TWI515855B - Lead frame package with improved ground bond stability - Google Patents

Description

Lead frame package with improved ground bond stability

The present invention relates generally to lead frame based semiconductor packages. More specifically, a configuration is described that enhances the stability of the electrical connection between the die and the die attach pad that serves as a contact for the package.

Many semiconductor packages utilize metal leadframes to provide electrical interconnection between the integrated circuit die and external components. Very small wires called "bonding wires" are often used to electrically connect the I/O pads on the die (often referred to as "bond pads") to corresponding leads/contacts in the leadframe. Typically, portions of the die, bond wires, and leadframe are encapsulated in the plastic for protection while leaving portions of the leadframe exposed to facilitate electrical connection to external devices.

Many leadframes include a die attach pad (DAP) that supports the die during assembly of the package. In some such packages, the die attach pad is exposed to one surface (typically the bottom surface) of the package. The exposed die attach liner can aid in thermal management of the package because the die attach pad provides a good thermal conduction path for dissipating excess heat generated by the die. In some exposed DAP packages, die attach pads are also used as electrical contacts for packaging. Most commonly, a die attach pad is used as the ground pad, but it can be used as a power pad in a few packages, and theoretically it can be used either as a signal pad.

When a die attach pad is used as an electrical contact, a bond wire is often used to electrically connect one or more ground I/O pads on the die to the die attach pad (often referred to as "down-bonding" Program). Most commonly, very fine gold or copper wires are used as bonding wires, and the lead frame is formed of copper or a copper-based alloy. Since gold does not adhere well to copper, the top surface of the die attach pad (and other related portions of the lead frame) is typically plated with a silver film that is easier to adhere to the gold bond wire than copper. Occasionally the problem is that the granules sometimes delaminate from the die attach liner during use of the device. Debonding may also occur between the die attach liner and the molding compound that encapsulates the die. When delamination occurs, the movement of the die relative to the die attach pad can sometimes separate or otherwise break the down bond line from the die attach pad.

A similar delamination problem can also occur at the leads. For example, delamination sometimes occurs between the molding material and the lead fingers, particularly in the area of the silver-plated lead frame. Debonding between the molding material and the leads can also damage the bond wires.

A representative lead frame suitable for use in a package having exposed die attach pads is illustrated diagrammatically in Figures 1A and 1B. 1A is a top plan view of leadframe 100 with a die attached and electrically connected to the leadframe. Figure 1B is a cross-sectional side view of Figure 1A taken along section line A-A. The die 102 is wire bonded to the grounded die attach pad 104 using ground bond wires 106. One end of the ground bond wire 106 is attached to the ground I/O pad 110 on the die 102 while the other end is directly attached to the die attach pad 104. In the design using the gold ground bond wire 106, the grounded die attach pad 104 is often plated with silver to improve the quality of the bond. In addition, bond wires 108 connect I/O pads 116 of die 102 to associated leads 112 of leadframe 124 to electrically connect the die as needed in the integrated circuit design. For example, bond wires 108 can be used to connect die 102 to a power supply, signal line, or any other suitable electrical connection. The die attach liner 104 is supported by a tie bar 118.

While conventional ground bonding methods are well suited for use in many applications, efforts continue to improve the stability of ground bonding.

To achieve the foregoing and other objects of the present invention, one or more selected I/O pads (eg, ground I/O pads) on the die are electrically coupled to a tie bar carrying a die attach pad. A part, or a structure connected to this connecting rod. The land is raised above the die attach pad. Since the bonding wires electrically connecting the die to the die attach pad are bonded in a different plane from the die attach pad, if the die is delaminated from the die attach pad, the bonding is less likely to be Damaged or damaged. Downsetting the die attach pad relative to the land permits more relative motion in the case of delamination, resulting in a ground bond with improved electrical stability. In some preferred embodiments, the landing area is wider than the other portions of the associated connecting rod. This configuration allows multiple ground I/O pads to be electrically coupled to the die attach pads.

