TWI520980B - The epoxy resin composition and cured - Google Patents
The epoxy resin composition and cured Download PDFInfo
- Publication number
- TWI520980B TWI520980B TW100128168A TW100128168A TWI520980B TW I520980 B TWI520980 B TW I520980B TW 100128168 A TW100128168 A TW 100128168A TW 100128168 A TW100128168 A TW 100128168A TW I520980 B TWI520980 B TW I520980B
- Authority
- TW
- Taiwan
- Prior art keywords
- epoxy resin
- viscosity
- epoxy
- resin composition
- weight
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title claims description 93
- 229920000647 polyepoxide Polymers 0.000 title claims description 93
- 239000000203 mixture Substances 0.000 title claims description 48
- 239000003085 diluting agent Substances 0.000 claims description 17
- 125000003700 epoxy group Chemical group 0.000 claims description 11
- 239000004848 polyfunctional curative Substances 0.000 claims description 11
- 125000000217 alkyl group Chemical group 0.000 claims description 8
- RGMCZPCPHOPJMQ-UHFFFAOYSA-N CCOCCC1CCC(C(C1)CCOCC)CCOCC Chemical group CCOCCC1CCC(C(C1)CCOCC)CCOCC RGMCZPCPHOPJMQ-UHFFFAOYSA-N 0.000 claims description 7
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 7
- 150000001412 amines Chemical class 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 125000000524 functional group Chemical group 0.000 claims description 3
- 150000008065 acid anhydrides Chemical class 0.000 claims description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims 3
- 239000004593 Epoxy Substances 0.000 description 30
- 238000005452 bending Methods 0.000 description 28
- 150000001875 compounds Chemical class 0.000 description 23
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 22
- 230000009477 glass transition Effects 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 8
- 239000000460 chlorine Substances 0.000 description 8
- 229910052801 chlorine Inorganic materials 0.000 description 8
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 8
- 238000002834 transmittance Methods 0.000 description 8
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 7
