TWI534406B - Method for manufacturing heat disspation device - Google Patents
Method for manufacturing heat disspation device Download PDFInfo
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- TWI534406B TWI534406B TW100131834A TW100131834A TWI534406B TW I534406 B TWI534406 B TW I534406B TW 100131834 A TW100131834 A TW 100131834A TW 100131834 A TW100131834 A TW 100131834A TW I534406 B TWI534406 B TW I534406B
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- heat dissipating
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- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 238000000034 method Methods 0.000 title claims description 13
- 230000017525 heat dissipation Effects 0.000 claims description 92
- 238000010438 heat treatment Methods 0.000 claims description 17
- 238000001125 extrusion Methods 0.000 claims description 14
- 230000008878 coupling Effects 0.000 claims description 9
- 238000010168 coupling process Methods 0.000 claims description 9
- 238000005859 coupling reaction Methods 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 239000011120 plywood Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- 230000000903 blocking effect Effects 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000007769 metal material Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
本發明係一種散熱裝置的製造方法,特別是一種包含加熱步驟的散熱裝置的製造方法。 The present invention is a method of manufacturing a heat sink, and more particularly to a method of manufacturing a heat sink including a heating step.
就目前的散熱裝置而言,基本的形態係使用金屬板為吸熱底座,並在吸熱底座上豎立複數個金屬片,以做為散熱鰭片。這種形態的散熱裝置,在使用上是將吸熱底座接觸於欲散熱之電子元件上,例如中央處理器(central processing unit,CPU)和圖形處理器(graphic processing unit,GPU)等電子元件,使電子元件於運作時所散發的熱能可經由吸熱底座經由熱傳導作用傳遞至複數個金屬片,之後再藉由複數個金屬片與外界空氣交換熱能,以達到使電子元件降溫的目的。 In the current heat sink, the basic form is to use a metal plate as the heat sink base, and a plurality of metal pieces are erected on the heat sink base as heat sink fins. The heat sink of this type is used to contact the heat sink base with electronic components to be dissipated, such as a central processing unit (CPU) and a graphic processing unit (GPU). The thermal energy emitted by the electronic component during operation can be transferred to a plurality of metal sheets via the heat transfer base through heat conduction, and then the heat energy is exchanged with the outside air by a plurality of metal sheets to cool the electronic components.
此外,在習知散熱裝置的製造上,可能利用組合之方式將複數個金屬片結合於金屬板上,這種將二元件相互結合的製造方式,通常有以下幾種接合方法:黏合、卡槽或鎖固等方法。黏合係使用黏著劑使二元件相互黏接,此方法最為容易,惟,黏合劑導熱係數低,會使二元件間熱傳導產生阻礙,進而影響散熱效能,也有鬆脫的隱憂。卡槽或鎖固則藉由構造上的設計,如設計凹凸卡槽或利用螺帽栓緊螺栓等,使二元件得以接合並固定,不過此種方式會造成接觸面有縫隙無法密合,而縫隙夾有空氣層使導熱效果大大降低。 In addition, in the manufacture of the conventional heat dissipating device, it is possible to combine a plurality of metal sheets on the metal plate by a combination. The manufacturing method of combining the two elements with each other generally has the following joining methods: bonding, card slot Or locking methods. The adhesive system uses an adhesive to bond the two components to each other. This method is the easiest. However, the low thermal conductivity of the adhesive may hinder the heat conduction between the two components, thereby affecting the heat dissipation performance, and also has the concern of loosening. The card slot or the locking is made by the structural design, such as designing the embossing card slot or using the nut to bolt the bolt, etc., so that the two components can be joined and fixed, but this way, the contact surface can not be tightly closed, and The air layer is sandwiched in the gap to greatly reduce the heat conduction effect.
此外,另有一種散熱裝置的製造方法,是以螺栓或插銷等結 合件串接複數個金屬片以及複數個夾片,使複數個金屬片以及複數個夾片受到結合件的夾固而結合為散熱裝置。然而,這種散熱裝置僅單純的藉由結合件將複數個金屬片與複數個夾片相互貼合夾緊,因此在金屬片與夾片之間容易因材料間的熱脹冷縮而存在有空氣間隙,如此將減少金屬片與夾片之間的接觸面積,而嚴重影響金屬片與夾片彼此之間的熱傳導作用,進而大幅降低散熱裝置的散熱效率。 In addition, another method of manufacturing a heat sink is a knot such as a bolt or a bolt. The plurality of metal pieces and the plurality of clips are connected in series, so that the plurality of metal pieces and the plurality of clips are combined by the joint to be combined as a heat sink. However, the heat dissipating device simply clamps the plurality of metal pieces and the plurality of clips to each other by the bonding member, so that there is a possibility of thermal expansion and contraction between the metal sheets and the clips. The air gap, which will reduce the contact area between the metal piece and the clip, seriously affects the heat conduction between the metal piece and the clip, thereby greatly reducing the heat dissipation efficiency of the heat sink.
