TWI520281B - Composite containing nano nickel lines and semifinished product - Google Patents

Description

Composite and semi-finished products with nano nickel wire

The present invention relates to a composite material for heat conduction and comprising a metal material, and more particularly to a composite material having a nano nickel wire.

As the number of components in an integrated circuit or a printed circuit board increases, there is a problem that a large amount of thermal energy is generated and heat dissipation is not easy. When the thermal energy cannot be dispelled, the ambient temperature of the component rises, resulting in a drastic drop in work efficiency, which in turn leads to poor performance of the integrated circuit or printed circuit board, and long-term high temperature, which makes the integrated circuit or printed circuit board Life decay. Therefore, reducing the generation of thermal energy or improving the heat dissipation efficiency is an urgent problem to be solved.

In the past, the method of improving heat dissipation is generally to provide a heat conductive composite material on the integrated circuit or the printed circuit board, and the heat conductive composite material is composed of a polymer body and a heat conductive filler material in the polymer body. The heat conductive filler comprises carbon, silver, copper, iron, boron nitride, aluminum nitride or aluminum oxide, and the heat conductive filler has a powder form. Although the heat conductive filler has thermal conductivity, the heat conductive filler is irregularly dispersed in the polymer body, so that the heat energy is transmitted in an irregular direction, thereby failing to efficiently transfer heat energy, and then the heat energy is effectively discharged. Therefore, the thermal conductivity of the thermally conductive composite material still does not meet the needs of the industry.

According to the above description, the heat conductive composite material is improved to provide a better heat dissipation effect for the integrated circuit or the printed circuit board, thereby avoiding the performance deterioration or the life shortening of the integrated circuit or the printed circuit board, and is a person skilled in the technical field. A topic that can be broken again.

Accordingly, a first object of the present invention is to provide a composite material having a nano nickel wire having thermal conductivity.

Thus, the present invention has a nano nickel wire composite comprising: a polymer body; and a plurality of substantially identical aligned nano nickel wires, wherein the nano nickel wires are respectively located in the polymer body.

A second object of the invention is to provide a semi-finished product having thermal conductivity.

Thus, the semifinished product of the present invention comprises: a composite material having a nanonickel wire as described above, and an element incorporating the composite material having the nanonickel wire.

The effect of the present invention is that, due to the substantially co-directional alignment characteristics of the nano nickel wires, when a thermal energy passes through the composite material having nano nickel wires, the thermal energy can be aligned along the nano nickel wires. The regular heat transfer is performed, and the heat energy is efficiently and uniformly discharged. Therefore, the composite material having the nano nickel wire of the present invention has better thermal conductivity.

The composite material having nano nickel wire comprises: a polymer body; and a plurality of substantially identical nickel wires arranged in the same direction, wherein the nano nickel wires are respectively located in the polymer body.

The aspect in which the nano nickel wires are respectively located in the polymer body is not particularly limited, so that heat energy can be efficiently and continuously transmitted. See Figure 1, these The nano nickel wires 2 are respectively located in the polymer body 1, preferably, the nano nickel wires 2 which can effectively discharge the heat energy through the substantially in the same direction are discharged to the outside. Referring to FIG. 2, the nano nickel wires are connected. The top surface and/or the bottom surface of each nano nickel wire in 2 respectively form a substantially flat surface with the top surface and/or the bottom surface of the polymer body 1, respectively, which is permeable to the thickness of the polymer body 1 and the The length of the rice nickel wire 2 is achieved, or by cutting the nano nickel wire composite; more preferably, referring to FIG. 3, at least one of the ends of the nano nickel wire 2 is respectively Located outside the polymer body 1, it can be achieved by adjusting the thickness of the polymer body 2 and the length of the nano nickel wires 1.

The polymer body of the present invention is not particularly limited as long as it can withstand heat, and the polymer body includes, but is not limited to, an epoxy polymer, a silicone, a polyurethane, and a poly. Polyimide or acrylate resin. Preferably, the average equivalent diameter of the nano nickel wires ranges from 300 nm to 800 nm. The nano nickel wires are not particularly limited as long as they have magnetic induction characteristics. Preferably, the nano nickel wires respectively comprise a nickel wire body and a coating film on the nickel wire body, and The coating film is selected from a nickel oxide film or a conductive metal film. The coating film in the nano nickel wire is formed by coating a nickel oxide material or a conductive metal material on the nickel wire body, or oxidizing the nickel wire precursor to form nickel oxide. Or generating a nickel wire precursor with a conductive metal precursor.

