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TWI516085B - Contact image sensing device - Google Patents

Contact image sensing device Download PDF

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TWI516085B
TWI516085B TW101150711A TW101150711A TWI516085B TW I516085 B TWI516085 B TW I516085B TW 101150711 A TW101150711 A TW 101150711A TW 101150711 A TW101150711 A TW 101150711A TW I516085 B TWI516085 B TW I516085B
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light
sensing device
image
contact image
sensing
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TW101150711A
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TW201427384A (en
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李彭榮
林明傑
徐仲凱
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菱光科技股份有限公司
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Description

接觸式影像感測裝置 Contact image sensing device

本發明係有關於一種影像感測模組,尤指一種接觸式影像感測模組。 The invention relates to an image sensing module, in particular to a contact image sensing module.

接觸式影像感測模組(contact image sensor)為線型影像感測器的一種,主要應用於掃描器、傳真機以及多功能事務機,以將平面的圖像或文件掃描成電子格式,以便於儲存、顯示或傳輸。 The contact image sensor is a kind of line image sensor, which is mainly used in scanners, fax machines, and multifunction machines to scan flat images or documents into an electronic format, so as to facilitate Store, display or transfer.

接觸式影像感測器的工作原理是將光源所產生的光線照射到待掃描的稿件上,經過稿件反射光線,並利用一鏡片組將該反射光線聚集於電荷耦合元件(charge-coupled device,CCD)或是互補式金屬氧化物半導體(complementary metal oxide semiconductor,CMOS)等感光元件上,利用感光元件將光的訊號改變為電的訊號,進而產生類比或數位畫數(pixel)資料。 The working principle of the contact image sensor is to illuminate the light generated by the light source onto the manuscript to be scanned, reflect the light through the manuscript, and focus the reflected light on the charge-coupled device (CCD) by using a lens group. Or on a photosensitive element such as a complementary metal oxide semiconductor (CMOS), the photosensitive element is used to change the signal of the light into an electrical signal, thereby generating analog or digital pixel data.

配合參閱第一圖,為習知之接觸式影像感測器之剖視圖。該接觸式影像感測器1包含一座體10、一發光元件12、一柱狀透鏡(rod lens)組14、一感測單元16及一反射鏡18。該座體10具有一容置槽100及一穿槽102。該發光元件12設置於該容置槽100,用以提供該接觸式影像感測器1感測一物體22時所需的光源提供。該柱狀透鏡組14設置於該穿槽102中。該感測單元16包含一電路板160以及設置於該電路板160上之複數感光元件162。該反射鏡18設 置於該柱狀透鏡組14及該感光元件162之間,用以反射通過該柱狀透鏡組14之光線,使光線進入該等感光元件162中。 Referring to the first figure, it is a cross-sectional view of a conventional contact image sensor. The contact image sensor 1 includes a body 10, a light emitting element 12, a rod lens group 14, a sensing unit 16, and a mirror 18. The base 10 has a receiving slot 100 and a slot 102. The illuminating element 12 is disposed in the accommodating slot 100 for providing a light source provided when the contact image sensor 1 senses an object 22. The lenticular lens group 14 is disposed in the through groove 102. The sensing unit 16 includes a circuit board 160 and a plurality of photosensitive elements 162 disposed on the circuit board 160. The mirror 18 is provided The lenticular lens group 14 and the photosensitive element 162 are disposed to reflect light passing through the lenticular lens group 14 to allow light to enter the photosensitive element 162.

於實際使用時,由該發光元件12發出的一光線係通過一透光玻璃20投射至該物體22,經該物體22反射後產生之影像光線係通過該柱狀透鏡組14傳遞至該反射鏡18,並由反射鏡18反射後成像於該等感測元件162。 In actual use, a light emitted by the light-emitting element 12 is projected to the object 22 through a light-transmissive glass 20, and image light generated by the object 22 is transmitted to the mirror through the lenticular lens group 14. 18, and reflected by the mirror 18 and imaged on the sensing elements 162.

該反射鏡18的使用雖然可以有效地降低該接觸式影像感測器1的整體高度,卻大幅地提升了該接觸式影像感測器1的製作成本、組裝的複雜度及該座體10的公差要求。 The use of the mirror 18 can effectively reduce the overall height of the contact image sensor 1 , but greatly increases the manufacturing cost, assembly complexity, and the body 10 of the contact image sensor 1 . Tolerance requirements.

鑒於先前技術所述,本發明之一目的,在於提供一種接觸式影像感測裝置。 In view of the prior art, it is an object of the present invention to provide a contact image sensing device.

為達上述目的,本發明提供一種接觸式影像感測裝置,一種接觸式影像感測裝置,用以感測一物體之影像,該接觸式影像感測裝置包含一座體、一發光單元、一柱狀透鏡陣列、一透光元件及一感測單元。該座體包含一第一容置槽、一大致平行於該第一容置槽之一穿槽,以及一連通該穿槽之第二容置槽,該第二容置槽的開口方向係垂直於該第一容置槽的開口方向;該發光單元設置於該第一容置槽中,並朝向該物體發出光線;該柱狀透鏡陣列設置於該穿槽中;該透光元件包含一本體,該本體具有一全反射面,該透光元件設置於該穿槽中並位於該柱狀透鏡陣列下方;該感測單元設置於該第二容置槽中,該感測單元包含 複數感測元件,該等感測元件係面對該透光元件,經由物體反射後之一影像光線係通過該柱狀透鏡陣列傳遞至該全反射面,該全反射面係反射該影像光線,使該影像光線成像於該等感測元件。 To achieve the above objective, the present invention provides a contact image sensing device, a contact image sensing device for sensing an image of an object, the contact image sensing device comprising a body, a light emitting unit, and a column The lens array, a light transmissive element and a sensing unit. The base body includes a first accommodating groove, a groove substantially parallel to the first accommodating groove, and a second accommodating groove communicating with the through groove. The opening direction of the second accommodating groove is vertical In the opening direction of the first accommodating groove; the illuminating unit is disposed in the first accommodating groove and emits light toward the object; the lenticular lens array is disposed in the through slot; the transparent component comprises a body The light-emitting element is disposed in the through-groove and located under the lenticular lens array; the sensing unit is disposed in the second accommodating groove, and the sensing unit includes a plurality of sensing elements facing the light transmissive element, and one of the image light rays reflected by the object is transmitted to the total reflection surface through the lenticular lens array, and the total reflection surface reflects the image light. The image light is imaged onto the sensing elements.

配合參閱第二圖及第三圖,分別為本發明第一實施例之接觸式影像感測裝置之立體分解圖及剖視圖。該接觸式影像感測裝置3主要應用於掃描器、傳真機以及多功能事務機,用以感測一設置於該接觸式影像感測裝置3上之一物體4的影像,並將物體4影像轉換為類比或數位影像資料。該接觸式影像感測裝置3包含一座體30、一發光單元32、一柱狀透鏡陣列(rod lens array)34、一感測單元36及一透光元件38。該座體30的上方有一透明玻璃件40,該物體4係擺放於該透明玻璃件40上方。 Referring to the second and third figures, respectively, an exploded perspective view and a cross-sectional view of the contact image sensing device according to the first embodiment of the present invention. The contact image sensing device 3 is mainly applied to a scanner, a fax machine, and a multifunction printer for sensing an image of an object 4 disposed on the contact image sensing device 3 and imaging the object 4 Convert to analog or digital image data. The contact image sensing device 3 includes a body 30, a light emitting unit 32, a rod lens array 34, a sensing unit 36, and a light transmitting member 38. Above the seat body 30 is a transparent glass member 40, and the object 4 is placed above the transparent glass member 40.

該座體30包含一第一容置槽300、一大致平行於該容置槽300之穿槽302及一第二容置槽304,該第二容置槽304的開口方向係大致垂於該第一容置槽300的開口方向,同時該第二容置槽304係連通該穿槽302;其中該穿槽302係貫穿該座體30。該座體30可例如使用塑膠或其他樹脂材料,通過射出成型技術製作而成。 The seat body 30 includes a first accommodating groove 300, a through groove 302 substantially parallel to the accommodating groove 300, and a second accommodating groove 304. The opening direction of the second accommodating groove 304 is substantially perpendicular to the The first receiving groove 300 is in the opening direction, and the second receiving groove 304 is connected to the through groove 302. The through groove 302 extends through the base 30. The body 30 can be fabricated by injection molding techniques, for example, using plastic or other resin materials.

該發光單元32設置於該第一容置槽300中,並朝向該物體4發出光線。該發光單元32包含至少一發光元件320及一導光元件322,該發光元件320可例如為發光二極體(light emitting diode,LED)或小型燈泡。該發光元件320設置於 該導光元件322之至少一側,並朝向該導光元件322發出光線。該導光元件322用以引導入射於其中的光線,使產生一線性光源。於實際實施時,該發光單元32可以為一燈條或燈管。 The light emitting unit 32 is disposed in the first receiving groove 300 and emits light toward the object 4 . The light emitting unit 32 includes at least one light emitting element 320 and a light guiding element 322. The light emitting element 320 can be, for example, a light emitting diode (LED) or a small light bulb. The light emitting element 320 is disposed on At least one side of the light guiding element 322 emits light toward the light guiding element 322. The light guiding element 322 is configured to guide light incident thereon to generate a linear light source. In actual implementation, the light emitting unit 32 can be a light bar or a light tube.

該柱狀透鏡陣列34設置於該穿槽302中,該柱狀透鏡陣列34具有複數柱狀透鏡340,各該柱狀透鏡340具有成像的功能。 The lenticular lens array 34 is disposed in the through groove 302. The lenticular lens array 34 has a plurality of cylindrical lenses 340, each of which has an imaging function.

該感測單元36設置於該第二容置槽304中。該感測單元36包含一電路板360及複數個感測元件362,該電路板360可例如(但不限定)為印刷電路板(printed circuit board,PCB)。該等感測元件362係平行於一軸線A地設置於該電路板360上並與該電路板360形成電性連接。各該感測元件362具有一光軸I,該光軸I平行於該物體4。各該感測元件362可以為電荷耦合元件(CCD)、互補式金屬氧化物半導體(CMOS)或其他具有光電轉換特性之元件,且較佳地該感測元件362可以為高解析度光線耦合元件。 The sensing unit 36 is disposed in the second receiving slot 304. The sensing unit 36 includes a circuit board 360 and a plurality of sensing elements 362, which may be, for example but not limited to, a printed circuit board (PCB). The sensing elements 362 are disposed on the circuit board 360 parallel to an axis A and are electrically connected to the circuit board 360. Each of the sensing elements 362 has an optical axis I that is parallel to the object 4. Each of the sensing elements 362 can be a charge coupled device (CCD), a complementary metal oxide semiconductor (CMOS) or other component having photoelectric conversion characteristics, and preferably the sensing element 362 can be a high resolution light coupling component. .

