TWI503711B - Touch panel and electronic device with the touch panel - Google Patents

Description

Touch panel and electronic device with touch panel

The present invention relates to an electronic device, and more particularly to an electronic device having a touch panel.

At present, there are more and more electronic devices with touch panels, such as touch screen mobile phones, touch screen tablets, and the like, which have been widely used. Current touch panels typically include a substrate, a touch sensor circuit carried on the substrate, and a static mask layer on the back side of the substrate and a Flexible Printed Circuit Board (FPCB). The electrostatic mask layer is used to cover the electromagnetic interference signal of the touch sensor circuit and needs to be grounded. The current electrostatic mask layer is grounded through a flexible circuit board, specifically, a mask sheet is disposed on the flexible circuit board, and the mask sheet is connected to the ground on the flexible circuit board through the conductive strip, and the static mask layer and the soft layer The mask sheet on the circuit board is bonded to the mask sheet by an ACF bonding (anisotropic conductive film bonding) process. Thereby, the electrostatic mask layer is connected to the ground on the flexible circuit board through the mask sheet and the conductive strip.

However, the current method of grounding the electrostatic mask layer by setting a mask sheet on a flexible circuit board increases the space of the flexible circuit board, so that the layout rate of the flexible circuit board is reduced, that is, the soft circuit that can be mounted on the same touch panel. The board is reduced. In addition, since the substrate of the current touch panel is made of glass, the mask on the flexible circuit board is When the edges of the electrostatic mask layer are bonded by solder or the like, the substrate is easily damaged. In addition, the current ACF bonding process is more complicated and the defect rate is higher.

The present invention provides a touch panel and an electronic device having the touch panel, which can omit the grounding of the electrostatic mask layer by omitting the mask sheet on the flexible circuit board.

A touch panel includes a substrate, a touch sensing circuit layer, a static shielding layer, and a flexible circuit board. The substrate is configured to carry a touch sensing circuit layer. The electrostatic shielding layer is disposed on a back surface of the substrate, and the flexible circuit board is disposed on the Above the touch sensing circuit layer, the flexible circuit board includes at least one grounded exposed area, and the bare area is electrically connected to the electrostatic mask layer through the conductive portion.

An electronic device includes a touch panel and a display panel. The touch panel includes a substrate, a touch sensing circuit layer, a static mask layer, and a flexible circuit board. The substrate is configured to carry a touch sensing circuit layer, and the electrostatic mask layer is disposed on the The flexible circuit board is disposed above the touch sensing circuit layer, wherein the flexible circuit board includes at least one grounded exposed area, and the bare area is electrically connected to the electrostatic mask layer through the conductive portion.

In the touch panel and the electronic device of the present invention, the electrostatic mask layer is grounded by directly providing a bare region and a static mask layer on the flexible circuit board, and there is no need to provide a mask sheet, thereby saving the occupied by the flexible circuit board. Space, and the process is simple, and the yield is high.

10‧‧‧ touch panel

11‧‧‧Substrate

12‧‧‧Touch sensing circuit layer

13‧‧‧Electrostatic mask

14‧‧‧Soft circuit board

141‧‧‧naked area

142‧‧‧ Conductive tape

34‧‧‧Electrical Department

20‧‧‧ display panel

1 is a schematic cross-sectional view of a touch panel in a first embodiment of the present invention.

2 is an exploded perspective view of the touch panel in an inverted state according to the first embodiment of the present invention.

3 is a schematic diagram of an electronic device having a touch panel in the first embodiment of the present invention.

Please refer to FIG. 1 and FIG. 2 together. FIG. 1 is a schematic cross-sectional view of a touch panel 10 according to an embodiment of the present invention. The touch panel 10 includes a substrate 11 , a touch sensing circuit layer 12 , a static mask layer 13 , and a flexible circuit board 14 .

The substrate 11 is configured to carry the touch sensing circuit layer 12 . The electrostatic mask layer 13 is disposed on the back surface of the substrate 11 , that is, disposed on a side of the touch sensing circuit layer 12 .

The substrate 11 is made of a transparent material such as glass or the like. The electrostatic mask layer 13 is an ITO (Indium Tin Oxide) film or the like, and the electrostatic mask layer 13 is applied to the back surface of the substrate 11.

The flexible circuit board 14 is disposed above the touch sensing circuit layer 12 . The flexible circuit board 14 defines a bare region 141 . The bare region 141 is electrically connected to the electrostatic mask layer 13 through the conductive portion 34 .

Specifically, as shown in FIG. 1 , in the embodiment, a part of the flexible circuit board 14 is exposed on the edge of the touch sensing circuit layer 12 , and the bare area 141 is opened on the flexible circuit board 14 to be exposed to the touch sensing. A portion of the circuit layer 12 faces the side of the touch sensing circuit layer 12. The flexible circuit board 14 is pressure-bonded to the top of the touch sensing circuit layer 12 by ACF bonding (anisotropic conductive film bonding).

Please refer to FIG. 2 together for an exploded view of the touch panel 10 in an inverted state. As shown in FIG. 2, in the embodiment, the bare area 141 is on the flexible circuit board 14. The grounding of the conductive strip 142 is obtained by removing the insulating layer at the position of the conductive strip 142 on the flexible circuit board 14 to expose the conductive material to form the exposed region 141. Thereby, the electrostatic mask layer 13 and the bare region 141 of the flexible circuit board 14 are electrically connected by the conductive portion 34 to be grounded. The number of the bare areas 141 may be one or several, and the number, size, shape, and the like of the bare areas 141 may satisfy the contact between the bare area 141 and the electrostatic mask layer 13. The conductive material exposed in the exposed area 141 is a conductive metal such as copper, silver or iron. The conductive strip 142 is grounded to directly connect the ground on the flexible circuit board 14.