Preferably, the nickel wire body has an average equivalent diameter ranging from 100 nm to 300 nm. The role of the nickel oxide film in the nano nickel wires is to reduce the conductivity of the nano nickel wires, which can be used to replace the commonly used insulation on the circuit board. Protective film, or other products that require thermal conductivity and insulation. The function of the conductive metal film in the nano nickel wires is to enhance the conductivity of the nano nickel wires, and can be used to replace the silver glue applied in the packaging process or other products requiring heat conduction and electrical conductivity.

Preferably, the total amount of the nano nickel wires used is in the range of 5 wt% to 20 wt%, based on the total amount of the nano nickel wire-containing composite material being 100 wt%. When the total use amount of the nano nickel wires is less than 5 wt%, the thermal conductivity of the composite material having the nano nickel wires is not good; when the total use amount of the nano nickel wires is more than 20 wt%, then the The dispersibility of the nanowires is not good.

The nano nickel wire composite material is formed by magnetic alignment treatment and curing treatment of a composition comprising a curable material and a plurality of nano nickel wires.

The curable material is not particularly limited as long as it can be subjected to a subsequent curing treatment, including but not limited to an epoxy polymer, a silicone, a polyurethane ( Polyurethane), polyimide or acrylate resin. These nano nickel wires are as described above and will not be described again.

Preferably, the magnetic alignment process has an operating magnetic field ranging from 500 Gauss to 5,000 Gauss to make the nanowires substantially aligned in the same direction. The effect of the curing process is to cure the curable material to maintain the direction of the nano nickel wires after magnetic alignment treatment. Preferably, the curing treatment is selected from a photocuring treatment, a thermal curing treatment, or a combination thereof.

Preferably, the composition further comprises a surfactant. The role of the surfactant is to enhance the dispersibility of the nano nickel wires so that they can be evenly divided. Disperse, but not aggregate, and make these nano nickel wires have good adhesion to the polymer body. The surfactant includes, but is not limited to, 3-aminopropyltriethoxysilane, dichlorodimethylsilane, dimethoxydimethylsilane, trichloromethane. Trichloromethylsilane, 3-(methacryloyloxy)propyl-trimethoxysilane, or triethoxyvinysilane.

The preparation method of the nano nickel wire composite material comprises the steps of: providing a curable material; adding a plurality of nano nickel wires to the curable material to form a composition, and applying the composition A magnetic alignment treatment is performed to align the nano nickel wires in substantially the same direction; then, a curing treatment is applied to cure the curable material.

The curable material, the nano nickel wires, the magnetic alignment treatment and the curing treatment are as described above, and therefore will not be described again.

The semifinished product of the present invention comprises a composite material having a nanonickel wire as described above, and an element incorporating the composite material having a nanonickel wire.

The element is not particularly limited, such as a transistor in an integrated circuit, a circuit in a printed circuit board, or a crystal grain in a light-emitting diode.

The aspect in which the element is combined with the composite material having a nano nickel wire is not particularly limited, for example, the composite material having a nano nickel wire is coated with the component, or The composite having a nanonickel wire is on a surface of the component.

The preparation method of the semi-finished product is not particularly limited, and the following two methods can be employed.

Method 1: The preparation method of the semi-finished product comprises the steps of: providing a curable material; adding a plurality of nano nickel wires to the curable material to form a composition, providing a component, and forming the composition On the component; then, a magnetic alignment treatment is applied to substantially align the nano nickel wires in the same direction; thereafter, a curing treatment is applied to cure the curable material.

The manner in which the composition is formed on the element is not particularly limited, for example, the composition is formed on the surface of the element by a coating method, or the element is placed in a mold having an accommodating space. The composition was poured into the mold to coat the component. The curable material, the nano nickel wires, the magnetic alignment treatment and the curing treatment are as described above, and therefore will not be described again.

Method 2: The preparation method of the semi-finished product comprises the steps of: providing a component; providing a curable material and forming on the component; forming a plurality of nano nickel wires on the curable material; and then applying A magnetic alignment treatment is performed to substantially align the nano nickel wires in the same direction; then, a curing treatment is applied to cure the curable material.

