the (meth) acrylate unit is preferably 1 to 18, and more preferably 1 to 8. The hydrocarbon group may have a substituent. The substituent is not particularly limited as long as it does not contain a crosslinkable group, and examples thereof include alkoxy groups such as a methoxy group and an ethoxy group.
作為(甲基)丙烯酸酯,具體而言,可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸正戊酯、(甲基)丙烯酸正己酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸正壬酯、(甲基)丙烯酸異酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸正癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸正十一烷基酯、(甲基)丙烯酸正十二烷基酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基乙酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸苄酯。其 中,就接著性之方面而言,較佳為使用丙烯酸正丁酯、丙烯酸2-乙基己酯、丙烯酸甲酯。該等可單獨使用1種,或併用2種以上。再者,於本發明中,所謂「(甲基)丙烯酸」,意指包含「丙烯酸」及「甲基丙烯酸」之兩者。 Specific examples of the (meth) acrylate include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, and (methyl) N-butyl acrylate, isobutyl (meth) acrylate, tertiary butyl (meth) acrylate, n-amyl (meth) acrylate, n-hexyl (meth) acrylate, (meth) acrylic acid 2- Ethylhexyl, n-octyl (meth) acrylate, isooctyl (meth) acrylate, n-nonyl (meth) acrylate, iso- (meth) acrylate Ester, isononyl (meth) acrylate, n-decyl (meth) acrylate, isodecyl (meth) acrylate, n-undecyl (meth) acrylate, n-dodecane (meth) acrylate Ester, stearyl (meth) acrylate, methoxyethyl (meth) acrylate, ethoxyethyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate . Among these, in terms of adhesiveness, n-butyl acrylate, 2-ethylhexyl acrylate, and methyl acrylate are preferably used. These can be used alone or in combination of two or more. Furthermore, in the present invention, "(meth) acrylic acid" means both "acrylic acid" and "methacrylic acid".
作為交聯性單體單元,可列舉:含羧基之共聚性單體單元、含羥基之共聚性單體單元、含胺基之共聚性單體單元、含縮水甘油基之共聚性單體單元。作為含羧基之共聚性單體,例如可列舉:丙烯酸、甲基丙烯酸、丁烯酸、順丁烯二酸、反丁烯二酸、伊康酸、檸康酸、戊烯二酸等α,β-不飽和羧酸或其酸酐等。 Examples of the crosslinkable monomer unit include a carboxyl group-containing copolymerizable monomer unit, a hydroxyl group-containing copolymerizable monomer unit, an amine group-containing copolymerizable monomer unit, and a glycidyl group-containing copolymerizable monomer unit. Examples of the carboxyl group-containing copolymerizable monomer include acrylic acid, methacrylic acid, butene acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, and glutaric acid. β-unsaturated carboxylic acid or anhydride thereof.
作為含羥基之共聚性單體,例如可列舉:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸2-羥基丙酯等(甲基)丙烯酸羥基烷基酯、(甲基)丙烯酸單(二乙二醇)等(甲基)丙烯酸[(單、二或聚)伸烷基二醇]、(甲基)丙烯酸單己內酯等(甲基)丙烯酸內酯。 Examples of the hydroxy-containing copolymerizable monomer include (meth) groups such as 2-hydroxyethyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, and 2-hydroxypropyl (meth) acrylate. (Meth) acrylic acid [(mono, di or poly) alkylene glycol], (meth) acrylic acid mono (diethylene glycol), etc. (Meth) acrylate.
作為含胺基之共聚性單體,例如可列舉:(甲基)丙烯醯胺、烯丙醯胺等。 Examples of the amine-group-containing copolymerizable monomer include (meth) acrylamide, allylamine, and the like.
作為含縮水甘油基之共聚性單體,例如可列舉:(甲基)丙烯酸縮水甘油酯等。 Examples of the glycidyl group-containing copolymerizable monomer include glycidyl (meth) acrylate and the like.
該等之中,就黏著性、交聯性及聚合性、進而用於透明導電膜之摻錫氧化銦或用於電磁波遮罩之銅等金屬之腐蝕性較小之方面而言,較佳為含羥基之共聚性單體,更佳為(甲基)丙烯酸羥基烷基酯,尤佳為(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸4-羥基丁酯。 Among these, in terms of adhesion, crosslinkability, and polymerizability, and further less corrosiveness of metals such as tin-doped indium oxide used for transparent conductive films or copper used for electromagnetic wave masks, The hydroxyl-containing copolymerizable monomer is more preferably a hydroxyalkyl (meth) acrylate, more preferably 2-hydroxyethyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate.
再者,於含有含羧基之共聚性單體單元作為交聯性單體單元之情形時,酸性變強,故而若接觸摻錫氧化銦膜或金屬膜等具有腐蝕性之膜,則有腐蝕該等膜之情況。因此,就防腐蝕性之方面而言,於含有含羧基之共聚性單體單元作為交聯性單體單元之情形時,其含有率較佳為未達0.5質量%,更佳為完全不含有。又,作為積層黏著片整 體,就防腐蝕性之方面而言,較佳為該丙烯酸系聚合物中之含羧基之共聚性單體單元之含有率未達1.0質量%。 In addition, when a carboxyl group-containing copolymerizable monomer unit is included as a crosslinkable monomer unit, the acidity becomes strong. Therefore, if it comes into contact with a corrosive film such as a tin-doped indium oxide film or a metal film, it will corrode the Isometric conditions. Therefore, in terms of corrosion resistance, when a carboxyl group-containing copolymerizable monomer unit is included as a crosslinkable monomer unit, the content ratio is preferably less than 0.5% by mass, and more preferably no content at all. . Also, as a laminated adhesive sheet In terms of corrosion resistance, the content of the carboxyl-containing copolymerizable monomer unit in the acrylic polymer is preferably not more than 1.0% by mass.
又,丙烯酸系聚合物亦可具有除非交聯性丙烯酸系單體單元及交聯性單體單元以外之其他單體單元。作為其他單體,可列舉:(甲基)丙烯腈、乙酸乙烯酯、苯乙烯、氯乙烯、乙烯基吡咯啶酮、乙烯基吡啶等。 The acrylic polymer may have other monomer units other than the crosslinkable acrylic monomer unit and the crosslinkable monomer unit. Examples of other monomers include (meth) acrylonitrile, vinyl acetate, styrene, vinyl chloride, vinylpyrrolidone, and vinylpyridine.
丙烯酸系聚合物中之其他單體單元之含有率較佳為0.1~20質量%,更佳為0.5~10質量%。若其他單體單元之含有率為上述下限值以上,則可容易地調整物性,若為上述上限值以下,則可防止因經時劣化所引起之黃變等。 The content of other monomer units in the acrylic polymer is preferably 0.1 to 20% by mass, and more preferably 0.5 to 10% by mass. If the content rate of the other monomer units is equal to or more than the above-mentioned lower limit value, physical properties can be easily adjusted. When the content rate of the other monomer units is equal to or less than the above-mentioned upper limit value, yellowing due to deterioration with time can be prevented.
各黏著劑層之相對介電常數可藉由適當選擇用於黏著劑之樹脂之種類而設為所需之值。例如,於提高相對介電常數之情形時,較佳為使用極性相對高之(甲基)丙烯酸酯單元例如,(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯等。其中,就透明性、或第1黏著劑層與第2黏著劑層之密接性之觀點而言,較佳為(甲基)丙烯酸甲酯、(甲基)丙烯酸正丁酯。 The relative dielectric constant of each adhesive layer can be set to a desired value by appropriately selecting the type of resin used for the adhesive. For example, in the case of increasing the relative dielectric constant, it is preferable to use a (meth) acrylic acid ester unit having a relatively high polarity, such as (meth) acrylic acid methyl ester, (meth) acrylic acid ethyl ester, and (meth) acrylic acid. Propyl ester, isopropyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, third butyl (meth) acrylate, and the like. Among them, methyl (meth) acrylate and n-butyl (meth) acrylate are preferred from the viewpoints of transparency and adhesion between the first adhesive layer and the second adhesive layer.