Some specific examples may have a rectangular enlarged land, while other embodiments may have a fused lead shape. The fused lead shape includes at least one finger portion extending inwardly from the connecting rod toward the die attach pad. The increased surface area of the enlarged land allows for a plurality of ground engaging locations on a connecting rod. Also, in some designs, the lead frame can have a plurality of tie bars and enlarged landing zones that can be positioned on opposite sides of the die or at other suitable locations.

The semiconductor package can also be encapsulated in a plastic encapsulant to protect any associated device. The surface of the die attach liner is often exposed to facilitate electrical connection to an external device.

Other devices, methods, features, and advantages of the present invention will be apparent or apparent from the <RTIgt; All such additional systems, methods, features, and advantages are intended to be included within the scope of the present invention and are covered by the scope of the appended claims.

In the following figures, the same reference symbols are sometimes used to indicate the same structural elements. It is also to be understood that in the drawings The invention and its advantages are best understood by referring to the following description in conjunction with the claims.

The present invention relates generally to an improved design for electrically connecting selected I/O pads (e.g., ground pads) on a die to a die attach pad in a lead frame based integrated circuit package and technology.

Numerous specific details are set forth in the following description in order to provide a thorough understanding of the invention. However, it is to be understood that the invention may be practiced without some or all of these specific details. In other instances, well-known program operations have not been described in detail so as not to unnecessarily obscure the invention.

As described in the [Prior Art] section, some leadframe-based integrated circuit packages are designed such that the die is electrically connected to the die attach pad portion of the lead frame by direct wire bonding to the lead frame. Ground. This program is often referred to as "downward bonding." A problem that sometimes arises in down-bonded packages is that the grains can sometimes be delaminated from the die attach pads, potentially causing relative motion between the die and the die attach pads. When this movement occurs, there is a risk that the downwardly joined bond wires may crack or otherwise be damaged or destroyed from the die attach pads, which may cause poor electrical stability.

To address this problem, the present invention describes an integrated circuit package in which selected ground I/O pads on the die are electrically coupled to the wire bond landings of the tie bars using bond wires. The connecting rod, which is part of the lead frame, is directly connected to the die attach pad during packaging and mechanically supports the die attach pad, but is generally not itself intended to be used as an electrical contact for the package. In many designs from the prior art, the tie bars are thin metal sheets that are only used to support the die attach pads. The present application contemplates the use of a connecting rod as part of the ground plane for the integrated circuit package. The die attach surface of the die attach pad is lowered relative to the wire bonding landing zone of the tie bar. In some embodiments, the wire bond landing zone is at the same height as the lead within the package. While the specific examples described are contemplated to use a die attach pad as a ground contact, it should be understood that the die attach pad can be used as a contact for other functions, such as power or signal terminals.

Referring initially to Figures 2A through 2D, a first embodiment in accordance with the present invention is shown. 2A illustrates a top plan view of a device region 214 of a leadframe panel 224 that includes leads 212, tie bars 218, and die attach pads 204. In addition to these components, the enlarged land 220 is integrally formed with the connecting rod 218. The die attach pad 204 is carried by the tie bar 218 and is thus electrically coupled and mechanically coupled to the tie bar 218, which in turn is attached to the support bar 223 in the lead frame panel 224. A plurality of leads 212 are also mechanically attached to the lead frame 224 and extend inwardly toward the die attach pad 204. The land 220 can be grounded by being electrically connected to a grounded die attach pad 204 via a tie bar 218. When the lead frame is formed of copper or a copper alloy, it is generally required that the land 220 is plated with a silver film to enhance the adhesion of the gold bonding wires.

In this first specific example, the land 220 is formed as a rectangular region that is actually a portion of the connecting rod 218. However, it will be appreciated that the lands 220 can be formed at other suitable locations on the connecting rod and can take any other suitable shape and size. Junction zone 220 is typically wider than other portions of its associated connecting rod 218. Larger regions may be useful for a variety of reasons, such as providing a larger surface area for joining multiple wires. Moreover, although two tie bars and enlarged lands are shown in this particular example, each device region 214 may have only one tie rod and lands, or more than two tie bars and joints, depending on the design of the die. Area. 2A illustrates the mechanical connection of two tie bars 218 to the die attach pad 204 on opposite sides of the die attach pad 204, but the tie bars 218 may also be attached to any (or all) die attach pad angles. unit.

