TWI599067B - Monolithic glass substrate selenium sulfide process equipment - Google Patents
Monolithic glass substrate selenium sulfide process equipment Download PDFInfo
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- TWI599067B TWI599067B TW104138372A TW104138372A TWI599067B TW I599067 B TWI599067 B TW I599067B TW 104138372 A TW104138372 A TW 104138372A TW 104138372 A TW104138372 A TW 104138372A TW I599067 B TWI599067 B TW I599067B
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- 239000000758 substrate Substances 0.000 title claims description 82
- 239000011521 glass Substances 0.000 title claims description 81
- 238000000034 method Methods 0.000 title description 38
- 230000008569 process Effects 0.000 title description 27
- VIDTVPHHDGRGAF-UHFFFAOYSA-N selenium sulfide Chemical compound [Se]=S VIDTVPHHDGRGAF-UHFFFAOYSA-N 0.000 title description 5
- 229960005265 selenium sulfide Drugs 0.000 title description 5
- 238000010438 heat treatment Methods 0.000 claims description 152
- 239000011669 selenium Substances 0.000 claims description 91
- 229910052711 selenium Inorganic materials 0.000 claims description 89
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 86
- 239000007789 gas Substances 0.000 claims description 74
- 238000004073 vulcanization Methods 0.000 claims description 48
- 239000011261 inert gas Substances 0.000 claims description 34
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 21
- 239000000919 ceramic Substances 0.000 claims description 16
- 238000005336 cracking Methods 0.000 claims description 15
- 238000011084 recovery Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 13
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 12
- 238000009826 distribution Methods 0.000 claims description 11
- 238000002156 mixing Methods 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 229910002804 graphite Inorganic materials 0.000 claims description 8
- 239000010439 graphite Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 229910001026 inconel Inorganic materials 0.000 claims description 6
- 239000010453 quartz Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 claims description 6
- 238000009833 condensation Methods 0.000 claims description 5
- 230000005494 condensation Effects 0.000 claims description 5
- 230000001105 regulatory effect Effects 0.000 claims 1
- 239000010408 film Substances 0.000 description 15
- 238000012545 processing Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 229910052717 sulfur Inorganic materials 0.000 description 8
- 239000011593 sulfur Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000013461 design Methods 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- 239000002243 precursor Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000005987 sulfurization reaction Methods 0.000 description 3
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000005486 sulfidation Methods 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005273 aeration Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010549 co-Evaporation Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Photovoltaic Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
本發明係關於一種硒硫化製程設備,更特別的是關於一種單片式玻璃基板之硒硫化製程設備。 The invention relates to a selenium vulcanization process equipment, and more particularly to a selenium vulcanization process equipment for a monolithic glass substrate.
具有銅銦鎵硒(Cu/In/Ga/Se,CIGS)薄膜之太陽能電池,其使用直接能隙半導體材料,能隙值介於1.04eV到1.68eV之間,具有很高的光吸收係數,吸光範圍廣泛,長期照光穩定性佳,材料製造成本低且轉換效率佳,因此CIGS太陽能電池為目前最具發展潛力的太陽能電池。 A solar cell having a copper indium gallium selenide (Cu/In/Ga/Se, CIGS) film using a direct energy gap semiconductor material with a band gap between 1.04 eV and 1.68 eV and having a high light absorption coefficient. With a wide range of light absorption, good long-term illumination stability, low material manufacturing cost and good conversion efficiency, CIGS solar cells are currently the most promising solar cells.
對於CIGS太陽能電池產業而言,目前主流的技術幾乎為真空製程,包含濺鍍硒化及多源共蒸鍍法等,其中又以採用濺鍍硒化法為主,而濺鍍硒化法又可區分為兩種類型,其中一種方式為採用高溫爐的技術方案,在密閉真空中通入H2Se進行高溫硒化,此種方式係在基板表面已有前驅層的狀態下,一次可以置入多片基板於高溫爐中,經過抽真空、通氣、加溫、持溫、降溫、排氣等循環過程,其製程過程時間長(可能長達10小時),然而,多片製程很難達到一致的均勻性,耗能大且昂貴材料耗損大而使得生產成本不易降低;另一種方式係採用快速熱處理(rapid thermal processing, RTP)的技術方案,這種方案基本上又可區分為兩種技術類型,一種是將硒薄膜沉積於基板上,作為前驅層的一部份,之後採用連續式加溫/持溫/降溫及內運送的方式進行快速硒化,或者在可開啟/隔絕之連續腔體內進行加溫/持溫/降溫之快速硒化法。另外一類則為可合併硒薄膜前驅層或不含硒薄膜前驅層之硒氣氛(裂解硒)下之快速硒化技術。 For the CIGS solar cell industry, the current mainstream technology is almost a vacuum process, including sputter selenization and multi-source co-evaporation, among which sputter selenization is the main method, and the sputter selenization method is It can be divided into two types, one of which is a technical scheme using a high-temperature furnace, and H 2 Se is introduced into a closed vacuum for high-temperature selenization. This method can be placed once in the state where the surface of the substrate has a precursor layer. Multiple substrates are placed in a high-temperature furnace, and after a cycle of vacuuming, aeration, heating, holding temperature, cooling, and exhausting, the process time is long (may be as long as 10 hours). However, it is difficult to achieve multi-chip process. Uniform uniformity, high energy consumption and high material consumption make the production cost difficult to reduce; the other method adopts the rapid thermal processing (RTP) technical solution, which can basically be divided into two technologies. Type, one is to deposit a selenium film on the substrate as part of the precursor layer, and then use the continuous heating / holding / cooling / internal transport for rapid selenization, or can be opened / Isolation of the cavity for continuous heating / holding temperature / rapid cooling of selenization. The other type is a rapid selenization technique that can be combined with a selenium film precursor layer or a selenium atmosphere (cracked selenium) that does not contain a selenium film precursor layer.
在鈉玻璃基板上製作銅銦鎵硒硫(CIGSS)薄膜太陽能電池,使用真空濺鍍技術製作CIG(銅銦鎵)前驅物,結合快速熱處理(Rapid Thermal Processing,RTP)製程-硒/硫化法(Selenization/Sulfurization)製備CIGSS吸收層,具有高品質、速度快且適合大面積生產的優點。在RTP硒化製程設計上,會因為Cu-In-Ga前驅膜的晶體取向(Amorphous or polycrystalline)、各層間的應力(tensile or compressive stress)與設計結構(single layer or multi-layer)而有所不同,在全系統之設計上需要考量:(1)硒/硫化溫度(2)升溫與降溫的速率(3)硒/硫化時間與各階段溫度分佈(4)硒/硫裂解模組設計(5)高溫均勻性設計(6)腔體密閉與轉站設計(7)硒/硫氣氛均佈方式(8)硒/硫汙染防治及回收機制等,皆是關鍵因素,在硒氣氛中進行快速硒化或整合硒蒸鍍前驅物進行硒氣氛中快速硒化。 A copper indium gallium selenide (CIGSS) thin film solar cell was fabricated on a soda glass substrate, and a CIG (copper indium gallium) precursor was fabricated using a vacuum sputtering technique in combination with a Rapid Thermal Processing (RTP) process-selenium/sulfurization method ( Selenization/Sulfurization) The preparation of CIGSS absorbers has the advantages of high quality, fast speed and suitable for large-area production. In the RTP selenization process design, it will be due to the Amorphous or polycrystalline of the Cu-In-Ga precursor film, the tensile or compressive stress and the single layer or multi-layer. Different, in the design of the whole system need to consider: (1) selenium / vulcanization temperature (2) temperature and temperature drop rate (3) selenium / vulcanization time and temperature distribution at each stage (4) selenium / sulfur cracking module design (5 High temperature uniformity design (6) cavity sealing and transfer station design (7) selenium/sulfur atmosphere uniform distribution method (8) selenium/sulfur pollution prevention and recovery mechanism, etc., are all key factors for rapid selenium in selenium atmosphere The selenium vapor deposition precursor is integrated or integrated to perform rapid selenization in a selenium atmosphere.
製造CIGS太陽電池的技術與方法眾多,但是習知技術上仍然沒有任何製程能同時滿足成本效益以及高效率的要求,主要的瓶頸在於穩定的大面積之CIGS太陽能電池製 程技術仍未成熟,且製程設備主要的議題包含:使用大面積玻璃基板進行製程時的輻射熱不均勻問題、硒蒸氣均勻散佈問題、硒蒸氣回收問題、高溫製程下產生玻璃基板變形問題等。於美國第5578503號專利中,描述了以每秒超過10℃之溫度變化的加熱速率進行製程,避免硒化過程中液化硒元素所導致之薄膜表面張力不均勻,而使得所形成之結晶不良導致太陽能電池轉換效率下降之情事,然而,對於大面積之玻璃基板使用每秒超過10℃之溫度變化的加熱速率進行製程,往往造成該玻璃基板碎裂;於美國第2010/0226629A1號專利中描述了一種連續式之量產硒化製程中避免硒汙染的方法,但在硒的回收以及熱均勻化之技術上並沒有有效的解決方法。 There are many techniques and methods for manufacturing CIGS solar cells, but there are still no processes in the prior art that can meet both cost-effective and high-efficiency requirements. The main bottleneck lies in the stable large-area CIGS solar cell system. The process technology is still immature, and the main topics of process equipment include: radiant heat non-uniformity during the process of using large-area glass substrates, uniform dispersion of selenium vapor, selenium vapor recovery, and glass substrate deformation under high-temperature process. In U.S. Patent No. 5,758,503, the process of heating at a temperature exceeding 10 ° C per second is described to avoid uneven surface tension of the film caused by liquefaction of selenium during selenization, resulting in poor crystal formation. The solar cell conversion efficiency is reduced. However, the process of using a heating rate of a temperature change of more than 10 ° C per second for a large-area glass substrate often causes the glass substrate to be broken; it is described in US Patent No. 2010/0226629 A1. A method for avoiding selenium contamination in a continuous mass production selenization process, but there is no effective solution in the technology of selenium recovery and heat homogenization.
故有必要提供一種用於玻璃基板之硒硫化製程設備,用以解決習知技術的缺失。 Therefore, it is necessary to provide a selenium vulcanization process equipment for a glass substrate to solve the lack of the prior art.
本發明之一目的在於提供一種單片式玻璃基板之硒硫化製程設備,以對單片玻璃基板進行均勻加熱以及均勻硒硫化。 It is an object of the present invention to provide a selenium vulcanization process apparatus for a monolithic glass substrate for uniform heating and uniform selenization of a single piece of glass substrate.
本發明之另一目的在於提供一種單片式玻璃基板之硒硫化製程設備,以裂解硒或硫混合惰性氣體於接近大氣壓力之環境下取代真空環境下具毒性之H2Se或H2S之硒化或硫化。 Another object of the present invention is to provide a selenium vulcanization process apparatus for a monolithic glass substrate, which is capable of replacing a toxic H 2 Se or H 2 S in a vacuum environment in an environment close to atmospheric pressure by cracking selenium or sulfur mixed inert gas. Selenization or vulcanization.
本發明之再一目的在於提供一種單片式玻璃基 板之硒硫化製程設備,以回收製程中多餘之硒蒸氣或硫蒸氣來再次利用,進而降低材料成本。 A further object of the present invention is to provide a monolithic glass base The selenium vulcanization process equipment of the board is reused by recycling excess selenium vapor or sulfur vapor in the process, thereby reducing the material cost.
為達上述目的及其他目的,本發明提出一種用於單片式玻璃基板之硒硫化製程設備,係包括一第一腔體、一第一運載加熱模組、一第一加熱組、一第二腔體、一第二運載加熱模組、一第二加熱組、一氣體均佈模組、一氣體回收模組、一腔體連通道及一溫度量測裝置。該第一腔體係具有一第一閘門及一第二閘門,且分別設置於該第一腔體不相鄰的二側;該第一運載加熱模組係設置於該第一腔體中並介於該第一閘門及該第二閘門之間;該第一加熱組係設置於該第一腔體中並位於第一運載模組之頂側及底側;該第二腔體係具有一第三閘門,且設置於該第二腔體的一側;該第二運載加熱模組係設置於該第二腔體中並鄰設於該第三閘門;該第二加熱組係設置於該第二腔體中並位於第二運載模組之頂側及底側;該氣體均佈模組係與該第二腔體相連接,以將氣體導入該第二腔體中;該氣體回收模組係與該第二腔體相連接,以回收該第二腔體中之氣體;該腔體連通道係分別與該第一腔體的第一閘門及該第二腔體的第三閘門相連接;及該溫度量測裝置,係設置於該腔體連通道中。 To achieve the above and other objects, the present invention provides a selenium vulcanization process apparatus for a monolithic glass substrate, comprising a first cavity, a first carrier heating module, a first heating group, and a second The cavity, a second carrier heating module, a second heating group, a gas uniform module, a gas recovery module, a cavity connecting channel and a temperature measuring device. The first cavity system has a first gate and a second gate, and is respectively disposed on two sides of the first cavity that are not adjacent to each other; the first carrier heating module is disposed in the first cavity and is Between the first gate and the second gate; the first heating group is disposed in the first cavity and located on a top side and a bottom side of the first carrier module; the second cavity system has a third a gate is disposed on one side of the second cavity; the second carrier heating module is disposed in the second cavity and adjacent to the third gate; the second heating group is disposed in the second The gas is disposed on the top side and the bottom side of the second carrier module; the gas uniformity module is connected to the second cavity to introduce a gas into the second cavity; the gas recovery module is Connected to the second cavity to recover the gas in the second cavity; the cavity connection channel is respectively connected to the first gate of the first cavity and the third gate of the second cavity; And the temperature measuring device is disposed in the cavity connecting passage.
