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TWI525213B - Method of making enamel layer - Google Patents

Method of making enamel layer Download PDF

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TWI525213B
TWI525213B TW099139377A TW99139377A TWI525213B TW I525213 B TWI525213 B TW I525213B TW 099139377 A TW099139377 A TW 099139377A TW 99139377 A TW99139377 A TW 99139377A TW I525213 B TWI525213 B TW I525213B
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layer
decane
high carbon
substrate
ruthenium
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TW201137169A (en
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史蒂芬 偉伯
麥瑟斯 帕茲
倫哈德 卡魯斯
托斯坦 布朗格
麥克 科洛
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贏創德固賽有限責任公司
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    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
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Description

矽層之製法 Method of making enamel layer

本發明係關於自可自非環狀矽烷製造的高碳矽烷製造矽層之液相方法。 The present invention relates to a liquid phase process for producing a ruthenium layer from a high carbon decane which can be produced from a non-cyclic decane.

矽層之合成在半導體工業上極為重要,特別是用以製造電子或光電子組件層,例如用以製造太陽能電池、光二極體和電晶體。 The synthesis of tantalum layers is extremely important in the semiconductor industry, particularly for the fabrication of electronic or optoelectronic component layers, such as for the fabrication of solar cells, photodiodes and transistors.

基本上可經由許多方法製造矽層。但是,其中,噴濺技術的缺點在於它們必須於高真空下進行。氣相澱積法具有其他的缺點在於i)在熱反應情況中,它們須使用極高溫度或ii)在引入之用以先質之分解所須的能量係電磁射線形式時,它們須使用高能量密度。這兩種情況中,僅能夠以極高的設備複雜性以經控制和均勻的方式,引入分解先質所須的能量。由於製造矽層的其他方法亦有缺點,因此,矽層較佳經由自液相沉積而形成。 The ruthenium layer can basically be made by a number of methods. However, among them, spattering techniques have the disadvantage that they must be carried out under high vacuum. Vapor deposition methods have other disadvantages in that i) in the case of thermal reactions, they must be used at very high temperatures or ii) they must be used in the form of energy-based electromagnetic radiation that is required for the decomposition of precursors. Energy Density. In both cases, the energy required to decompose the precursor can only be introduced in a controlled and uniform manner with extremely high equipment complexity. Since other methods of fabricating the tantalum layer also have disadvantages, the tantalum layer is preferably formed by deposition from a liquid phase.

在此製造矽層的液相方法中,液態反應物(選擇性地作為其他添加劑和/或摻雜劑的溶劑)或含有反應物(其本身為液體或固體)(及選擇性的其他添加劑和/或摻雜劑)的液態溶液施用至待塗覆的基板,然後以熱和/或電磁射線轉化成矽層。 In this liquid phase process for producing a ruthenium layer, a liquid reactant (optionally as a solvent for other additives and/or dopants) or a reactant (which is itself a liquid or a solid) (and other additives of selectivity and The liquid solution of the / or dopant) is applied to the substrate to be coated and then converted into a layer of ruthenium by heat and/or electromagnetic radiation.

此處,較佳使用的反應物係氫矽烷。這些化合物基本上由矽和氫原子所組成且具有的優點在於它們反應轉化而 提供經澱積的矽(可能有殘留氫含量有利於電子性質)和氣態氫。 Here, the reactant which is preferably used is hydrohalane. These compounds consist essentially of hydrazine and hydrogen atoms and have the advantage that they react and convert Provided by the deposition of ruthenium (possibly having residual hydrogen content favoring electronic properties) and gaseous hydrogen.

以前技術特別包括用以自環狀矽烷(包括螺化合物)或自高碳矽烷(低聚物,其可自環狀矽烷(包括螺化合物)製造)製造矽層的液相方法。 The prior art specifically includes a liquid phase process for producing a ruthenium layer from a cyclic decane (including a spiro compound) or from a high carbon decane (an oligomer which can be produced from a cyclic decane (including a spiro compound).

例如,EP 1 134 224 A2描述在基板表面上製造矽膜之方法,其中含有環戊矽烷和矽基環戊矽烷或螺[4.4]壬矽烷的溶液施用至基板表面以形成塗膜,且該塗膜於之後藉加熱轉化成矽膜。此方法中,發現矽基環戊矽烷和螺[4.4]壬矽烷具有作為用於環戊矽烷之自由基聚合反應引發劑的性質或本身聚合並開環,使得能夠使用矽基環戊矽烷和螺[4.4]壬矽烷或其與環戊矽烷之混合物,選擇性地在先以UV光照射之後,經由熱法(熱轉化)製造矽層。所描述的熱轉化時間為30秒至30分鐘,溫度超過300℃,較佳400-500℃。 For example, EP 1 134 224 A2 describes a method of producing a ruthenium film on a surface of a substrate, wherein a solution containing cyclopentane and decylcyclopentane or spiro[4.4] decane is applied to the surface of the substrate to form a coating film, and the coating is applied. The film is then converted to a ruthenium film by heating. In this method, it has been found that mercaptocyclopentane and spiro[4.4]nonane have properties as a radical polymerization initiator for cyclopentane or are themselves polymerized and ring-opened, enabling the use of mercaptocyclopentane and snails. [4.4] decane or a mixture thereof with cyclopentane, which is selectively subjected to thermal light (thermal conversion) after first irradiation with UV light. The described thermal conversion time is from 30 seconds to 30 minutes, and the temperature exceeds 300 ° C, preferably from 400 to 500 ° C.

所用的環狀化合物的開環聚合反應基本上形成直鏈低聚物。但是,這些基本上直鏈的低聚物之缺點在於,由於它們僅可於極窄的分子量範圍內用以製造矽層:分子量過低導致潤濕欠佳或不潤濕。分子量過高導致組成物不安定,自彼形成過大的低聚物沉澱物且無法得到良好潤濕和均勻的層。如同所述之用以自環狀矽烷或可自彼製得的高碳矽烷(低聚物)製造矽層的液相方法,以前技術亦描述用以自直鏈矽烷(選擇性地與環狀矽烷合併)或可自彼製造的高碳矽烷(低聚物)製造矽層之方法。 The ring-opening polymerization of the cyclic compound used substantially forms a linear oligomer. However, these substantially linear oligomers have the disadvantage that they can be used to make tantalum layers only in a very narrow molecular weight range: too low molecular weight results in poor or no wetting. Too high a molecular weight results in a composition that is unstable, from which an excessive oligomer precipitate is formed and a layer that is well wetted and uniform is not obtained. A liquid phase process for producing a ruthenium layer from a cyclic decane or a high carbon decane (oligomer) which can be prepared from the same, as described in the prior art for self-linear decane (optionally and cyclically). A method in which a ruthenium layer is combined with a high carbon decane (oligomer) which can be produced from the same.

例如,JP 07-267621 A描述用以在基板上熱製造矽層之方法,其中使用式SimH2m+2(其中m≧5)或式SinH2n(其中n≧4)的液態矽烷。藉其中所述方法可製造的矽層可為非晶狀或多晶狀。其中所述的轉化溫度係溫度為200-550℃以得到非晶狀矽層。高於550℃,應得到多晶狀層。 低於200℃,據稱轉化為矽將不完全。此實例描述轉化時間為30分鐘(300℃;350℃;450℃)和60分鐘(700℃)。 For example, JP 07-267621 A describes a method for thermally producing a tantalum layer on a substrate, wherein a liquid decane of the formula Si m H 2m+2 (where m≧5) or Si n H 2n (where n≧4) is used. . The tantalum layer which can be produced by the method described therein may be amorphous or polycrystalline. The conversion temperature is 200-550 ° C to obtain an amorphous ruthenium layer. Above 550 ° C, a polycrystalline layer should be obtained. Below 200 ° C, it is said that conversion to hydrazine will be incomplete. This example describes a conversion time of 30 minutes (300 ° C; 350 ° C; 450 ° C) and 60 minutes (700 ° C).

JP 09-045922 A亦描述一種在基板上製造多晶狀矽層之方法,其中式SimH2m+2(其中m≧5)或式SinH2n(其中n≧4)的矽烷用於照射法。文中所述轉化溫度為200-550℃。低於200℃,據稱轉化為矽將不完全。此實例描述在氫電漿下的轉化時間為30分鐘(350℃;480℃)。 JP 09-045922 A also describes a method for producing a polycrystalline tantalum layer on a substrate, wherein a silane of the formula Si m H 2m+2 (where m≧5) or of the formula Si n H 2n (where n≧4) is used Irradiation method. The conversion temperature described herein is from 200 to 550 °C. Below 200 ° C, it is said that conversion to hydrazine will be incomplete. This example describes a conversion time of 30 minutes (350 ° C; 480 ° C) under hydrogen plasma.

US 5,866,471 A尤其描述使用直鏈或環狀氫矽烷和經矽基取代的直鏈或環狀氫矽烷,其可熱分解提供半導體膜。所述基板於室溫為固體,可溶於有機溶劑且具有聚合度較佳為3-10,000,更佳為5-30。它們另較佳於200至700℃熱分解,硬化時間由10分鐘至10小時。 No. 5,866,471 A describes, inter alia, a linear or cyclic hydrodecane substituted with a linear or cyclic hydrohalane and a mercapto group which is thermally decomposable to provide a semiconductor film. The substrate is solid at room temperature, soluble in an organic solvent and has a degree of polymerization of preferably from 3 to 10,000, more preferably from 5 to 30. They are further preferably thermally decomposed at 200 to 700 ° C, and the hardening time is from 10 minutes to 10 hours.

US 5,700,400 A描述用以製造半導體材料之方法,其中將氫矽烷單體予以去氫縮合,之後,其中間產物藉熱分解。此氫矽烷單體可為單矽烷、二矽烷或三矽烷衍生物。 熱分解係於溫度200-1000℃,較佳200-700℃進行。實例中指明的轉化時間由1小時(700℃)至24小時(200℃)。 No. 5,700,400 A describes a process for the manufacture of a semiconductor material in which a hydroquinone monomer is subjected to dehydrogenation condensation, after which the intermediate product is thermally decomposed. The hydrodecane monomer may be a monodecane, dioxane or trioxane derivative. The thermal decomposition is carried out at a temperature of from 200 to 1000 ° C, preferably from 200 to 700 ° C. The conversion time indicated in the examples ranged from 1 hour (700 °C) to 24 hours (200 °C).

EP 1 085 560 A1的經驗指出使用式SinXm(n≧5且m=n 、2n-2或2n)的環狀矽烷化合物和/或式SiaXbYc(其中a≧3,b=a至2a+c+2,c=1至a)之經改質的矽烷以使用熱和/或光製造矽膜。此可提供非晶狀或多晶狀層。在乾燥之後,藉至多550℃的轉化溫度,可以得到多晶狀層,且在乾燥之後,藉高於550℃的轉化溫度可得到多晶狀層。此實例描述轉化時間為30分鐘(300℃)。 The experience of EP 1 085 560 A1 teaches the use of cyclic decane compounds of the formula Si n X m (n≧5 and m=n, 2n-2 or 2n) and/or of the formula Si a X b Y c (where a≧3, The modified decane of b = a to 2a + c + 2, c = 1 to a) is used to make a ruthenium film using heat and/or light. This can provide an amorphous or polycrystalline layer. After drying, a polycrystalline layer can be obtained by a conversion temperature of up to 550 ° C, and after drying, a polycrystalline layer can be obtained by a conversion temperature higher than 550 ° C. This example describes a conversion time of 30 minutes (300 ° C).

EP 1 085 579 A1描述製造太陽能電池的方法,其中使用含有矽烷的液態組成物並藉熱、光和/或雷射處理轉化。此液態塗覆組成物可含有溶劑和式SinXm(X=H、Hal,n≧5,m=n、2n-2、2n)的環狀矽化合物或式SiaXbYc(其中X=H、Hal,Y=B、P,a≧3,c=1至a且b=a至2a+c+2)之經改質的矽烷。此塗覆組成物轉化成矽烷可藉乾燥步驟之後的轉化步驟達成。指明典型的乾燥溫度在100-200℃範圍內。此處亦陳述僅自300℃明顯轉化得到矽層,300℃至550℃得到非晶狀層,且550℃得到多晶狀層。未報導轉化時間。 EP 1 085 579 A1 describes a process for the production of solar cells in which a liquid composition containing decane is used and converted by heat, light and/or laser treatment. The liquid coating composition may contain a solvent and a cyclic oxime compound of the formula Si n X m (X=H, Hal, n≧5, m=n, 2n-2, 2n) or a formula Si a X b Y c ( Modified decane wherein X = H, Hal, Y = B, P, a ≧ 3, c = 1 to a and b = a to 2a + c + 2). The conversion of this coating composition to decane can be achieved by a conversion step after the drying step. Indicates that the typical drying temperature is in the range of 100-200 °C. It is also stated herein that the ruthenium layer is only significantly converted from 300 ° C, the amorphous layer is obtained from 300 ° C to 550 ° C, and the polycrystalline layer is obtained at 550 ° C. Conversion time not reported.

EP 1 087 428 A1描述含有矽先質的墨組成物,其矽膜可藉印刷法製造。其中所述矽先質係式(I)SinXm(其中n≧3,m=n、2n-2、2n或2n+2且X=H和/或Hal)或(II)式SiaXbYc(其中X=H和/或Hal,Y=B、P,a≧3,b=a至2a+c+2,c=1至a)化合物,其可單獨使用或以混合物使用。式(I)的環狀化合物為較佳者。使用熱和/或光可製造矽膜。使用熱時,此轉化基本上於溫度為100-800℃進行。此可提供非晶狀或多晶狀層。藉至高550℃的轉化溫 度可得到非晶狀層,且藉高於550℃的轉化溫度可得到多晶狀層。低於300℃未轉化。此實例描述的轉化時間是30分鐘。 EP 1 087 428 A1 describes an ink composition containing a ruthenium precursor, the ruthenium film of which can be produced by printing. Wherein the yttrium is of the formula (I) Si n X m (where n ≧ 3, m=n, 2n-2, 2n or 2n+2 and X=H and/or Hal) or (II) Si a X b Y c (wherein X = H and / or Hal, Y = B, P, a ≧ 3, b = a to 2a + c + 2, c = 1 to a) compounds, which may be used alone or in a mixture . The cyclic compound of the formula (I) is preferred. A ruthenium film can be made using heat and/or light. When heat is used, this conversion is carried out essentially at a temperature of from 100 to 800 °C. This can provide an amorphous or polycrystalline layer. An amorphous layer can be obtained by a conversion temperature of 550 ° C, and a polycrystalline layer can be obtained by a conversion temperature higher than 550 ° C. Less than 300 ° C is not converted. The conversion time described by this example is 30 minutes.

EP 1 357 154 A1描述“高碳矽烷”組成物,其含有藉由以UV射線照射光可聚合的矽烷而可製造的聚矽烷。此光可聚合的矽烷可為通式SinXm(其中n≧3,m≧4,X=H、Hal)的矽烷,例子指明的化合物係式SinX2n的環狀矽烷或SinH2n-2的二或多環狀結構,及分子中具有環狀結構的其他矽烷,其對於光具有極高的反應性且有效率地光聚合。 此“高碳矽烷”組成物可以在基板上藉熱分解反應或光分解反應轉化成矽膜。就此目的,此潤濕的膜藉熱(基本上100-200℃)乾燥且然後藉熱和/或光轉化。藉由溫度低於550℃的熱處理可得到非晶狀膜;於較高溫度,結果係多晶狀膜。此實例報導轉化時間為10分鐘(350℃,400℃,500℃)。 EP 1 357 154 A1 describes a "high carbon decane" composition comprising a polydecane which can be produced by irradiating a photopolymerizable decane with UV radiation. The photopolymerizable decane may be a decane of the formula Si n X m (where n ≧ 3, m ≧ 4, X = H, Hal), and the compound specified by the example is a cyclic decane or Si n of the formula Si n X 2n . A di- or polycyclic structure of H 2n-2 , and other decane having a cyclic structure in the molecule, which is highly reactive to light and efficiently photopolymerized. This "high carbon decane" composition can be converted into a ruthenium film by a thermal decomposition reaction or a photodecomposition reaction on a substrate. For this purpose, the wet film is dried by heat (essentially 100-200 ° C) and then converted by heat and/or light. An amorphous film can be obtained by heat treatment at a temperature lower than 550 ° C; at a higher temperature, a polycrystalline film is obtained. This example reported a conversion time of 10 minutes (350 ° C, 400 ° C, 500 ° C).

JP 2004-134440 A1係關於在矽層製造中,矽烷組成物之照射。使用的矽烷組成物可為(i)式SinRm(其中n≧11且m=n至(2n+2),其中R可為H)的矽烷,或(ii)式SiiH2i+2(其中i=2-10)、SijH2j(其中j=3-10)或SikHk(其中k=6、8或10)的矽烷,各情況中,與選自環戊矽烷、環己矽烷和矽基環戊矽烷的至少一種矽烷合併。所述矽烷每一者可為鏈接、環狀或籠形式。照光時間約0.1至30分鐘,且照射期間內的溫度可為室溫至300℃。此方法提供矽膜生成物,其可藉100-1000℃,較佳200-850℃,更佳 300-500℃轉化成矽膜。當選用的轉化溫度高於550℃,亦得到多晶狀矽層。低於300℃,膜之形成不完全。實例報導轉化時間為30分鐘(400℃)、60分鐘(300℃,250℃)。 JP 2004-134440 A1 relates to the irradiation of a decane composition in the production of tantalum. The decane composition used may be (i) a silane of the formula Si n R m (where n ≧ 11 and m = n to (2n + 2), where R may be H), or (ii) a formula Si i H 2i+ 2 (where i = 2-10), Si j H 2j (where j = 3-10) or Si k H k (where k = 6, 8 or 10) of decane, in each case, selected from cyclopentane And at least one decane of cyclohexanane and decylcyclopentane is combined. Each of the decanes may be in the form of a link, a ring or a cage. The illumination time is about 0.1 to 30 minutes, and the temperature during the irradiation may be from room temperature to 300 °C. This method provides a ruthenium film product which can be converted into a ruthenium film by 100-1000 ° C, preferably 200-850 ° C, more preferably 300-500 ° C. When the conversion temperature selected is higher than 550 ° C, a polycrystalline ruthenium layer is also obtained. Below 300 ° C, the formation of the film is incomplete. The example reported a conversion time of 30 minutes (400 ° C), 60 minutes (300 ° C, 250 ° C).

但是,所述的所有這些方法的共同特徵在於它們導致欠佳的光學和電性質。矽層之光學和電性質的指標,更特別是其光導電性的指標,可為吸收係數α,其可經由PDS分析,在中間能隙(就Si而言為1.2電子伏特)測定。通常,低α值代表良好的電和光學性質,而高α值代表欠佳的電和光學性質。此α值可以視為所得層中之帶隙中的狀態(中間能隙狀態)的頻率。在帶隙中的狀態(中間能隙狀態)係在帶隙中的電子狀態,此狀態使得半導體材料的電性質變差,例如,電荷載體的光導電性和壽命,此因它們作為電子阱並因此,例如,降低用於光電流的電荷載體的產率之故。這些狀態通常為不飽和的矽鍵(‘懸空鍵’)。 However, a common feature of all of these methods is that they result in poor optical and electrical properties. The index of the optical and electrical properties of the ruthenium layer, and more particularly the index of its photoconductivity, can be the absorption coefficient α, which can be determined by PDS analysis in the intermediate energy gap (1.2 electron volts for Si). Generally, low alpha values represent good electrical and optical properties, while high alpha values represent poor electrical and optical properties. This alpha value can be regarded as the frequency of the state (intermediate energy gap state) in the band gap in the resulting layer. The state in the band gap (intermediate energy gap state) is an electronic state in the band gap, which deteriorates the electrical properties of the semiconductor material, for example, the photoconductivity and lifetime of the charge carriers, since they act as electron traps Therefore, for example, the yield of the charge carrier for photocurrent is lowered. These states are usually unsaturated 矽 bonds ('dangling keys').

因此,本發明之目的係提供一種用於製造矽層之液相方法,其避免以前技術的所示缺點。更特別地,應提供一種用以製造矽層之液相方法,其中,所用調合物是安定的且充分潤濕基板,且其得到具有較佳電和光學性質的均勻矽層。其亦特別有利地,能夠製造具有較低吸收係數α(針對aSi:H,其可經由PDS測量,於1.2電子伏特測定)的aSi:H層。 Accordingly, it is an object of the present invention to provide a liquid phase process for making a tantalum layer that avoids the disadvantages of the prior art. More particularly, a liquid phase process for making a tantalum layer should be provided wherein the blend used is stable and sufficiently wets the substrate and which results in a uniform tantalum layer having better electrical and optical properties. It is also particularly advantageous to be able to produce an aSi:H layer having a lower absorption coefficient α (measured by PDS, measured at 1.2 electron volts for aSi:H).

於本情況中,藉由本發明之用於在基板上熱製造矽層之液相方法,達到此目的,其中將由至少一種通式SiaH2a+2(其中a=3-10)的氫矽烷所製造的至少一種高碳矽烷施用至基板,並然後藉熱轉化成基本上包含矽的層,其中該高碳矽烷於溫度為500-900℃及轉化時間≦5分鐘,予以熱轉化。令人驚訝地,此亦能夠得到純度特別良好的矽層。 In this case, the object is achieved by the liquid phase process of the invention for thermally producing a ruthenium layer on a substrate, wherein at least one hydroquinone of the formula Si a H 2a+2 (where a = 3-10) is used. The at least one high carbon decane produced is applied to the substrate and then converted by heat into a layer substantially comprising ruthenium, wherein the high carbon decane is thermally converted at a temperature of 500-900 ° C and a conversion time of 5 minutes. Surprisingly, it is also possible to obtain a layer of ruthenium which is particularly good in purity.

瞭解本文中之熱製造矽層之液相方法是指液相反應物(選擇性地作為用於其他添加劑和/或摻雜劑之溶劑)或含有反應物(其本身為液體或固體)(和選擇性的其他添加劑和/或摻雜劑;後者特別為主族第III和V族的元素化合物形式)的液相溶液施用至待塗覆的基板及然後藉熱(選擇性地藉電磁射線支撐)轉化成基本上包含矽的層之方法。本情況中所用的反應物係至少一種高碳矽烷,該高碳矽烷可製自至少一種通式SiaH2a+2(其中a=3-10)的氫矽烷。通式SiaH2a+2(其中a=3-10)的氫矽烷係非環狀,即,直鏈或支鏈,氫矽烷。用以製造高碳矽烷的對應方法為嫻於此技術之人士已知者。例子包括光化學、陰離子、陽離子或催化性聚合法。其中,較佳者係藉UV射線照射啟動和進行自由基聚合法,此照射時間與所得的平均分子量有關。所述所有聚合法的共同點在於它們以解離的方式進行,此與關於環狀矽烷所述的開環反應不同,即,它們由於解離反應機構和解離的中間產物或中間形成的狀態,平均導致高碳矽烷具有相對高含量的分枝和/或交聯。經驗 顯示可經由聚合法而自至少一種通式SiaH2a+2(其中a=3-10)的氫矽烷製造的高碳矽烷的分子量不均勻。因此,本發明中的“高碳矽烷”是指由至少一種通式SiaH2a+2(其中a=3-10)界定的氫矽烷經由解離聚合法製造且平均分子量較所用反應物為高(此歸因於選用的聚合法)的矽烷。 The liquid phase process for understanding the heat-producing ruthenium layer herein refers to a liquid phase reactant (optionally as a solvent for other additives and/or dopants) or a reactant (which is itself a liquid or a solid) (and a liquid phase solution of a selective other additive and/or dopant; the latter in particular in the form of elemental compounds of Group III and V of the main group) is applied to the substrate to be coated and then supported by heat (optionally supported by electromagnetic rays) A method of converting into a layer substantially comprising ruthenium. The reactant used in the present case is at least one high carbon decane which can be prepared from at least one hydrooxane of the formula Si a H 2a + 2 (where a = 3-10). The hydrohalo alkane of the formula Si a H 2a+2 (where a = 3-10) is acyclic, i.e., linear or branched, hydrodecane. Corresponding methods for producing high carbon decane are known to those skilled in the art. Examples include photochemical, anionic, cationic or catalytic polymerization processes. Among them, preferred is initiated by UV irradiation and subjected to a radical polymerization method, and this irradiation time is related to the obtained average molecular weight. All of the polymerization processes have in common that they are carried out in a dissociated manner, which is different from the ring opening reaction described with respect to cyclic decane, i.e. they are on average due to the dissociation reaction mechanism and the dissociated intermediate or intermediate formed state. High carbon decane has a relatively high content of branching and/or crosslinking. Experience has shown that the molecular weight of the high carbon decane which can be produced from at least one hydrooxane of the general formula Si a H 2a+2 (where a = 3-10) can be made heterogeneous via polymerization. Therefore, "high carbon decane" in the present invention means that hydroquinane defined by at least one formula Si a H 2a+2 (where a = 3-10) is produced by dissociation polymerization and the average molecular weight is higher than that of the reactant used. (This is due to the chosen polymerization method) of decane.

根據本發明之方法中,較佳地使用重量平均分子量(藉GPC方法測定)為330-10,000克/莫耳的高碳矽烷。高碳矽烷的重量平均分子量更佳為330-5000克/莫耳,更佳為600-4000克/莫耳,此藉GPC方法測定。 In the process according to the invention, it is preferred to use a high carbon decane having a weight average molecular weight (determined by the GPC method) of from 330 to 10,000 g/mole. The weight average molecular weight of the high carbon decane is more preferably from 330 to 5000 g/mol, more preferably from 600 to 4000 g/mol, as determined by the GPC method.

該至少一種高碳矽烷可以,若其本身為液體,施用至基板無需進一步溶於溶劑中。但是,此高碳矽烷較佳以溶於溶劑中的形式施用至基板。 The at least one high carbon decane may, if it is a liquid itself, be applied to the substrate without further dissolution in the solvent. However, this high carbon decane is preferably applied to the substrate in a form dissolved in a solvent.

優先使用的溶劑出自包含具1至12個碳原子的直鏈、支鏈或環狀、飽和、不飽和或芳族烴(選擇性地經部分或完全鹵化)、醇、醚、羧酸、酯、腈、胺、醯胺、亞碸和水之群組。特別佳者係正戊烷、正己烷、正庚烷、正辛烷、正癸烷、十二烷、環己烷、環辛烷、環癸烷、二環戊烷、苯、甲苯、間-二甲苯、對-二甲苯、1,3,5-三甲苯、二氫化茚、茚、四氫萘、十氫萘、二乙醚、二丙醚、乙二醇二甲醚、乙二醇二乙醚、乙二醇甲乙醚、二乙二醇二甲醚、二乙二醇二乙醚、二乙二醇甲乙醚、四氫呋喃、對-二、乙腈、二甲基甲醯胺、二甲亞碸、二氯甲烷和氯仿。使用上特別佳的溶劑係烴、正戊烷、正己烷、正己烷、正辛烷、正癸烷、十二烷、環己烷、環辛烷、環癸烷、苯 、甲苯、間-二甲苯、對-二甲苯、1,3,5-三甲苯、二氫化茚和茚。 Preferred solvents are those derived from linear, branched or cyclic, saturated, unsaturated or aromatic hydrocarbons having from 1 to 12 carbon atoms (optionally partially or fully halogenated), alcohols, ethers, carboxylic acids, esters , a group of nitriles, amines, guanamines, hydrazines and water. Particularly preferred are n-pentane, n-hexane, n-heptane, n-octane, n-decane, dodecane, cyclohexane, cyclooctane, cyclodecane, dicyclopentane, benzene, toluene, m- Xylene, p-xylene, 1,3,5-trimethylbenzene, indane, hydrazine, tetrahydronaphthalene, decahydronaphthalene, diethyl ether, dipropyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether , ethylene glycol methyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, tetrahydrofuran, p-two , acetonitrile, dimethylformamide, dimethyl hydrazine, dichloromethane and chloroform. Particularly preferred solvents are hydrocarbons, n-pentane, n-hexane, n-hexane, n-octane, n-decane, dodecane, cyclohexane, cyclooctane, cyclodecane, benzene, toluene, m-di Toluene, p-xylene, 1,3,5-trimethylbenzene, indane and hydrazine.

當此至少一種高碳矽烷於溶劑中使用時,以此組成物總重計,其百分比較佳至少5重量%。當此至少一種高碳矽烷以未進一步溶於溶劑中的形式施用至基板時,其重量百分比,根據其本身是否作為其他添加劑和/或摻雜劑的溶劑與否,較佳由70至100重量%,此以該組成物的總重計。因此,較佳地,至少一種高碳矽烷的使用比例以含彼之組成物的總重計為5-100重量%。組成物所含至少一種高碳矽烷的比例為10-50重量%時,可得到特別薄的層。 When the at least one high carbon decane is used in a solvent, the percentage thereof is preferably at least 5% by weight based on the total weight of the composition. When the at least one high carbon decane is applied to the substrate in a form which is not further dissolved in a solvent, the weight percentage thereof is preferably from 70 to 100 by weight depending on whether it is itself a solvent for other additives and/or dopants. %, which is based on the total weight of the composition. Accordingly, preferably, the at least one high carbon decane is used in a proportion of from 5 to 100% by weight based on the total weight of the composition. When the proportion of the at least one high carbon decane contained in the composition is from 10 to 50% by weight, a particularly thin layer can be obtained.

