TWI530724B - Image sensor module and method for adjusting focus of image sensor module - Google Patents
Image sensor module and method for adjusting focus of image sensor module Download PDFInfo
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- TWI530724B TWI530724B TW103131202A TW103131202A TWI530724B TW I530724 B TWI530724 B TW I530724B TW 103131202 A TW103131202 A TW 103131202A TW 103131202 A TW103131202 A TW 103131202A TW I530724 B TWI530724 B TW I530724B
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- 238000000034 method Methods 0.000 title claims description 15
- 239000000853 adhesive Substances 0.000 claims description 26
- 230000001070 adhesive effect Effects 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 16
- 230000006835 compression Effects 0.000 claims description 4
- 238000007906 compression Methods 0.000 claims description 4
- 238000001723 curing Methods 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
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Description
本發明係有關於一種影像感測模組,尤指一種影像感測模組及調整影像感測模組的焦距的方法。 The invention relates to an image sensing module, in particular to an image sensing module and a method for adjusting the focal length of the image sensing module.
請參考第1圖,第1圖為先前技術中組裝影像感測模組及調整影像感測模組的焦距的流程圖。在第一個步驟中,使用接著劑112以將影像感測器120固定在印刷電路板110之上,且使用塗佈機(dispenser)將熱硬化接著劑122塗佈在印刷電路板110之上;接著,在第二個步驟中,具有一透鏡模組132的固定座130被置放於熱硬化接著劑122以及印刷電路板110之上,其中透鏡模組132可具有多個透鏡;在第三個步驟中,整個影像感測模組被放入烤箱中以進行固化程序,亦即將熱硬化接著劑122固化以將固定座130穩固在印刷電路板110之上;最後,在第四個步驟中,進行調制轉換函數(Modulation Transfer Function,MTF)測試,並藉由調整透鏡模組132與影像感測器120之間的距離來調整影像感測模組的焦距。 Please refer to FIG. 1 . FIG. 1 is a flow chart of assembling the image sensing module and adjusting the focal length of the image sensing module in the prior art. In the first step, an adhesive 112 is used to secure the image sensor 120 on the printed circuit board 110, and a thermal hardener 122 is applied over the printed circuit board 110 using a dispenser. Then, in the second step, the fixing base 130 having a lens module 132 is placed on the thermal curing adhesive 122 and the printed circuit board 110, wherein the lens module 132 can have a plurality of lenses; In the three steps, the entire image sensing module is placed in the oven for the curing process, that is, the thermosetting adhesive 122 is cured to stabilize the mount 130 on the printed circuit board 110; finally, in the fourth step The modulation transfer function (MTF) test is performed, and the focal length of the image sensing module is adjusted by adjusting the distance between the lens module 132 and the image sensor 120.
然而,由於塗佈在印刷電路板110之上的熱硬化接著劑122的量有時無法被精確地控制,再加上熱硬化接著劑122的形狀可能會因為固化過程中而有所改變,因此,固定座130可能會因為上述原因而造成傾斜,進而造成影樣感測器120所感測到的影像變得模糊。此外,由於透鏡模組132具有多個透鏡,因此當固定座130有傾斜現象發生時,部分透鏡的焦距可能無 法被精確地調整。 However, since the amount of the heat-hardening adhesive 122 coated on the printed circuit board 110 sometimes cannot be precisely controlled, the shape of the heat-hardening adhesive 122 may be changed due to the curing process, The fixing seat 130 may be tilted for the above reasons, thereby causing the image sensed by the image sensor 120 to become blurred. In addition, since the lens module 132 has a plurality of lenses, when the tilting phenomenon of the fixing base 130 occurs, the focal length of some of the lenses may be absent. The method is precisely adjusted.
因此,本發明的目的之一在於提供一種影像感測模組及調整影像感測模組之焦距的方法,以解決上述的問題。 Therefore, one of the objects of the present invention is to provide an image sensing module and a method for adjusting the focal length of the image sensing module to solve the above problems.