於本發明之一實施例中,該第一運載加熱模組係具有複數第一加熱滾輪,且各該第一加熱滾輪中係設置有一第一滾輪加熱單元。 In an embodiment of the present invention, the first carrier heating module has a plurality of first heating rollers, and each of the first heating rollers is provided with a first roller heating unit.
於本發明之一實施例中,該等第一加熱滾輪係由石墨、氧化矽陶瓷、氧化鋯陶瓷、石英或鉻鎳鐵合金(Inconel)材料所製成。 In an embodiment of the invention, the first heating rollers are made of graphite, yttria ceramic, zirconia ceramic, quartz or Inconel.
於本發明之一實施例中,該第二運載加熱模組係具有複數第二加熱滾輪,且各該第二加熱滾輪中係設置有一第二滾輪加熱單元。 In an embodiment of the invention, the second carrier heating module has a plurality of second heating rollers, and each of the second heating rollers is provided with a second roller heating unit.
於本發明之一實施例中,該等第二加熱滾輪係由石墨、氧化矽陶瓷、氧化鋯陶瓷、石英或鉻鎳鐵合金(Inconel)材料所製成。 In an embodiment of the invention, the second heating rollers are made of graphite, yttria ceramic, zirconia ceramic, quartz or Inconel.
於本發明之一實施例中,該氣體均佈模組係包括一蒸氣產生單元、一惰性氣體控制單元、一氣體混合單元、一混合氣體裂解加熱單元及一混合氣體分佈單元。該蒸氣產生單元係產生硒蒸氣或硫蒸氣並透過調控壓力來控制硒蒸氣或硫蒸氣之輸出量;該惰性氣體控制單元係可輸出惰性氣體並控制惰性氣體之輸出量;該氣體混合單元係與該蒸氣產生單元及該惰性氣體控制單元相連接,以將該蒸氣產生單元所產生之蒸氣與該惰性氣體控制單元所輸出之惰性氣體混合並輸出;該混合氣體裂解加熱單元係與該氣體混合單元相連接;及該混合氣體分佈單元係與該氣體裂解加熱單元及該第二腔體相連接,並將該混合氣體裂解加熱單元所輸出之氣體均勻分佈於該第二腔體中之玻璃基板上。 In an embodiment of the invention, the gas homogenizing module comprises a vapor generating unit, an inert gas control unit, a gas mixing unit, a mixed gas cracking heating unit and a mixed gas distribution unit. The vapor generating unit generates selenium vapor or sulfur vapor and controls the output of the selenium vapor or sulfur vapor by adjusting the pressure; the inert gas control unit outputs an inert gas and controls the output of the inert gas; the gas mixing unit is coupled to The vapor generating unit and the inert gas control unit are connected to mix and output the vapor generated by the vapor generating unit with the inert gas outputted by the inert gas control unit; the mixed gas cracking heating unit and the gas mixing unit And the mixed gas distribution unit is connected to the gas cracking heating unit and the second cavity, and uniformly distributes the gas outputted by the mixed gas cracking heating unit on the glass substrate in the second cavity; .
於本發明之一實施例中,該氣體回收模組係包括 一吸氣單元、一冷凝單元及一收集單元。該吸氣單元係透過一吸氣通道與該第二腔體相連接,以將該第二腔體中之氣體吸出;該冷凝單元係與該吸氣單元相連接,以使被該吸氣單元所吸出之蒸氣及惰性氣體相互分離;以及該收集單元係與該冷凝單元相連接,以收集分離出之蒸氣及惰性氣體。 In an embodiment of the invention, the gas recovery module includes An air suction unit, a condensation unit and a collection unit. The air suction unit is connected to the second cavity through an air suction passage to suck out the gas in the second cavity; the condensation unit is connected to the air suction unit to be used by the air suction unit The sucked vapor and the inert gas are separated from each other; and the collecting unit is connected to the condensing unit to collect the separated vapor and the inert gas.
於本發明之一實施例中,該第一加熱組係包括複數加熱燈管。 In an embodiment of the invention, the first heating group comprises a plurality of heating lamps.
於本發明之一實施例中,該第二加熱組係包括複數加熱燈管及複數均溫板。 In an embodiment of the invention, the second heating group includes a plurality of heating lamps and a plurality of temperature equalizing plates.
於本發明之一實施例中,更包括一第一絕熱墊,係設置於該第一腔體的內壁上。 In an embodiment of the invention, a first heat insulating mat is further disposed on the inner wall of the first cavity.
於本發明之一實施例中,更包括一第二絕熱墊,係設置於該第二腔體的內壁上。 In an embodiment of the invention, a second heat insulating mat is further disposed on the inner wall of the second cavity.
於本發明之一實施例中,該溫度量測裝置係為非接觸式。 In an embodiment of the invention, the temperature measuring device is non-contact.
於本發明之一實施例中,更包括一第四閘門,係設置於該第二腔體並相對該第三閘門之側面。 In an embodiment of the invention, a fourth gate is further disposed on the second cavity and opposite to the side of the third gate.
藉此,本發明之單片式玻璃基板之硒硫化製程設備藉由二個腔體分別對玻璃基板快速加熱及硒/硫化,因此一方面可以避免該玻璃基板長時間處於軟化點之上之持溫溫度,也可以依製程之需求提高薄膜硒/硫化溫度以降低持溫硒/硫化的時間,達到節能省時之功效;藉由使該玻璃基板於在 該等腔體中來回往復運動,以達到該玻璃基板各處的溫度更為均勻,且在進行硒/硫化作業時能使硒/硫化氣體更均勻的分佈於該玻璃基板;再者,回收之液態硒/硫及惰性氣體可再次利用,進而降低材料成本。 Therefore, the selenium vulcanization process device of the monolithic glass substrate of the present invention rapidly heats and selenizes/vulcanizes the glass substrate by two cavities, so that on the one hand, the glass substrate can be prevented from being above the softening point for a long time. Temperature and temperature, can also increase the film selenium / vulcanization temperature according to the needs of the process to reduce the temperature of selenium / vulcanization, to achieve energy saving and time-saving effect; by making the glass substrate The chambers reciprocate back and forth to achieve a more uniform temperature throughout the glass substrate, and the selenium/sulfidation gas can be more uniformly distributed on the glass substrate during the selenium/sulfurization operation; Liquid selenium/sulfur and inert gases can be reused, reducing material costs.
以上之概述與接下來的詳細說明及附圖,皆是為了能進一步說明本發明達到預定目的所採取的方式、手段及功效。而有關本發明的其他目的及優點,將在後續的說明及圖示中加以闡述。 The above summary, the following detailed description and the accompanying drawings are intended to further illustrate the manner, the Other objects and advantages of the present invention will be described in the following description and drawings.