為了與由通式SiaH2a+2的氫矽烷所製造的至少一種高碳矽烷達到正面的層性質,亦可以將至少一種選自主族III或V族元素的化合物之摻雜劑施用至基板。對應化合物為嫻於此技術之人士已知者。優先使用的摻雜劑係BHxR3-x型(其中x=1-3而R=C1-C10-烷基、不飽和環狀(選擇性地醚錯合或胺錯合的C2-C10-烷基)的硼化合物、式Si5H9BR2(R=H、Ph、C1-C10-烷基)和Si4H9BR2(R=H、Ph、C1-C10-烷基)的化合物、紅磷、白磷(P4)、式PHxR3-x(其中x=0-3而R=Ph、SiMe3、C1-C10-烷基)的化合物、及式P7(SiR3)3(R=H、Ph、C1-C10-烷基)、Si5H9PR2(R=H、Ph、C1-C10-烷基)和Si4H9PR2(R=H、Ph、C1-C10-烷基)的化合物。 In order to achieve a positive layer property with at least one higher carbon decane produced by a hydrohalane of the general formula Si a H 2a+2 , it is also possible to apply at least one dopant selected from a compound of the main group III or V element to the substrate. . Corresponding compounds are known to those skilled in the art. Preferred dopants are BH x R 3-x type (where x = 1-3 and R = C 1 - C 10 - alkyl, unsaturated cyclic (selective ether mismatch or amine mismatch C) a boron compound of 2 -C 10 -alkyl), a formula of Si 5 H 9 BR 2 (R=H, Ph, C 1 -C 10 -alkyl) and Si 4 H 9 BR 2 (R=H, Ph, C a compound of 1 -C 10 -alkyl), red phosphorus, white phosphorus (P 4 ), formula PH x R 3-x (where x=0-3 and R=Ph, SiMe 3 , C 1 -C 10 -alkyl a compound, and a formula P 7 (SiR 3 ) 3 (R=H, Ph, C 1 -C 10 -alkyl), Si 5 H 9 PR 2 (R=H, Ph, C 1 -C 10 -alkane) a compound of Si) and Si 4 H 9 PR 2 (R = H, Ph, C 1 -C 10 -alkyl).

關於本發明之方法,可以使用許多基板。較佳地,基板包含玻璃、石英玻璃、石墨或金屬。其他較佳金屬係鋁 、不銹鋼、Cr鋼、鈦、鉻和鉬。也可以使用聚合物膜,例如PEN、PET或聚醯亞胺。其他較佳者係熱相容金屬箔(選擇性地具有作為用於金屬的擴散阻擋物之層(如碳、Si3N4)和在擴散阻擋層上的導電層(如TCO、ZnO、SnO2、ITO或金屬))。所用的此擴散阻擋物可為Al、SiOx、AlxOy和Pt、Pd、Rh和Ni。特別適合的是Ti、Al和Zr的氧化物、及Ti和Si的氮化物。 Many substrates can be used with regard to the method of the present invention. Preferably, the substrate comprises glass, quartz glass, graphite or metal. Other preferred metals are aluminum, stainless steel, Cr steel, titanium, chromium and molybdenum. Polymeric films such as PEN, PET or polyimine can also be used. Other preferred are thermally compatible metal foils (selectively having a layer that acts as a diffusion barrier for the metal (eg, carbon, Si 3 N 4 ) and a conductive layer on the diffusion barrier (eg, TCO, ZnO, SnO) 2 , ITO or metal)). The diffusion barrier used may be Al, SiO x , Al x O y and Pt, Pd, Rh and Ni. Particularly suitable are oxides of Ti, Al and Zr, and nitrides of Ti and Si.

亦較佳地,所用基板可為存在於熱可相容載體上的矽基板或矽層、氧化銦錫(ITO)層、ZnO:F層或SnO2:F(FTO)層。 Also preferably, the substrate used may be a tantalum or tantalum layer, an indium tin oxide (ITO) layer, a ZnO:F layer or a SnO 2 :F (FTO) layer present on a thermally compatible support.

施用高碳矽烷的較佳方法係選自印刷法(特別是快乾印刷/凹版印刷、噴墨印刷、平版印刷、數位平版印刷和網版印刷)、噴霧法、旋轉塗覆法(“旋塗”)、浸漬法(“浸漬塗覆”)之方法及選自液面彎曲式塗佈(meniscus coating)、狹縫式塗佈(slit coating)、狹縫模具式塗佈(slot die coating)和簾塗佈之方法。 Preferred methods for applying high carbon decane are selected from printing methods (especially fast drying/gravure printing, ink jet printing, lithography, digital lithography and screen printing), spray methods, spin coating methods ("spin coating" "), a method of dipping ("dip coating") and a method selected from the group consisting of meniscus coating, slit coating, slot die coating, and The method of curtain coating.

塗覆之後及轉化之前,經塗覆的基板可經進一步乾燥以移除存在的任何溶劑。其對應的測量法和條件為嫻於此技術之人士已知者。為了僅移除溶劑,在熱乾燥的情況中,加熱溫度不應超過250℃。 After coating and prior to conversion, the coated substrate can be further dried to remove any solvent present. The corresponding measurement methods and conditions are known to those skilled in the art. In order to remove only the solvent, in the case of thermal drying, the heating temperature should not exceed 250 °C.

根據本發明之方法之轉化係於溫度為500-900℃且轉化時間≦5分鐘進行。藉由,例如,使用IR燈、熱板、爐、閃光燈、RTP系統或微波系統(需要時,各者為經預熱或熱機狀態)能夠達到相仿的迅速熱方法。轉化溫度為 500-650℃時,可達到特別佳的光學和電層性質。 The conversion according to the method of the present invention is carried out at a temperature of from 500 to 900 ° C and a conversion time of ≦ 5 minutes. A similar rapid thermal method can be achieved, for example, by using an IR lamp, a hot plate, a furnace, a flash lamp, an RTP system, or a microwave system (when required, each being preheated or warmed). Conversion temperature is Particularly good optical and electrical properties are achieved at 500-650 °C.

轉化時間較佳為0.1毫秒至120秒。為達到特別佳的光學和電性質,轉化時間應選擇為0.1-60秒。 The conversion time is preferably from 0.1 milliseconds to 120 seconds. In order to achieve particularly good optical and electrical properties, the conversion time should be chosen to be 0.1-60 seconds.

當在單一熱處理步驟中進行熱轉化時,所得層的品質也會受到正面影響,即,基板較佳在初步轉化之後,未自熱源移開並於之後再加熱。 When thermal conversion is carried out in a single heat treatment step, the quality of the resulting layer is also positively affected, i.e., the substrate is preferably removed from the heat source and then heated after the initial conversion.

當在熱處理之前、期間或之後照射UV射線,所得層的品質也會受到正面的影響。當施用高碳矽烷之後及其轉化之前,以UV射線照射,這些正面效應最大。典型的照射時間係1至20分鐘。 When UV rays are irradiated before, during or after heat treatment, the quality of the resulting layer is also positively affected. These positive effects are greatest when irradiated with UV rays after application of high carbon decane and prior to conversion. Typical exposure times are from 1 to 20 minutes.

