TWI509646B - Laminated metal parts manufacturing apparatus and laminated type electronic parts manufacturing method - Google Patents

Description

Multilayer electronic component manufacturing apparatus and manufacturing method of laminated electronic component

The present invention relates to a laminated electronic component manufacturing apparatus and a method of manufacturing a laminated electronic component for manufacturing a laminated electronic component such as a laminated ceramic capacitor.

A conventional multilayer ceramic capacitor is manufactured by coating a ceramic film on a long film, printing thereon an internal electrode, and then cutting it into a desired size, then peeling off from the film for stacking, and repeating the above The operation forms a laminated body block and then cuts it into a part unit.

On the other hand, Patent Document 1 discloses a method of manufacturing a laminated ceramic electronic component in which a plurality of ceramic green sheets obtained by forming a substrate are laminated to form a laminate. Forming the laminated body block in the unit of the part, thereby forming the laminated ceramic electronic component, and forming at least two of the plurality of ceramic green sheets constituting the same laminated body block The specific region on the substrate is laminated, and the orientation of the in-plane direction of each ceramic green sheet and the position of each ceramic green sheet are substantially identical.

Patent Document 2 discloses a technique in which a first flexible support is circulated, a ceramic coating is applied to one surface of a second flexible support, and the obtained undried ceramic coating layer is transferred. Printing onto the first flexible support, and after transfer, the second flexible support is peeled off from the ceramic coating layer and transferred onto the surface of the ceramic coating layer on the first flexible support The electrodes are printed, and the electrodes are dried, and the steps are repeated on the first flexible support.

Patent Document 3 discloses a technique for a laminated electronic component including a self-supporting green sheet containing a ceramic and an organic binder component and having a specific pattern for forming an internal electrode layer thereon. In the laminated body manufacturing apparatus, a self-supporting green sheet in which a specific pattern is formed in advance is wound around a cylindrical roll and manufactured.

Patent Document 4 discloses a technique including an unwinding supply portion for supplying a green sheet, a laminated reel for winding a green sheet on an outer peripheral surface to form a laminated body, and a rotation angle detecting device. The method is for detecting the rotation angle of the laminated reel; and the internal electrode printing portion is configured to form an internal electrode on the green sheet wound on the laminated reel while winding the blank based on the information of the rotation angle detecting device. This makes it possible to manufacture laminates at high speed.

In the following Patent Document 5, there is disclosed a method for producing a ceramic laminate in which a ring-shaped belt is twisted and twisted on a ring-shaped belt of a polygonal prism, and the ring-shaped belt is oriented in a specific order. The formation of the ceramic green sheet is carried out by the application of the coating roller and the formation of the internal electrode by the transfer device. Moreover, during the movement of the endless belt loop, the fixed region of the endless belt is set in contact with the planar portion of the polygonal prism wheel, and the size of the region in contact with the planar portion is by the punching tip. To take out the ceramic laminate as the target.

Here, as a method of forming a laminate in the process of manufacturing a multilayer ceramic capacitor, generally, a method is employed in which a ceramic coating film is formed on a long film, and an internal electrode is printed thereon and formed. After cutting, the film was peeled off from the film and stacked. In order to achieve small size and high capacitance of the multilayer capacitor, it is necessary to form a ceramic dielectric layer thinner and increase the number of laminated layers. However, it is known that such a treatment may cause a short circuit due to a defect caused by a protrusion on the film. The proportion of poor quality has increased. Therefore, efforts have been made to further smooth the film, but the problem is the deterioration of the operability and the increase in the cost of the film, and the prospect is worrisome.

As a method for solving the above problems, a method of forming a ceramic green sheet by using the same substrate of a flat plate type has been proposed (see Patent Document 1). Since the defective portion is concentrated on one portion of the laminated block by using the same substrate, even if a projection is present on the substrate, the defective wafer due to the influence of the projection can be controlled to a minimum.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-296641

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2002-141245

[Patent Document 3] Japanese Patent Laid-Open Publication No. 2000-306766

[Patent Document 4] Japanese Patent Laid-Open Publication No. 2003-217992

[Patent Document 5] Japanese Patent Laid-Open No. Hei 10-32140

However, in the technique of Patent Document 1, since the green sheet is required to be intermittently formed on the flat plate or the cylindrical substrate, a film thickness unevenness region is formed at the film formation start portion and the end portion, even if it is formed. In the case of laminated bodies, the area where the desired quality is obtained is also narrow, so the problem of yield is large. Furthermore, in the step of laminating the green sheets on the flat plate, intermittent operation is required layer by layer, so that there is a disadvantage that the production speed cannot be improved.

Moreover, as a method of efficiently laminating a ceramic green sheet, the technique of the above Patent Document 2 has been proposed. The ceramic was coated on the long film and transferred to an endless belt to obtain a laminated structure. In this step, since it is not necessary to perform an intermittent operation, the speed can be increased. However, since a long substrate is used, the effect of suppressing the quality defect in the defective portion of the ceramic layer due to the substrate protrusion cannot be expected.

Further, the same invention is also described in the above Patent Document 3. This is a laminated structure formed on a cylindrical reel, and can be laminated at a high speed by continuous operation. However, the green sheet is limited to a self-supporting green sheet having a high strength and a support such as a film. The frequency of occurrence of the intrinsic defect in such a self-supporting green sheet is not clear, but the sheet containing a high degree of polymerization resin and increasing the strength is difficult to degrease in the calcination step, thereby hindering the compactness of the ceramic after calcination. The reason is therefore low in practicality and difficult to use for mass production.

The invention of the above-mentioned Patent Document 4 is formed by continuously laminating a cylinder or a polygonal prism and forming an electrode circuit by an inkjet method. However, in this case, the green sheet needs to be capable of being independently conveyed to a high degree, so that it is formed thin. The subjective method of the laminated structure of the ceramic layer is difficult to put into practical use.

As described in the above Patent Document 5, the method of continuously coating the slurry in a wet state on the dried sheet causes the solvent in the applied slurry to dissolve the next sheet, thereby causing a short circuit or IR. Defective (poor insulation resistance) sheet defects. In particular, the thickness of the sheet of the current multilayer ceramic capacitor is continuously thinned, and the coating of such a method is not suitable.

In the case where the sheet is formed into other separate steps, the storage, storage, storage, and the like which are generated by the step also cost a great deal, so there is a problem that the production period becomes long. Further, since the steps are divided, not only the sheet length required for the laminated block but also the excess sheet such as the conveyance path and the number of laminated ends are required, resulting in material loss. On the other hand, in the case where the sheet is subjected to electrode printing after the sheet is laminated, the sheet erosion caused by the sheet solvent being dissolved by the electrode is not only generated in the sheet in the printing process but also in the lower layer thereof. In the electrode or sheet, a fault such as a short circuit or a poor IR is generated. This situation is the cause of poor quality of the manufactured electronic components.

In view of the above problems, it is an object of the present invention to provide a laminated electronic component manufacturing apparatus and laminated electronic type capable of suppressing generation of quality defects of electronic components and improving manufacturing efficiency (production speed) of laminated electronic components at low cost. How to manufacture parts.

The present invention relates to a device for manufacturing a laminated electronic component, comprising: a film-forming substrate having a continuous annular shape, which is subjected to a mold release treatment on the outer circumference; and a film formation portion for coating the film-forming substrate The ceramic slurry is dried and continuously formed into a ceramic sheet; an electrode circuit forming portion that forms an electrode circuit on the ceramic sheet on the film forming substrate; and a build-up support that is in contact with the ceramic sheet In the film formation substrate, the ceramic sheet is peeled off from the film formation substrate, and the peeled ceramic sheet is wound around the outer circumference to form a laminated structure of the ceramic sheet and the electrode circuit.

According to the present invention, even if a defect such as a projection is present on the film-forming substrate, the defective portion of the ceramic sheet thus produced is concentrated in a limited range of the laminated structure, and therefore, the cut and the divided portion can be obtained. The occurrence of poor quality of electronic parts is suppressed to a low degree.

Further, since the ceramic sheet is continuously formed on the film formation substrate, the stable region of the film thickness is expanded as compared with the intermittent coating, and the number of the multilayer structure which can be obtained from the laminated body can be increased.

The step of forming a ceramic sheet on the film-forming substrate by continuous operation and the step of forming a laminated body of the ceramic sheet on the build-up support, because the ceramic sheet can be formed with high productivity in a shorter time. The laminated structure.

Moreover, since it is not necessary to use a long film substrate as before, the intermediate material cost can be suppressed.

In the above-described manner, the occurrence of quality defects in the electronic component can be suppressed, and the operation can be continuously performed at low cost and non-intermittently, thereby improving the manufacturing efficiency (production speed) of the laminated electronic component.

Further, the present invention provides a laminated electronic component manufacturing apparatus characterized by comprising: a continuous film-forming substrate having a continuous shape, which is subjected to a mold release treatment on the outer circumference; and a film formation portion which is a film-forming substrate The ceramic slurry is coated and dried to continuously form a ceramic sheet; an electrode circuit forming portion for forming an electrode circuit for the ceramic sheet; and a build-up support for forming the ceramic by winding the ceramic sheet around the outer circumference a laminated structure of the sheet and the electrode circuit; and a conveying member that is formed to be in contact with the film forming substrate and the build-up support via the ceramic sheet, and is formed on the film forming substrate from the film forming substrate The ceramic piece on the material is conveyed to the laminated support by the received ceramic piece.

According to the invention, the ceramic sheet formed on the film-forming substrate is temporarily received by the conveying member. Thereafter, the ceramic sheet is transferred from the conveying member to the buildup support. Thereby, the peeling of the ceramic sheet from the film formation substrate is not affected by the state of the buildup support side, so that stable operation can be performed. Specifically, when the laminated structure of the ceramic sheet is continuously formed on the laminated support, the size of the laminated support is continuously increased, and when the electrode circuit is formed, the portion of the laminated support is uneven. Although the state of the shape changes, the film-forming substrate and the build-up support member can be inserted into the transfer member to avoid direct contact between the film-forming substrate and the build-up support. Further, the positional relationship between the build-up support and the transfer member, the pressure, and the like can be appropriately adjusted in accordance with the state change of the build-up support. Thereby, the quality of the laminated structure of the ceramic sheet formed on the build-up support can be prevented from deteriorating due to the state change of the build-up support. Further, by designing the build-up support to be in direct contact with the film-forming substrate, the state of the build-up support can be prevented from being changed, and the quality of the ceramic sheet or the electronic component formed on the film-forming substrate can be deteriorated.

Further, since it is not necessary to increase the size of the single film formation substrate, and the path for moving the ceramic sheet before the conveyance of the buildup support can be extended, the drying time of the ceramic sheet can be extended. Further, since the ceramic slurry is continuously applied to the film formation substrate, the production speed (manufacturing efficiency) of the ceramic sheet can be increased, and the manufacturing efficiency of the laminated body of the ceramic sheet can be improved, and the manufacture of the electronic component can be improved. effectiveness.

Further, it is preferable that the electrode circuit is formed on the ceramic sheet before being wound around the buildup support by the electrode circuit forming portion. Thereby, an electrode circuit is formed on the ceramic sheet before the ceramic sheet is laminated on the buildup support. If an electrode circuit is formed on the ceramic sheet after the ceramic sheet is laminated on the build-up support, the electrode circuit formed on the lower ceramic sheet or the ceramic sheet on which the electrode circuit has been formed in the lower layer may be eroded by the electrode solvent. According to the present invention, if an electrode circuit is formed in a state of a single-layer ceramic sheet, the influence of sheet erosion can be controlled to a minimum of only a single layer, thereby reducing short circuit or IR failure (insulation resistance). malfunction.

In the invention, it is preferable that the electrode circuit forming portion forms the electrode circuit on the ceramic piece on the conveying member.

Thereby, the electrode circuit is formed on the ceramic piece on the conveying member by the electrode circuit forming portion. Thereby, since the electrode circuit is formed on the dried ceramic sheet on the film formation substrate, the positional accuracy of the formation position of the electrode circuit can be further improved.

Further, a laminated electronic component manufacturing apparatus comprising: a film-forming substrate having a continuous annular shape, wherein a mold release process is performed on an outer circumference; and an electrode circuit forming portion for forming an electrode on the film formation substrate a film formation portion that applies a ceramic slurry to a film formation substrate on which the electrode circuit is formed and dried, continuously forms a ceramic sheet with the electrode circuit; and a build-up support, which is a spacer The ceramic sheet with the electrode circuit is in contact with the film formation substrate, and the ceramic sheet with the electrode circuit is peeled off from the film formation substrate, and the ceramic sheet with the electrode circuit is peeled off The laminated body is formed by winding the outer circumference to form the laminated body of the ceramic sheet and the electrode circuit.

Further, a laminated electronic component manufacturing apparatus comprising: a film-forming substrate having a continuous annular shape, wherein a mold release process is performed on an outer circumference; and an electrode circuit forming portion for forming an electrode on the film formation substrate a film forming portion that applies a ceramic slurry to a film-forming substrate on which the electrode circuit is formed and dried, and continuously forms a ceramic sheet with the electrode circuit; a build-up support by a ceramic structure in which the ceramic sheet of the electrode circuit is wound around the outer periphery to form the ceramic sheet and the electrode circuit, and a transfer member that is provided to be in contact with the ceramic sheet with the electrode circuit a film-forming substrate and the build-up support, and receiving, from the film-forming substrate, the ceramic sheet having the electrode circuit formed on the film-forming substrate, and receiving the ceramic having the electrode circuit The sheet is transferred to the above laminated support.

The present invention is characterized in that the electrode circuit forming portion is a plateless printing device that performs electrode printing on the ceramic sheet.

Accordingly, electrode circuits of different patterns can be formed on each of the ceramic sheets. Further, even if the ceramic sheet is laminated on the build-up support, the expansion or contraction of the ceramic sheet or the size of the build-up support is changed, and the distance between the electrode circuits can be adjusted to form an electrode circuit without displacement.

Further, as the plateless printing device, it is preferable to comprise an inkjet printing device and an ink drying and curing device.

The present invention is characterized in that the outer circumference of the film formation substrate is the same length as the outer circumference of the laminate support, or one of the outer circumference of the film formation substrate or the outer circumference of the laminate support is another outer circumference. An integer multiple of an outer perimeter.

Thereby, the defective portion of the ceramic sheet which is caused by the presence of a defect such as a projection on the film-forming substrate can be concentrated in a specific region of the laminated structure. Specifically, the defective portions generated in the laminated structure of the ceramic sheets on the build-up support can be concentrated on the same circumferential orbit of the laminated structure (the same row on the laminated structure when the ceramic sheets are viewed from the transport direction). Further, when the outer circumference of the laminated support is longer than the outer circumference of the film formation substrate, the defective portion generated in the laminated structure of the ceramic sheet on the laminated support can be concentrated on the same coordinate of the laminated structure. Upper (the same column and row on the laminated structure when the ceramic sheets are observed from the conveying direction).

According to the present invention, when the ceramic sheet is wound around the outer periphery of the buildup support to form a laminated structure of the ceramic sheet, a new ceramic sheet is continuously formed on the film formation substrate.

Thereby, the laminated structure of the ceramic sheet can be formed by continuous operation instead of intermittent operation, and therefore, the laminated structure of the ceramic sheet can be formed in a very short time. As a result, the manufacturing efficiency of the laminated structure of the ceramic sheet can be improved.

The present invention relates to a method of producing a laminated electronic component, comprising: a film forming step of coating a film of a film-forming substrate having a ring-shaped continuous shape which is subjected to a release treatment on a peripheral surface by a film forming portion. And drying the slurry to form a ceramic sheet continuously; an electrode circuit forming step of forming an electrode circuit on the ceramic sheet on the film formation substrate by an electrode circuit forming portion; and a step of forming a laminated structure The ceramic sheet is peeled from the film formation substrate by interposing the build-up support layer on the film formation substrate, and the peeled ceramic sheet is wound around the outer layer of the buildup support body. This forms a laminated structure of the above ceramic sheet and the above electrode circuit.

The present invention relates to a method of producing a laminated electronic component, comprising: a film forming step of coating a film of a film-forming substrate having a ring-shaped continuous shape which is subjected to a release treatment on a peripheral surface by a film forming portion. And drying the slurry to form a ceramic sheet continuously; an electrode circuit forming step of forming an electrode circuit on the ceramic sheet by the electrode circuit forming portion; and a laminated structure forming step of winding the ceramic sheet a laminated structure in which the ceramic sheet and the electrode circuit are formed on the outer periphery of the build-up support; and a transfer step performed after the film formation step and before the laminated structure forming step, and the transfer member is formed from the film formation step The substrate receives the ceramic sheet formed on the film formation substrate, and the received ceramic sheet is transferred to the buildup support by the transfer member.

In the electrode circuit forming step, it is preferable that the electrode piece is formed on the ceramic piece on the transfer member.

The present invention relates to a method of manufacturing a laminated electronic component, comprising: an electrode circuit forming step of forming an electrode on a film-formed substrate having a ring-shaped continuous shape which is subjected to a mold release treatment on an outer circumference by an electrode circuit forming portion. a film formation step of applying a ceramic slurry to a film formation substrate on which the electrode circuit is formed by a film formation portion, and drying the ceramic sheet to which the electrode circuit is attached; and laminating a structure forming step of peeling the ceramic sheet to which the electrode circuit is attached from the film formation substrate by contacting the ceramic sheet with the electrode circuit interposed therebetween with the build-up support body to the film formation substrate And the laminated body of the ceramic piece and the electrode circuit is formed by winding the peeled ceramic sheet with the electrode circuit around the outer periphery of the buildup support.

The present invention relates to a method of manufacturing a laminated electronic component, comprising: an electrode circuit forming step of forming an electrode on a film-formed substrate having a ring-shaped continuous shape which is subjected to a mold release treatment on an outer circumference by an electrode circuit forming portion. a film formation step of applying a ceramic slurry to a film formation substrate on which the electrode circuit is formed by a film formation portion and drying the film, and continuously forming a ceramic sheet having the electrode circuit; a body forming step of forming the laminated body of the ceramic sheet and the electrode circuit by winding the ceramic sheet having the electrode circuit around the laminated support, and a transporting step of the above After the film formation step and before the laminated structure forming step, the transfer member receives the ceramic sheet with the electrode circuit formed on the film formation substrate from the film formation substrate, and the transfer member is The ceramic piece with the electrode circuit received is transferred to the laminated support.

In the above case, it is preferable to use a plateless printing apparatus that performs electrode printing on the ceramic sheet as the electrode circuit forming portion.

As the above-mentioned plateless printing device, an inkjet printing device and an ink drying and curing device are preferably used.

In the laminated structure forming step, when the ceramic sheet is wound around the outer periphery of the buildup support to form the laminated body of the ceramic sheet and the electrode circuit, the film formation step is preferably performed on the film formation substrate. A new ceramic piece as described above is continuously formed.

According to the present invention, it is possible to improve the manufacturing efficiency (manufacturing speed) of the laminated electronic component by suppressing the occurrence of poor quality of the electronic component and operating at low cost and continuously without intermittent operation.

A method of manufacturing a laminated electronic component manufacturing apparatus and a laminated electronic component according to the first embodiment of the present invention will be described with reference to the drawings. Further, the "layered electronic component" which is a target of the present invention includes a laminated electronic component such as a laminated ceramic capacitor or a laminated ceramic inductor. Hereinafter, a multilayer ceramic capacitor will be described as an example of a laminated electronic component.

First, a laminated electronic component manufacturing apparatus will be described.

As shown in FIG. 1, the laminated electronic component manufacturing apparatus 10 mainly includes a coating roll 12 (film forming substrate) on which a mold release process is performed on a surface (outer peripheral surface) to form a ceramic sheet S, and a winding from a coating roll. The ceramic sheet S is peeled off to form the laminated rolls 14 and 15 (layered support) of the laminated structure S' of the ceramic sheet S.

A film forming mechanism 16 (film forming portion) for applying a ceramic slurry as a material of the ceramic sheet S to the surface of the coating roller 12 is disposed around the coating roller 12 to supply the film forming mechanism 16 a liquid supply mechanism 18 for ceramic slurry; a drying and curing device 20 for drying and solidifying the ceramic slurry on the surface of the coating roller 12 for winding (stacking) on the outer peripheral surface of the lamination rolls 14, 15 On the ceramic sheet S, an electrode circuit forming mechanism 22 (electrode circuit forming portion) of the electrode circuit 24 (see FIG. 2), a drying and curing device 26 for drying the electrode circuit 24, and the above-described laminating rolls 14, 15 are formed.

The laminated electronic component manufacturing apparatus 10 of the present embodiment is characterized in that the electrode circuit 24 is formed on the ceramic sheet S before being wound around the outer peripheral surfaces of the laminating rolls 14, 15, and thereafter, the ceramic in which the electrode circuit 24 is formed is formed. The sheet S is wound (laminated) on the outer peripheral surfaces of the laminating rolls 14 and 15, and a laminated structure S' of the ceramic sheets S is formed.

Further, on the downstream side of the coating roller 16 in the rotation direction of the coating roller (between the film forming mechanism 16 and the electrode circuit forming mechanism 22), the ceramic slurry on the surface of the coating roller 12 is disposed to be dried and solidified. The curing device 20 is dried. Further, on the downstream side of the coating roller rotation direction of the electrode circuit forming mechanism 22 (between the electrode circuit forming mechanism 22 and the lamination roller 14), a drying and curing device 26 for drying the electrode circuit 24 is disposed.

Specifically, the coating roll 12 is a rigid body roll (cylindrical or cylindrical) such as a metal which is subjected to a release treatment on the surface, and includes a ring-shaped continuous substrate. The coating roller 12 is configured to be rotationally driven by a driving source (not shown). In addition, the mold release treatment means, for example, a plating fluorine treatment or the like.

The laminating rolls 14 and 15 are formed by adhering an elastic body (for example, a resin film, an elastic film, a rubber, a viscous sheet, or the like) to the peripheral surface of the detachable metal cylindrical jig. The cylinder jig is mounted on a rotating shaft and rotated in synchronization with the coating roller 12. Further, the laminating rolls 14 and 15 may be configured to be rotationally driven by a driving source (not shown), or may be configured to be rotated by the rotational force of the coating roller 12. The laminating rolls 14 and 15 press the coating roll 12 at a specific pressure (pressing force) by a pressing mechanism (not shown). The laminating rolls 14 and 15 can pressurize any one of the laminating rolls 14 or the laminating rolls 15 to the coating roll 12 by a switching mechanism (not shown).

The surface of the elastomer of the laminating roller 14 holds the ceramic sheet S by a mechanism such as adhesion or electrostatic adsorption. Further, the ceramic sheet S wound by the laminating rolls 14 is formed by pressing the laminated sheets to each other. Since the holding force is set to be larger than the force by which the coating roller 12 holds the ceramic sheet S, the ceramic sheet S is peeled off from the coating roller 12 and transferred onto the laminating roller 14. The laminating rolls 15 are also the same.

In order to reliably transfer the ceramic sheet S from the coating roller 12 to the laminating roller 14, it is preferable to carry out the transfer while appropriately pressing the laminating roller onto the coating roller 12. If there is a space between the application roller 12 and the laminating roller 14, a section in which the ceramic sheet S during the conveyance is not supported by the other members is formed, and there is a possibility that the sheet is broken in the section. Therefore, the laminating roller 14 is appropriately pressed to the coating roller 12 so as not to form an unsupported section of the ceramic sheet S. The surface of the laminating roller 14 is elastic so that no mechanical twist is generated upon extrusion.

Here, it is preferable that the outer circumference of the coating roller 12 is the same length as the outer circumference of the laminating rolls 14, 15, or one outer circumference of the outer circumference of the coating roll 12 or the outer circumference of the lamination rolls 14, 15. It is an integer multiple of another outer perimeter.

As the film forming mechanism 16, for example, an extrusion coating method such as a slit coater or a doctor blade, a roll coater, an ink jet type coater or the like can be used. The extrusion coating method refers to a method of applying a coating liquid from a lip extrusion coating. Further, in order to make the film thickness of the ceramic sheet S formed on the outer peripheral surface of the coating roll 12 thinner, it is preferable to provide an upstream pressure reducing mechanism in the slit coater. The coating slurry 12 is continuously (non-intermittently) coated with the ceramic slurry by the film forming mechanism 16 to form a ceramic sheet S. In this way, the same coating roll 12 is continuously supplied with the ceramic slurry.

As the liquid supply mechanism 18, for example, a gear pump is used. Further, the liquid supply mechanism 18 is not limited to the gear pump, and a cylinder type dispenser, a diaphragm pump, or the like may be suitably employed.

As the electrode circuit forming mechanism 22, for example, an inkjet printing device can be employed. The electrode circuit forming mechanism 22 is preferably a plateless printing mechanism, but may transfer the dried electrode circuit 24, such as gravure printing or gravure offset printing. Further, the electrode material ink used in the electrode circuit forming mechanism 22 is, for example, a method in which Ni powder (nickel powder) and a resin are dissolved and dispersed in an organic solvent. It is also possible to disperse the Ni powder in a UV (Ultraviolet) curable resin. In particular, for the ceramic coating film, it is preferred to use a solvent having low swelling property. Further, the solvent may be a water system.

As the drying and curing apparatuses 20 and 26, for example, a method of drying by hot air or a method of heating the outer peripheral surface of the coating roll 12 is employed. When an ultraviolet curable resin is used, the ultraviolet curable resin may be cured by irradiation with ultraviolet rays. The drying and curing devices 20, 26 are used to dry or cure the applied ceramic paste or electrode material ink. Further, a vacuum drying mechanism may be used in the drying and curing device 20 for drying the ceramic slurry on the coating roller 12.

As the ceramic slurry, for example, a ceramic powder and a resin are dissolved and dispersed in an organic solvent. It is also possible to use a ceramic powder dispersed in an ultraviolet curable resin. Further, the solvent may be a water system.

Next, a method of manufacturing the laminated structure S' of the ceramic sheet S using the laminated electronic component manufacturing apparatus 10 will be described.

The coating roller 12 subjected to the release treatment is rotated at a specific speed, and the outer peripheral surface thereof is coated with a ceramic slurry by the film forming mechanism 16. Further, the supply of the ceramic slurry is performed using a gear pump as the liquid supply mechanism 18. Then, the ceramic slurry is dried and solidified on the coating roll 12 using the drying and curing device 20. Here, the drying and curing device 20 uses a hot air of a specific temperature for drying the ceramic slurry. Further, the temperature is adjusted by heating or cooling using a temperature regulator so that the temperature of the outer peripheral surface of the coating roller 12 reaches a reasonable temperature. Further, the temperatures are appropriately adjusted in accordance with the material of the ceramic sheet S. In this manner, the coating roll 12 is continuously supplied with the ceramic slurry by the film forming mechanism 16 and the liquid supply mechanism 18, whereby the ceramic sheet S is continuously formed. The ceramic sheet S of the unprinted electrode circuit 24 is wound around a specific layer by the laminating roller 14, and a layer portion other than the laminated structure S' is formed.

Next, the electrode material forming mechanism 22 applies an electrode material ink to the ceramic sheet S on the coating roller 12, and prints an electrode circuit (internal electrode circuit) 24 of a specific pattern pattern. After the electrode circuit 24 is printed, the warm air of a specific temperature is sprayed by the drying and curing device 26 to dry the electrode circuit 24. Here, the electrode circuit is formed by performing electrode printing by changing the pattern pattern so that the electrode circuit 24 becomes a counter electrode in each layer (per week) when winding is performed on the outer peripheral surfaces of the laminating rolls 14, 15. In this way, the electrode sheet 24 is formed on the ceramic sheet S on the coating roller 12.

Then, the laminating roller 14 is press-contacted to the coating roller 12 via the ceramic sheet S with a specific pressing force. Further, the above-described pressing force must be appropriately adjusted in accordance with the material of the ceramic sheet S. Then, the dried ceramic sheet S (formed electrode circuit) formed on the outer peripheral surface of the coating roll 12 is peeled off from the outer peripheral surface of the coating roll 12, and then transferred and wound around the outer peripheral surface of the laminating roll 14. on. Here, since the outer peripheral surface of the coating roller 12 is subjected to a mold release treatment, and the laminating roller 14 is in contact with the coating roller 12 with a specific pressing force, the ceramic sheet S is formed on the outer circumference of the coating roller 12. The dried ceramic sheet S is easily peeled off from the outer peripheral surface of the coating roll 12 and transferred to the outer peripheral surface of the laminating roll 14. The laminating roller 14 is wound with an elastic resin film on the outer peripheral surface of a cylindrical jig made of metal, and is temperature-adjusted so that the temperature of the outer peripheral surface thereof reaches a specific temperature. Further, the temperature of the outer peripheral surface must be appropriately adjusted in accordance with the material of the ceramic sheet S.

After the ceramic sheet S is wound around the specific layer by the laminating roller 14, the electrode circuit forming mechanism 22 stops the printing of the electrode circuit 24. Then, the ceramic sheet S of the unprinted electrode circuit 24 is wound around a specific layer on the laminating roller 14 to form a layer portion other than the laminated structure S'. Thereafter, the supply of the ceramic slurry to the coating roller 12 is stopped, the formation of the laminated structure S' of the ceramic sheet S is completed, or the laminating roller 15 is brought into pressure contact with the outer peripheral surface of the coating roller 12 by a switching mechanism. The ceramic sheet S (the ceramic sheet S after the electrode circuit 24 is formed) is wound around the outer circumferential surface of the laminating roller 15 instead of the press contact of the laminating rolls 14. In this way, the laminated structure S' of the ceramic sheet S is formed.

Further, the laminated structure S' of the ceramic sheet S formed on the laminating rolls 14 is removed together with the cylindrical jig, held in a cylindrical shape, pressed and pressed, and cut into pieces by cutting by a cutter. . Thereafter, firing is performed to form an electrode circuit (external electrode circuit) or the like, and a multilayer ceramic capacitor is produced through a usual manufacturing process.

According to the manufacturing method of the laminated electronic component manufacturing apparatus and the laminated electronic component of the first embodiment, when there are minute scratches or protrusions on the outer circumferential surface of the coating roller 12, the ceramic sheet S after coating is repeated. Although the defective portion 28 is produced, the defective portion 28 can be concentrated in a limited region by repeatedly applying the same coating roller 12 to the laminated structure S' which is wound around the laminated roller 14 in a cylindrical shape. In the electronic component obtained by cutting and dividing the laminated structure S' of the ceramic sheet S obtained in this manner, occurrence of quality defects can be suppressed.

Moreover, when the ceramic sheet S is peeled off from the coating roll 12 and wound around the outer peripheral surface of the lamination roll 14, and the laminated structure S' of the ceramic sheet S is formed, a new ceramic sheet S continues to be formed on the coating roll 12. Therefore, the ceramic sheet S is formed on the coating roller 12, and the laminated structure S' in which the ceramic sheet S is formed on the laminating roller 14 is simultaneously performed. Thereby, the ceramic sheet S can be continuously formed without suspending the rotational driving of the coating roller 12, and the laminated structure S' of the ceramic sheet S can be continuously produced without suspending the rotational driving of the laminating roller 14. Thereby, the laminated structure S' of the ceramic sheet S can be formed by continuous operation instead of intermittent operation. As a result, the laminated structure S' of the ceramic sheet S can be formed in a very short period of time, and the manufacturing efficiency of the laminated structure S' of the ceramic sheet S can be improved.

Further, the ceramic sheet S is formed on the application roller 12 as a rigid body, and is conveyed while the sheet is being conveyed by the application conveyance roller 12 or the transfer roller 14 from the sheet forming process to the sheet laminating step. Even if a thin and low-strength ceramic sheet S is used, the occurrence of breakage or scratching of the ceramic sheet S can be suppressed. As a result, the operability of the thin and low-strength ceramic sheet S can be improved.

Further, as shown in FIG. 1, the circumference of the coating roller 12 and the laminating roller 14 may be the same, or one of the outer circumferences may be an integer ratio of the other outer circumference, as shown in FIG. The defect portion 28 is further concentrated on a specific portion. When the outer circumference is not in an integer ratio, the defective portion 28 generated in the laminated structure S' of the ceramic sheet S on the laminating roller 14 will be concentrated on the same circumferential orbit of the laminating roller 14 (the ceramic is observed in the conveying direction) The same line of the sliced layer structure). Further, when the outer circumference of the laminating roller 14 is longer than the outer circumference of the coating roller 12, the defective portion 28 generated in the laminated structure S' of the ceramic sheet S on the laminating roller 14 can be concentrated on The same row of the laminating rolls 14 (the same row and row on the laminated structure when the ceramic sheets are observed in the conveying direction).

Moreover, the uniformity of the film thickness of the ceramic sheet S and the high productivity can be obtained as compared with the method of intermittent coating using a known ceramic slurry. In other words, since the laminated structure S' of the ceramic sheet S is continuously formed into a cylindrical shape, the stable region of the film thickness is wider than that of the intermittent coating. As a result, an electronic component of stable quality can be obtained from the laminated structure S' of the ceramic sheet S. The number of electronic parts available per unit volume of the laminated structure of the ceramic sheet S is increased.

Further, in the present embodiment, it is not necessary to use an intermediate-consumption material of a disposable substrate (such as a PET film), so that the cost of the intermediate material including storage, transportation, and the like can be reduced, so that the laminated structure S of the ceramic sheet S can be greatly reduced. 'The manufacturing cost, which in turn significantly reduces the manufacturing costs of electronic components.

Further, in the present embodiment, it is only necessary to form the ceramic sheet S of a desired amount by connecting the film forming step, the printing step or the laminating step, and there is no loss or generation of the number of laminated ends in the transport path of the previous layer. Therefore, material loss can be reduced.

Further, in the present embodiment, the electrode circuit 24 is formed before the ceramic sheet S is laminated on the outer peripheral surface of the laminating roller 14. Therefore, in other words, after the electrode circuit 24 is formed on the ceramic sheet S, the ceramic sheet S on which the electrode circuit 24 has been formed is formed. The outer peripheral surface of the lamination roll 14 is wound and laminated. If the electrode sheet 24 is formed on the ceramic sheet S after the ceramic sheet S is laminated on the outer peripheral surface of the stacking roll 14, the electrode circuit 24 formed on the lower layer ceramic sheet S, or the underlying ceramic sheet S on which the electrode circuit has been formed Sheet erosion occurs due to electrode solvent. According to the present invention, if an electrode circuit is formed in a state of a single-layer ceramic sheet, the influence of sheet erosion can be suppressed to a minimum of a single layer, thereby reducing short-circuit or IR failure (insulation resistance). malfunction.

In particular, the formation of the ceramic sheet S and the formation of the electrode circuit 24 are simultaneously performed on the coating roller 12, so that the entire apparatus can be made simple and compact, thereby reducing the price of the apparatus and reducing the area, and the apparatus can be improved. reliability.

Further, since the ceramic slurry is dried on the coating roller 12, the ceramic sheet S is laminated on the additional laminating roller 14, so that the ceramic slurry is not applied to the dried ceramic sheet S, so that it does not Produces sheet erosion caused by redissolution.

Further, the electrode circuit 24 can be formed by a plateless printing method such as inkjet, and the electrode circuit 24 having a different electrode pattern can be formed in each of the ceramic sheets S. In particular, even if the ceramic sheet S is deformed or the outer diameter of the laminating roller 14 is increased, the circumferential length is increased, and the pattern or formation position of the electrode circuit 24 can be freely changed, so that it can be appropriately adjusted. The electrode circuits 24 are spaced apart (interval) to form an electrode circuit 24 without misalignment.

In the first embodiment, the application roller 12 corresponds to the "film formation substrate" of the present invention, and the lamination rolls 14 and 15 correspond to the "layered support" of the present invention.

Next, a method of manufacturing a laminated electronic component manufacturing apparatus and a laminated electronic component according to a second embodiment of the present invention will be described with reference to the drawings. Incidentally, the same components as those in the first embodiment are denoted by the same reference numerals, and the description of the overlapping configuration and the effect of the operation will be omitted.

As shown in FIG. 3, in the second embodiment, the printing conveyance roller (transport member) 30 is in contact with the coating roller 12 via the ceramic sheet S. Further, the intermediate transfer roller (transport member) 32 is in contact with the printing conveyance roller 30 via the ceramic sheet S. The two lamination rollers 14 or the laminating roller 15 are in contact with the intermediate conveyance roller 32 via the ceramic sheet S. The pressure rolls 34 and 36 are in contact with the two lamination rolls 14 or the lamination rolls 15 via the ceramic sheets S, respectively. As described above, the printing conveyance roller 30 and the intermediate conveyance roller 32 are inserted between the application roller 12 and each of the lamination rollers 14 and 15. Therefore, the coating roller 12 is in indirect contact with each of the laminating rolls 14, 15 (a state in which power can be mechanically transmitted).

Further, around the coating roller 12, a film forming mechanism 16 (film forming portion) for applying a ceramic slurry as a material of the ceramic sheet S to the surface of the coating roller 12 is disposed; a liquid supply mechanism 18, which is used to supply the ceramic slurry to the film forming mechanism 16; and a drying and curing device 20 which is located on the downstream side of the coating roller 16 in the rotation direction of the coating roller 16 and is used to make the surface of the coating roller 12 The ceramic slurry is dried and cured. An electrode circuit forming mechanism 22 (electrode circuit forming portion) for forming the electrode circuit 24 on the ceramic sheet S before being wound (laminated) on the outer peripheral surface of the lamination rolls 14 and 15 is disposed around the printing conveyance roller 30, The drying and curing device 26 for drying the electrode circuit 24 on the downstream side of the first supply roller in the rotation direction of the electrode circuit forming mechanism 22, and the intermediate transfer roller 32.

Here, the printing conveyance roller 30 and the intermediate conveyance roller 32 have a function of receiving the ceramic sheet S from the previous step by a method such as adhesion, and supplying the received ceramic sheet S to the subsequent step. The printing conveyance roller 30 and the intermediate conveyance roller 32 are suitably selected as a rigid body roll of metal or resin, or a roll coated with a resin on the surface.

Since the force of the printing conveyance roller 30 to hold the ceramic sheet S is set to be larger than the force of the coating roller 12 to hold the ceramic sheet S, and further set to be smaller than the force of the intermediate conveyance roller 32 to hold the ceramic sheet S, the ceramic sheet S is self-coated roller. After the peeling 12 is carried out by the printing conveyance roller 30, it is transferred to the intermediate conveyance roller 32. Since the force by which the intermediate transfer roller 32 holds the ceramic sheet S is set to be smaller than the force by which the laminated roller 14 holds the ceramic sheet S, the ceramic sheet S is peeled off from the intermediate transfer roller 32 and then transferred to the laminating roller 14. The surface of the elastic body of the laminating roller 14 holds the ceramic sheet S by adhesion or electrostatic adsorption. Further, the ceramic sheet S wound by the laminating rolls 14 presses the laminated sheets to each other and holds them together. Since the holding force is set to be larger than the force by which the intermediate transfer roller 32 holds the ceramic sheet S, the ceramic sheet S is peeled off from the intermediate transfer roller 32 and transferred to the laminating roller 14.

