TWI529394B - Check the contact probe - Google Patents
Check the contact probe Download PDFInfo
- Publication number
- TWI529394B TWI529394B TW100140524A TW100140524A TWI529394B TW I529394 B TWI529394 B TW I529394B TW 100140524 A TW100140524 A TW 100140524A TW 100140524 A TW100140524 A TW 100140524A TW I529394 B TWI529394 B TW I529394B
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- TW
- Taiwan
- Prior art keywords
- contact
- inspection
- contact probe
- solder ball
- side conductive
- Prior art date
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- 239000000523 sample Substances 0.000 title claims description 45
- 238000007689 inspection Methods 0.000 claims description 40
- 229910000679 solder Inorganic materials 0.000 claims description 38
- 230000001154 acute effect Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Measuring Leads Or Probes (AREA)
Description
本發明係關於檢查用接觸，尤其關於能夠提升與檢查對象元件之端子之接觸性的檢查用接觸探針。The present invention relates to an inspection contact, and in particular to an inspection contact probe capable of improving contact with a terminal of an inspection target element.
近年來，半導體積體電路(以下，稱為IC)更加地大規模化，以外部連接端子而言，對於採用BGR(Ball Grid Array)之IC也有在底面具有1000個以上之焊球者。In recent years, semiconductor integrated circuits (hereinafter referred to as ICs) have been further increased in size, and for external connection terminals, there are also 1000 or more solder balls on the bottom surface for ICs using BGR (Ball Grid Array).
如此大規模之IC係在安裝於印刷基板之前進行功能試驗及預燒試驗，在該些試驗中，為了電性連接IC和IC測試機，使用檢查用插槽。The IC of such a large scale performs a function test and a burn-in test before being mounted on a printed circuit board. In these tests, an inspection socket is used to electrically connect the IC and the IC tester.
該檢查插槽具備IC之焊球之數量和總數量之接觸探針，發揮電性連接IC之焊球和IC測試機之端子的功能。The inspection slot has the number of solder balls of the IC and the total number of contact probes, and functions to electrically connect the solder balls of the IC and the terminals of the IC tester.
因此，要求接觸探針之前端部與IC之焊球確實接觸性，已提案有各種形狀之接觸探針(例如，參照專利文獻1及專利文獻2)。Therefore, it is required to contact the solder ball of the IC before the probe is in contact with the solder ball of the IC. Various types of contact probes have been proposed (for example, refer to Patent Document 1 and Patent Document 2).
即是，在專利文獻1揭示有在接觸探針之外緣上具有複數之頂部，稜線朝向接觸中心下降之冠狀之接觸部的接觸探針。That is, Patent Document 1 discloses a contact probe having a plurality of top portions on the outer edge of the contact probe and a ridge line facing the contact portion of the crown which is lowered toward the contact center.
再者，在專利文獻2，於接觸探針之外緣上具有複數之頂部，在從頂部延伸之稜線偏離接觸探針之中心的位置，具有以少於180度之角度交叉之冠狀接觸部的接觸探針。Further, in Patent Document 2, a plurality of top portions are provided on the outer edge of the contact probe, and a ridge line extending from the top portion is offset from the center of the contact probe, and has a crown contact portion intersecting at an angle of less than 180 degrees. Contact the probe.
[專利文獻1]日本特開2010-038612號公報([0019]、第2圖、第3圖)[Patent Document 1] Japanese Laid-Open Patent Publication No. 2010-038612 ([0019], Fig. 2, and Fig. 3)
[專利文獻2]日本特開2006-184055號公報([0029]、第3圖)[Patent Document 2] Japanese Laid-Open Patent Publication No. 2006-184055 ([0029], FIG. 3)
但是，揭示於上述專利文獻之接觸探針因係焊球和接觸探針線接觸之構成，故於焊球表面被氧化覆膜覆蓋之時，無法確保電性充分的接觸性，有可能於檢查產生阻礙。However, since the contact probe disclosed in the above patent document is formed by the contact of the solder ball and the contact probe wire, when the surface of the solder ball is covered with the oxide film, electrical contact is not ensured, and it is possible to check. Create obstacles.
也存在有將冠狀之頂部數量增至8個之接觸探針，但是當增加頂部數量，從加工技術之制約來看，不得不降低頂部之高度，故稜線所構成之角度成為平緩，於焊球表面存在氧化覆膜之時接觸性反而惡化。There are also contact probes that increase the number of tops of the crown to eight. However, when the number of tops is increased, the height of the top has to be lowered from the constraints of the processing technique, so that the angle formed by the ridge lines becomes gentle, and the solder balls are When the oxide film is present on the surface, the contact property is rather deteriorated.
再者，於將接觸探針之前端設為槍狀之時，有可能刺破氧化覆膜而直接與焊球接觸，接觸面積端變小不僅有在檢查時損傷焊球之情形，也必須嚴格地定位焊球和接觸探針。Furthermore, when the front end of the contact probe is formed into a gun shape, it is possible to pierce the oxide film and directly contact the solder ball, and the contact area end becomes small, which not only damages the solder ball during inspection but also must be strict. Position the solder balls and contact probes.
本發明係鑒於上述課題而研究出，其目的為提供即使焊球和接觸探針之定位具有誤差之時，亦可以與焊球確實接觸，並且可以確保某程度之接觸面積的檢查用接觸探針。The present invention has been made in view of the above problems, and an object thereof is to provide a contact probe for inspection which can be surely contacted with a solder ball even when the positioning of the solder ball and the contact probe is in error, and which can secure a certain contact area. .
與本發明有關之檢查用接觸探針具有在與檢查對象元件之端子接觸之接觸面的內側形成具有銳角之頂部的複數之錐體的構成。The inspection contact probe according to the present invention has a configuration in which a plurality of pyramids having an acute top portion are formed inside the contact surface in contact with the terminal of the inspection target member.
若藉由本構成，提供即使具有焊球和接觸探針之定位誤差時，亦可以確實與銲球接觸，並且可以確保某程度之接觸面積。According to this configuration, even if there is a positioning error of the solder ball and the contact probe, it is possible to surely contact the solder ball and to secure a certain contact area.
與本發明有關之檢查用接觸探針具有連結錐體之頂部的面構成凹面之構成。The inspection contact probe according to the present invention has a configuration in which a surface connecting the tops of the cones constitutes a concave surface.
若藉由本構成時，因頂部沿著焊球之曲面而接觸，故可以降低焊球之損傷。According to this configuration, since the top is in contact with the curved surface of the solder ball, the damage of the solder ball can be reduced.
與本發明有關之檢查用接觸探針具有錐體之數量為9以上之構成。The contact probe for inspection relating to the present invention has a configuration in which the number of the cones is 9 or more.
若藉由本構成時，則能夠增大頂部和銲球之接觸面積。According to this configuration, the contact area between the top portion and the solder ball can be increased.
與本發明有關之檢查用接觸探針具有錐體之頂角為60度以下之構成。The contact probe for inspection relating to the present invention has a configuration in which the apex angle of the cone is 60 degrees or less.
若藉由本構成時，即使於焊球表面形成有氧化覆膜之時，亦可以使檢查用接觸探針確實地接觸於焊球。According to this configuration, even when an oxide film is formed on the surface of the solder ball, the inspection contact probe can be surely brought into contact with the solder ball.
若藉由本發明，提供即使具有焊球和接觸探針之定位誤差時，亦可以確實與銲球接觸，並且可以確保某程度之接觸面積的檢查用接觸探針。According to the present invention, it is possible to provide a contact probe for inspection which can surely contact the solder ball even when there is a positioning error of the solder ball and the contact probe, and can secure a certain contact area.
第1圖為裝入與本發明有關之接觸探針的檢查用插槽1之部分剖面圖，接觸探針2被儲存於插槽本體10之中。Fig. 1 is a partial cross-sectional view showing an inspection slot 1 in which a contact probe according to the present invention is incorporated, and the contact probe 2 is stored in the socket body 10.
接觸探針2係由檢查元件側導電部3、印刷基板側導電部4、芯軸5及彈簧6所構成，芯軸5係滑動自如地與檢查元件側導電部3及印刷基板側導電部4接觸。彈簧6係被配置在檢查元件側導電部3及印刷基板側導電部4之凸緣間，捲繞芯軸5之周圍。The contact probe 2 is composed of the inspection element side conductive portion 3, the printed circuit board side conductive portion 4, the core shaft 5, and the spring 6, and the core shaft 5 is slidably attached to the inspection element side conductive portion 3 and the printed circuit board side conductive portion 4 contact. The spring 6 is disposed between the inspection element side conductive portion 3 and the flange of the printed circuit board side conductive portion 4, and is wound around the mandrel 5.
然後，檢查元件側導電部3與檢查對象之IC之焊球(無圖示)接觸，印刷基板側導電部4與印刷基板上之銲墊(無圖示)接觸。Then, the inspection element side conductive portion 3 is in contact with a solder ball (not shown) of the IC to be inspected, and the printed substrate side conductive portion 4 is in contact with a pad (not shown) on the printed substrate.
第2圖為與本發明有關之接觸探針之檢查元件側導電部3之上視圖(a)及A-A剖面圖(b)，第3圖為與本發明有關之接觸探針之檢查元件側導電部3之斜視圖。Fig. 2 is a top view (a) and a cross-sectional view (b) of the inspection element side conductive portion 3 of the contact probe relating to the present invention, and Fig. 3 is a view showing the side of the inspection element of the contact probe relating to the present invention. An oblique view of the section 3.
在上視圖(a)中，黑圓圈31～39係表示頂部，實線表示稜線，虛線表示谷線。In the top view (a), the black circles 31 to 39 indicate the top, the solid line indicates the ridge line, and the broken line indicates the valley line.
即是，與本發明有關之接觸探針之檢查元件側導電部與檢查元件之接觸面，形成頂角θ為銳角(少於90度)之複數個之錐體。That is, the contact surface of the inspection element side conductive portion and the inspection element of the contact probe according to the present invention forms a plurality of cones whose apex angle θ is an acute angle (less than 90 degrees).
由A-A剖面圖(b)可知，使與本發明有關之接觸探針之檢查元件側導電部3與IC接觸時，因複數之錐體之頂部與被檢查對象之IC之焊球20接觸，故即使以氧化覆膜覆蓋焊球20表面之時，頂部亦刺破氧化覆膜而能與導電體之焊錫接觸。As is clear from the AA cross-sectional view (b), when the inspection element side conductive portion 3 of the contact probe according to the present invention is brought into contact with the IC, since the top of the plurality of cones is in contact with the solder ball 20 of the IC to be inspected, Even when the surface of the solder ball 20 is covered with an oxide film, the top portion pierces the oxide film to be in contact with the solder of the conductor.
並且，因複數之頂部與焊球20接觸，故不僅與焊球20之接觸面積增大，即使焊球20和接觸探針之位置多少偏離，亦可以達成確實之接觸。Further, since the top of the plurality of contacts is in contact with the solder ball 20, not only the contact area with the solder ball 20 is increased, but also the actual contact can be achieved even if the positions of the solder ball 20 and the contact probe are somewhat deviated.
本發明雖然規定錐體之形狀、數量及頂部之角度，但是以形狀為四角錐體、錐體之數量為9個以上，頂部之角度為60度以下為佳。Although the shape, the number, and the angle of the top of the cone are specified in the present invention, the number of the pyramids and the number of the pyramids is nine or more, and the angle of the top is preferably 60 degrees or less.
如第2圖所示般，為了在檢查元件側導電部3之上面形成9個頂角為60度之四角錐體，如第2圖所示般，藉由頂角60度以下之圓錐體之切削具，沿著切削線V1～V4及H1～H4而切削檢查元件側導電部3之上面，依此進行製作。As shown in FIG. 2, in order to form nine quadrangular pyramids having an apex angle of 60 degrees on the inspection element side conductive portion 3, as shown in Fig. 2, a cone having a vertex angle of 60 degrees or less is used. The cutting tool is formed by cutting the upper surface of the inspection element side conductive portion 3 along the cutting lines V1 to V4 and H1 to H4.
第4圖為本發明之第2實施型態之接觸探針之檢查元件側導電部3之上視圖(c)及B-B剖面圖(d)。Fig. 4 is a cross-sectional view (c) and a cross-sectional view (d) of the inspection element side conductive portion 3 of the contact probe according to the second embodiment of the present invention.
在第2實施型態中，最初將接觸探針之檢查元件側導電部3之上面事先加工成接近於焊球20之曲率的曲率之凹面後，形成錐體。In the second embodiment, the upper surface of the inspection element side conductive portion 3 of the contact probe is first processed into a concave surface having a curvature close to the curvature of the solder ball 20, and then a cone is formed.
若藉由該實施型態時，如第4圖(d)所示般，因錐體之頂部沿著接近於焊球20之曲率的曲率之曲面而連接，故不僅與焊球20接觸之錐體頂部之數量增加，因複數之頂部均等與焊球20接觸，不會有少數之頂部較深地刺穿，故亦可以抑制基於檢查之的焊球損傷。According to this embodiment, as shown in FIG. 4(d), since the top of the cone is connected along a curved surface close to the curvature of the curvature of the solder ball 20, not only the cone in contact with the solder ball 20 is used. The number of tops of the body is increased, and since the top of the plural is uniformly contacted with the solder ball 20, a small number of tops are not pierced deep, so that the solder ball damage based on the inspection can be suppressed.