There is no particular limitation on the manner in which the curable material is formed on the component. The curable material is formed on the element by, for example, coating. The curable material, the nano nickel wires, the magnetic alignment treatment and the curing treatment are as described above, and therefore will not be described again.

The invention is further described in the following examples, but it should be understood that these examples are for illustrative purposes only and are not to be construed as limiting.

<Example> <Preparation Example 1> Preparation of nano nickel wire

A plurality of nano nickel wires having an average equivalent diameter of 600 nm were placed in an oven at 300 ° C for 2 hours to obtain a plurality of nano nickel wires having an average equivalent diameter of 600 nm, and the nano nickel wires respectively included A nickel wire body and a nickel oxide film having an average equivalent diameter of 200 nm.

<Example 1> Preparation of composite material having nano nickel wire

0.2 g of a nanonickel wire having an average equivalent diameter of 600 nm, 3.8 g of a decyloxy resin, and 0.5 wt% of 3-aminopropyltriethoxydecane were placed in a container and uniformly mixed, and then, Applying a magnetic field of 1,000 Gauss, so that the nano nickel wires are substantially aligned in the same direction, and then the container is placed in an oven at 80 ° C for curing treatment, thereby obtaining a composite material having nano nickel wires, and the like The nanonickel wires are respectively located in the cured silicone resin body.

<Example 2>

0.3 g of a nanonickel wire having an average equivalent diameter of 600 nm, 2.7 g of a decyloxy resin, and 0.5 wt% of 3-aminopropyltriethoxydecane were placed in a container and uniformly mixed, and then, A magnetic field of 1,000 Gauss was applied to arrange the nano nickel wires in substantially the same direction, after which the container was placed in an oven at 80 ° C. The curing treatment is carried out to obtain a composite material having nano nickel wires, and the nano nickel wires are respectively located in the cured silicone resin body.

<Example 3>

0.5 g of a nanonickel wire having an average equivalent diameter of 600 nm, 2 g of a decyloxy resin, and 0.5 wt% of 3-aminopropyltriethoxydecane were placed in a container and uniformly mixed, and then, Applying a magnetic field of 1,000 Gauss, so that the nano nickel wires are substantially aligned in the same direction, and then the container is placed in an oven at 80 ° C for curing treatment, thereby obtaining a composite material having nano nickel wires, and the like The nanonickel wires are respectively located in the cured silicone resin body.

<Example 4>

0.2 g of the nanonickel wire of Preparation Example 1, 3.8 g of a decyloxy resin, and 0.5% by weight of 3-aminopropyltriethoxydecane were placed in a container and uniformly mixed, and then 1,000 was administered. The magnetic field of Gauss makes the nano nickel wires substantially aligned in the same direction, and then the container is placed in an oven at 80 ° C for curing treatment, thereby obtaining a composite material having nano nickel wires, and the nano nickel The wires are located in the cured silicone resin body, respectively.

<Example 5>

0.3 g of the nanonickel wire of Preparation Example 1, 2.7 g of a decyloxy resin, and 0.5% by weight of 3-aminopropyltriethoxydecane were placed in a container and uniformly mixed, and then 1,000 was administered. The magnetic field of Gauss makes the nano nickel wires substantially aligned in the same direction, and then the container is placed in an oven at 80 ° C for curing treatment, thereby obtaining a composite material having nano nickel wires, and the nano nickel The wires are located in the cured silicone resin body, respectively.

<Example 6>

0.5 g of the nanonickel wire of Preparation Example 1, 2 g of a decyloxy resin, and 0.5% by weight of 3-aminopropyltriethoxydecane were placed in a container and uniformly mixed, and then 1,000 was administered. The magnetic field of Gauss makes the nano nickel wires substantially aligned in the same direction, and then the container is placed in an oven at 80 ° C for curing treatment, thereby obtaining a composite material having nano nickel wires, and the nano nickel The wires are located in the cured silicone resin body, respectively.

<Example 7>

3.8 g of a cerium oxide resin was applied on the top surface of a substrate, and a magnetic field of 1,000 gauss was applied to the bottom surface of the substrate, and then 0.2 gram of nano nickel having an average equivalent diameter of 600 nm was applied to the enamel resin. Sprinkling on the top, the nano nickel wires are substantially aligned in the same direction due to the action of the magnetic field, and one end portion of the nano nickel wires of the nano nickel wires are respectively located outside the epoxy resin, and then the substrate is placed. The composite material having a nano nickel wire was obtained by performing a curing treatment in an oven at 80 °C.

<Example 8>

2.7 g of a cerium oxide resin was coated on the top surface of a substrate, and a magnetic field of 1,000 gauss was applied to the bottom surface of the substrate, and then 0.3 g of a nano nickel having an average equivalent diameter of 600 nm was applied to the enamel resin. Sprinkling on the top, the nano nickel wires are substantially aligned in the same direction due to the action of the magnetic field, and one end portion of the nano nickel wires of the nano nickel wires are respectively located outside the epoxy resin, and then the substrate is placed. The composite material having a nano nickel wire was obtained by performing a curing treatment in an oven at 80 °C.

<Example 9>

Applying 2 grams of enamel resin to the top surface of a substrate, and at the base A magnetic field of 1,000 Gauss is applied to the bottom surface of the plate, and then 0.5 g of a nano nickel wire having an average equivalent diameter of 600 mm is sprinkled over the epoxy resin, and the nano nickel wires are substantially aligned in the same direction due to the action of the magnetic field. And one end portion of the nano nickel wire of the nano nickel wire is located outside the epoxy resin, and then the substrate is placed in an oven at 80 ° C for curing treatment, thereby obtaining a nano nickel wire. Composite material.

<Example 10>

3.8 g of a cerium oxide resin was applied on the top surface of a substrate, and a magnetic field of 1,000 gauss was applied to the bottom surface of the substrate, and then 0.2 g of the nanonickel wire of Preparation Example 1 was sprinkled over the enamel resin. The nano nickel wires are substantially aligned in the same direction due to the action of the magnetic field, and one end portion of the nano nickel wires of the nano nickel wires are respectively located outside the epoxy resin, and then the substrate is placed A composite material having a nano nickel wire can be obtained by performing a curing treatment in an oven at 80 °C.

<Example 11>

2.7 g of a silicone resin was applied on the top surface of a substrate, and a magnetic field of 1,000 gauss was applied to the bottom surface of the substrate. Then, 0.3 g of the nano nickel wire of Preparation Example 1 was sprinkled over the epoxy resin. The nano nickel wires are substantially aligned in the same direction due to the action of the magnetic field, and one end portion of the nano nickel wires of the nano nickel wires are respectively located outside the epoxy resin, and then the substrate is placed A composite material having a nano nickel wire can be obtained by performing a curing treatment in an oven at 80 °C.

<Example 12>

Applying 2 grams of enamel resin to the top surface of a substrate, and at the base A magnetic field of 1,000 Gauss is applied to the bottom surface of the plate, and then 0.5 g of the nano nickel wire of Preparation Example 1 is sprinkled over the epoxy resin, and the nano nickel wires are substantially aligned in the same direction due to the action of the magnetic field, and the One end portion of the nano nickel wire of the nano nickel wire is located outside the epoxy resin, and then the substrate is placed in an oven at 80 ° C for curing treatment, thereby obtaining a composite material having a nano nickel wire. .

<Comparative Example 1>

0.2 g of a nano nickel wire having an average equivalent diameter of 600 nm, 3.8 g of a decyloxy resin, and 0.5 wt% of 3-aminopropyltriethoxy decane were placed in a container and uniformly mixed, and then, The container was subjected to a curing treatment in an oven at 80 ° C to obtain a composite material having nano nickel wires, and the nano nickel wires were respectively positioned in the cured silicone resin body.

<Comparative Example 2>

0.3 g of a nano nickel wire having an average equivalent diameter of 600 nm, 2.7 g of a decyloxy resin, and 0.5 wt% of 3-aminopropyltriethoxy decane were placed in a container and uniformly mixed, and then, The container was subjected to a curing treatment in an oven at 80 ° C to obtain a composite material having nano nickel wires, and the nano nickel wires were respectively positioned in the cured silicone resin body.

<Comparative Example 3>

0.5 g of a nano nickel wire having an average equivalent diameter of 600 nm, 2 g of a decyloxy resin, and 0.5 wt% of 3-aminopropyltriethoxy decane are placed in a container and uniformly mixed, and then, The container was subjected to a curing treatment in an oven at 80 ° C to obtain a composite material having nano nickel wires, and the nano nickel wires were respectively positioned in the cured silicone resin body.