該透光元件38設置於該穿槽302中,並位於該柱狀透鏡陣列34下方,該等感測元件362係面對該透光元件38。透鏡元件38可例如使用聚甲基丙烯酸甲脂(PMMA)或聚碳酸酯(PC)等透光樹脂材質製成。該透光元件38包含一本體380,該本體380包含一凹槽部382、一全反射面384及一入光面386,其中該入光面386為該凹槽部382之底面。該凹槽部382用以供該柱狀透鏡陣列34容設於其中,且該柱狀透鏡陣列34之一底表面342係抵接於該入光面 386,如此一來,可以減少光線於該柱狀透鏡陣列34與該凹槽部382的接合處產生反射,進而提高光線傳遞至該透光元件38的機會。該全反射面384用以反射由該物體4反射並通過該柱狀透鏡陣列34之一影像光線L,使該影像光線L成像於該等感測元件362。 The light transmissive element 38 is disposed in the through slot 302 and is located below the lenticular lens array 34 . The sensing elements 362 face the light transmissive element 38 . The lens element 38 can be made of, for example, a light transmissive resin such as polymethyl methacrylate (PMMA) or polycarbonate (PC). The light-transmitting member 38 includes a body 380. The body 380 includes a groove portion 382, a total reflection surface 384, and a light-incident surface 386. The light-incident surface 386 is a bottom surface of the groove portion 382. The groove portion 382 is configured to receive the lenticular lens array 34 therein, and a bottom surface 342 of the lenticular lens array 34 abuts the light incident surface 386, in this way, light can be reduced to reflect at the junction of the lenticular lens array 34 and the groove portion 382, thereby increasing the chance of light being transmitted to the light transmissive element 38. The total reflection surface 384 is configured to reflect the image light L reflected by the object 4 and passing through the lenticular lens array 34 to form the image light L on the sensing elements 362.

配合參閱第四圖,為本發明第二實施例之接觸式影像感測裝置之剖視圖。第四圖所示之接觸式影像感測裝置3a與第一實施例的接觸式影像感測裝置3類似,且相同的元件標示以相同的符號。值得注意的是,兩者的差異在於:座體30a及透光元件38a為一體成型,如第五圖所示。 4 is a cross-sectional view of a contact image sensing device according to a second embodiment of the present invention. The contact image sensing device 3a shown in the fourth figure is similar to the contact image sensing device 3 of the first embodiment, and the same elements are denoted by the same reference numerals. It is worth noting that the difference between the two is that the seat body 30a and the light transmitting member 38a are integrally formed as shown in the fifth figure.

該座體30a及該透光元件38a可利用雙色射出(或稱雙料射出)成型技術製作而成,如此一來,可以降低該接觸式影像感測裝置3a的組裝程序,並可大幅地提升該座體30a之強度,藉以提高該接觸式影像感測裝置3a的可靠度。其中,當製作該透光元件38a之樹脂材料的轉移溫度低於製作該座體30a之樹脂材料的轉移溫度時,可利用射出成型技術先製作該座體30a,之後在使該透光元件38a成型於座體30a中。反之,當製作該透光元件38a之樹脂材料的轉移溫度高於製作該座體30a之樹脂材料的轉移溫度時,可利用射出成型技術先製作該透光元件38a,之後再使該座體30a成型於該透光元件38a上。 The base body 30a and the light transmissive element 38a can be fabricated by two-color injection (or double-ejection) molding technology, so that the assembly procedure of the contact image sensing device 3a can be reduced, and the device can be greatly improved. The strength of the seat body 30a is used to improve the reliability of the contact image sensing device 3a. Wherein, when the transfer temperature of the resin material for fabricating the light transmissive element 38a is lower than the transfer temperature of the resin material for the base body 30a, the seat body 30a can be first formed by an injection molding technique, and then the light transmissive element 38a is made. Formed in the seat body 30a. On the other hand, when the transfer temperature of the resin material for fabricating the light-transmitting member 38a is higher than the transfer temperature of the resin material for forming the base member 30a, the light-transmitting member 38a can be first formed by an injection molding technique, and then the seat member 30a can be made. Formed on the light transmissive element 38a.

該座體30a包含一第一容置槽300a、一大致平行於該第一容置槽300a之穿槽302a及一連通該穿槽302a之第二容置槽304a,該第二容置槽304a的開口方向大致垂直於該第 一容置槽300a的開口方向。 The base 30a includes a first accommodating groove 300a, a through groove 302a substantially parallel to the first accommodating groove 300a, and a second accommodating groove 304a communicating with the through groove 302a. The second accommodating groove 304a The direction of the opening is substantially perpendicular to the first The opening direction of the receiving groove 300a.

該透鏡元件38a係設置於該穿槽302a及該第二容置槽304a中。該透鏡元件38a包含一本體380a,該本體380a具有一全反射面384a及一入光面386a。 The lens element 38a is disposed in the through slot 302a and the second receiving slot 304a. The lens element 38a includes a body 380a having a total reflection surface 384a and a light incident surface 386a.

復參閱第四圖,該柱狀透鏡陣列34設置於該穿槽302a中,且該柱狀透鏡陣列34之一底表面342抵接於該入光面386a。該發光單元32設置於該第一容置槽300a並朝向該物體4發出光線。該感測單元36設置於該第二容置槽304a,該感測單元36之電路板360係密封該第二容置槽304a之開口,該等感測元件362係面對該透光元件38a。 Referring to the fourth figure, the lenticular lens array 34 is disposed in the through slot 302a, and a bottom surface 342 of the lenticular lens array 34 abuts against the light incident surface 386a. The light emitting unit 32 is disposed in the first receiving groove 300a and emits light toward the object 4. The sensing unit 36 is disposed on the second accommodating groove 304a. The circuit board 360 of the sensing unit 36 seals the opening of the second accommodating groove 304a. The sensing elements 362 face the transparent component 38a. .

該發光單元32朝向該物體4發出之光線,該物體4係反射該發光單元32發出的光線使產生一影像光線L,該影像光線L係通過該柱狀透鏡陣列34及該入光面386a傳遞至該全反射面384a,該全反射面384a係反射該影像光線L,使該影像光線L得以成像於該等感測元件362上。 The light emitting unit 32 emits light toward the object 4, and the object 4 reflects the light emitted by the light emitting unit 32 to generate an image light L, which is transmitted through the lenticular lens array 34 and the light incident surface 386a. To the total reflection surface 384a, the total reflection surface 384a reflects the image light L, so that the image light L is imaged on the sensing elements 362.

配合參閱第六圖,為本發明第三實施例之接觸式影像感測裝置之剖視圖。該接觸式影像感測裝置5用以感測一設置於其上之一物體4的影像,並將物體4影像轉換為類比或數位影像資料。該接觸式影像感測裝置5包含一座體50、一發光單元52、一柱狀透鏡陣列54、一感測單元56及一透光元件58。該座體50的上方設置有一透明玻璃件40,該物體4係擺放於該透明玻璃件40上方。 6 is a cross-sectional view of a contact image sensing device according to a third embodiment of the present invention. The contact image sensing device 5 is configured to sense an image of an object 4 disposed thereon and convert the image of the object 4 into analog or digital image data. The contact image sensing device 5 includes a body 50, a light emitting unit 52, a cylindrical lens array 54, a sensing unit 56, and a light transmitting member 58. A transparent glass member 40 is disposed above the base 50, and the object 4 is placed above the transparent glass member 40.

該發光單元52、該柱狀透鏡陣列54、該感測單元56及該透光元件58分別設置於該座體50上,該柱狀透鏡陣列54 位於該發光單元52及該感測單元56之間,該透光元件58位於該發光單元52及該柱狀透鏡陣列54之間。其中,該座體50與該透光元件58可以為分離設置,或者,該座體50與該透光元件58可以為一體成型,且使用雙色射出成型技術製作而成。當該座體50及該透光元件58為一體成型時,可以降低該接觸式影像感測裝置5的組裝程序,並可大幅地提升該座體50之強度,藉以提高該接觸式影像感測裝置5的可靠度。 The illuminating unit 52, the lenticular lens array 54, the sensing unit 56 and the light transmissive element 58 are respectively disposed on the base 50, and the lenticular lens array 54 Located between the light emitting unit 52 and the sensing unit 56, the light transmitting element 58 is located between the light emitting unit 52 and the lenticular lens array 54. The base 50 and the light transmissive element 58 may be separately disposed, or the base 50 and the light transmissive element 58 may be integrally formed and fabricated using a two-color injection molding technique. When the base 50 and the light transmissive element 58 are integrally formed, the assembly procedure of the contact image sensing device 5 can be reduced, and the strength of the base 50 can be greatly improved, thereby improving the contact image sensing. The reliability of the device 5.

該發光單元52用以朝向該物體4發出光線,該物體4係反射該發光單元52發出之光線,使產生一影像光線L,該影像光線L係傳遞至該透光元件58。 The light-emitting unit 52 emits light toward the object 4, and the object 4 reflects the light emitted by the light-emitting unit 52 to generate an image light L, which is transmitted to the light-transmitting element 58.

該透光元件58包含一本體580,於本實施例中,該本體580大致呈矩形,實際實施時則不以此限。該本體580具有一全反射面582,該全反射面582為該本體580貼近於該座體50之一表面。該全反射面582係反射該影像光線L,藉以轉折該影像光線L的光學傳遞路徑,使該影像光線L得以傳遞至該柱狀陣列透鏡54。 The light-transmitting element 58 includes a body 580. In the embodiment, the body 580 is substantially rectangular, and is not limited thereto. The body 580 has a total reflection surface 582 that is adjacent to a surface of the body 50. The total reflection surface 582 reflects the image light L, thereby turning the optical transmission path of the image light L, so that the image light L is transmitted to the columnar array lens 54.

該柱狀透鏡陣列54用以使該影像光線L聚焦於該感測單元56。該感測單元56係面對該發光單元52之一發光側520,該發光側520具有一出光面522,該發光單元52係由該出光面522發出光線。該感測單元56包含一電路板560及設置於該電路板560上之複數感測元件562,各該感測元件562具有一光軸I,該光軸I係平行於該物體4。該等感測元件562係面對該柱狀透鏡陣列54,該柱狀 透鏡陣列54係使得該影像光線L成像於該等感測元件562。 The lenticular lens array 54 is configured to focus the image light L on the sensing unit 56. The sensing unit 56 faces the light emitting side 520 of the light emitting unit 52. The light emitting side 520 has a light emitting surface 522, and the light emitting unit 52 emits light from the light emitting surface 522. The sensing unit 56 includes a circuit board 560 and a plurality of sensing elements 562 disposed on the circuit board 560. Each of the sensing elements 562 has an optical axis I that is parallel to the object 4. The sensing elements 562 face the lenticular lens array 54, the column The lens array 54 is such that the image light L is imaged by the sensing elements 562.

配合參閱第七圖,為本發明第四實施例之接觸式影像感測裝置之剖視圖。該接觸式影像感測裝置6用以感測一設置於其上之一物體4的影像,並將物體4影像轉換為類比或數位影像資料。該接觸式影像感測裝置6包含一座體60、一發光單元62、一柱狀透鏡陣列64、一感測單元66及一透光元件68。該座體60的上方設置有一透明玻璃40件,該物體4係擺放於該透明玻璃件40上方。該發光單元62、該柱狀透鏡陣列64、該感測單元66及該透光元件68分別設置於該座體60上,該柱狀透鏡陣列64位於該透光元件68及該感測單元66之間。其中,該座體60與該透光元件68可以為分離設置,或者,該座體60與該透光元件68可以為一體成型,且使用雙色射出成型技術製作而成。當該座體60及該透光元件68為一體成型時,可以降低該接觸式影像感測裝置6的組裝程序,並可大幅地提升該座體60之強度,藉以提高該接觸式影像感測裝置6的可靠度。 Referring to the seventh figure, a cross-sectional view of a contact image sensing device according to a fourth embodiment of the present invention is shown. The contact image sensing device 6 is configured to sense an image of an object 4 disposed thereon and convert the image of the object 4 into analog or digital image data. The contact image sensing device 6 includes a body 60, a light emitting unit 62, a cylindrical lens array 64, a sensing unit 66, and a light transmitting member 68. A transparent glass 40 is disposed above the base 60, and the object 4 is placed above the transparent glass member 40. The illuminating unit 62, the lenticular lens array 64, the sensing unit 66 and the light transmissive element 68 are respectively disposed on the base 60. The lenticular lens array 64 is located at the transparent component 68 and the sensing unit 66. between. The base 60 and the light transmissive element 68 may be separately disposed, or the base 60 and the light transmissive element 68 may be integrally formed and fabricated using a two-color injection molding technique. When the base 60 and the light transmissive element 68 are integrally formed, the assembly procedure of the contact image sensing device 6 can be reduced, and the strength of the base 60 can be greatly improved, thereby improving the contact image sensing. The reliability of the device 6.

該發光單元62包含一發光側620,該發光側620具有一出光面622,該發光單元62係由該出光面622發出光線。該發光單元62用以朝向該物體4發出光線,該物體4係反射該發光單元62發出之光線,使產生一影像光線L,該影像光線L係傳遞至該透光元件68。 The light-emitting unit 620 has a light-emitting side 620, and the light-emitting side 620 has a light-emitting surface 622. The light-emitting unit 62 emits light from the light-emitting surface 622. The light-emitting unit 62 is configured to emit light toward the object 4, and the object 4 reflects the light emitted by the light-emitting unit 62 to generate an image light L, which is transmitted to the light-transmitting element 68.

該透光元件68包含一本體680,於本實施例中,該本體680大致呈五邊形,且該本體680面對該物體4之一表 面(即用以接收該影像光線L之表面)為平面。該本體680具有一全反射面682,該全反射面682為該本體680貼近於該座體60之一表面。該全反射面682係反射該影像光線L,藉以轉折該影像光線L的光學傳遞路徑,使該影像光線L得以傳遞至該柱狀陣列透鏡64。 The light transmissive element 68 includes a body 680. In the embodiment, the body 680 is substantially pentagonal, and the body 680 faces the object 4 The face (ie, the surface for receiving the image light L) is a plane. The body 680 has a total reflection surface 682 that is adjacent to a surface of the body 60. The total reflection surface 682 reflects the image light L, thereby turning the optical transmission path of the image light L, so that the image light L is transmitted to the columnar array lens 64.

該柱狀透鏡陣列64用以使該影像光線L聚焦於該感測單元66。該感測單元66係背對該發光側620。該感測單元66包含一電路板660及設置於該電路板660上之複數感測元件662,各該感測元件662具有一光軸I,該光軸I係平行於該物體4。該等感測元件662係面對該柱狀透鏡陣列64,該柱狀透鏡陣列64係使得該影像光線L成像於該等感測元件662。 The lenticular lens array 64 is configured to focus the image light L on the sensing unit 66. The sensing unit 66 is opposite the light emitting side 620. The sensing unit 66 includes a circuit board 660 and a plurality of sensing elements 662 disposed on the circuit board 660. Each of the sensing elements 662 has an optical axis I that is parallel to the object 4. The sensing elements 662 are facing the lenticular lens array 64, and the lenticular lens array 64 is such that the image light L is imaged by the sensing elements 662.

配合參閱第八圖,為本發明第五實施例之接觸式影像感測裝置之剖視圖。該接觸式影像感測裝置7用以感測一設置於其上之一物體4的影像,並將物體4影像轉換為類比或數位影像資料。該接觸式影像感測裝置7包含一座體70、一發光單元72、一柱狀透鏡陣列74、一感測單元76、一透光元件78及一全反射件79。該座體70的上方設置有一透明玻璃40,該座體70的上方有一透明玻璃件40,該物體4係擺放於該透明玻璃件40上方。 Referring to FIG. 8, a cross-sectional view of a contact image sensing device according to a fifth embodiment of the present invention is shown. The contact image sensing device 7 is configured to sense an image of an object 4 disposed thereon and convert the image of the object 4 into analog or digital image data. The contact image sensing device 7 includes a body 70, a light emitting unit 72, a cylindrical lens array 74, a sensing unit 76, a light transmitting member 78, and a total reflecting member 79. A transparent glass 40 is disposed above the base 70, and a transparent glass member 40 is disposed above the base 70. The object 4 is placed above the transparent glass member 40.

