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TWI505387B - - Google Patents

Info

Publication number
TWI505387B
TWI505387B TW101143569A TW101143569A TWI505387B TW I505387 B TWI505387 B TW I505387B TW 101143569 A TW101143569 A TW 101143569A TW 101143569 A TW101143569 A TW 101143569A TW I505387 B TWI505387 B TW I505387B
Authority
TW
Taiwan
Application number
TW101143569A
Other languages
Chinese (zh)
Other versions
TW201332042A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW201332042A publication Critical patent/TW201332042A/en
Application granted granted Critical
Publication of TWI505387B publication Critical patent/TWI505387B/zh

Links

TW101143569A 2011-12-23 2012-11-21 Adjustable confining ring for plasma processing device TW201332042A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110437212.2A CN103177925B (en) 2011-12-23 2011-12-23 A kind of adjustable confinement ring for plasma processing apparatus

Publications (2)

Publication Number Publication Date
TW201332042A TW201332042A (en) 2013-08-01
TWI505387B true TWI505387B (en) 2015-10-21

Family

ID=48637706

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101143569A TW201332042A (en) 2011-12-23 2012-11-21 Adjustable confining ring for plasma processing device

Country Status (2)

Country Link
CN (1) CN103177925B (en)
TW (1) TW201332042A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI828132B (en) * 2021-06-23 2024-01-01 大陸商中微半導體設備(上海)股份有限公司 Confinement ring, plasma processing device and exhaust control method thereof

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105789014B (en) * 2014-12-26 2018-10-09 中微半导体设备(上海)有限公司 It is a kind of to realize the plasma processing apparatus being uniformly vented
CN106935530B (en) * 2015-12-31 2020-04-17 中微半导体设备(上海)股份有限公司 Plasma etching photoresist device
CN109037019B (en) * 2018-07-03 2020-04-28 深圳市华星光电半导体显示技术有限公司 Dry etching apparatus
CN111383896B (en) * 2018-12-29 2023-10-13 北京北方华创微电子装备有限公司 Lining and reaction chamber
JP7308711B2 (en) * 2019-09-26 2023-07-14 東京エレクトロン株式会社 Plasma processing equipment
CN114334593B (en) * 2020-09-29 2023-10-31 中微半导体设备(上海)股份有限公司 Confinement ring, plasma processing device and exhaust method thereof
CN114639585B (en) * 2020-12-16 2025-02-14 中微半导体设备(上海)股份有限公司 Confinement ring assembly, plasma processing device and exhaust control method thereof
CN115954257B (en) * 2023-03-14 2023-05-23 长鑫存储技术有限公司 Substrate processing apparatus, gas confinement assembly, and adjustment method and adjustment apparatus therefor
CN116779409A (en) * 2023-07-31 2023-09-19 安徽四象半导体材料科技有限公司 Confined rings for plasma etching
CN120261250B (en) * 2025-05-30 2025-08-22 上海邦芯半导体科技有限公司 Exhaust adjusting device of plasma equipment and plasma equipment

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200829088A (en) * 2006-12-27 2008-07-01 Advanced Micro Fab Equip Inc Plasma confinement apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6896765B2 (en) * 2002-09-18 2005-05-24 Lam Research Corporation Method and apparatus for the compensation of edge ring wear in a plasma processing chamber
US7972467B2 (en) * 2003-04-17 2011-07-05 Applied Materials Inc. Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor
CN101150909B (en) * 2006-09-22 2010-05-12 中微半导体设备(上海)有限公司 Plasm restraint device
CN100576438C (en) * 2006-11-15 2009-12-30 应用材料股份有限公司 Confinement Baffles and Flow Equalizers for Enhanced Magnetic Control of Radial Plasma Distribution
TWM377038U (en) * 2009-05-15 2010-03-21 Advanced Micro Fab Equip Inc Plasma confinement device and plasma processing device using the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200829088A (en) * 2006-12-27 2008-07-01 Advanced Micro Fab Equip Inc Plasma confinement apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI828132B (en) * 2021-06-23 2024-01-01 大陸商中微半導體設備(上海)股份有限公司 Confinement ring, plasma processing device and exhaust control method thereof

Also Published As

Publication number Publication date
CN103177925B (en) 2015-08-26
CN103177925A (en) 2013-06-26
TW201332042A (en) 2013-08-01

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