1‧‧‧玻璃基板 1‧‧‧ glass substrate
10‧‧‧快速熱處理裝置 10‧‧‧Rapid heat treatment unit
100‧‧‧第一腔體 100‧‧‧First cavity
101‧‧‧第一閘門 101‧‧‧The first gate
102‧‧‧第二閘門 102‧‧‧second gate
110‧‧‧第一運載加熱模組 110‧‧‧First Carrier Heating Module
111‧‧‧第一加熱滾輪 111‧‧‧First heating roller
112‧‧‧第一滾輪加熱單元 112‧‧‧First roller heating unit
120‧‧‧第一加熱組 120‧‧‧First heating group
121‧‧‧第一加熱組 121‧‧‧First heating group
130‧‧‧第一絕熱墊 130‧‧‧First insulation mat
20‧‧‧硒硫化持溫裝置 20‧‧‧Selenium vulcanization temperature control device
200‧‧‧第二腔體 200‧‧‧second cavity
201‧‧‧第三閘門 201‧‧‧ third gate
202‧‧‧第四閘門 202‧‧‧fourth gate
210‧‧‧第二運載加熱模組 210‧‧‧Second carrier heating module
211‧‧‧第二加熱滾輪 211‧‧‧Second heating roller
212‧‧‧第二滾輪加熱單元 212‧‧‧Second roller heating unit
220‧‧‧第二加熱組 220‧‧‧second heating group
221‧‧‧加熱燈管 221‧‧‧heating tube
222‧‧‧均溫板 222‧‧‧Wall plate
230‧‧‧氣體均佈模組 230‧‧‧ gas uniform module
231‧‧‧蒸氣產生單元 231‧‧‧Vapor generating unit
232‧‧‧惰性氣體控制單元 232‧‧‧Inert gas control unit
233‧‧‧氣體混合單元 233‧‧‧ gas mixing unit
234‧‧‧混合氣體裂解加熱單元 234‧‧‧ Mixed gas cracking heating unit
235‧‧‧混合氣體分佈單元 235‧‧‧mixed gas distribution unit
2351‧‧‧圓管 2351‧‧‧ round tube
2352‧‧‧平板 2352‧‧‧ tablet
2353‧‧‧主氣孔 2353‧‧‧Main air holes
2354‧‧‧通孔噴氣孔 2354‧‧‧through hole
240‧‧‧氣體回收模組 240‧‧‧ gas recovery module
241‧‧‧吸氣單元 241‧‧‧sucking unit
242‧‧‧冷凝單元 242‧‧‧Condensation unit
243‧‧‧收集單元 243‧‧‧Collection unit
250‧‧‧第二絕熱墊 250‧‧‧Second insulation mat
300‧‧‧腔體連通道 300‧‧‧ cavity connection
301‧‧‧溫度量測裝置 301‧‧‧Temperature measuring device
圖1係為本發明一實施例中之快速熱處理裝置的示意圖。 1 is a schematic view of a rapid thermal processing apparatus in an embodiment of the present invention.
圖2係為本發明一實施例中之硒硫化持溫裝置的示意圖。 2 is a schematic view of a selenium vulcanization temperature holding device according to an embodiment of the present invention.
圖3係為本發明一實施例中之氣體均佈模組的功能方塊圖。 3 is a functional block diagram of a gas uniformity module in accordance with an embodiment of the present invention.
圖4係為本發明一實施例中之混合氣體分佈單元的示意圖。 4 is a schematic view of a mixed gas distribution unit in an embodiment of the present invention.
圖5係為本發明一實施例中之氣體回收模組的功能方塊圖。 FIG. 5 is a functional block diagram of a gas recovery module in accordance with an embodiment of the present invention.
圖6係為本發明一實施例中之快速熱處理裝置與硒硫化持溫裝置的結合示意圖。 6 is a schematic view showing the combination of a rapid thermal processing device and a selenium vulcanization temperature maintaining device according to an embodiment of the present invention.
以下係藉由特定的具體實例說明本發明之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點與功效。 The embodiments of the present invention are described below by way of specific examples, and those skilled in the art can readily appreciate other advantages and functions of the present invention from the disclosure herein.
本發明之單片式玻璃基板之硒硫化製程設備一 實施例中,可依功能將本發明之設備分為兩部分:快速熱處理(RTP)裝置與硒硫化持溫裝置。請參閱圖1,係為本發明一實施例中之快速熱處理(RTP)裝置的示意圖。本發明之快速熱處理裝置10係用於對一玻璃基板1進行均勻化之快速升溫,其目的在提供一可快速對玻璃基板加溫(例如10℃/S)之裝置,並且具備對玻璃基板快速轉站、往復運動之功能。該快速熱處理裝置10具有一第一腔體100、一第一運載加熱模組110及二第一加熱組120、121。 Selenium vulcanization process equipment for monolithic glass substrate of the present invention In an embodiment, the apparatus of the present invention can be divided into two parts according to function: a rapid thermal processing (RTP) apparatus and a selenium sulfide holding temperature apparatus. Please refer to FIG. 1, which is a schematic diagram of a rapid thermal processing (RTP) device in accordance with an embodiment of the present invention. The rapid thermal processing device 10 of the present invention is used for rapidly increasing the temperature of a glass substrate 1 for the purpose of providing a device for quickly heating a glass substrate (for example, 10 ° C / S), and having a fast glass substrate The function of transfer station and reciprocating motion. The rapid thermal processing device 10 has a first cavity 100, a first carrier heating module 110, and two first heating groups 120, 121.
該第一腔體100係具有可活動開啟或關閉的一第一閘門101及一第二閘門102,該第一閘門101及該第二閘門102係分別設置於該第一腔體100中不相鄰的二側面。該第一運載加熱模組110係設置於該第一腔體100中,且該第一運載加熱模組110係設置於該第一閘門101及該第二閘門102之間。該等第一加熱組120、121係設置於該第一腔體100中,且該第一加熱組120係設置於該第一運載加熱模組110之頂側,而該第一加熱組121係設置於該第一運載加熱模組110之底側。 The first cavity 100 has a first gate 101 and a second gate 102 that are movable to open or close. The first gate 101 and the second gate 102 are respectively disposed in the first cavity 100. Two sides of the neighborhood. The first carrier heating module 110 is disposed in the first cavity 100 , and the first carrier heating module 110 is disposed between the first gate 101 and the second gate 102 . The first heating group 120 is disposed in the first cavity 100, and the first heating group 120 is disposed on the top side of the first carrier heating module 110, and the first heating group 121 is The bottom side of the first carrier heating module 110 is disposed.
於製程作業中,本發明之快速熱處理裝置10係可藉由一真空幫浦(圖未示)來使其為一真空狀態,即透過該第一腔體100、該第一閘門101及該第二閘門102來與外界隔絕以形成一氣密空間,其中,該真空狀態係可為一低度真空狀態。該玻璃基板1係可透過該第一閘門101及該第二閘門102來移 入至該第一腔體100中,或由該第一腔體100中移出。 In the process, the rapid thermal processing device 10 of the present invention can be made into a vacuum state by a vacuum pump (not shown), that is, through the first cavity 100, the first gate 101, and the first The two gates 102 are isolated from the outside to form an airtight space, wherein the vacuum state can be a low vacuum state. The glass substrate 1 is movable through the first gate 101 and the second gate 102 The first cavity 100 is inserted into or removed from the first cavity 100.
而於製程作業期間,該玻璃基板1係可被置於該第一運載加熱模組110上,該第一運載加熱模組110可帶動該玻璃基板1進行反覆的往返運動。該第一運載加熱模組110係具有複數第一加熱滾輪111,且各該第一加熱滾輪111中係設置有一第一滾輪加熱單元112,該等第一滾輪加熱單元112係用於對該等第一加熱滾輪111進行加熱,透過均勻加熱該等第一加熱滾輪111,使該等第一加熱滾輪111與該玻璃基板1相接觸之面的溫度以及該玻璃基板1的溫度能夠限制在一定之範圍內。再者,該等第一加熱滾輪111可為耐高溫硒硫化之材料所製成,例如為石墨、氧化矽陶瓷、氧化鋯陶瓷、石英或鉻鎳鐵合金(Inconel)等材料,且外層以電漿披覆陶瓷薄膜藉以提升表面摩擦係數以及維持較低之熱傳導係數。 During the process, the glass substrate 1 can be placed on the first carrier heating module 110. The first carrier heating module 110 can drive the glass substrate 1 to perform repeated reciprocating motion. The first carrier heating module 110 has a plurality of first heating rollers 111, and each of the first heating rollers 111 is provided with a first roller heating unit 112, and the first roller heating units 112 are used for the same. The first heating roller 111 is heated to uniformly heat the first heating roller 111, so that the temperature of the surface of the first heating roller 111 in contact with the glass substrate 1 and the temperature of the glass substrate 1 can be limited to a certain value. Within the scope. Furthermore, the first heating roller 111 can be made of a material resistant to high temperature selenization, such as graphite, yttria ceramic, zirconia ceramic, quartz or Inconel, and the outer layer is made of plasma. The ceramic film is coated to increase the surface friction coefficient and maintain a low heat transfer coefficient.
該等第一加熱組120、121係用於對該玻璃基板1本身以及位於該玻璃基板1之上表面的CIGS薄膜(圖未示)進行加熱。於本實施例中,該等第一加熱組120、121可為加熱燈管,加熱燈管具有較佳之加熱速率,且可選擇地使用特定之加熱燈管,使被選擇地加熱燈管所產生之光源波長,係與該玻璃基板1及位於其上表面的CIGS薄膜的吸收熱能之波長能相互匹配,以增加加熱效率。 The first heating groups 120 and 121 are used to heat the glass substrate 1 itself and a CIGS film (not shown) on the upper surface of the glass substrate 1. In this embodiment, the first heating groups 120, 121 may be heated lamps, the heating lamps have a preferred heating rate, and optionally a specific heating tube is used to selectively heat the tubes. The wavelength of the light source is matched with the wavelength of the absorption heat energy of the glass substrate 1 and the CIGS film located on the upper surface thereof to increase the heating efficiency.
為盡量維持該第一腔體100中之熱能,於該第一腔體100內壁上係可設置有第一絕熱墊130(例如石墨毯),以維 持來該第一腔體100中之溫度。 In order to maintain the thermal energy in the first cavity 100 as much as possible, a first insulating pad 130 (for example, a graphite blanket) may be disposed on the inner wall of the first cavity 100 to The temperature in the first cavity 100 is held.
請參閱圖2,係為本發明一實施例中之硒硫化持溫裝置的示意圖。本發明之硒硫化持溫裝置20,係用於對該玻璃基板1進行均勻化之硒硫化製程,其目的在提供一可對玻璃基板高溫持溫硒硫化之裝置,並且具備對玻璃基板快速轉站、往復運動之功能。該硒硫化持溫裝置20包括一第二腔體200、一第二運載加熱模組210、一第二加熱組220、一氣體均佈模組230及一氣體回收模組240。 Please refer to FIG. 2 , which is a schematic diagram of a selenium vulcanization temperature holding device according to an embodiment of the invention. The selenium vulcanization temperature-holding device 20 of the present invention is a selenium vulcanization process for homogenizing the glass substrate 1, and the object thereof is to provide a device capable of maintaining temperature and selenium vulcanization at a high temperature on a glass substrate, and having a rapid rotation on the glass substrate Station, reciprocating function. The selenium vulcanization temperature holding device 20 includes a second cavity 200, a second carrier heating module 210, a second heating group 220, a gas uniformity module 230, and a gas recovery module 240.
該第二腔體200係具有可活動開啟或關閉的一第三閘門201及可依設計需求而選擇性設置的一第四閘門202。該第二運載加熱模組210係設置於該第二腔體200中,且該第二運載加熱模組210係設置於該第三閘門201及該第四閘門202之間。該第二加熱組220係設置於該第二腔體200中,且該第二加熱組220係設置於該第二運載加熱模組210之頂側及底側。 The second cavity 200 has a third gate 201 that can be actively opened or closed and a fourth gate 202 that can be selectively disposed according to design requirements. The second carrier heating module 210 is disposed in the second cavity 200, and the second carrier heating module 210 is disposed between the third gate 201 and the fourth gate 202. The second heating group 220 is disposed in the second cavity 200, and the second heating group 220 is disposed on the top side and the bottom side of the second carrier heating module 210.
於製程作業中,該硒硫化持溫裝置20亦類似於該快速熱處理裝置10,透過該第二腔體200、該第三閘門201及該第四閘門202來與外界隔絕以形成低度真空狀態的氣密空間。該玻璃基板1係可透過該第三閘門201及該第四閘門202來移入至該第二腔體200中,或由該第二腔體200中移出。 In the process, the selenium vulcanization temperature holding device 20 is also similar to the rapid thermal processing device 10, and is insulated from the outside by the second cavity 200, the third gate 201 and the fourth gate 202 to form a low vacuum state. The airtight space. The glass substrate 1 can be moved into the second cavity 200 through the third gate 201 and the fourth gate 202 or removed from the second cavity 200.
於製程作業期間,該玻璃基板1係可被置於該第二運載加熱模組210上,該第二運載加熱模組210可帶動該玻 璃基板1進行反覆的往返運動。類似於該第一運載加熱模組110,該第二運載加熱模組210亦可具有複數第二加熱滾輪211,且各該第二加熱滾輪211中係設置有一第二滾輪加熱單元212。再者,該等第二加熱滾輪211可為耐高溫硒硫化之材料所製成,例如為石墨、氧化矽陶瓷、氧化鋯陶瓷、石英或鉻鎳鐵合金(Inconel)等材料,且外層以電漿披覆陶瓷薄膜藉以提升表面摩擦係數以及維持較低之熱傳導係數。 During the manufacturing process, the glass substrate 1 can be placed on the second carrier heating module 210, and the second carrier heating module 210 can drive the glass The glass substrate 1 performs a reciprocating motion. Similar to the first carrier heating module 110, the second carrier heating module 210 can also have a plurality of second heating rollers 211, and each of the second heating rollers 211 is provided with a second roller heating unit 212. Furthermore, the second heating roller 211 can be made of a material resistant to high temperature selenization, such as graphite, yttria ceramic, zirconia ceramic, quartz or Inconel, and the outer layer is made of plasma. The ceramic film is coated to increase the surface friction coefficient and maintain a low heat transfer coefficient.
該第二加熱組220係用於對該玻璃基板1本身以及位於該玻璃基板1之上表面的CIGS薄膜(圖未示)進行加熱,該第二加熱組220係包括複數加熱燈管221及複數均溫板222,透過該等加熱燈管221來將該等均溫板222加熱至製程所需求之溫度。再者,於放置該玻璃基板1之該第二腔體200的側面上更可具有反射罩(圖未示)之設計,以補償邊界較低之溫度。值得注意的是,於該第二腔體200內部上方的均溫板222係可具有複數開口,以作為該氣體均佈模組230及該氣體回收模組240的氣體出入口之通道。 The second heating group 220 is used for heating the glass substrate 1 itself and a CIGS film (not shown) on the upper surface of the glass substrate 1. The second heating group 220 includes a plurality of heating lamps 221 and a plurality of The temperature equalizing plate 222 passes through the heating lamps 221 to heat the temperature equalizing plates 222 to the temperature required for the process. Furthermore, a side of the second cavity 200 on which the glass substrate 1 is placed may have a design of a reflective cover (not shown) to compensate for the lower boundary temperature. It should be noted that the temperature equalizing plate 222 above the second cavity 200 can have a plurality of openings as a passage for the gas uniformity module 230 and the gas inlet and outlet of the gas recovery module 240.
為盡量維持該第二腔體200中之熱能,於該第二腔體100內壁上亦可設置有第二絕熱墊250(例如石墨毯),以維持該第二腔體200中之溫度。 In order to maintain the thermal energy in the second cavity 200 as much as possible, a second insulating pad 250 (for example, a graphite blanket) may be disposed on the inner wall of the second cavity 100 to maintain the temperature in the second cavity 200.
請一併參閱圖3,係為本發明一實施例中之氣體均佈模組的功能方塊圖。該氣體均佈模組230係包括一蒸氣產生單元231、一惰性氣體控制單元232、一氣體混合單元233、 一混合氣體裂解加熱單元234及一混合氣體分佈單元235。 Please refer to FIG. 3, which is a functional block diagram of a gas uniformity module according to an embodiment of the present invention. The gas uniformity module 230 includes a vapor generating unit 231, an inert gas control unit 232, and a gas mixing unit 233. A mixed gas cracking heating unit 234 and a mixed gas distributing unit 235.
該蒸氣產生單元231係用於在硒或硫化製程中產生硒蒸氣或硫蒸氣,並透過調控適當之壓力以控制硒或硫蒸氣之輸出量;該惰性氣體控制單元232係透過調控適當之壓力以及流速以控制惰性氣體之輸出量;該氣體混合單元233係與該蒸氣產生單元231及該惰性氣體控制單元232相連接,以將該蒸氣產生單元231所產生之蒸氣與該惰性氣體控制單元232所輸出之惰性氣體混合並輸出;該混合氣體裂解加熱單元234係與該氣體混合單元233相連接,以產生具有高溫裂解之硒蒸氣或硫蒸氣的混合氣體,相較於習知硒硫化製程,透過裂解硒或硫混合惰性氣體於接近大氣壓力之環境下取代真空環境下具毒性之H2Se或H2S之硒化或硫化,使製程作業更具安全性;及該混合氣體分佈單元235係與該氣體裂解加熱單元234及該第二腔體200相連接,並將該混合氣體裂解加熱單元234所輸出之氣體均勻分佈於該第二腔體200中,使具有高溫裂解之硒蒸氣或硫蒸氣的混合氣體以均勻之氣體流量分佈於該玻璃基板1上;其中,該混合氣體分佈單元235之開口形狀以及大小,係可透過CFD運算分析而決定,以使於垂直該玻璃基板1之運動方向上之氣體分佈能夠符合製程需求。 The vapor generating unit 231 is configured to generate selenium vapor or sulfur vapor in a selenium or vulcanization process, and control an appropriate amount of pressure to control the output of selenium or sulfur vapor; the inert gas control unit 232 controls the appropriate pressure and a flow rate to control the output of the inert gas; the gas mixing unit 233 is connected to the vapor generating unit 231 and the inert gas control unit 232 to vaporize the steam generating unit 231 and the inert gas control unit 232 The output inert gas is mixed and output; the mixed gas cracking heating unit 234 is connected to the gas mixing unit 233 to generate a mixed gas of high temperature cracking selenium vapor or sulfur vapor, which is transmitted through a conventional selenium vulcanization process. Separating selenium or sulfur mixed inert gas in place of atmospheric pressure to replace selenization or vulcanization of toxic H 2 Se or H 2 S in a vacuum environment to make process operation more safe; and the mixed gas distribution unit 235 The gas cracking heating unit 234 and the second cavity 200 are connected, and the mixed gas is cracked and the gas output by the heating unit 234 is output. Evenly distributed in the second cavity 200, the mixed gas having the pyrolyzed selenium vapor or sulfur vapor is distributed on the glass substrate 1 at a uniform gas flow rate; wherein the mixed gas distribution unit 235 has an opening shape and size It can be determined by CFD calculation analysis so that the gas distribution in the direction of movement of the glass substrate 1 can conform to the process requirements.
請參閱圖4,係為本發明一實施例中之混合氣體分佈單元的示意圖。該混合氣體分佈單元235係由一圓管2351剖半後與一平板2352組合而成。該圓管2351的上端為一主氣 孔2353,係連接該混合氣體裂解加熱單元234,該圓管2351內設有該平板2352,該平板2352及該圓管2351的下端具有複數個通孔噴氣孔2354,可將硒/硫蒸氣與惰性氣體混氣經由此等通孔噴氣孔2354均勻散佈於該玻璃基板1上。 Please refer to FIG. 4, which is a schematic diagram of a mixed gas distribution unit in an embodiment of the present invention. The mixed gas distribution unit 235 is formed by combining a circular tube 2351 and a flat plate 2352. The upper end of the round tube 2351 is a main gas The hole 2353 is connected to the mixed gas cracking heating unit 234. The flat plate 2351 is provided with the flat plate 2352. The flat plate 2352 and the lower end of the circular tube 2351 have a plurality of through-hole air holes 2354 for selenium/sulfur vapor and The inert gas mixture is uniformly dispersed on the glass substrate 1 through the through-hole air holes 2354.
請一併參閱圖5,係為本發明一實施例中之氣體回收模組的功能方塊圖。該氣體回收模組240係包括一吸氣單元241、一冷凝單元242及一收集單元243。 Please refer to FIG. 5, which is a functional block diagram of a gas recovery module according to an embodiment of the present invention. The gas recovery module 240 includes a getter unit 241, a condensing unit 242, and a collecting unit 243.
該吸氣單元241係透過一吸氣通道(圖未示)與該第二腔體200相連接,以將製程中於該第二腔體200中多餘之硒蒸氣、硫蒸氣及惰性氣體吸出;該冷凝單元242係與該吸氣單元241相連接,以使該吸氣單元241所吸取的硒/硫蒸氣及惰性氣體,利用冷凝方式使該硒/硫蒸氣固化,藉由氣、固相之分離機制來將固態硒/硫以及惰性氣體分別回收利用;以及該收集單元243係與該冷凝單元242相連接,以收集分離出之固態硒及惰性氣體,以供將回收之固態硒及惰性氣體再利用,進而降低材料成本。 The air suction unit 241 is connected to the second cavity 200 through an air suction passage (not shown) to suck out excess selenium vapor, sulfur vapor and inert gas in the second cavity 200 during the process; The condensing unit 242 is connected to the air suction unit 241, so that the selenium/sulfur vapor and the inert gas sucked by the air suction unit 241 are solidified by condensation, by gas and solid phase. Separating mechanism to separately recover solid selenium/sulfur and inert gas; and collecting unit 243 is connected to the condensing unit 242 to collect separated solid selenium and inert gas for solid selenium and inert gas to be recovered Reuse, which in turn reduces material costs.
請參閱圖6,係為本發明一實施例中之快速熱處理裝置與硒硫化持溫裝置的結合示意圖,為清楚顯示本發明之快速熱處理裝置10及硒硫化持溫裝置20之結合關係,因此於圖6中僅示出本發明之部份構件,詳細構件配置可一併參考圖1至圖5。 Please refer to FIG. 6 , which is a schematic diagram of the combination of the rapid thermal processing device and the selenium vulcanization temperature maintaining device according to an embodiment of the present invention, in order to clearly show the combination relationship between the rapid thermal processing device 10 and the selenium vulcanization temperature maintaining device 20 of the present invention. Only some of the components of the present invention are shown in FIG. 6, and the detailed component configurations can be collectively referred to FIGS. 1 through 5.
請參閱圖6,本發明一實施例中係透過一腔體連 通道300,以將該第一腔體100與該第二腔體200相連接,該腔體連通道300的二端係分別連接該第一腔體100的第二閘門102及該第二腔體200的第三閘門201。該腔體連通道300上係設置有一溫度量測裝置301,其中該溫度量測裝置301係為非接觸式。該溫度量測裝置301係可對通過該腔體連通道300之玻璃基板1表面上的薄膜進行即時溫度量測。 Referring to FIG. 6, in an embodiment of the present invention, a cavity is connected through a cavity. a channel 300 for connecting the first cavity 100 to the second cavity 200. The two ends of the cavity connection channel 300 are respectively connected to the second gate 102 and the second cavity of the first cavity 100. The third gate 201 of 200. The cavity connecting channel 300 is provided with a temperature measuring device 301, wherein the temperature measuring device 301 is non-contact. The temperature measuring device 301 can perform an instantaneous temperature measurement on the film on the surface of the glass substrate 1 passing through the cavity connecting passage 300.
一般而言,硒硫化製程會以以下步驟進行:當該第一腔體100的第一閘門101開啟後,該玻璃基板1係透過該第一運載加熱模組110將其導入至該第一腔體100中。關閉該等第一至第四閘門101、102、201以及202;開啟真空抽氣系統(例如一真空幫浦),並當該第一腔體100與該第二腔體200內分別達到低度真空狀態時(例如10-2torr時),開啟該第一腔體100與該第二腔體200之加熱系統(如圖1之第一運載加熱模組110、第一加熱組120及圖2之第二運載加熱模組210、第二加熱組220)。當該玻璃基板1置於低度真空之第一腔體100內的第一運載加熱模組110上後,設置於該等第一加熱滾輪111內部的第一滾輪加熱單元112對該等第一加熱滾輪111進行加熱,而同時該第一加熱組120、121對該玻璃基板1進行快速加熱,期間位於該第一運載加熱模組110下方的第一加熱組121也同時對該等第一加熱滾輪111進行加熱,其目的在使得該等第一加熱滾輪111表面溫度與該玻璃基板1溫度差限制在一定之範圍內。 In general, the selenium vulcanization process is performed by the following steps: when the first gate 101 of the first cavity 100 is opened, the glass substrate 1 is introduced into the first cavity through the first carrier heating module 110. In body 100. Closing the first to fourth gates 101, 102, 201, and 202; opening a vacuum pumping system (eg, a vacuum pump), and achieving a low degree in the first cavity 100 and the second cavity 200, respectively When the vacuum state (for example, 10 -2 torr), the heating system of the first cavity 100 and the second cavity 200 is opened (such as the first carrier heating module 110, the first heating group 120, and FIG. 2 of FIG. 1) The second carrier heating module 210 and the second heating group 220). After the glass substrate 1 is placed on the first carrier heating module 110 in the first cavity 100 of the low vacuum, the first roller heating unit 112 disposed inside the first heating roller 111 is first The heating roller 111 is heated, and at the same time, the first heating group 120, 121 rapidly heats the glass substrate 1, and the first heating group 121 located under the first carrier heating module 110 also simultaneously heats the first heating The roller 111 is heated for the purpose of limiting the temperature difference between the surface temperature of the first heating roller 111 and the glass substrate 1 within a certain range.
於此同時,該第二腔體200之第二加熱組220的加熱燈管221已針對該等均溫板222進行加熱,而設置於該第二運載加熱模組210之第二加熱滾輪211內部的第二滾輪加熱單元212針對該等第二加熱滾輪211進行加熱,且位於該第二運載加熱模組210下方之均溫板222也同時對該第二加熱滾輪211,其目的在使得該第二加熱滾輪211表面溫度與該玻璃基板1溫度差限制在一定之範圍內。 At the same time, the heating lamp tube 221 of the second heating group 220 of the second cavity 200 is heated for the equalizing plate 222, and is disposed inside the second heating roller 211 of the second carrier heating module 210. The second roller heating unit 212 heats the second heating rollers 211, and the temperature equalizing plate 222 located under the second carrier heating module 210 also simultaneously serves the second heating roller 211. The temperature difference between the surface temperature of the heating roller 211 and the glass substrate 1 is limited to a certain range.