又,作為交聯性單體單元,同樣地只要使用極性相對高之含羧基之共聚性單體單元、含羥基之共聚性單體單元、含胺基之共聚性單體單元即可,作為含羧基之共聚性單體,例如可列舉:丙烯酸、甲基丙烯酸、丁烯酸、順丁烯二酸、反丁烯二酸、伊康酸、檸康酸、戊烯二酸等α,β-不飽和羧酸或其酸酐,作為含羥基之共聚性單體,例如可列舉:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸2-羥基丙酯等(甲基)丙烯酸羥基烷基酯、(甲基)丙烯酸單(二乙二醇)等(甲基)丙烯酸[(單、二或聚)伸烷基二醇]、(甲基)丙烯酸單己內酯等(甲基)丙烯酸內酯,作為含胺基之共聚性單體,例如可列舉:(甲 基)丙烯醯胺、烯丙醯胺等。其中,就相對介電常數之控制之容易性之觀點而言,極性基於分子整體中所占之比率增高,故而較佳為(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸4-羥基丁酯。 In addition, as the crosslinkable monomer unit, similarly, it is only necessary to use a carboxyl group-containing copolymerizable monomer unit, a hydroxyl group-containing copolymerizable monomer unit, and an amine group-containing copolymerizable monomer unit having relatively high polarity. Examples of the copolymerizable monomers of a carboxyl group include acrylic acid, methacrylic acid, butenoic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, and glutaric acid. Unsaturated carboxylic acid or its anhydride, as a hydroxyl-containing copolymerizable monomer, for example, 2-hydroxyethyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 2- (meth) acrylate 2- Hydroxyalkyl (meth) acrylates such as hydroxypropyl esters, (meth) acrylic acid ((mono, di, or poly) alkylene glycols) such as (meth) acrylic acid mono (diethylene glycol), (methyl (Meth) acrylic lactones such as monocaprolactone, etc., as the copolymerizable monomer containing an amine group, for example: Group) acrylamide, allylamine and the like. Among them, from the viewpoint of the ease of controlling the relative dielectric constant, the polarity is based on the fact that the ratio of the molecule as a whole is increased. Therefore, 2-hydroxyethyl (meth) acrylate and 4-hydroxy (meth) acrylate are preferred. Hydroxybutyl ester.
另一方面,於降低黏著劑層之相對介電常數之情形時,只要使用極性較低者即可。例如可列舉:(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸正壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸正癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸正十一烷基酯、(甲基)丙烯酸正十二烷基酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸苄酯、丙烯酸環己酯或丙烯酸異酯等脂環式化合物,其中,就透明性或黏著劑層之密接性之觀點而言,又,就可達成使相對介電常數未達4之方面而言,較佳為(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異酯。 On the other hand, in the case where the relative dielectric constant of the adhesive layer is reduced, it is only necessary to use the one having a lower polarity. Examples include 2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, n-nonyl (meth) acrylate, isonon (meth) acrylate Ester, n-decyl (meth) acrylate, isodecyl (meth) acrylate, n-undecyl (meth) acrylate, n-dodecyl (meth) acrylate, hard (meth) acrylate Aliphatic ester, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, cyclohexyl acrylate or isopropyl acrylate Among alicyclic compounds such as esters, (meth) acrylic acid is preferred from the viewpoint of transparency or adhesiveness of the adhesive layer, and from the viewpoint of achieving a relative dielectric constant of less than 4. 2-ethylhexyl ester, (meth) acrylic acid iso ester.
亦可於各黏著劑層中使用交聯劑。作為交聯劑,例如可列舉:異氰酸酯化合物、環氧化合物、唑啉化合物、氮丙啶化合物、金屬螯合物化合物、丁基化三聚氰胺化合物等。該等交聯劑之中,就可容易地交聯丙烯酸系聚合物之方面而言,較佳為異氰酸酯化合物、環氧化合物。尤其是於丙烯酸系聚合物僅含有含羥基之共聚性單體單元作為交聯性單體單元之情形時,就羥基之反應性而言,較佳為使用異氰酸酯化合物。 A cross-linking agent may also be used in each adhesive layer. Examples of the crosslinking agent include isocyanate compounds, epoxy compounds, An oxazoline compound, an aziridine compound, a metal chelate compound, a butylated melamine compound, and the like. Among these crosslinking agents, an isocyanate compound and an epoxy compound are preferred because they can easily crosslink an acrylic polymer. In particular, when the acrylic polymer contains only a copolymerizable monomer unit containing a hydroxyl group as a crosslinkable monomer unit, it is preferable to use an isocyanate compound in terms of the reactivity of the hydroxyl group.
作為異氰酸酯化合物,例如可列舉:甲苯二異氰酸酯、苯二甲基二異氰酸酯、六亞甲基二異氰酸酯、異佛爾酮二異氰酸酯等。作為環氧化合物,例如可列舉:乙二醇二縮水甘油醚、聚乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、聚丙二醇二縮水甘油醚、甘油二縮水甘油醚、新戊二醇二縮水甘油醚、1,6-己二醇二縮水甘油醚、四縮水甘油基苯二甲胺、1,3-雙(N,N-二縮水甘油胺甲基)環己烷、三羥甲基丙 烷聚縮水甘油醚、二甘油聚縮水甘油醚、聚甘油聚縮水甘油醚、山梨糖醇聚縮水甘油醚等。交聯劑之含量較佳為根據成為所需之黏著物性而適當選擇。 Examples of the isocyanate compound include toluene diisocyanate, xylylene diisocyanate, hexamethylene diisocyanate, and isophorone diisocyanate. Examples of the epoxy compound include ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, glycerol diglycidyl ether, and neopentyl glycol diethylene glycol. Glycidyl ether, 1,6-hexanediol diglycidyl ether, tetraglycidyl xylylenediamine, 1,3-bis (N, N-diglycidylamine methyl) cyclohexane, trimethylol C Alkyl polyglycidyl ether, diglycerol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitol polyglycidyl ether, and the like. The content of the cross-linking agent is preferably appropriately selected depending on the desired adhesive properties.
[添加劑] [additive]
又,亦可於各黏著劑層中,視需要含有抗氧化劑、抗金屬腐蝕劑、黏著賦予劑、矽烷偶合劑、紫外線吸收劑、受阻胺系化合物等光穩定劑、填充劑等其他添加劑。 Further, each of the adhesive layers may contain other additives such as light stabilizers such as antioxidants, anti-corrosive agents, adhesion-imparting agents, silane coupling agents, ultraviolet absorbers, hindered amine compounds, and fillers as necessary.
作為抗氧化劑,可列舉:酚系抗氧化劑、胺系抗氧化劑、內酯系抗氧化劑、磷系抗氧化劑、硫系抗氧化劑等。該等抗氧化劑可單獨使用1種,亦可併用2種以上。 Examples of the antioxidant include a phenol-based antioxidant, an amine-based antioxidant, a lactone-based antioxidant, a phosphorus-based antioxidant, and a sulfur-based antioxidant. These antioxidants may be used individually by 1 type, and may use 2 or more types together.
作為抗金屬腐蝕劑,就黏著劑之相溶性或效果之高度之方面而言,較佳為苯并三唑系樹脂。 As the anti-corrosive agent, a benzotriazole-based resin is preferred in terms of the compatibility of the adhesive or the height of the effect.
作為黏著賦予劑,例如可列舉:松香系樹脂、萜烯系樹脂、萜酚系樹脂、薰草咔-茚系樹脂、苯乙烯系樹脂、二甲苯系樹脂、酚系樹脂、石油樹脂等。 Examples of the adhesion-imparting agent include a rosin-based resin, a terpene-based resin, a terpene-based resin, a lavender-indene-based resin, a styrene-based resin, a xylene-based resin, a phenol-based resin, and a petroleum resin.
作為矽烷偶合劑,例如可列舉:巰基烷氧基矽烷化合物(例如,經巰基取代之烷氧基低聚物等)等。 Examples of the silane coupling agent include a mercaptoalkoxysilane compound (for example, an alkoxy oligomer substituted with a mercapto group).
作為紫外線吸收劑,例如可列舉:苯并三唑系化合物、二苯甲酮系化合物等。 Examples of the ultraviolet absorber include benzotriazole-based compounds and benzophenone-based compounds.
(樹脂層) (Resin layer)
本發明之積層黏著片除具有上述第1黏著劑層、第2黏著劑層及第3黏著劑層以外,亦可進而具有樹脂層。樹脂層可為黏著劑層,亦可為非黏著性之樹脂層。又,可為單層,亦可為複數層。於樹脂層為非黏著性之樹脂層之情形時,作為所使用之樹脂,較佳為對光學物性不產生影響者,例如可列舉:聚碳酸酯、聚對苯二甲酸乙二酯、聚甲基丙烯酸甲酯、聚萘二甲酸乙二酯、環烯烴聚合物、三乙醯纖維素、 聚醯亞胺、醯化纖維素等。 The laminated adhesive sheet of the present invention may have a resin layer in addition to the above-mentioned first adhesive layer, second adhesive layer, and third adhesive layer. The resin layer may be an adhesive layer or a non-adhesive resin layer. It may be a single layer or a plurality of layers. In the case where the resin layer is a non-adhesive resin layer, the resin to be used is preferably one that does not affect the optical properties. Examples include polycarbonate, polyethylene terephthalate, and polymethylmethacrylate. Methyl acrylate, polyethylene naphthalate, cycloolefin polymer, triethyl cellulose, Polyimide, tritiated cellulose, etc.
樹脂層為黏著劑層之情形時之黏著主劑與用於各黏著劑層之黏著主劑同樣,較佳為具有不降低顯示裝置之視認性之程度之透明性者。例如可使用:丙烯酸系黏著劑、聚矽氧系黏著劑、聚酯系黏著劑、橡膠系黏著劑、聚胺基甲酸酯系黏著劑等公知之黏著劑,尤其就耐久性之觀點而言,較佳為含有以烷基之碳數為1~18之(甲基)丙烯酸烷基酯作為主單體成分之丙烯酸系聚合物作為基礎聚合物之丙烯酸系黏著劑。 In the case where the resin layer is an adhesive layer, the adhesive main agent is the same as the adhesive main agent used for each adhesive layer, and is preferably one having a degree of transparency that does not reduce the visibility of the display device. For example, known adhesives such as acrylic adhesives, silicone adhesives, polyester adhesives, rubber adhesives, and polyurethane adhesives can be used, especially from the viewpoint of durability. It is preferably an acrylic adhesive containing an acrylic polymer containing an alkyl (meth) acrylic acid alkyl ester having 1 to 18 carbon atoms as a main monomer component as a base polymer.
於圖2中,表示本發明之積層黏著片10之另一態樣之概略剖面圖。如圖2所示,本發明之積層黏著片10具有第1黏著劑層1、第2黏著劑層2及樹脂層5。於本發明中,亦可如圖2(a)所示,將樹脂層5設置於第1黏著劑層1與第2黏著劑層2之間。於該情形時,以樹脂層5為中介而於兩面設置黏著劑層,故而積層黏著片可作為雙面黏著片而發揮功能。 FIG. 2 is a schematic cross-sectional view showing another aspect of the laminated adhesive sheet 10 of the present invention. As shown in FIG. 2, the laminated adhesive sheet 10 of the present invention includes a first adhesive layer 1, a second adhesive layer 2, and a resin layer 5. In the present invention, as shown in FIG. 2 (a), the resin layer 5 may be provided between the first adhesive layer 1 and the second adhesive layer 2. In this case, an adhesive layer is provided on both sides with the resin layer 5 as an intermediary, so the laminated adhesive sheet can function as a double-sided adhesive sheet.
又,亦可如圖2(b)所示,於樹脂層5上積層第1黏著劑層1,經由第1黏著劑層1而於與樹脂層5相反側設置第2樹脂層2。於該情形時,第2黏著劑層2與光學構件等被接著物進行接著,故而第2黏著劑層2較佳為含有與被接著物之接著性優異之樹脂。 Alternatively, as shown in FIG. 2 (b), the first adhesive layer 1 may be laminated on the resin layer 5, and the second resin layer 2 may be provided on the side opposite to the resin layer 5 through the first adhesive layer 1. In this case, since the second adhesive layer 2 is adhered to an adherend such as an optical member, the second adhesive layer 2 preferably contains a resin having excellent adhesiveness with the adherend.
樹脂層之頻率1MHz下之相對介電常數較佳為2~10。可藉由將樹脂層之頻率1MHz下之相對介電常數設為此種範圍,而容易地進行積層黏著片之相對介電常數之調整,進一步精度良好地對積層黏著片調整相對介電常數。再者,對於樹脂層之相對介電常數,亦較佳為藉由適當選擇使用之樹脂之種類而進行調整。 The relative dielectric constant of the resin layer at 1 MHz is preferably 2 to 10. By setting the relative dielectric constant of the resin layer at 1 MHz to such a range, the relative dielectric constant of the laminated adhesive sheet can be easily adjusted, and the relative dielectric constant of the laminated adhesive sheet can be adjusted with good accuracy. The relative dielectric constant of the resin layer is preferably adjusted by appropriately selecting the type of resin to be used.
樹脂層之厚度較佳為10~500μm,更佳為25~250μm。若樹脂層之厚度為上述下限值以上,則容易控制積層黏著片整體之相對介電常數,若樹脂層之厚度為上述上限值以下,則可容易地製造積層黏著 片。 The thickness of the resin layer is preferably 10 to 500 μm, and more preferably 25 to 250 μm. If the thickness of the resin layer is greater than the above-mentioned lower limit value, it is easy to control the relative dielectric constant of the entire laminated adhesive sheet, and if the thickness of the resin layer is less than the above-mentioned upper limit value, the laminated adhesive can be easily manufactured. sheet.
(附剝離片材之積層黏著片) (Laminated adhesive sheet with release sheet)
本發明之積層黏著片例如可藉由於剝離片材上塗敷第1黏著劑組合物與第2黏著劑組合物而形成塗膜,並加熱該塗膜而製成硬化物而獲得。作為剝離片材,可列舉:具有剝離片材用基材與設置於該剝離片材用基材之單面之剝離劑層之剝離性積層片材、或作為低極性基材之聚乙烯膜或聚丙烯膜等聚烯烴膜。 The laminated adhesive sheet of the present invention can be obtained, for example, by forming a coating film by applying the first adhesive composition and the second adhesive composition to a release sheet, and heating the coating film to obtain a cured product. Examples of the release sheet include a release laminate sheet having a substrate for a release sheet and a release agent layer provided on one side of the substrate for the release sheet, a polyethylene film as a low-polarity substrate, or Polyolefin film such as polypropylene film.
作為剝離性積層片材中之剝離片材用基材,可使用紙類、高分子膜。作為構成剝離劑層之剝離劑,例如可使用通用之加成型或縮合型之聚矽氧系剝離劑或含長鏈烷基之化合物。 As a base material for a release sheet in a release laminated sheet, paper or a polymer film can be used. As the release agent constituting the release agent layer, for example, a general-purpose addition-type or condensation-type silicone release agent or a compound containing a long-chain alkyl group can be used.
作為聚矽氧系剝離劑,具體而言,可列舉:Dow Corning Toray Silicone公司製造之BY24-4527、SD-7220等,或信越化學工業(股)製造之KS-3600、KS-774、X62-2600等。又,較佳為於聚矽氧系剝離劑中含有具有SiO2單元與(CH3)3SiO1/2單元或CH2=CH(CH3)SiO1/2單元之有機矽化合物之聚矽氧樹脂。作為聚矽氧樹脂之具體例,可列舉:Dow Corning Toray Silicone公司製造之BY24-843、SD-7292、SHR-1404等,或信越化學工業(股)製造之KS-3800、X92-183等。 Specific examples of the silicone release agent include BY24-4527 and SD-7220 manufactured by Dow Corning Toray Silicone, or KS-3600, KS-774, and X62- manufactured by Shin-Etsu Chemical Industry Co., Ltd. 2600 and so on. In addition, it is preferable that the polysilicone-based release agent contains polysilicon containing an organic silicon compound having SiO 2 units and (CH 3 ) 3 SiO 1/2 units or CH 2 = CH (CH 3 ) SiO 1/2 units. Oxygen resin. Specific examples of the silicone resin include BY24-843, SD-7292, and SHR-1404 manufactured by Dow Corning Toray Silicone, or KS-3800 and X92-183 manufactured by Shin-Etsu Chemical Industry Co., Ltd.
為了將剝離片材容易地剝離,較佳為使第1黏著劑層側剝離片材與第2黏著劑層側剝離片材各自剝離性不同。即,若自一者之剝離性與自另一者之剝離性不同,則容易先僅將剝離性較高者之剝離片材剝離。於該情形時,只要根據貼合方法或貼合順序調整第1黏著劑層側剝離片材與第2黏著劑層側剝離片材之剝離性即可。 In order to easily peel the release sheet, it is preferable that the first adhesive layer-side release sheet and the second adhesive layer-side release sheet have different releasability from each other. That is, if the releasability from one is different from the releasability from the other, it is easy to first peel only the release sheet with the higher releasability. In this case, it is only necessary to adjust the releasability of the first adhesive layer-side release sheet and the second adhesive layer-side release sheet according to the bonding method or the bonding order.
形成各黏著劑層之黏著劑組合物之塗敷可使用公知之塗敷裝置而實施。黏著劑組合物可塗敷於每個黏著劑層,亦可將黏著劑組合物同時多層塗敷,藉此形成2層以上之黏著劑層。作為塗敷裝置,例如可列舉:刮刀塗佈機、氣刀塗佈機、輥式塗佈機、棒式塗佈機、凹版 塗佈機、微凹版塗佈機、桿式刮刀塗佈機、模唇塗佈機、模具塗佈機、簾幕式塗佈機等。於塗敷液中包含溶劑。作為溶劑,例如可使用甲醇、乙醇、異丙醇、丙酮、甲基乙基酮、甲苯、正己烷、正丁醇、甲基異丁基酮、甲基丁基酮、乙基丁基酮、環己酮、乙酸乙酯、乙酸丁酯、丙二醇單甲醚乙酸酯、乙二醇單乙醚、丙二醇單甲醚、N-甲基-2-吡咯啶酮等。該等可單獨使用1種以上,亦可混合2種以上而使用。 The application of the adhesive composition which forms each adhesive layer can be performed using a well-known application device. The adhesive composition can be applied to each adhesive layer, or the adhesive composition can be applied in multiple layers at the same time, thereby forming two or more adhesive layers. Examples of the coating device include a blade coater, an air knife coater, a roll coater, a bar coater, and a gravure plate. Coater, micro gravure coater, bar blade coater, die lip coater, die coater, curtain coater, etc. A solvent is contained in the coating liquid. As the solvent, for example, methanol, ethanol, isopropanol, acetone, methyl ethyl ketone, toluene, n-hexane, n-butanol, methyl isobutyl ketone, methyl butyl ketone, ethyl butyl ketone, Cyclohexanone, ethyl acetate, butyl acetate, propylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, N-methyl-2-pyrrolidone, and the like. These can be used individually by 1 type or in mixture of 2 or more types.