依據本發明一實施例,揭露一種影像感測模組,其包含了一基板、一安裝於該基板上的影像感測器、一設置於該基板上的固定座、設置於該固定座上的多個鏡筒、以及多個彈性元件,其中每一個鏡筒用來固定一個透鏡模組,以及每個彈性元件係設置於該固定座以及相對應的鏡筒之間,且用以施加彈力在該固定座與該相對應的鏡筒之上。 According to an embodiment of the invention, an image sensing module includes a substrate, an image sensor mounted on the substrate, a mounting seat disposed on the substrate, and a mounting on the mounting base. a plurality of lens barrels and a plurality of elastic members, wherein each of the lens barrels is used for fixing one lens module, and each elastic element is disposed between the fixing base and the corresponding lens barrel, and is configured to apply an elastic force The fixing seat is above the corresponding lens barrel.
依據本發明另一實施例,一種用來調整一影像感測模組的焦距的方法包含有:提供一基板;提供一安裝於該基板上的影像感測器;提供一設置於該基板上的固定座;將多個彈性元件分別置放於該固定座的多個孔中;將多個鏡筒分別設置於該固定座的該多個孔中,以使得每一個彈性元件位於該固定座以及相對應的鏡筒之間,其中每一個彈性元件用以施加彈力在該固定座與該相對應的鏡筒之上,且每一個鏡筒固定住一個透鏡模組;以及將該多個鏡筒分別相對於該固定座滑動以調整該多個鏡筒與該影像感測器之間的距離,以調整該影像感測模組的焦距。 According to another embodiment of the present invention, a method for adjusting a focal length of an image sensing module includes: providing a substrate; providing an image sensor mounted on the substrate; and providing a substrate disposed on the substrate a plurality of elastic members are respectively disposed in the plurality of holes of the fixing base; a plurality of lens barrels are respectively disposed in the plurality of holes of the fixing seat, so that each elastic element is located in the fixing seat and Between the corresponding lens barrels, wherein each of the elastic members is configured to apply an elastic force on the fixing base and the corresponding lens barrel, and each of the lens barrels fixes a lens module; and the plurality of lens barrels Sliding relative to the fixing seat to adjust a distance between the plurality of lens barrels and the image sensor to adjust a focal length of the image sensing module.
110、210‧‧‧印刷電路板 110, 210‧‧‧ Printed circuit boards
112、212‧‧‧接著劑 112, 212‧‧‧ adhesive
120、220‧‧‧影像感測器 120, 220‧‧‧ image sensor
122、222‧‧‧熱硬化接著劑 122, 222‧‧‧ Thermal hardening adhesive
130、230‧‧‧固定座 130, 230‧‧‧ fixed seat
132‧‧‧透鏡模組 132‧‧‧ lens module
242‧‧‧UV接著劑 242‧‧‧UV adhesive
250_1、250_2‧‧‧壓力螺旋彈簧 250_1, 250_2‧‧‧pressure coil spring
260_1、260_2‧‧‧鏡筒 260_1, 260_2‧‧ ‧ tube
第1圖為先前技術中組裝影像感測模組及調整影像感測模組的焦距的流程圖。 FIG. 1 is a flow chart of assembling the image sensing module and adjusting the focal length of the image sensing module in the prior art.
第2A圖及第2B圖為依據本發明一實施例之組裝影像感測模組及調整影像感測模組的焦距的流程圖。 2A and 2B are flow charts of assembling an image sensing module and adjusting a focal length of the image sensing module according to an embodiment of the invention.
請參考第2A圖及第2B圖,其繪示了依據本發明一實施例之組裝影像感測模組及調整影像感測模組的焦距的流程圖。須注意的是,在具有實質上相同結果的情形下,本發明的流程步驟並不以第2A圖及第2B圖所示的順序為限,參考第2A圖及第2B圖,流程敘述如下。 Please refer to FIG. 2A and FIG. 2B , which illustrate a flow chart of assembling an image sensing module and adjusting a focal length of the image sensing module according to an embodiment of the invention. It should be noted that, in the case of substantially the same result, the flow steps of the present invention are not limited to the order shown in FIGS. 2A and 2B, and the flow is described below with reference to FIGS. 2A and 2B.