該發光單元72、該柱狀透鏡陣列74、該感測單元76、該透光元件78及該全反射件79分別設置於該座體70上,該柱狀透鏡陣列74位於該發光單元72及該感測單元76之間,該透光元件78位於該發光單元72及該柱狀透鏡陣列74之 間,該全反射件79位於該柱狀透鏡陣列74及該感測單元76之間。其中,該座體70、該透光元件78及該全反射件79可以為分離設置,或者,該座體70、該透光元件78及該全反射件79可以為一體成型,且使用雙色射出成型技術製作而成。當該座體70及該透光元件78為一體成型時,可以降低該接觸式影像感測裝置7的組裝程序,並可大幅地提升該座體70之強度,藉以提高該接觸式影像感測裝置7的可靠度。 The illuminating unit 72, the lenticular lens array 74, the sensing unit 76, the light transmissive element 78 and the total reflection member 79 are respectively disposed on the base 70, and the lenticular lens array 74 is located at the illuminating unit 72 and The light transmitting element 78 is located between the sensing unit 76 and the illuminating unit 72 and the lenticular lens array 74. The total reflection member 79 is located between the lenticular lens array 74 and the sensing unit 76. The seat body 70, the light transmissive element 78, and the total reflection member 79 may be separately disposed, or the seat body 70, the light transmissive element 78, and the total reflection member 79 may be integrally formed and output using two colors. Made by molding technology. When the base body 70 and the light transmissive element 78 are integrally formed, the assembly procedure of the contact image sensing device 7 can be reduced, and the strength of the base body 70 can be greatly improved, thereby improving the contact image sensing. The reliability of the device 7.

該發光單元72用以朝向該物體4發出光線,該物體4係反射該發光單元72發出之光線,使產生一影像光線L,該影像光線L係傳遞至該透光元件78。 The light-emitting unit 72 is configured to emit light toward the object 4, and the object 4 reflects the light emitted by the light-emitting unit 72 to generate an image light L, which is transmitted to the light-transmitting element 78.

該感測單元76包含一電路板760及設置於該電路板760上之複數感測元件762,各該感測元件762具有一光軸I,該光軸I係垂直於該物體4。該等感測元件762係面對該全反射件79。 The sensing unit 76 includes a circuit board 760 and a plurality of sensing elements 762 disposed on the circuit board 760. Each of the sensing elements 762 has an optical axis I that is perpendicular to the object 4. The sensing elements 762 are facing the total reflection member 79.

該透光元件78包含一本體780,於本實施例中,該本體780大致呈矩形。該本體780具有一全反射面782,該全反射面782為該本體780貼近於該座體70之一表面。該全反射面782係反射該影像光線L,藉以轉折該影像光線L的光學傳遞路徑,使該影像光線L得以傳遞至該柱狀陣列透鏡74。 The light transmissive element 78 includes a body 780. In the present embodiment, the body 780 is substantially rectangular. The body 780 has a total reflection surface 782 that is adjacent to a surface of the body 70. The total reflection surface 782 reflects the image light L, thereby turning the optical transmission path of the image light L, so that the image light L is transmitted to the columnar array lens 74.

該柱狀透鏡陣列74具有成像之功能,可使該影像光線L成像於該感測單元76。該全反射件79包含一透光本體790,於本實施例中,該透光本體790大致呈三角形。該 透光本體790具有一全反射面792,該全反射面792係反射通過該柱狀透鏡陣列74之該影像光線L,藉以轉折該影像光線L的光學傳遞路徑,使該影像光線L得以成像於該等感測元件762。 The lenticular lens array 74 has an imaging function for imaging the image light L to the sensing unit 76. The total reflection member 79 includes a light transmitting body 790. In the embodiment, the light transmitting body 790 is substantially triangular. The The light-transmissive body 790 has a total reflection surface 792 that reflects the image light L passing through the lenticular lens array 74, thereby turning the optical transmission path of the image light L to image the image light L. The sensing elements 762.

然以上所述者,僅為本發明之較佳實施例,當不能限定本發明實施之範圍,即凡依本發明申請專利範圍所作之均等變化與修飾等,皆應仍屬本發明之專利涵蓋範圍意圖保護之範疇。 However, the above is only a preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the equivalent changes and modifications made by the scope of the present invention should still be covered by the patent of the present invention. The scope of the scope is intended to protect.