2B depicts a top plan view of integrated circuit package 200. In FIG. 2B, die 202 is mechanically attached to die mounting surface 226 of die attach pad 204. The die includes a plurality of I/O pads (bond pads) on the active surface of the die 202. Each of the first set of I/O pads 216 is designed to connect the die 202 to the associated leads 212 of the lead frame 224. I/O pads 216 can be used for a variety of purposes, including connecting die 202 to a power source, signal line, ground plane, or other suitable function. As illustrated in FIG. 2B, I/O pads 216 are electrically connected to leads 212 using bond wires 208. In a preferred embodiment, bond wire 208 is made of gold, but other suitable materials such as copper can be used. In addition, the bond wires are preferably joined in a thermal ultrasonic manner to cause gold bond ball bonding at an I/O pad 216 and pin bonding at a corresponding lead 212.

Each of the second set of I/O pads 210 ("grounded I/O pads") is designed to electrically connect the die 202 to a ground plane that is magnified in this situation. Junction area 220. In the example of FIGS. 2A-2D, the ground I/O pad 210 is bonded to the enlarged lands 220 of the tie bars 218 via ground bond wires 206. Preferably, the ground bonding wires are made of gold and the bonding is produced in an ultrasonic manner to cause gold ball bonding at an I/O pad 210 and a corresponding pin at the enlarged bonding region 220. Engage. Although two ground bond wires 206 are connected to each land 220 in FIG. 2B, it may be useful in some embodiments to connect only one or more ground bond wires to a single land. The integrated circuit package 200 can also include an encapsulant, which is not shown in Figure 2B.

2C illustrates a side cross-sectional view of the package 200 presented in FIG. 2B taken along section BB. As shown in the figures, the die attach surface 226 of the die attach pad 204 is preferably lowered at a distance h ₁ relative to the enlarged land 220 of the tie bar 218. Coupling the ground bond wire 206 to a raised amplifying land 220 improves the electrical stability of the ground bond. This connection is less susceptible to damage due to die delamination because the loop generated by the ground bond wire permits more relative than prior art designs, such as the prior art design shown in FIG. motion. The relative motion between the die and the die attach pad is therefore less likely to cause damage to the ground bond wire 206.

2D is a side cross-sectional view of the package 200 presented in FIG. 2B taken along section CC. Lead 212 extends inwardly toward die 202. Although lead 212 does not directly overlie die 202 in FIG. 2D, those skilled in the art will appreciate that lead 212 can be placed differently. Die attach pad mounting surface 204 of the die 226 by a distance h ₂ from the leads 212 and the next set. The distance h ₂ may be greater or less than the distance h ₁ shown in Figure 2C. However, in a preferred embodiment, the distances h ₁ and h _{2 are} substantially equal such that the enlarged land 220 and the leads 212 are positioned at substantially the same height above the die mounting surface 226.

The die 202, the die attach pad 204, the leads 212, the I/O pads 216, the ground I/O pads 210, the bond wires 208, the ground bond wires 206, and portions of the tie bars 218 may be encapsulated in the encapsulant Or within the molding material 222. The molding compound is usually a non-conductive plastic or resin. In the particular example illustrated in Figures 2C and 2D, the outer portion of lead 212 extends from the side of encapsulated package 200 to facilitate electrical connection to a suitable substrate.

The bottom surface of the die attach pad 204 is exposed via the encapsulant 222 to facilitate electrically coupling the die attach pad 204 to the electrical ground plane. Since the die attach pad 204 is electrically connected to the land 220 of the tie bar 218, this situation presents a method of electrically connecting the ground I/O pad to ground.