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 7
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 229920003986 novolac Polymers 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 229930185605 Bisphenol Natural products 0.000 description 6
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 230000006750 UV protection Effects 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 4
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 229910001961 silver nitrate Inorganic materials 0.000 description 4
- -1 vinyl compound Chemical class 0.000 description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000012044 organic layer Substances 0.000 description 3
- 150000002978 peroxides Chemical class 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- DGUJJOYLOCXENZ-UHFFFAOYSA-N 4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenol Chemical class C=1C=C(OCC2OC2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 DGUJJOYLOCXENZ-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 239000004844 aliphatic epoxy resin Substances 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- 238000006735 epoxidation reaction Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 235000013824 polyphenols Nutrition 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- 238000004448 titration Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KTRQRAQRHBLCSQ-UHFFFAOYSA-N 1,2,4-tris(ethenyl)cyclohexane Chemical compound C=CC1CCC(C=C)C(C=C)C1 KTRQRAQRHBLCSQ-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- FYERTDTXGGOMGT-UHFFFAOYSA-N 2,2-diethoxyethylbenzene Chemical compound CCOC(OCC)CC1=CC=CC=C1 FYERTDTXGGOMGT-UHFFFAOYSA-N 0.000 description 1
- CMQUQOHNANGDOR-UHFFFAOYSA-N 2,3-dibromo-4-(2,4-dibromo-5-hydroxyphenyl)phenol Chemical compound BrC1=C(Br)C(O)=CC=C1C1=CC(O)=C(Br)C=C1Br CMQUQOHNANGDOR-UHFFFAOYSA-N 0.000 description 1
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 1
- WKJICCKTDQDONB-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxycarbonyl)cyclohexane-1-carboxylic acid Chemical compound OC(=O)C1CCCCC1C(=O)OCC1OC1 WKJICCKTDQDONB-UHFFFAOYSA-N 0.000 description 1
