TWI534918B - Method and system for compensating for wire diameter changes on a wire machine - Google Patents

Description

Method and system for compensating for wire diameter changes on a wire machine

The present invention relates to the formation of wire bonds, and more particularly to an improved method of adjusting the wire bonding process, for example, when changing a wire spool on a wire bonding machine.

The present application claims priority to U.S. Provisional Application Serial No. 61/666,114, filed on Jun. 29, 2012, the content of which is hereby incorporated by reference.

In the fabrication and packaging of semiconductor devices, wire bonding has been the primary method of providing electrical interconnection between two locations within a package (eg, between a die pad of a semiconductor die and a lead of a leadframe).

In a ball joint, an airless ball is formed by a tail end of a wire extending from a tip end of a bonding tool (for example, a capillary file) by applying a current (for example, an instantaneous discharge) to the trailing end of the wire. The airless ball is then placed at the tip of the capillary file and the capillary file is moved to the engaged position where the first joint of the wire loop is to be formed. The capillary file compresses the airless ball (usually with ultrasonic energy) to a first bonding location (eg, a die pad of a semiconductor die) to form a ball bond (ie, a first bond). A length of wire (ie, wire loop) extends from the ball joint to a second joint location (eg, a lead wire of the lead frame). The capillary file is then used to connect the wires The second engagement position (usually utilizing ultrasonic energy) is engaged to form a stitched engagement (ie, a second engagement). The wire supply (the end supplied by the capillary file feeding the wire) is then separated from the second bond. Thus, a wire loop is formed between the first engagement position and the second engagement position.

Due to variations in the diameter of the bond wires having the same nominal size (eg, variations in the actual diameter between one wire spool and the next wire spool), it may be difficult to obtain fairly uniform characteristics (eg, squash, welding) Wire bonding of ball size, etc.). Accordingly, it would be desirable to provide an improved method that can form consistent wire bonds regardless of wire diameter variations, and the like.

In accordance with an exemplary embodiment of the present invention, a method of adjusting airless ball formation parameters on a wire bonding machine includes the steps of: (a) providing a reference airless ball contact height; (b) measuring at least one airless ball on the wire bonding machine a subject having no air ball contact height; and (c) if the difference between the target airless ball contact height and the reference airless ball contact height is greater than a predetermined tolerance level, adjusted based at least in part on the difference The airless ball on the wire bonding machine forms parameters.

In accordance with another exemplary embodiment of the present invention, a method of adjusting airless ball formation parameters on a wire bonding machine includes the steps of: a) providing a reference airless ball joint extrusion; b) measuring at least one airless ball on the wire bonding machine The target airless ball engagement extrusion; and c) if the difference between the target airless ball engagement extrusion and the reference airless ball engagement extrusion is greater than a predetermined tolerance level, then adjusted based at least in part on the difference The airless ball on the wire bonding machine forms parameters.

According to still another exemplary embodiment of the present invention, an adjustment wire bonding machine The method of forming an airless ball includes the steps of: a) providing a reference engagement force value; b) measuring a target engagement force value of the target wire engagement during formation of the target wire bond on the wire bonding machine; and c) if the target is engaged The difference between the force value and the reference engagement force value is greater than the predetermined tolerance level, and the airless ball formation parameter of the wire bonding machine is adjusted based at least in part on the difference.

In accordance with still another exemplary embodiment of the present invention, a method of adjusting airless ball formation parameters on a wire bonding machine includes the steps of: a) providing a reference tensile test characteristic value; b) measuring at least one bonded lead portion of the wire bonding machine a target tensile test characteristic value; and c) if the difference between the target tensile test characteristic value and the reference tensile test characteristic value is greater than a predetermined tolerance level, adjusting the airless ball on the wire bonding machine based on the difference The airless ball forms parameters.

In accordance with still another exemplary embodiment of the present invention, a method of adjusting airless ball formation parameters on a wire bonding machine includes the steps of: a) providing a reference wire size associated with a diameter of a reference wire; b) measuring at least a wire bonding machine a target wire size value associated with a diameter of a target wire; and c) adjusting the wire bond based at least in part on the difference if the difference between the at least one target wire size and the reference wire size is greater than a predetermined tolerance level The airless ball of the machine forms parameters.

In accordance with still another exemplary embodiment of the present invention, a method of adjusting airless ball formation parameters on a wire bonding machine includes the steps of: a) providing a reference ultrasonic sensor energy characteristic value; b) at least one ultrasonic wave on the wire bonding machine Determining an ultrasonic sensor energy characteristic value during formation of the spherical joint; and c) if the difference between the target ultrasonic sensor energy characteristic value and the reference ultrasonic sensor energy characteristic value is greater than a predetermined tolerance level, based at least in part on This difference is used to adjust the airless ball formation parameters on the wire bonding machine.

130‧‧‧reference wire

130b‧‧‧ actual wire

130a‧‧‧Wire

132a‧‧‧diameter

132b‧‧‧ actual diameter

134‧‧‧Capillary file

136‧‧‧Electronic ignition device

138‧‧‧Electric sparks

139a‧‧ ‧ benchmark airless ball

139b‧‧‧ Actual airless ball

140‧‧‧ joint position

142a‧‧‧reference contact height

142b‧‧‧ actual contact height

230‧‧‧ wire

232‧‧‧diameter

234‧‧‧Capillary file

239‧‧‧No air ball

240‧‧‧Substrate

242‧‧‧distance

244‧‧‧ spherical joint

248‧‧‧Join extrusion

250‧‧‧ distance

252‧‧‧ surface

430‧‧‧ wire

434‧‧‧ bonding tool

440‧‧‧ Bonding pads

442‧‧‧ grain

443‧‧‧Join airless ball

444‧‧‧Airless ball joint

450‧‧‧clamp

The invention can be better understood when reading the following detailed description in conjunction with the drawings. It is emphasized that the various features of the drawings are not drawn to scale. Conversely, the dimensions of the various features are arbitrarily enlarged or reduced for clarity. Included in the drawings are the following figures: FIG. 1A is a flow chart illustrating a method of adjusting airless ball formation parameters on a wire bonding machine in accordance with an exemplary embodiment of the present invention; FIG. 1B-1E is a diagram A block side view showing the formation of a joint airless ball, and a contact height of a reference airless ball and an actual airless ball, according to an exemplary embodiment of the present invention; FIG. 2A is a view illustrating an exemplary embodiment of the present invention according to an embodiment of the present invention A flow chart of another method of adjusting airless ball formation parameters on a wire bonding machine; FIG. 2B-2C is a block diagram illustrating the formation of a joint airless ball in accordance with an exemplary embodiment of the present invention; A flowchart illustrating still another method of adjusting airless ball formation parameters on a wire bonding machine in accordance with an exemplary embodiment of the present invention; FIG. 4A is a diagram illustrating an adjustment wire bonding machine in accordance with an exemplary embodiment of the present invention. A flowchart of still another method of forming an airless ball on a parameter; FIG. 4B-4D is a block diagram illustrating a tensile test according to an exemplary embodiment of the present invention; and FIG. 5 is a diagram illustrating a tensile test according to an embodiment of the present invention; Sample implementation A flowchart of a method of re-adjusting the free air ball on wire bonding machine forming parameters; and FIG. 6 is a flow chart illustrating still another method of adjusting airless ball formation parameters on a wire bonding machine in accordance with an exemplary embodiment of the present invention.

As used herein, the term "airless ball formation parameter" refers to a parameter that affects the formation of an airless ball, such as the length of time during which electrical energy is applied (eg, from an electronic ignition device); the amount of power applied (eg, Controlled by controlling current and/or voltage, etc.; no distance between the electronic ignition device and the wire tail during air formation; length of the wire tail extending from the tip of the bonding tool, and the like.

In order to provide a consistent spherical joint, it is desirable to obtain an airless ball (i.e., FAB) having consistent characteristics (e.g., characteristics such as contact height) within a predetermined tolerance. One challenge in forming a consistent airless ball is that the nominal diameter of the bond wires (disposed on the wire spool) varies. Such changes from the nominal diameter, whether small or large, can cause many problems. For example, wires that exceed the nominal diameter may result in oversized airless balls, thereby increasing the likelihood of a short circuit occurring between adjacent joints.

In accordance with certain example embodiments of the present invention, adjustments are provided (eg, calibration, Normalization, etc.) A method of forming parameters without air balls at a wire reel change on a wire bonding machine.

The present invention monitors (e.g., measures, determines, etc.) various characteristics associated with the diameter of the wires on the wire bonding machine to adjust at least one airless ball forming parameter to compensate for variations in wire diameter. Among these characteristics, some characteristics related to the diameter of the wire are also related to the bonding or joining process of the airless ball, for example, the contact height during the formation of the spherical joint, the air ballless extrusion, the force applied during the formation of the joint, and the formation of the joint. Ultrasonic sensor energy characteristics and more. Other exemplary wire diameter characteristics include the diameter of the bond wire, and the tensile test of the bond wire Value and so on.

Because of the change in the actual diameter of the bond wires (when the wires on one spool should be the same as the wires on the other spool), these characteristics associated with the diameter of the wires also change. Certain characteristics may be obtained during the formation of the joint without air ball bonding (ie, ball joint). For example, such characteristics may include: (1) the contact height of the engaged airless ball (see, for example, Figures 1A-1E); (2) the extrusion of the engaged airless ball (see, for example, Figures 2A-2C). (3) the force during the formation of the engagement with the airless ball (for example, see FIG. 3), (4) the ultrasonic sensor energy characteristics during the formation of the engagement with the airless ball (for example, see FIG. 6), etc. . Some other characteristics are available that are not related to airless ball bonding or airless ball bonding processes. For example, the other characteristics may include: (5) tensile/tension test values for wire bonding after forming the bond (see, for example, Figures 4A-4D); and (6) diameter of the bond wires (see, for example, Figure 5) Wait. These six characteristics are all examples of characteristics related to the diameter of the wire and will be discussed herein.

1A-1E illustrate the use of a contact height (eg, the height of the bonding tool when the air ball is first contacted with the conductive bonding surface) as a selected characteristic to compensate for the diameter of the wire when the wire spool is changed, in accordance with an exemplary embodiment of the present invention. The way to change. 1A is a closed loop flow diagram, and FIGS. 1B-1E are block diagrams of the example method of FIG. 1A. At step 100 of Figure 1A, the wire spool on the wire bonding machine is changed. At step 102, an airless ball is formed, and at step 104, the bonding tool (with the placed airless ball) is lowered to the contact height (eg, the bonding tool above the engaged position when the airless ball is first contacted with the engaged position) The lowest part of the tip height). At step 106, it is determined if the airless ball contact height value is within a predetermined tolerance level of the reference airless ball contact height value. If the answer is yes, the method proceeds to step 108 and operates carry out. If the answer is no, the method proceeds to step 110 and adjusts the airless ball formation parameter based, at least in part, on the difference between the actual airless ball contact height value and the reference airless ball contact height value. The method then returns to step 102 where a subsequent airless ball is formed, and then to steps 104 and 106 (step 110 if necessary) until "YES" is obtained at step 106.