因此,如何改善散熱裝置製造時,於金屬片與夾片之間的接觸面,容易產生隙縫及空氣層而無法緊密接觸,所導致散熱裝置的散熱效果不佳的問題,實為目前相關業者所欲解決的課題之一。 Therefore, how to improve the contact surface between the metal piece and the clip during the manufacture of the heat dissipating device is likely to cause a gap and an air layer to be in close contact, which causes a problem that the heat dissipating effect of the heat dissipating device is not good, which is currently a relevant industry One of the topics to be solved.
鑒於以上的問題,本發明提供一種散熱裝置的製造方法,藉以解決習知散熱裝置製造方法中,金屬片與夾片容易在彼此之間的接觸面存在有間隙或空氣介面,導致金屬片與夾片無法緊密貼合,以致於大幅降低散熱裝置之散熱效能的問題。 In view of the above problems, the present invention provides a method for manufacturing a heat dissipating device, in which a method for manufacturing a heat dissipating device is known, in which a metal sheet and a clip are easily separated by a gap or an air interface between the contact faces of each other, resulting in a metal sheet and a clip. The sheets do not fit snugly, so that the heat dissipation performance of the heat sink is greatly reduced.
本發明揭露一種散熱裝置的製造方法,包括以下步驟:交錯設置複數個散熱鰭片以及複數個夾片,令相鄰之二散熱鰭片之間相隔一間距,以形成一層狀散熱結構;加熱層狀散熱結構;擠壓層狀散熱結構,令複數個散熱鰭片及複數個夾片相互推擠;以及夾固層狀散熱結構,令複數個散熱鰭片及複數個夾片結合為一整體。 The invention discloses a method for manufacturing a heat dissipating device, comprising the steps of: staggering a plurality of heat dissipating fins and a plurality of clips, so that adjacent ones of the fins are spaced apart to form a layer of heat dissipating structure; heating a layered heat dissipation structure; an extruded layered heat dissipation structure, which causes a plurality of heat dissipation fins and a plurality of clips to push each other; and a laminated layer heat dissipation structure, which combines a plurality of heat dissipation fins and a plurality of clips into one whole .
本發明之功效在於,將複數個散熱鰭片及複數個夾片藉由烘烤軟化,在金屬軟化的狀態下夾合複數個散熱鰭片及複數個夾 片,以藉由讓複數個散熱鰭片及複數個夾片因緊密貼合而產生形變,甚至是使複數個散熱鰭片的表面與複數個夾片的表面之間相互融合,進而除去兩者間相互接觸時所產生的隙縫及空氣介面,因此可增進複數散熱鰭片及複數夾片之間的熱傳導作用,進而提升散熱裝置的散熱效率。 The utility model has the advantages that a plurality of heat dissipation fins and a plurality of clips are softened by baking, and a plurality of heat dissipation fins and a plurality of clips are sandwiched in a state in which the metal is softened. The film is formed by causing a plurality of heat-dissipating fins and a plurality of clips to be deformed by close fitting, and even merging the surfaces of the plurality of heat-dissipating fins with the surfaces of the plurality of clips to remove the two The gap and the air interface generated when contacting each other can improve the heat conduction between the plurality of fins and the plurality of clips, thereby improving the heat dissipation efficiency of the heat sink.
有關本發明的特徵、實作與功效,茲配合圖式作最佳實施例詳細說明如下。 The features, implementations, and utilities of the present invention are described in detail below with reference to the drawings.