<Comparative Example 4>

0.2 g of the nanonickel wire of Preparation Example 1, 3.8 g of a decyloxy resin, and 0.5% by weight of 3-aminopropyltriethoxydecane were placed in a container and uniformly mixed, and then, the container was placed. The composite material having nano nickel wires was obtained by curing in an oven at 80 ° C, and the nano nickel wires were respectively located in the cured epoxy resin body.

<Comparative Example 5>

0.3 g of the nanonickel wire of Preparation Example 1, 2.7 g of a decyloxy resin, and 0.5% by weight of 3-aminopropyltriethoxydecane were placed in a container and uniformly mixed, and then, the container was placed. The composite material having nano nickel wires was obtained by curing in an oven at 80 ° C, and the nano nickel wires were respectively located in the cured epoxy resin body.

<Comparative Example 6>

0.5 g of the nanonickel wire of Preparation Example 1, 2 g of a decyloxy resin, and 0.5% by weight of 3-aminopropyltriethoxydecane were placed in a container and uniformly mixed, and then, the container was placed. The composite material having nano nickel wires was obtained by curing in an oven at 80 ° C, and the nano nickel wires were respectively located in the cured epoxy resin body.

<Comparative Example 7>

0.2 g of a silicone resin was coated on the top surface of a substrate, and then 3.8 g of a nano nickel wire having an average equivalent diameter of 600 nm was sprinkled over the epoxy resin, and then the substrate was placed at 80 ° C. The curing process can be carried out in an oven.

<Comparative Example 8>

2.7 g of a silicone resin was coated on the top surface of a substrate, and then 0.3 g of a nano nickel wire having an average equivalent diameter of 600 nm was sprinkled over the epoxy resin, and then the substrate was placed at 80 ° C. The curing process can be carried out in an oven.

<Comparative Example 9>

2 g of a silicone resin was coated on the top surface of a substrate, and then 0.5 g of a nano nickel wire having an average equivalent diameter of 600 nm was sprinkled over the epoxy resin, and then the substrate was placed at 80 ° C. The curing process can be carried out in an oven.

<Comparative Example 10>

0.2 g of a silicone resin was coated on the top surface of a substrate, and then 3.8 g of the nanonickel wire of Preparation Example 1 was sprinkled over the epoxy resin, and then the substrate was placed in an oven at 80 ° C. It can be cured in the middle.

<Comparative Example 11>

2.7 g of a silicone resin was coated on the top surface of a substrate, and then 0.3 g of the nano nickel wire of Preparation Example 1 was sprinkled over the epoxy resin, and then the substrate was placed in an oven at 80 ° C. It can be cured in the middle.

<Comparative Example 12>

2 g of the epoxy resin was coated on the top surface of a substrate, and then 0.5 g of the nano nickel wire of Preparation Example 1 was sprinkled over the epoxy resin, and then the substrate was placed in an oven at 80 ° C. It can be cured in the middle.

【Test items】

1. Thermal conductivity (unit: w/mK) detection: The thermal conductivity coefficients of Examples 1 to 12 and Comparative Examples 1 to 12 were measured by a hot plate method, and the measuring instrument was a thermal conductivity analyzer of Comes. TPS 2500. The sample size is 3 cm in diameter and 500 μm to 1 cm thick.

From the data results of Table 1, it is known that Comparative Examples 1 to 3 have nano nickel. The nano nickel wires of the wire composite are respectively located in the polymer body and are not aligned in the same direction, and in the composite materials having the nano nickel wires of Examples 1 to 3, the nano nickel wires are respectively In the polymer body, and arranged in the same direction, in contrast, the composite material having the nano nickel wire of the present invention has a better heat transfer coefficient (0.461 w/mK to 1.221 w/mK), which indicates the present invention. A composite material having a nano nickel wire has better thermal conductivity.

The nano nickel wires of the nano nickel wire-containing composites of Comparative Examples 4 to 6 were respectively located in the polymer body and were not aligned in the same direction, and the composites of Examples 4 to 6 having nano nickel wires. In the material, the nano nickel wires are respectively located in the polymer body and arranged in the same direction. In contrast, the composite material having the nano nickel wire of the present invention has a better heat transfer coefficient (0.4118 w/mK to 1.055w/mK), which means that the composite material having the nano nickel wire of the present invention has better thermal conductivity.

