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TWI512297B - - Google Patents

Info

Publication number
TWI512297B
TWI512297B TW103116505A TW103116505A TWI512297B TW I512297 B TWI512297 B TW I512297B TW 103116505 A TW103116505 A TW 103116505A TW 103116505 A TW103116505 A TW 103116505A TW I512297 B TWI512297 B TW I512297B
Authority
TW
Taiwan
Application number
TW103116505A
Other versions
TW201543039A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW103116505A priority Critical patent/TW201543039A/zh
Priority to US14/702,764 priority patent/US20150323566A1/en
Priority to KR2020150002909U priority patent/KR20150004160U/ko
Priority to ITVI2015U000022U priority patent/ITVI20150022U1/it
Priority to JP2015002253U priority patent/JP3198767U/ja
Publication of TW201543039A publication Critical patent/TW201543039A/zh
Application granted granted Critical
Publication of TWI512297B publication Critical patent/TWI512297B/zh

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889Interfaces, e.g. between probe and tester
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06766Input circuits therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00Testing or calibrating of apparatus covered by the other groups of this subclass
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44Conversion of DC power input into AC power output without possibility of reversal by static converters
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/08Locating faults in cables, transmission lines, or networks
    • G01R31/11Locating faults in cables, transmission lines, or networks using pulse reflection methods

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
TW103116505A 2014-05-09 2014-05-09 用於測試探針卡之轉換卡 TW201543039A (zh)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW103116505A TW201543039A (zh) 2014-05-09 2014-05-09 用於測試探針卡之轉換卡
US14/702,764 US20150323566A1 (en) 2014-05-09 2015-05-04 Conversion card for use with probe card
KR2020150002909U KR20150004160U (ko) 2014-05-09 2015-05-07 프로브 카드 시험용 전환 카드
ITVI2015U000022U ITVI20150022U1 (it) 2014-05-09 2015-05-07 Scheda di conversione da utilizzare con probe card
JP2015002253U JP3198767U (ja) 2014-05-09 2015-05-08 プローブカードテスト用の変換カード

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103116505A TW201543039A (zh) 2014-05-09 2014-05-09 用於測試探針卡之轉換卡

Publications (2)

Publication Number Publication Date
TW201543039A TW201543039A (zh) 2015-11-16
TWI512297B true TWI512297B (zh) 2015-12-11

Family

ID=53718250

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103116505A TW201543039A (zh) 2014-05-09 2014-05-09 用於測試探針卡之轉換卡

Country Status (5)

Country Link
US (1) US20150323566A1 (zh)
JP (1) JP3198767U (zh)
KR (1) KR20150004160U (zh)
IT (1) ITVI20150022U1 (zh)
TW (1) TW201543039A (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106707053B (zh) * 2016-11-15 2019-04-30 中国电子科技集团公司第四十一研究所 一种提高矢量网络分析仪高速链路测试能力的系统及方法
US11226353B2 (en) 2017-03-31 2022-01-18 Intel Corporation Integrated cable probe design for high bandwidth RF testing
CN111103565B (zh) * 2019-12-11 2022-03-01 国网天津市电力公司电力科学研究院 一种基于智能电能表计量误差分析的数据变换方法及系统
CN116298473B (zh) * 2023-05-17 2023-08-08 湖南大学 芯片引脚电压的非接触测量方法、装置、设备和介质

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201126168A (en) * 2010-01-21 2011-08-01 Mpi Corp Probe card and printed circuit board applicable to the same
TW201209420A (en) * 2010-08-31 2012-03-01 Hermes Testing Solutions Inc Probe card structure adaptable to different test apparatuses having different specifications

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7349223B2 (en) * 2000-05-23 2008-03-25 Nanonexus, Inc. Enhanced compliant probe card systems having improved planarity
US7742307B2 (en) * 2008-01-17 2010-06-22 Raytheon Company High performance power device
EP2574949A3 (en) * 2011-09-30 2013-10-30 Kabushiki Kaisha Toshiba Photovoltaic panel diagnosis device, method and program

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201126168A (en) * 2010-01-21 2011-08-01 Mpi Corp Probe card and printed circuit board applicable to the same
TW201209420A (en) * 2010-08-31 2012-03-01 Hermes Testing Solutions Inc Probe card structure adaptable to different test apparatuses having different specifications

Also Published As

Publication number Publication date
ITVI20150022U1 (it) 2016-11-07
TW201543039A (zh) 2015-11-16
US20150323566A1 (en) 2015-11-12
KR20150004160U (ko) 2015-11-18
JP3198767U (ja) 2015-07-23

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees