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TWI521073B - Copper alloy plate, and with its high current with electronic components and thermal electronic components - Google Patents

Copper alloy plate, and with its high current with electronic components and thermal electronic components Download PDF

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Publication number
TWI521073B
TWI521073B TW103128762A TW103128762A TWI521073B TW I521073 B TWI521073 B TW I521073B TW 103128762 A TW103128762 A TW 103128762A TW 103128762 A TW103128762 A TW 103128762A TW I521073 B TWI521073 B TW I521073B
Authority
TW
Taiwan
Prior art keywords
copper alloy
mass
mpa
thickness
annealing
Prior art date
Application number
TW103128762A
Other languages
English (en)
Chinese (zh)
Other versions
TW201522671A (zh
Inventor
柿谷明宏
Original Assignee
Ｊｘ日鑛日石金屬股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｊｘ日鑛日石金屬股份有限公司 filed Critical Ｊｘ日鑛日石金屬股份有限公司
Publication of TW201522671A publication Critical patent/TW201522671A/zh
Application granted granted Critical
Publication of TWI521073B publication Critical patent/TWI521073B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H10W40/10—
    • H10W40/258—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Non-Insulated Conductors (AREA)
TW103128762A 2013-11-19 2014-08-21 Copper alloy plate, and with its high current with electronic components and thermal electronic components TWI521073B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013239197A JP5632063B1 (ja) 2013-11-19 2013-11-19 銅合金板、並びに、それを備える大電流用電子部品及び放熱用電子部品

Publications (2)

Publication Number Publication Date
TW201522671A TW201522671A (zh) 2015-06-16
TWI521073B true TWI521073B (zh) 2016-02-11

Family

ID=52145011

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103128762A TWI521073B (zh) 2013-11-19 2014-08-21 Copper alloy plate, and with its high current with electronic components and thermal electronic components

Country Status (5)

Country Link
JP (1) JP5632063B1 (fr)
KR (1) KR101788497B1 (fr)
CN (1) CN105765093A (fr)
TW (1) TWI521073B (fr)
WO (1) WO2015075990A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6464740B2 (ja) * 2014-12-26 2019-02-06 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用部品、端子及びバスバー
JP6464742B2 (ja) * 2014-12-26 2019-02-06 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用部品、端子及びバスバー
JP6464741B2 (ja) * 2014-12-26 2019-02-06 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用部品、端子及びバスバー
JP6749121B2 (ja) * 2016-03-30 2020-09-02 Ｊｘ金属株式会社 強度及び導電性に優れる銅合金板
TWI674326B (zh) * 2018-11-19 2019-10-11 財團法人工業技術研究院 銅鋯合金散熱元件及銅鋯合金殼體的製造方法
CN110592421B (zh) * 2019-10-29 2020-07-07 吉林大学 铜合金、铜合金板材及其制备方法和应用
CN112281023B (zh) * 2020-11-23 2021-08-31 宁波博威合金材料股份有限公司 一种具有优异折弯性的铜合金材料及其制备方法和应用

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005133185A (ja) * 2003-10-31 2005-05-26 Nippon Mining & Metals Co Ltd 析出型銅合金の熱処理方法と析出型銅合金および素材
JP4157899B2 (ja) 2006-11-17 2008-10-01 株式会社神戸製鋼所 曲げ加工性に優れた高強度銅合金板
CN100532599C (zh) * 2007-08-01 2009-08-26 苏州有色金属研究院有限公司 一种抗疲劳的Cu-Ti合金及其生产方法
JP5312920B2 (ja) 2008-11-28 2013-10-09 Ｊｘ日鉱日石金属株式会社 電子材料用銅合金板又は条
KR20110111502A (ko) * 2009-01-26 2011-10-11 후루카와 덴키 고교 가부시키가이샤 배선용 전선 도체, 배선용 전선 도체의 제조방법, 배선용 전선 및 구리합금 소선
JP4550148B1 (ja) * 2009-03-13 2010-09-22 三菱伸銅株式会社 銅合金及びその製造方法
JP4642119B2 (ja) * 2009-03-23 2011-03-02 三菱伸銅株式会社 銅合金及びその製造方法
JP5170916B2 (ja) * 2010-08-27 2013-03-27 古河電気工業株式会社 銅合金板材及びその製造方法
JP5060625B2 (ja) * 2011-02-18 2012-10-31 三菱伸銅株式会社 Ｃｕ−Ｚｒ系銅合金板及びその製造方法
JP5461467B2 (ja) * 2011-03-29 2014-04-02 Ｊｘ日鉱日石金属株式会社 強度、導電率及び曲げ加工性に優れたチタン銅及びその製造方法
JP5432201B2 (ja) 2011-03-30 2014-03-05 Ｊｘ日鉱日石金属株式会社 放熱性及び繰り返し曲げ加工性に優れた銅合金板
JP6188273B2 (ja) 2011-11-18 2017-08-30 Ｊｘ金属株式会社 放熱性及び繰り返し曲げ加工性に優れた銅合金板
JP5847787B2 (ja) 2013-11-26 2016-01-27 Jx日鉱日石金属株式会社 導電性及び応力緩和特性に優れる銅合金板

Also Published As

Publication number Publication date
KR101788497B1 (ko) 2017-10-19
WO2015075990A1 (fr) 2015-05-28
TW201522671A (zh) 2015-06-16
KR20160088379A (ko) 2016-07-25
CN105765093A (zh) 2016-07-13
JP2015098628A (ja) 2015-05-28
JP5632063B1 (ja) 2014-11-26

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