One end portions of the nano nickel wires of the nano nickel wires of the composite materials of Comparative Examples 7 to 9 were respectively located outside the polymer body, and were not aligned in the same direction, and Example 7 was In the composite material having a nano nickel wire, a part of the nano nickel wire of the nano nickel wire is located outside the polymer body and arranged in the same direction. In contrast, the present invention has a nai. The composite of the rice nickel wire has a better heat transfer coefficient (0.5108 w/mK to 1.467 w/mK), which means that the composite material having the nanonickel wire of the present invention has better thermal conductivity.

One end portions of the nano nickel wires of the nano nickel wires of the composite materials of Comparative Examples 10 to 12 were respectively located outside the polymer body, and were not aligned in the same direction, and Example 10 to 12 composite with nano nickel wire In the material, one end portion of the nano nickel wire of the nano nickel wire is located outside the polymer body and arranged in the same direction. In comparison, the composite material having the nano nickel wire of the present invention has better properties. The heat transfer coefficient (0.4011 w/mK to 1.097 w/mK) indicates that the composite material having the nano nickel wire of the present invention has better thermal conductivity.

The nano nickel wires of the composite having nano nickel wires of Examples 1 to 3 are respectively located in the polymer body, and the composite of the nano nickel wires of Examples 7 to 9 The one end portion of the nano nickel wire of the nano nickel wire is located outside the polymer body, and the composite material having the nano nickel wire of Examples 7 to 9 has better thermal conductivity.

In summary, the composite material having nano nickel wires of the present invention has better thermal conductivity, and when a thermal energy passes through the composite material having nano nickel wires, due to the substantial alignment characteristics of the nano nickel wires The heat energy can be subjected to regular heat transfer along the direction of the nano nickel wires, and the heat energy can be efficiently and uniformly discharged, and one end portion of the nano nickel wire of the nano nickel wires In addition to being in the polymer body, the composite material having the nanonickel wire can have better thermal conductivity, so that the object of the present invention can be achieved.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

1‧‧‧ polymer body

2‧‧‧Nylon nickel wire

Figure 1 is a schematic cross-sectional view showing the nano nickel wires of the present invention in the polymer body; 2 is a schematic cross-sectional view showing that the top surface and the bottom surface of each nano nickel wire in the nano nickel wires of the present invention form a substantial plane together with the top surface and the bottom surface of the polymer body; and FIG. 3 A schematic cross-sectional view showing that the ends of a portion of the nanonickel wires of the nano nickel wires of the present invention are respectively located outside the polymer body.

1‧‧‧ polymer body

2‧‧‧Nylon nickel wire

Claims (10)

A composite material having nano nickel wires, comprising: a polymer body; and a plurality of substantially identical nickel wires arranged in the same direction, wherein the nano nickel wires are respectively located in the polymer body. The composite material having nano nickel wires according to claim 1, wherein the total amount of the nano nickel wires is 100% by weight based on the total amount of the nano nickel wires. 5 wt% to 20 wt%. The nano nickel wire-containing composite material according to claim 1, wherein the nano nickel wires have an average equivalent diameter ranging from 300 nm to 800 nm. The composite material having nano nickel wires according to claim 1, wherein at least one of both end portions of a portion of the nano nickel wires of the nano nickel wires is located outside the polymer body. . The composite material having nano nickel wires according to claim 1, wherein a top surface and/or a bottom surface of each nano nickel wire in the nano nickel wires respectively and a top of the polymer body The faces and/or the bottom faces together form a substantially planar surface. The composite material having a nano nickel wire according to claim 1 is formed by a magnetic alignment treatment and a curing treatment, the composition comprising a curable material and a plurality of nano nickel wires. . The composite material having a nanonickel wire according to claim 6, wherein the magnetic alignment process has an operating magnetic field ranging from 500 gauss to 5,000 gauss. The nano nickel wire-containing composite material according to any one of claims 1 to 7, wherein the nano nickel wires respectively comprise a nickel wire body and a coating on the nickel wire body. a film, and the coating film is selected from a nickel oxide film or a conductive metal film. The composite material having a nanonickel wire according to the invention of claim 8, wherein the nickel wire body has an average equivalent diameter ranging from 100 nm to 300 nm. A semi-finished product comprising a composite material having a nano nickel wire as described in claim 8 of the patent application, and an element incorporating the composite material having a nano nickel wire.