3A to 3C, another specific example according to the present invention will be described. Many of the features in this particular example are substantially similar to the features of Figures 2A-2D, but present several differences. 3A shows a leadframe device region 314 having an enlarged lands 320 on the tie bars 318 and having a plurality of leads 312 extending inwardly toward the die attach pads 304. The shape of the enlarged lands 320 of FIG. 3A (fused lead shape) includes at least one finger portion 330 extending inwardly from the connecting rod 318 toward the die attach pad 304. The large surface area of the land 320 allows for a plurality of ground engaging locations on the single connecting rod 318. The land 320 is in turn electrically connected to the die attach pad 304 via a tie bar 318.

FIG. 3B depicts a top view of integrated circuit package 300 with a die 302 attached to die attach pad 304. Similar to the example of FIG. 2B, bond wires 308 electrically connect selected I/O pads 316 from die 302 to leads 312. I/O pads 316 can be used for a variety of purposes, including connecting die 302 to a power supply, signal lines, ground planes, or other suitable function. In a preferred embodiment, bond wire 308 is made of gold. In addition, bond wires 308 are preferably ultrasonically bonded to cause gold bond ball bonding at an I/O pad 316 and pin bonding at a corresponding lead 312.

The second set of I/O pads 310 are designed to electrically connect the die 302 to a ground plane. In this particular example, the ground I/O pad 310 is bonded to the enlarged lands 320 of the tie bars 318 via ground bond wires 306. Preferably, the ground bond wires 306 are made of gold and the bonds are ultrasonically generated to cause gold ball bonding at a I/O pad 310 and a corresponding enlarged land 320. Needle joint.

When properly drawn to scale, the side views of the specific examples shown in FIG. 3B taken along sections D-D and E-E may be substantially similar to the side views depicted in the specific examples of FIGS. 2C and 2D, respectively. As a significant difference between these specific examples, FIG. 3C illustrates a side cross-sectional view of the integrated circuit package 300 taken along section F-F of FIG. 3B. The ground bond wire 306 electrically connects the ground I/O pad 310 to the amplifying land 320 of the tie rod 318. In the diagram of FIG. 3C, the ground bond wire 306 is ultrasonically bonded to the finger portion 330 of the land 320, the finger portion 330 extending inwardly toward the die.

Similar to the embodiment shown in FIGS. 2A-2D, the die attach surface 326 of the die attach pad 304 is lowered at a distance h ₁ relative to the enlarged land 320 and is lowered relative to the lead 312 by a distance h ₂ . . Although the equidistances need not be equal, the lands 320 and leads 312 can be at substantially the same height above the die attach surface 326 of the die attach pad 304. The high placement of the amplifying junction 320 improves the stability of the ground junction by reducing the associated stress on the ground bond wires 306.

Similar to the specific examples described above, the integrated circuit package 300 is preferably enclosed within an encapsulant or molding material 322. The surface of the die attach liner 304 is then exposed via the encapsulant 322 to connect to a ground plane, as disclosed in detail above.

4A and 4B present yet another practice for improving the stability of ground bonding in an integrated circuit package. In the specific example illustrated in FIG. 4, some of the ground I/O pads 410 on the die 402 are directly coupled to the ground using a solder ball bonding (BSOB) technique with a wedge attached to the solder balls. A particle attachment pad 404. As seen in FIG. 4A, wire bond bumps 432 are initially created on the die attach surface 426 of the grounded die attach pad 404. A bump 432 is formed by ultrasonically depositing a solder ball bond onto the grounded die attach pad 404 using a standard wire bond capillary. Rather than continuing the extrusion of the wire, the capillary intercepts the wire near the top of the ball bond bump 432 such that only the wire bond "bump" or "bump" 432 remains on top of the die attach pad 404. The bumps 432 can be produced using a force greater than the force normally used for wire bonding, which has the effect of flattening the bumps to increase their joint surface area and increase the strength of the resulting bumps.