In order to determine if the "contact height" value is within a predetermined tolerance, it is desirable to measure the contact height relative to some of the reference positions. 1B-1E illustrate an example technique for measuring contact height relative to the upper surface of substrate 140 as shown in FIG. 1B. However, it should be understood that the contact height can be measured relative to any desired reference position. 1B is a block side of the bonding tool 134 (eg, capillary razor 134) contacting the underlying substrate 140 (eg, bonding location 140, etc.) during "capillary trowel height calibration" (a plane that coincides with the top surface of substrate 140). view. This can be used to establish/calibrate the positional and vertical height movement of the capillary file 134 relative to the substrate 140. In FIG. 1C, a capillary file 134 is placed adjacent the electronic ignition device 136, and a reference wire 130 (having a diameter 132) extends from a central bore at the tip end of the capillary file 134. The electric spark 138 is transmitted from the electronic ignition device 136 to the reference conductor 130 to melt the lower portion of the reference conductor 130 and form a reference airless ball (e.g., the reference airless ball 139a as shown in FIG. 1D).

1D shows a reference airless ball 139a (with the wire 130a of diameter 132a) placed within the tip end of the capillary file 134 and contacting the substrate 140 at a "reference contact height" 142a. This "contact height" may be the height of the tip end of the capillary file 134 when the bottom of the airless ball 139a first touches or contacts the lower surface (eg, the upper surface of the substrate 140 on the wire bonding machine, etc.). For example, electrical continuity can be used to detect such contact of the airless ball 139a to detect contact between the airless ball 139a and the engaged position 140. Those skilled in the art will Solution, FIG. 1B shows the reference contact height 142a associated with the exposed portion of the reference airless ball 139a (not the entire diameter of the reference airless ball 139a because a portion of the ball 139a is placed within the tip end of the capillary file 134). Therefore, the reference contact height is established. Of course, the reference contact height can be established in a variety of ways. In one example, several reference airless balls (as in Figure ID) can be measured, where such measurements can be used together to derive a reference contact height. In another example, a known reference contact height may be selected without performing the measurements shown in FIG. 1D. In yet another example, the nominal wire size/diameter can be used to determine (eg, calculate, etc.) the reference contact height.

After changing the wire spool (eg, step 100), FIG. 1E shows the "actual contact height" 142b of the actual airless ball 139b formed by the actual wire 130b (eg, steps 102 and 104). As shown, the actual contact height 142b is lower/less than the reference contact height 142a (eg, step 106). Therefore, the actual diameter 132b of the wire 130b is smaller than the reference diameter 132a of the reference wire 130a. If the difference in contact height between the reference diameter 132a and the actual diameter 132b is greater than a predetermined tolerance level (eg, step 106), the airless ball formation parameter is adjusted based at least in part on the difference (eg, step 110). Subsequent airless balls may then be formed (e.g., step 102) until the contact height difference is less than the predetermined tolerance level and the operation is complete (e.g., step 108).

2A-2C illustrate a method of using joint extrusion as a selected characteristic to compensate for a predetermined change in wire diameter when changing a wire spool. 2A is a closed loop flow diagram, and FIGS. 2B-2C are block diagrams showing the example method of FIG. 2A. At step 200, the wire spool on the wire bonding machine is changed. At step 202, an airless ball (which may be placed in the capillary file tip) is formed, and at step 204, the capillary file is lowered to the substrate using a bonding force to form a bond with the airless ball. At step 206, an extrusion of the airless ball is determined (which may be a flat for a plurality of joints) At the mean squeezing value, at step 208, it is determined if the airless ball squeezing is within a predetermined tolerance level of the reference airless ball squeezing. If the answer is "Yes", the method proceeds to step 210 and the operation is completed. If the answer is no, the method proceeds to step 212 where the airless ball formation parameters are adjusted based at least in part on the difference between the (average) airless ball extrusion and the reference airless ball extrusion. Subsequently, the method returns to step 202 where a subsequent airless ball is formed and the method can continue the loop from step 202 to step 212 until "YES" is obtained at step 208.

2B illustrates a side view (eg, step 202) of an airless ball 239 formed from a wire 230 having a diameter 232 upon first contact (eg, a downward touch) with the substrate 240 (eg, the engaged position 240), The airless ball 239 establishes the distance 242 of the capillary file 234 above the upper surface of the substrate 240. As shown in FIG. 2C, the capillary file 234 continues downward using the engagement force (possibly ultrasonic energy) until an airless ball joint 244 (eg, ball joint 244) is formed at the engagement location 240 (eg, step 204). . The ball joint 244 has a joint extrusion 248 that can be calculated as (1) the distance 242 of the capillary file 234 from the upper surface 252 of the pad 240 when touched down (see, for example, Figure 2B), And (2) the difference between the distance 250 (e.g., step 206) of the capillary file 234 from the upper surface 252 of the pad 240 after the ball bond 244 is formed. The bond extrusion 248 is associated with the diameter 232 of the wire 230.

If the engagement squeeze 248 is within a predetermined tolerance level of the reference airless ball engagement extrusion (the answer at step 208 is "YES"), then the operation is complete (eg, step 210). However, if the engagement extrusion 248 is not within the predetermined tolerance level of the reference airless ball engagement extrusion (the answer at step 208 is "NO"), then based at least in part on the airless ball extrusion and the reference airless ball extrusion The difference between the pressures is used to adjust the airless ball formation parameters (eg, step 212). Subsequently, the adjusted airless ball formation parameters are used to form a subsequent airless ball (eg, step 202), The method can continue to be performed in a loop as described above until the difference between the subsequent airless ball press 248 and the reference airless ball squeeze is within a predetermined tolerance level (e.g., the answer at step 208 is " Yes").

3 is a closed loop flow diagram showing a method of using a joint force value (eg, a single force value, a joint force distribution, etc.) as the selected characteristic. At step 300, the wire spool on the wire bonding machine is changed. At step 302, an airless ball is formed. At step 304, a target force value (eg, a target engagement force value used during ball joint formation) is determined. At step 306, it is determined if the target force value is within a predetermined tolerance level of the baseline force value. If the answer is yes, the method proceeds to step 308 and the operation is completed. If the answer is no, the method proceeds to step 310 where the airless ball formation parameters are adjusted based at least in part on the difference between the target force value and the reference force value. The method can then return to step 302 until "YES" is achieved at step 306. Those skilled in the art will appreciate that the force of engagement force can be measured, for example, using a force sensor on the bond head of the wire bonder.

4A-4D illustrate a method of using a tensile/tension test of a post-bonded wire as a selected characteristic related to wire diameter. Referring to Figure 4A, at step 400, the wire spool on the wire bonding machine is changed. At step 402, the target joint is formed using the airless ball, and at step 404, the capillary file is raised with the wire clamp open to maintain a portion of the wire following the target engagement. At step 406, a tension/tension test is performed by closing the clamp and then raising the capillary file to pull the portion of the wire out of the target joint. At step 408, it is then determined if the target pull/tension test value is within a predetermined tolerance level of the desired reference pull/tension test value. If the answer is "Yes", the method proceeds to step 410 and the operation is completed. If the answer is no, the method proceeds to step 412 where it is based, at least in part, on the target pull/tension test value and the reference pull The difference between the force/tension test values is used to adjust the airless ball formation parameters. Further operations can then be carried out.

4B illustrates the use of a wire 430 through the wire clamp 450 after changing the wire spool (eg, step 400), the bonding tool 434 (eg, capillary file 434) engaging the airless ball 433 to the bonding position 440 (eg, semiconductor A side view of target joint 444 (eg, step 402) is formed on bond pads 440) of die 442. In FIG. 4B, the clip 450 is closed (but may also be open), and the capillary file 434 is moved downward by the engaging force to engage the airless ball joint 444 on the upper surface of the pad 440 (see FIG. 4C) (see FIG. 4C) (see FIG. 4C). For example, step 402). In FIG. 4C, with the wire clamp 450 open, the capillary file 434 is raised as indicated by arrow 452 to maintain a portion of the wire 430 following the target joint 444 (eg, step 404). Subsequently, as shown in FIG. 4D, by closing the clip 450 and further raising the capillary file 434 as indicated by arrow 454 to unplug the wire 430 from the target joint 444 (and thereby separate) (eg, step 406), For the tensile test. During the separation, the tensile strength of the wire (for example, the tensile/tension test value) is measured. This tension/tension test value is related to the diameter of the wire 430. A determination is made as to whether the target pull/tension test value is within a predetermined tolerance level of the reference pull/tension test value (eg, step 408). If the answer is yes, the operation is complete (eg, step 410). If the answer is no, the airless ball formation parameters are adjusted based at least in part on the difference between the target tension/tension test value and the reference pull/tension test value (eg, step 412).

Figure 5 is a flow chart showing a method of using wire diameter (e.g., wire size) as the selected characteristic. At step 500, the wire spool on the wire bonding machine is changed. At step 502, the diameter of the new wire is determined (eg, measured). Subsequently, at step 504, it is determined if the new wire diameter is within a predetermined tolerance of the reference wire diameter. If the answer is "Yes", the method proceeds to step 506 and the operation is completed. If the answer is no, the method proceeds to step 508 to adjust the airless ball formation parameters based, at least in part, on the difference between the new wire diameter and the reference wire diameter. The wire diameter can be determined using any contemplated technique including, for example, a camera based optical inspection system.

6 is a flow chart showing a method of using an ultrasonic sensor energy characteristic (for example, an impedance seen by a sensor, a voltage applied to a sensor, a current applied to a sensor, etc.) as a selected characteristic. At step 600, the wire spool on the wire bonding machine is changed. At step 602, an airless ball is formed, and at step 604, the bonding tool is lowered to the substrate using a bonding force to form a spherical bond with the airless ball. At step 606, a target ultrasonic sensor energy characteristic value during formation of the spherical joint is determined. The target characteristic can be a single value associated with a single bond (eg, a single value of impedance, voltage, and/or current), or can be derived from a plurality of values. At step 608, it is determined if the target ultrasonic sensor energy characteristic value is within a predetermined tolerance level of the reference ultrasonic sensor energy characteristic value. If the answer is "Yes", the method proceeds to step 610 and the operation is completed. If the answer is no, the method proceeds to step 612 to adjust the airless ball formation parameter based, at least in part, on the difference between the target ultrasonic sensor energy characteristic value and the reference ultrasonic sensor energy characteristic value. Subsequently, the method returns to step 602 where a subsequent airless ball is formed, followed by steps 604 and 608 (step 612 if necessary) until "YES" is obtained at step 608.

Examples of the reference ultrasonic sensor energy characteristic value include an impedance value, a current value, or a voltage value. For example, if the sensor is operating in a constant current mode, the voltage can be considered to be an ultrasonic sensor energy characteristic value. The voltage can be measured during ball bond formation (eg, at a single point in time during ball bond formation, or during all or part of the airless ball formation period) The voltage distribution between them), or a plurality of voltage values (for example, for a plurality of spherical joints) can be determined. In any case, determine the voltage value (using a single voltage value or a plurality of voltage values) and compare it to the reference voltage value.

In another example, if the sensor is operating in a constant voltage mode, the current can be considered an ultrasonic sensor energy characteristic value. Current may be measured during ball bond formation (eg, at a single point in time during ball bond formation, or current distribution during full or partial ball bond formation), or multiple current values may be determined (eg, for multiples) Spherical joint). In any case, determine the current value (using a single current value or a plurality of values) and compare it to the reference current value.

In yet another example, the impedance seen by the sensor can be used as an ultrasonic sensor energy characteristic value. Current and voltage can be used to determine this impedance (eg, one of the voltage and current is fixed depending on the mode of operation, and the other of the voltage and current is measured).

It should be noted that the methods disclosed herein are not limited to when to change the wire spool of the wire bonding machine. For example, this method can be used for: (1) within a single wire reel; (2) after two or more wire reels have been changed; (3) at the start of the wire bonding machine; (4) at a predetermined number of wires After joining; and so on. In addition, periodic or continuous inspection of the wire diameter on the spool can be employed to determine if it is within a predetermined tolerance level.