- WVRNUXJQQFPNMN-VAWYXSNFSA-N 3-[(e)-dodec-1-enyl]oxolane-2,5-dione Chemical compound CCCCCCCCCC\C=C\C1CC(=O)OC1=O WVRNUXJQQFPNMN-VAWYXSNFSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- OUJKZIYSFNAHHZ-UHFFFAOYSA-N 9,10-diphenylanthracene-1,2-diamine Chemical compound NC1=C(C2=C(C3=CC=CC=C3C(=C2C=C1)C1=CC=CC=C1)C1=CC=CC=C1)N OUJKZIYSFNAHHZ-UHFFFAOYSA-N 0.000 description 1
- AQMRWVSATGGHIE-UHFFFAOYSA-N C(C(C1CCCCC1)C1CCCCC1)c1ccccc1 Chemical compound C(C(C1CCCCC1)C1CCCCC1)c1ccccc1 AQMRWVSATGGHIE-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001334 alicyclic compounds Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 150000001491 aromatic compounds Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000001555 benzenes Chemical class 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 1
- 239000012295 chemical reaction liquid Substances 0.000 description 1
- 238000004587 chromatography analysis Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000009408 flooring Methods 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 125000005908 glyceryl ester group Chemical group 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- FLBJFXNAEMSXGL-UHFFFAOYSA-N het anhydride Chemical compound O=C1OC(=O)C2C1C1(Cl)C(Cl)=C(Cl)C2(Cl)C1(Cl)Cl FLBJFXNAEMSXGL-UHFFFAOYSA-N 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- QOSATHPSBFQAML-UHFFFAOYSA-N hydrogen peroxide;hydrate Chemical compound O.OO QOSATHPSBFQAML-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- GKQPCPXONLDCMU-CCEZHUSRSA-N lacidipine Chemical compound CCOC(=O)C1=C(C)NC(C)=C(C(=O)OCC)C1C1=CC=CC=C1\C=C\C(=O)OC(C)(C)C GKQPCPXONLDCMU-CCEZHUSRSA-N 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 238000003918 potentiometric titration Methods 0.000 description 1
- OVARTBFNCCXQKS-UHFFFAOYSA-N propan-2-one;hydrate Chemical compound O.CC(C)=O OVARTBFNCCXQKS-UHFFFAOYSA-N 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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Description