In other embodiments, the location of the bare region 141 is ground, and the conductive region is exposed by removing the insulating layer in the region on the flexible circuit board 14 to form the bare region 141 of the ground.

In the present embodiment, the conductive portion 34 extends from the electrostatic mask layer 13 to the bare region 141.

Specifically, in the embodiment, the conductive portion 34 is a conductive metal paste, for example, a conductive silver paste. As shown in FIG. 2, at the time of production, the touch panel 10 is inverted, and the conductive metal paste is poured from the electrostatic mask layer 13 to the bare region 141 to form a conductive connection between the electrostatic mask layer 13 and the bare region 141. Part 34.

In other embodiments, the conductive portion 34 can be a detachable conductive tape or a conductive foam, and one end of the detachable conductive tape or the conductive foam is soldered to the electrostatic mask layer 13 and the other end is connected to the bare region. 141 welding.

Therefore, in the present invention, by electrically connecting the grounded conductive portion 34 on the flexible circuit board 14 to the electrostatic shield layer 13, it is not necessary to provide a mask on the flexible circuit board 14, which reduces the occupation of the flexible circuit board 14. space. And because there is no need for a mask and static The ACF bonding pressure welding process of the cover layer 13 simplifies the process and reduces the risk of damaging the substrate 11 of the glass material, thereby improving the yield.

Please refer to FIG. 3 , which is a schematic diagram of an electronic device 100 according to an embodiment of the present invention. The electronic device 100 includes a touch panel 10 as shown in FIG. 1 and a display panel 20.

The display panel 20 is located below the touch panel 10 and forms a touch screen with the touch panel 10 . The display panel 20 can be a liquid crystal display panel or the like.

The electrostatic mask layer 13 of the touch panel 10 is located between the touch sensing circuit layer 12 and the display panel 20 to shield the mutual interference between the touch sensing circuit layer 12 and the display panel 20.

Obviously, the electronic device 100 further includes other components, for example, a processing unit, a storage unit, and the like, which are not described herein because they are not related to the improvement of the present invention.

The electronic device 100 is one of a mobile phone, a tablet computer, a digital camera, and an electronic photo frame.

It is to be understood that the above-described embodiments are merely illustrative of the invention and are not intended to limit the invention. Variations made by the person skilled in the art in the corresponding technical field in accordance with the invention are within the scope of protection of the invention.

10‧‧‧ touch panel

11‧‧‧Substrate

12‧‧‧Touch sensing circuit layer

13‧‧‧Electrostatic mask

14‧‧‧Soft circuit board

34‧‧‧Electrical Department

Claims (12)

A touch panel includes a substrate, a touch sensing circuit layer, a static shielding layer, and a flexible circuit board. The substrate is configured to carry a touch sensing circuit layer. The electrostatic shielding layer is disposed on a side of the substrate away from the touch sensing circuit layer. The flexible circuit board is disposed above the touch sensing circuit layer, and the improvement is that the flexible circuit board comprises at least one grounded exposed area formed by opening a conductive material on the flexible circuit board, the bare area The electrostatic mask layer is electrically connected to the conductive portion. The touch panel of claim 1, wherein a portion of the flexible circuit board is exposed on an edge of the touch sensing circuit layer, and the bare region is formed on a portion of the flexible circuit board exposed on the touch sensing circuit layer. One side facing the touch sensing circuit layer. The touch panel of claim 1, wherein the exposed area is formed by opening a hole in a region of a grounded conductive strip on the flexible circuit board to expose the conductive material. The touch panel of claim 1, wherein the bare region is formed by opening a hole in a region of the ground on the flexible circuit board to form the bare region. The touch panel of claim 1, wherein the conductive portion is a conductive metal paste, and when the touch panel is inverted, the conductive metal paste is poured from the electrostatic mask layer to the bare region to form the static electricity. The mask layer and the conductive portion of the bare area. The touch panel of claim 1, wherein the conductive portion is a detachable conductive tape or a conductive foam, and one end of the detachable conductive tape or the conductive foam is soldered to the electrostatic mask layer. The other end is welded to the bare area. An electronic device includes a touch panel and a display panel, the touch panel including a substrate, a touch sensing circuit layer, an electrostatic mask layer, and a flexible circuit board for carrying a touch In the sensing circuit layer, the electrostatic shielding layer is disposed on a side of the substrate away from the touch sensing circuit layer, and the flexible circuit board is disposed above the touch sensing circuit layer, wherein the flexible circuit board comprises at least one grounded The bare region is formed by exposing a conductive material to the opening of the flexible circuit board, and the bare region is electrically connected to the electrostatic mask layer through the conductive portion. The electronic device of claim 7, wherein a portion of the flexible circuit board is exposed at an edge of the touch sensing circuit layer, and the bare region is formed on a portion of the flexible circuit board exposed to the touch sensing circuit layer. One side facing the touch sensing circuit layer. The electronic device of claim 7, wherein the bare region is formed by opening a hole in a region of a grounded conductive strip on the flexible circuit board to expose the conductive material. The electronic device of claim 7, wherein the bare region is formed by opening a hole in a region of the ground on the flexible circuit board to form the bare region. The electronic device of claim 7, wherein the conductive portion is a conductive metal paste, and when the touch panel is inverted, the conductive metal paste is poured from the electrostatic mask layer to the bare region to form the static electricity. The mask layer and the conductive portion of the bare area. The electronic device of claim 7, wherein the conductive portion is a detachable conductive tape or a conductive foam, and one end of the detachable conductive tape or the conductive foam is soldered to the electrostatic mask layer. The other end is welded to the bare area.