TWI643930B - 電子裝置封裝用膠帶 - Google Patents

電子裝置封裝用膠帶 Download PDF

Info

Publication number: TWI643930B
Authority: TW; Taiwan
Prior art keywords: adhesive layer; adhesive; electronic device; resin; tape
Prior art date: 2016-03-31

Application number

TW106109579A

Other languages

English (en)

Chinese (zh)

Other versions

TW201739871A (zh

Inventor

Toru Sano

佐野透

Jirou SUGIYAMA

杉山二朗

Masami Aoyama

青山真沙美

Kunihiko Ishiguro

石黒邦彦

Original Assignee

Furukawa Electric Co., Ltd.

古河電氣工業股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2016-03-31

Filing date

2017-03-22

Publication date

2018-12-11

2017-03-22 Application filed by Furukawa Electric Co., Ltd., 古河電氣工業股份有限公司 filed Critical Furukawa Electric Co., Ltd.

2017-11-16 Publication of TW201739871A publication Critical patent/TW201739871A/zh

2018-12-11 Application granted granted Critical

2018-12-11 Publication of TWI643930B publication Critical patent/TWI643930B/zh

Classifications

- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- H10W99/00—

Landscapes

Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Inorganic Chemistry (AREA)
Adhesives Or Adhesive Processes (AREA)
Adhesive Tapes (AREA)
Engineering & Computer Science (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Dicing (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Packages (AREA)

TW106109579A 2016-03-31 2017-03-22 電子裝置封裝用膠帶 TWI643930B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2016-072255		2016-03-31
JP2016072255		2016-03-31

Publications (2)

Publication Number	Publication Date
TW201739871A TW201739871A (zh)	2017-11-16
TWI643930B true TWI643930B (zh)	2018-12-11

Family

ID=59963849

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW106109579A TWI643930B (zh)	2016-03-31	2017-03-22	電子裝置封裝用膠帶

Country Status (7)

Country	Link
JP (1)	JP6775005B2 (fr)
KR (1)	KR102056178B1 (fr)
CN (1)	CN108076669B (fr)
MY (1)	MY192601A (fr)
SG (1)	SG11201802282VA (fr)
TW (1)	TWI643930B (fr)
WO (1)	WO2017168820A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI799557B (zh) *	2018-03-28	2023-04-21	日商琳得科股份有限公司	樹脂組合物、密封片及密封體
TWI713880B (zh) *	2018-08-17	2020-12-21	美屬薩摩亞商茂邦電子有限公司	具有六面式保護層之晶片封裝結構及其製造方法
WO2020251307A1 (fr) *	2019-06-13	2020-12-17	주식회사 엘지화학	Film non conducteur et procédé de préparation pour stratifié semi-conducteur
JP7572792B2 (ja) *	2020-03-31	2024-10-24	株式会社有沢製作所	粘着テープ
JP7427530B2 (ja) *	2020-06-02	2024-02-05	マクセル株式会社	ダイシングテープ用の基材フィルムおよびダイシングテープ
CN113352772B (zh) *	2020-06-24	2022-04-08	山东华菱电子股份有限公司	热敏打印头及其制造方法
JP7042986B1 (ja) *	2020-07-30	2022-03-28	古河電気工業株式会社	接着剤用組成物及びフィルム状接着剤、並びに、フィルム状接着剤を用いた半導体パッケージ及びその製造方法
CN113897163B (zh) *	2021-12-09	2022-03-11	武汉市三选科技有限公司	一种粘接剂、芯片键合膜及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TW201213487A (en) *	2010-07-29	2012-04-01	Nitto Denko Corp	Film for flip chip type semiconductor back surface and its use
TW201404847A (zh) *	2012-04-26	2014-02-01	新日鐵住金化學股份有限公司	薄膜狀接著劑用組成物及其製造方法、薄膜狀接著劑、以及使用薄膜狀接著劑之半導體封裝及其製造方法

Family Cites Families (9)

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Publication number	Priority date	Publication date	Assignee	Title
JPS599007B2 (ja)	1977-07-12	1984-02-28	パロマ工業株式会社	液体燃料の燃焼装置
JPS5487847A (en)	1977-12-26	1979-07-12	Nissin Electric Co Ltd	Oil impregnated capacitor
JP2007235022A (ja)	2006-03-03	2007-09-13	Mitsui Chemicals Inc	接着フィルム
CN101490813B (zh) *	2006-07-19	2011-07-13	积水化学工业株式会社	切片及芯片键合带以及半导体芯片制造方法
JP5503342B2 (ja) *	2010-03-10	2014-05-28	古河電気工業株式会社	ダイシング・ダイボンディングテープ
JP5528936B2 (ja) *	2010-07-28	2014-06-25	日東電工株式会社	フリップチップ型半導体裏面用フィルム
JP2013030500A (ja) *	2011-07-26	2013-02-07	Nitto Denko Corp	半導体装置製造用の接着シート、ダイシングフィルム一体型半導体装置製造用の接着シート、及び、半導体装置製造用の接着シートを有する半導体装置
KR20130075188A (ko) *	2011-12-27	2013-07-05	제일모직주식회사	반도체용 접착 조성물 및 이를 포함하는 접착 필름
JP6722584B2 (ja) *	2014-06-11	2020-07-15	日本化薬株式会社	タッチパネル用紫外線硬化型樹脂組成物、それを用いた貼り合せ方法及び物品

2016
- 2016-11-14 KR KR1020187009129A patent/KR102056178B1/ko active Active
- 2016-11-14 CN CN201680056349.4A patent/CN108076669B/zh active Active
- 2016-11-14 SG SG11201802282VA patent/SG11201802282VA/en unknown
- 2016-11-14 MY MYPI2018701080A patent/MY192601A/en unknown
- 2016-11-14 JP JP2018508367A patent/JP6775005B2/ja active Active
- 2016-11-14 WO PCT/JP2016/083696 patent/WO2017168820A1/fr not_active Ceased
2017
- 2017-03-22 TW TW106109579A patent/TWI643930B/zh active

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TW201213487A (en) *	2010-07-29	2012-04-01	Nitto Denko Corp	Film for flip chip type semiconductor back surface and its use
TW201404847A (zh) *	2012-04-26	2014-02-01	新日鐵住金化學股份有限公司	薄膜狀接著劑用組成物及其製造方法、薄膜狀接著劑、以及使用薄膜狀接著劑之半導體封裝及其製造方法

Also Published As

Publication number	Publication date
SG11201802282VA (en)	2018-04-27
TW201739871A (zh)	2017-11-16
WO2017168820A1 (fr)	2017-10-05
CN108076669B (zh)	2021-01-15
CN108076669A (zh)	2018-05-25
KR102056178B1 (ko)	2019-12-16
JPWO2017168820A1 (ja)	2019-02-14
MY192601A (en)	2022-08-29
KR20180067522A (ko)	2018-06-20
JP6775005B2 (ja)	2020-10-28

Publication	Publication Date	Title
TWI632625B (zh)	2018-08-11	Tape for electronic device packaging
TWI643930B (zh)	2018-12-11	電子裝置封裝用膠帶
JP6310492B2 (ja)	2018-04-11	電子デバイスパッケージ用テープ
CN103923573B (zh)	2019-07-12	胶粘薄膜、切割/芯片接合薄膜、半导体装置的制造方法及半导体装置
JP6877404B2 (ja)	2021-05-26	電子デバイスパッケージ用テープ
JP2011102383A (ja)	2011-05-26	熱硬化型ダイボンドフィルム
KR102329756B1 (ko)	2021-11-23	접착 필름, 다이싱·다이 본드 필름, 반도체 장치의 제조 방법 및 반도체 장치
JP6852030B2 (ja)	2021-03-31	電子デバイスパッケージ用テープ
JP6935379B2 (ja)	2021-09-15	電子デバイスパッケージ用テープ
WO2017168824A1 (fr)	2017-10-05	Boîtier de dispositif électronique, procédé de fabrication de boîtier de dispositif électronique, et bande pour boîtier de dispositif électronique
TWI624885B (zh)	2018-05-21	Tape for electronic device packaging
JPWO2017110202A1 (ja)	2018-10-11	半導体加工用テープ
JP6339619B2 (ja)	2018-06-06	電子デバイスパッケージ用テープ
JP2021185610A (ja)	2021-12-09	電子デバイスパッケージ用テープ
JP2018170340A (ja)	2018-11-01	電子デバイスパッケージ用テープ
JP2021072345A (ja)	2021-05-06	電子デバイスパッケージ用テープ