TWI526865B - Gui device for direct drawing device, direct drawing system, method for setting drawing area and recording medium - Google Patents
Gui device for direct drawing device, direct drawing system, method for setting drawing area and recording medium Download PDFInfo
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Description
本發明係關於一種用於直接描繪裝置之圖形使用者介面(Graphical User Interface)裝置(GUI裝置),該直接描繪裝置於形成有光阻膜之基板上描繪配線圖案等。 The present invention relates to a graphical user interface device (GUI device) for directly drawing a device, which draws a wiring pattern or the like on a substrate on which a photoresist film is formed.
自先前,藉由對半導體基板、印刷配線基板、玻璃基板等各種基板,照射經由光罩後之光,而進行圖案之形成。近年來,為了應對各種圖案之形成,利用有如下技術:不使用光罩,直接對基板照射經空間調變之光來描繪圖案而進行曝光處理。 Conventionally, various patterns such as a semiconductor substrate, a printed wiring board, and a glass substrate are irradiated with light passing through the mask to form a pattern. In recent years, in order to cope with the formation of various patterns, there is a technique of performing exposure processing by directly irradiating a substrate with spatially modulated light without using a photomask to draw a pattern.
如上述般進行曝光處理之曝光裝置被稱為直接描繪裝置,例如於專利文獻1中,記載有用於直接描繪裝置之圖形使用者介面裝置(例如,專利文獻1中之段落0054及圖3)。該圖形使用者介面裝置係於以遍及圓形狀之基板上之大致整個表面設定的複數個區塊單位,來設定描繪參數等曝光條件時等使用。該區塊為矩形狀,且於基板上在列方向及行方向排列。換言之,複數個區塊於基板上呈矩陣狀配置。 The exposure apparatus that performs the exposure processing as described above is called a direct drawing device. For example, Patent Document 1 describes a graphic user interface device for directly drawing a device (for example, paragraph 0054 and FIG. 3 in Patent Document 1). The graphic user interface device is used when a plurality of block units are set over substantially the entire surface of a circularly shaped substrate to set exposure conditions such as drawing parameters. The block has a rectangular shape and is arranged on the substrate in the column direction and the row direction. In other words, a plurality of blocks are arranged in a matrix on the substrate.
又,於基板之端部對應形成鍍敷用電極之圓弧帶狀區域進行曝光處理的技術例如記載於專利文獻2中(例如,專利文獻2中之段落 0029及圖17)。除了鍍敷用電極以外,於基板之端部還設定有已藉由雷射刻印等形成序列號等之圓弧帶狀之編號區域,曝光處理時亦需要考慮該圓弧帶狀區域。 In addition, a technique for performing exposure processing on an end portion of the substrate corresponding to the arc-shaped strip-shaped region in which the plating electrode is formed is described in Patent Document 2 (for example, the paragraph in Patent Document 2) 0029 and Figure 17). In addition to the electrode for plating, a numbered region in which an arc-shaped strip having a serial number or the like is formed by laser marking or the like is provided at the end portion of the substrate, and the arc-shaped strip-shaped region is also required to be considered in the exposure processing.
[專利文獻1]日本專利特開2013-77718號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2013-77718
[專利文獻2]日本專利特開2005-5462號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2005-5462
圖17表示於圓形狀之基板W之端部沿周緣應形成8個鍍敷用電極之圓弧帶狀區域E1至E8。於藉由直接描繪裝置對該等圓弧帶狀區域E1至E8進行描繪處理之情形時,需要在圖形使用者介面裝置中將圓弧帶狀區域E1至E8之位置設定為描繪區域或非描繪區域。 Fig. 17 shows arc-shaped strip-shaped regions E1 to E8 in which eight plating electrodes are to be formed along the peripheral edge at the end portion of the circular-shaped substrate W. When the arcuate strip regions E1 to E8 are subjected to rendering processing by the direct drawing device, it is necessary to set the positions of the arcuate strip regions E1 to E8 to the drawing region or non-deline in the graphic user interface device. region.
例如,於藉由圖形使用者介面裝置指定1個圓弧帶狀區域E1之情形時,考慮指定處於圓弧帶狀區域E1之4角之位置P1、位置P2、位置P3及位置P4之各者之二維座標值(x1,y1)、(x2,y2)、(x3,y3)及(x4,y4)的方法。於該方法中,由於各座標值具有2個資訊,故而需要向圖形使用者介面裝置輸入合計8個資訊,產生設定作業量增大之類之問題。 For example, when designing one arc-shaped strip-shaped region E1 by the graphic user interface device, it is considered to designate each of the position P1, the position P2, the position P3, and the position P4 at the four corners of the arc-shaped strip-shaped region E1. The method of two-dimensional coordinate values (x1, y1), (x2, y2), (x3, y3), and (x4, y4). In this method, since each coordinate value has two pieces of information, it is necessary to input a total of eight pieces of information to the graphic user interface device, thereby causing a problem that the setting operation amount is increased.
又,於如上述般由操作者使用圖形使用者介面裝置輸入圓弧帶狀區域之4角之座標值時,亦產生難以直觀地理解圓弧帶狀區域之相對於圓形狀之基板之位置或範圍之類的其他問題。例如,若基板為矩形狀,便容易直觀地根據二維座標值設定帶狀區域,但若基板為圓形狀,則並不容易直觀地根據二維座標把握圓弧帶狀區域。 Moreover, when the coordinate value of the four corners of the arc strip region is input by the operator using the graphic user interface device as described above, it is difficult to intuitively understand the position of the circular strip-shaped region relative to the circular shaped substrate or Other issues like scope. For example, if the substrate has a rectangular shape, it is easy to intuitively set the strip-shaped region based on the two-dimensional coordinate value. However, if the substrate has a circular shape, it is not easy to intuitively grasp the arc-shaped strip region based on the two-dimensional coordinates.
鑒於如上所述之情況,本發明之目的在於提供一種直接描繪裝置用之圖形使用者介面裝置、直接描繪系統、描繪區域設定方法及記 錄媒體,能以較少之作業量且直觀地設定圓形狀之基板上之圓弧帶狀區域作為直接描繪裝置之描繪區域或非描繪區域。 In view of the above circumstances, an object of the present invention is to provide a graphic user interface device for direct drawing device, a direct drawing system, a drawing region setting method, and a recording The recording medium can intuitively set the arcuate strip-shaped area on the circular substrate as a drawing area or a non-drawing area of the direct drawing device with a small amount of work.
第1發明係一種圖形使用者介面裝置,其特徵在於,其係於對形成於圓形狀之基板之表面之光阻膜描繪圖案的直接描繪裝置中使用,用來設定基板內之圓弧帶狀區域作為描繪區域或非描繪區域,該圖形使用者介面裝置具備:顯示部,其具有畫面;操作部,其操作上述顯示部之上述畫面;及顯示控制部,其控制上述顯示部之畫面顯示;且上述顯示控制部具有:周資訊輸入部,其於上述顯示部之上述畫面上,顯示用於輸入與圓弧帶狀區域之圓周方向之長度相關之資訊的輸入區域;徑資訊輸入部,其於上述顯示部之上述畫面上,顯示用於輸入基板之徑向上之圓弧帶狀區域之位置資訊的輸入區域;寬度資訊輸入部,其於上述顯示部之上述畫面上,顯示用於輸入圓弧帶狀區域之徑向上之寬度資訊的輸入區域;描繪指示輸入部,其於上述顯示部之上述畫面上,顯示用於輸入藉由上述徑資訊輸入部、上述周資訊輸入部及上述寬度資訊輸入部所設定之圓弧帶狀區域為描繪區域或非描繪區域之任一者的輸入區域;以及確認顯示部,其於顯示部之畫面上,顯示基板外形、及上述圓弧帶狀區域,上述圓弧帶狀區域係基於藉由操作部分別輸入至上述徑資訊輸入部、上述周資訊輸入部、上述寬度資訊輸入部及上述描繪指示輸入部的資訊而得者。 A first aspect of the invention is a graphic user interface device for use in a direct drawing device for patterning a photoresist film formed on a surface of a circular substrate for setting an arc band in a substrate. The graphic user interface device includes: a display unit having a screen; an operation unit that operates the screen of the display unit; and a display control unit that controls display of the screen of the display unit; Further, the display control unit includes a week information input unit that displays an input area for inputting information on a length of a circular arc-shaped region in a circumferential direction on the screen of the display unit, and a diameter information input unit. An input area for inputting positional information of an arcuate strip-shaped region in a radial direction of the substrate is displayed on the screen of the display unit; and a width information input unit is displayed on the screen of the display unit for inputting a circle An input area of the width information in the radial direction of the arc strip region; a drawing instruction input unit displayed on the screen of the display unit An input area for inputting an arcuate strip-shaped area set by the radial information input unit, the weekly information input unit, and the width information input unit as either a drawing area or a non-drawing area; and a confirmation display unit And displaying the outer shape of the substrate and the arc-shaped strip-shaped region on the screen of the display unit, wherein the arc-shaped strip-shaped region is input to the radial information input unit, the weekly information input unit, and the width by the operation unit. The information input unit and the above-mentioned information indicating the input unit are drawn.
第2發明係如第1發明,其中上述顯示控制部將上述周資訊輸入部、上述徑資訊輸入部、上述寬度資訊輸入部及上述描繪指示輸入部作為一個組合,並以該組合於顯示部之畫面上顯示用於在周向依序輸入各資訊之輸入區域。 According to a second aspect of the invention, the display control unit combines the weekly information input unit, the radial information input unit, the width information input unit, and the drawing instruction input unit, and combines the display information with the display unit. An input area for inputting each piece of information in the circumferential direction is displayed on the screen.
第3發明係如第1發明,其中上述周資訊輸入部於上述顯示部之上述畫面上,顯示用於輸入角度之數值作為與圓弧帶狀區域之圓周方 向之長度相關之資訊的輸入區域、或用於輸入圓弧之長度尺寸作為與圓弧帶狀區域之圓周方向之長度相關之資訊的輸入區域。 According to a third aspect of the invention, the week information input unit displays, on the screen of the display unit, a numerical value for inputting an angle as a circumference of an arc band region. An input area for information relating to the length, or an input area for inputting the length dimension of the arc as information relating to the length of the circular arc-shaped region in the circumferential direction.
第4發明係如第1發明,其中上述寬度資訊輸入部於上述顯示部之上述畫面上,顯示用於向徑向上之複數個範圍分別輸入寬度資訊之複數個輸入區域。 According to a fourth aspect of the invention, the width information input unit displays a plurality of input areas for inputting width information to a plurality of ranges in the radial direction on the screen of the display unit.
第5發明係一種直接描繪系統,其具備:如第1發明至第4發明中任一項之圖形使用者介面裝置;及直接描繪裝置,其對上述光阻膜掃描經空間調變之光束而描繪圖案。 A fifth aspect of the invention provides a direct drawing system comprising: the graphic user interface device according to any one of the first invention to the fourth invention; and a direct drawing device that scans the photoresist film with a spatially modulated light beam Draw a pattern.
第6發明係一種描繪區域設定方法,其係藉由具有顯示部及操作部之圖形使用者介面裝置,設定作為直接描繪裝置應描繪之描繪區域、或不描繪之非描繪區域的圓弧帶狀區域者,該描繪區域設定方法包含:輸入畫面顯示步驟,其係於上述顯示部之畫面上,顯示用於輸入與圓弧帶狀區域之圓周方向之長度相關之資訊之輸入區域、用於輸入基板之徑向上之位置資訊之輸入區域、用於輸入圓弧帶狀區域之徑向上之寬度資訊之輸入區域、及用於輸入圓弧帶狀區域為描繪區域或非描繪區域之任一者之資訊的輸入區域;資訊輸入步驟,其係藉由上述操作部向藉由上述輸入畫面顯示步驟而顯示於上述顯示部之上述畫面上的各輸入區域分別輸入各資訊;以及確認顯示步驟,其係於上述顯示部之上述畫面上,顯示基板外形、及基於藉由上述資訊輸入步驟所輸入之各資訊的圓弧帶狀區域。 According to a sixth aspect of the invention, there is provided a drawing area setting method of setting a drawing area to be drawn as a direct drawing device or a non-drawing area not to be drawn by a graphic user interface device having a display unit and an operation unit; In the area, the drawing area setting method includes an input screen display step of displaying an input area for inputting information related to the length of the circular arc-shaped area in the circumferential direction on the screen of the display unit, for inputting An input region of position information in a radial direction of the substrate, an input region for inputting width information in a radial direction of the arc strip region, and an input circular arc region as either a drawing region or a non-drawing region Information input area; the information input step is performed by the operation unit respectively inputting each piece of information to each input area displayed on the screen of the display unit by the input screen display step; and confirming the display step Displaying the shape of the substrate and the information input based on the information input step on the screen of the display unit Circular arc band.
第7發明係如第6發明,其中藉由上述輸入畫面顯示步驟而顯示之各輸入區域之組合係於周向顯示複數個,且上述資訊輸入步驟係針對各輸入區域之組合之每一個而於周向依序輸入各資訊的步驟。 According to a seventh aspect of the invention, the combination of the input areas displayed by the input screen display step is displayed in a plurality of circumferential directions, and the information input step is performed for each of the combinations of the input areas. The step of entering the information in order.
第8發明係一種記錄媒體,其特徵在於,其記錄圖形使用者介面裝置所具備之電腦可讀取之程式,該圖形使用者介面裝置係於對形成於圓形狀之基板之表面之光阻膜描繪圖案的直接描繪裝置中使用,用 來設定基板內之圓弧帶狀區域作為描繪區域或非描繪區域,該記錄媒體記錄之程式使電腦於上述圖形使用者介面裝置具有之顯示部之畫面上發揮以下功能:周資訊輸入區域之顯示功能,其係顯示用於輸入與圓弧帶狀區域之圓周方向之長度相關之資訊的輸入區域;徑資訊輸入區域之顯示功能,其係顯示用於輸入基板之徑向上之圓弧帶狀區域之位置資訊之輸入區域;寬度資訊輸入區域之顯示功能,其係顯示用於輸入圓弧帶狀區域之徑向上之寬度資訊之輸入區域;描繪指示輸入區域之顯示功能,其係顯示用於輸入由上述徑資訊輸入部、上述周資訊輸入部及上述寬度資訊輸入部所設定之圓弧帶狀區域為描繪區域或非描繪區域之任一者之資訊的輸入區域;以及確認顯示功能,其係顯示基板外形、及上述圓弧帶狀區域,上述圓弧帶狀區域係基於藉由上述圖形使用者介面裝置具有之操作部分別輸入至上述徑資訊輸入區域、上述周資訊輸入區域、上述寬度資訊輸入區域及上述描繪指示輸入區域的資訊而得者。 An eighth aspect of the invention is a recording medium characterized by recording a computer readable program provided in a graphic user interface device, the graphic user interface device being attached to a photoresist film formed on a surface of a circular substrate Used in the direct drawing device for drawing patterns, The circular strip-shaped area in the substrate is set as a drawing area or a non-drawing area, and the recording medium recording program causes the computer to perform the following functions on the screen of the display unit of the graphic user interface device: display of the weekly information input area Function, which is an input area for inputting information related to the length of the circular arc-shaped region in the circumferential direction; a display function of the radial information input region, which is a circular strip-shaped region for inputting the radial direction of the substrate The input area of the position information; the display function of the width information input area, which displays an input area for inputting the radial width information of the arc strip region; the display function indicating the input area is displayed for input An arc-shaped region set by the radial information input unit, the weekly information input unit, and the width information input unit is an input region for information of any one of a drawing region and a non-drawing region; and a confirmation display function Displaying an outer shape of the substrate and the arc-shaped strip-shaped region, wherein the arc-shaped strip region is based on the graphic Interface by means of the operating portion having a diameter above are input to the input region information, information obtained by the information input by the peripheral region of the input region and the width of the rendering information indicative of the input region.
第9發明係如第8發明,其使電腦發揮以下功能:於上述顯示部之上述畫面上,將上述徑資訊輸入區域、上述周資訊輸入區域、上述寬度資訊輸入區域及上述描繪指示輸入區域作為一個組合,並以該組合顯示用於在周向依序輸入各資訊之輸入區域。 According to a ninth aspect of the invention, the computer has the function of: the track information input area, the week information input area, the width information input area, and the drawing instruction input area on the screen of the display unit; A combination, and in this combination, an input area for sequentially inputting information in the circumferential direction is displayed.
第10發明係如第8發明,其使電腦發揮以下功能:於上述顯示部之上述畫面上,顯示用於輸入角度之數值作為與上述圓弧帶狀區域之圓周方向之長度相關之資訊的輸入區域、或用於輸入圓弧之長度尺寸作為與上述圓弧帶狀區域之圓周方向之長度相關之資訊的輸入區域。 According to a tenth aspect of the invention, in the eighth aspect of the invention, the computer is configured to display, on the screen of the display unit, an input value for inputting an angle as information relating to a length of a circumferential direction of the arcuate strip-shaped region. The area, or the input area for inputting the length dimension of the arc as the information relating to the length of the circular arc-shaped area in the circumferential direction.
第11發明係如第8發明,其使電腦發揮以下功能:於上述顯示部之上述畫面上,顯示用於向徑向上之複數個範圍分別輸入寬度資訊之複數個輸入區域。 According to an eleventh aspect of the invention, the computer has a function of displaying a plurality of input areas for inputting width information to a plurality of ranges in the radial direction on the screen of the display unit.
根據第1發明至第11發明之任一者,可提供一種直接描繪裝置用之圖形使用者介面裝置、直接描繪系統、描繪區域設定方法及記錄媒體,能以較少之作業量且直觀地設定圓形狀之基板上之圓弧帶狀區域作為直接描繪裝置之描繪區域或非描繪區域。 According to any one of the first invention to the eleventh aspect of the present invention, a graphic user interface device, a direct drawing system, a drawing area setting method, and a recording medium for a direct drawing device can be provided, and can be intuitively set with a small amount of work The arc-shaped strip-shaped area on the circular-shaped substrate serves as a drawing area or a non-drawing area of the direct drawing device.
1‧‧‧設計資料作成裝置 1‧‧‧Design data creation device
2‧‧‧圖形使用者介面裝置 2‧‧‧Graphic user interface device
3‧‧‧圖像處理裝置 3‧‧‧Image processing device
4‧‧‧直接描繪系統 4‧‧‧Direct drawing system
5‧‧‧電腦 5‧‧‧ computer
7‧‧‧畫面 7‧‧‧ screen
10‧‧‧載置台 10‧‧‧ mounting table
10a‧‧‧第1部位 10a‧‧‧Part 1
10b‧‧‧第2部位 10b‧‧‧Part 2
20‧‧‧載置台移動機構 20‧‧‧Moving station moving mechanism
21‧‧‧旋轉機構 21‧‧‧Rotating mechanism
22‧‧‧支持板 22‧‧‧Support board
23‧‧‧副掃描機構 23‧‧‧Sub Scanning Mechanism
23a‧‧‧線性馬達 23a‧‧‧Linear motor
23b‧‧‧一對導軌 23b‧‧‧A pair of rails
24‧‧‧底板 24‧‧‧floor
25‧‧‧主掃描機構 25‧‧‧Main scanning mechanism
25a‧‧‧線性馬達 25a‧‧‧linear motor
25b‧‧‧一對導軌 25b‧‧‧A pair of rails
30‧‧‧位置參數測量機構 30‧‧‧Location parameter measuring mechanism
31‧‧‧雷射光出射部 31‧‧‧Laser light exit
32‧‧‧分光器 32‧‧‧Distributor
33‧‧‧彎光器 33‧‧‧Curve bender
34‧‧‧第1干渉計 34‧‧‧1st cognac
35‧‧‧第2干渉計 35‧‧‧2nd cognac
50‧‧‧光學頭部 50‧‧‧ Optical head
53‧‧‧照明光學系統 53‧‧‧Lighting optical system
54‧‧‧雷射振盪器 54‧‧‧Laser oscillator
55‧‧‧雷射驅動部 55‧‧‧Laser drive
60‧‧‧對準相機 60‧‧‧Aligning the camera
70‧‧‧控制部 70‧‧‧Control Department
71‧‧‧電腦 71‧‧‧ computer
72‧‧‧記憶體 72‧‧‧ memory
73‧‧‧光柵化部 73‧‧‧Rasterization Department
75‧‧‧資料產生部 75‧‧‧Data Generation Department
76‧‧‧描繪圖案資料 76‧‧‧Drawing pattern information
77‧‧‧光柵資料 77‧‧‧Grating data
80‧‧‧確認顯示區域 80‧‧‧Confirm display area
90‧‧‧輸入區域 90‧‧‧Input area
91‧‧‧「No.」欄 91‧‧‧"No." column
92‧‧‧「θ」欄 92‧‧‧"θ" column
93‧‧‧「R0」欄 93‧‧‧"R0" column
94‧‧‧「內」欄 94‧‧‧"Inside" column
95‧‧‧「外」欄 95‧‧‧"Outside" column
96‧‧‧「曝光」欄 96‧‧‧"Exposure" column
97‧‧‧單選按鈕 97‧‧‧ radio button
98‧‧‧單選按鈕 98‧‧‧ radio button
99‧‧‧「弧長」欄 99‧‧‧"Arc length" column
100‧‧‧直接描繪裝置 100‧‧‧Direct drawing device
101‧‧‧本體框架 101‧‧‧ ontology framework
102‧‧‧外罩 102‧‧‧ Cover
110‧‧‧基板收納匣 110‧‧‧Substrate storage area
120‧‧‧搬送機器人 120‧‧‧Transfer robot
130‧‧‧基台 130‧‧‧Abutment
140‧‧‧頭支持部 140‧‧‧ head support
141‧‧‧腳構件 141‧‧‧foot members
142‧‧‧腳構件 142‧‧‧ foot members
143‧‧‧樑構件 143‧‧ ‧ beam components
144‧‧‧樑構件 144‧‧‧ beam members
172‧‧‧盒體 172‧‧‧ box
200‧‧‧顯示部 200‧‧‧Display Department
230‧‧‧CPU 230‧‧‧CPU
231‧‧‧ROM 231‧‧‧ROM
232‧‧‧記憶體 232‧‧‧ memory
233‧‧‧媒體驅動器 233‧‧‧Media Drive
234‧‧‧操作部 234‧‧‧Operation Department
235‧‧‧匯流排線 235‧‧‧ bus line
240‧‧‧顯示控制部 240‧‧‧Display Control Department
241‧‧‧周資訊輸入部 241‧‧Week Information Input Department
242‧‧‧徑資訊輸入部 242‧‧‧Path Information Input Department
243‧‧‧寬度資訊輸入部 243‧‧‧Width Information Input Department
244‧‧‧描繪指示輸入部 244‧‧‧Drawing instruction input section
245‧‧‧確認顯示部 245‧‧‧Confirmation display
400‧‧‧圖形描繪系統 400‧‧‧Graphic drawing system
511‧‧‧空間光調變器 511‧‧‧Space light modulator
512‧‧‧光調變單元 512‧‧‧Light modulation unit
513‧‧‧描繪信號處理部 513‧‧‧Drawing Signal Processing Department
514‧‧‧曝光控制部 514‧‧‧Exposure Control Department
515‧‧‧描繪控制部 515‧‧‧Drawing Control Department
516‧‧‧反射鏡 516‧‧‧Mirror
517‧‧‧投影光學系統 517‧‧‧Projection optical system
518、519、520、522‧‧‧透鏡 518, 519, 520, 522‧‧ lens
521‧‧‧遮蔽板 521‧‧‧shading board
524‧‧‧聚焦透鏡 524‧‧‧focus lens
530a‧‧‧可動帶 530a‧‧‧ movable belt
531b‧‧‧固定帶 531b‧‧‧Fixed tape
535‧‧‧粗線 535‧‧‧ thick line
536‧‧‧驅動器電路單元 536‧‧‧Drive circuit unit
540‧‧‧遠鏡 540‧‧‧ far mirror
541‧‧‧聚光透鏡 541‧‧‧ Concentrating lens
542‧‧‧消光器 542‧‧‧Duffer
543‧‧‧聚焦透鏡 543‧‧ ‧focus lens
Ct‧‧‧基板之中心 Center of Ct‧‧‧ substrate
D0‧‧‧設計資料 D0‧‧‧Design materials
D1‧‧‧修正設計資料 D1‧‧‧ Revised design information
E1~E8‧‧‧圓弧帶狀區域 E1~E8‧‧‧ arc band
E1a‧‧‧第1圓弧帶狀區域 E1a‧‧‧1st arc band
k1‧‧‧非描繪區域 K1‧‧‧non-depiction area
L3‧‧‧假想圓 L3‧‧‧ imaginary circle
M‧‧‧記錄媒體 M‧‧ Record Media
N‧‧‧網路 N‧‧‧Network
P‧‧‧程式 P‧‧‧ program
R0‧‧‧假想線 R0‧‧‧ imaginary line
R1‧‧‧假想線 R1‧‧‧ imaginary line
R2‧‧‧假想線 R2‧‧‧ imaginary line
R3‧‧‧假想線 R3‧‧‧ imaginary line
S1~S5、S10~S40‧‧‧步驟 S1~S5, S10~S40‧‧‧ steps
t1‧‧‧寬度尺寸 Width of t1‧‧‧
T1‧‧‧圓弧區域用資料 T1‧‧‧Arc area data
W‧‧‧基板 W‧‧‧Substrate
WO‧‧‧外形線 WO‧‧‧ outline
圖1係表示包含曝光系統之描繪系統之圖。 Figure 1 is a diagram showing a rendering system including an exposure system.
圖2係表示圖形使用者介面裝置之硬體構成之方塊圖。 Figure 2 is a block diagram showing the hardware configuration of the graphical user interface device.
圖3係表示圖形使用者介面裝置之功能構成之方塊圖。 Figure 3 is a block diagram showing the functional configuration of the graphical user interface device.
圖4係表示描繪區域設定之流程之流程圖。 Fig. 4 is a flow chart showing the flow of drawing area setting.
圖5係表示初始輸入畫面之圖。 Fig. 5 is a view showing an initial input screen.
圖6(a)、(b)係用於說明第1實施例中之資訊輸入動作之圖。 6(a) and 6(b) are diagrams for explaining the information input operation in the first embodiment.
圖7係表示輸入後之畫面之圖。 Fig. 7 is a view showing a screen after input.
圖8(a)、(b)係用於說明第2實施例中之資訊輸入動作之圖。 8(a) and 8(b) are diagrams for explaining the information input operation in the second embodiment.
圖9(a)、(b)係用於說明第3實施例中之資訊輸入動作之圖。 9(a) and 9(b) are diagrams for explaining the information input operation in the third embodiment.
圖10係直接描繪裝置之側視圖。 Figure 10 is a side elevational view of the device directly depicted.
圖11係直接描繪裝置之俯視圖。 Figure 11 is a top plan view of the device directly depicted.
圖12係表示照明光學系統及投影光學系統之圖。 Fig. 12 is a view showing an illumination optical system and a projection optical system.
圖13係將空間光調變器放大而表示之圖。 Fig. 13 is a view showing an enlarged view of a spatial light modulator.
圖14係表示直接描繪裝置之各部與控制部之連接構成之方塊圖。 Fig. 14 is a block diagram showing the connection structure between each unit of the direct drawing device and the control unit.
圖15係表示控制描繪動作之控制部之方塊圖。 Fig. 15 is a block diagram showing a control unit for controlling the drawing operation.
圖16係直接描繪裝置之動作之流程圖。 Figure 16 is a flow chart for directly depicting the actions of the device.
圖17係用於說明背景技術之圖。 Figure 17 is a diagram for explaining the background art.
以下,參照隨附圖式,對本發明之實施形態進行說明。 Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
圖1係表示包含作為本發明之一實施形態之直接描繪系統4之圖形描繪系統400的圖。該圖形描繪系統400係如下系統:選擇性地對例如圓形狀之半導體基板(以下僅稱為「基板」)上之光阻膜進行曝光,藉此直接對光阻膜描繪相當於電路圖案的圖形。 Fig. 1 is a view showing a graphic drawing system 400 including a direct drawing system 4 as an embodiment of the present invention. The pattern drawing system 400 is a system for selectively exposing a photoresist film on a circular semiconductor substrate (hereinafter simply referred to as "substrate"), thereby directly drawing a pattern corresponding to a circuit pattern on the photoresist film. .
圖形描繪系統400具備經由LAN等網路N而相互連接之設計資料作成裝置1、圖像處理裝置3及直接描繪裝置100。圖像處理裝置3具備圖形使用者介面裝置2。 The graphic drawing system 400 includes a design data creating device 1, an image processing device 3, and a direct drawing device 100 that are connected to each other via a network N such as a LAN. The image processing device 3 includes a graphic user interface device 2.
設計資料作成裝置1係進行資料之作成及編輯之裝置,該資料描述應對作為描繪對象物之基板描繪之圖案區域。具體而言,資料係藉由CAD而以向量形式描述之圖形資料而作成。以下,將該資料稱為設計資料D0。由設計資料作成裝置1作成之設計資料D0經由網路N而分別被發送至圖像處理裝置3及直接描繪裝置100。再者,設計資料D0係用於在後述之圓弧帶狀區域E1至E8以外之基板W之表面形成半導體晶片之配線圖案等的資料。 The design data creation device 1 is a device for creating and editing data, and the data describes a pattern region to be drawn on a substrate as a drawing object. Specifically, the data is created by graphically describing the graphic data in the form of a vector. Hereinafter, this material is referred to as design data D0. The design data D0 created by the design data creation device 1 is transmitted to the image processing device 3 and the direct drawing device 100 via the network N, respectively. In addition, the design data D0 is used to form a wiring pattern or the like of a semiconductor wafer on the surface of the substrate W other than the arc-shaped strip-shaped regions E1 to E8 to be described later.
圖像處理裝置3對經由網路N發送之設計資料D0進行修正,作成修正設計資料D1。由圖像處理裝置3作成之修正設計資料D1經由網路N而被發送至直接描繪裝置100。 The image processing device 3 corrects the design data D0 transmitted via the network N to create the corrected design data D1. The corrected design data D1 created by the image processing apparatus 3 is transmitted to the direct drawing apparatus 100 via the network N.
具體而言,圖像處理裝置3具有以下功能:根據曝光條件(描繪條件)之變更,對設計資料D0執行增大應曝光(描繪)之電路圖案之線寬尺寸之處理(變粗處理)、或減小線寬尺寸之處理(變細處理),而獲得修正設計資料D1。該變粗處理及變細處理係以區劃基板內之複數個區塊單位而執行。 Specifically, the image processing device 3 has a function of performing a process of increasing the line width size of the circuit pattern to be exposed (drawn) (thickening processing) on the design material D0 in accordance with the change of the exposure condition (drawing condition), Or the processing of reducing the line width size (thinning processing), and obtaining the corrected design data D1. The thickening and thinning processing is performed by dividing a plurality of block units in the substrate.
又,圖像處理裝置3對設計資料D0中之各區塊之曝光條件進行修正。例如,具有以下功能:於設計資料D0為對所有區塊以標準圖案曝光之資料的情形時,修正為對特定之區塊以測試圖案曝光之資料而 獲得修正設計資料D1。此處,「標準圖案」係用於以形成半導體元件之電路圖案曝光之圖案,與「標準圖案」不同,「測試圖案」係用於以例如半導體元件之試做用或製造製程之驗證用之電路圖案曝光的圖案。 Further, the image processing device 3 corrects the exposure conditions of the respective blocks in the design data D0. For example, it has the following function: when the design data D0 is a material that is exposed to a standard pattern for all the blocks, it is corrected to the data of the specific block to be exposed by the test pattern. Obtained revised design data D1. Here, the "standard pattern" is used to form a pattern for forming a circuit pattern of a semiconductor element, and unlike the "standard pattern", the "test pattern" is used for verification of, for example, a semiconductor element or a manufacturing process. The pattern of the circuit pattern exposure.
進而,圖像處理裝置3具有以下功能:使用圖形使用者介面裝置2,獲得於基板之端部等設定用於形成鍍敷用電極之圓弧帶狀區域之圓弧區域用資料T1、或設定用於形成編號等之圓弧帶狀區域的圓弧區域用資料T1。又,圓弧區域用資料T1有時亦為如下資料:以藉由雷射刻印等已形成於基板之端部之序列號等不會因後步驟被破壞的方式,將形成有序列號等之編號區域設定為圓弧帶狀區域。 Further, the image processing apparatus 3 has a function of setting the circular arc area data T1 or setting for setting the arc-shaped strip-shaped region for forming the plating electrode at the end portion of the substrate or the like using the graphic user interface device 2. A material T1 for forming an arc area for forming an arc band region of a number or the like. Further, the arc area data T1 may be a data such that a serial number or the like formed at the end portion of the substrate by laser marking or the like is not broken by the subsequent step, and a serial number or the like is formed. The number area is set to an arc band area.
圖形使用者介面裝置2係設於圖像處理裝置3,作為面向操作者之圖形使用者介面(Graphical User Interface)發揮功能。圖2係表示圖形使用者介面裝置2之硬體構成之方塊圖。 The graphic user interface device 2 is provided in the image processing device 3 and functions as a graphical user interface for the operator. 2 is a block diagram showing the hardware configuration of the graphical user interface device 2.
圖形使用者介面裝置2例如為電腦5,具備CPU230、ROM231、記憶體232、媒體驅動器233、顯示部200、及操作部234等。該等硬體分別藉由匯流排線235而電性連接。 The graphic user interface device 2 is, for example, a computer 5, and includes a CPU 230, a ROM 231, a memory 232, a media drive 233, a display unit 200, an operation unit 234, and the like. The hardware is electrically connected by bus bar 235, respectively.
CPU230基於記憶於ROM231之程式(或由媒體驅動器233讀取之程式)P,控制上述硬體各部,而實現電腦5(圖形使用者介面裝置2)之功能。程式P係可由電腦5讀取、且使電腦5發揮各功能者。再者,亦可構成為將保存於硬碟驅動器(HDD)之程式P讀入RAM,使電腦5發揮各功能。 The CPU 230 controls the hardware components based on the program stored in the ROM 231 (or the program read by the media drive 233) P to realize the function of the computer 5 (the graphic user interface device 2). The program P is readable by the computer 5 and causes the computer 5 to perform various functions. Further, the program P stored in the hard disk drive (HDD) may be read into the RAM to cause the computer 5 to perform various functions.
ROM231係預先儲存有圖形使用者介面裝置2之控制所需之程式P及資料之讀出專用之記憶裝置。 The ROM 231 is a memory device for storing the program P and the data required for the control of the graphic user interface device 2 in advance.
記憶體232係可讀出及寫入之記憶裝置,臨時記憶CPU230進行演算處理時產生之資料等。記憶體232係由SRAM、DRAM等構成。 The memory 232 is a memory device that can be read and written, and temporarily stores data generated by the CPU 230 when performing arithmetic processing. The memory 232 is composed of SRAM, DRAM or the like.
媒體驅動器233具有將記憶於記錄媒體M之資訊讀出之功能。記錄媒體M係例如CD-ROM、DVD(Digital Versatile Disk,數位多功能光碟)、軟碟等可攜性記錄媒體。例如,於記錄媒體M中預先記錄有程式P之情形時,電腦5通過記錄媒體M而讀取程式P。 The media drive 233 has a function of reading information stored in the recording medium M. The recording medium M is a portable recording medium such as a CD-ROM, a DVD (Digital Versatile Disk), or a floppy disk. For example, when the program P is recorded in advance on the recording medium M, the computer 5 reads the program P through the recording medium M.
顯示部200具備如彩色LCD之顯示器等,其畫面上可變地顯示圖形使用者介面操作用之圖像、各種資料及動作狀態等。 The display unit 200 includes a display such as a color LCD, and variably displays an image for operation of the user interface of the graphic, various materials, operation states, and the like.
操作部234係具有鍵盤及滑鼠之輸入器件,受理命令或各種資料之輸入之使用者操作。操作者使用該操作部234對顯示於顯示部200之圖形使用者介面操作畫面輸入各種資訊,而操作顯示部200之畫面。 The operation unit 234 is provided with a keyboard and a mouse input device, and accepts user operations of commands or input of various materials. The operator uses the operation unit 234 to input various information to the graphic user interface operation screen displayed on the display unit 200, and operates the screen of the display unit 200.
圖3係表示圖形使用者介面裝置2之功能構成之方塊圖。該圖3係以方塊圖表示藉由上述圖2所示之程式P而使圖形使用者介面裝置2之硬體構成發揮的各功能,但該等功能區塊可藉由硬體、軟體之組合而以各種形式實現。 3 is a block diagram showing the functional configuration of the graphical user interface device 2. FIG. 3 is a block diagram showing the functions of the hardware configuration of the graphic user interface device 2 by the program P shown in FIG. 2, but the functional blocks can be combined by hardware and software. It is implemented in various forms.
如圖3所示,圖形使用者介面裝置2具備顯示控制部240。該顯示控制部240係對顯示部200之畫面顯示進行控制者,且具有周資訊輸入部241、徑資訊輸入部242、寬度資訊輸入部243、描繪指示輸入部244及確認顯示部245。顯示控制部2係藉由操作者對操作部234之操作而實現各部之功能,其詳細內容於動作之說明中進行敍述。 As shown in FIG. 3, the graphic user interface device 2 includes a display control unit 240. The display control unit 240 controls the screen display of the display unit 200, and includes a weekly information input unit 241, a radial information input unit 242, a width information input unit 243, a drawing instruction input unit 244, and a confirmation display unit 245. The display control unit 2 realizes the functions of the respective units by the operation of the operation unit 234 by the operator, and the details thereof will be described in the description of the operation.
圖4係表示描繪區域設定之流程之流程圖。使用該圖4對設定上述圓弧帶狀區域之作業之流程進行說明。首先,於步驟S10之輸入畫面顯示步驟中,在圖形使用者介面裝置2所具備之顯示部200之畫面上顯示初始輸入畫面。圖5係初始輸入畫面之一例,在畫面7上顯示確認顯示區域80及輸入區域90。輸入區域90係藉由上述周資訊輸入部241、徑資訊輸入部242、寬度資訊輸入部243及描繪指示輸入部245之各功能而顯示於畫面7上。關於輸入區域90之詳細內容,於作為下一 步驟之步驟S20之資訊輸入步驟中進行說明。 Fig. 4 is a flow chart showing the flow of drawing area setting. The flow of the operation of setting the arcuate strip-shaped region will be described with reference to Fig. 4 . First, in the input screen display step of step S10, the initial input screen is displayed on the screen of the display unit 200 provided in the graphic user interface device 2. FIG. 5 is an example of an initial input screen, and a confirmation display area 80 and an input area 90 are displayed on the screen 7. The input area 90 is displayed on the screen 7 by the functions of the above-described weekly information input unit 241, the diameter information input unit 242, the width information input unit 243, and the drawing instruction input unit 245. Regarding the details of the input area 90, as the next The step of step S20 is described in the information input step.
返回至圖4中,對步驟S20之資訊輸入步驟進行說明。該資訊輸入步驟包含周資訊輸入步驟(步驟S21)、徑資訊輸入步驟(步驟S22)、寬度資訊輸入步驟(步驟S23)及描繪指示輸入步驟(步驟S24)。 Returning to Fig. 4, the information input step of step S20 will be described. The information input step includes a weekly information input step (step S21), a radial information input step (step S22), a width information input step (step S23), and a drawing instruction input step (step S24).
參照圖6,對作為資訊輸入步驟(步驟S20)之一例之第1實施例進行說明。圖6(a)係概念性表示設定第1圓弧帶狀區域E1及第2圓弧帶狀區域E2之狀況之圖,圖6(b)係表示輸入區域90輸入有各資訊之狀態。 A first embodiment which is an example of the information input step (step S20) will be described with reference to Fig. 6 . Fig. 6(a) conceptually shows a state in which the first arc-shaped strip-shaped region E1 and the second arc-shaped strip-shaped region E2 are set, and Fig. 6(b) shows a state in which the information is input to the input region 90.
如圖6(b)所示,輸入區域90係具有行列之清單(list)狀之輸入區域。第1行之「No.」欄91中顯示清單之列編號,第1列顯示「0」作為初始值(預設值)。第2列之後依序顯示為「1、2、3‧‧‧」,各列為用於指定一個圓弧帶狀區域之一個組合。 As shown in FIG. 6(b), the input area 90 is an input area having a list of rows and columns. In the "No." column 91 of the first row, the column number of the list is displayed, and the first column displays "0" as the initial value (preset value). The second column is sequentially displayed as "1, 2, 3‧‧‧", and each column is a combination for specifying an arc band.
第2行之「θ」欄92係藉由周資訊輸入部241之功能而顯示之輸入區域,且係輸入角度之數值之輸入區域。再者,如後述般「弧長」欄99設為藉由周資訊輸入部241之功能而顯示之輸入區域之情形時,「θ」欄91顯示與「弧長」欄99中輸入之圓弧之長度尺寸相應的角度之數值。「θ」欄92中輸入之角度之數值、或「弧長」欄99中輸入之圓弧之長度尺寸係與圓弧帶狀區域之周向之長度相關的資訊。 The "θ" column 92 of the second line is an input area displayed by the function of the week information input unit 241, and is an input area for inputting the numerical value of the angle. Further, when the "arc length" column 99 is set as the input area displayed by the function of the week information input unit 241, the "θ" column 91 displays the arc input in the "arc length" column 99. The length of the corresponding dimension of the length dimension. The value of the angle input in the "θ" column 92 or the length dimension of the arc input in the "arc length" column 99 is information relating to the length of the circumferential direction of the arc band region.
第3行之「R0」欄93係輸入作為描繪對象之圓形狀之基板之徑向上之圓弧帶狀區域之位置資訊之一的、基板之中心至徑向上之圓弧帶狀區域為止之長度尺寸的輸入區域,且係藉由徑資訊輸入部242之功能而顯示之輸入區域。 In the "R0" column 93 of the third row, the length from the center of the substrate to the arc-shaped strip-shaped region in the radial direction, which is one of the positional information of the arc-shaped strip-shaped region in the radial direction of the substrate of the circular shape to be drawn, is input. The input area of the size is an input area displayed by the function of the diameter information input unit 242.
第4行之「內」欄94及第5行之「外」欄95係分別用於輸入以「R0」欄93中輸入之長度尺寸為半徑之假想圓距離內側之長度尺寸的輸入區域。具體而言,「內」欄94及「外」欄95係用於分兩階段設定並輸入徑向上之圓弧帶狀區域之寬度尺寸之輸入區域,「內」欄94 中輸入基板之中心Ct側之寬度尺寸,「外」欄95中輸入假想圓側之寬度尺寸。「內」欄94及/或「外」欄95之輸入區域係藉由寬度資訊輸入部243之功能而顯示之輸入區域。 The "inner" column 94 on the fourth line and the "outer" column 95 on the fifth line are respectively used to input an input area having a length dimension inside the virtual circle having a radius of the length dimension input in the "R0" column 93. Specifically, the "inner" column 94 and the "outer" column 95 are used to input and input the input area of the width dimension of the arc-shaped strip-shaped region in the radial direction in two stages, and the "inner" column 94 The width dimension of the center Ct side of the middle input substrate, and the width dimension of the imaginary circle side is input to the "outer" column 95. The input area of the "inner" column 94 and/or the "outer" column 95 is an input area displayed by the function of the width information input unit 243.
第6行之「曝光」欄96中顯示左右排列之2個單選按鈕(radio button)97、98。於選擇左側之單選按鈕97之情形時,係輸入「內」欄94中輸入並設定之區域為應描繪之(應曝光之)描繪區域的資訊。於選擇右側之單選按鈕98之情形時,係輸入「外」欄95中輸入並設定之區域為應描繪之(應曝光之)描繪區域的資訊。相反,未選擇單選按鈕97、98之狀態係輸入此區域為並非應描繪之區域之非描繪區域的狀態。「曝光」欄96係藉由描繪指示輸入部244之功能而顯示。 In the "Exposure" column 96 of the sixth row, two radio buttons 97 and 98 arranged side by side are displayed. In the case of selecting the radio button 97 on the left side, the area input and set in the "inside" column 94 is entered as the information of the drawing area (which should be exposed) to be drawn. In the case where the radio button 98 on the right side is selected, the area input and set in the "outside" column 95 is entered as the information of the drawing area (which should be exposed) to be drawn. On the contrary, the state in which the radio buttons 97 and 98 are not selected is a state in which this area is input as a non-drawing area which is not an area to be drawn. The "Exposure" column 96 is displayed by drawing the function of the instruction input unit 244.
