TWI510751B - Heat pipe structure - Google Patents

Description

Heat pipe structure improvement

The invention relates to a heat pipe structure improvement, in particular to a heat pipe structure improvement which can reduce the heat resistance pressure and greatly increase the vapor-liquid circulation inside the heat pipe and thereby increase the heat transfer efficiency.

With the miniaturization and high performance of computers, smart electronic devices and other electrical devices, the heat transfer components and heat dissipating components used in the interior are also required to be designed in the direction of miniaturization and thinning. In order to meet the needs of users.

The heat pipe is a heat-conducting element with excellent heat conduction efficiency, and its heat transfer efficiency is several times or even several tens of times higher than that of metals such as copper and aluminum, and thus it is used as a cooling element in various heat-related equipment.

In terms of shape, the heat pipe is divided into a heat pipe having a circular tube shape, a heat pipe having a D-shaped cross section, a flat heat pipe, etc., and is mainly used for cooling the heat source in the electronic device, and is convenient for mounting to the cooled component and In order to obtain a larger area of the contact surface, the flat heat pipe is widely used at the present stage, and as the cooling mechanism is miniaturized and space-saving, the electronic device using the heat pipe as the heat conduction is also selected in the same amount. Flat heat pipe to apply.

The conventional heat pipe structure has various manufacturing methods, for example, a metal powder is filled in a hollow pipe body, and the metal powder is sintered to form a capillary structure layer on the inner wall of the hollow pipe, and thereafter The tube body is vacuum-filled into the working fluid to finally seal the tube, or the mesh body of the metal material is built in the hollow tube body, and the mesh-shaped capillary structure is unfolded and naturally extended outwardly to the Hollow tube inner wall In order to form a capillary structure layer, the tube body is then vacuum-filled to fill the working fluid and finally sealed. However, due to the micro-thinning requirements of the electronic equipment, the heat pipe needs to be made into a flat type.

Although the flat heat pipe can achieve the purpose of thinning, it extends another problem. Since the flat heat pipe sinters the metal powder on the inner wall surface of the heat pipe diameter, the sintered body is completely covered. On the wall surface, when the flat heat pipe is pressurized, the capillary structure (ie, the sintered metal powder or the network capillary structure) on the two sides of the flat heat pipe is susceptible to crushing damage, and the flat heat pipe is further The inner wall is detached, so that the heat transfer efficiency of the thin heat pipe is greatly reduced or it is dissipated; in addition, although the flat heat pipe can achieve heat source conduction, since the flat heat pipe is thinned, the interior is thinned. The capillary force of the capillary structure is insufficient, causing the working fluid to block the steam passage. Moreover, the area of the flow passage in the tube is reduced when the flat heat pipe is thinned, so that the capillary force is reduced, and the maximum heat transfer amount is also lowered. The overall thinning of the flat heat pipe leads to a reduction in the inner volume of the flat heat pipe, and the other reason is that the thinned flat heat pipe after the flattening causes the central recessed rear seal Blocks the steam path.

Therefore, in order to solve the above-mentioned conventional disadvantages, a person in the field inserts a mandrel into the inner chamber of the flat heat pipe, and the mandrel forms a specific slit shape along the axial direction, and the inner wall of the cavity is formed by the slit The formed space is filled with metal powder and sintered to form a capillary structure, and finally the mandrel is pulled out, and then the central portion of the chamber where the capillary structure is located is subjected to press processing to form a flat shape, and the capillary structure and the inner wall of the chamber are formed. The flat portion is in thermal contact, and a gap is provided on both sides of the capillary structure in the chamber as a steam passage to obtain a better vapor passage impedance, but the capillary section is narrow, so that The reduction in capillary force results in poor anti-gravity thermal efficiency and heat transfer efficiency, and this shortcoming is the focus of current improvement.

Accordingly, in order to solve the above disadvantages of the prior art, the main object of the present invention is to provide a heat pipe structure improvement that can improve heat conduction and heat transfer efficiency.

A secondary object of the present invention is to provide a heat pipe structural improvement that reduces the anti-gravity performance.

In order to achieve the above object, the present invention provides a heat pipe structure improvement, comprising: a body having a chamber, the chamber having a first side and a second side, wherein the first and second sides are respectively provided with a a first capillary structure and a second capillary structure and a working fluid, wherein the first capillary structure has a radial extent greater than or equal to one half of the circumference of the inner wall of the chamber, and is greater than a radial extent of the second capillary structure, and One side of the first capillary structure and the second capillary structure are coupled to each other and define at least one steam passage together with the chamber.

The heat pipe structure improvement system of the present invention can greatly improve the anti-gravity performance inside the heat pipe, thereby improving the vapor-liquid circulation efficiency of the working fluid, so the invention has the following advantages: 1. The unit area can withstand a large thermal power impact; Improve the maximum heat transfer efficiency; 3. Excellent anti-gravity ability; 4. The interface thermal resistance is small.

The above object of the present invention and its structural and functional characteristics will be based on the drawings The preferred embodiment of the formula is illustrated.

1 and 2 are a perspective view and a cross-sectional view of a first embodiment of the heat pipe structure according to the present invention. As shown in the figure, the heat pipe structure is improved, comprising: a body 1; the body 1 has a a chamber 11 having a first side 111 and a second side 112. The first and second sides 111, 112 are respectively provided with a first capillary structure 1111 and a second capillary structure 1121 and a working fluid. 2, the first capillary structure 1111 has a radial extent greater than or equal to one half of the inner wall of the chamber 11 and is greater than the radial extent of the second capillary structure 1121, and the first capillary structure 1111 side The second capillary structure 1121 is coupled to the second capillary structure 1121 and defines at least one steam passage 113 together with the chamber 11.

The first and second capillary structures 1111 and 1121 are either a sintered powder body, a mesh body, a fiber body, and a porous structure. This embodiment is a sintered powder body, but is not limited thereto. The chamber 11 is formed into a smooth wall.

FIG. 3 is a cross-sectional view showing a second embodiment of the heat pipe structure according to the present invention. As shown in the figure, the structure of the embodiment is the same as that of the first embodiment, and therefore will not be described herein. The difference between the embodiment and the first embodiment is that a first extension portion 1112 extends from a side of the first capillary structure 1111, and the first extension portion 1112 is connected to the second capillary structure 1121.

FIG. 4 is a cross-sectional view showing a third embodiment of the heat pipe structure according to the present invention. As shown in the figure, the structure of the embodiment is the same as that of the first embodiment, and therefore will not be described herein. The difference between the embodiment and the foregoing first embodiment is A second extension portion 1122 extends from a side of the second capillary structure 1121, and the second extension portion 1122 is coupled to the first capillary structure 1111.

FIG. 5 is a cross-sectional view showing a fourth embodiment of the heat pipe structure according to the present invention. As shown in the figure, the structure of the embodiment is the same as that of the first embodiment, and therefore will not be described herein. The difference between the embodiment and the foregoing first embodiment is that a third capillary structure 114 is disposed on the wall surface of the chamber 11 , and the first and second capillary structures 1111 , 1121 are connected to the third capillary structure 114 . The third capillary structure 114 is a sintered powder body, a mesh body, a fiber body, and a groove. The present embodiment is described by a groove, but is not limited thereto.

FIG. 6 is a cross-sectional view showing a fifth embodiment of the heat pipe structure according to the present invention. As shown in the figure, the structure of the embodiment is the same as that of the first embodiment, and therefore will not be described herein. The difference between the embodiment and the foregoing first embodiment is that the wall surface of the chamber 11 further has a plating layer 3, and the plating layer 3 is disposed between the wall surface of the chamber 11 and the first and second capillary structures 1111 and 1121. The plating layer 3 is selected as one of a hydrophilic plating layer and a hydrophobic plating layer, or the user may customize the partial hydrophilic coating and partially apply the hydrophobic plating layer.

FIG. 7 and FIG. 8 are a perspective view and a cross-sectional view showing an application embodiment of the heat pipe structure according to the present invention. As shown, the exterior of the first side 111 of the body 1 is correspondingly disposed with at least one heat source 4, and the heat dissipation is performed. The component 5 is disposed on the other end of the body 1 opposite to the heat source 4. The heat dissipating component 5 is a heat sink, a heat sink fin set, and a water cooling device. This embodiment uses a heat sink as an illustration, but To be limited.

The first capillary structure 1111 of the body 1 of the embodiment has an overall volume larger than the second The capillary structure 1121 and the longitudinal extension thereof are more than or exactly equal to one half of the circumference of the wall of the chamber 11. The first capillary structure 1111 is disposed on the first side 111 of the body 1 corresponding to the heat source 4, The second capillary structure 1121 is disposed on the second side 112 corresponding to the first side 111. The heat generated by the heat source 4 causes the working fluid 2 in the first capillary structure 1111 to be evaporated by heat, and the liquid working fluid 22 The working fluid 21 converted to the vapor state is diffused toward the second capillary structure 1121 disposed on the second side 112 of the body 1. The vaporous working fluid 21 is cooled on the second side 112 to be condensed into a liquid working fluid 22, and then The vapor-liquid circulation is continued by gravity or the second capillary structure 1121 is returned to the first capillary structure 1111. The working fluid 2 is converted from a vapor state to a liquid system through the vapor passage 113 of the body 1 from the first capillary structure 1111 to the first The second capillary structure 1121 is diffused. Since the volume of the second capillary structure 1121 is smaller than the first capillary structure 1111, the pressure resistance of the vaporous working fluid 21 during diffusion can be reduced, and the vapor-liquid circulation efficiency of the working fluid 2 can be effectively increased. , The heat is transmitted to the distal end of the heat source 4 to dissipate heat, so that the heat source 4 does not accumulate heat, which not only accelerates the radial heat conduction efficiency of the body 1, but also improves the axial heat transfer efficiency of the body 1 .

1‧‧‧ Ontology

11‧‧‧ chamber

111‧‧‧ first side

1111‧‧‧First capillary structure

1112‧‧‧First Extension

112‧‧‧ second side

1121‧‧‧Second capillary structure

1122‧‧‧Second extension

113‧‧‧Steam channel

2‧‧‧Working fluid

21‧‧‧Vaporous working fluid

22‧‧‧Liquid working fluid

3‧‧‧ plating

4‧‧‧heat source

5‧‧‧Heat components

1 is a perspective view of a first embodiment of a heat pipe structure according to the present invention; FIG. 2 is a cross-sectional view of the first embodiment of the heat pipe structure according to the present invention; FIG. 3 is a second embodiment of the heat pipe structure of the present invention. Figure 4 is a cross-sectional view showing a third embodiment of the heat pipe structure according to the present invention; and Figure 5 is a cross-sectional view showing a fourth embodiment of the heat pipe structure according to the present invention; Figure 6 is a cross-sectional view showing a modified embodiment of the heat pipe structure of the present invention; Figure 7 is a perspective view showing an improved application embodiment of the heat pipe structure of the present invention; and Figure 8 is a cross-sectional view showing an improved application embodiment of the heat pipe structure of the present invention.

1‧‧‧ Ontology

11‧‧‧ chamber

111‧‧‧ first side

112‧‧‧ second side

113‧‧‧Steam channel

1111‧‧‧First capillary structure

1121‧‧‧Second capillary structure

2‧‧‧Working fluid

Claims (12)

A heat pipe structure improvement comprising: a body having a chamber, the chamber having a first side and a second side, wherein the first and second sides are respectively provided with a first capillary structure and a second capillary structure And a working fluid, the first capillary structure has a radial extension range greater than one half of the circumference of the inner wall of the chamber, and is greater than a radial extent of the second capillary structure, and the first capillary structure side and the second The capillary structures are connected to each other, and the first and second capillary structures are sintered powder bodies, and together with the chamber, define at least one steam passage, a heat absorption zone and a condensation zone, and the wall surface of the cavity is further coated. The plating layer is disposed between the wall surface of the chamber and the first and second capillary structures, and the plating layer located in the heat absorption region is a hydrophilic plating layer, and the condensation region is a hydrophobic plating layer, and the first side of the chamber The external heat is disposed on the external side corresponding to the at least one heat source, and the second side is externally disposed with at least one heat dissipating component, wherein the heat dissipating component is any one of a heat sink or a heat dissipating fin set or a water cooling device. The heat pipe structure improvement according to claim 1, wherein one side of the first capillary structure extends to a first extension portion, and the first extension portion is connected to the second capillary structure. The heat pipe structure improvement according to claim 1, wherein one side of the second capillary structure extends to a second extension portion, and the second extension portion is connected to the first capillary structure. The heat pipe structure improvement according to claim 1, wherein the chamber system Made into a smooth wall. The heat pipe structure improvement according to claim 1, wherein the chamber wall surface is provided with a third capillary structure, and the first and second capillary structures are connected to the third capillary structure. The heat pipe structure improvement according to claim 5, wherein the third capillary structure is any one of a sintered powder body, a mesh body and a fiber body, and a groove and a porous structure. A heat pipe structure improvement comprising: a body having a chamber, the chamber having a first side and a second side, wherein the first and second sides are respectively provided with a first capillary structure and a second capillary structure And a working fluid, the first capillary structure has a radial extension range equal to one half of the circumference of the inner wall of the chamber, and is greater than a radial extent of the second capillary structure, wherein the first and second capillary structures are sintered powder bodies. And a side of the first capillary structure and the second capillary structure are coupled to each other, and together with the chamber, define at least one steam passage, a heat absorption region and a condensation region, and the chamber wall surface has a plating layer. The plating layer is disposed between the wall surface of the chamber and the first and second capillary structures, and the plating layer located in the heat absorption region is a hydrophilic plating layer, and the condensation region is a hydrophobic plating layer, and the first side of the chamber The external heat is disposed on the external side corresponding to the at least one heat source, and the second side is externally disposed with at least one heat dissipating component, wherein the heat dissipating component is any one of a heat sink or a heat dissipating fin set or a water cooling device. The heat pipe structure improvement according to claim 7, wherein the first hair is One side of the fine structure extends a first extension, and the first extension is connected to the second capillary structure. The heat pipe structure improvement according to claim 7, wherein one side of the second capillary structure extends to a second extension portion, and the second extension portion is connected to the first capillary structure. The heat pipe structure improvement according to claim 7, wherein the chamber is formed into a smooth wall surface. The heat pipe structure improvement according to claim 7, wherein the chamber wall surface is provided with a third capillary structure, and the first and second capillary structures are connected to the third capillary structure. The heat pipe structure improvement according to claim 11, wherein the third capillary structure is a sintered powder body, a mesh body and a fiber body, and a groove and a porous structure.