Ground I/O pad 410 is then wire bonded to bump 432 using bond wires 406. Bond wire 406 can be formed from gold, copper, or other suitable electrically conductive material. A second solder ball bond is preferably formed at the ground I/O pad 410 during the wire bonding process, and a pin bond 434 can be formed on top of the bump 432. Thus, bond wire 406 is electrically coupled to grounded die attach pad 404 via pin bond 434 located atop top of bump 432. In some embodiments, bumps 432 are at about 1/3 of the height of the solder ball bond at ground I/O pad 410. If the die attach pad 404 is plated with silver, the specific example disclosed in Figure 4 improves the stability of the ground bond. This is because the solder ball bonding bumps 432 adhere better to the silver plated die attach pads 404 than the pin bonds. Thus, bumps 432 provide an interface between bond wires 406 and die attach surface 426 of die attach pads 404, thereby reducing shear stress in bond wires 406 and improving stability.

An additional solder ball mounting technique is illustrated in Figure 4B. In this particular example, an initial bump 442 is formed on the ground I/O pad 410 on the die 402. The die attach pads 404 are then electrically connected to the bumps 442 on the I/O pads 410 using bond wires 406. A second solder ball bond 446 is formed on the die attach pad 404 during the wire bonding process. Again, the wire bonder can utilize the bonding force compared to normal, which has flattened bumps to increase the joint strength and surface area effects.

5A to 5C, still another specific example of the present invention will be described. It is often useful to assemble integrated circuit packages using lead frame strips 524 of array 528 of support device regions 514 as would be familiar to those skilled in the art. This configuration allows a large number of integrated circuit packages to be fabricated. Although FIGS. 5A-5C depict device regions similar to the device regions presented in FIGS. 2A-2D, it should also be appreciated that the leadframe can support the specific examples of FIGS. 3A-3C and FIG. 4, as well as any other suitable Specific examples.

FIG. 5A depicts a portion of a leadframe strip 524 having multiple device regions 514. Typically, device area 514 is disposed on at least one two-dimensional array 528 on panel 524, although various other configurations are possible (eg, one-dimensional arrays, non-linear configurations, etc.). In the illustrated embodiment, five two-dimensional arrays 528 of device regions 514 are shown. However, it should be appreciated that more or fewer arrays 528 may be provided. Lead frame panel 524 is typically formed from a copper or copper based alloy, although other suitable materials (e.g., aluminum) can be used in various alternative embodiments. Each device region 514 can contain an integrated circuit package as described in any of the above specific examples. After the package is assembled onto the lead frame 524, the lead frame 524 is singulated as necessary to produce a plurality of individual integrated circuit packages ready for use in any desired application. This singulation can be configured to sacrifice the tie bars 518 and can electrically isolate the leads 512 from the die attach pads 504 of the lead frame 524.

The invention can also be used in any suitable integrated circuit package type. For example, in the specific examples of FIGS. 2A-2D and 3A-3C, the integrated circuit package 200 can be used as a dual in-line package having two columns of leads 212 on opposite sides of the die 202 ( Dual in-line package, DIP). Of course, the disclosed package is also applicable to a variety of other package types, such as quad flat packages (QFP) and thin small outline packages (TSOP).

Although only a few specific examples of the invention have been described in detail, it is understood that the invention may be embodied in many other forms without departing from the spirit or scope of the invention. For example, in addition to being coupled to an electrical ground plane, the amplifying junction can also be coupled to a power source or signal input.

In the illustrated embodiment where wire bonding is desired to the region of the connecting rod, the die attach pad is lowered relative to both the wire and the wire bond region of the tie bar. However, in some packages (eg, QFN or LLP packages), the bottom surface of the leads may be required to serve as a joint that is coplanar with the bottom surface of the die attach pad. In such specific examples, it may be desirable to up-set the bond pads of the die attach pads such that the wire bonds remain substantially coplanar with the die attach pads. Therefore, the present invention is to be considered as illustrative and not restrictive, and the invention is not limited to the details of the invention.