在第一個步驟中,使用接著劑212以將影像感測器220固定在一基板(在本實施例中,該基板為印刷電路板210)之上,且使用塗佈機將熱硬化接著劑222塗佈在印刷電路板210之上;在第二個步驟中,將固定座230設置於熱硬化接著劑222之上,並將固定座230與印刷電路板210一同放入烤箱中以進行固化程序,亦即將熱硬化接著劑222固化以將固定座230穩固在印刷電路板210之上。在本實施例中,第2A圖所示的固定座230具有四個孔,(第2A圖繪示了固定座230的上視圖及側視圖),但這並非是作為本發明的限制,在實作上,固定座230上孔洞的數量可以根據設計者的考量而有所變化。 In the first step, an adhesive 212 is used to fix the image sensor 220 on a substrate (in this embodiment, the substrate is a printed circuit board 210), and a thermal hardening adhesive is used using a coater. 222 is coated on the printed circuit board 210; in the second step, the mount 230 is placed on the thermosetting adhesive 222, and the mount 230 is placed in the oven together with the printed circuit board 210 for curing. The procedure, that is, curing of the thermosetting adhesive 222, also secures the mount 230 over the printed circuit board 210. In the present embodiment, the fixing base 230 shown in FIG. 2A has four holes, (the second drawing shows a top view and a side view of the fixing base 230), but this is not a limitation of the present invention. As such, the number of holes in the mount 230 can vary depending on the designer's considerations.
在固定座230固定於印刷電路板210之後,在第三個步驟,使用塗佈機在固定座230上的每一個孔的內壁上塗上接著劑,在本實施例中,塗佈在內壁上的接著劑是紫外光接著劑(UV接著劑)242,但此接著劑也可以是其他的接著劑,例如熱硬化接著劑。 After the fixing base 230 is fixed to the printed circuit board 210, in the third step, an adhesive is applied to the inner wall of each of the holes on the fixing base 230 using a coater, in this embodiment, coated on the inner wall. The upper adhesive is an ultraviolet light adhesive (UV adhesive) 242, but the adhesive may also be another adhesive such as a heat hardening adhesive.
在第四個步驟中,多個彈性元件分別被置放於固定座230的多個孔中,在本實施例中,每一個彈性元件為一壓力螺旋彈簧250_1、250_2,且固定座230的每一個孔只會設置一個壓力螺旋彈簧。然而,在本發明之其他實施例中,第2A圖所示的壓力螺旋彈簧250_1、250_2可以被替換為其他任何適合的彈性元件,例如彈簧片...等等。 In the fourth step, a plurality of elastic members are respectively placed in the plurality of holes of the fixing base 230. In the embodiment, each of the elastic members is a pressure coil spring 250_1, 250_2, and each of the fixing seats 230 Only one pressure coil spring is placed in one hole. However, in other embodiments of the present invention, the pressure coil springs 250_1, 250_2 shown in FIG. 2A may be replaced with any other suitable elastic members, such as spring tabs, and the like.
在第五個步驟中,多個鏡筒260_1、260_2分別被置放於固定座230的多個孔中,且壓力螺旋彈簧250_1/250_2分別位於固定座230與鏡筒260_1/260_2之間。在本實施例中,每一個鏡筒260_1、260_2只會包含一個透鏡。 In the fifth step, the plurality of lens barrels 260_1, 260_2 are respectively placed in the plurality of holes of the fixing base 230, and the pressure coil springs 250_1 / 250_2 are respectively located between the fixing base 230 and the lens barrel 260_1 / 260_2. In the present embodiment, each of the barrels 260_1, 260_2 contains only one lens.
在第六個步驟中,進行調制轉換函數(MTF)測試以調整鏡筒260_1的焦距。詳細來說,當調整鏡筒260_1的焦距時,將鏡筒260_1相對於固定座230進行滑動(例如,可以藉由按壓鏡筒260_1來使得鏡筒260_1往下滑動,且此時壓力螺旋彈簧250_1會施加彈力在固定座230與鏡筒260_1之上),以調整鏡筒260_1與影像感測器220之間的距離。在鏡筒260_1滑動到最佳的位置之後,使用紫外光照射以硬化固定座230與鏡筒260_1之間的UV接著劑242,以固定住鏡筒260_1與固定座230。 In the sixth step, a modulation transfer function (MTF) test is performed to adjust the focal length of the lens barrel 260_1. In detail, when the focal length of the lens barrel 260_1 is adjusted, the lens barrel 260_1 is slid relative to the fixed seat 230 (for example, the lens barrel 260_1 can be slid downward by pressing the lens barrel 260_1, and the pressure coil spring 250_1 at this time) A spring force is applied to the mount 230 and the lens barrel 260_1 to adjust the distance between the lens barrel 260_1 and the image sensor 220. After the lens barrel 260_1 is slid to the optimum position, ultraviolet light is irradiated to harden the UV adhesive 242 between the holder 230 and the lens barrel 260_1 to fix the lens barrel 260_1 and the holder 230.