1‧‧‧接觸式影像感測器 1‧‧‧Contact Image Sensor

10、30、30a、50、60、70‧‧‧座體 10, 30, 30a, 50, 60, 70‧‧‧

100‧‧‧容置槽 100‧‧‧ accommodating slots

102、302、302a‧‧‧穿槽 102, 302, 302a‧‧‧ slotted

12‧‧‧發光元件 12‧‧‧Lighting elements

14‧‧‧柱狀透鏡組 14‧‧‧ lenticular lens group

16、36、56、56、66、76‧‧‧感測單元 16, 36, 56, 56, 66, 76‧‧‧ Sensing unit

160、360、560、660、760‧‧‧電路板 160, 360, 560, 660, 760‧‧‧ circuit boards

162‧‧‧感光元件 162‧‧‧Photosensitive elements

18‧‧‧反射鏡 18‧‧‧Mirror

20‧‧‧透光件 20‧‧‧Transparent parts

22、4‧‧‧物體 22, 4 ‧ ‧ objects

3、3a、5、6‧‧‧接觸式影像感測裝置 3, 3a, 5, 6‧‧‧ contact image sensing device

300、300a‧‧‧第一容置槽 300, 300a‧‧‧first accommodating slot

304、304a‧‧‧第二容置槽 304, 304a‧‧‧Second accommodating slot

32、52、62、72‧‧‧發光單元 32, 52, 62, 72‧ ‧ lighting units

320‧‧‧發光元件 320‧‧‧Lighting elements

322‧‧‧導光元件 322‧‧‧Light guiding elements

34、54、64、74‧‧‧柱狀透鏡陣列 34, 54, 64, 74‧‧ ‧ lenticular lens array

340‧‧‧柱狀透鏡 340‧‧‧ lenticular lens

342‧‧‧底表面 342‧‧‧ bottom surface

362、562、662、762‧‧‧感測元件 362, 562, 662, 762‧‧‧ sensing components

38、38a、58、68、78‧‧‧透光元件 38, 38a, 58, 68, 78‧‧‧ Light-transmitting components

380、380a、580、680、780‧‧‧本體 380, 380a, 580, 680, 780‧‧‧ ontology

382‧‧‧凹槽部 382‧‧‧ Groove

384、384a、582、682、782、792‧‧‧全反射面 384, 384a, 582, 682, 782, 792‧‧ ‧ total reflection surface

386、386a‧‧‧入光面 386, 386a‧‧‧ into the glossy

40‧‧‧透明玻璃件 40‧‧‧Transparent glass pieces

520、620‧‧‧發光側 520, 620‧‧‧ illuminating side

522、622‧‧‧出光面 522, 622‧‧‧ light surface

79‧‧‧全反射件 79‧‧‧ total reflection parts

790‧‧‧透光本體 790‧‧‧Lighting body

A‧‧‧軸線 A‧‧‧ axis

I‧‧‧光軸 I‧‧‧ optical axis

L‧‧‧影像光線 L‧‧‧Image light

第一圖為習知之影像感測裝置之剖視圖。 The first figure is a cross-sectional view of a conventional image sensing device.

第二圖為本發明第一實施例之接觸式影像感測裝置之立體圖分解。 The second figure is a perspective view of the contact image sensing device according to the first embodiment of the present invention.

第三圖為本發明第一實施例之接觸式影像感測裝置之剖視圖。 The third figure is a cross-sectional view of the contact image sensing device of the first embodiment of the present invention.

第四圖為本發明第二實施例之接觸式影像感測裝置之剖視圖。 The fourth figure is a cross-sectional view of a contact image sensing device according to a second embodiment of the present invention.

第五圖為本發明第二實施例之座體與透光元件之剖視圖。 Figure 5 is a cross-sectional view showing a seat body and a light transmitting member according to a second embodiment of the present invention.

第六圖為本發明第三實施例之接觸式影像感測裝置之剖視圖。 Figure 6 is a cross-sectional view showing a contact image sensing device according to a third embodiment of the present invention.

第七圖為本發明第四實施例之接觸式影像感測裝置之剖視圖。 Figure 7 is a cross-sectional view showing a contact image sensing device according to a fourth embodiment of the present invention.

第八圖為本發明第五實施例之接觸式影像感測裝置之剖視圖。 Figure 8 is a cross-sectional view showing a contact image sensing device according to a fifth embodiment of the present invention.

3‧‧‧接觸式影像感測裝置 3‧‧‧Contact image sensing device

30‧‧‧座體 30‧‧‧ body

300‧‧‧第一容置槽 300‧‧‧First accommodating slot

302‧‧‧穿槽 302‧‧‧through slot

32‧‧‧發光單元 32‧‧‧Lighting unit

320‧‧‧發光元件 320‧‧‧Lighting elements

322‧‧‧導光元件 322‧‧‧Light guiding elements

34‧‧‧柱狀透鏡陣列 34‧‧‧ lenticular lens array

340‧‧‧柱狀透鏡 340‧‧‧ lenticular lens

36‧‧‧感測單元 36‧‧‧Sensor unit

360‧‧‧電路板 360‧‧‧PCB

362‧‧‧感測元件 362‧‧‧Sensor components

38‧‧‧透光元件 38‧‧‧Lighting components

380‧‧‧本體 380‧‧‧ Ontology

384‧‧‧全反射面 384‧‧‧ total reflection surface

386‧‧‧入光面 386‧‧‧Into the glossy

A‧‧‧軸線 A‧‧‧ axis

Claims (15)

一種接觸式影像感測裝置,用以感測一物體之影像,該接觸式影像感測裝置包含:一座體,包含一第一容置槽、一大致平行於該第一容置槽之一穿槽,以及一連通該穿槽之第二容置槽,該第二容置槽的開口方向係垂直於該第一容置槽的開口方向;一發光單元,設置於該第一容置槽中,並朝向該物體發出光線;一柱狀透鏡陣列,設置於該穿槽中;一透光元件,包含一本體,該本體具有一全反射面,該透光元件設置於該穿槽中並位於該柱狀透鏡陣列下方;以及一感測單元,設置於該第二容置槽中,該感測單元包含複數感測元件,該等感測元件係面對該透光元件,各該感測元件具有一光軸,該光軸平行於該物體,其中,經由該物體反射後之一影像光線係通過該柱狀透鏡陣列傳遞至該全反射面,該全反射面係反射該影像光線,使該影像光線成像於該等感測元件。 A contact image sensing device for sensing an image of an object, the contact image sensing device comprising: a body comprising a first receiving groove and a substantially parallel one of the first receiving grooves a slot, and a second accommodating slot that communicates with the slot, the opening direction of the second accommodating slot is perpendicular to the opening direction of the first accommodating slot; and an illuminating unit is disposed in the first accommodating slot And emitting light to the object; a cylindrical lens array disposed in the through slot; a light transmissive element comprising a body, the body having a total reflection surface, the light transmissive element being disposed in the through slot and located The sensing unit is disposed in the second receiving groove, and the sensing unit includes a plurality of sensing elements facing the light transmitting element, and each sensing The element has an optical axis parallel to the object, wherein one of the image light rays reflected by the object is transmitted to the total reflection surface through the lenticular lens array, and the total reflection surface reflects the image light The image light is imaged in the sensing Pieces. 如申請專利範圍第1項所述之接觸式影像感測裝置,其中該透光元件更包含一凹槽部,該凹槽部係供該柱狀透鏡陣列容設於其中。 The contact image sensing device of claim 1, wherein the light transmissive element further comprises a groove portion for receiving the lenticular lens array therein. 如申請專利範圍第2項所述之接觸式影像感測裝置,其中該透光元件更包含一入光面,該柱狀透鏡陣列係容置於該凹槽部中,使該柱狀透鏡陣列之一底表面抵接於 該入光面。 The contact image sensing device of claim 2, wherein the light transmissive element further comprises a light incident surface, and the lenticular lens array is received in the groove portion to make the lenticular lens array One of the bottom surfaces abuts The entrance surface. 如申請專利範圍第1項所述之接觸式影像感測裝置,其中該座體及該透光元件為一體成型。 The contact image sensing device of claim 1, wherein the body and the light transmissive element are integrally formed. 如申請專利範圍第4項所述之接觸式影像感測裝置,其中該座體及該透光元件係使用雙色射出所製成。 The contact image sensing device of claim 4, wherein the body and the light transmissive element are made using a two-color shot. 如申請專利範圍第4項所述之接觸式影像感測裝置,其中該透光元件係設置於該穿槽及該第二容置槽中。 The contact image sensing device of claim 4, wherein the light transmitting component is disposed in the through slot and the second receiving slot. 一種接觸式影像感測裝置,用以感測一物體之影像,該接觸式影像感測裝置包含:一發光單元,朝向該物體直接地發出光線;一感測單元,包含複數感測元件;一透光元件,包含一本體,該本體具有一全反射面;以及一柱狀透鏡陣列,設置於該透光元件及該感測單元之間;其中,經由物體反射後之一影像光線係傳遞至該透光元件,該全反射面係反射該影像光線,使該影像光線通過該柱狀透鏡陣列而成像於該等感測元件。 A touch image sensing device for sensing an image of an object, the touch image sensing device comprising: a light emitting unit directly emitting light toward the object; and a sensing unit comprising a plurality of sensing elements; The light transmissive element comprises a body having a total reflection surface; and a cylindrical lens array disposed between the light transmissive element and the sensing unit; wherein the image light is transmitted to the image through the object In the light transmissive element, the total reflection surface reflects the image light, and the image light is imaged on the sensing elements through the lenticular lens array. 如申請專利範圍第7項所述之接觸式影像感測裝置,更包含一座體,該發光單元、該感測單元、該柱狀陣列透鏡及該透光元件分別設置於該座體上。 The touch-sensitive image sensing device of claim 7, further comprising a body, the light-emitting unit, the sensing unit, the columnar array lens and the light-transmitting element are respectively disposed on the base. 如申請專利範圍第8項所述之接觸式影像感測裝置,其中該座體及該透光元件為一體成型。 The contact image sensing device of claim 8, wherein the body and the light transmissive element are integrally formed. 如申請專利範圍第8項所述之接觸式影像感測裝 置,其中該座體及該透光元件係使用雙色射出所製成。 Contact image sensing device as described in claim 8 The holder and the light transmissive element are made using two-color ejection. 如申請專利範圍第7項所述之接觸式影像感測裝置,其中各該感光元件具有一光軸,該光軸係垂直於該物體。 The contact image sensing device of claim 7, wherein each of the photosensitive elements has an optical axis that is perpendicular to the object. 如申請專利範圍第11項所述之接觸式影像感測裝置,更包含一全反射件,該全反射件設置於該柱狀透鏡陣列及該感測單元之間,該全反射件係反射通過該柱狀透鏡陣列之該影像光線,使該影像光線成像於該等感測元件。 The contact image sensing device of claim 11, further comprising a total reflection member disposed between the lenticular lens array and the sensing unit, the total reflection member being reflected The image light of the lenticular lens array images the image light onto the sensing elements. 如申請專利範圍第7項所述之接觸式影像感測裝置,其中各該感測元件具有一光軸,該光軸平行於該物體。 The contact image sensing device of claim 7, wherein each of the sensing elements has an optical axis that is parallel to the object. 如申請專利範圍第13項所述之接觸式影像感測裝置,其中該感測單元係面對該發光單元之一發光側。 The contact image sensing device of claim 13, wherein the sensing unit faces a light emitting side of the light emitting unit. 如申請專利範圍第13項所述之接觸式影像感測裝置,其中該感測單元係背對該發光單元之一發光側。 The contact image sensing device of claim 13, wherein the sensing unit is opposite to a light emitting side of the light emitting unit.
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