塗膜之加熱可使用加熱爐、紅外線燈等公知之加熱裝置而實施。 The coating film can be heated using a known heating device such as a heating furnace or an infrared lamp.
對於樹脂層,亦可使用上述塗敷裝置而形成。再者,於樹脂層為非黏著性之樹脂層之情形時,可利用公知之方法而成型,並無特別限定,較佳為雙軸延伸法、熔融擠出法等。 The resin layer can also be formed using the coating device. When the resin layer is a non-adhesive resin layer, the resin layer can be molded by a known method, and is not particularly limited, and a biaxial stretching method, a melt extrusion method, or the like is preferred.
(積層體) (Laminated body)
於本發明中,可藉由將積層黏著片貼合於至少1個光學構件而製作積層體。於積層黏著片為雙面黏著片之情形時,可於積層黏著片之兩面貼合一對光學構件。 In the present invention, a laminated body can be produced by bonding a laminated adhesive sheet to at least one optical member. In the case where the laminated adhesive sheet is a double-sided adhesive sheet, a pair of optical members may be laminated on both sides of the laminated adhesive sheet.
所謂構成積層體之光學構件,係指觸控面板或圖像顯示裝置等光學製品中之各構成構件。作為觸控面板之構成構件,例如可列舉:於透明樹脂膜設置有ITO膜之ITO膜、於玻璃板之表面設置有ITO膜之ITO玻璃、於透明樹脂膜塗佈有導電性聚合物之透明導電性膜、硬塗膜、耐指紋性膜等。作為圖像顯示裝置之構成構件,例如可列舉:用於液晶顯示裝置之抗反射膜、配向膜、偏光膜、相位差膜、增亮膜等。作為用於該等構件之材料,可列舉:玻璃、聚碳酸酯、聚對苯二甲酸乙二酯、聚甲基丙烯酸甲酯、聚萘二甲酸乙二酯、環烯烴聚合物、三乙醯纖維素、聚醯亞胺、醯化纖維素等。 The optical member constituting the laminated body refers to each constituent member in an optical product such as a touch panel or an image display device. Examples of the constituent members of the touch panel include: an ITO film provided with an ITO film on a transparent resin film, an ITO glass provided with an ITO film on a surface of a glass plate, and a transparent resin film coated with a conductive polymer. Conductive film, hard coat film, fingerprint-resistant film, etc. Examples of constituent members of the image display device include an antireflection film, an alignment film, a polarizing film, a retardation film, and a brightness enhancement film used in a liquid crystal display device. Examples of materials used for these members include glass, polycarbonate, polyethylene terephthalate, polymethyl methacrylate, polyethylene naphthalate, cycloolefin polymer, and triethylpyrene. Cellulose, polyimide, tritiated cellulose, etc.
又,作為藉由本發明之積層黏著片而貼合之一對光學構件,可 列舉:觸控面板之內部之ITO膜彼此之貼合、ITO膜與ITO玻璃之貼合、觸控面板之ITO膜與液晶面板之貼合、覆蓋玻璃與ITO膜之貼合、覆蓋玻璃與裝飾膜之貼合等。 In addition, as a pair of optical members bonded by the laminated adhesive sheet of the present invention, Examples: the bonding of ITO films inside the touch panel, the bonding of ITO film and ITO glass, the bonding of ITO film of touch panel and liquid crystal panel, the bonding of cover glass and ITO film, cover glass and decoration Lamination of films, etc.
以下,列舉實施例與比較例進而具體地說明本發明之特徵。以下之實施例中所示之材料、使用量、比率、處理內容、處理順序等只要不脫離本發明之主旨,則可適當變更。因此,本發明之範圍不應藉由以下所示之具體例而限定性地解釋。 Hereinafter, examples and comparative examples will be given to further specifically describe the features of the present invention. The materials, usage amounts, ratios, processing contents, processing procedures, and the like shown in the following examples can be appropriately changed as long as they do not depart from the gist of the present invention. Therefore, the scope of the present invention should not be limitedly interpreted by the specific examples shown below.
(第1黏著劑層中所含之黏著劑組合物(A)之製作) (Preparation of the adhesive composition (A) contained in the first adhesive layer)
將作為非交聯性丙烯酸酯單元之丙烯酸2-乙基己酯80質量份、丙烯酸異酯17質量份、作為具有交聯性官能基之丙烯酸系單體單元之丙烯酸4-羥基丁酯3質量份藉由公知之溶劑聚合法而進行聚合反應,獲得丙烯酸酯共聚物溶液。將以該丙烯酸酯共聚物溶液作為黏著主劑之黏著劑溶液製成黏著劑組合物(A)。 80 parts by mass of 2-ethylhexyl acrylate as a non-crosslinkable acrylate unit, 17 parts by mass of an ester and 3 parts by mass of 4-hydroxybutyl acrylate as an acrylic monomer unit having a crosslinkable functional group were polymerized by a known solvent polymerization method to obtain an acrylate copolymer solution. An adhesive composition (A) was prepared by using the acrylate copolymer solution as an adhesive main agent.
作為剝離片材,準備於PET(polyethylene terephthalate,聚對苯二甲酸乙二酯)膜具備剝離劑層之剝離膜[王子F-TECH(股)製造,38μmRL-07(L)],利用刮刀塗佈機於該剝離片材之剝離劑層塗敷上述黏著劑組合物(A)之溶液,於100℃下加熱3分鐘,形成厚度100μm之黏著劑層,藉由介電常數測定系統(東陽技術製造之1260型)並基於JIS-C-2138而測定、檢測出相對介電常數,結果頻率1MHz下之相對介電常數ε1為2.6。 As a release sheet, a release film having a release agent layer on a PET (polyethylene terephthalate) film [manufactured by Oji F-TECH Co., Ltd., 38 μm RL-07 (L)] was prepared and applied with a doctor blade. A cloth machine applies the solution of the above-mentioned adhesive composition (A) to the release agent layer of the release sheet, and heats it at 100 ° C for 3 minutes to form an adhesive layer with a thickness of 100 μm. The dielectric constant measurement system (Dongyang Technology 1260 type manufactured), and the relative dielectric constant was measured and detected based on JIS-C-2138. As a result, the relative dielectric constant ε 1 at a frequency of 1 MHz was 2.6.
(第2黏著劑層中所含之黏著劑組合物(B)之製作) (Production of the adhesive composition (B) contained in the second adhesive layer)
將作為非交聯性丙烯酸酯單元之丙烯酸甲酯40質量份、丙烯酸丁酯40質量份、作為具有交聯性官能基之丙烯酸系單體單元之丙烯酸2-羥基乙酯20質量份藉由公知之溶劑聚合法而進行聚合反應,獲得丙烯酸酯共聚物溶液。將以該丙烯酸酯共聚物溶液作為黏著主劑之黏著 劑溶液製成黏著劑組合物(B)。 40 parts by mass of methyl acrylate as a non-crosslinkable acrylate unit, 40 parts by mass of butyl acrylate, and 20 parts by mass of 2-hydroxyethyl acrylate as an acrylic monomer unit having a crosslinkable functional group are known. Polymerization was performed by a solvent polymerization method to obtain an acrylate copolymer solution. Adhesion using the acrylate copolymer solution as an adhesion main agent The adhesive solution is made into an adhesive composition (B).
作為剝離片材,準備於PET膜具備剝離劑層之剝離膜[王子F-TECH(股)製造,38μmRL-07(L)],利用刮刀塗佈機於該剝離片材之剝離劑層塗敷上述黏著劑組合物(B)之溶液,於100℃下加熱3分鐘,形成厚度100μm之黏著劑層,測定相對介電常數,結果頻率1MHz下之相對介電常數ε2為5.4。 As a release sheet, a release film having a release agent layer for PET film [manufactured by Oji F-TECH Co., Ltd., 38 μm RL-07 (L)] was prepared, and the release agent layer of the release sheet was applied by a doctor blade coater. The solution of the above-mentioned adhesive composition (B) was heated at 100 ° C. for 3 minutes to form an adhesive layer having a thickness of 100 μm, and the relative dielectric constant was measured. As a result, the relative dielectric constant ε 2 at a frequency of 1 MHz was 5.4.
(第1黏著劑層中所含之黏著劑組合物(C)之製作) (Preparation of the adhesive composition (C) contained in the first adhesive layer)
將丙烯酸2-乙基己酯80質量份、丙烯酸異酯17質量份、丙烯酸4-羥基丁酯3質量份利用公知之塊狀聚合法而進行聚合反應,獲得丙烯酸酯共聚物。將相對於該丙烯酸酯共聚物100質量份添加作為反應性稀釋劑之丙烯酸2-乙基己酯30質量份、丙烯酸異辛酯20質量份、光聚合起始劑0.5質量份並調整而成之黏著劑漿液製成黏著劑組合物(C)。 80 parts by mass of 2-ethylhexyl acrylate, isopropyl acrylate 17 mass parts of esters and 3 mass parts of 4-hydroxybutyl acrylate were polymerized by a known block polymerization method to obtain an acrylate copolymer. 30 parts by mass of 2-ethylhexyl acrylate as a reactive diluent, 20 parts by mass of isooctyl acrylate, and 0.5 parts by mass of a photopolymerization initiator are added to 100 parts by mass of the acrylate copolymer. The adhesive slurry was prepared into an adhesive composition (C).
作為剝離片材,準備於PET膜具備剝離劑層之剝離膜[王子特F-TECH(股)製造,38μmRL-07(L)],利用刮刀塗佈機於該剝離片材之剝離劑層塗敷上述黏著劑組合物(C)之漿液,一面於氮氣環境下利用UV(ultraviolet,紫外線)照射機進行冷卻一面照射累積光量1000mJ/cm2,形成厚度100μm之黏著劑層。將該黏著劑層藉由介電常數測定系統(東陽技術製造之1260型)並基於JIS-C-2138而測定、檢測出相對介電常數,結果頻率1MHz下之相對介電常數ε1為2.4。 As a release sheet, a release film having a release agent layer on a PET film [manufactured by Ojito F-TECH Co., Ltd., 38 μm RL-07 (L)] was prepared, and the release agent layer of the release sheet was coated with a doctor blade The slurry containing the above-mentioned adhesive composition (C) was irradiated with a UV (ultraviolet, ultraviolet) irradiator while cooling under a nitrogen environment to irradiate a cumulative light amount of 1000 mJ / cm 2 to form an adhesive layer having a thickness of 100 μm. The relative dielectric constant of this adhesive layer was measured and detected based on JIS-C-2138 by a dielectric constant measurement system (type 1260 manufactured by Toyo Technology). As a result, the relative dielectric constant ε 1 at a frequency of 1 MHz was 2.4. .
(第2黏著劑層中所含之黏著劑組合物(D)之製作) (Production of the adhesive composition (D) contained in the second adhesive layer)
將作為非交聯性丙烯酸酯單元之丙烯酸甲酯40質量份、丙烯酸丁酯40質量份、作為具有交聯性官能基之丙烯酸系單體單元之丙烯酸2-羥基乙酯20質量份藉由公知之塊狀聚合法而進行聚合反應,獲得丙烯酸酯共聚物。將相對於該丙烯酸酯共聚物100質量份添加丙烯酸月桂酯50質量份、光聚合起始劑0.5質量份並調整而成之黏著劑漿液製 成黏著劑組合物(D)。 40 parts by mass of methyl acrylate as a non-crosslinkable acrylate unit, 40 parts by mass of butyl acrylate, and 20 parts by mass of 2-hydroxyethyl acrylate as an acrylic monomer unit having a crosslinkable functional group are known. Polymerization was carried out by a block polymerization method to obtain an acrylate copolymer. An adhesive slurry prepared by adding 50 parts by mass of lauryl acrylate and 0.5 parts by mass of a photopolymerization initiator to 100 parts by mass of the acrylate copolymer. Into an adhesive composition (D).
作為剝離片材,準備於PET膜具備剝離劑層之剝離膜[王子F-TECH(股)製造,38μmRL-07(L)],利用刮刀塗佈機於該剝離片材之剝離劑層塗敷上述黏著劑組合物(D)之漿液,一面於氮氣環境下利用UV照射機進行冷卻一面照射累積光量1000mJ/cm2,形成厚度100μm之黏著劑層。將該黏著劑層藉由介電常數測定系統(東陽技術製造之1260型)並基於JIS-C-2138而測定、檢測出相對介電常數,結果頻率1MHz下之相對介電常數ε1為5.8。 As a release sheet, a release film having a release agent layer for PET film [manufactured by Oji F-TECH Co., Ltd., 38 μm RL-07 (L)] was prepared, and the release agent layer of the release sheet was applied by a doctor blade coater. The slurry of the above-mentioned adhesive composition (D) was irradiated with a cumulative light amount of 1000 mJ / cm 2 while being cooled by a UV irradiator under a nitrogen atmosphere to form an adhesive layer having a thickness of 100 μm. The relative dielectric constant of this adhesive layer was measured and detected based on JIS-C-2138 by a dielectric constant measurement system (type 1260 manufactured by Toyo Technology). As a result, the relative dielectric constant ε 1 at a frequency of 1 MHz was 5.8. .
(實施例1)積層黏著片之製作 (Example 1) Production of laminated adhesive sheet
為了使用黏著劑組合物(A)與(B)而製作相對介電常數為3.5之積層黏著片,使用式(1)算出第1黏著劑層與第2黏著劑層之厚度之比。所算出之厚度之比為「(第1黏著劑層之厚度):(第2黏著劑層之厚度)=1:1」,故而以如下所述之方式形成第1黏著劑層與第2黏著劑層。 In order to use the adhesive composition (A) and (B) to produce a laminated adhesive sheet having a relative dielectric constant of 3.5, the ratio of the thickness of the first adhesive layer to the second adhesive layer was calculated using formula (1). The calculated thickness ratio is "(thickness of the first adhesive layer): (thickness of the second adhesive layer) = 1: 1", so the first adhesive layer and the second adhesive are formed in the following manner.剂 层。 The agent layer.
作為第1剝離片材,準備於PET膜具備剝離劑層之剝離膜[王子F-TECH(股)製造,38μmRL-07(L)],利用刮刀塗佈機於該第1剝離片材之剝離劑層塗敷上述黏著劑組合物(A)之溶液,於100℃下加熱3分鐘,形成厚度50μm之第1黏著劑層。 As a first release sheet, a release film having a release agent layer on a PET film [manufactured by Oji F-Tech Co., Ltd., 38 μm RL-07 (L)] was prepared, and the first release sheet was peeled off with a doctor blade coater The adhesive layer was coated with the solution of the adhesive composition (A), and heated at 100 ° C. for 3 minutes to form a first adhesive layer having a thickness of 50 μm.
作為第2剝離片材,準備於PET膜具備剝離劑層之剝離膜[王子F-TECH(股)製造,38μmRL-07(L)],利用刮刀塗佈機於該第2剝離片材之剝離劑層塗敷上述黏著劑組合物(B)之溶液,於100℃下加熱3分鐘,形成厚度50μm之第2黏著劑層。 As the second release sheet, a release film having a release agent layer on a PET film [manufactured by Oji F-TECH Co., Ltd., 38 μm RL-07 (L)] was prepared, and the second release sheet was peeled off with a doctor blade coater. The adhesive layer was coated with the solution of the adhesive composition (B), and heated at 100 ° C. for 3 minutes to form a second adhesive layer having a thickness of 50 μm.
以使上述第1黏著劑層與第2黏著劑層接觸之方式進行重疊、壓接。以如此之方式,獲得黏著劑層之厚度為100μm之附剝離片材之積層黏著片。 The first adhesive layer and the second adhesive layer are brought into contact with each other so as to be overlapped and crimped. In this manner, a laminated adhesive sheet with a release sheet having a thickness of 100 μm of the adhesive layer was obtained.
(實施例2) (Example 2)
為了使用黏著劑組合物(A)與(B)而製作相對介電常數為4.3之積 層黏著片,使用式(1)算出第1黏著劑層與第2黏著劑層之厚度之比。所算出之厚度之比為「(第1黏著劑層之厚度):(第2黏著劑層之厚度)=1:3」,故而將第1黏著劑層之厚度設為25μm、及第2黏著劑層之厚度設為75μm,除此以外,以與實施例1相同之方式,獲得黏著劑層之厚度為100μm之附剝離片材之積層黏著片。 In order to use the adhesive composition (A) and (B), a product having a relative dielectric constant of 4.3 was prepared. For the layer adhesive sheet, the ratio of the thickness of the first adhesive layer to the thickness of the second adhesive layer was calculated using formula (1). The calculated thickness ratio is “(thickness of the first adhesive layer): (thickness of the second adhesive layer) = 1: 3”, so the thickness of the first adhesive layer is set to 25 μm, and the second adhesive layer is Except that the thickness of the adhesive layer was set to 75 μm, in the same manner as in Example 1, a laminated adhesive sheet with a release sheet having a thickness of 100 μm was obtained.
(實施例3) (Example 3)
為了使用黏著劑組合物(A)與(B)而製作相對介電常數為3.0之積層黏著片,使用式(1)算出第1黏著劑層與第2黏著劑層之厚度之比。所算出之厚度之比為「(第1黏著劑層之厚度):(第2黏著劑層之厚度)=3:1」,故而將第1黏著劑層之厚度設為75μm、及第2黏著劑層之厚度設為25μm,除此以外,以與實施例1相同之方式,獲得黏著劑層之厚度為100μm之附剝離片材之積層黏著片。 In order to produce a laminated adhesive sheet having a relative dielectric constant of 3.0 using the adhesive compositions (A) and (B), the ratio of the thickness of the first adhesive layer to the thickness of the second adhesive layer was calculated using formula (1). The calculated thickness ratio is “(thickness of the first adhesive layer): (thickness of the second adhesive layer) = 3: 1”, so the thickness of the first adhesive layer is set to 75 μm, and the second adhesive layer is Except that the thickness of the adhesive layer was set to 25 μm, in the same manner as in Example 1, a laminated adhesive sheet with a release sheet with a thickness of 100 μm was obtained.
(實施例4)使用UV硬化系黏著劑組合物之積層黏著片之製作 (Example 4) Production of a laminated adhesive sheet using a UV-curable adhesive composition
為了使用黏著劑組合物(C)與(D)而製作相對介電常數為3.5之積層黏著片,使用式(1)算出第1黏著劑層與第2黏著劑層之厚度之比。所算出之厚度之比為「(第1黏著劑層之厚度):(第2黏著劑層之厚度)=0.9:1.1」,故而以下所述之方式,形成第1黏著劑層與第2黏著劑層。 In order to use the adhesive compositions (C) and (D) to produce a laminated adhesive sheet having a relative dielectric constant of 3.5, the ratio of the thickness of the first adhesive layer to the second adhesive layer was calculated using the formula (1). The calculated thickness ratio is "(thickness of the first adhesive layer): (thickness of the second adhesive layer) = 0.9: 1.1", so the first adhesive layer and the second adhesive are formed in the following manner.剂 层。 The agent layer.
作為第1剝離片材,準備於PET膜具備剝離劑層之剝離膜[王子F-TECH(股)製造,38μmRL-07(L)],利用刮刀塗佈機於該第1剝離片材之剝離劑層塗敷上述黏著劑組合物(C)之漿液,一面於氮氣環境下利用UV照射機進行冷卻一面照射累積光量1000mJ/cm2,形成厚度45μm之黏著劑層。 As a first release sheet, a release film having a release agent layer on a PET film [manufactured by Oji F-Tech Co., Ltd., 38 μm RL-07 (L)] was prepared, and the first release sheet was peeled off with a doctor blade coater. The agent layer was coated with the slurry of the above-mentioned adhesive composition (C), and was irradiated with a cumulative light amount of 1,000 mJ / cm 2 while being cooled by a UV irradiator under a nitrogen atmosphere to form an adhesive layer having a thickness of 45 μm.
作為第2剝離片材,準備於PET膜具備剝離劑層之剝離膜[王子F-TECH(股)製造,38μmRL-07(L)],利用刮刀塗佈機於該第2剝離片材之剝離劑層塗敷上述黏著劑組合物(D)之溶液,一面於氮氣環境下利 用UV照射機進行冷卻一面照射累積光量1000mJ/cm2,形成厚度55μm之黏著劑層。 As the second release sheet, a release film having a release agent layer on a PET film [manufactured by Oji F-TECH Co., Ltd., 38 μm RL-07 (L)] was prepared, and the second release sheet was peeled off with a doctor blade coater. The agent layer was coated with the solution of the above-mentioned adhesive composition (D), and was irradiated with a cumulative light amount of 1000 mJ / cm 2 while being cooled by a UV irradiator under a nitrogen atmosphere to form an adhesive layer having a thickness of 55 μm.
以使上述第1黏著劑層與第2黏著劑層接觸之方式進行重疊、壓接。以如此之方式,獲得黏著劑層之厚度為100μm之附剝離片材之積層黏著片。 The first adhesive layer and the second adhesive layer are brought into contact with each other so as to be overlapped and crimped. In this manner, a laminated adhesive sheet with a release sheet having a thickness of 100 μm of the adhesive layer was obtained.
(實施例5) (Example 5)
為了使用黏著劑組合物(C)與(D)而製作相對介電常數為4.4之積層黏著片,使用式(1)算出第1黏著劑層與第2黏著劑層之厚度之比。所算出之厚度之比為「(第1黏著劑層之厚度):(第2黏著劑層之厚度)=1:4」,故而將第1黏著劑層之厚度設為20μm、及第2黏著劑層之厚度設為80μm,除此以外,以與實施例4相同之方式,獲得黏著劑層之厚度為100μm之附剝離片材之積層黏著片。 In order to produce a laminated adhesive sheet having a relative dielectric constant of 4.4 using the adhesive compositions (C) and (D), the ratio of the thickness of the first adhesive layer to the thickness of the second adhesive layer was calculated using formula (1). The calculated thickness ratio is “(thickness of the first adhesive layer): (thickness of the second adhesive layer) = 1: 4”, so the thickness of the first adhesive layer is set to 20 μm, and the second adhesive layer is Except that the thickness of the adhesive layer was set to 80 μm, in the same manner as in Example 4, a laminated adhesive sheet with a release sheet with a thickness of 100 μm was obtained.
(實施例6) (Example 6)
為了使用黏著劑組合物(C)與(D)而製作相對介電常數為3.0之積層黏著片,使用式(1)算出第1黏著劑層與第2黏著劑層之厚度之比。所算出之厚度之比為「(第1黏著劑層之厚度):(第2黏著劑層之厚度)=6.5:3.5」,故而將第1黏著劑層之厚度設為65μm、及第2黏著劑層之厚度設為35μm,除此以外,以與實施例4相同之方式,獲得黏著劑層之厚度為100μm之附剝離片材之積層黏著片。 In order to use the adhesive composition (C) and (D) to produce a laminated adhesive sheet having a relative dielectric constant of 3.0, the ratio of the thickness of the first adhesive layer to the thickness of the second adhesive layer was calculated using the formula (1). The calculated thickness ratio is “(thickness of the first adhesive layer): (thickness of the second adhesive layer) = 6.5: 3.5”, so the thickness of the first adhesive layer is set to 65 μm, and the second adhesive layer is Except that the thickness of the adhesive layer was set to 35 μm, in the same manner as in Example 4, a laminated adhesive sheet with a release sheet having a thickness of 100 μm was obtained.
(相對介電常數之測定) (Measurement of Relative Dielectric Constant)
對實施例中所獲得之積層黏著片之頻率1MHz下之相對介電常數進行測定,結果為表1之結果。再者,所謂理論相對介電常數,係指藉由式(1)所求出之值。 The relative dielectric constant of the laminated adhesive sheet obtained in the examples at a frequency of 1 MHz was measured, and the results are shown in Table 1. The theoretical relative permittivity refers to a value obtained by the formula (1).
[數3]
式(1)中,ε表示積層黏著片整體之相對介電常數,d表示積層黏著片整體之厚度。又,εn表示各黏著劑層之相對介電常數,dn表示各黏著劑層之厚度。再者,n表示黏著劑層之層數。 In the formula (1), ε represents the relative dielectric constant of the entire laminated adhesive sheet, and d represents the thickness of the entire laminated adhesive sheet. In addition, ε n represents the relative dielectric constant of each adhesive layer, and d n represents the thickness of each adhesive layer. In addition, n represents the number of layers of the adhesive layer.
由表1之結果可知,根據式(1)所求出之相對介電常數與實測之相對介電常數基本一致。可如此藉由使用計算式(1),而容易地製造具有所需之相對介電常數之積層黏著片。 From the results in Table 1, it can be seen that the relative permittivity obtained according to formula (1) is basically consistent with the measured relative permittivity. By using the calculation formula (1) in this manner, a laminated adhesive sheet having a desired relative dielectric constant can be easily manufactured.
進而,製作具有第3黏著劑層之積層黏著片。 Furthermore, a laminated adhesive sheet having a third adhesive layer was produced.
(黏著劑組合物(1)之製作) (Preparation of Adhesive Composition (1))
將作為非交聯性丙烯酸酯單元之丙烯酸甲酯40質量份、丙烯酸丁酯40質量份、作為具有交聯性官能基之丙烯酸系單體單元之丙烯酸4-羥基丁酯20質量份藉由公知之溶劑聚合法而進行聚合反應,獲得丙烯酸酯共聚物溶液。將以該丙烯酸酯共聚物溶液作為黏著主劑之黏著劑溶液製成黏著劑組合物(1)。 40 parts by mass of methyl acrylate as a non-crosslinkable acrylate unit, 40 parts by mass of butyl acrylate, and 20 parts by mass of 4-hydroxybutyl acrylate as an acrylic monomer unit having a crosslinkable functional group are known. Polymerization was performed by a solvent polymerization method to obtain an acrylate copolymer solution. An adhesive solution (1) was prepared by using the acrylate copolymer solution as an adhesive main agent.
(黏著劑組合物(2)之製作) (Production of Adhesive Composition (2))
將作為非交聯性丙烯酸酯單元之丙烯酸2-乙基己酯60質量份、丙 烯酸異酯38質量份、作為具有交聯性官能基之丙烯酸系單體單元之丙烯酸4-羥基丁酯2質量份藉由公知之溶劑聚合法而進行聚合反應,獲得丙烯酸酯共聚物溶液。將以該丙烯酸酯共聚物溶液作為黏著主劑之黏著劑溶液製成黏著劑組合物(2)。 60 parts by mass of 2-ethylhexyl acrylate as a non-crosslinkable acrylate unit, 38 parts by mass of an ester and 2 parts by mass of 4-hydroxybutyl acrylate as an acrylic monomer unit having a crosslinkable functional group were polymerized by a known solvent polymerization method to obtain an acrylate copolymer solution. An adhesive composition (2) was prepared by using the acrylate copolymer solution as an adhesive main agent.
(黏著劑組合物(3)之製作) (Preparation of Adhesive Composition (3))
將作為非交聯性丙烯酸酯單元之丙烯酸甲酯30質量份、丙烯酸丁酯60質量份、作為具有交聯性官能基之丙烯酸系單體單元之丙烯酸4-羥基丁酯10質量份藉由公知之溶劑聚合法而進行聚合反應,獲得丙烯酸酯共聚物溶液。將以該丙烯酸酯共聚物溶液作為黏著主劑之黏著劑溶液製成黏著劑組合物(3)。 30 parts by mass of methyl acrylate as a non-crosslinkable acrylate unit, 60 parts by mass of butyl acrylate, and 10 parts by mass of 4-hydroxybutyl acrylate as an acrylic monomer unit having a crosslinkable functional group are known. Polymerization was performed by a solvent polymerization method to obtain an acrylate copolymer solution. An adhesive composition (3) was prepared by using the acrylate copolymer solution as an adhesive main agent.
(實施例7)具有3層黏著劑層之積層黏著片7之製作 (Example 7) Production of laminated adhesive sheet 7 with three adhesive layers
(1)第2黏著劑層之製作 (1) Fabrication of the second adhesive layer
作為第1剝離片材,準備於PET膜具備剝離劑層之剝離膜[王子F-TECH(股)製造,38μmRL-07(L)],利用刮刀塗佈機於該第1剝離片材之剝離劑層塗敷上述黏著劑(2)之溶液,於100℃下加熱3分鐘,形成第2黏著劑層。所形成之第2黏著劑層之頻率100Hz下之相對介電常數εr為4.5。 As a first release sheet, a release film having a release agent layer on a PET film [manufactured by Oji F-Tech Co., Ltd., 38 μm RL-07 (L)] was prepared, and the first release sheet was peeled off with a doctor blade coater. The adhesive layer was coated with the solution of the adhesive (2), and heated at 100 ° C. for 3 minutes to form a second adhesive layer. The relative dielectric constant ε r of the formed second adhesive layer at a frequency of 100 Hz was 4.5.
再者,為了將積層黏著片7整體之相對介電常數設為5.5,而根據第1黏著劑層之厚度與相對介電常數及第3黏著劑層之厚度與相對介電常數,使用式(1)求出第2黏著劑層之最佳之厚度,結果為,以厚度成為51μm之方式塗敷第2黏著劑(2)。 In addition, in order to set the relative dielectric constant of the entire laminated adhesive sheet 7 to 5.5, the formula ( 1) The optimal thickness of the second adhesive layer was obtained. As a result, the second adhesive (2) was applied so that the thickness became 51 μm.
(2)第1黏著劑層之製作 (2) Production of the first adhesive layer
作為第2剝離片材,準備於PET膜具備剝離性低於上述第1剝離片材之剝離劑層之剝離膜[王子F-TECH(股)製造,38μmRL-07(2)],利用刮刀塗佈機於該第2剝離片材之剝離劑層,以厚度成為25μm之方式塗敷上述黏著劑(1)之溶液,於100℃下加熱3分鐘,形成第1黏著劑 層。所形成之第1黏著劑層之頻率100Hz下之相對介電常數εr為7.1。 As a second release sheet, a PET film having a release agent layer having a release property lower than that of the first release sheet described above [manufactured by Oji F-TECH Co., Ltd., 38 μm RL-07 (2)] was prepared, and applied with a doctor blade. The cloth was coated on the release agent layer of the second release sheet with a thickness of 25 μm, and the solution of the above-mentioned adhesive (1) was applied, and heated at 100 ° C. for 3 minutes to form a first adhesive layer. The relative dielectric constant ε r of the first adhesive layer formed at a frequency of 100 Hz was 7.1.
(3)第3黏著劑層之製作 (3) Production of the third adhesive layer
作為第3剝離片材,準備與第1剝離膜相同之剝離膜[王子F-TECH(股)製造,38μmRL-07(L)],利用刮刀塗佈機於該第3剝離片材之剝離劑層,以厚度成為25μm之方式塗敷上述黏著劑(1)之溶液,於100℃下加熱3分鐘,形成第3黏著劑層。所形成之第3黏著劑層之頻率100Hz下之相對介電常數εr為7.1。 As the third release sheet, a release film similar to the first release film [38 μm RL-07 (L) manufactured by Oji F-TECH Co., Ltd.] was prepared, and a release agent was applied to the third release sheet using a blade coater. The layer was coated with the solution of the above-mentioned adhesive (1) so that the thickness became 25 μm, and heated at 100 ° C. for 3 minutes to form a third adhesive layer. The relative dielectric constant ε r of the formed third adhesive layer at a frequency of 100 Hz was 7.1.
(4)積層黏著片之製作 (4) Production of laminated adhesive sheet
以使上述第2黏著劑層與第1黏著劑層接觸之方式進行重疊、壓接後,剝離第1剝離片材而使第2黏著劑層露出,以使第2黏著劑層與第3黏著劑層接觸之方式進行重疊、壓接後,獲得附剝離片材之積層黏著片7。積層黏著片7之各層之厚度與相對介電常數係如表2所示。 After the second adhesive layer and the first adhesive layer are brought into contact with each other and overlapped and crimped, the first release sheet is peeled off to expose the second adhesive layer, so that the second adhesive layer and the third adhesive layer are adhered. After the agent layers are contacted and overlapped and crimped, a laminated adhesive sheet 7 with a release sheet is obtained. The thickness and relative dielectric constant of each layer of the laminated adhesive sheet 7 are shown in Table 2.
(積層黏著片之相對介電常數之測定) (Measurement of Relative Dielectric Constant of Laminated Adhesive Sheet)
對上述積層黏著片7之頻率100k Hz下之相對介電常數進行測定,結果所獲得之積層黏著片7整體之頻率100Hz下之相對介電常數εr為5.4。於表3中,表示積層黏著片7之頻率100Hz下之相對介電常數之推測值與實測值。 The relative dielectric constant at a frequency of 100 k Hz of the laminated adhesive sheet 7 was measured. As a result, the relative dielectric constant ε r of the obtained laminated adhesive sheet 7 at a frequency of 100 Hz was 5.4. In Table 3, the estimated and measured values of the relative dielectric constant at a frequency of 100 Hz of the laminated adhesive sheet 7 are shown.
如表3所示,於第2黏著劑層形成相對介電常數較低之黏著劑層,且調整其厚度,藉此可獲得積層黏著片7之整體之相對介電常數幾乎接近推測值之實測值。即,可認為獲得具有所需之相對介電常數之積層黏著片。 As shown in Table 3, an adhesive layer with a lower relative dielectric constant is formed on the second adhesive layer, and its thickness is adjusted, thereby obtaining an actual measurement that the relative dielectric constant of the entire laminated adhesive sheet 7 is almost close to the estimated value. value. That is, it is considered that a laminated adhesive sheet having a desired relative dielectric constant is obtained.
(實施例8)積層黏著片8之製作 (Example 8) Production of laminated adhesive sheet 8
於第1黏著劑層使用黏著劑(1),於第2黏著劑層使用黏著劑(2),於第3黏著劑層使用黏著劑(3),以與實施例7相同之方法製作積層黏著片8。再者,為了將積層黏著片8之相對介電常數設為5.0,而根據第1黏著劑層之厚度與相對介電常數、及第3黏著劑層之厚度與相對介電常數,使用式(1)求出第2黏著劑層之最佳之厚度,結果為,以厚度成為100μm之方式塗敷黏著劑(2)。 An adhesive (1) was used for the first adhesive layer, an adhesive (2) was used for the second adhesive layer, and an adhesive (3) was used for the third adhesive layer. The laminated adhesive was produced in the same manner as in Example 7. Tablet 8. Furthermore, in order to set the relative permittivity of the laminated adhesive sheet 8 to 5.0, based on the thickness and relative permittivity of the first adhesive layer and the thickness and relative permittivity of the third adhesive layer, the formula ( 1) The optimal thickness of the second adhesive layer was obtained. As a result, the adhesive (2) was applied so that the thickness became 100 μm.
(實施例9)積層黏著片9之製作 (Example 9) Production of laminated adhesive sheet 9
於第1黏著劑層使用黏著劑(3)、於第2黏著劑層使用黏著劑(1)、於第3黏著劑層使用黏著劑(2),除此以外,以與實施例8相同之方式製作積層黏著片9。 Except that the adhesive (3) was used for the first adhesive layer, the adhesive (1) was used for the second adhesive layer, and the adhesive (2) was used for the third adhesive layer, except that it was the same as in Example 8. Way to make laminated adhesive sheet 9.
再者,為了將積層黏著片9整體之相對介電常數εr設為6.3,而根據第1黏著劑層之厚度與相對介電常數、及第3黏著劑層之厚度與相對介電常數,使用式(1)求出第2黏著劑層之最佳之厚度,結果為,以厚度成為100μm之方式塗敷黏著劑(1)。 Furthermore, in order to set the relative dielectric constant ε r of the entire laminated adhesive sheet 9 to 6.3, based on the thickness and relative dielectric constant of the first adhesive layer, and the thickness and relative dielectric constant of the third adhesive layer, The optimum thickness of the second adhesive layer was obtained using the formula (1). As a result, the adhesive (1) was applied so that the thickness became 100 μm.
積層黏著片8及9之各層之厚度與相對介電常數係如表4所示。 The thickness and relative dielectric constant of each layer of the laminated adhesive sheets 8 and 9 are shown in Table 4.
(積層黏著片之相對介電常數之測定) (Measurement of Relative Dielectric Constant of Laminated Adhesive Sheet)
對上述積層黏著片8及9之頻率100k Hz下之相對介電常數進行測定,結果為表5之結果。 The relative dielectric constants of the laminated adhesive sheets 8 and 9 at a frequency of 100 k Hz were measured, and the results are shown in Table 5.
如表5所示,即便於所有黏著劑層中之相對介電常數均不同之情形時,亦可藉由控制黏著劑層之相對介電常數與厚度,而自由地調節積層黏著片整體之相對介電常數。 As shown in Table 5, even when the relative dielectric constants of all the adhesive layers are different, the relative relative dielectric constant and thickness of the adhesive layer can be freely adjusted by controlling the relative dielectric constant and thickness of the adhesive layer. Dielectric constant.
根據本發明,可提供一種更準確地控制積層黏著片中之相對介電常數之方法。因此,於本發明中,可獲得具有所需之相對介電常數之積層黏著片。本發明之積層黏著片於光學構件彼此之貼合例如,觸控面板感測器內之ITO膜彼此之貼合、或觸控面板模組與液晶模組之貼合中較為有用。 According to the present invention, a method for more accurately controlling the relative permittivity in a laminated adhesive sheet can be provided. Therefore, in the present invention, a laminated adhesive sheet having a desired relative dielectric constant can be obtained. The lamination of the laminated adhesive sheet of the present invention to the optical components is useful, for example, for lamination of ITO films in a touch panel sensor, or for lamination of a touch panel module and a liquid crystal module.
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| JP (1) | JP6354752B2 (en) |
| KR (1) | KR101894734B1 (en) |
| CN (1) | CN105229100B (en) |
| TW (1) | TWI645009B (en) |
| WO (1) | WO2014181853A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203129697U (en) | 2013-02-05 | 2013-08-14 | 客贝利(厦门)休闲用品有限公司 | Tent frame pole |
| EP3106498B1 (en) | 2015-06-16 | 2021-08-11 | Nitto Denko Corporation | Pressure-sensitive adhesive composition |
| JP6691813B2 (en) * | 2015-06-16 | 2020-05-13 | 日東電工株式会社 | Adhesive composition |
| KR102017014B1 (en) | 2017-05-22 | 2019-09-03 | 주식회사 엘지화학 | Multilayer adhesive tape |
| JP7388323B2 (en) * | 2020-09-07 | 2023-11-29 | 株式会社レゾナック | Laminated structure and object detection structure |
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| JP2004136625A (en) * | 2002-10-21 | 2004-05-13 | Nitto Denko Corp | Antistatic sheet and adhesive tape |
| CN102510888A (en) * | 2010-08-05 | 2012-06-20 | 新塔克化成株式会社 | Double-sided adhesive sheet, double-sided adhesive sheet with release sheet, method for producing same, and transparent laminate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3880418B2 (en) | 2002-02-21 | 2007-02-14 | 日東電工株式会社 | Method for sticking and fixing double-sided adhesive sheet and touch panel to display device |
| JP4151828B2 (en) | 2002-05-29 | 2008-09-17 | 日東電工株式会社 | Double-sided adhesive sheet and display device with touch panel |
| JP4493273B2 (en) | 2003-01-29 | 2010-06-30 | 日東電工株式会社 | Double-sided adhesive sheet and display device with touch panel |
| JP2006124528A (en) * | 2004-10-29 | 2006-05-18 | Toyo Ink Mfg Co Ltd | Adhesive laminate and liquid crystal cell member using the same |
| JP2010147047A (en) | 2008-12-16 | 2010-07-01 | Toppan Printing Co Ltd | Method of manufacturing multilayered wiring board |
| JP5498811B2 (en) * | 2010-02-17 | 2014-05-21 | アルプス電気株式会社 | Capacitive input device |
| CN102190972B (en) * | 2010-03-14 | 2014-01-29 | 宸鸿科技(厦门)有限公司 | Optical adhesive layer with multilayer structure |
| US20120113361A1 (en) * | 2010-11-10 | 2012-05-10 | Tpk Touch Solutions Inc. | Optical Level Composite Pressure-Sensitive Adhesive and an Apparatus Therewith |
| KR101393778B1 (en) * | 2010-11-22 | 2014-05-13 | (주)엘지하우시스 | Double-Side Adhesive Sheet and Touch Panel Display Device comprising the same |
| JP5758647B2 (en) * | 2011-02-17 | 2015-08-05 | 日東電工株式会社 | Optical adhesive sheet |
| JP2012229358A (en) * | 2011-04-27 | 2012-11-22 | Nitto Denko Corp | Adhesive sheet |
| JP2012251030A (en) * | 2011-06-01 | 2012-12-20 | Toray Advanced Film Co Ltd | Adhesive sheet, electrostatic capacity-type touch panel with surface protective layer, and display device |
| JP2013014665A (en) * | 2011-07-01 | 2013-01-24 | Nitto Denko Corp | Multilayer adhesive article and adhesive sheet |
| JP2013104028A (en) * | 2011-11-15 | 2013-05-30 | Oji Holdings Corp | Double-sided adhesive sheet for optical member, and laminate |
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2014
- 2014-05-09 WO PCT/JP2014/062431 patent/WO2014181853A1/en not_active Ceased
- 2014-05-09 TW TW103116612A patent/TWI645009B/en not_active IP Right Cessation
- 2014-05-09 JP JP2015515901A patent/JP6354752B2/en active Active
- 2014-05-09 CN CN201480025770.XA patent/CN105229100B/en active Active
- 2014-05-09 KR KR1020157034897A patent/KR101894734B1/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004136625A (en) * | 2002-10-21 | 2004-05-13 | Nitto Denko Corp | Antistatic sheet and adhesive tape |
| CN102510888A (en) * | 2010-08-05 | 2012-06-20 | 新塔克化成株式会社 | Double-sided adhesive sheet, double-sided adhesive sheet with release sheet, method for producing same, and transparent laminate |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014181853A1 (en) | 2014-11-13 |
| JP6354752B2 (en) | 2018-07-11 |
| CN105229100B (en) | 2018-02-06 |
| JPWO2014181853A1 (en) | 2017-02-23 |
| KR20160006743A (en) | 2016-01-19 |
| TW201446932A (en) | 2014-12-16 |
| CN105229100A (en) | 2016-01-06 |
| KR101894734B1 (en) | 2018-09-04 |
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