與本發明有關之檢查用接觸探針可用於具有BGA端子之IC的功能試驗、預燒試驗等，具有產業上之利用可行性。The contact probe for inspection relating to the present invention can be used for a functional test, a burn-in test, etc. of an IC having a BGA terminal, and has industrial feasibility.
1．．．檢查用插槽1. . . Check slot
2．．．接觸探針2. . . Contact probe
3．．．檢查元件側導電部3. . . Check the component side conductive part
4．．．印刷基板側導電部4. . . Printed substrate side conductive portion
5．．．芯軸5. . . Mandrel
6．．．彈簧6. . . spring
10‧‧‧插槽本體 10‧‧‧Slot body
20‧‧‧焊球 20‧‧‧ solder balls
第1圖為裝入本發明之第1實施型態之接觸探針的檢查用插槽之部分剖面圖。Fig. 1 is a partial cross-sectional view showing a socket for inspection in which a contact probe according to a first embodiment of the present invention is incorporated.
第2圖為本發明之第1實施型態之接觸探針之檢查元件側導電部之上視圖(a)及A-A剖面圖(b)。Fig. 2 is a top view (a) and an A-A sectional view (b) of the inspection element side conductive portion of the contact probe according to the first embodiment of the present invention.
第3圖為本發明之第1實施型態之接觸探針之檢查元件側導電部的斜視圖，Fig. 3 is a perspective view showing the conductive portion on the inspection element side of the contact probe according to the first embodiment of the present invention.
第4圖為本發明之第2實施型態之接觸探針之檢查元件側導電部之上視圖(a)及B-B剖面圖(b)。Fig. 4 is a top view (a) and a cross-sectional view (b) of the inspection element side conductive portion of the contact probe according to the second embodiment of the present invention.
3．．．檢查元件側導電部3. . . Check the component side conductive part
31～39．．．頂部31~39. . . top
Claims (3)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010283342A JP5783715B2 (en) | 2010-12-20 | 2010-12-20 | Contact probe for inspection |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201237422A TW201237422A (en) | 2012-09-16 |
| TWI529394B true TWI529394B (en) | 2016-04-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100140524A TWI529394B (en) | 2010-12-20 | 2011-11-07 | Check the contact probe |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5783715B2 (en) |
| TW (1) | TWI529394B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101439342B1 (en) | 2013-04-18 | 2014-09-16 | 주식회사 아이에스시 | Probe member for pogo pin |
| KR101439343B1 (en) * | 2013-04-18 | 2014-09-16 | 주식회사 아이에스시 | Probe member for pogo pin |
| KR101524471B1 (en) * | 2013-12-12 | 2015-06-10 | 주식회사 아이에스시 | Fixing Method of Probe Member Within Plunger and Pogo Pin Made Thereby |
| JP6084592B2 (en) * | 2014-08-05 | 2017-02-22 | 株式会社アイエスシーＩｓｃ Ｃｏ．， Ｌｔｄ． | Probe member for pogo pins |
| JP6243584B1 (en) | 2016-02-15 | 2017-12-06 | 日本発條株式会社 | Conductive contact for inspection and semiconductor inspection apparatus |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH0323576Y2 (en) * | 1986-02-27 | 1991-05-22 | ||
| US5929521A (en) * | 1997-03-26 | 1999-07-27 | Micron Technology, Inc. | Projected contact structure for bumped semiconductor device and resulting articles and assemblies |
| JP2000329789A (en) * | 1999-03-12 | 2000-11-30 | Sony Chem Corp | Needle-shaped contact probe |
| JP4480258B2 (en) * | 2000-03-29 | 2010-06-16 | 株式会社日本マイクロニクス | Electrical contact device in semiconductor device inspection equipment |
| JP2007218675A (en) * | 2006-02-15 | 2007-08-30 | Fujitsu Ltd | Probe and probe manufacturing method |
| JP2009198238A (en) * | 2008-02-20 | 2009-09-03 | Totoku Electric Co Ltd | Probe needle and method of manufacturing the same |
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| Publication number | Publication date |
|---|---|
| TW201237422A (en) | 2012-09-16 |
| JP2012132717A (en) | 2012-07-12 |
| JP5783715B2 (en) | 2015-09-24 |
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