在施用高碳矽烷之後及其轉化之前,施用減壓(低至真空)時,亦可得到較佳的層。較佳減壓係1.10-3毫巴至0.5巴。經塗覆的基板更佳於減壓處理1至20分鐘。 Preferred layers are also obtained when a reduced pressure (down to vacuum) is applied after the application of the high carbon decane and prior to its conversion. Preferably, the reduced pressure is from 1.10 -3 mbar to 0.5 bar. The coated substrate is more preferably treated under reduced pressure for 1 to 20 minutes.

製造多層(例如串接的太陽能電池)的情況中,應全面遵守相同時間/溫度限制(熱預算)。換言之,所有溫度步驟>500℃的和應較佳維持<5分鐘。 In the case of manufacturing multiple layers (eg, tandem solar cells), the same time/temperature limit (thermal budget) should be fully adhered to. In other words, the sum of all temperature steps >500 ° C should preferably be maintained for <5 minutes.

本發明之方法特別適合用以製造非晶狀矽層。在對應方式中得到此的方法和手段為嫻於此技術之人士已知者。瞭解非晶狀矽層是指該層的拉曼光譜僅有一個峰最高點在450公分-1-500公分-1範圍內且FWHM(半峰全寬)為50-100公分-1的峰。因此,本發明亦提供用於在基板上熱製造非晶狀矽層之液相方法,其中將由至少一種通式SiaH2a+2(其中a=3-10)的氫矽烷所製造的至少一種高碳矽烷施用至基板,並然後藉熱轉化成基本上包含矽的層,其中該高 碳矽烷於溫度為500-900℃及轉化時間≦5分鐘予以熱轉化。 The method of the invention is particularly suitable for use in the manufacture of amorphous tantalum layers. The methods and means for obtaining this in a corresponding manner are known to those skilled in the art. Understanding the amorphous tantalum layer means that the Raman spectrum of the layer has only one peak with a peak highest in the range of 450 cm -1 to 500 cm -1 and a FWHM (full width at half maximum) of 50-100 cm -1 . Accordingly, the present invention also provides a liquid phase process for thermally producing an amorphous tantalum layer on a substrate, wherein at least one hydroxane of the formula Si a H 2a+2 (where a = 3-10) is produced. A high carbon decane is applied to the substrate and then converted by heat into a layer comprising substantially rhodium, wherein the high carbon decane is thermally converted at a temperature of 500-900 ° C and a conversion time of 5 minutes.

本發明進一步提供藉該方法可製造的矽層。 The invention further provides a layer of tantalum that can be fabricated by this method.

本發明亦提供藉根據本發明之方法可製得的矽層之用途,其係用於製備電子或光電組件層,特別是用於光伏應用或用於電晶體。 The invention also provides the use of a layer of tantalum which can be obtained by the process according to the invention for the preparation of electronic or photovoltaic component layers, in particular for photovoltaic applications or for transistors.

下列實例用以提供本發明之標的物的其他額外說明。 The following examples are provided to provide additional additional description of the subject matter of the invention.

實例:Example:

所有的操作排除O2地在N2手套箱中進行。 All operations were performed in an N 2 glove box excluding O 2 .

A. 高碳矽烷之合成A. Synthesis of high carbon decane 實例1-用於本發明用途之材料Example 1 - Materials for Use in the Invention

3毫升新戊矽烷在稱量瓶中以UV燈照射直到重量平均分子量達到約Mw=900克/莫耳。 3 ml of neopentane was irradiated with a UV lamp in a weighing bottle until the weight average molecular weight reached about M w = 900 g/mole.

實例2-用於比較例之材料:Example 2 - Materials for Comparative Examples:

3毫升環戊矽烷在稱量瓶中以UV燈照射直到重量平均分子量達到約Mw=2200克/莫耳。 3 ml of cyclopentane was irradiated with a UV lamp in a weighing bottle until the weight average molecular weight reached about M w = 2200 g/mole.

B. 層製造B. Layer manufacturing 實例1:Example 1:

50微升在前面的實例1中得到的低聚合矽烷在環辛烷 中之37.5重量%調合物逐滴施用至尺寸為2.5×2.5公分2的玻璃基板,並藉旋轉塗覆機於2000rpm旋轉。所得膜在加熱板上於600℃硬化20秒。得到厚度約130奈米的棕色Si層(參照圖1)。PDS數據顯示於1.2電子伏特的α值為103公分-1,拉曼數據指出為100%非晶狀aSi:H。 50 microliters of the 37.5 wt% blend of the oligomeric decane obtained in the previous Example 1 in cyclooctane was applied dropwise to a glass substrate having a size of 2.5 x 2.5 cm 2 and rotated by a spin coater at 2000 rpm. The resulting film was hardened on a hot plate at 600 ° C for 20 seconds. A brown Si layer having a thickness of about 130 nm was obtained (refer to Fig. 1). The PDS data shows an alpha value of 103 cm -1 at 1.2 eV, which is indicated by the Raman data as 100% amorphous aSi:H.

比較例1:Comparative Example 1:

50微升在前面的實例1中得到的低聚合矽烷在環辛烷中之37重量%調合物逐滴施用至尺寸為2.5×2.5公分2的玻璃基板,並藉旋轉塗覆機於2000rpm旋轉。所得膜在加熱板上於400℃硬化10分鐘。得到厚度約140奈米的棕色Si層。 PDS數據顯示於1.2電子伏特的α值為120公分-1,拉曼數據指出為100%非晶狀aSi:H。 50 microliters of the 37% by weight blend of the oligomeric decane obtained in the previous Example 1 in cyclooctane was applied dropwise to a glass substrate having a size of 2.5 x 2.5 cm 2 and rotated by a spin coater at 2000 rpm. The resulting film was hardened on a hot plate at 400 ° C for 10 minutes. A brown Si layer having a thickness of about 140 nm was obtained. The PDS data shows an alpha value of 1.2 cm -1 at 1.2 eV, which is indicated by the Raman data as 100% amorphous aSi:H.

比較例2:Comparative Example 2:

50微升在前面的實例2中得到的低聚合矽烷在環辛烷中之28.5重量%調合物逐滴施用至尺寸為2.5×2.5公分2的玻璃基板,並藉旋轉塗覆機於6000rpm旋轉。所得膜在加熱板上於400℃硬化10分鐘。得到厚度約142奈米的棕色Si層。PDS數據顯示於1.2電子伏特的α值為172公分-1,拉曼數據指出為100%非晶狀aSi:H。 50 microliters of the 28.5% by weight blend of the oligomeric decane obtained in the previous Example 2 in cyclooctane was applied dropwise to a glass substrate having a size of 2.5 x 2.5 cm 2 and rotated by a spin coater at 6000 rpm. The resulting film was hardened on a hot plate at 400 ° C for 10 minutes. A brown Si layer having a thickness of about 142 nm was obtained. The PDS data shows an alpha value of 172 cm -1 at 1.2 eV, which is indicated by the Raman data as 100% amorphous aSi:H.

比較例3:Comparative Example 3:

3毫升環戊矽烷在稱量瓶中以UV燈照射直到重量平均 分子量約Mw=3100克/莫耳。50微升所得到的低聚合矽烷在環辛烷中之37.5重量%調合物逐滴施用至尺寸為2.5×2.5公分2的玻璃基板,並藉旋轉塗覆機於2500rpm旋轉。所得膜在加熱板上於500℃硬化60秒(參照圖2)。 3 ml of cyclopentane was irradiated with a UV lamp in a weighing bottle until the weight average molecular weight was about M w = 3100 g/mole. 50 μl of the obtained 37.5 wt% blend of the oligomeric decane in cyclooctane was applied dropwise to a glass substrate having a size of 2.5 x 2.5 cm 2 and rotated by a spin coater at 2500 rpm. The resulting film was cured on a hot plate at 500 ° C for 60 seconds (refer to Fig. 2).

圖1顯示自新戊矽烷製得的高碳矽烷層。 Figure 1 shows a high carbon germane layer prepared from neopentane.

圖2顯示自環戊矽烷製得的高碳矽烷層。 Figure 2 shows a high carbon decane layer prepared from cyclopentane.

Claims (13)

一種用於在基板上熱製造矽層之液相方法,其中將由至少一種通式Si(SiH3)4的新戊矽烷所製造的至少一種高碳矽烷施用至基板,並然後藉熱轉化成基本上包含矽的層,其特徵在於該高碳矽烷- 於溫度為500-900℃- 及轉化時間為0.1-60秒,予以熱轉化。 A liquid phase method for thermally producing a ruthenium layer on a substrate, wherein at least one high carbon decane produced from at least one neopentane having the general formula Si(SiH 3 ) 4 is applied to a substrate and then converted into a basic by heat The layer comprising ruthenium is characterized in that the high carbon decane is thermally converted at a temperature of from 500 to 900 ° C - and a conversion time of from 0.1 to 60 seconds. 如申請專利範圍第1項之方法,其中該至少一種高碳矽烷的重量平均分子量為330-10,000克/莫耳。 The method of claim 1, wherein the at least one high carbon decane has a weight average molecular weight of from 330 to 10,000 g/mole. 如申請專利範圍第1或2項之方法,其中該至少一種高碳矽烷溶於溶劑中地施用至基板。 The method of claim 1 or 2, wherein the at least one high carbon decane is dissolved in a solvent and applied to the substrate. 如申請專利範圍第1或2項之方法,其中該至少一種高碳矽烷的使用比例以含彼之組成物的總重計為5-100重量%。 The method of claim 1 or 2, wherein the at least one high carbon decane is used in a proportion of from 5 to 100% by weight based on the total weight of the composition. 如申請專利範圍第1或2項之方法,其中該至少一種高碳矽烷與至少一種選自主族III或V的元素之化合物的摻雜劑一起施用至基板。 The method of claim 1 or 2, wherein the at least one high carbon decane is applied to the substrate together with a dopant of at least one compound selected from the group consisting of elements of the main group III or V. 如申請專利範圍第1或2項之方法,其中該基板包含玻璃、石英玻璃、石墨、金屬、塑膠或矽,或存在於熱可相容載體上的矽、氧化銦錫、ZnO:F或SnO2:F層。 The method of claim 1 or 2, wherein the substrate comprises glass, quartz glass, graphite, metal, plastic or tantalum, or tantalum, indium tin oxide, ZnO:F or SnO present on a thermally compatible carrier 2 : F layer. 如申請專利範圍第1或2項之方法,其中該至少一種高碳矽烷係藉選自印刷法、噴霧法、旋轉塗覆法、浸漬法、液面彎曲式塗佈(meniscus coating)、狹縫式塗佈(slit coating)、狹縫模具式塗佈(slot die coating)和 簾塗佈之方法而予以施用。 The method of claim 1 or 2, wherein the at least one high-carbon decane is selected from the group consisting of a printing method, a spray method, a spin coating method, a dipping method, a meniscus coating, and a slit. Slip coating, slot die coating, and It is applied by the method of curtain coating. 如申請專利範圍第1或2項之方法,其中該熱轉化於溫度為500-650℃進行。 The method of claim 1 or 2, wherein the thermal conversion is carried out at a temperature of from 500 to 650 °C. 如申請專利範圍第1或2項之方法,其中該熱轉化係在單一熱程序步驟中進行。 The method of claim 1 or 2, wherein the thermal conversion is carried out in a single thermal procedure step. 如申請專利範圍第1或2項之方法,其中在熱處理之前、期間或之後施以UV照射。 The method of claim 1 or 2, wherein the UV irradiation is applied before, during or after the heat treatment. 如申請專利範圍第1或2項之方法,其中在施用高碳矽烷之後及其轉化之前,施以減壓。 The method of claim 1 or 2, wherein the reduced pressure is applied after the application of the high carbon decane and before the conversion thereof. 一種藉申請專利範圍第1項之方法可製得的矽層。 A layer of ruthenium which can be obtained by the method of claim 1 of the patent scope. 一種藉申請專利範圍第1項之方法可製得的矽層於製備電子或光電組件層之用途。 A use of a layer of ruthenium which can be obtained by the method of claim 1 of the patent scope for the preparation of an electronic or optoelectronic component layer.
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