100. . . Lead frame

102. . . Grain

104. . . Grounded die attach pad

106. . . Ground wire

108. . . Bonding wire

110. . . Ground I/O pad

112. . . lead

116. . . I/O pad

118. . . Connecting rod

200. . . Integrated circuit package

202. . . Grain

204. . . Die attach liner

206. . . Ground wire

208. . . Bonding wire

210. . . Second set of I/O pads

212. . . lead

214. . . Device area

216. . . First set of I/O pads

218. . . Connecting rod

220. . . Junction area

222. . . Encapsulant or molding material

223. . . Support rod

224. . . Lead frame

226. . . Die mounting surface

300. . . Integrated circuit package

302. . . Grain

304. . . Die attach liner

306. . . Ground wire

308. . . Bonding wire

310. . . Ground I/O pad

312. . . Multiple leads

314. . . Lead frame device area

316. . . I/O pad

318. . . Connecting rod

320. . . Junction area

322. . . Encapsulant or molding material

324. . . Support rod

326. . . Die mounting surface

330. . . Finger part

402. . . Grain

404. . . Grounded die attach pad

406. . . Bonding wire

410. . . Ground I/O pad

426. . . Die mounting surface

432. . . Wire bonding bump

434. . . Needle joint

442. . . Initial bump

446. . . Second solder ball bonding

512. . . lead

514. . . Device area

518. . . Connecting rod

524. . . Lead frame strip

528. . . Array

h ₁ . . . distance

h ₂ . . . distance

1A illustrates a top plan view of a prior art integrated circuit package in which a ground bond pad on a die is bonded down to a grounded die attach pad.

FIG. 1B illustrates a side cross-sectional view of the package shown in FIG. 1A taken along section A-A.

2A illustrates a top plan view of a leadframe device region having an enlarged landing area on a connecting rod in accordance with an embodiment of the present invention.

2B illustrates a top plan view of an integrated circuit package including a die attached to the leadframe device region of FIG. 2A, wherein the die is electrically coupled to the connecting rod for amplification, in accordance with an embodiment of the present invention. Junction area.

2C illustrates a side cross-sectional view taken along section B-B of the embodiment of FIG. 2B showing a ground bond wire electrically coupled to the raised land of the tie bar, in accordance with an embodiment of the present invention.

2D illustrates a side cross-sectional view taken along section C-C of the embodiment of FIG. 2B, showing a bond wire electrically coupled to the leads, in accordance with an embodiment of the present invention.

3A illustrates a top plan view of a leadframe device region having an enlarged landing region on a connecting rod in accordance with another embodiment of the present invention.

3B illustrates a top plan view of an integrated circuit package including a die attached to the leadframe device region of FIG. 3A, wherein the die is electrically coupled to the tie bar, in accordance with another embodiment of the present invention. Amplified grounded area.

3C illustrates a side cross-sectional view of the integrated circuit package of FIG. 3B taken along section F-F, wherein the ground I/O pad is coupled to the amplifying junction of the connecting rod, in accordance with an embodiment of the present invention.

4A illustrates a side cross-sectional view of an integrated circuit package in which a bond wire is directly coupled to the die attach pad via a solder ball bond (BSOB) having a wedge that is bonded to the solder ball. .

4B illustrates a side cross-sectional view of an integrated circuit package in which a bond wire is directly coupled to the die attach pad via a reverse solder ball (RBSOB) that is bonded to the solder ball. .

5A-5C illustrate, in a top plan view, a lead frame strip 524 having a plurality of device regions 514 in accordance with an embodiment of the present invention.

304. . . Die attach liner

312. . . Multiple leads

314. . . Lead frame device area

318. . . Connecting rod

320. . . Junction area

324. . . Support rod

330. . . Finger part

Claims (12)

