TWI512297B - - Google Patents
Info
- Publication number
- TWI512297B TWI512297B TW103116505A TW103116505A TWI512297B TW I512297 B TWI512297 B TW I512297B TW 103116505 A TW103116505 A TW 103116505A TW 103116505 A TW103116505 A TW 103116505A TW I512297 B TWI512297 B TW I512297B
- Authority
- TW
- Taiwan
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06766—Input circuits therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
- H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/08—Locating faults in cables, transmission lines, or networks
- G01R31/11—Locating faults in cables, transmission lines, or networks using pulse reflection methods
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103116505A TW201543039A (zh) | 2014-05-09 | 2014-05-09 | 用於測試探針卡之轉換卡 |
| US14/702,764 US20150323566A1 (en) | 2014-05-09 | 2015-05-04 | Conversion card for use with probe card |
| KR2020150002909U KR20150004160U (ko) | 2014-05-09 | 2015-05-07 | 프로브 카드 시험용 전환 카드 |
| ITVI2015U000022U ITVI20150022U1 (it) | 2014-05-09 | 2015-05-07 | Scheda di conversione da utilizzare con probe card |
| JP2015002253U JP3198767U (ja) | 2014-05-09 | 2015-05-08 | プローブカードテスト用の変換カード |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103116505A TW201543039A (zh) | 2014-05-09 | 2014-05-09 | 用於測試探針卡之轉換卡 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201543039A TW201543039A (zh) | 2015-11-16 |
| TWI512297B true TWI512297B (zh) | 2015-12-11 |
Family
ID=53718250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103116505A TW201543039A (zh) | 2014-05-09 | 2014-05-09 | 用於測試探針卡之轉換卡 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20150323566A1 (zh) |
| JP (1) | JP3198767U (zh) |
| KR (1) | KR20150004160U (zh) |
| IT (1) | ITVI20150022U1 (zh) |
| TW (1) | TW201543039A (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106707053B (zh) * | 2016-11-15 | 2019-04-30 | 中国电子科技集团公司第四十一研究所 | 一种提高矢量网络分析仪高速链路测试能力的系统及方法 |
| US11226353B2 (en) | 2017-03-31 | 2022-01-18 | Intel Corporation | Integrated cable probe design for high bandwidth RF testing |
| CN111103565B (zh) * | 2019-12-11 | 2022-03-01 | 国网天津市电力公司电力科学研究院 | 一种基于智能电能表计量误差分析的数据变换方法及系统 |
| CN116298473B (zh) * | 2023-05-17 | 2023-08-08 | 湖南大学 | 芯片引脚电压的非接触测量方法、装置、设备和介质 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201126168A (en) * | 2010-01-21 | 2011-08-01 | Mpi Corp | Probe card and printed circuit board applicable to the same |
| TW201209420A (en) * | 2010-08-31 | 2012-03-01 | Hermes Testing Solutions Inc | Probe card structure adaptable to different test apparatuses having different specifications |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7349223B2 (en) * | 2000-05-23 | 2008-03-25 | Nanonexus, Inc. | Enhanced compliant probe card systems having improved planarity |
| US7742307B2 (en) * | 2008-01-17 | 2010-06-22 | Raytheon Company | High performance power device |
| EP2574949A3 (en) * | 2011-09-30 | 2013-10-30 | Kabushiki Kaisha Toshiba | Photovoltaic panel diagnosis device, method and program |
-
2014
- 2014-05-09 TW TW103116505A patent/TW201543039A/zh not_active IP Right Cessation
-
2015
- 2015-05-04 US US14/702,764 patent/US20150323566A1/en not_active Abandoned
- 2015-05-07 KR KR2020150002909U patent/KR20150004160U/ko not_active Ceased
- 2015-05-07 IT ITVI2015U000022U patent/ITVI20150022U1/it unknown
- 2015-05-08 JP JP2015002253U patent/JP3198767U/ja not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201126168A (en) * | 2010-01-21 | 2011-08-01 | Mpi Corp | Probe card and printed circuit board applicable to the same |
| TW201209420A (en) * | 2010-08-31 | 2012-03-01 | Hermes Testing Solutions Inc | Probe card structure adaptable to different test apparatuses having different specifications |
Also Published As
| Publication number | Publication date |
|---|---|
| ITVI20150022U1 (it) | 2016-11-07 |
| TW201543039A (zh) | 2015-11-16 |
| US20150323566A1 (en) | 2015-11-12 |
| KR20150004160U (ko) | 2015-11-18 |
| JP3198767U (ja) | 2015-07-23 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |