TWI515539B - Computer and power board thereof - Google Patents
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- TWI515539B TWI515539B TW103101922A TW103101922A TWI515539B TW I515539 B TWI515539 B TW I515539B TW 103101922 A TW103101922 A TW 103101922A TW 103101922 A TW103101922 A TW 103101922A TW I515539 B TWI515539 B TW I515539B
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- 238000006243 chemical reaction Methods 0.000 claims description 16
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 16
- 239000010931 gold Substances 0.000 claims description 16
- 229910052737 gold Inorganic materials 0.000 claims description 16
- 230000005540 biological transmission Effects 0.000 description 6
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
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Description
本發明係有關於一種電腦，特別係有關於一種具有較佳電源傳輸效率之電腦。 The present invention relates to a computer, and more particularly to a computer having better power transmission efficiency.
電腦的主機包括電源供應器、電源轉板以及主機板等電子元件。電源轉板耦接電源供應器。在習知技術中，受限於電腦主機內部空間的限制以及電子元件的配置設計，主機板主要透過排線耦接電源轉板。然而，排線在電力傳輸過程中造成電力損耗，並產生廢熱。此外，排線的延伸路徑佔用了許多系統空間，造成各電子元件在配置設計上的障礙。 The mainframe of the computer includes electronic components such as a power supply, a power transfer board, and a motherboard. The power transfer board is coupled to the power supply. In the prior art, limited by the limitation of the internal space of the host computer and the configuration design of the electronic components, the motherboard is mainly coupled to the power transfer board through the cable. However, the cable causes power loss during power transmission and generates waste heat. In addition, the extension path of the cable occupies a lot of system space, causing obstacles in the configuration design of each electronic component.
本發明係為了欲解決習知技術之問題而提供之一種電腦，包括一機殼、一電源供應單元、一第一主機板以及一電源轉板。電源供應單元設於該機殼之中。第一主機板設於該機殼之中，其中，該第一主機板包括一第一主機板連接部。電源轉板連接該電源供應單元，其中，該電源轉板包括一第一電源轉板連接部，該第一電源轉板連接部直接連接該第一主機板連接部，藉此該電源轉板連結該第一主機板，該電源轉板並與該第一主機板相垂直。 The present invention provides a computer for solving the problems of the prior art, including a casing, a power supply unit, a first motherboard, and a power transfer board. A power supply unit is disposed in the casing. The first motherboard is disposed in the casing, wherein the first motherboard includes a first motherboard connection. The power board is connected to the power supply unit, wherein the power board includes a first power board connecting portion, and the first power board connecting part is directly connected to the first board connecting portion, thereby connecting the power board The first motherboard, the power adapter is perpendicular to the first motherboard.
在一實施例中，該電源轉板透過金手指結構(connecting fingers)連接該電源供應單元。 In an embodiment, the power transfer board is connected to the power supply unit through connecting fingers.
在一實施例中，該電源供應單元包括一為長方體，具有一長度方向，該電源轉板平行於該長度方向。 In one embodiment, the power supply unit includes a rectangular parallelepiped having a length direction, and the power transfer plate is parallel to the length direction.
在一實施例中，該第一主機板連接部包括一主機板插槽，該第一電源轉板連接部包括一電源轉板金手指結構，該電源轉板金手指結構插入該主機板插槽。 In an embodiment, the first motherboard connection portion includes a motherboard slot, and the first power conversion board connection portion includes a power conversion plate gold finger structure, and the power conversion plate gold finger structure is inserted into the motherboard slot. .
在一實施例中，該第一主機板包括一第一主機板表面，該第一主機板連接部設置於該第一主機板表面，該第一主機板表面面向該電源供應單元以及該電源轉板。 In an embodiment, the first motherboard includes a first motherboard surface, the first motherboard connection portion is disposed on the first motherboard surface, the first motherboard surface faces the power supply unit, and the power is turned board.
在一實施例中，該電腦更包括一第二主機板，設於該機殼之中，其中，該第二主機板包括一第二主機板連接部，該電源轉板包括一第二電源轉板連接部，該第二主機板連接部直接連接該第二電源轉板連接部，藉此該電源轉板連結該第二主機板，並與該第二主機板相垂直。 In an embodiment, the computer further includes a second motherboard disposed in the casing, wherein the second motherboard includes a second motherboard connection portion, and the power conversion panel includes a second power supply In the board connecting portion, the second motherboard connecting portion is directly connected to the second power board connecting portion, whereby the power board is coupled to the second board and perpendicular to the second board.
在一實施例中，該第一主機板平行於該第二主機板。 In an embodiment, the first motherboard is parallel to the second motherboard.
在一實施例中，該第二主機板連接部包括一主機板金手指結構，該第二電源轉板連接部包括一電源轉板插槽，該主機板金手指結構插入該電源轉板插槽。 In an embodiment, the second motherboard connection portion includes a motherboard gold finger structure, and the second power conversion board connection portion includes a power conversion plate slot, and the motherboard gold finger structure is inserted into the power conversion plate slot. .
在一實施例中，該電源供應單元包括一第一電源供應器以及一第二電源供應器，該第二主機板位於該第一電源供應器以及該第二電源供應器之間。 In an embodiment, the power supply unit includes a first power supply and a second power supply, and the second motherboard is located between the first power supply and the second power supply.
在一實施例中，該電源轉板包括一第一表面、一第二表面、一第一電極棒、一第二電極棒、一正極線路層以及一負極線路層，該第一表面相反於該第二表面，該正極線路層 以及該負極線路層係埋設於該電源轉板之中，該第一電極棒設於該第一表面並電性連接該正極線路層，該第二電極棒設於該第二表面並電性連接該負極線路層。 In one embodiment, the power conversion board includes a first surface, a second surface, a first electrode rod, a second electrode rod, a positive circuit layer, and a negative circuit layer, the first surface being opposite to the Second surface, the positive circuit layer The first electrode rod is disposed on the first surface and electrically connected to the positive circuit layer, and the second electrode rod is disposed on the second surface and electrically connected. The negative circuit layer.
在一實施例中，該機殼包括一抵接結構，該抵接結構抵接該第二電極棒，並與該第二電極棒電性連接。 In one embodiment, the housing includes an abutting structure that abuts the second electrode rod and is electrically connected to the second electrode rod.
在一實施例中，本發明提供一種電源轉板，適於連接一第一主機板以及一電源供應單元，該第一主機板包括一第一主機板連接部，該電源轉板包括一第一電源轉板連接部，該第一電源轉板連接部直接連接該第一主機板連接部，藉此該電源轉板連結該第一主機板，其中，該第一主機板連接部包括一主機板插槽，該第一電源轉板連接部包括一電源轉板金手指結構，該電源轉板金手指結構插入該主機板插槽。 In an embodiment, the present invention provides a power transfer board, which is adapted to be connected to a first motherboard and a power supply unit, the first motherboard includes a first motherboard connection, and the power adapter includes a first a power board connecting portion, the first power board connecting portion is directly connected to the first motherboard connecting portion, wherein the power board is coupled to the first board, wherein the first board connecting portion comprises a motherboard The slot, the first power plate connection portion includes a power switch plate gold finger structure, and the power plate metal finger structure is inserted into the motherboard slot.
應用本發明實施例之電腦，由於省略了排線。因此避免了電力在傳輸過程中的電力損耗。並且節省了許多系統空間。提高了各電子元件在配置設計上的靈活度。特別是，在本發明實施例之電腦中，電源轉板可以在最小的空間同時連接兩個主機板，提供電源傳輸的功能，大幅改善了電腦內部空間的使用效率。 The computer to which the embodiment of the present invention is applied is omitted because the cable is omitted. Therefore, power loss of power during transmission is avoided. And save a lot of system space. Improve the flexibility of the design of each electronic component. In particular, in the computer of the embodiment of the invention, the power transfer board can simultaneously connect two main boards in a minimum space, and provides a power transmission function, which greatly improves the use efficiency of the internal space of the computer.
10‧‧‧機殼 10‧‧‧Chassis
20‧‧‧電源供應單元 20‧‧‧Power supply unit
21‧‧‧第一電源供應器 21‧‧‧First power supply
22‧‧‧第二電源供應器 22‧‧‧Second power supply
30‧‧‧第一主機板 30‧‧‧First motherboard
31‧‧‧第一主機板連接部 31‧‧‧ First motherboard connection
32‧‧‧第一主機板表面 32‧‧‧First motherboard surface
40‧‧‧電源轉板 40‧‧‧Power transfer board
41‧‧‧第一電源轉板連接部 41‧‧‧First power transfer board connection
42‧‧‧第二電源轉板連接部 42‧‧‧Second power transfer board connection
43‧‧‧金手指結構 43‧‧‧Gold finger structure
44‧‧‧第二表面 44‧‧‧ second surface
45‧‧‧第一電極棒 45‧‧‧First electrode rod
46‧‧‧第二電極棒 46‧‧‧Second electrode rod
47‧‧‧第一表面 47‧‧‧ first surface
50‧‧‧第二主機板 50‧‧‧Second motherboard
51‧‧‧第二主機板連接部 51‧‧‧Second motherboard connection
第1圖係顯示本發明第一實施例之電腦的立體圖。 Fig. 1 is a perspective view showing a computer of a first embodiment of the present invention.
第2圖係顯示本發明第二實施例之電腦的立體圖。 Fig. 2 is a perspective view showing a computer of a second embodiment of the present invention.
第3圖係顯示本發明第二實施例之電腦之主要元件的側視圖。 Figure 3 is a side view showing the main components of the computer of the second embodiment of the present invention.
第4A以及4B圖係顯示本發明之電源轉板之一變形例。 4A and 4B are views showing a modification of the power conversion plate of the present invention.
參照第1圖，其係顯示本發明第一實施例之電腦，包括一機殼10、一電源供應單元20、一第一主機板30以及一電源轉板40。電源供應單元20設於該機殼10之中。第一主機板30設於該機殼10之中，其中，該第一主機板30包括一第一主機板連接部31。電源轉板40連接該電源供應單元20，其中，該電源轉板40包括一第一電源轉板連接部41，該第一電源轉板連接部41直接連接該第一主機板連接部31，藉此該電源轉板40連結該第一主機板30，該電源轉板40並與該第一主機板30相垂直。 Referring to FIG. 1, a computer according to a first embodiment of the present invention includes a casing 10, a power supply unit 20, a first motherboard 30, and a power conversion plate 40. The power supply unit 20 is disposed in the casing 10. The first motherboard 30 is disposed in the casing 10, wherein the first motherboard 30 includes a first motherboard connection portion 31. The power board 40 is connected to the power supply unit 20, wherein the power board 40 includes a first power board connection 41, and the first power board connection unit 41 is directly connected to the first board connection unit 31. The power transfer plate 40 is coupled to the first motherboard 30 , and the power conversion plate 40 is perpendicular to the first motherboard 30 .
在上述實施例中，該電源轉板40可透過金手指結構43(connecting fingers)連接該電源供應單元20。 In the above embodiment, the power conversion plate 40 can be connected to the power supply unit 20 through the connecting fingers 43 (connecting fingers).
參照第1圖，該電源供應單元20包括一為長方體，具有一長度方向X，該電源轉板40平行於該長度方向X。 Referring to Fig. 1, the power supply unit 20 includes a rectangular parallelepiped having a length direction X, and the power supply plate 40 is parallel to the longitudinal direction X.
參照第1圖，該第一主機板連接部31可以為一主機板插槽，該第一電源轉板連接部41可以為一電源轉板金手指結構，該電源轉板金手指結構41插入該主機板插槽31。 Referring to FIG. 1 , the first motherboard connection portion 31 can be a motherboard slot, and the first power adapter connection portion 41 can be a power switch gold finger structure, and the power adapter gold finger structure 41 is inserted into the motherboard. Motherboard slot 31.
參照第1圖，在此實施例中，該第一主機板30包括一第一主機板表面32，該第一主機板連接部31設置於該第一主機板表面32，該第一主機板表面32面向該電源供應單元20以及該電源轉板40。 Referring to FIG. 1 , in the embodiment, the first motherboard 30 includes a first motherboard surface 32 , and the first motherboard connection portion 31 is disposed on the first motherboard surface 32 , the first motherboard surface 32 faces the power supply unit 20 and the power transfer plate 40.
參照第2、3圖，係顯示本發明第二實施例之電腦，相較於第一實施例，其更包括一第二主機板50，設於該機殼10之中。其中，該第二主機板50包括一第二主機板連接部51，該 電源轉板40包括一第二電源轉板連接部42，該第二主機板連接部51直接連接該第二電源轉板連接部42，藉此該電源轉板40連結該第二主機板50，並與該第二主機板50相垂直。 Referring to FIGS. 2 and 3, a computer according to a second embodiment of the present invention is further provided, which further includes a second motherboard 50 disposed in the casing 10 as compared with the first embodiment. The second motherboard 50 includes a second motherboard connection portion 51. The power board 40 includes a second power board connecting portion 42 . The second board connecting portion 51 is directly connected to the second power board connecting portion 42 . The power board 40 is coupled to the second board 50 . And perpendicular to the second motherboard 50.
參照第2、3圖，在此實施例中，該第一主機板30平行於該第二主機板50。該第二主機板連接部51可以為一主機板金手指結構，該第二電源轉板連接部42可以為一電源轉板插槽，該主機板金手指結構插入該電源轉板插槽。 Referring to FIGS. 2 and 3, in this embodiment, the first motherboard 30 is parallel to the second motherboard 50. The second motherboard connection portion 51 can be a motherboard gold finger structure, and the second power board connection portion 42 can be a power board slot, and the motherboard gold finger structure is inserted into the power board slot.
參照第2、3圖，在一實施例中，該電源供應單元20包括一第一電源供應器21以及一第二電源供應器22，該第二主機板50位於該第一電源供應器21以及該第二電源供應器22之間。在本發明之實施例中，雖然以具有兩個電源供應器的系統為例，但其並未限制本發明，本發明亦可應用於具有一個或三個以上電源供應器之電腦系統。 Referring to FIGS. 2 and 3, in an embodiment, the power supply unit 20 includes a first power supply 21 and a second power supply 22, and the second motherboard 50 is located at the first power supply 21 and Between the second power supplies 22. In the embodiment of the present invention, although a system having two power supplies is taken as an example, it does not limit the present invention, and the present invention is also applicable to a computer system having one or more power supplies.
應用本發明實施例之電腦，由於省略了排線。因此避免了電力在傳輸過程中的電力損耗。並且節省了許多系統空間。提高了各電子元件在配置設計上的靈活度。特別是，在本發明實施例之電腦中，電源轉板可以在最小的空間同時連接兩個主機板，提供電源傳輸的功能，大幅改善了電腦內部空間的使用效率。 The computer to which the embodiment of the present invention is applied is omitted because the cable is omitted. Therefore, power loss of power during transmission is avoided. And save a lot of system space. Improve the flexibility of the design of each electronic component. In particular, in the computer of the embodiment of the invention, the power transfer board can simultaneously connect two main boards in a minimum space, and provides a power transmission function, which greatly improves the use efficiency of the internal space of the computer.