請參照第1圖至第5圖所示,本發明第一實施例所揭露之散熱裝置10的製造方法,首先交錯設置複數個散熱鰭片110以及複數個夾片120,以形成一層狀散熱結構100(S101)。散熱鰭片110可以是但並不侷限於由鋁或銅等金屬材料所組成之片材或板材,並且於散熱鰭片110上具有複數個穿孔111。夾片120可以是但並不侷限於由鋁或銅等金屬材料或者是塑膠所組成之片材或板材,並且在夾片120上形成有對應穿孔111之複數個定位孔121。其中,夾片120的長度小於散熱鰭片110的長度,使相鄰之二散熱鰭片110之間受到夾片120的阻隔而相隔一間距d(如第2圖所示),用以做為供一氣體流動及/或與外界空氣進行熱交換的氣流通道。 Referring to FIG. 1 to FIG. 5 , in the manufacturing method of the heat dissipation device 10 disclosed in the first embodiment of the present invention, a plurality of heat dissipation fins 110 and a plurality of clips 120 are first staggered to form a layer of heat dissipation. Structure 100 (S101). The heat dissipation fins 110 may be, but not limited to, a sheet or a plate material composed of a metal material such as aluminum or copper, and have a plurality of through holes 111 on the heat dissipation fins 110. The clip 120 may be, but not limited to, a sheet or plate composed of a metal material such as aluminum or copper or plastic, and a plurality of positioning holes 121 corresponding to the through holes 111 are formed on the clip 120. The length of the clip 120 is smaller than the length of the heat dissipating fins 110, so that the adjacent fins 110 are blocked by the clip 120 and separated by a spacing d (as shown in FIG. 2). An air flow passage for a gas to flow and/or to exchange heat with outside air.
此外,在夾片120的至少其中一側邊形成有一導流面122,導流面122可以是但並不侷限於以斜平面或曲面的形式形成於夾片120上。並且,夾片120之導流面122位於相鄰之二散熱鰭片110之間所形成的氣流通道內,用以導引氣流變換流動方向。 In addition, a flow guiding surface 122 is formed on at least one side of the clip 120, and the flow guiding surface 122 may be formed on the clip 120 in an oblique plane or a curved surface. Moreover, the flow guiding surface 122 of the clip 120 is located in the air flow channel formed between the adjacent two heat radiating fins 110 for guiding the air flow to change the flow direction.
承上,在層狀散熱結構100形成後,設置一固定片130於層狀散熱結構100之一側面,或者是設置二固定片130於層狀散熱結構100的相對二側面,並且使固定片130的設置位置對應於夾片120(S102)。固定片130的組成材料可以是但並不侷限於鋼,因此使固定片130的熔點大於散熱鰭片110及夾片120。此外,在固定片130上形成有複數個固定孔131,使固定片130設置於層狀散熱結構100之側面時,可以複數個固定孔131對齊散熱鰭片110之複數個穿孔111以及夾片120之複數個定位孔121,藉以在層狀散熱結構100上形成複數個貫穿通道。 After the layered heat dissipation structure 100 is formed, a fixing piece 130 is disposed on one side of the layered heat dissipation structure 100, or two fixing pieces 130 are disposed on opposite sides of the layered heat dissipation structure 100, and the fixing piece 130 is disposed. The set position corresponds to the clip 120 (S102). The constituent material of the fixing piece 130 may be, but not limited to, steel, so that the melting point of the fixing piece 130 is larger than the heat dissipation fins 110 and the clips 120. In addition, a plurality of fixing holes 131 are formed on the fixing piece 130. When the fixing piece 130 is disposed on the side of the layered heat dissipation structure 100, the plurality of fixing holes 131 may be aligned with the plurality of through holes 111 of the heat dissipation fins 110 and the clip 120. A plurality of positioning holes 121 are formed to form a plurality of through channels on the layered heat dissipation structure 100.
然後,以複數個結合件140分別穿過由固定片130之固定孔131、散熱鰭片110之穿孔111以及夾片120之定位孔121所形成之複數個貫穿通道(如第3圖所示)。結合件140可以是但並不侷限於由一螺栓141以及一螺帽142所組成,螺栓141具有一第一端1411以及一第二端1412,螺栓141之第一端1411以及螺帽142的直徑分別大於固定孔131、穿孔111以及定位孔121的直徑,螺栓141之第二端1412的直徑則小於固定孔131、穿孔111以及定位孔121的直徑。因此,當結合件140以螺栓141串接固定片130、散熱鰭片110以及夾片120時,螺栓141之第一端1411係貼抵於層狀散熱結構100之一側面的固定片130上(S103),螺栓141之第二端1412則露出於層狀散熱結構100之另一側面的固定片130外,螺帽142即鎖固於螺栓141之第二端1412,並且貼抵於固定片130上(S104)。 Then, a plurality of coupling members 140 respectively pass through a plurality of through passages formed by the fixing holes 131 of the fixing piece 130, the through holes 111 of the heat dissipation fins 110, and the positioning holes 121 of the clips 120 (as shown in FIG. 3). . The coupling member 140 can be, but is not limited to, a bolt 141 having a first end 1411 and a second end 1412, a first end 1411 of the bolt 141, and a diameter of the nut 142. The diameter of the second end 1412 of the bolt 141 is smaller than the diameters of the fixing hole 131, the through hole 111 and the positioning hole 121, respectively, which are larger than the diameters of the fixing hole 131, the through hole 111 and the positioning hole 121. Therefore, when the coupling member 140 is connected to the fixing piece 130, the heat dissipation fin 110 and the clip 120 by bolts 141, the first end 1411 of the bolt 141 is fastened against the fixing piece 130 on one side of the layered heat dissipation structure 100 ( S103), the second end 1412 of the bolt 141 is exposed outside the fixing piece 130 on the other side of the layered heat dissipation structure 100. The nut 142 is locked to the second end 1412 of the bolt 141 and is attached to the fixing piece 130. Up (S104).
接著,加熱層狀散熱結構100(S105),例如將層狀散熱結構 100放置於一烤箱或烘爐等加熱設備內,並且以300℃至450℃之間的溫度烘烤,例如350℃進行烘烤,使散熱鰭片110與夾片120因加熱軟化,而容易在外力作用下產生變形。同時,由於固定片130的熔點大於散熱鰭片110與夾片120。因此,在此加熱溫度下,固定片130並不會因加熱作用而產生軟化,使固定片130仍能維持一定的剛性,而不會產生結構變形。 Next, the layered heat dissipation structure 100 is heated (S105), for example, a layered heat dissipation structure 100 is placed in a heating device such as an oven or an oven, and baked at a temperature between 300 ° C and 450 ° C, for example, 350 ° C, so that the heat dissipation fins 110 and the clips 120 are softened by heating, and are easily Deformation occurs under the action of external force. At the same time, since the melting point of the fixing piece 130 is larger than the heat dissipation fins 110 and the clips 120. Therefore, at this heating temperature, the fixing piece 130 does not soften due to the heating action, so that the fixing piece 130 can maintain a certain rigidity without causing structural deformation.
之後,如第4圖所示,在散熱鰭片110與夾片120尚處於軟化狀態時,將層狀散熱結構100放入一擠壓模具20中,並且以擠壓模具20之二壓合板210分別貼合於層狀散熱結構100之相對二側面所設置的固定片130表面。然後,以二壓合板210施加壓力於固定片130上,以藉由固定片130擠壓層狀散熱結構100(S106),使散熱鰭片110與夾片120之間的間距d縮短。由於固定片130的設置位置對應於夾片120,並且固定片130具有一定的鋼性,因此讓擠壓模具20所施加的壓力可透過固定片平均的分佈於層狀散熱結構的相對二側面,以避免在擠壓層狀散熱結構的過程中,造成散熱鰭片與夾片之間產生錯位、歪斜的情形發生,並且讓散熱鰭片110的表面以及夾片120的表面產生相互推擠並產生壓縮變形,而更加的緊密相互結合。 Thereafter, as shown in FIG. 4, when the heat dissipation fins 110 and the clips 120 are still in a softened state, the layered heat dissipation structure 100 is placed in an extrusion die 20, and the second compression plate 210 of the extrusion die 20 is used. The surfaces of the fixing sheets 130 disposed on opposite sides of the layered heat dissipation structure 100 are respectively attached. Then, pressure is applied to the fixing piece 130 by the second pressing plate 210 to press the layered heat dissipation structure 100 by the fixing piece 130 (S106), so that the distance d between the heat dissipation fin 110 and the clip 120 is shortened. Since the position of the fixing piece 130 corresponds to the clip 120, and the fixing piece 130 has a certain rigidity, the pressure applied by the pressing die 20 can be evenly distributed through the fixing piece on the opposite sides of the layered heat dissipating structure. In order to avoid the occurrence of misalignment and skew between the heat dissipation fins and the clip during the process of pressing the layered heat dissipation structure, the surface of the heat dissipation fin 110 and the surface of the clip 120 are mutually pushed and generated. Compressed deformation, and more closely combined with each other.
同時,當加熱溫度達到散熱鰭片110與夾片120的融化溫度時,更可藉由散熱鰭片110的表面與夾片120的表面互相融合,而進一步提升散熱鰭片110與夾片120之間的密合度。 At the same time, when the heating temperature reaches the melting temperature of the heat dissipating fins 110 and the clips 120, the surface of the heat dissipating fins 110 and the surface of the clips 120 are mutually fused to further enhance the heat dissipating fins 110 and the clips 120. The degree of closeness.
接著,將結合件140之螺帽142朝向固定片130的方向旋緊於螺栓141上,使結合件140的相對二端(即螺栓141的第一端1411 以及螺帽142)分別抵緊於固定片130上,使複數個散熱鰭片110、複數個夾片120以及固定片130(如第5圖所示),受到結合件140的夾固作用而結合為一整體(S107),以完成散熱裝置10的製造。 Next, the nut 142 of the coupling member 140 is screwed onto the bolt 141 in the direction of the fixing piece 130, so that the opposite ends of the coupling member 140 (ie, the first end 1411 of the bolt 141) And the nut 142) is respectively abutted against the fixing piece 130, so that the plurality of heat dissipation fins 110, the plurality of clips 120 and the fixing piece 130 (as shown in FIG. 5) are combined by the clamping action of the coupling member 140. It is a whole (S107) to complete the manufacture of the heat sink 10.
基於上述散熱裝置的製造方法,經由加熱、擠壓以及夾固等步驟的進行,讓複數個散熱鰭片與複數個夾片相互接觸時,可排除彼此之間所存在的空氣介面,並且使複數個散熱鰭片與複數個夾片得以更加緊密的結合,而增加彼此之間的熱傳導作用,進而提升散熱裝置的散熱效能。 According to the manufacturing method of the heat dissipating device described above, when a plurality of heat dissipating fins and a plurality of clips are brought into contact with each other through the steps of heating, pressing, and clamping, the air interface existing between each other can be eliminated, and the plurality of air interfaces can be eliminated. The heat sink fins and the plurality of clips are more closely combined to increase the heat conduction between each other, thereby improving the heat dissipation performance of the heat sink.
請參照第6圖至第10圖所示,本發明第二實施例所揭露之散熱裝置10的製造方法,首先提供複數個散熱鰭片110以及複數個夾片120(S201),散熱鰭片110可以是但並不侷限於由鋁或銅等金屬材料所組成之片材或板材,並且於散熱鰭片110上形成有一穿孔111。夾片120可以是但並不侷限於由鋁或銅等金屬材料或者是塑膠所組成之片材或板材。在本實施例中是以散熱鰭片110為銅所組成之片材,以及夾片120由鋁所組成之片材做為舉例說明,但並不以此為限。此外,夾片120的長度小於散熱鰭片110的長度,並且夾片120上形成有對應穿孔111之一定位孔121,以及在夾片120的相對二側邊分例形成有一導流面122,用以導引氣流的流動方向。 Referring to FIG. 6 to FIG. 10 , a method for manufacturing the heat dissipation device 10 according to the second embodiment of the present invention first provides a plurality of heat dissipation fins 110 and a plurality of clips 120 ( S201 ), and the heat dissipation fins 110 . It may be, but is not limited to, a sheet or plate composed of a metal material such as aluminum or copper, and a through hole 111 is formed in the heat dissipation fin 110. The clip 120 can be, but is not limited to, a sheet or sheet of metal material such as aluminum or copper or plastic. In the present embodiment, the sheet composed of the heat dissipation fins 110 is made of copper, and the sheet composed of the clips 120 is made of aluminum as an example, but not limited thereto. In addition, the length of the clip 120 is smaller than the length of the heat dissipation fin 110, and the positioning hole 121 of one of the corresponding through holes 111 is formed on the clip 120, and a flow guiding surface 122 is formed on the opposite sides of the clip 120. Used to guide the flow direction of the airflow.
接著,交錯設置複數個散熱鰭片110以及複數個夾片120(S202),使複數個夾片120介於相鄰之二散熱鰭片110之間,並且使夾片120之定位孔121對齊散熱鰭片110的穿孔111。同時,由於夾片120的長度小於散熱鰭片110的長度,使相鄰之二 散熱鰭片110之間具有一間距d(如第7圖所示),此間距d係做為氣流通道,用以供一氣體在間距d內流動及/或與外界空氣進行熱交換。因此,複數個散熱鰭片110以及複數個夾片120經由交互堆疊而形成一層狀散熱結構100。 Then, a plurality of heat dissipation fins 110 and a plurality of clips 120 are interleaved (S202), so that the plurality of clips 120 are interposed between the adjacent two heat dissipation fins 110, and the positioning holes 121 of the clips 120 are aligned to dissipate heat. The perforations 111 of the fins 110. At the same time, since the length of the clip 120 is smaller than the length of the heat dissipation fin 110, the adjacent two The heat dissipating fins 110 have a spacing d (as shown in FIG. 7) which serves as an air flow passage for a gas to flow in the spacing d and/or to exchange heat with the outside air. Therefore, the plurality of heat dissipation fins 110 and the plurality of clips 120 are stacked to form a layered heat dissipation structure 100.
然後,加熱層狀散熱結構100(S203),例如將層狀散熱結構100放置於一烤箱或烘爐等加熱設備內,並且以300℃至450℃之間的溫度烘烤,例如300℃進行烘烤,使散熱鰭片110與夾片120因加熱軟化,而容易在外力作用下產生變形。 Then, the layered heat dissipation structure 100 is heated (S203), for example, the layered heat dissipation structure 100 is placed in a heating device such as an oven or an oven, and baked at a temperature between 300 ° C and 450 ° C, for example, 300 ° C for baking. Bake, so that the heat dissipation fins 110 and the clips 120 are softened by heating, and are easily deformed by an external force.
之後,如第8圖所示,在散熱鰭片110與夾片120尚處於軟化狀態時,將層狀散熱結構100放入一擠壓模具20中,並且以擠壓模具20之二壓合板210分別貼合於層狀散熱結構100的相對二側面,使散熱鰭片110與夾片120被夾制於二壓合板210之間。然後,沿著散熱鰭片110與夾片120的排列方向,藉由二壓合板210施加壓力擠壓層狀散熱結構100(S204),使散熱鰭片110與夾片120因相互推擠而緊密接觸,並且使散熱鰭片110的表面以及夾片120的表面產生壓縮變形,進而縮短散熱鰭片110與夾片120之間的間距d,或者是當散熱鰭片110與夾片120達到其融化溫度,而造成散熱鰭片110的表面與夾片120的表面互相融合。因此,利用擠壓使散熱鰭片110與夾片120之間的密合度增加,並且使散熱鰭片110與夾片120相互貼合時,在散熱鰭片110表面與夾片120表面之間所含有的空氣層及縫隙得以消除,而可達到無縫貼合的作用。 Thereafter, as shown in FIG. 8, when the heat dissipation fins 110 and the clips 120 are still in a softened state, the layered heat dissipation structure 100 is placed in an extrusion die 20, and the second compression plate 210 of the extrusion die 20 is used. The heat dissipating fins 110 and the clips 120 are sandwiched between the two plywood plates 210 respectively. Then, along the direction in which the heat dissipation fins 110 and the clips 120 are arranged, the layered heat dissipation structure 100 is pressed by the pressure of the second pressure plate 210 (S204), so that the heat dissipation fins 110 and the clips 120 are pushed tightly by each other. Contacting and causing compression deformation of the surface of the heat dissipation fin 110 and the surface of the clip 120, thereby shortening the distance d between the heat dissipation fin 110 and the clip 120, or when the heat dissipation fin 110 and the clip 120 reach the melting point thereof The temperature causes the surface of the heat dissipation fin 110 to merge with the surface of the clip 120. Therefore, when the adhesion between the heat dissipation fins 110 and the clips 120 is increased by the pressing, and the heat dissipation fins 110 and the clips 120 are attached to each other, between the surface of the heat dissipation fins 110 and the surface of the clips 120 The contained air layer and gap are eliminated, and the seamless fit can be achieved.
可以理解的是,雖然在本實施例中層狀散熱結構的擠壓步驟 是在散熱鰭片與夾片加熱完成後才進行擠壓步驟,然而在本發明的其他實施例中,層狀散熱結構的擠壓步驟,亦可以和加熱步驟同時進行,例如在加熱設備中設置有擠壓模具,因此在操作上,先將層狀散熱結構夾固在擠壓模具上,使複數個散熱鰭片與複數個夾片彼此間相互貼合。然後再對層狀散熱結構進行加熱,並且在達到預定加熱溫度時,例如300℃、350℃、375℃或425℃等,再以擠壓模具對層狀散熱結構的相對二側面施加壓力,使散熱鰭片與夾片緊密貼合。除此之外,擠壓模具所施加的壓力大小亦可以隨著溫度梯度的上升而增加,以進一步增加散熱鰭片與夾片之間的密合度。 It can be understood that although the extrusion step of the layered heat dissipation structure in this embodiment is The extrusion step is performed after the heat dissipation fins and the clips are heated. However, in other embodiments of the present invention, the step of pressing the layered heat dissipation structure may be performed simultaneously with the heating step, for example, in a heating device. There is an extrusion die, so in operation, the layered heat dissipation structure is first clamped on the extrusion die, so that a plurality of heat dissipation fins and a plurality of clips are attached to each other. Then, the layered heat dissipating structure is heated, and when a predetermined heating temperature is reached, for example, 300 ° C, 350 ° C, 375 ° C or 425 ° C, etc., pressure is applied to the opposite sides of the layered heat dissipating structure by an extrusion die. The heat sink fins fit snugly against the clips. In addition, the amount of pressure applied by the extrusion die can also increase as the temperature gradient increases to further increase the tightness between the heat sink fins and the clip.
如第6圖、第9圖及第10圖所示,在層狀散熱結構100的擠壓步驟完成後,以一結合件140貫穿層狀散熱結構100,藉以夾固層狀散熱結構100(S205),其中結合件140可以是但並不侷限於銷釘、插銷或者是螺栓與螺帽的搭配組合,在本實施例中是以結合件140為銷釘做為舉例說明,但並不以此為限。結合件140包含一桿體143以及一擋片144,桿體143可以是半圓形桿體、方形桿體或者是半圓形桿體以及方形桿體的搭配組合,並且桿體143的直徑實質上等於散熱鰭片110之穿孔111的孔徑以及夾片120之定位孔121的孔徑。擋片144設置於桿體143之一端,並且擋片144的直徑大於散熱鰭片110之穿孔111的孔徑以及夾片120之定位孔121的孔徑。因此,結合件140是以桿體143穿過散熱鰭片110之穿孔111以及夾片120之定位孔121,使桿體143相對擋片144之另一端露出於層狀散熱結構100之一側面,並且以擋 片144貼抵於層狀散熱結構100之另一側面。 As shown in FIG. 6, FIG. 9 and FIG. 10, after the pressing step of the layered heat dissipation structure 100 is completed, the layered heat dissipation structure 100 is penetrated by a bonding member 140, thereby sandwiching the layered heat dissipation structure 100 (S205) The combination member 140 may be, but is not limited to, a pin, a pin, or a combination of a bolt and a nut. In the embodiment, the coupling member 140 is used as a pin, but is not limited thereto. . The coupling member 140 includes a rod body 143 and a blocking piece 144. The rod body 143 may be a semi-circular rod body, a square rod body or a combination of a semi-circular rod body and a square rod body, and the diameter of the rod body 143 is substantially The upper surface is equal to the aperture of the through hole 111 of the heat dissipation fin 110 and the aperture of the positioning hole 121 of the clip 120. The blocking piece 144 is disposed at one end of the rod body 143, and the diameter of the blocking piece 144 is larger than the diameter of the through hole 111 of the heat dissipation fin 110 and the diameter of the positioning hole 121 of the clip 120. Therefore, the joint member 140 passes through the through hole 111 of the heat dissipation fin 110 and the positioning hole 121 of the clip 120, so that the other end of the rod body 143 opposite to the blocking piece 144 is exposed on one side of the layered heat dissipation structure 100. And block The sheet 144 is attached to the other side of the layered heat dissipation structure 100.
接著,以敲擊或捶打方式沖壓桿體143相對擋片144之另一端,使桿體143相對擋片144之另一端產生結構變形,而壓抵於層狀散熱結構100相對擋片144的另一側面上。因此,使複數個散熱鰭片110以及複數個夾片120受到結合件140的夾制作用而緊密的結合為一整體,以完成散熱裝置10的製作。 Then, the other end of the rod 143 is pressed against the other end of the blocking piece 144 by tapping or beating, so that the other end of the rod 143 is deformed relative to the other end of the blocking piece 144, and is pressed against the layered heat dissipating structure 100 with respect to the blocking piece 144. On one side. Therefore, the plurality of heat dissipation fins 110 and the plurality of clips 120 are tightly combined as a whole by the clips of the joint member 140 to complete the fabrication of the heat sink 10.
上述本發明之散熱裝置的製造方法,藉由在製程中將複數個散熱鰭片以及複數個夾片加熱,使複數個散熱鰭片以及複數個夾片產生軟化,之後再擠壓複數個散熱鰭片及複數個夾片,使其彼此之間的表面緊密接觸而排除兩者之接面處的空氣,或者是使其彼此之間的表面相互融合,因此提升複數個散熱鰭片及複數個夾片之間的熱傳導效果,進而增進散熱器的效熱效能。 In the above method for manufacturing a heat dissipating device of the present invention, a plurality of heat dissipating fins and a plurality of clips are heated in the process to soften a plurality of heat dissipating fins and a plurality of clips, and then compressing a plurality of heat dissipating fins The sheet and the plurality of clips are brought into close contact with each other to exclude the air at the joint between the two, or to fuse the surfaces of each other, thereby lifting a plurality of heat sink fins and a plurality of clips The heat transfer between the sheets enhances the heat efficiency of the heat sink.
雖然本發明之實施例揭露如上所述,然並非用以限定本發明,任何熟習相關技藝者,在不脫離本發明之精神和範圍內,舉凡依本發明申請範圍所述之形狀、構造、特徵及數量當可做些許之變更,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。 Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the number of modifications may be made, and the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to the specification.
10‧‧‧散熱裝置 10‧‧‧heating device
100‧‧‧層狀散熱結構 100‧‧‧Layered heat dissipation structure
110‧‧‧散熱鰭片 110‧‧‧Heat fins
111‧‧‧穿孔 111‧‧‧Perforation
120‧‧‧夾片 120‧‧‧ Clips
121‧‧‧定位孔 121‧‧‧Positioning holes
122‧‧‧導流面 122‧‧ ‧ diversion surface
130‧‧‧固定片 130‧‧‧Fixed tablets
131‧‧‧固定孔 131‧‧‧Fixed holes
140‧‧‧結合件 140‧‧‧Connected parts
141‧‧‧螺栓 141‧‧‧ bolt
1411‧‧‧第一端 1411‧‧‧ first end
1412‧‧‧第二端 1412‧‧‧ second end
142‧‧‧螺帽 142‧‧‧ nuts
143‧‧‧桿體 143‧‧‧ rod body
144‧‧‧擋片 144‧‧ ‧Flap
20‧‧‧擠壓模具 20‧‧‧Extrusion mould
210‧‧‧壓合板 210‧‧‧Plywood
第1圖為本發明第一實施例之散熱裝置的製造方法流程圖。 Fig. 1 is a flow chart showing a method of manufacturing a heat sink according to a first embodiment of the present invention.
第2圖為本發明第一實施例之層狀散熱結構的局部分解示意圖。 Fig. 2 is a partially exploded perspective view showing the layered heat dissipation structure of the first embodiment of the present invention.
第3圖為本發明第一實施例之層狀散熱結構設置於擠壓模具內的側視示意圖。 Fig. 3 is a side elevational view showing the layered heat dissipating structure of the first embodiment of the present invention disposed in an extrusion die.
第4圖為本發明第一實施例之結合件夾固層狀散熱結構的立體示 意圖。 4 is a perspective view showing the sandwiched layered heat dissipation structure of the joint member according to the first embodiment of the present invention; intention.
第5圖為本發明第一實施例之散熱裝置的立體示意圖。 Fig. 5 is a perspective view showing the heat sink of the first embodiment of the present invention.
第6圖為本發明第二實施例之散熱裝置的製造方法流程圖。 Fig. 6 is a flow chart showing a method of manufacturing a heat sink according to a second embodiment of the present invention.
第7圖為本發明第二實施例之層狀散熱結構的局部分解示意圖。 Figure 7 is a partially exploded perspective view showing the layered heat dissipation structure of the second embodiment of the present invention.
第8圖為本發明第二實施例之層狀散熱結構設置於擠壓模具內的側視示意圖。 Figure 8 is a side elevational view showing the layered heat dissipating structure of the second embodiment of the present invention disposed in an extrusion die.
第9圖為本發明第二實施例之結合件夾固層狀散熱結構的立體示意圖。 Figure 9 is a perspective view showing the sandwiched layered heat dissipation structure of the joint member according to the second embodiment of the present invention.
第10圖為本發明第二實施例之散熱裝置的立體示意圖。 Figure 10 is a perspective view of a heat sink according to a second embodiment of the present invention.
Claims (6)
Priority Applications (2)
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|---|---|---|---|
| TW100131834A TWI534406B (en) | 2011-09-02 | 2011-09-02 | Method for manufacturing heat disspation device |
| CN201110348523.1A CN102984917B (en) | 2011-09-02 | 2011-11-07 | Method for manufacturing heat sink |
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| TW100131834A TWI534406B (en) | 2011-09-02 | 2011-09-02 | Method for manufacturing heat disspation device |
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| TWI534406B true TWI534406B (en) | 2016-05-21 |
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| JPH0794644A (en) * | 1993-06-29 | 1995-04-07 | Nisshin Seiki Kk | Heat sink |
| US20020020523A1 (en) * | 2000-08-21 | 2002-02-21 | Ling-Po Sheu | Radiator with thin fins |
| JP3552047B2 (en) * | 2000-10-25 | 2004-08-11 | 古河電気工業株式会社 | Heat sink, manufacturing method thereof, and pressing jig |
| CN2462543Y (en) * | 2001-01-12 | 2001-11-28 | 许凌波 | Thin airfoil heat sink |
| CN2490630Y (en) * | 2001-04-29 | 2002-05-08 | 李联荣 | Improved combined heat sink |
| CN2487111Y (en) * | 2001-05-14 | 2002-04-17 | 友巨企业有限公司 | Radiator fin |
| CN1622318A (en) * | 2003-11-24 | 2005-06-01 | 旭扬热导股份有限公司 | Manufacturing method and structure of heat sink |
| CN101832535A (en) * | 2009-12-31 | 2010-09-15 | 柯智慧 | Manufacturing method of multi-directional convection LED street lamp heat radiator |
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| CN102984917A (en) | 2013-03-20 |
| TW201312076A (en) | 2013-03-16 |
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