Specifically, the printing conveyance roller 30 has a function of peeling the ceramic sheet S from the application roller 12 and transferring it to the intermediate conveyance roller 32. Further, the intermediate transfer roller 32 has a function of peeling the ceramic sheet S from the transfer conveyance roller 30 and transferring it to the laminating roller 14. The printing conveyance roller 30 and the intermediate conveyance roller 32 may be a peeling conveyance roller which adsorbs (sucks or electrostatically adsorbs) the ceramic sheet S and performs peeling conveyance. At this time, it is preferable that the printing conveyance roller 30 and the intermediate conveyance roller 32 are configured to control a portion where the ceramic sheet S is adsorbed and a portion where the ceramic sheet S is not adsorbed. When the ceramic sheet S is received from the coating roller 12, the specific portion of the printing conveyance roller 30 that is in contact with the ceramic sheet S has an adsorption function, and when the received ceramic sheet S is transferred to the intermediate conveyance roller 32, the ceramic sheet is used. The specific portion of the printing conveyance roller 30 that is in contact with S has a non-adsorption region, whereby the ceramic sheet S can be smoothly received and transferred. The intermediate transfer roller 32 is also the same in the above-described adsorption function and non-adsorption region. In other words, when the ceramic sheet S is received from the printing conveyance roller 30, the specific portion of the intermediate conveyance roller 32 that is in contact with the ceramic sheet S has an adsorption function, and when the received ceramic sheet S is transferred to the laminating roller 14, The specific portion of the intermediate transfer roller 32 in contact with the ceramic sheet S has a non-adsorption region, whereby the ceramic sheet S can be smoothly received and transferred.

In the second embodiment, the ceramic slurry is supplied to the outer peripheral surface of the coating roller 12 by the film forming mechanism 16 and the liquid supply mechanism 18. Then, the ceramic slurry is dried and solidified by drying the curing device 20 on the coating roller 12. The ceramic sheet S is formed in this manner. Further, the ceramic sheet S moved from the coating roller 12 to the printing conveyance roller 30 is coated with the electrode material ink from the electrode circuit forming mechanism 22 (for example, inkjet printing), and the electrode circuit 24 of the specific pattern pattern is printed. After the printing of the electrode circuit 24, the ceramic sheet S on the printing conveyance roller 30 is sprayed with a warm air of a specific temperature from the drying and curing device 26, and the electrode circuit 24 is dried. In this way, the ceramic piece S on the printing conveyance roller 30 forms the electrode circuit 24. Thereafter, the ceramic sheet S on which the electrode circuit 24 is formed is received by the intermediate transfer roller 32, and wound around the outer peripheral surface of the stacking roll 14 to be laminated. Thereby, the laminated structure S' of the ceramic sheet S is formed. As described above, even in the second embodiment, after the electrode circuit 24 is formed on the ceramic sheet S, the ceramic sheet S on which the electrode circuit 24 has been formed is wound around the outer peripheral surface of the stacking roll 14 to be laminated. The outer circumferential surfaces of the coating roller 12, the printing conveyance roller 30, and the laminating roller 14 are temperature-adjusted by a temperature adjuster so as to reach an appropriate temperature.

According to the second embodiment, the peeling of the ceramic sheet S from the coating roller 12 is not affected by the state of the laminating roller 14 side, so that stable operation can be performed. Specifically, when the laminated body 14 continuously forms the laminated structure S' of the ceramic sheet S, the size (outer diameter) of the laminated roll 14 including the ceramic piece is continuously increased, and the electrode circuit 24 is generated. The position changes in the shape such as unevenness. However, by inserting the printing conveyance roller 30 and the intermediate conveyance roller 32 between the application roller 12 and the laminating roller 14, the state of the laminating roller 14 is changed in accordance with the state change, and the laminating roller 14 and the printing conveyance are appropriately adjusted. The positional relationship, pressure, and the like of the roller 30 and the intermediate transfer roller 32. Thereby, the quality of the laminated structure S' of the ceramic sheet S formed on the lamination roll 14 can be prevented from deteriorating due to a change in the state of the laminating rolls 14. Further, by designing the laminating roller 14 not to be in direct contact with the coating roller 12, the laminating roller 14 is prevented from being scratched by the state of itself, and the ceramic sheet S formed on the coating roller 12 is scratched. It can prevent deterioration of the quality of the ceramic sheet S or even the electronic parts.

Further, by providing the printing conveyance roller 30 and the intermediate conveyance roller 32, the application roller 12 can be prevented from being increased in size, and the path in which the ceramic sheet S moves can be lengthened before being supplied to the laminating roller 14, so that the ceramic sheet S can be extended. And the drying time of the electrode circuit 24. Further, since the ceramic slurry is continuously applied to the coating roller 12, the moving step of the ceramic sheet S from the coating roller 12 to the laminating roller 14 via the printing conveyance roller 30 and the intermediate conveyance roller 32 can be continuously performed. . As a result, the production line speed of the apparatus can be increased, and the manufacturing speed (manufacturing efficiency) of the ceramic sheet S can be improved, so that the manufacturing efficiency of the laminated structure S' of the ceramic sheet S or even the electronic parts can be improved.

Further, the ceramic piece S on the printing conveyance roller 30 forms the electrode circuit 24. Thereby, the electrode circuit 24 is formed on the ceramic sheet S which is reliably dried on the coating roller 12, so that the positional accuracy of the formation position of the electrode circuit 24 can be further improved. On the other hand, when the electrode circuit 24 is formed in the semi-dried ceramic sheet S, the ceramic sheet S which is the underlayer is deformed or the like, and the position of the electrode circuit 24 formed thereon is also displaced. In order to solve the above problem, in the second embodiment, the electrode circuit 24 is formed on the ceramic sheet S which is reliably dried on the coating roller 12.

In the second embodiment, the application roller 12 corresponds to the "film formation substrate" of the present invention, and the lamination rolls 14 and 15 correspond to the "layered support" of the present invention. Further, the printing conveyance roller 30 and the intermediate conveyance roller 32 correspond to the "transport member" of the present invention.

Next, a method of manufacturing a laminated electronic component manufacturing apparatus and a laminated electronic component according to a third embodiment of the present invention will be described with reference to the drawings. Incidentally, the same components as those of the above-described embodiments are denoted by the same reference numerals, and the description of the overlapping configuration and the effect of the operation will be omitted.

As shown in FIG. 4, in the third embodiment, the electrode circuit 24 is formed on the ceramic sheet S on the endless belt (transport member) 38. That is, the intermediate transfer roller (transport member) 40 is in contact with the coating roller 12 via the ceramic sheet S. Further, the endless belt 38 is in contact with the intermediate transfer roller 40 via the ceramic sheet S. Further, the intermediate transfer roller (transport member) 42 is in contact with the annular transfer belt 38 via the ceramic sheet S. The two lamination rollers 14 or the laminating roller 15 are in contact with the intermediate transfer roller 42 via the ceramic sheet S. The pressure rolls 34 and 36 are in contact with the two lamination rolls 14 or the lamination rolls 15 via the ceramic sheets S, respectively. In this manner, the intermediate transfer roller 40, the endless conveyance belt 38, and the intermediate conveyance roller 42 are interposed between the application roller 12 and each of the lamination rollers 14 and 15. Therefore, the application roller 12 and the laminating rolls 14 and 15 are in indirect contact state (a state in which power can be mechanically transmitted).

Further, around the coating roller 12, a film forming mechanism 16 (film forming portion) for applying a ceramic slurry as a material of the ceramic sheet S to the surface of the coating roller 12 is disposed; a liquid supply mechanism 18, which is used to supply the ceramic slurry to the film forming mechanism 16; the drying and curing device 20 is located on the downstream side of the coating roller rotating direction of the film forming mechanism 16, and is used to make the ceramic on the surface of the coating roller 12. The slurry is dried and solidified; and the intermediate transfer roller 40 described above. An electrode circuit forming mechanism 22 for forming the electrode circuit 24 on the ceramic sheet S before being wound (laminated) on the outer peripheral surface of the lamination rolls 14 and 15 is disposed around the endless belt 38, and the electrode circuit forming mechanism is disposed. A drying and curing device 26 for drying the electrode circuit 24 on the downstream side in the direction of rotation of the annular band of 22, and the intermediate transfer roller 42 described above.

Specifically, the intermediate transfer roller 40 has a function of peeling the ceramic sheet S from the application roller 12 and transferring it to the endless conveyance belt 38. In the third embodiment, the electrode piece 24 is not formed on the ceramic sheet S on the intermediate transfer roller 40. The endless conveyance belt 38 has a function of peeling the ceramic sheet S from the intermediate conveyance roller 40 and transferring it to the intermediate conveyance roller 42. Further, the intermediate transfer roller 42 has a function of peeling the ceramic sheet S from the endless conveyance belt 38 and transferring it to the laminating roller 14.

In the third embodiment, the ceramic slurry is applied to the outer circumferential surface of the coating roller 12 by the film forming mechanism 16 and the liquid supply mechanism 18. Further, the ceramic slurry is dried and solidified on the coating roller 12 by the drying and curing device 20. In this way, the ceramic sheet S is formed. Further, the ceramic sheet S which has been moved from the application roller 12 to the endless conveyance belt 38 via the intermediate conveyance roller 40, and the electrode material ink is applied from the electrode circuit formation mechanism 22 (for example, inkjet printing), and the electrode of the specific pattern pattern is printed. Circuit (internal electrode circuit) 24. After the printing of the electrode circuit 24, the ceramic sheet S on the endless belt 38 is sprayed with a warm air of a specific temperature from the drying and curing device 26 to dry the electrode circuit 24. In this way, the electrode circuit 24 is formed on the ceramic sheet S on the endless belt 38. Thereafter, the ceramic sheet S on which the electrode circuit 24 is formed is received by the intermediate transfer roller 42, and is wound around the outer peripheral surface of the stacking roller 14 to be laminated. Thereby, the laminated structure S' of the ceramic sheet S is formed. In the third embodiment, even after the electrode circuit 24 is formed on the ceramic sheet S, the ceramic sheet S on which the electrode circuit 24 has been formed is wound around the outer peripheral surface of the stacking roll 14 to be laminated.

According to the third embodiment, since the outer circumference of the endless belt conveyor 38 as the long conveyor belt is longer than the outer circumference of the application roller 12 or the outer circumference of the intermediate conveyance roller 40, the ceramic on the endless belt 38 can be expanded. The dried area of the sheet S (the area which can be dried by drying the curing unit 26). Thereby, the formation speed (including the drying speed) of the electrode circuit 24 on the ceramic piece S can be made faster, thereby increasing the manufacturing speed of the electronic component.

In particular, when the electrode circuit forming mechanism 22 employs the ink jet method, the amount of solvent of the ink is large, and the ink is difficult to dry. Therefore, by using the endless belt 38 in the printing portion of the electrode circuit 24, the moving distance of the ceramic sheet S can be lengthened without using a large-diameter roller, so that the electrode for the ceramic sheet S can be increased. The time during which the circuit 24 is dry. Therefore, the unevenness of the quality of the electrode circuit 24 formed by the ink jet method disappears, and the high quality of the electronic component can be maintained.

In the third embodiment, the application roller 12 corresponds to the "film formation substrate" of the present invention, and the lamination rolls 14 and 15 correspond to the "layered support" of the present invention. Further, the intermediate transfer roller 40, the endless conveyance belt 38, and the intermediate conveyance roller 42 correspond to the "transport member" of the present invention.

Next, a method of manufacturing a laminated electronic component manufacturing apparatus and a laminated electronic component according to a fourth embodiment of the present invention will be described with reference to the drawings. Incidentally, the same components as those of the above-described embodiments are denoted by the same reference numerals, and the description of the overlapping configuration and the effect of the operation will be omitted.

As shown in Fig. 5, in the fourth embodiment, the coating roll 12 of the first embodiment is constituted by a ring-shaped film forming tape 44 as a long conveyor. In other words, the intermediate transfer roller (transport member) 46 is in contact with the annular film formation tape 44 that forms the (film formation) ceramic sheet S via the ceramic sheet S. Further, the two laminating rolls 14 or the laminating rolls 15 are in contact with the intermediate transfer rolls 46 via the ceramic sheets S. The pressure rolls 34 and 36 are in contact with the two lamination rolls 14 or the lamination rolls 15 via the ceramic sheets S, respectively. In this manner, the intermediate transfer roller 46 is inserted between the annular film forming tape 44 and each of the laminating rolls 14 and 15. Therefore, the annular film-forming tape 44 is brought into indirect contact with each of the laminating rolls 14, 15 (a state in which power can be mechanically transmitted).

In particular, around the endless belt film forming film 44, a film forming mechanism 16 (film forming portion) for applying a ceramic slurry as a material of the ceramic sheet S to the surface of the annular film forming belt 44 is disposed; The liquid supply mechanism 18 is for supplying the ceramic slurry to the film forming mechanism 16; the drying and curing device 20 is located on the downstream side in the rotation direction of the annular belt of the film forming mechanism 16, and is used for the annular film forming belt 44. The ceramic slurry on the surface is dried and solidified; a film thickness inspection device (CCD camera or the like) 48 for measuring the film thickness of the ceramic sheet S; and an electrode circuit forming mechanism 22 for winding (stacking) on the laminate An electrode circuit 24 is formed on the ceramic sheet S before the outer circumferential surface of the rolls 14, 15; a drying and curing device 26 is located on the downstream side in the rotation direction of the endless belt of the electrode circuit forming mechanism 22, and is used to dry the electrode circuit 24; A roller 50 which removes the defective ceramic sheet S; and the intermediate transfer roller 46 described above.

In the fourth embodiment, the ceramic slurry is supplied to the outer peripheral surface of the annular film-forming tape 44 by the film forming mechanism 16 and the liquid supply mechanism 18. Then, the ceramic slurry is dried and solidified by drying the curing device 20 on the annular film-forming tape 44. In this way, the ceramic sheet S is formed. Further, the film thickness of the ceramic sheet S on the annular film-forming tape 44 is measured by a film thickness inspection device (such as a CCD camera) 48. The electrode material forming means 22 applies an electrode material ink to the ceramic sheet S to print a specific pattern pattern electrode circuit 24. After the printing of the electrode circuit 24, the ceramic sheet S on the annular film-forming tape 44 is sprayed with a warm air of a specific temperature from the drying and curing device 26 to dry the electrode circuit 24. In this way, the electrode pad 24 is formed on the ceramic sheet S on the annular film-forming tape 44. Thereafter, the ceramic sheet S on which the electrode circuit 24 is formed is received by the intermediate transfer roller 46, and wound around the outer peripheral surface of the stacking roll 14 to be laminated. Thereby, the laminated structure S' of the ceramic sheet S is formed. In the fourth embodiment, even after the electrode circuit 24 is formed on the ceramic sheet S, the ceramic sheet S on which the electrode circuit 24 has been formed is wound around the outer peripheral surface of the stacking roll 14 to be laminated.

Here, when the electrode circuit forming mechanism 22 employs the ink jet method, it is difficult to dry the ink due to the large amount of solvent of the ink. Therefore, by using the annular film-forming tape 44 in the printing portion, the moving distance of the ceramic sheet S can be made longer without using a large-diameter roller, so that the electrode circuit 24 on the ceramic sheet S can be increased. Time. Therefore, the unevenness of the quality of the electrode circuit 24 formed by the ink jet method disappears, so that the high quality of the electronic component can be maintained.

In the fourth embodiment, the annular film-forming tape 44 corresponds to the "film-forming substrate" of the present invention, and the laminating rolls 14, 15 correspond to the "layered support" of the present invention. Further, the intermediate transfer roller 46 corresponds to the "transport member" of the present invention.

Next, a method of manufacturing a laminated electronic component manufacturing apparatus and a laminated electronic component according to a fifth embodiment of the present invention will be described with reference to the drawings. Incidentally, the same components as those of the above-described embodiments are denoted by the same reference numerals, and the description of the overlapping configuration and the effect of the operation will be omitted.

As shown in Fig. 6, in the fifth embodiment, a gravure offset printing method is employed as the printing method of the electrode circuit 24. That is, the intermediate transfer roller (transport member) 52 is in contact with the coating roller 12 via the ceramic sheet S. Moreover, the printing conveyance roller (transport member) 54 used when the electrode circuit 24 is formed on the ceramic sheet S is in contact with the intermediate conveyance roller 52 via the ceramic sheet S. The intermediate transfer roller (transport member) 56 is in contact with the printing conveyance roller 54 via the ceramic sheet S. The laminating roller 14 is in contact with the intermediate transfer roller 56 via the ceramic sheet S. The pressure rollers 34, 36 are in contact with the laminating roller 14 via the ceramic sheet S. In this manner, the intermediate conveyance roller 52, the conveyance conveyance roller 54, and the intermediate conveyance roller 56 are inserted between the application roller 12 and each of the lamination rollers 14. Therefore, the application roller 12 and the lamination rolls 14 are in indirect contact state (a state in which power can be mechanically transmitted).

Further, around the coating roller 12, a film forming mechanism 16 for applying a ceramic slurry as a material of the ceramic sheet S to the surface of the coating roller 12, and a liquid supply mechanism 18 for the liquid supply mechanism 18 are disposed. The film forming mechanism 16 is supplied with a ceramic slurry; the drying and curing device 20 is located on the downstream side in the rotation direction of the coating roller of the film forming mechanism 16 and serves to dry and solidify the ceramic slurry on the surface of the coating roller 12; Intermediate transfer roller 52. Further, an electrode circuit forming mechanism 22 for forming the electrode circuit 24 on the ceramic sheet S before being wound (laminated) on the outer peripheral surface of the laminating roller 14 is disposed around the printing conveyance roller 54 for the electrode circuit 24 The drying and drying device 26 and the intermediate transfer roller 52 and the intermediate transfer roller 56.

Here, the electrode circuit forming mechanism 22 is a gravure offset printing method. That is, the offset circuit type electrode circuit forming mechanism 22 includes a pattern forming roller 22A which is formed with a groove (a groove filled with a conductive paste) corresponding to a pattern of the conductive paste film which can be the electrode circuit 24 on the outer peripheral surface; The transfer roller 22B transfers a pattern formed on the pattern forming roller 22A. Further, the pattern transferred onto the transfer roller 22B is dried by the drying and curing device 26 by spraying a warm air of a specific temperature. The pattern of the electrode circuit 24 transferred onto the transfer roller 22B is transferred to the printing conveyance roller 54, and the electrode circuit 24 of a specific pattern is formed on the ceramic sheet S on the printing conveyance roller 54.

According to the fifth embodiment, the ceramic slurry is supplied to the outer circumferential surface of the coating roller 12 by the film forming mechanism 16 and the liquid supply mechanism 18. Thereafter, the ceramic slurry is dried and solidified by drying the curing device 20 on the coating roller 12. In this way, the ceramic sheet S is formed. On the coating roller 12, the ceramic sheet S moves to the intermediate conveyance roller 52 and the print conveyance roller 54. The ceramic sheet S on the printing conveyance roller 54 is transferred from the transfer roller 22B to form a specific pattern of the electrode circuit 24. In this way, the ceramic piece S on the printing conveyance roller 54 forms the electrode circuit 24. Thereafter, the ceramic sheet S on which the electrode circuit 24 is formed is received by the intermediate transfer roller 56, and is wound around the outer peripheral surface of the stacking roller 14 to be laminated. Thereby, the laminated structure S' of the ceramic sheet S is formed. In the fifth embodiment, after the electrode circuit 24 is formed on the ceramic sheet S, the ceramic sheet S on which the electrode circuit 24 has been formed is wound around the outer peripheral surface of the stacking roll 14 to be laminated.