當於該第一腔體100中的溫度升溫至一特定溫度後,該第一腔體100的第二閘門102及該第二腔體200的第三閘門201開啟,此時該第一腔體100中之第一運載加熱模組110、該第二腔體200中之第二運載加熱模組210、該玻璃基板1、該第二腔體200中之均溫板222的溫度將處於一定之範圍內。接著,該第一腔體100中之第一運載加熱模組110經由該腔體連通道300而將該玻璃基板1快速運送至該第二腔體200內,並由該第二腔體200之第二運載加熱模組210承接,以使該玻璃基板1可進行於該第二腔體200腔體內之往復運動。當該玻璃基板1送至該第二腔體200腔體後,該第一腔體100的第二閘門102及該第二腔體200的第三閘門201關閉,並各自形成密閉空間,此時,若該製程為一連續製程,該第一腔體100亦可為另一回合之玻璃基板1進行快速加熱。該第二腔體200之持溫硒化製程,如前述由該氣體均佈模組230產生量可控之硒/硫蒸氣混合惰性氣體以高溫與玻璃基板1上之薄膜完成硒/硫化反應 以形成CIGS薄膜。 After the temperature in the first cavity 100 is raised to a specific temperature, the second gate 102 of the first cavity 100 and the third gate 201 of the second cavity 200 are opened, and the first cavity is at this time. The temperature of the first carrying heating module 110, the second carrying heating module 210 of the second cavity 200, the temperature equalizing plate 222 of the glass substrate 1, and the second cavity 200 will be at a certain temperature. Within the scope. Then, the first carrier heating module 110 in the first cavity 100 quickly transports the glass substrate 1 into the second cavity 200 via the cavity connecting channel 300, and the second cavity 200 is The second carrier heating module 210 is received to enable the glass substrate 1 to reciprocate in the cavity of the second cavity 200. After the glass substrate 1 is sent to the cavity of the second cavity 200, the second gate 102 of the first cavity 100 and the third gate 201 of the second cavity 200 are closed, and each forms a sealed space. If the process is a continuous process, the first cavity 100 can also be rapidly heated for another round of the glass substrate 1. The temperature holding selenization process of the second cavity 200, as described above, the selenium/sulfur vapor mixed inert gas controlled by the gas homogenizing module 230 is used to complete the selenium/sulfidation reaction on the glass substrate 1 at a high temperature. To form a CIGS film.
若製程係採多階段硒硫化反應之製程方法時,當該玻璃基板1於該第二腔體200完成第一階段的硒硫化反應後,可依上述方式而被運回至該第一腔體100中以進行第二階段的持續快速熱處理作業,並於溫度達到第二階段所指定之製程溫度後再將該玻璃基板1運送至該第二腔體200中,以續行第二階段的持溫硒硫化反應;或者,當第一階段的硒硫化反應完成後,該玻璃基板1可由該第二腔體200被運送至與該第二腔體200之第四閘門202相連接之其他腔體(圖未示,例如另一組之硒硫化製程設備)中,以進行後續階段的快速熱處理作業及硒硫化反應。 If the process is a multi-stage selenium sulfide reaction process, when the glass substrate 1 completes the first stage of selenization reaction in the second cavity 200, it can be transported back to the first cavity in the above manner. In the 100th, the second stage of the continuous rapid heat treatment operation is performed, and after the temperature reaches the process temperature specified in the second stage, the glass substrate 1 is transported to the second cavity 200 to continue the second stage of the holding process. The temperature selenium sulfide reaction; or, when the first stage selenization reaction is completed, the glass substrate 1 can be transported by the second cavity 200 to other cavities connected to the fourth gate 202 of the second cavity 200. (The figure is not shown, for example, another set of selenium vulcanization process equipment), in order to carry out the rapid heat treatment operation in the subsequent stage and the selenium sulfide reaction.
藉此,本發明之單片式玻璃基板之硒硫化製程設備藉由二個腔體分別對玻璃基板快速加熱及硒/硫化,因此一方面可以避免該玻璃基板長時間處於軟化點之上之持溫溫度,也可以依製程之需求提高薄膜硒/硫化溫度以降低持溫硒/硫化的時間,達到節能省時之功效;藉由使該玻璃基板於在該等腔體中來回往復運動,以達到該玻璃基板各處的溫度更為均勻;再者,回收之液態硒/硫及惰性氣體可再次利用,進而降低材料成本。 Therefore, the selenium vulcanization process device of the monolithic glass substrate of the present invention rapidly heats and selenizes/vulcanizes the glass substrate by two cavities, so that on the one hand, the glass substrate can be prevented from being above the softening point for a long time. Temperature and temperature, can also increase the film selenium / vulcanization temperature according to the needs of the process to reduce the temperature of selenium / vulcanization, to achieve energy saving and time saving; by reciprocating the glass substrate back and forth in the cavity The temperature across the glass substrate is more uniform; in addition, the recovered liquid selenium/sulfur and inert gas can be reused, thereby reducing material costs.
上述之實施例僅為例示性說明本發明之特點及其功效,而非用於限制本發明之實質技術內容的範圍。任何熟習此技藝之人士均可在不違背本發明之精神及範疇下,對 上述實施例進行修飾與變化。因此,本發明之權利保護範圍,應如後述之申請專利範圍所列。 The above-described embodiments are merely illustrative of the features and functions of the present invention, and are not intended to limit the scope of the technical scope of the present invention. Anyone skilled in the art can do so without departing from the spirit and scope of the invention. The above embodiments are modified and changed. Therefore, the scope of protection of the present invention should be as set forth in the scope of the claims described below.
1‧‧‧玻璃基板 1‧‧‧ glass substrate
10‧‧‧快速熱處理裝置 10‧‧‧Rapid heat treatment unit
100‧‧‧第一腔體 100‧‧‧First cavity
110‧‧‧第一運載加熱模組 110‧‧‧First Carrier Heating Module
20‧‧‧硒硫化持溫裝置 20‧‧‧Selenium vulcanization temperature control device
200‧‧‧第二腔體 200‧‧‧second cavity
210‧‧‧第二運載加熱模組 210‧‧‧Second carrier heating module
300‧‧‧腔體連通道 300‧‧‧ cavity connection
301‧‧‧溫度量測裝置 301‧‧‧Temperature measuring device
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| TW104138372A TWI599067B (en) | 2015-11-20 | 2015-11-20 | Monolithic glass substrate selenium sulfide process equipment |
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