在第七個步驟中,進行調制轉換函數(MTF)測試以調整鏡筒260_2的焦距。詳細來說,當調整鏡筒260_2的焦距時,將鏡筒260_2相對於固定座230進行滑動(例如,可以藉由按壓鏡筒260_2來使得鏡筒260_2往下滑動,且此時壓力螺旋彈簧250_2會施加彈力在固定座230與鏡筒260_2之上),以調整鏡筒260_2與影像感測器220之間的距離。在鏡筒260_2滑動到最佳的位置之後,使用紫外光照射以硬化固定座230與鏡筒260_2之間的UV接著劑242,以固定住鏡筒260_2與固定座230。 In the seventh step, a modulation transfer function (MTF) test is performed to adjust the focal length of the lens barrel 260_2. In detail, when the focal length of the lens barrel 260_2 is adjusted, the lens barrel 260_2 is slid relative to the fixing base 230 (for example, the lens barrel 260_2 can be slid downward by pressing the lens barrel 260_2, and the pressure coil spring 250_2 at this time) A spring force is applied to the mount 230 and the lens barrel 260_2 to adjust the distance between the lens barrel 260_2 and the image sensor 220. After the lens barrel 260_2 is slid to the optimum position, ultraviolet light is irradiated to harden the UV adhesive 242 between the holder 230 and the lens barrel 260_2 to fix the lens barrel 260_2 and the holder 230.
在接下來的步驟中,其他的鏡筒被置放在固定座230的剩餘孔中,並使用上述第六、七的步驟中所描述的方式來調整這些鏡筒的焦距。 In the next step, the other lens barrels are placed in the remaining holes of the holder 230, and the focal lengths of the barrels are adjusted in the manner described in the sixth and seventh steps above.
如上所述,由於每一個鏡筒都是獨立地調整本身的焦距,因此, 當固定座230相對於印刷電路板210有傾斜現象發生時,藉由獨立地調整鏡筒260_1、260_2的位置,可以使得鏡筒260_1、260_2的焦點準確地落在影像感測器220之上。舉例來說,假設固定座230相對於印刷電路板210有傾斜現象發生,且固定座230的左側高於右側,則鏡筒260_1下壓的深度會大於鏡筒260_2下壓的深度,亦即壓力螺旋彈簧250_1的壓縮程度會大於壓力螺旋彈簧250_2的壓縮程度。如上所述,相較於第1圖所示的先前技術焦距調整方法,本發明之影像感測模組所感測到的影像會更清晰。 As described above, since each of the lens barrels independently adjusts its own focal length, When the tilting of the mount 230 with respect to the printed circuit board 210 occurs, the focus of the lens barrels 260_1, 260_2 can be accurately dropped on the image sensor 220 by independently adjusting the positions of the lens barrels 260_1, 260_2. For example, assuming that the mounting seat 230 has a tilting phenomenon with respect to the printed circuit board 210, and the left side of the fixing base 230 is higher than the right side, the depth of the lens barrel 260_1 is greater than the depth of the lens barrel 260_2, that is, the pressure. The degree of compression of the coil spring 250_1 is greater than the degree of compression of the pressure coil spring 250_2. As described above, the image sensed by the image sensing module of the present invention is clearer than the prior art focus adjustment method shown in FIG.
以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。 The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.
242‧‧‧UV接著劑 242‧‧‧UV adhesive
260_1、260_2‧‧‧鏡筒 260_1, 260_2‧‧ ‧ tube
Claims (11)
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| TW103131202A TWI530724B (en) | 2014-09-10 | 2014-09-10 | Image sensor module and method for adjusting focus of image sensor module |
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| TW103131202A TWI530724B (en) | 2014-09-10 | 2014-09-10 | Image sensor module and method for adjusting focus of image sensor module |
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| TW201610505A TW201610505A (en) | 2016-03-16 |
| TWI530724B true TWI530724B (en) | 2016-04-21 |
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