Further, in the fifth embodiment, the application roller 12 corresponds to the "film formation substrate" of the present invention, and the lamination roller 14 corresponds to the "layered support" of the present invention. Further, the intermediate transfer roller 52, the print conveyance roller 54, and the intermediate transfer roller 56 correspond to the "transport member" of the present invention.

Next, a method of manufacturing a laminated electronic component manufacturing apparatus and a laminated electronic component according to a sixth embodiment of the present invention will be described with reference to the drawings. Incidentally, the same components as those of the above-described embodiments are denoted by the same reference numerals, and the description of the overlapping configuration and the effect of the operation will be omitted.

As shown in Fig. 7, the sixth embodiment is based on the configuration of the first embodiment, and a part of the improvement is configured to be inserted between the coating roller 12 and the laminating roller 14 or the laminating roller 15. There is an intermediate transfer roller (transport member) 58.

In the sixth embodiment, the electrode sheet 24 is formed on the ceramic sheet S on the coating roller 12, and the ceramic sheet S on which the electrode circuit 24 has been formed is received by the intermediate transfer roller 58. Then, the ceramic sheet S received by the intermediate transfer roller 58 is wound around the outer peripheral surface of the laminating roller 14 to form a laminated structure S' of the ceramic sheet S.

According to the sixth embodiment, since the intermediate transfer roller 58 is inserted between the application roller 12 and the laminating roller 14 or the laminating roller 15, the ceramic sheet S is self-coated roller 12 as in the second embodiment. The peeling is not affected by the state of the side of the laminating rolls 14, so that the operation can be performed stably.

Further, in the sixth embodiment, the application roller 12 corresponds to the "film formation substrate" of the present invention, and the lamination rollers 14 and 15 correspond to the "layered support" of the present invention. Further, the intermediate transfer roller 58 corresponds to the "transport member" of the present invention.

Next, a method of manufacturing a laminated electronic component manufacturing apparatus and a laminated electronic component according to a seventh embodiment of the present invention will be described with reference to the drawings. Incidentally, the same components as those of the above-described embodiments are denoted by the same reference numerals, and the description of the overlapping configuration and the effect of the operation will be omitted.

As shown in FIG. 8, the seventh embodiment is based on the configuration of the second embodiment, and is partially modified to insert another supply roller between the application roller 12 and the printing conveyance roller 30. Transfer roller (transport member) 60.

In the seventh embodiment, the ceramic sheet S formed on the coating roller 12 is supplied to the printing conveyance roller 30 via the intermediate conveyance roller 60. The electrode circuit 24 is formed on the ceramic sheet S supplied to the printing conveyance roller 30, and the ceramic sheet S on which the electrode circuit 24 has been formed is received from the printing conveyance roller 30 by the intermediate conveyance roller 32. Then, the ceramic sheet S received by the intermediate transfer roller 32, which is the second supply roller, is wound around the outer circumferential surface of the laminating roller 14 to form a laminated structure S' of the ceramic sheet S.

According to the seventh embodiment, since the intermediate transfer roller 60 is inserted between the application roller 12 and the printing conveyance roller 30, the peeling of the ceramic sheet S from the application roller 12 is not the same as that of the second embodiment. Since the state of the layer roll 14 is affected, the operation can be performed stably.

Further, in the seventh embodiment, the application roller 12 corresponds to the "film formation substrate" of the present invention, and the lamination rollers 14 and 15 correspond to the "layered support" of the present invention. Moreover, the intermediate conveyance roller, the conveyance conveyance roller 30, and the intermediate conveyance roller 32 correspond to the "transport member" of this invention.

Next, a method of manufacturing a laminated electronic component manufacturing apparatus and a laminated electronic component according to the eighth embodiment to the tenth embodiment of the present invention will be described with reference to the drawings.

In the eighth embodiment to the tenth embodiment, as shown in FIG. 9 to FIG. 11, the electrode circuit forming mechanism 22 is formed on the circumferentially continuous coating roll 12 or the annular film forming belt 44 which is subjected to mold release treatment on the outer circumference. Electrode circuit 24. Then, the ceramic slurry is applied to the coating roller 12 or the annular film-forming tape 44 on which the electrode circuit 24 is formed by the film forming mechanism 16, and dried to continuously form the ceramic sheet S with the electrode circuit. Further, the ceramic sheet S with the electrode circuit is peeled off from the coating roll 12 or the annular film forming belt 44, and the peeled ceramic sheet S with the electrode circuit is wound around the outer circumference of the laminating roll 14. Thereby, the laminated structure S' of the ceramic sheet S and the electrode circuit 24 is formed.

10. . . Laminated electronic component manufacturing device

12. . . Coating roll (film forming substrate)

14. . . Laminating roll (layered support)

15. . . Laminating roll (layered support)

18. . . Liquid supply mechanism

16. . . Film forming mechanism (film forming portion)

20, 26. . . Dry curing device

twenty two. . . Electrode circuit forming mechanism (electrode circuit forming portion)

twenty four. . . Electrode circuit

30. . . Printing conveyance roller (transport member)

32. . . Intermediate transfer roller (transport member)

38. . . Annular conveyor belt (transporting member)

40. . . Intermediate transfer roller (transport member)

42. . . Intermediate transfer roller (transport member)

44. . . Ring-forming film forming tape (film forming substrate)

46. . . Intermediate transfer roller (transport member)

52. . . Intermediate transfer roller (transport member)

54. . . Printing conveyance roller (transport member)

56. . . Intermediate transfer roller (transport member)

58. . . Intermediate transfer roller (transport member)

60. . . Intermediate transfer roller (transport member)

S. . . Ceramics

S'. . . Laminated structure of ceramic sheet

1 is an explanatory view of a multilayer electronic component manufacturing apparatus according to a first embodiment of the present invention;

Figure 2 is an explanatory view showing the position of a defective portion on a ceramic sheet;

3 is an explanatory view of a multilayer electronic component manufacturing apparatus according to a second embodiment of the present invention;

Figure 4 is an explanatory view showing a manufacturing apparatus of a laminated electronic component according to a third embodiment of the present invention;

Figure 5 is an explanatory view showing a manufacturing apparatus of a laminated electronic component according to a fourth embodiment of the present invention;

Figure 6 is an explanatory view showing a manufacturing apparatus of a laminated electronic component according to a fifth embodiment of the present invention;

Figure 7 is an explanatory view showing a manufacturing apparatus of a laminated electronic component according to a sixth embodiment of the present invention;

Figure 8 is an explanatory view showing a manufacturing apparatus of a laminated electronic component according to a seventh embodiment of the present invention;

Figure 9 is an explanatory view showing a device for manufacturing a laminated electronic component according to an eighth embodiment of the present invention;

Figure 10 is an explanatory view showing a manufacturing apparatus of a laminated electronic component according to a ninth embodiment of the present invention; and

Fig. 11 is an explanatory view showing a manufacturing apparatus of a laminated electronic component according to a tenth embodiment of the present invention.

10. . . Laminated electronic component manufacturing device

12. . . Coating roll (film forming substrate)

14. . . Laminating roll (layered support)

15. . . Laminating roll (layered support)

16. . . Film forming mechanism (film forming portion)

18. . . Liquid supply mechanism

20, 26. . . Dry curing device

twenty two. . . Electrode circuit forming mechanism (electrode circuit forming portion)

S. . . Ceramics

S'. . . Laminated structure of ceramic sheet

Claims (26)

A laminated electronic component manufacturing apparatus comprising: a continuous annular film-forming substrate which is subjected to a mold release treatment on an outer peripheral surface; and a film formation portion which coats a surface of the film formation substrate The ceramic slurry is continuously dried to form a ceramic sheet continuously; the electrode circuit forming portion is formed on the film forming substrate, and the ceramic sheet forming electrode circuit is continuous from the film forming portion; and the buildup support is The ceramic sheet is placed in contact with the film formation substrate, and the ceramic sheet on which the electrode circuit is formed is continuously peeled off from the film formation substrate, and the film formation portion is continuously dried and attached thereto. The ceramic piece of the electrode circuit is wound around the outer circumference to form a laminated structure of the ceramic piece and the electrode circuit, and the ceramic piece is repeatedly formed on the surface of the film formation substrate from which the ceramic piece is peeled off. A laminated electronic component manufacturing apparatus comprising: a continuous annular film-forming substrate which is subjected to a mold release treatment on an outer peripheral surface; and a film formation portion which coats a surface of the film formation substrate The ceramic slurry is continuously dried to form a ceramic sheet continuously; the electrode circuit forming portion is formed by forming the electrode circuit from the ceramic sheet continuous from the film forming portion; and the build-up support is formed by the electrode The circuit forming portion is continuously dried from the film forming portion and is attached to the electrode circuit The ceramic sheet is wound around the outer circumference to form a laminated structure of the ceramic sheet and the electrode circuit, and the conveying member is provided so as to be in contact with the film forming substrate and the laminated support via the ceramic sheet, and The film formation substrate receives the ceramic sheet formed on the film formation substrate, and conveys the received ceramic sheet to the buildup support, and repeatedly forms a ceramic on the surface of the film formation substrate from which the ceramic sheet is peeled off. sheet. The apparatus for manufacturing a laminated electronic component according to claim 2, wherein the electrode circuit forming portion forms the electrode circuit on the ceramic sheet on the conveying member. A laminated electronic component manufacturing apparatus comprising: a continuous annular film-forming substrate having a mold release treatment on an outer peripheral surface; and an electrode circuit forming portion formed on an electrode surface of the film formation substrate a film formation portion that applies a ceramic slurry to a film formation substrate on which the electrode circuit is formed and dried, and continuously forms a ceramic sheet with the electrode circuit; and a build-up support The ceramic sheet having the electrode circuit described above is in contact with the film formation substrate, and the ceramic sheet having the electrode circuit is continuously peeled off from the film formation substrate, and the film formation portion is continuous. The ceramic piece after drying and having the electrode circuit described above is wound around the outer circumference, thereby forming a laminate of the ceramic piece and the electrode circuit. The structure is formed by repeatedly forming a ceramic sheet with an electrode circuit on the surface of the film-forming substrate on which the ceramic sheet having the electrode circuit is attached. A laminated electronic component manufacturing apparatus comprising: a continuous annular film-forming substrate having a mold release treatment on an outer peripheral surface; and an electrode circuit forming portion formed on an electrode surface of the film formation substrate a film forming portion that applies a ceramic slurry to a film-forming substrate on which the electrode circuit is formed and dried, and continuously forms a ceramic sheet with the electrode circuit; a build-up support a laminated structure in which the ceramic sheet and the electrode circuit are formed by winding the ceramic sheet having the electrode circuit continuously dried after the film forming portion is continuously wound, and the transfer member is disposed The ceramic sheet having the electrode circuit is in contact with the film formation substrate and the buildup support, and the ceramic sheet having the electrode circuit formed on the film formation substrate is received from the film formation substrate, and The ceramic sheet with the electrode circuit received thereon is transferred to the build-up support, and the film-forming substrate of the ceramic sheet with the electrode circuit is peeled off The surface of the ceramic sheet with an electrode formed repeatedly circuits. The laminated electronic component manufacturing apparatus according to any one of claims 1 to 5, wherein the electrode circuit forming portion is a plateless printing device that performs electrode printing on the ceramic sheet. The apparatus for manufacturing a laminated electronic component according to claim 6, wherein the above-described plateless printing device is composed of an inkjet printing device and an ink drying and curing device. The apparatus for manufacturing a laminated electronic component according to any one of claims 1 to 5, wherein the outer circumference of the film-forming substrate is the same length as the outer circumference of the laminated support, or the outer circumference of the film-forming substrate or the above One of the outer circumferences of the outer circumference of the laminated support is an integral multiple of the other outer circumference. The apparatus for manufacturing a laminated electronic component according to claim 6, wherein the outer circumference of the film formation substrate is the same length as the outer circumference of the buildup support, or the outer circumference of the film formation substrate or the outer circumference of the laminate support One of the outer perimeters is an integer multiple of the other outer perimeter. The apparatus for manufacturing a laminated electronic component according to claim 7, wherein the outer circumference of the film formation substrate is the same length as the outer circumference of the buildup support, or the outer circumference of the film formation substrate or the outer circumference of the laminate support One of the outer perimeters is an integer multiple of the other outer perimeter. The laminated electronic component manufacturing apparatus according to any one of claims 1 to 5, wherein when the ceramic sheet is wound around the outer periphery of the buildup support to form a laminated structure of the ceramic sheet and the electrode circuit, A new ceramic piece as described above is continuously formed on the film-forming substrate. The apparatus for manufacturing a laminated electronic component according to claim 6, wherein the ceramic sheet is wound around the outer periphery of the buildup support to form a laminated structure of the ceramic sheet and the electrode circuit, and continues on the film formation substrate. A new ceramic piece as described above is formed. The apparatus for manufacturing a laminated electronic component according to claim 7, wherein When the ceramic sheet is wound around the outer periphery of the buildup support to form the laminated structure of the ceramic sheet and the electrode circuit, a new ceramic sheet is continuously formed on the film formation substrate. The apparatus for manufacturing a laminated electronic component according to claim 8, wherein the ceramic sheet is wound around the outer periphery of the buildup support to form a laminated structure of the ceramic sheet and the electrode circuit, and continues on the film formation substrate. A new ceramic piece as described above is formed. The apparatus for manufacturing a laminated electronic component according to claim 9, wherein the ceramic sheet is wound around the outer periphery of the buildup support to form a laminated structure of the ceramic sheet and the electrode circuit, and continues on the film formation substrate. A new ceramic piece as described above is formed. The apparatus for manufacturing a laminated electronic component according to claim 10, wherein the ceramic sheet is wound around the outer periphery of the buildup support to form a laminated structure of the ceramic sheet and the electrode circuit, and continues on the film formation substrate. A new ceramic piece as described above is formed. A method for producing a laminated electronic component, comprising: a film forming step of coating a surface of a film-forming substrate having a ring-shaped continuous shape with a release treatment on an outer peripheral surface by a film forming portion; The slurry is dried and continuously formed into a ceramic sheet; and an electrode circuit forming step of forming the electrode circuit by the ceramic sheet continuous from the film forming portion on the film forming substrate by the electrode circuit forming portion And a laminated structure forming step of continuously forming the film-forming substrate by allowing the build-up support to contact the film-forming substrate via the ceramic sheet The ceramic sheet on which the electrode circuit is formed is peeled off, and the ceramic sheet which has been continuously dried from the film formation portion and has the electrode circuit is wound around the outer periphery of the buildup support, thereby forming the ceramic sheet. And a laminated structure of the electrode circuit, wherein the ceramic sheet is repeatedly formed on the surface of the film-forming substrate from which the ceramic sheet is peeled off. A method for producing a laminated electronic component, comprising: a film forming step of coating a surface of a film-forming substrate having a ring-shaped continuous shape with a release treatment on an outer peripheral surface by a film forming portion; a slurry is continuously formed to form a ceramic sheet continuously; an electrode circuit forming step of forming an electrode circuit on the ceramic sheet continuous from the film formation portion by an electrode circuit forming portion; and a laminated structure forming step The ceramic sheet and the electrode circuit are formed by winding the ceramic sheet which has been continuously dried from the film formation portion and the electrode forming circuit, and the ceramic sheet having the electrode circuit is wound around the outer periphery of the buildup support. a laminated structure; and a transporting step performed after the film forming step and before the laminated structure forming step, and the conveying member receives the ceramic sheet formed on the film forming substrate from the film forming substrate, And conveying the received ceramic sheet to the buildup support by the transfer member, and peeling off the ceramic sheet Formed on the surface of the substrate sheet to form a ceramic repeated. A method of manufacturing a laminated electronic component according to claim 18, wherein the electrode is electrically In the road forming step, the electrode circuit is formed on the ceramic sheet on the conveying member. A method of manufacturing a laminated electronic component, comprising: an electrode circuit forming step of forming an electrode circuit on a surface of a ring-shaped continuous film-forming substrate having a release process on an outer peripheral surface by an electrode circuit forming portion; a film formation step of applying a ceramic slurry to a film formation substrate on which the electrode circuit is formed by a film formation portion and drying the ceramic sheet, and continuously forming a ceramic sheet with the electrode circuit; a laminated structure forming step of continuously contacting the above-mentioned electrode circuit from the film forming substrate by contacting the ceramic sheet with the electrode circuit in contact with the film forming substrate via a laminated support a ceramic sheet in which the ceramic sheet having the electrode circuit continuously dried and the electrode sheet having the electrode circuit is wound around the outer periphery of the buildup support to form a laminated structure of the ceramic sheet and the electrode circuit. Further, the ceramic sheet with the electrode circuit is repeatedly formed on the surface of the film-forming substrate on which the ceramic sheet having the electrode circuit is attached. A method of manufacturing a laminated electronic component, comprising: an electrode circuit forming step of forming an electrode circuit on a surface of a ring-shaped continuous film-forming substrate having a release process on an outer peripheral surface by an electrode circuit forming portion; a film formation step of applying a ceramic slurry to a film formation substrate on which the electrode circuit is formed by a film formation portion and drying the film, and continuously forming a ceramic sheet with the electrode circuit; a laminated structure forming step of forming the ceramic sheet and the electrode circuit by winding the ceramic sheet which is continuously dried from the film forming portion and having the electrode circuit around the outer periphery of the buildup support a laminated structure; and a transporting step performed after the film forming step and before the laminated structure forming step, and the conveying member receives the electrode formed on the film forming substrate from the film forming substrate In the ceramic sheet of the circuit, the ceramic sheet with the electrode circuit received is transferred to the build-up support by the transfer member, and the film-forming substrate of the ceramic sheet with the electrode circuit is peeled off On the surface of the material, a ceramic sheet with an electrode circuit is repeatedly formed. The method for producing a laminated electronic component according to any one of claims 17 to 21, wherein a plateless printing device that performs electrode printing on the ceramic sheet is used as the electrode circuit forming portion. A method of producing a laminated electronic component according to claim 22, wherein an inkjet printing device and an ink drying and curing device are used as the above-described plateless printing device. The method of manufacturing a laminated electronic component according to any one of claims 17 to 21, wherein in the laminated structure forming step, the ceramic sheet is wound around the outer periphery of the buildup support to form the ceramic sheet and the electrode. In the laminated structure of the circuit, in the film formation step, a new ceramic sheet is continuously formed on the film formation substrate. The method of manufacturing a laminated electronic component according to claim 22, wherein in the step of forming the laminated structure, the ceramic sheet is wound around the laminated layer When the ceramic sheet and the laminated structure of the electrode circuit are formed in the outer periphery of the support, the new ceramic sheet is continuously formed on the film formation substrate in the film formation step. The method of manufacturing a laminated electronic component according to claim 23, wherein in the step of forming the laminated structure, the ceramic sheet is wound around the outer periphery of the buildup support to form a laminated structure of the ceramic sheet and the electrode circuit. In the film formation step described above, a new ceramic sheet is continuously formed on the film formation substrate.