第7行之「弧長」欄99中顯示以「R0」欄93中輸入之長度尺寸為半徑之假想圓之圓周長度中之、「θ」欄92中輸入之角度範圍量之長度作為圓弧長度之尺寸。再者,關於「弧長」欄99,亦可將「弧長」欄99設為藉由周資訊輸入部242之功能顯示之輸入區域。該情形時,將與圓弧帶狀區域之圓弧長度相關之資訊輸入至「弧長」欄99,並根據該輸入值而如上述般在「θ」欄92顯示角度之數值。 In the "arc length" column 99 of the seventh row, the length of the angular range input in the "θ" column 92 in the circumferential length of the imaginary circle having the radius of the length dimension input in the "R0" column 93 is displayed as an arc. The size of the length. Further, regarding the "arc length" column 99, the "arc length" column 99 may be set as an input area displayed by the function of the week information input unit 242. In this case, information relating to the arc length of the arc band region is input to the "arc length" column 99, and the value of the angle is displayed in the "θ" column 92 as described above based on the input value.
於第1列之「No.0」中,「θ」欄92顯示0度作為初始值(預設值)。其概念性地表示自圖6(a)所示之基板之中心Ct沿徑向延伸之假想線R0。 In "No. 0" of the first column, the "θ" column 92 displays 0 degrees as an initial value (preset value). It conceptually represents an imaginary line R0 extending in the radial direction from the center Ct of the substrate shown in Fig. 6(a).
返回至圖4中,對資訊輸入步驟S20進行說明。首先,於步驟S21之周資訊輸入步驟中,於圖6(b)所示之輸入區域90之第2列之「No.1」中,在「θ」欄92輸入例如「10」度。其次,藉由步驟S22之徑資訊輸入步驟向「R0」欄93中輸入例如「150」mm。 Returning to Fig. 4, the information input step S20 will be described. First, in the week information input step of step S21, in the "No. 1" of the second column of the input area 90 shown in Fig. 6 (b), for example, "10" is input in the "θ" column 92. Next, for example, "150" mm is input to the "R0" column 93 by the path information input step of step S22.
其概念性表示自圖6(a)所示之基板之中心Ct沿徑向以150mm之長度延伸的假想線R1相對於假想線R0而於逆時針方向上位於角度10度之位置上。再者,圖中符號之WO表示基板之外形線,該例中,基板 之半徑為150mm,該實施例中,基板之外形線WO與假想圓L3一致。「R0」欄93中輸入之值為任意,若為「150」mm以外之數值,則外形線WO與假想圓不一致。 It is conceptually shown that the imaginary line R1 extending from the center Ct of the substrate shown in Fig. 6(a) by a length of 150 mm in the radial direction is located at an angle of 10 degrees in the counterclockwise direction with respect to the imaginary line R0. Furthermore, the symbol WO in the figure indicates a shape line outside the substrate, in this case, the substrate The radius is 150 mm. In this embodiment, the outer shape line WO of the substrate coincides with the imaginary circle L3. The value entered in the "R0" column 93 is arbitrary, and if it is a value other than "150" mm, the outline WO does not coincide with the imaginary circle.
其次,藉由步驟S23之寬度資訊輸入步驟,於同列(第2列)之「內」欄94中輸入例如「5」mm。其表示自連結假想線R0之終端與假想線R1之終端之假想圓L3之圓弧朝向內側(基板之中心Ct側)之上述兩階段區域內、將內側之區域之寬度尺寸t1設為5mm。而且,向「外」欄95中輸入「0」mm,其表示上述兩階段之區域內、外側之區域無寬度。該結果,設定寬度尺寸t1為5mm之第1圓弧帶狀區域E1。 Next, by the width information input step of step S23, for example, "5" mm is input in the "inner" column 94 of the same column (column 2). It is shown that the width dimension t1 of the inner region is set to 5 mm in the two-stage region from the end of the imaginary line R0 and the imaginary circle L3 of the terminal of the imaginary line R1 toward the inner side (the center Ct side of the substrate). Further, "0" is input to the "outer" column 95, which indicates that there is no width in the area in the outer and outer regions of the two stages. As a result, the first arc-shaped strip-shaped region E1 having the width dimension t1 of 5 mm is set.
其次,藉由步驟S24之描繪指示輸入步驟,選擇並指定同列(第2列)之「曝光」欄96之左側之單選按鈕97。該選擇指定相當於輸入「內」欄94中輸入之寬度尺寸之區域為應描繪之描繪區域,結果,輸入第1圓弧帶狀區域E1為應描繪之描繪區域。相反,於將第1圓弧帶狀區域E1設定為不描繪之非描繪區域之情形時,選擇並指定「曝光」欄96之右側之單選按鈕98。該情形時,相當於向「內」欄94之描繪指示之左側之單選按鈕97未被選擇,故而將「內」欄94中輸入之寬度尺寸之區域設定為非描繪區域。 Next, by the drawing instruction input step of step S24, the radio button 97 on the left side of the "exposure" column 96 of the same column (column 2) is selected and designated. This selection designates a region corresponding to the width dimension input in the input "inner" column 94 as the drawing region to be drawn, and as a result, the first arc band region E1 is input as the drawing region to be drawn. On the other hand, when the first arc-shaped strip-shaped area E1 is set as the non-drawing area which is not drawn, the radio button 98 on the right side of the "exposure" column 96 is selected and designated. In this case, the radio button 97 corresponding to the left side of the drawing instruction to the "inside" column 94 is not selected. Therefore, the area of the width size input in the "inner" column 94 is set as the non-drawing area.
同列(第2列)之「弧長」欄99中,與向「θ」欄92之輸入動作連動地顯示「26.17」mm作為上述圓弧之長度。再者,於將「弧長」欄99作為輸入區域而執行周資訊輸入步驟(步驟S22)之情形時,若「弧長」欄99中輸入「26.17」mm,便可同樣地設定第1圓弧帶狀區域E1。該情形時,與向「弧長」欄99之輸入動作連動地,「θ」欄92中顯示「10」度。 In the "arc length" column 99 of the same column (second column), "26.17" mm is displayed as the length of the arc in conjunction with the input operation to the "θ" column 92. In the case where the week information input step (step S22) is executed by using the "arc length" column 99 as the input area, if "26.17" mm is input in the "arc length" column 99, the first circle can be set in the same manner. Arc band area E1. In this case, in conjunction with the input operation to the "arc length" column 99, "10" is displayed in the "θ" column 92.
再者,資訊輸入步驟中之周資訊輸入步驟、徑資訊輸入步驟、寬度資訊輸入步驟及描繪指示步驟並非必須按照上述順序執行,步驟順序亦可任意地設定。 Furthermore, the weekly information input step, the diameter information input step, the width information input step, and the drawing instruction step in the information input step are not necessarily performed in the above order, and the step sequence may be arbitrarily set.
其次,藉由步驟S30之確認顯示步驟,利用確認顯示部245之功能而於畫面7之確認顯示區域80內顯示第1圓弧帶狀區域E1之形狀及基板上之配置位置。 Next, by the confirmation display step of step S30, the shape of the first arc-shaped strip-shaped region E1 and the arrangement position on the substrate are displayed in the confirmation display area 80 of the screen 7 by the function of the confirmation display unit 245.
其次,於步驟S40中,由操作者基於確認顯示區域80內之顯示內容等判斷基板中之圓弧帶狀區域之設定是否全部完成,於判斷未完成之情形時(No之情形時),返回至資訊輸入步驟(步驟S20),繼續進行輸入作業。於判斷設定作業已完成之情形時(Yes之情形時),結束設定作業。 Next, in step S40, the operator determines whether or not the setting of the arc-shaped strip-shaped area in the substrate is completed based on the display content in the confirmation display area 80 or the like, and returns to the case where the determination is not completed (in the case of No), and returns. To the information input step (step S20), the input job is continued. When it is judged that the setting operation has been completed (in the case of Yes), the setting operation is ended.
於步驟S40中,於No之情形時,例如圖6(b)之輸入區域90所示之第3列之「No.2」之輸入作業即步驟S21至步驟S24係由操作者執行。具體而言,操作者使用操作部234,向「θ」欄92輸入「35」度、向「R0」欄93輸入「150」mm、向「內」欄94輸入「0」mm及向「外」欄輸入「0」mm,且指定「曝光」96欄之左側之單選按鈕97。此時,「弧長」欄99中顯示「91.58」mm。再者,與上述同樣地,亦可代替向「θ」欄92之輸入,而進行向「弧長」欄99之輸入作業。 In the case of No in step S40, for example, steps S21 to S24, which are input operations of "No. 2" in the third column shown in the input area 90 of Fig. 6(b), are executed by the operator. Specifically, the operator uses the operation unit 234 to input "35" degrees into the "θ" column 92, "150" mm into the "R0" column 93, and input "0" mm and "outside" to the "Inside" column 94. In the field, enter "0" mm and specify the radio button 97 on the left side of the "Exposure" column. At this time, "91.58" mm is displayed in the "Arc Length" column 99. Further, similarly to the above, instead of inputting to the "θ" column 92, an input operation to the "arc length" column 99 may be performed.
藉由向第3列之「No.2」之各輸入區域輸入各資訊,而表示有長度150mm之假想線R2,其概念性地配置於自圖6(a)所示之假想線R1向逆時針之方向推進35度後之位置。自連結假想線R1之終端與假想線R2之終端之圓弧朝向內側之兩階段之區域分別具有「0」mm之寬度的區域成為圓弧帶狀區域,但該情形時,由於並無寬度尺寸,故而實質上並不設定圓弧帶狀區域。 By inputting each piece of information to each input area of "No. 2" in the third column, an imaginary line R2 having a length of 150 mm is conceptually placed in the inverse of the imaginary line R1 shown in Fig. 6(a). The direction of the hour hand advances after 35 degrees. A region having a width of "0" mm from the end of the connection imaginary line R1 and the end of the arc of the imaginary line R2 toward the inner side is an arc band-shaped region, but in this case, since there is no width dimension Therefore, the arc band region is not substantially set.
其次,圖6(b)之輸入區域90所示之第4列之「No.3」之輸入作業即步驟S21至步驟S24係由操作者執行。該輸入內容係與第2列之「No.2」中之輸入內容相同,操作者使用操作部234向「θ」欄92輸入「10」度、向「R0」欄93輸入「150」mm、向「內」欄94輸入「5」mm及向「外」欄輸入「0」mm,且指定「曝光」欄之左側之單選按 鈕97。此時,「弧長」欄99中顯示「26.17」mm。再者,與上述同樣地,亦可代替向「θ」欄92之輸入而進行向「弧長」欄99之輸入作業。 Next, the input operation of "No. 3" in the fourth column shown in the input area 90 of Fig. 6(b), that is, the steps S21 to S24, is executed by the operator. The input content is the same as the input content in "No. 2" of the second column, and the operator inputs "10" degrees to the "θ" column 92 and "150" mm to the "R0" column 93 using the operation unit 234. Enter "5" mm in the "Inside" column 94 and "0" mm in the "Outside" column, and specify the radio button on the left side of the "Exposure" column. Button 97. At this time, "26.17" mm is displayed in the "Arc Length" column 99. Further, similarly to the above, the input operation to the "arc length" column 99 may be performed instead of the input to the "θ" column 92.
藉由向第4列之「No.3」之各輸入區域輸入各資訊,而顯示長度150mm之假想線R3,其概念性地配置於自圖6(a)所示之假想線R2向逆時針之方向推進10度後之位置。自連結假想線R2之終端與假想線R3之終端之圓弧朝向內側具有「5」mm之寬度的區域被設定為第2圓弧帶狀區域E2。 By inputting each piece of information to each input area of "No. 3" in the fourth column, an imaginary line R3 having a length of 150 mm is displayed, which is conceptually arranged counterclockwise from the imaginary line R2 shown in Fig. 6(a). The direction is advanced after 10 degrees. A region having a width of "5" mm toward the inner side of the arc of the terminal connecting the imaginary line R2 and the imaginary line R3 is set as the second arc-shaped strip-shaped region E2.
圖7係藉由圖6之步驟S40而判斷設定作業已完成(Yes)時之畫面7之一例。於該圖7中,重複圖6所示之作業之結果為,將設定有第1至第8之8個圓弧帶狀區域E1至E8之狀況與基板之外形WO一併藉由確認顯示部245之功能而顯示於確認顯示區域80。具體而言,於確認顯示區域80顯示以下狀態:圓周方向之長度為10度、且徑向之尺寸為5mm之8個圓弧帶狀區域E1至E8沿基板外形WO彼此隔開35度之間隔而配置。又,於輸入區域90顯示有第2列(No.1)至第17列(No.16)之輸入結果。 Fig. 7 is an example of the screen 7 when the setting operation is completed (Yes) by the step S40 of Fig. 6. In FIG. 7, the result of the operation shown in FIG. 6 is repeated, and the state in which the first to eighth arc-shaped strip-shaped regions E1 to E8 are set is combined with the substrate outer shape WO by the confirmation display portion. The function of 245 is displayed on the confirmation display area 80. Specifically, it is confirmed that the display region 80 displays a state in which eight arc-shaped strip-shaped regions E1 to E8 having a length of 10 degrees in the circumferential direction and a size of 5 mm in the radial direction are spaced apart from each other by 35 degrees along the substrate outer shape WO. And configuration. Further, the input result of the second column (No. 1) to the 17th column (No. 16) is displayed in the input area 90.
又,若步驟S40之設定作業完成,則藉由圖像處理裝置3而產生與圓弧帶狀區域E1至E8對應之圓弧區域用資料T1,並經由網路N發送至直接描繪裝置100。圖像處理裝置3例如產生圓弧區域用資料T1作為表示圓弧帶狀區域E1等之外形線之向量資料。再者,亦可藉由圖像處理裝置3,基於向量資料對圓弧區域用資料T1與設計資料D0或修正設計資料D1進行合成處理,並將合成處理後之向量資料經由網路N發送至直接描繪裝置100。 When the setting operation in step S40 is completed, the arc area information T1 corresponding to the arc band regions E1 to E8 is generated by the image processing device 3, and transmitted to the direct drawing device 100 via the network N. The image processing device 3 generates, for example, the arc area data T1 as vector data indicating an outer line such as the arc band area E1. Furthermore, the image processing device 3 can also synthesize the circular region data T1 and the design data D0 or the modified design data D1 based on the vector data, and send the synthesized vector data to the network N through the network N. The device 100 is directly depicted.
如上述般藉由「θ」欄92中輸入之周資訊、「R0」欄中輸入之徑資訊及「內」欄94中輸入之寬度資訊之3個資訊,而設定圓弧帶狀區域,故而與藉由用於特定圖17所示之圓弧帶狀區域之4角之座標之8個 資訊進行設定的先前例相比,可減少作業量。 As described above, the arc band region is set by the week information input in the "θ" column 92, the path information input in the "R0" column, and the three pieces of width information input in the "inner" column 94. 8 with coordinates of 4 corners for the arc-shaped strip region shown in Fig. 17 Compared with the previous example in which the information is set, the amount of work can be reduced.
又,如上述般根據角度資訊或圓弧長度之資訊指定圓弧帶狀區域之圓周方向之長度,且以距基板之中心之距離尺寸來指定其徑向之位置,以距圓弧之長度資訊來指定其徑向上之寬度尺寸,藉此與圖17所示之圓弧帶狀區域之4角之座標之指定方法相比,可直觀地設定圓弧帶狀區域。此係基板為圓形狀且於此基板周緣部等設定圓弧帶狀區域之作業,故而本實施形態之設定方法可直觀地進行。 Further, as described above, the length of the circular strip-shaped region in the circumferential direction is specified according to the information of the angle information or the length of the arc, and the position of the radial direction is specified by the distance from the center of the substrate, so as to be the length of the arc. By specifying the width dimension in the radial direction, the arc band region can be intuitively set as compared with the method of specifying the coordinates of the four corners of the arc band region shown in FIG. Since the base substrate has a circular shape and the arcuate strip-shaped region is set on the peripheral portion of the substrate, the setting method of the present embodiment can be intuitively performed.
進而,將上述步驟S21至步驟S24之資訊輸入步驟(步驟S20)作為一個組合來設定1個圓弧帶狀區域,並於基板之周向依序重複該設定作業,藉此可容易地進行周向之全域的設定作業。如圖17所示之先前例般例如指定8個圓弧帶狀區域之4角之座標位置之作業,由於需要將圓形狀之基板中之二維座標位置按各座標逐一找出,故而並不容易。 Further, the information input step (step S20) of the above-described steps S21 to S24 is set as one combination to form one arc-shaped strip-shaped region, and the setting operation is sequentially repeated in the circumferential direction of the substrate, whereby the circumferential direction can be easily performed. Global setting operation. For example, as shown in the previous example shown in FIG. 17, for example, the operation of designating the coordinate positions of the four corners of the eight arc-shaped strip-shaped regions requires that the two-dimensional coordinate positions in the circular-shaped substrate are found one by one for each coordinate, and thus easily.
參照圖8對作為資訊輸入步驟(步驟S20)之其他例的第2實施例進行說明。 A second embodiment which is another example of the information input step (step S20) will be described with reference to Fig. 8 .
與上述第1實施例不同之處為,於步驟S23之寬度資訊輸入步驟中,向輸入區域90所示之第2列(No.1)之「內」欄94輸入「0」mm,且向「外」欄95輸入「5」mm。又,與上述第1實施例不同之處還有,於步驟S24之描繪指示輸入步驟中指定同列(第2列)之「曝光」欄96之右側之單選按鈕98。 The difference from the above-described first embodiment is that in the width information input step of step S23, "0" is input to the "inner" column 94 of the second column (No. 1) indicated by the input area 90, and Enter "5" mm in the "Outside" column 95. Further, unlike the above-described first embodiment, the radio button 98 on the right side of the "exposure" column 96 of the same column (second column) is designated in the drawing instruction step S24.
於該第2實施例中,在連結假想線R0之終端與假想線R1之終端之假想圓L3中之圓弧朝向內側之兩階段區域內,將外側之區域設定為5mm之寬度尺寸,將內側之區域設定為0mm之寬度尺寸。又,由於將5mm之外側區域設定為描繪區域,故而結果為,與第1實施例同樣地,將寬度尺寸t1為5mm之第1圓弧帶狀區域E1設定為描繪區域。再者,於將第1圓弧帶狀區域E1設定為不描繪之非描繪區域之情形時, 選擇並指定「曝光」欄96之左側之單選按鈕97。該情形時,並不選擇相當於向「外」欄95之描繪指示之右側之單選按鈕98,故而將「外」欄95中輸入之寬度尺寸之區域設定為非描繪區域。 In the second embodiment, the outer region is set to a width of 5 mm in the two-stage region in which the circular arc of the terminal connecting the virtual line R0 and the virtual circle L3 at the end of the virtual line R1 faces inward, and the inner side is set to the inner side. The area is set to a width of 0 mm. In addition, as a result of setting the outer region of 5 mm as the drawing region, the first arc-shaped strip-shaped region E1 having the width t1 of 5 mm is set as the drawing region as in the first embodiment. Further, when the first arc-shaped strip-shaped region E1 is set as a non-drawing region that is not drawn, Select and assign the radio button 97 to the left of the "Exposure" column 96. In this case, the radio button 98 corresponding to the right side of the drawing instruction to the "outside" column 95 is not selected, so the area of the width size input in the "outer" column 95 is set as the non-drawing area.
關於輸入區域90所示之第3列(No.2),執行與上述第1實施例相同之資訊輸入步驟(步驟S20),關於第4列(No.3)執行與上述第2實施例之第2列(No.2)相同之資訊輸入步驟(步驟S20)。遍及周向執行該作業之結果,藉由該第2實施例,亦可與第1實施例同樣地,設定圖7之確認顯示區域80所示之8個圓弧帶狀區域E1至E8。 The third column (No. 2) shown in the input area 90 performs the same information input step as the first embodiment (step S20), and the fourth column (No. 3) executes the second embodiment. The second information (No. 2) is the same information input step (step S20). As a result of performing the above operation in the circumferential direction, in the second embodiment, eight arc-shaped strip-shaped regions E1 to E8 shown in the confirmation display region 80 of Fig. 7 can be set in the same manner as in the first embodiment.
參照圖9對作為資訊輸入步驟(步驟S20)之其他例的第3實施例進行說明。 A third embodiment which is another example of the information input step (step S20) will be described with reference to Fig. 9 .
與上述第1實施例及第2實施例不同之處為,於步驟S23之寬度資訊輸入步驟中,向輸入區域90所示之第2列(No.1)之「內」欄94輸入「2」mm,且向「外」欄95輸入「3」mm。又,與上述第1實施例不同之處還有,於步驟S24之描繪指示輸入步驟中,選擇並指定同列(第2列)之「曝光」欄96之右側之單選按鈕97。 The difference from the first embodiment and the second embodiment is that in the width information input step of step S23, "2" is input to the "inner" column 94 of the second column (No. 1) indicated by the input area 90. "mm" and enter "3" mm into the "outside" column 95. Further, unlike the first embodiment described above, in the drawing instruction input step of step S24, the radio button 97 on the right side of the "exposure" column 96 of the same column (second column) is selected and designated.
於該第3實施例中,於自連結假想線R0之終端與假想線R1之終端之假想圓L3中之圓弧朝向內側之兩階段區域內,將外側之區域設定為3mm之寬度尺寸,將內側之區域設定為2mm之寬度尺寸。又,由於設定寬度為3mm之外側區域作為描繪區域,故而結果為,將寬度尺寸t2為3mm之第1圓弧帶狀區域E1a設定為描繪區域。 In the third embodiment, the outer region is set to a width of 3 mm in a two-stage region in which the arc of the virtual virtual line R3 at the end of the imaginary line R0 and the imaginary line R1 is directed to the inner side. The inner area is set to a width of 2 mm. In addition, since the outer side region having the set width of 3 mm is used as the drawing region, the first arc-shaped strip-shaped region E1a having the width dimension t2 of 3 mm is set as the drawing region.
又,設定為自上述圓弧朝向內側之兩階段區域內,內側之寬度為2mm之區域係非描繪區域k1。該非描繪區域k1亦有作為圓弧帶狀區域以外之例如不描繪配線圖案等圖案之描繪禁止區域k1的含義。如此,藉由於第1圓弧帶狀區域E1a與配線圖案等之間設置描繪禁止區域k1,而可於形成於基板上之圓弧帶狀之鍍敷用電極等與配線圖案之間 確實地設置所需間隔。 Further, in the two-stage region from the arc toward the inside, the region having the inner width of 2 mm is the non-drawing region k1. The non-drawing area k1 has a meaning other than the arc-shaped strip-shaped area, for example, the drawing prohibition area k1 in which a pattern such as a wiring pattern is not drawn. By providing the drawing prohibition region k1 between the first arc-shaped strip-shaped region E1a and the wiring pattern or the like, it is possible to form an arc-shaped strip-shaped plating electrode or the like formed on the substrate with the wiring pattern. Make sure the required interval is set.
關於輸入區域90所示之第3列(No.2),執行與上述第1實施例相同之資訊輸入步驟(步驟S20),關於第4列(No.3)執行與上述第3實施例之第2列(No.2)相同之資訊輸入步驟(步驟S20)。遍及周向而執行該作業之結果為,設定8個圓弧帶狀區域E1a至E8a及描繪禁止區域k1至k8,且將該設定結果顯示於圖7之確認顯示區域80。 The third column (No. 2) shown in the input area 90 performs the same information input step as the first embodiment (step S20), and the fourth column (No. 3) is executed in the third column (No. 3). The second information (No. 2) is the same information input step (step S20). As a result of performing the operation in the circumferential direction, eight arc-shaped strip regions E1a to E8a and drawing prohibition regions k1 to k8 are set, and the setting result is displayed on the confirmation display region 80 of FIG.
上述各實施例中之步驟S23之寬度資訊輸入步驟中,假想圓L3中之圓弧至內側係以兩階段之範圍進行輸入,但既可為兩階段以上,亦可於徑向上之複數個範圍分別輸入寬度資訊。又,並不限於上述圓弧之內側,亦可輸入外側之區域或內外雙方之區域之寬度資訊。 In the width information input step of step S23 in each of the above embodiments, the arc to the inner side of the imaginary circle L3 is input in a two-stage range, but may be two or more stages or a plurality of ranges in the radial direction. Enter the width information separately. Further, it is not limited to the inner side of the arc, and the width information of the outer region or the inner and outer regions may be input.
其次,參照圖10及圖11對直接描繪裝置100之構成進行說明。圖10係本發明之一實施形態之直接描繪裝置100之側視圖,圖11係圖10所示之直接描繪裝置100之俯視圖。 Next, the configuration of the direct drawing device 100 will be described with reference to Figs. 10 and 11 . Fig. 10 is a side view of the direct drawing device 100 according to an embodiment of the present invention, and Fig. 11 is a plan view of the direct drawing device 100 shown in Fig. 10.
該直接描繪裝置100係如下裝置,對表面附有光阻膜(感光性材料)之半導體基板或玻璃基板等基板W之表面掃描經空間調變後之光束而描繪曝光圖案。具體而言,該裝置係用以於半導體器件晶片之製造步驟中,對作為曝光對象基板之支持基板(以下僅稱為「基板」)W之表面所形成之具有感光性的光阻膜描繪配線圖案。基板W為圓形狀,其外周緣之一部分形成有被稱為凹槽之切口。亦存在代替凹槽而於基板W之外周緣之一部分設置定向平面之情形。又,直接描繪裝置100係以區劃基板W內之區塊單位實施曝光處理之曝光裝置。 The direct drawing device 100 is a device that scans a spatially modulated light beam on a surface of a substrate W such as a semiconductor substrate or a glass substrate having a photoresist film (photosensitive material) on its surface to form an exposure pattern. Specifically, the device is used for drawing a wiring of a photosensitive resist film formed on the surface of a support substrate (hereinafter simply referred to as "substrate") W as an exposure target substrate in the manufacturing process of the semiconductor device wafer. pattern. The substrate W has a circular shape, and a portion of the outer peripheral edge thereof is formed with a slit called a groove. There is also a case where an orientation flat is provided on one of the outer circumferences of the substrate W instead of the groove. Further, the direct drawing device 100 is an exposure device that performs exposure processing in units of blocks in the partition substrate W.
如圖10及圖11所示,直接描繪裝置100主要具備保持基板W之載置台10、移動載置台10之載置台移動機構20、測量與載置台10之位置對應之位置參數的位置參數測量機構30、對基板W之表面照射脈衝光之光學頭部50、1個對準相機60、及控制部70。 As shown in FIGS. 10 and 11 , the direct drawing device 100 mainly includes a mounting table 10 that holds the substrate W, a mounting table moving mechanism 20 that moves the mounting table 10, and a position parameter measuring mechanism that measures positional parameters corresponding to the position of the mounting table 10. 30. An optical head 50 that irradiates the surface of the substrate W with pulsed light, an alignment camera 60, and a control unit 70.
又,於該直接描繪裝置100中,係於對本體框架101安裝外罩102而形成之本體內部配置裝置各部從而構成本體部,且於本體部之外側(本實施形態中,如圖11所示,為本體部之+Y側)配置有基板收納匣110。於該基板收納匣110收納有應接受曝光處理之未處理基板W,藉由配置於本體內部之搬送機器人120而將該基板W裝載至本體部。又,對未處理基板W實施曝光處理(圖案描繪處理)之後,藉由搬送機器人120將該基板W自本體部卸載並返回至基板收納匣110。如此,搬送機器人120係作為搬送部而發揮功能。 Further, in the direct drawing device 100, each of the devices is disposed inside the main body of the main body frame 101, and the main body portion is disposed on the outside of the main body portion (in the present embodiment, as shown in FIG. The substrate housing cassette 110 is disposed on the +Y side of the main body portion. The substrate storage cassette 110 stores an unprocessed substrate W to be subjected to exposure processing, and the substrate W is placed on the main body by the transfer robot 120 disposed inside the main body. After the exposure processing (pattern drawing processing) is performed on the unprocessed substrate W, the substrate W is unloaded from the main body portion by the transfer robot 120 and returned to the substrate housing cassette 110. In this way, the transport robot 120 functions as a transport unit.
如圖11所示,於該本體部中,係於被外罩102包圍之本體內部之+Y側端部配置搬送機器人120。又,於該搬送機器人120之-Y側配置有基台130。該基台130中之一端側區域(圖10及圖11之+Y側區域)成為與搬送機器人120之間進行基板W之交接的基板交接區域。又,基台130之中,Y方向中央側區域成為向基板W進行圖案描繪之圖案描繪區域。如圖10所示,頭支持部140具備自基台130朝上方豎立設置之2根腳構件141、及於較2根腳構件141更靠-Y側自基台130朝上方豎立設置的2根腳構件142。又,頭支持部140具備以將2根腳構件141之頂部之間跨接之方式設置之樑構件143、及以將2根腳構件142之頂部之間跨接之方式設置的樑構件144。而且,如圖10所示,於樑構件143之-Y側固定有對準相機(攝像部)60,如後述般可拍攝被載置台10保持之基板W之表面(被描繪面、被曝光面)上之複數個對準標記或下層圖案。 As shown in FIG. 11, in the main body portion, the transport robot 120 is disposed at the +Y side end portion of the inside of the main body surrounded by the outer cover 102. Further, a base 130 is disposed on the -Y side of the transfer robot 120. One end side region (the +Y side region in FIGS. 10 and 11) of the base 130 serves as a substrate transfer region for transferring the substrate W to and from the transfer robot 120. Further, among the bases 130, the central side region in the Y direction is a pattern drawing region for patterning the substrate W. As shown in FIG. 10, the head support portion 140 includes two leg members 141 that are erected upward from the base 130, and two legs that are erected upward from the base 130 on the -Y side of the two leg members 141. Foot member 142. Further, the head support portion 140 includes a beam member 143 that is provided to bridge the top of the two leg members 141, and a beam member 144 that is provided to bridge the top of the two leg members 142. Further, as shown in FIG. 10, an alignment camera (image pickup unit) 60 is fixed to the -Y side of the beam member 143, and the surface of the substrate W held by the mounting table 10 (the drawn surface and the exposed surface) can be imaged as will be described later. a plurality of alignment marks or lower patterns on the).