An integrated circuit package comprising: a lead frame comprising a die attach pad, a plurality of leads electrically isolated from the die attach pad and electrically isolated, and a die attach liner The pad is integrally formed and mechanically coupled and electrically coupled to the first connecting rod of the die attaching pad, the first connecting bar comprising a first engaging portion of a rectangular shape as a part of the first connecting rod The die attach pad has a die mounting surface disposed below the first bonding region; a die mounted on the die mounting surface of the die attach pad, the die Having a plurality of I/O pads; a first set of bond wires, wherein each bond wire of the first set of bond wires has a first end attached to an associated I/O pad and an attached to a related a second end of the lead wire to electrically couple the associated I/O pad to the associated lead; and a second set of bond wires, wherein at least one bond wire exists in the second set of bond wires, the first Each of the two sets of bond wires has an associated I/O pad attached to the die a first end and a second end of the first bonding region attached to the first connecting rod, whereby an attachment point of the first bonding wire to the first bonding region is opposite to a surface covering the die mounting surface Plane offset. The integrated circuit package of claim 1, wherein the die attach pad is electrically coupled to ground, and wherein each of the I/O pads attached to one of the second set of bond wires is A grounded I/O pad. Such as the integrated circuit package of claim 1 of the patent scope, wherein the first The width of the land is substantially greater than the width of the other portions of the first connecting rod. The integrated circuit package of claim 1, further comprising a plastic capsule seal encapsulating the die, the bonding wires and at least a portion of the lead frame, and leaving the crystal One of the bottom surfaces of the particle attachment liner is exposed to serve as an electrical contact. The integrated circuit package of claim 1, wherein the package is a dual in-line package having two rows of leads on opposite sides of the package and having no leads extending from opposite ends of the package, and Wherein the first connecting rod extends toward one end of the package without a lead. The integrated circuit package of claim 1, wherein the second set of bonding wires comprises a plurality of bonding wires each coupled to the first bonding region. The integrated circuit package of claim 1, further comprising: a second connecting rod integrally formed with the die attach pad and having a second bonding region, wherein at least one additional bonding wire is attached to The second magnifying junction area. The integrated circuit package of claim 7, wherein the top surfaces of the first bonding region and the second bonding region are substantially coplanar with the top surface of the leads. The integrated circuit package of claim 1, wherein the first land is shaped to be a fused lead shape having at least one finger portion extending inwardly toward the die. An electronic device comprising: An integrated circuit package according to claim 4, wherein each I/O pad attached to one of the bonding wires of the second group of bonding wires is a ground I/O pad, and the die attaches The pads are electrically coupled to ground to thereby electrically connect the ground I/O pads to ground via the bond wires, the first tie bars, and the die attach pads. An integrated circuit package comprising: a lead frame having a die attach pad, a plurality of leads, and a connecting bar connected to the die attach pad, the connecting bar comprising a first joint of a rectangular shape The region serves as a portion of the connecting rod; a die mounted on the die attach pad, the die including a plurality of I/O pads; at least one wire bonding bump formed on the die Attached to the pad; multiple bond wires, each bond wire electrically coupled to an associated I/O pad, wherein each of the first set of bond wires electrically connects an associated I/O pad to An associated lead, and wherein at least one of the bond wires is a down bond wire that is indirectly electrically coupled to the die attach pad, wherein each down bond wire pin is bonded to an associated wire bond A bump to electrically connect the down bond wire to the die attach pad. An integrated circuit package comprising: a lead frame including a plurality of leads, a die attach pad, and at least one connecting bar connected to the die attach pad and including a wire engaging landing zone, the connecting bar a first lands including a rectangular shape as part of the connecting rod, wherein each of the die attach pads and the leads serve as electrical contacts for the package, and the connecting rod does not Act as one for this Encapsulating electrical contacts, and wherein the die support surface is lowered relative to the wire bond landing zone; a die mounted on the die attach pad, the die comprising a plurality of I/O pads The plurality of I/O pads includes at least one ground I/O pad; multiple bond wires, each bond wire electrically coupled to an associated I/O pad, wherein each of the first set of bond wires One electrically connecting an associated I/O pad to an associated lead, and wherein at least one of the bond wires is a ground bond wire, the ground bond wire will be an associated I/O pad Connecting the wire to the landing zone of the connecting rod to indirectly electrically connect the ground bonding wire to the die attach pad, whereby the ground bonding wire to the wire bonding landing zone has an attachment point relative to a plane vertically covering the die mounting surface; and an encapsulant encapsulating the die, the bonding wires, and at least a portion of the lead frame, wherein a bottom surface of the die attach pad Exposing to a bottom surface of the package to facilitate electrically coupling the die attach pad to an electrical ground, Bonding wire to the ground via the connecting rods and the like of the die attach pad the ground I / O pads is electrically connected to the ground.