本發明係關於一種低黏度且作業性優異之環氧樹脂組成物、及使其硬化而得到之耐熱性、機械特性優異之環氧樹脂硬化物者。
環氧樹脂係藉由以各種之硬化劑使之硬化,成為一般機械性質、耐水性、耐藥品性、耐熱性、電氣性質等優異之硬化物,可利用於接著劑、塗料、層合板、成形材料、模具材料等之廣泛領域。以往,在液狀環氧樹脂組成物中就環氧樹脂而言主要使用雙酚A型環氧樹脂、或雙酚F型環氧樹脂,但樹脂之黏度比較高,常添加反應性稀釋劑。反應性稀釋劑代表性者係使用丁基縮水甘油基醚、烯丙基縮水甘油基醚、苯基縮水甘油基醚。
添加習知之丁基縮水甘油基醚、烯丙基縮水甘油基醚、苯基縮水甘油基醚等的稀釋劑時,若添加量多,有硬化物之耐熱性或機械性強度降低等之問題。因此,如專利文獻1、2記載般,已提出具有2官能以上之環氧基的反應性稀釋劑。但,專利文獻1記載之反應稀釋劑係雖具有低的黏度,但為具有脂環式環氧基者。因此,若與習知之表氯醇型的環氧化合物相比較,缺乏反應性,只能以酸酐硬化係周知之事實,用途受限。又,專利文獻2中係已提出含有環己基之化合物,但,此等之化合物的黏度係240cps至3200cps,相較於習知之反應性稀釋劑,黏度高,作為稀釋劑之功能不充分。
為解決此等之課題,發明人等首先發現使用聚環氧基苯類作為反應性稀釋劑。此等係可降低組成物全體之黏度,具有與表氯醇型環氧基同等的反應性,且為不使硬化物之耐熱性、機械特性降低的反應性稀釋劑。但,因係芳香族化合物,故相較於脂環式化合物,有透明性、耐光性略差之問題。
[專利文獻1]特開平7-97431號公報
[專利文獻2]特許第3415047號公報
因此,就反應性稀釋劑而言,期望出現:可降低組成物全體之黏度,具有與表氯醇型環氧基同等的反應性,且不使硬化物之耐熱性、機械特性降低的反應性稀釋劑。又,在電氣、電子零件用途中期望氯濃度低的環氧樹脂,期待出現氯含量低之反應性稀釋劑。進一步,在光學零件領域中係亦尋求透明性、耐光性。
本發明人等係有鑑於如此之實情,尋求一種黏度非常低、而且不使硬化物之耐熱性、機械特性降低而氯含量低之反應性稀釋劑而經專心研究之結果,發現以下述式(1)所示之環氧化合物滿足此等之要求者,終完成本發明。
亦即,本發明係關於一種環氧樹脂組成物,其係含有在25℃之黏度為1000mPa‧s以上之環氧樹脂、與以下式(1)所示之聚環氧基乙基環己烷,前述聚環氧基乙基環己烷之含量相對於前述環氧樹脂100重量份為1重量份以上90重量份以下;
【化1】
(式中,E表示環氧基,R表示氫、乙烯基或烷基,n表示2~3之整數)。
本發明係關於一種環氧樹脂硬化物,其特徵係於上述之環氧樹脂組成物中摻合硬化劑,使之硬化而成。
本發明係關於一種環氧樹脂組成物,其特徵係上述聚環氧基乙基環己烷為1,2,4-三環氧基乙基環己烷。
本發明係關於一種環氧樹脂用之反應性稀釋劑,其特徵係由上述聚環氧基乙基環己烷所構成。
以下,詳細說明本發明。
本發明之環氧樹脂組成物,其係含有在25℃之黏度為1000mPa‧s以上之環氧樹脂、與以上述式(1)所示之聚環氧基乙基環己烷(以下,亦稱為環氧化合物)。
以式(1)所示之環氧化合物係可使用一使對應之乙烯基化合物藉過氧化物環氧化者。R之一部分為乙烯基之環氧化合物係使聚乙烯基環己烷類環氧化時,不使全部之乙烯基環氧化,而使一部分未反應來得到。藉此方法所得到之環氧化合物係合成時不使用表氯醇,故具有氯含量少之特徵。使用於環氧化之過氧化物係可使用一般之過氧或有機過氧化物。
如上述般,此環氧化合物係可藉由以聚乙烯基環己烷類(以下亦稱為乙烯基化合物)之氧化的環氧化而有利地得到。此時,聚乙烯基環己烷類為立體異構物混合物時,此環氧化合物亦成為立體異構物混合物,但無妨。
以式(1)所示之聚環氧基乙基環己烷係具有n個亦即2或3個環氧基,但以高耐熱性、高強度作為目的時,為提高硬化時之交聯密度,故宜為三環氧基環己烷類。又,亦可為n=2及n=3之混合物。在式(1)中之R係氫、乙烯基、或烷基,烷基係碳數為1~6之烷基,黏度低,作為稀釋劑之效果特高,故佳。又,6-n個之R係可為同一,亦可為相異。為降低黏度,全部之R為氫,或1~3個之R為氫,其餘為乙烯基或烷基,尤宜源自乙烯基或烷基之碳數的合計為4以下。
可使用於本發明之環氧樹脂組成物之在25℃之黏度為1000mPa‧s以上之環氧樹脂係只要為滿足上述黏度者即可,無特別限定。可舉例如雙酚A系、雙酚F系、雙酚AD係、含溴之雙酚A系、酚酚醛清漆系、甲酚酚醛清漆系、聚酚系、直鏈脂肪族系、丁二烯系、胺基甲酸酯系等之縮水甘油基醚型環氧樹脂;六氫酞酸縮水甘油基酯、偶體酸縮水甘油基酯、芳香族系、環狀脂肪族系、脂肪族系縮水甘油基酯型環氧樹脂;雙酚系、酯系、高分子量醚酯系、醚酯系、溴系、酚醛清漆系、甲基取代型環氧樹脂;雜環型環氧樹脂;三縮水甘油基三聚異氰酸酯、或四縮水甘油基二胺基二苯基甲烷等縮水甘油基胺型環氧樹脂;環氧化聚丁二烯或環氧基大豆油等之線狀脂肪型環氧樹脂;環狀脂肪族型環氧樹脂、萘系酚醛清漆型環氧樹脂、二縮水甘油基氧萘型環氧樹脂等之環氧樹脂中在25℃之黏度為1000 mPa‧s以上者,但,性能及經濟性上,尤宜為雙酚A型、雙酚F型、雙酚AD型、甲酚酚醛清漆型之縮水甘油基醚型環氧樹脂等之2官能以上的環氧樹脂。此等之環氧樹脂的具體例如大日本油墨化學工業(股)製之EPICLON 850(環氧基當量188g/eq)、EPICLON 1050(環氧基當量475g/eq)等之雙酚A-表氯醇縮合物環氧樹脂、EPICLON 830(環氧基當量172g/eq)等之雙酚F-表氯醇縮合物環氧樹脂、EPICLON N-740(環氧基當量180g/eq)、EPICLON N-670(環氧基當量210g/eq)等之酚醛清漆樹脂-表氯醇縮合物環氧樹脂、EPICLON 152(環氧基當量360g/eq)等之四溴雙酚A-表氯醇縮合物環氧樹脂、EPICLON 430(環氧基當量120g/eq)等之縮水甘油基胺型環氧樹脂等之芳香族縮水甘油基醚型環氧樹脂。有關在25℃下之黏度未達1000mPa‧s之環氧樹脂係以式(1)之環氧化合物的黏度降低效果低。
可使用於本發明之環氧樹脂組成物的以式(1)所示之環氧化合物係具有降低環氧樹脂組成物之黏度的功能。尤其,若上述環氧化合物之黏度範圍為10~500mPa‧s,降低上述黏度之功能優異,佳。另外,在25℃之黏度為1000 mPa‧s以上的環氧樹脂因係比較一般性環氧樹脂,故具有其環氧樹脂特有的性能,但黏度高。以下,在25℃之黏度為1000mPa‧s以上的環氧樹脂亦稱為高黏度環氧樹脂。
以式(1)所示之環氧化合物的添加量係必須相對於前述高黏度環氧樹脂100重量份為1~90重量份的範圍。宜為5~80重量份,更宜為10~60重量份。若添加量未達1重量份,黏度降低作用不充分,若超過90重量份,引起原來之環氧樹脂的物性降低。
以式(1)所示之環氧化合物係作為環氧樹脂稀釋劑優異。習知之環氧樹脂稀釋劑係使環氧樹脂組成物硬化所得到之硬化物的Tg或強度充份降低,但在本發明使用之以式(1)所示的環氧化合物係儘管低黏度且稀釋效果高,但若進行硬化,成為高Tg、高強度。又,此環氧化合物係具有脂環式構造,故具有透明性高之效果。
又,環氧樹脂組成物係依需要而在無損本發明之性能的範圍,亦可進一步添加在其用途領域一般所摻合之可撓化劑、偶合劑、耐燃劑、耐燃助劑、著色劑、填充劑等之添加劑。
於本發明之環氧樹脂組成物中加入硬化劑,可使之硬化得到環氧樹脂硬化物。
可使用於本發明之環氧樹脂組成物的硬化劑,就一般環氧樹脂之硬化劑而言可為公知之硬化劑,就一例而言,可舉例如乙二胺、二乙三胺、三乙四胺、四乙五胺、二丙三胺、二乙基胺基丙胺、間苯二胺、p,p’-二胺基二苯基甲烷、二胺基二苯基碸等之第一胺類;二乙醇胺、N-甲基乙醇胺、雙羥基乙基二乙三胺等之第二胺類;三乙胺、六氫吡啶、苯甲基二甲基胺2-(二甲基胺基甲基)酚等之第三胺類;酞酸酐、六氫酞酸酐、十二碳烯基琥珀酸酐、均苯四甲酸酐、偏苯三甲酸酐、氯茵酸酐(chlorendic anhydride)等之酸酐;可摻合此等之一種以上。
環氧樹脂與硬化劑的摻合比率係環氧基與硬化劑中之官能基以當量比計宜為0.8~1.5的範圍。在此範圍外,係硬化後未反應之環氧基、或硬化劑中之官能基會殘留,硬化物之物性降低。此處,以式(1)所示之環氧化合物係形成環氧樹脂而計算。
本發明之環氧樹脂組成物的用途係可舉例如塗料、注入材、模具品、CFRP等之複合材、成形品、印刷基板等之層合材及絕緣材、電氣‧電子零件的密封材、接著劑、層合板、光學材料、FRP成形物、土木建築用之修補材、地板材、道路舖裝材等。
其次,為使本發明之特徵更明確地,舉出實施例而具體地說明。又,文中之份及%係全部表示重量基準者。
合成例1
使1,2,4-三乙烯基環己烷80g(0.49mol)、乙腈323g(7.87mol)、甲醇560g(17.5mol)及碳酸鉀175g(1.27mol)投入於附有溫度計、冷卻管、氮氣導入管、攪拌葉之2升的五口分離式燒瓶中。氮氣取代後,使內溫調整至20~25℃,花2小時滴入30%的過氧化氫水630g(5.55mol)。滴入終了後,一邊使內溫保持於25~45℃之間一邊反應5小時。反應終了後,使10%之亞硫酸鈉水溶液186.6g(0.15mol)分解反應液中之殘存過氧化物。添加甲苯600g(6.51mol),進行水層與有機層之分離。分離後,水洗有機層3次,使用硫酸鈉而乾燥。使用蒸發器而有機層(甲苯層)餾去後,藉環氧混合物(包含單環氧基體、二環氧基體、三環氧基體)減壓餾去進行精製、分離。得到單環氧基體8.74g(0.049mol,收率10%)、二環氧基體27.22g(0.140mol、29%)、及1,2,4-三環氧基乙基環己烷(TEpCH)29.87g(0.142mol、收率29%)。1,2,4-三環氧基乙基環己烷(TEpCH)之環氧基當量為93g/eq,黏度為115mPa‧s。
合成例2
於3升反應器中裝入二乙烯基苯(新日鐵化學製DVB-960二乙烯基苯含量97%、m-體/p-體=62:38)300g、醋酸乙酯1200g,進行攪拌。然後,花3小時而滴入含有過醋酸30%之醋酸乙酯溶液1640g。滴入中進行控制以使反應溫度成為30℃。滴入後,進一步以30℃攪拌3小時。冷卻反應液至室溫後,加入20%NaOH水溶液1208g,攪拌1小時後,分離水層,進行未反應之過醋酸及所生成之醋酸的除去。以蒸發器減壓餾去醋酸乙酯後,進行精製蒸餾(餾出溫度:10torr、150℃),得到二環氧基乙基苯(DEpEB)151.6g。所得到之二環氧基乙基苯的環氧基當量為81g/eq,在25℃之黏度為18mPa‧s,純度為97.1%(氣體色層分析面積%)、m-體/p-體=64:36(1H-NMR積分比)。
實施例1~3
相對於雙酚A型環氧樹脂(YD-128;東都化成股份公司製)100重量份,加入於合成例1得到之1,2,4-三環氧基乙基環己烷(TEpCH)10重量份、25重量份或50重量份,進行混合,得到環氧樹脂組成物。以B型黏度計測定25℃之樹脂組成物的黏度。於環氧樹脂組成物中加入Rikacid MH-700(新日本理化股份公司製)使得當量比成為0.9而均一地混合後,流入模具內,以120℃、1小時,然後150℃、3小時加熱硬化,製作縱125mm×橫13mm×厚9mm之彎曲試驗用試驗片及直徑5mm×厚3mm之玻璃轉移點測定用試驗片。
使用所製作之彎曲試驗用試驗片而在25℃中進行JIS K 7171規定之彎曲試驗,從最大強度求出彎曲強度。又,從變形-應力曲線之初期斜率求出彎曲彈性率。又,使用所製作之玻璃轉移點測定用試驗片,而藉SII.Nanotechnology股份公司製,熱機械分析裝置(TMA/SS),氮環境下、以昇溫速度7℃/分的條件求出玻璃轉移點(Tg)。將結果表示於表1中。
比較例1~3
相對於雙酚A型環氧樹脂(YD-128)100重量份,加入苯基縮水甘油基醚(PGE;東京化成化學工業製)10重量份、25重量份或50重量份,進行混合,得到環氧樹脂組成物。於環氧樹脂組成物中加入Rikacid MH-700使得當量比成為0.9而均一地混合後,與實施例1~3同樣地做法,製作彎曲試驗用試驗片及玻璃轉移點測定用試驗片,求出彎曲強度、彎曲彈性率及玻璃轉移點。
比較例4~6
相對於雙酚A型環氧樹脂(YD-128)100重量份,加入丁基縮水甘油基醚(BGE;東京化成化學工業製)10重量份、25重量份或50重量份,進行混合,得到環氧樹脂組成物。於環氧樹脂組成物中加入Rikacid MH-700使得當量比成為0.9而均一地混合後,與實施例1~3同樣地做法,製作彎曲試驗用試驗片及玻璃轉移點測定用試驗片,求出彎曲強度、彎曲彈性率及玻璃轉移點。
實施例4
相對於雙酚F型環氧樹脂(YD-170;東都化成股份公司製)100重量份,加入於合成例1得到之1,2,4-三環氧基乙基環己烷(TEpCH)50重量份,進行混合,得到環氧樹脂組成物。以B型黏度計測定25℃之樹脂組成物的黏度。於環氧樹脂組成物中加入Rikacid MH-700使得當量比成為0.9而均一地混合後,與實施例1~3同樣地做法,製作彎曲試驗用試驗片及玻璃轉移點測定用試驗片,求出彎曲強度、彎曲彈性率及玻璃轉移點。
實施例5
相對於酚酚醛清漆型環氧樹脂(YDPN-638;東都化成股份公司製)100重量份,加入於合成例1得到之1,2,4-三環氧基乙基環己烷(TEpCH)50重量份,進行混合,得到環氧樹脂組成物。於環氧樹脂組成物中加入Rikacid MH-700使得當量比成為0.9而均一地混合後,與實施例1~3同樣地做法,製作彎曲試驗用試驗片及玻璃轉移點測定用試驗片,求出彎曲強度、彎曲彈性率及玻璃轉移點。
將實施例1~5及比較例1~6之樹脂組成物的摻合組成與黏度、及硬化物之物性測定值表示於表1中。又,化合物添加量係相對於環氧樹脂100重量份之環氧化合物的摻合量。黏度在25℃進行測定。又,黏度係摻合硬化劑之前的環氧樹脂組成物之黏度。
比較例7
於雙酚A型環氧樹脂(YD-128)中,加入Rikacid MH-700使得當量比成為0.9而均一地混合後,與實施例1~3同樣地做法,製作彎曲試驗用試驗片及玻璃轉移點測定用試驗片,求出彎曲強度、彎曲彈性率及玻璃轉移點。
比較例8
於雙酚F型環氧樹脂(YD-170)中,加入Rikacid MH-700使得當量比成為0.9而均一地混合後,與實施例1~3同樣地做法,製作彎曲試驗用試驗片及玻璃轉移點測定用試驗片,求出彎曲強度、彎曲彈性率及玻璃轉移點。
比較例9
於酚酚醛清漆型環氧樹脂(YDPN-638)中,加入Rikacid MH-700使得當量比成為0.9而均一地混合後,與實施例1~3同樣地做法,製作彎曲試驗用試驗片及玻璃轉移點測定用試驗片,求出彎曲強度、彎曲彈性率及玻璃轉移點。
將比較例7~9所使用之環氧樹脂在25℃之黏度及硬化物的物性測定值表示於表2中。又,化合物添加量為0。
參考例