作為支持基板W之支持部之載置台10係於基台130上藉由載置台移動機構20而朝X方向、Y方向及θ方向移動。即,載置台移動機構20係使載置台10於水平面內二維移動而進行定位,且使其繞θ軸(鉛垂軸)旋轉而調整相對於後述光學頭部50之相對角度從而進行定位。 The mounting table 10 as the support portion of the support substrate W is moved on the base 130 by the stage moving mechanism 20 in the X direction, the Y direction, and the θ direction. In other words, the stage moving mechanism 20 performs positioning by moving the stage 10 two-dimensionally in the horizontal plane, and rotating it around the θ axis (vertical axis) to adjust the relative angle with respect to the optical head 50 to be described later.
又,將光學頭部50以於上下方向移動自如之方式安裝於以此方式構成之頭支持部140。如此,將對準相機60及光學頭部50安裝於頭 支持部140,使XY平面內之兩者之位置關係固定化。又,該光學頭部50係對基板W進行圖案描繪者,藉由頭移動機構(省略圖示)而於上下方向移動。而且,藉由頭移動機構作動,光學頭部50於上下方向移動,而可高精度地調整光學頭部50與載置台10所保持之基板W之距離。如此,光學頭部50係作為描繪頭而發揮功能。 Moreover, the optical head unit 50 is attached to the head support unit 140 configured in this manner so as to be movable in the vertical direction. In this way, the alignment camera 60 and the optical head 50 are mounted on the head. The support unit 140 fixes the positional relationship between the two in the XY plane. Further, the optical head 50 is a pattern in which the substrate W is patterned, and is moved in the vertical direction by a head moving mechanism (not shown). Further, the optical head unit 50 is moved in the vertical direction by the head moving mechanism, and the distance between the optical head 50 and the substrate W held by the mounting table 10 can be adjusted with high precision. In this manner, the optical head 50 functions as a drawing head.
而且,以將2根樑構件143、144、2根腳構件141之頂部、及2根腳構件142之頂部跨接的方式,設置收納有光學頭部50之光學系統之盒體172。 Further, the casing 172 of the optical system in which the optical head 50 is housed is provided so that the two beam members 143 and 144, the tops of the two leg members 141, and the tops of the two leg members 142 are bridged.
載置台10係具有圓筒狀之外形,且用於在其上表面載置並保持基板W為水平姿勢之保持部。於載置台10之上表面,形成有複數個抽吸孔(省略圖示)。因此,若於載置台10上載置基板W,則基板W藉由複數個抽吸孔之抽吸壓而被吸附固定於載置台10之上表面。再者,於本實施形態中成為描繪處理之對象之基板W之表面(主面)上,藉由旋塗法(旋轉式塗佈方法)等而預先形成有光阻(感光性材料)膜。 The mounting table 10 has a cylindrical outer shape and is provided with a holding portion in which the substrate W is placed in a horizontal posture on the upper surface thereof. A plurality of suction holes (not shown) are formed on the upper surface of the mounting table 10. Therefore, when the substrate W is placed on the mounting table 10, the substrate W is adsorbed and fixed to the upper surface of the mounting table 10 by the suction pressure of the plurality of suction holes. Further, in the surface (main surface) of the substrate W which is the target of the drawing process in the present embodiment, a photoresist (photosensitive material) film is formed in advance by a spin coating method (rotary coating method) or the like.
載置台移動機構20係用於使載置台10相對於直接描繪裝置100之基台130而朝主掃描方向(Y軸方向)、副掃描方向(X軸方向)、及旋轉方向(繞Z軸之旋轉方向)移動之機構。載置台移動機構20具有使載置台10旋轉之旋轉機構21、支持載置台10使其可旋轉之支持板22、使支持板22於副掃描方向移動之副掃描機構23、經由副掃描機構23而支持支持板22之底板24、及使底板24於主掃描方向移動之主掃描機構25。 The stage moving mechanism 20 is for moving the stage 10 to the main scanning direction (Y-axis direction), the sub-scanning direction (X-axis direction), and the rotation direction (around the Z-axis) with respect to the base 130 of the direct drawing device 100. Rotation direction) The mechanism of movement. The stage moving mechanism 20 includes a rotating mechanism 21 that rotates the mounting table 10, a support plate 22 that supports the mounting table 10 to be rotatable, a sub-scanning mechanism 23 that moves the support plate 22 in the sub-scanning direction, and a sub-scanning mechanism 23. The bottom plate 24 of the support plate 22 and the main scanning mechanism 25 for moving the bottom plate 24 in the main scanning direction are supported.
旋轉機構21具有由安裝於載置台10之內部之轉子構成的馬達。又,於載置台10之中央部下表面側與支持板22之間設有旋轉軸承機構。因此,若使馬達動作,則轉子朝θ方向移動,載置台10以旋轉軸承機構之旋轉軸為中心於特定角度之範圍內旋轉。 The rotation mechanism 21 has a motor composed of a rotor attached to the inside of the mounting table 10. Further, a rotary bearing mechanism is provided between the lower surface side of the central portion of the mounting table 10 and the support plate 22. Therefore, when the motor is operated, the rotor moves in the θ direction, and the mounting table 10 rotates within a certain angle around the rotation axis of the rotary bearing mechanism.
副掃描機構23具有線性馬達23a,該線性馬達23a藉由安裝於支持板22之下表面之動子及敷設於底板24之上表面的定子而產生副掃描方 向之推進力。又,副掃描機構23具有相對於底板24而沿副掃描方向導引支持板22之一對導軌23b。因此,若使線性馬達23a動作,支持板22及載置台10便沿底板24上之導軌23b而於副掃描方向移動。 The sub-scanning mechanism 23 has a linear motor 23a which generates a sub-scanning side by a mover attached to the lower surface of the support plate 22 and a stator attached to the upper surface of the bottom plate 24. Advance to it. Further, the sub-scanning mechanism 23 has a pair of guide rails 23b that guide the support plate 22 in the sub-scanning direction with respect to the bottom plate 24. Therefore, when the linear motor 23a is operated, the support plate 22 and the mounting table 10 move in the sub-scanning direction along the guide rail 23b on the bottom plate 24.
主掃描機構25具有線性馬達25a,該線性馬達25a藉由安裝於底板24之下表面之動子及敷設於頭支持部140之上表面的定子而產生主掃描方向之推進力。又,主掃描機構25具有相對於頭支持部140而沿主掃描方向導引底板24之一對導軌25b。因此,若使線性馬達25a動作,底板24、支持板22、及載置台10便沿基台130上之導軌25b而於主掃描方向移動。再者,作為此種載置台移動機構20,可使用先前常用之X-Y-θ軸移動機構。 The main scanning mechanism 25 has a linear motor 25a that generates a propulsive force in the main scanning direction by a mover attached to the lower surface of the bottom plate 24 and a stator attached to the upper surface of the head support portion 140. Further, the main scanning mechanism 25 has a pair of guide rails 25b that guide the bottom plate 24 in the main scanning direction with respect to the head supporting portion 140. Therefore, when the linear motor 25a is operated, the bottom plate 24, the support plate 22, and the mounting table 10 are moved in the main scanning direction along the guide rail 25b on the base 130. Further, as such a stage moving mechanism 20, a conventional X-Y-θ axis moving mechanism can be used.
位置參數測量機構30係用於利用雷射光之干渉而測量載置台10之位置參數之機構。位置參數測量機構30主要具有雷射光出射部31、分光器32、彎光器33、第1干渉計34及第2干渉計35。 The position parameter measuring mechanism 30 is a mechanism for measuring the positional parameter of the mounting table 10 by using the dryness of the laser light. The position parameter measuring unit 30 mainly includes a laser light emitting unit 31, a beam splitter 32, a bender 33, a first dry meter 34, and a second dry meter 35.
雷射光出射部31係用於出射測量用之雷射光之光源裝置。雷射光出射部31係設置於固定位置、即設置於相對於本裝置之基台130或光學頭部50固定的位置。自雷射光出射部31出射之雷射光首先入射至分光器32,被分支為自分光器32朝向彎光器33之第1分支光、及自分光器32朝向第2干渉計35之第2分支光。 The laser light emitting portion 31 is a light source device for emitting laser light for measurement. The laser light emitting portion 31 is provided at a fixed position, that is, at a position fixed to the base 130 or the optical head 50 of the device. The laser light emitted from the laser light emitting portion 31 is first incident on the spectroscope 32, branched into the first branch light from the spectroscope 32 toward the bender 33, and the second branch from the spectroscope 32 toward the second dry meter 35. Light.
第1分支光被彎光器33反射,入射至第1干渉計34,且自第1干渉計34照射至載置台10之-Y側之端邊之第1部位(此處,為-Y側之端邊之中央部)10a。然後,於第1部位10a被反射之第1分支光再次入射至第1干渉計34。第1干渉計34基於朝向載置台10之第1分支光與自載置台10反射之第1分支光之干渉,測量與載置台10之第1部位10a之位置對應的位置參數。 The first branch light is reflected by the bender 33, and is incident on the first dry meter 34, and is irradiated from the first dry meter 34 to the first portion on the -Y side of the mounting table 10 (here, the -Y side) The central portion of the end side) 10a. Then, the first branched light reflected by the first portion 10a is again incident on the first dry meter 34. The first dry meter 34 measures the positional parameter corresponding to the position of the first portion 10a of the mounting table 10 based on the first branch light that is directed toward the mounting table 10 and the first branched light that is reflected from the mounting table 10.
另一方面,第2分支光入射至第2干渉計35,且自第2干渉計35照射至載置台10之-Y側之端邊之第2部位(與第1部位10a不同之部 位)10b。然後,於第2部位10b被反射之第2分支光再次入射至第2干渉計35。第2干渉計35基於朝向載置台10之第2分支光與自載置台10反射之第2分支光之干渉,測量與載置台10之第2部位10b之位置對應的位置參數。第1干渉計34及第2干渉計35將藉由各自之測量所取得之位置參數發送至控制部70。 On the other hand, the second branch light is incident on the second dry meter 35, and is irradiated from the second dry meter 35 to the second portion on the -Y side of the mounting table 10 (the portion different from the first portion 10a) Bit) 10b. Then, the second branched light reflected by the second portion 10b is again incident on the second dry meter 35. The second dry meter 35 measures the positional parameter corresponding to the position of the second portion 10b of the mounting table 10 based on the second branch light that is directed toward the mounting table 10 and the second branched light that is reflected from the mounting table 10. The first dry meter 34 and the second dry meter 35 transmit the position parameters obtained by the respective measurements to the control unit 70.
光學頭部50係朝向載置台10上所保持之基板W之表面照射脈衝光之光照射部。樑構件143以跨及載置台10及載置台移動機構20之方式架設於基台130上,光學頭部50係設於樑構件143上之副掃描方向之大致中央。光學頭部50經由照明光學系統53而連接於1個雷射振盪器54。又,作為光源之雷射振盪器54上連接有驅動雷射振盪器54之雷射驅動部55。若使雷射驅動部55動作,便會自雷射振盪器54出射脈衝光,該脈衝光經由照明光學系統53而被導入光學頭部50之內部。 The optical head 50 is a light irradiation portion that irradiates the surface of the substrate W held on the mounting table 10 with pulsed light. The beam member 143 is mounted on the base 130 so as to straddle the mounting table 10 and the stage moving mechanism 20, and the optical head 50 is disposed substantially at the center of the beam member 143 in the sub-scanning direction. The optical head 50 is connected to one laser oscillator 54 via an illumination optical system 53. Further, a laser drive unit 55 that drives the laser oscillator 54 is connected to the laser oscillator 54 as a light source. When the laser driving unit 55 is operated, pulsed light is emitted from the laser oscillator 54, and the pulsed light is introduced into the optical head 50 via the illumination optical system 53.
於光學頭部50之內部,脈衝光自導入部導入而自照明光學系統53導入至光學頭部50之內部,被導入之脈衝光作為成形為特定圖案形狀之光束,向基板W之表面照射脈衝光,對基板W上之光阻膜(感光層)進行曝光,藉此對基板W之表面描繪圖案。 Inside the optical head 50, pulsed light is introduced from the introduction portion, introduced into the optical head 50 from the illumination optical system 53, and the introduced pulsed light is irradiated onto the surface of the substrate W as a light beam shaped into a specific pattern shape. Light is applied to the photoresist film (photosensitive layer) on the substrate W to thereby draw a pattern on the surface of the substrate W.
於圖10之直接描繪裝置100中,作為光源之雷射振盪器54係設於盒體172內,經由照明光學系統53而使來自雷射振盪器54之光導入光學頭部50之內部。本實施形態之基板W之主面上預先形成有因紫外線之照射而感光之光阻(感光性材料)膜,雷射振盪器54係出射波長λ為約365nm之紫外線(i射線)之雷射光源。當然,雷射振盪器54亦可為出射基板W之感光性材料感光之波段所含的其他波長之光者。 In the direct drawing device 100 of FIG. 10, a laser oscillator 54 as a light source is disposed in the casing 172, and light from the laser oscillator 54 is introduced into the optical head 50 via the illumination optical system 53. In the main surface of the substrate W of the present embodiment, a photoresist (photosensitive material) film that is exposed to ultraviolet light is formed in advance, and the laser oscillator 54 emits an ultraviolet (i-ray) laser having a wavelength λ of about 365 nm. light source. Of course, the laser oscillator 54 may also be light of other wavelengths contained in the wavelength band from which the photosensitive material of the substrate W is exposed.
圖12係表示直接描繪裝置100之照明光學系統53及投影光學系統517之圖。來自圖10所示之雷射振盪器54之光經由圖12所示之照明光學系統53及反射鏡516而被照射至光調變單元512之空間光調變器511。經空間光調變器511進行空間調變後之光經由投影光學系統517 而照射至載置台10所支持的基板W上。 FIG. 12 is a view showing the illumination optical system 53 and the projection optical system 517 of the direct drawing device 100. Light from the laser oscillator 54 shown in FIG. 10 is irradiated to the spatial light modulator 511 of the light modulation unit 512 via the illumination optical system 53 and the mirror 516 shown in FIG. The spatially modulated light passing through the spatial light modulator 511 passes through the projection optical system 517. The light is applied to the substrate W supported by the mounting table 10.