Those skilled in the art will appreciate that the methods disclosed and claimed herein may be performed at the joint regions of the wire bonders or may be performed at different regions of the wire bonder remote from the engageable regions.

The various methods disclosed or claimed herein can be used in a closed loop manner until The target (actual) value of the characteristic is within a predetermined tolerance of the reference value of the characteristic. However, such closed loop processing may also be terminated based on a timeout feature (eg, after a predetermined time has elapsed, etc.), after a predetermined number of iterative operations, and the like.

As noted above, certain characteristics considered herein may be related to the z-axis (ie, vertical axis) position on the wire bonder. For example, the z-axis position needs to be determined during the contact height detection method (see FIGS. 1A-1E) and the airless ball extrusion detection method (see FIGS. 2A-2C). Those skilled in the art will appreciate that a z-axis encoder can be used in conjunction with such detection methods. Typically, the bond head carrying the bonding tool can include a z-axis encoder to accurately determine the movement of the bonding tool on the z-axis.

According to each of the example embodiments of the present invention, the reference characteristics may be measured, calculated, or otherwise determined as desired (eg, the contact height in FIG. 1A, the squeeze value in FIG. 2A, the force value in FIG. 3, The tension/tension value in Fig. 4, the wire diameter in Fig. 5 and the ultrasonic sensor energy characteristic value in Fig. 6). Moreover, according to each of the exemplary embodiments of the present invention, if it is determined to use the measured value (either directly or by calculation), the reference characteristic and the target/actual can be obtained from a single measurement or multiple measurements as desired. Characteristics (eg, contact height in FIG. 1A, extrusion value in FIG. 2A, force value in FIG. 3, tensile/tension value in FIG. 4, wire diameter in FIG. 5, and ultrasonic sensor energy in FIG. Characteristic value).

Although the invention has been described primarily in a predetermined order relative to certain exemplary method steps, the invention is not limited thereto. Certain steps may be rearranged or omitted within the scope of the invention, or additional steps may be added.

Although the present invention has been shown and described herein with reference to the specific embodiments, the invention is not intended to Rather, many modifications may be made to the details within the scope and the scope of the appended claims and without departing from the invention.

Claims (37)

A method of adjusting airless ball formation parameters on a wire bonding machine, the method comprising the steps of: a) providing a reference bonding force value; b) measuring a target of the target wire bonding during formation of the target wire bonding on the wire bonding machine a bonding force value; and c) if the difference between the target engagement force value and the reference engagement force value is greater than a predetermined tolerance level, adjusting the airless ball formation parameter of the wire bonding machine based at least in part on the difference . The method of claim 1, wherein the airless ball formation parameter is an electronic ignition device parameter. The method of claim 1, wherein the airless ball formation parameter is a power output parameter of the electronic ignition device. The method of claim 1, wherein the airless ball formation parameter is a length of time during which power is applied from the electronic ignition device. The method of claim 1, wherein the airless ball formation parameter is a current output parameter of the electronic ignition device. The method of claim 1, wherein the measuring of step (b) and the adjusting of step (c) are performed when the lead reel is changed on the wire bonding machine. The method of claim 1, wherein the adjusted amount of step (c) is related to the difference between the target engagement force value and the reference engagement force value. The method of claim 1, further comprising the step of: (d) using the adjusted airless ball formation parameters after step (c) to form a subsequent target airless ball. The method of claim 8, wherein the steps (b) to (d) are repeated until the difference between the subsequent target engagement force value and the reference engagement force value is equal to or smaller than the predetermined tolerance level. A method of adjusting airless ball formation parameters on a wire bonding machine, the method comprising the steps of: a) providing a reference tensile test characteristic value; b) measuring a target tensile test characteristic value of at least one of the bond wire portions on the wire bonding machine; And c) if the difference between the target tensile test characteristic value and the reference tensile test characteristic value is greater than a predetermined tolerance level, adjusting the airless ball for use on the wire bonding machine based on the difference The balloon forms a parameter. The method of claim 10, wherein steps b) to c) are repeated until the difference between the subsequent target tensile test characteristic value and the reference tensile test characteristic value is equal to or less than the predetermined tolerance level . The method of claim 10, wherein the airless ball formation parameter is an electronic ignition device parameter. The method of claim 10, wherein the airless ball formation parameter is a power output parameter of the electronic ignition device. The method of claim 10, wherein the airless ball formation parameter is a length of time during which power is applied from the electronic ignition device. The method of claim 10, wherein the airless ball formation parameter is a current output parameter of the electronic ignition device. The method of claim 10, wherein the measuring of step (b) and the adjusting of step (c) are performed when the lead bob is changed on the wire bonding machine. The method of claim 10, wherein the adjusted amount of step (c) is related to the difference between the target tensile test characteristic value and the reference tensile test characteristic value. The method of claim 10, further comprising the step of: (d) using the adjusted airless ball formation parameters after step (c) to form a subsequent target airless ball. A method of adjusting airless ball formation parameters on a wire bonding machine, the method comprising the steps of: a) providing a reference lead size associated with a diameter of a reference lead; b) measuring a diameter of at least one target lead on the wire bonding machine Related target lead size; c) if the difference between the target lead diameter and the reference lead diameter is greater than a predetermined tolerance level, the airless ball formation parameter of the wire bonding machine is adjusted based at least in part on the difference. The method of claim 19, wherein the airless ball formation parameter is an electronic ignition device parameter. The method of claim 19, wherein the airless ball formation parameter is a power output parameter of the electronic ignition device. The method of claim 19, wherein the airless ball formation parameter is a length of time during which power is applied from the electronic ignition device. The method of claim 19, wherein the airless ball formation parameter is a current output parameter of the electronic ignition device. The method of claim 19, wherein the measuring of step (b) and the adjusting of step (c) are performed when the lead bob is changed on the wire bonding machine. The method of claim 19, wherein the adjusted amount of step (c) is related to the difference between the target lead size and the reference lead size. The method of claim 19, further comprising the step of: (d) using the adjusted airless ball formation parameters after step (c) to form a subsequent target airless ball. A method of adjusting airless ball formation parameters on a wire bonding machine, the method comprising the steps of: a) providing a reference ultrasonic sensor energy characteristic value; b) determining a target during formation of at least one ultrasonic spherical joint on the wire bonding machine An ultrasonic sensor energy characteristic value; and c) if the difference between the target ultrasonic sensor energy characteristic value and the reference ultrasonic sensor energy characteristic value is greater than a predetermined tolerance level, adjusted based at least in part on the difference The airless ball on the wire bonding machine forms parameters. The method of claim 27, wherein the target ultrasonic sensor energy characteristic value is an impedance value associated with operation of the ultrasonic sensor. The method of claim 27, wherein the target ultrasonic sensor energy characteristic value is a current value associated with a current applied to the ultrasonic sensor. The method of claim 27, wherein the target ultrasonic sensor energy characteristic value is a voltage value associated with a voltage applied to the ultrasonic sensor. The method of claim 27, wherein the airless ball formation parameter is an electronic ignition device parameter. The method of claim 27, wherein the airless ball formation parameter is a power output parameter of the electronic ignition device. The method of claim 27, wherein the airless ball formation parameter is a length of time during which power is applied from the electronic ignition device. The method of claim 27, wherein the airless ball formation parameter is a current output parameter of the electronic ignition device. The method of claim 27, wherein the measuring of step (b) and the adjusting of step (c) are performed when the lead bob is changed on the wire bonding machine. The method of claim 27, wherein the adjusted amount of step (c) is related to the difference between the target ultrasonic sensor energy characteristic value and the reference ultrasonic sensor energy characteristic value. The method of claim 27, further comprising the step of: (d) using the adjusted airless ball formation parameters after step (c) to form a subsequent target airless ball.