測定苯基縮水甘油基醚(PGE)、丁基縮水甘油基醚(BGE)及TEpCH之水解性氯濃度後,如以下。
TEpCH:未檢測出
PGE:53ppm
BGE:16ppm
水解性氯含量係以如下的方法進行分析。亦即,使試料約1g精密地取至100ml三角燒瓶中,正確秤量至1mg之單位。加入二噁烷30ml,使用超音波洗淨器而完全溶解。正確加入1N氫氧化鉀‧乙醇溶液5ml後,充分振動混合後,加入沸石,安裝冷卻管。加熱至約180℃,進行回流。回流時間係開始沸騰後正確地為30分鐘。冷卻至室溫後,以甲醇5ml洗淨冷卻管,洗液加入於試料液中。使三角燒瓶從冷卻管卸下,試料液係移入至200ml燒杯中。以80%丙酮水50ml分成3次而於燒瓶內洗淨,使洗液加入於試料液中。正確地加入N/400氯化鈉溶液5ml,置入旋轉子。加入醋酸3ml,攪拌2分鐘後,使用N/100硝酸銀溶液而以如下之條件進行電位差滴定。與以上同一操作,進行空試驗。
依下式,求出水解性氯濃度。
水解性氯(%)=F×(V-B)×0.0355/S
F:N/100硝酸銀溶液之因子
V:試料之滴定需要的N/100硝酸銀溶液的量
B:空試驗之滴定需要的N/100硝酸銀溶液的量
S:試料量(g)
實施例6
相對於氫化雙酚A縮水甘油基醚型環氧樹脂(Rikresin HBE-100;新日本理化股份公司製黏度(1950 cps 25℃)100重量份,加入合成例1得到之1,2,4-三環氧基乙基環己烷(TEpCH)50重量份,混合得到環氧樹脂組成物。於此環氧樹脂組成物中,加入Rikacid MH-700以使當量比成為0.9而均一地混合後,真空脫氣而在模具內,以100℃4小時,進而以140℃硬化12小時而製作厚1mm及4mm之樹脂板。使用此試驗片,進行硬化物之初期透過度、耐UV性之測定、初期耐熱性之測定。又,與實施例1~3同樣地做法,製作彎曲試驗用試驗片及玻璃轉移點測定用試驗片,求出彎曲強度、彎曲彈性率及玻璃轉移點。
比較例10
相對於氫化雙酚A縮水甘油基醚型環氧樹脂(Rikresin HBE-100;新日本理化股份公司製黏度(1950 cps 25℃)100重量份,加入合成例2得到之二環氧基乙基苯(DEpEB)50重量份,混合得到環氧樹脂組成物。於此環氧樹脂組成物中,加入Rikacid MH-700以使當量比成為0.9而均一地混合後,真空脫氣而在模具內,以100℃ 4小時,進而以140℃硬化12小時而製作厚1mm及4mm之樹脂板。使用此試驗片,進行硬化物之初期透過度、耐UV性之測定、初期耐熱性之測定。又,與實施例1~3同樣地做法,製作彎曲試驗用試驗片及玻璃轉移點測定用試驗片,求出彎曲強度、彎曲彈性率及玻璃轉移點。
在實施例6、比較例10中,硬化物之初期透過度、耐UV性之測定、初期耐熱性之測定係以如下之方法進行。
初期透過度
於厚度1mm之樹脂板,使用日立製作所製自記分光光度計U-3410,測定400nm之硬化物的透過度。
耐UV性
於厚度4mm之樹脂板,使用Q Panel公司製耐候性試驗機QUV而UV照射600小時後的400nm之透過度,與初期透過度同樣做法而進行測定。於QUV之燈係使用UVA 340nm,黑面板溫度為55℃。
初期耐熱性
於厚度1mm之樹脂板,在150℃之環境下曝光72小時後的400nm之透過度,與初期透過度同樣做法而測定。
將實施例6及比較例10之樹脂組成物的摻合組成、黏度、硬化物之物性值、硬化物之初期透過度、耐UV性及初期耐熱性表示於表3中。又,化合物添加量相對於環氧樹脂100重量份之環氧化合物的摻合量。
如表3所示般,摻合TEpCH之硬化物係初期透過度、耐UV性、初期耐熱性優異。亦即,透明性、耐光性優異,可用來作為光學樹脂。
本發明之環氧樹脂組成物係低黏度且作業性優異,使其硬化而得到之環氧樹脂硬化物係耐熱性、機械特性、透明性、耐光性優異。
Claims (4)
- 一種環氧樹脂組成物,其特徵係含有在25℃之黏度為1000mPa‧s以上之環氧樹脂、與黏度為10~500Pa‧s之以下式(1)所示之聚環氧基乙基環己烷,聚環氧基乙基環己烷之含量相對於前述環氧樹脂100重量份為10重量份以上60重量份以下;
式中,E表示環氧基,R表示氫、乙烯基或碳數1~6之烷基,n表示2~3之整數。 - 如申請專利範圍第1項之環氧樹脂組成物,其中聚環氧基乙基環己烷為1,2,4-三環氧基乙基環己烷。
- 一種環氧樹脂硬化物,其特徵係於如申請專利範圍第1項之環氧樹脂組成物中以環氧基與硬化劑中的官能基當量比成為0.8~1.5的範圍之量摻合選自第一胺類、第二胺類、第三胺類及酸酐類之硬化劑,使之硬化而成。
- 一種環氧樹脂用之反應性稀釋劑,其特徵係由25℃之黏度10~500Pa‧s之以下式(1)所示之聚環氧基乙基環己烷所構成,
式中,E表示環氧基,R表示氫、乙烯基或碳數1~6之烷基,n表示2~3之整數。
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