照明光學系統53具備遠鏡(telescope)540、聚光透鏡541、消光器542及聚焦透鏡543。遠鏡540具有於X及Z方向擴展光(雷射光束)之光束徑(剖面形狀)之功能,包括3片透鏡。聚光透鏡541具有於X方向擴展雷射光束之功能。消光器542調整要通過之雷射光束之能量(透過量)。聚焦透鏡543具有於Z方向縮小雷射光束之剖面尺寸之功能。自聚焦透鏡543出射之光(雷射光束)經由反射鏡516而於X方向延伸,且作為於Y方向經縮小之線狀之照明光而照射至空間光調變器511。再者,照明光學系統53並非必須如圖12所示般構成,亦可追加其他光學元件。 The illumination optical system 53 includes a telescope 540, a collecting lens 541, an extinction 542, and a focus lens 543. The telescope 540 has a function of expanding the beam diameter (cross-sectional shape) of the light (laser beam) in the X and Z directions, and includes three lenses. The condenser lens 541 has a function of expanding the laser beam in the X direction. The dimmer 542 adjusts the energy (transmission amount) of the laser beam to be passed. The focus lens 543 has a function of reducing the cross-sectional size of the laser beam in the Z direction. The light (laser beam) emitted from the self-focusing lens 543 extends in the X direction via the mirror 516, and is irradiated to the spatial light modulator 511 as the linearly illuminating light in the Y direction. Further, the illumination optical system 53 is not necessarily configured as shown in FIG. 12, and other optical elements may be added.
自照明光學系統53照射至空間調變器511之光較佳為接近平行光,其原因在於,自空間光調變器511反射之正反射光(0次光)通過後述之投影光學系統之遮蔽板521之開口,而自空間光調變器511產生之(±1)次繞射光被遮蔽板521遮蔽。因此,照明光學系統53之數值孔徑NA1設定為大於0(零)且0.06以下。再者,若將於X方向延伸之線狀之照明光貫通YZ平面時之照明光相對於光軸之最大角度設為θ1,則數值孔徑NA1係藉由NA1=n‧sinθ1而求出。其中,n為媒介之折射率,於本實施形態之情形時,媒介為空氣,故而折射率n為1。 The light that is incident on the spatial modulator 511 from the illumination optical system 53 is preferably near-parallel light because the regular reflection light (zero-order light) reflected from the spatial light modulator 511 passes through the shadowing of the projection optical system described later. The opening of the plate 521, and (±1) times of the diffracted light generated from the spatial light modulator 511 is shielded by the shielding plate 521. Therefore, the numerical aperture NA1 of the illumination optical system 53 is set to be greater than 0 (zero) and 0.06 or less. Further, when the maximum angle of the illumination light with respect to the optical axis when the linear illumination light extending in the X direction passes through the YZ plane is θ1, the numerical aperture NA1 is obtained by NA1=n‧sinθ1. Here, n is the refractive index of the medium. In the case of the present embodiment, the medium is air, and therefore the refractive index n is 1.
投影光學系統517具備4片透鏡518、519、520、522、遮蔽板(光圈構件)521、變焦透鏡523及聚焦透鏡524。投影光學系統517之透鏡518、519、520、522及遮蔽板521構築成為兩側遠心(telecentric)的紋影(schrieren)光學系統,通過透鏡520後之光被導入具有開口之遮蔽板521,一部分光(正反射光(0次光))通過開口而被導向透鏡522,剩餘之光((±1)次繞射光)被遮蔽板521遮蔽。通過透鏡522後之光被導向變焦透鏡523,經由聚焦透鏡524而以特定倍率被導向基板W上之光阻膜(感光性材料)。再者,投影光學系統517並非必須如圖12所示般構 成,亦可追加其他光學元件。 The projection optical system 517 includes four lenses 518, 519, 520, and 522, a shielding plate (aperture member) 521, a zoom lens 523, and a focus lens 524. The lenses 518, 519, 520, 522 and the shielding plate 521 of the projection optical system 517 are constructed as two telecentric schrieren optical systems, and the light passing through the lens 520 is guided into the shielding plate 521 having an opening, a part Light (positive reflected light (0th order light)) is guided to the lens 522 through the opening, and the remaining light ((±1) times of diffracted light) is shielded by the shielding plate 521. The light that has passed through the lens 522 is guided to the zoom lens 523, and is guided to the photoresist film (photosensitive material) on the substrate W at a specific magnification via the focus lens 524. Furthermore, the projection optical system 517 does not have to be constructed as shown in FIG. Other optical components can be added.
為了減小與焦點位置(聚焦位置)相應之基板W上照射之光之徑(寬度)之變化,需要將投影光學系統517之景深設定得較長(較深)。因此,投影光學系統517之數值孔徑NA2較佳為較小,例如設定為0.1。再者,若將於X方向延伸之線狀之投影光貫穿YZ平面時之投影光相對於光軸之最大角度設為θ2,則數值孔徑NA2係藉由NA2=n‧sinθ2而求出。其中,n為媒介之折射率,於本實施形態之情形時,由於媒介為空氣,故而折射率n為1。 In order to reduce the change in the diameter (width) of the light irradiated on the substrate W corresponding to the focus position (focus position), it is necessary to set the depth of field of the projection optical system 517 to be long (deep). Therefore, the numerical aperture NA2 of the projection optical system 517 is preferably small, for example, set to 0.1. Further, when the maximum angle of the projection light when the linear projection light extending in the X direction passes through the YZ plane with respect to the optical axis is θ2, the numerical aperture NA2 is obtained by NA2=n‧sinθ2. Here, n is the refractive index of the medium. In the case of the present embodiment, since the medium is air, the refractive index n is 1.
如上述般,為使被空間光調變器511反射之正反射光以所需形狀照射至基板W上,照明光學系統53之數值孔徑NA1除以投影光學系統517之數值孔徑NA2之值(σ值)較佳為接近0,例如設定為大於0且0.6以下。 As described above, in order to illuminate the specular reflected light reflected by the spatial light modulator 511 onto the substrate W in a desired shape, the numerical aperture NA1 of the illumination optical system 53 is divided by the numerical aperture NA2 of the projection optical system 517 (σ). The value) is preferably close to 0, for example, set to be greater than 0 and 0.6 or less.
於空間光調變器511上電性連接有進行光調變單元512之調變控制之描繪控制部515。描繪控制部515及投影光學系統517係內置於光學頭部50中。於描繪控制部515上分別電性連接有曝光控制部514及描繪信號處理部513。曝光控制部514上電性連接有描繪信號處理部513及載置台移動機構20。曝光控制部514及描繪信號處理部513係設於圖10之控制單元70內。 A rendering control unit 515 that performs modulation control of the optical modulation unit 512 is electrically connected to the spatial light modulator 511. The drawing control unit 515 and the projection optical system 517 are built in the optical head 50. The exposure control unit 514 and the rendering signal processing unit 513 are electrically connected to the drawing control unit 515, respectively. The exposure control unit 514 is electrically connected to the drawing signal processing unit 513 and the stage moving mechanism 20. The exposure control unit 514 and the rendering signal processing unit 513 are provided in the control unit 70 of Fig. 10 .
圖13係將空間光調變器511放大而表示之圖。圖13所示之空間光調變器511係利用半導體裝置製造技術而製造,為可變更光柵深度之繞射光柵。於空間光調變器511交替且平行地排列形成有複數個可動帶(ribbon)530a及固定帶531b,如後述般,可動帶530a可相對於背後之基準面而個別地升降移動,固定帶531b相對於基準面而固定。作為繞射光柵型之空間光調變器,例如已知有GLV(Grating Light Valve:光柵光閥)(Silicon Light Machines(聖荷西、加利福尼亞)之註冊商標)。 Fig. 13 is a view showing the spatial light modulator 511 enlarged. The spatial light modulator 511 shown in Fig. 13 is manufactured by a semiconductor device manufacturing technique and is a diffraction grating capable of changing the grating depth. A plurality of movable belts 530a and fixing belts 531b are alternately arranged in parallel with each other in the spatial light modulator 511. As will be described later, the movable belt 530a can be moved up and down individually with respect to the reference plane on the back side, and the fixing belt 531b is fixed. Fixed relative to the reference plane. As a diffraction grating type spatial light modulator, for example, GLV (Grating Light Valve) (registered trademark of Silicon Light Machines (San Jose, California)) is known.
於固定帶531b之上表面設有固定反射面,於可動帶530a之上表面設有可動反射面。於複數個可動帶530a及固定帶531b上,照射光束剖面為排列方向較長之線狀之光。於空間光調變器511中,若將鄰接之各1根可動帶530a及固定帶531b設為1個帶對而作為光柵要素,則相互鄰接之3個以上之光柵要素對應於要描繪之圖案之1個像素。於本實施形態中,相互鄰接之4個光柵要素之集合為對應於1個像素之調變元件,圖13中,構成1個調變元件之帶對集合係由附有符號535之粗線之矩形包圍。 A fixed reflecting surface is provided on the upper surface of the fixing belt 531b, and a movable reflecting surface is provided on the upper surface of the movable belt 530a. The plurality of movable belts 530a and the fixed belt 531b are irradiated with a beam of light having a long line direction. In the spatial light modulator 511, when one adjacent one of the movable belt 530a and the fixed belt 531b is a pair of belt elements, the three or more adjacent grating elements correspond to the pattern to be drawn. One pixel. In the present embodiment, the set of four raster elements adjacent to each other is a modulation element corresponding to one pixel, and in FIG. 13, the pair of bands constituting one modulation element is a thick line with a symbol 535 attached thereto. Surrounded by rectangles.
驅動器電路單元536對可動帶530a與基準面之間賦予電壓(電位差),藉此使可動帶530a向基準面側彎曲。該結果,可動帶530a於遠離基準面之初始位置、與接觸基準面之位置之間升降移動,設定可動帶530a之高度位置。 The driver circuit unit 536 applies a voltage (potential difference) between the movable belt 530a and the reference surface, thereby bending the movable belt 530a toward the reference surface side. As a result, the movable belt 530a moves up and down between the initial position away from the reference surface and the position of the contact reference surface, and sets the height position of the movable belt 530a.
圖10所示之控制部70係用於執行各種演算處理並控制直接描繪裝置100內之各部之動作的資訊處理部。圖14係表示直接描繪裝置100之上述各部與控制部70之間之連接構成的方塊圖。如圖14所示,控制部70係與上述旋轉機構21、線性馬達23a、25a、雷射光出射部31、第1干渉計34、第2干渉計35、照明光學系統53、雷射驅動部55、投影光學系統517及對準相機60電性連接。控制部70例如包括具有CPU及記憶體之電腦,電腦依照安裝於電腦之程式而動作,藉此進行上述各部之動作控制。 The control unit 70 shown in FIG. 10 is an information processing unit for executing various arithmetic processing and controlling the operation of each unit in the direct drawing device 100. FIG. 14 is a block diagram showing a connection configuration between the above-described respective units of the direct drawing device 100 and the control unit 70. As shown in FIG. 14, the control unit 70 is connected to the above-described rotating mechanism 21, linear motors 23a and 25a, laser light emitting unit 31, first dry meter 34, second dry meter 35, illumination optical system 53, and laser drive unit 55. The projection optical system 517 and the alignment camera 60 are electrically connected. The control unit 70 includes, for example, a computer having a CPU and a memory, and the computer operates in accordance with a program installed in the computer, thereby performing operation control of each of the above units.
又,控制部70包含具有CPU及記憶體72等之電腦71、及曝光控制部514。圖15係表示控制描繪動作之控制部之方塊圖。電腦71內之CPU依照特定之程式進行演算處理,藉此實現光柵化部73及資料產生部75。 Further, the control unit 70 includes a computer 71 having a CPU, a memory 72, and the like, and an exposure control unit 514. Fig. 15 is a block diagram showing a control unit for controlling the drawing operation. The CPU in the computer 71 performs arithmetic processing in accordance with a specific program, thereby realizing the rasterizing unit 73 and the data generating unit 75.
例如相當於1個半導體封裝之圖案之資料係藉由外部之CAD等產生之圖案資料,預先作為描繪圖案資料76而於記憶體72中準備。基於 該描繪圖案資料76及資料產生部75而如後述般將半導體封裝之描繪圖案描繪於基板W上。此處,電腦71負責圖15所示之描繪信號處理部513之作用。再者,描繪圖案資料76相當於上述設計資料D0、修正設計資料D1及圓弧區域用資料T1。又,描繪圖案資料76亦存在由上述設計資料D0或修正設計資料D1與圓弧區域用資料T1合成而成之資料之情形。 For example, the data corresponding to the pattern of one semiconductor package is prepared in the memory 72 as the drawing pattern data 76 in advance by the pattern data generated by the external CAD or the like. based on The drawing pattern data 76 and the data generating unit 75 draw a drawing pattern of the semiconductor package on the substrate W as will be described later. Here, the computer 71 is responsible for the role of the drawing signal processing unit 513 shown in FIG. Further, the drawing pattern data 76 corresponds to the design data D0, the corrected design data D1, and the circular area data T1. Further, the drawing pattern data 76 also has a case where the design data D0 or the corrected design data D1 and the circular area data T1 are combined.
光柵化部73將資料產生部75產生之描繪資料所示之單位區域分割並光柵化,產生光柵資料77並保存於記憶體72。如此,於光柵資料77之準備後、或與光柵資料77之準備同時地描繪未處理之基板W。 The rasterizing unit 73 divides and rasterizes the unit area indicated by the drawing data generated by the data generating unit 75, and generates raster data 77 and stores it in the memory 72. Thus, the unprocessed substrate W is rendered after the preparation of the raster data 77 or simultaneously with the preparation of the raster data 77.
以此方式產生之描繪資料係自資料產生部75發送至曝光控制部514,曝光控制部514藉由控制光調變單元512、載置台移動機構20之各部而進行1個條紋之描繪。再者,如圖15所示,曝光控制部514對光調變單元512之控制係經由描繪控制部515而執行。而且,若對1個條紋之曝光記錄結束,便對下一分割區域進行同樣的處理,每個條紋重複一次描繪。本發明之控制部於本實施形態中係藉由控制部70、描繪控制部515、曝光控制部514及驅動器電路單元536等而實現。 The drawing data generated in this manner is sent from the data generating unit 75 to the exposure control unit 514, and the exposure control unit 514 performs drawing of one strip by controlling each of the light modulation unit 512 and the stage moving mechanism 20. Further, as shown in FIG. 15, the exposure control unit 514 controls the light modulation unit 512 via the drawing control unit 515. Further, when the exposure recording of one stripe is completed, the same processing is performed on the next divided area, and each stripe is repeatedly drawn. In the present embodiment, the control unit of the present invention is realized by the control unit 70, the drawing control unit 515, the exposure control unit 514, the driver circuit unit 536, and the like.
又,直接描繪裝置100於每一條紋之描繪動作時,藉由經過圖12所示之描繪控制部515執行之曝光控制部514對光調變單元512之控制,基於按區劃基板W之複數個區塊之每一個而設定的曝光條件,以區塊單位執行曝光動作。 Further, when the direct drawing device 100 performs the drawing operation for each stripe, the exposure control unit 514, which is executed by the drawing control unit 515 shown in FIG. 12, controls the light modulation unit 512 based on the plurality of regions of the substrate W. The exposure conditions set for each of the blocks perform the exposure operation in block units.
又,直接描繪裝置100例如執行對上述第1實施例、第2實施例或第3實施例設定之第1至第8圓弧帶狀區域E1至E8的描繪動作。該等圓弧帶狀區域為例如形成鍍敷用電極之區域,且為於之後的顯影處理步驟中除去光阻膜之區域。於光阻膜為正型之情形時,直接描繪裝置100將上述圓弧帶狀區域作為描繪區域,利用光束進行掃描而使位於該區域之光阻膜曝光。於光阻膜為負型之情形時,直接描繪裝置100 將上述圓弧帶狀區域作為非描繪區域,不進行光束掃描,不使位於該區域之光阻膜曝光。 Further, the direct drawing device 100 performs a drawing operation on the first to eighth arc-shaped strip regions E1 to E8 set in the first embodiment, the second embodiment, or the third embodiment, for example. These arc-shaped strip-shaped regions are, for example, regions where the plating electrodes are formed, and are regions where the photoresist film is removed in the subsequent development processing step. When the photoresist film is a positive type, the direct drawing device 100 uses the arcuate strip-shaped region as a drawing region, and scans the light beam to expose the photoresist film located in the region. When the photoresist film is in a negative type, the device 100 is directly drawn. The arc-shaped strip-shaped region is used as a non-drawing region, and beam scanning is not performed, and the photoresist film located in the region is not exposed.
於圓弧帶狀區域為上述編號區域之情形時,為使位於編號區域內之雷射刻印於之後的步驟中不破損,考慮光阻膜為正型還是負型、及之後的步驟之製程處理等,將圓弧帶狀區域作為描繪區域或非描繪區域而執行描繪處理。 In the case where the arc-shaped strip-shaped region is the above-mentioned numbered region, in order to prevent the laser light located in the numbered region from being damaged in the subsequent step, whether the photoresist film is positive or negative, and the subsequent processing steps are considered. Etc., the arc band region is used as the drawing region or the non-drawing region, and the drawing process is performed.
於本實施形態中,圖15所示之電腦71係設於直接描繪裝置100,但亦可將該電腦71設於圖1所示之圖像處理裝置3內。 In the present embodiment, the computer 71 shown in FIG. 15 is provided in the direct drawing device 100. However, the computer 71 may be provided in the image processing device 3 shown in FIG. 1.
該直接描繪裝置100具有基於上述第1干渉計34、第2干渉計35之各測量結果而控制載置台10之位置的功能。以下,對此種載置台10之位置控制進行說明。 The direct drawing device 100 has a function of controlling the position of the mounting table 10 based on the respective measurement results of the first dry meter 34 and the second dry meter 35. Hereinafter, the position control of the above-described mounting table 10 will be described.
如上所述,第1干渉計34及第2干渉計35分別測量與載置台10之第1部位10a及第2部位10b之位置對應的位置參數。第1干渉計34及第2干渉計35將藉由各自之測量所取得之位置參數發送至控制部70。如圖15所示,控制部70具有作為算出部之電腦71。該電腦71之功能係藉由例如電腦71之CPU依照特定之程式進行動作而實現。 As described above, the first dry meter 34 and the second dry meter 35 measure positional parameters corresponding to the positions of the first portion 10a and the second portion 10b of the mounting table 10, respectively. The first dry meter 34 and the second dry meter 35 transmit the position parameters obtained by the respective measurements to the control unit 70. As shown in FIG. 15, the control unit 70 has a computer 71 as a calculation unit. The function of the computer 71 is realized by, for example, the CPU of the computer 71 operating in accordance with a specific program.
另一方面,控制部70基於自第1干渉計34及第2干渉計35發送之位置參數,算出載置台10之位置(Y軸方向之位置及繞Z軸之旋轉角度)。其次,控制部70參照所算出之載置台10之位置,並使載置台移動機構20動作,藉此準確地控制載置台10之位置及載置台10之移動速度。此處,控制部70亦藉由使載置台10繞Z軸旋轉,而校正伴隨主掃描方向之移動之載置台10之傾斜(繞Z軸之旋轉角度之偏離)。又,控制部70參照所算出之載置台10之位置,並使雷射驅動部55動作,藉此準確地控制脈衝光對基板W之表面之照射位置。 On the other hand, the control unit 70 calculates the position (the position in the Y-axis direction and the rotation angle around the Z-axis) of the mounting table 10 based on the positional parameters transmitted from the first dry meter 34 and the second dry meter 35. Next, the control unit 70 refers to the calculated position of the stage 10 and operates the stage moving mechanism 20, thereby accurately controlling the position of the stage 10 and the moving speed of the stage 10. Here, the control unit 70 also corrects the inclination of the stage 10 (the deviation of the rotation angle around the Z axis) by the movement of the stage 10 by rotating the stage 10 around the Z axis. Moreover, the control unit 70 refers to the calculated position of the mounting table 10 and operates the laser driving unit 55, thereby accurately controlling the irradiation position of the pulse light on the surface of the substrate W.
繼而,參照圖16之流程圖,對上述直接描繪裝置100之動作之一例進行說明。 Next, an example of the operation of the direct drawing device 100 will be described with reference to the flowchart of Fig. 16 .
於直接描繪裝置100中進行基板W之處理時,首先進行對自光學頭部50照射之脈衝光之位置及光量進行調整的校準處理(步驟S1)。於校準處理中,首先藉由移動底板24而將未圖示之CCD相機配置於光學頭部50之下方。然後,使CCD相機於副掃描方向移動並自光學頭部50照射脈衝光,藉由CCD相機拍攝所照射之脈衝光。控制部70基於所取得之圖像資料,使光學頭部50之照明光學系統53動作,藉此調整自光學頭部50照射之脈衝光之位置及光量。 When the processing of the substrate W is performed in the direct drawing device 100, first, a calibration process for adjusting the position and amount of the pulsed light irradiated from the optical head 50 is performed (step S1). In the calibration process, first, a CCD camera (not shown) is placed below the optical head 50 by moving the bottom plate 24. Then, the CCD camera is moved in the sub-scanning direction and the pulsed light is irradiated from the optical head 50, and the pulsed light is irradiated by the CCD camera. The control unit 70 operates the illumination optical system 53 of the optical head 50 based on the acquired image data, thereby adjusting the position and amount of the pulsed light irradiated from the optical head 50.
若校準處理完成,接下來搬送機器人120搬入基板W並將其載置於載置台10之上表面(步驟S2)。 When the calibration process is completed, the transfer robot 120 carries the substrate W and places it on the upper surface of the mounting table 10 (step S2).
繼而,直接描繪裝置100進行對載置於載置台10上之基板W與光學頭部50之相對位置進行調整的對準處理(步驟S3)。於上述步驟S2中,基板W係載置於載置台10上之大致特定位置,但大多情形時作為用於描繪微細圖案之位置精度而言並不足夠。因此,藉由進行對準處理而對基板W之位置及傾斜進行微調整,提高後續之描繪處理之精度。 Then, the direct drawing device 100 performs alignment processing for adjusting the relative positions of the substrate W placed on the mounting table 10 and the optical head 50 (step S3). In the above step S2, the substrate W is placed at a substantially specific position on the mounting table 10, but in many cases, it is not sufficient as the positional accuracy for drawing the fine pattern. Therefore, the position and the inclination of the substrate W are finely adjusted by the alignment process, and the accuracy of the subsequent drawing process is improved.
於對準處理中,首先,藉由對準相機60分別拍攝形成於基板W之上表面之四角的對準標記。控制部70基於由對準相機60所取得之圖像中之各對準標記之位置,算出與基板W之理想位置之偏離量(X軸方向之位置偏離量、Y軸方向之位置偏離量、及繞Z軸之傾斜量)。然後,使載置台移動機構20於減少所算出之偏離量之方向動作,來校正基板W之位置。 In the alignment process, first, the alignment marks formed on the four corners of the upper surface of the substrate W are respectively taken by the alignment camera 60. The control unit 70 calculates the amount of deviation from the ideal position of the substrate W based on the position of each of the alignment marks in the image obtained by the alignment camera 60 (the amount of positional deviation in the X-axis direction, the amount of positional deviation in the Y-axis direction, and And the amount of tilt around the Z axis). Then, the stage moving mechanism 20 is operated in the direction of reducing the calculated amount of deviation to correct the position of the substrate W.
接著,直接描繪裝置100對經對準處理後之基板W進行描繪處理(步驟S4)。即,直接描繪裝置100使載置台10於主掃描方向及副掃描方向移動,並自光學頭部50朝向基板W之上表面照射脈衝光,藉此於 基板W之上表面按區劃基板W內之複數個區塊的每一個而描繪規則性圖案。又,對上述圓弧帶狀區域E1至E8執行描繪動作。 Next, the direct drawing device 100 performs drawing processing on the aligned substrate W (step S4). That is, the direct drawing device 100 moves the mounting table 10 in the main scanning direction and the sub-scanning direction, and irradiates the pulsed light from the optical head 50 toward the upper surface of the substrate W, thereby The upper surface of the substrate W depicts a regular pattern by arranging each of the plurality of blocks within the substrate W. Further, a drawing operation is performed on the arcuate strip-shaped regions E1 to E8.
若描繪處理完成,則直接描繪裝置100使載置台移動機構20動作而使載置台10及基板W移動至搬出位置。然後,搬送機器人120自載置台10之上表面搬出基板W(步驟S5)。 When the drawing process is completed, the direct drawing device 100 operates the stage moving mechanism 20 to move the stage 10 and the substrate W to the carry-out position. Then, the transport robot 120 carries out the substrate W from the upper surface of the mounting table 10 (step S5).
於上述實施形態之直接描繪裝置100中,構成為使基板W相對於光學頭部50等而移動,但亦可使光學頭部50等相對於被固體支持之基板W而移動,實現相對移動。 In the direct drawing device 100 of the above-described embodiment, the substrate W is moved relative to the optical head 50 or the like. However, the optical head 50 or the like can be moved relative to the substrate W supported by the solid to achieve relative movement.
90‧‧‧輸入區域 90‧‧‧Input area
91‧‧‧「No.」欄 91‧‧‧"No." column
92‧‧‧「θ」欄 92‧‧‧"θ" column
93‧‧‧「R0」欄 93‧‧‧"R0" column
94‧‧‧「內」欄 94‧‧‧"Inside" column
95‧‧‧「外」欄 95‧‧‧"Outside" column
96‧‧‧「曝光」欄 96‧‧‧"Exposure" column
97‧‧‧單選按鈕 97‧‧‧ radio button
98‧‧‧單選按鈕 98‧‧‧ radio button
99‧‧‧「弧長」欄 99‧‧‧"Arc length" column
Ct‧‧‧基板之中心 Center of Ct‧‧‧ substrate
E1、E2‧‧‧圓弧帶狀區域 E1, E2‧‧‧ arc band
L3‧‧‧假想圓 L3‧‧‧ imaginary circle
R0‧‧‧假想線 R0‧‧‧ imaginary line
R1‧‧‧假想線 R1‧‧‧ imaginary line
R2‧‧‧假想線 R2‧‧‧ imaginary line
R3‧‧‧假想線 R3‧‧‧ imaginary line
t1‧‧‧寬度尺寸 Width of t1‧‧‧
WO‧‧‧外形線 WO‧‧‧ outline
Claims (11)
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| JP2014036513A JP6280392B2 (en) | 2014-02-27 | 2014-02-27 | GUI apparatus for direct drawing apparatus, direct drawing system, drawing area setting method and program |
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| TWI526865B true TWI526865B (en) | 2016-03-21 |
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| JP (1) | JP6280392B2 (en) |
| KR (1) | KR101917014B1 (en) |
| CN (1) | CN105981096B (en) |
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| WO (1) | WO2015129341A1 (en) |
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| JP2024044259A (en) * | 2022-09-21 | 2024-04-02 | 株式会社Screenホールディングス | Drawing system and method |
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| JPH08162386A (en) * | 1994-12-01 | 1996-06-21 | Nikon Corp | Resist exposure apparatus and method for adjusting the apparatus |
| JPH0950951A (en) * | 1995-08-04 | 1997-02-18 | Nikon Corp | Lithographic method and lithographic apparatus |
| JPH0997761A (en) * | 1995-09-28 | 1997-04-08 | Dainippon Screen Mfg Co Ltd | Wafer periphery exposure system |
| JP3127795B2 (en) * | 1995-10-04 | 2001-01-29 | ウシオ電機株式会社 | Wafer peripheral exposure method and apparatus |
| JP2665487B2 (en) * | 1995-10-18 | 1997-10-22 | 大日本スクリーン製造株式会社 | Wafer peripheral exposure system |
| JP2000232045A (en) * | 1999-02-12 | 2000-08-22 | Tokyo Electron Ltd | Forming method of resist pattern |
| JP2005005462A (en) | 2003-06-11 | 2005-01-06 | Shinko Electric Ind Co Ltd | Electrode forming method for plating |
| JP4317488B2 (en) * | 2004-05-28 | 2009-08-19 | 株式会社オーク製作所 | Exposure apparatus, exposure method, and exposure processing program |
| JP4795886B2 (en) * | 2006-07-27 | 2011-10-19 | 株式会社キーエンス | Laser processing device, laser processing condition setting device, laser processing condition setting method, laser processing condition setting program |
| US20090036030A1 (en) * | 2007-08-03 | 2009-02-05 | Winbond Electronics Corp. | Polishing head and chemical mechanical polishing process using the same |
| JP5211630B2 (en) * | 2007-10-15 | 2013-06-12 | 新日鐵住金株式会社 | Ignition furnace of sintering machine, method of adjusting furnace temperature in ignition furnace |
| JP5801674B2 (en) | 2011-09-30 | 2015-10-28 | 株式会社Screenホールディングス | Image display device and program for direct drawing device |
| JP6200253B2 (en) * | 2013-09-26 | 2017-09-20 | 株式会社Screenホールディングス | GUI apparatus for exposure apparatus, exposure system, exposure condition setting method, and program |
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| CN105981096B (en) | 2018-07-24 |
| JP2015162059A (en) | 2015-09-07 |
| TW201543244A (en) | 2015-11-16 |
| WO2015129341A1 (en) | 2015-09-03 |
| KR20160090902A (en) | 2016-08-01 |
| JP6280392B2 (en) | 2018-02-14 |
| KR101917014B1 (en) | 2018-11-08 |
| CN105981096A (en) | 2016-09-28 |
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