參照第4A以及4B圖，在一實施例中，該電源轉板40包括一第一表面47、一第二表面44、一第一電極棒45、一第二電極棒46、一正極線路層(未圖式)以及一負極線路層(未圖式)，該第一表面47相反於該第二表面44，該正極線路層以及該負極線路層係埋設於該電源轉板40之中，該第一電極棒45設 於該第一表面47並電性連接該正極線路層，該第二電極棒46設於該第二表面44並電性連接該負極線路層。在一實施例中，該機殼10包括一抵接結構(例如，機殼內壁上的凸出結構)，該抵接結構抵接該第二電極棒46，並與該第二電極棒46電性連接，藉此將該電源轉板40接地。透過第一電極棒以及第二電極棒的設計，本發明實施例之電源轉板可承受較高的電力負載，並提高系統的可靠度。 Referring to FIGS. 4A and 4B, in an embodiment, the power conversion plate 40 includes a first surface 47, a second surface 44, a first electrode rod 45, a second electrode rod 46, and a positive circuit layer ( a first negative electrode layer (not shown), the first surface 47 is opposite to the second surface 44, and the positive circuit layer and the negative circuit layer are embedded in the power rotating plate 40. An electrode rod 45 is provided The first surface 47 is electrically connected to the positive circuit layer, and the second electrode rod 46 is disposed on the second surface 44 and electrically connected to the negative circuit layer. In an embodiment, the casing 10 includes an abutting structure (for example, a protruding structure on the inner wall of the casing), the abutting structure abuts the second electrode rod 46, and the second electrode rod 46 Electrically connected thereby grounding the power transfer plate 40. Through the design of the first electrode rod and the second electrode rod, the power conversion plate of the embodiment of the invention can withstand high electrical load and improve the reliability of the system.
雖然本發明已以具體之較佳實施例揭露如上，然其並非用以限定本發明，任何熟習此項技術者，在不脫離本發明之精神和範圍內，仍可作些許的更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and may be modified and modified without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.
10‧‧‧機殼 10‧‧‧Chassis
20‧‧‧電源供應單元 20‧‧‧Power supply unit
21‧‧‧第一電源供應器 21‧‧‧First power supply
22‧‧‧第二電源供應器 22‧‧‧Second power supply
30‧‧‧第一主機板 30‧‧‧First motherboard
31‧‧‧第一主機板連接部 31‧‧‧ First motherboard connection
32‧‧‧第一主機板表面 32‧‧‧First motherboard surface
40‧‧‧電源轉板 40‧‧‧Power transfer board
41‧‧‧第一電源轉板連接部 41‧‧‧First power transfer board connection
43‧‧‧金手指結構 43‧‧‧Gold finger structure
Claims (9)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103101922A TWI515539B (en) | 2014-01-20 | 2014-01-20 | Computer and power board thereof |
| CN201410042271.3A CN104793707A (en) | 2014-01-20 | 2014-01-28 | Computer and power supply rotating plate thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103101922A TWI515539B (en) | 2014-01-20 | 2014-01-20 | Computer and power board thereof |
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|---|---|
| TW201530288A TW201530288A (en) | 2015-08-01 |
| TWI515539B true TWI515539B (en) | 2016-01-01 |
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| TW103101922A TWI515539B (en) | 2014-01-20 | 2014-01-20 | Computer and power board thereof |
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| TW (1) | TWI515539B (en) |
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| US6970346B2 (en) * | 2003-07-22 | 2005-11-29 | Evserv Tech Corporation | Redundant power supply wirelessly connected to motherboard |
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| CN102645957B (en) * | 2012-03-09 | 2014-05-07 | 华为技术有限公司 | Back plate system |
| CN102662453B (en) * | 2012-03-27 | 2014-07-23 | 中国人民解放军国防科学技术大学 | Power supply system of high-performance computer |
| CN102799224A (en) * | 2012-07-17 | 2012-11-28 | 曙光信息产业(北京)有限公司 | High-density blade type micro-server |
-
2014
- 2014-01-20 TW TW103101922A patent/TWI515539B/en not_active IP Right Cessation
- 2014-01-28 CN CN201410042271.3A patent/CN104793707A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW201530288A (en) | 2015-08-01 |
| CN104793707A (en) | 2015-07-22 |
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| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |