TWI598138B - Manufacturing method of golf ball and its products - Google Patents

Description

Golf ball manufacturing method and product thereof

The present invention relates to a method of manufacturing a golf ball and a product thereof, and more particularly to a method of manufacturing a golf ball filled with a wafer module and a battery, and an article thereof.

With the continuous advancement and miniaturization of sensing modules and communication technologies, technologies for real-time positioning and information measurement using wafer modules have been widely used in various fields. For example, when playing golf, if the sensing module or communication module can be assembled in the golf ball, the speed and position of the golf ball can be instantly grasped, which not only helps the player in the weather or the field of vision is not good. Understand the flight path of the golf ball that you have shot, and also find the location of the golf ball in a vast and complex venue. Even some chip modules have built-in buzzer and other prompting devices. When people approach, they will make a sound or other prompts to help people find the ball in the grass or the leeches.

Due to the increasing versatility of the chip modules, many of the chip modules need to be battery-driven to obtain sufficient power to maintain normal operation. Therefore, when the wafer module is enclosed in the golf ball, the chip module is also electrically connected at the same time. The battery is sealed together. However, the aforementioned golf ball is manufactured by hot press forming, and the molding temperature often reaches 150 degrees Celsius or more. Therefore, in the manufacturing process, the battery which is not resistant to high temperature is easily damaged due to direct contact with the high temperature plastic fluid, and may also be mutated. Damage to the wafer module affects normal operation.

Accordingly, it is an object of the present invention to provide a method of manufacturing a golf ball that protects a battery and a wafer module.

Thus, the method of manufacturing the golf ball of the present invention comprises a preparation step, a filling step, a first forming step, and a second forming step.

In the preparation step, a spherical center is formed which surrounds an accommodating space and forms a slit connecting the accommodating space on the surface. In the filling step, a wafer module and a battery electrically connected to the wafer module are inserted into the accommodating space via the slit of the center of the ball. In the first molding step, the center of the sphere is placed in a first molding die, and a sphere layer is formed outside the sphere. In the second molding step, the center of the core coated with the spherical layer is placed in a second molding die, and a spherical shell layer is formed outside the spherical layer to obtain a golf ball.

Another object of the present invention is to provide a golf ball produced by the manufacturing method.

Therefore, the golf ball of the present invention comprises a ball core surrounding an accommodating space, a wafer module disposed in the accommodating space of the ball center, and an electrical space disposed in the accommodating space of the ball center and electrically connected thereto. a battery of the wafer module, a sphere layer covering the core, and a spherical shell covering the sphere layer.

The effect of the invention is that, by inserting the wafer module and the battery into the formed and elastic core, the spherical core can be coated in a manner of hot-pressing the spherical layer and the spherical shell layer. The chip module and the battery function to insulate and protect the battery from variability and damage.

Referring to FIGS. 1 and 2, an embodiment of a method of manufacturing a golf ball 1 of the present invention includes a preparation step 21, a filling step 22, a first forming step 23, and a second forming step 24.

In this preparation step 21, a spherical core 3 having elasticity is prepared. The center of the core 3 surrounds an accommodating space 31, and a slit 32 that communicates with the accommodating space 31 is formed on the surface. In this embodiment, the material of the core 3 is selected from the group consisting of epoxy resin (Epoxy) or rubber, and has been formed into a spherical shape.

Referring to FIG. 1 and FIG. 3, in the filling step 22, a wafer module 41 and a battery 42 electrically connected to the wafer module 41 are inserted into the accommodating space 31 via the slit 32 of the core 3, Since the core 3 has elasticity, the slit 32 can be sized to pass the wafer module 41 and the battery 42 and the semiconductor module 41 and the battery 42 are placed in the housing. After the space 31 is no longer applied to the core 3, the slit 32 is closed, and the wafer module 41 and the battery 42 are encapsulated in the core 3, and the accommodating space 31 is matched with the wafer module. 41 and the size of the battery 42 such that the center of gravity of the core 3, the die module 41, and the battery 42 coincide with the centroid of the core 3, that is, the wafer module 41 and the battery 42 are located therein. At the center of the center of the ball 3.

Referring to FIG. 1 and FIG. 4, in the first molding step 23, the core 3 in which the wafer module 41 and the battery 42 are packaged are placed in a first molding die 5, and the first molding die 5 includes a first molding die 5 a first upper mold body 51, a first lower mold body 52, and a plurality of first ejector pins 53 movably respectively disposed on the first upper mold body 51 and the first lower mold body 52, and a first thimble 53 disposed at the first upper mold body 51 The first guide groove 54 in the upper mold body 51. The first upper mold body 51 and the first lower mold body 52 define a first molding space 55 that communicates with the first flow guiding groove 54. Inserting the core 3 into the first molding space 55 and fixing the core 3 to the center of the first molding space 55 by the first ejector pins 53, so that the core 3 and the first upper mold body A gap is formed between the 51 and the first lower mold body 52, and then a plastic is heated to a semi-fluid shape, and then injected into the first flow guiding groove 54, so that the plastic is injected into the gap to form a spherical spherical layer 6 To cover the core 3 . In this embodiment, the spherical layer 6 has a lower melting point than the core 3, and the material thereof is selected from rubber or polymeric materials (Ionomer).

Referring to FIG. 1 , FIG. 5 , and FIG. 6 , in the second molding step 24 , the core 3 coated with the spherical layer 6 is placed in a second molding die 7 , and the second molding die 7 includes a first molding die 7 . a second upper mold body 71, a second lower mold body 72, a plurality of second ejector pins 73 that are movably respectively disposed to the second upper mold body 71 and the second lower mold body 72, and a second thimble 73 The second guide groove 74 in the upper mold body 71. The second upper mold body 71 and the second lower mold body 72 define a second molding space 75 that communicates with the second flow guiding groove 74. The spherical core 3 covered with the spherical layer 6 is placed in the second molding space 75, and the spherical layer 6 is fixed to the center of the second molding space 75 by the second ejector pins 73, so that the spherical layer 6 is A gap is formed between the second upper mold body 71 and the second lower mold body 72, and then a plastic is heated to a semi-fluid shape, and then injected into the second flow guiding groove 74 to form the plastic into the gap to form a gap. A spherical spherical shell layer 8 is coated to cover the sphere layer 6, and after being molded by cooling, a golf ball 1 as shown in Fig. 6 is obtained. In this embodiment, the material of the spherical shell layer 8 is selected from a polymer polymeric material (Ionomer) or a thermoplastic polyurethane (TPU).

Since the melting point of the core 3 is higher than that of the sphere layer 6, by encapsulating the wafer module 41 and the battery 42 in the core 3, heat insulation and protection can be generated to avoid the first molding. In step 23, the high temperature plastic directly contacts the battery 42 to cause variation and damage, and the wafer module 41 can also be protected from damage during the manufacturing process and affect the normal operation of the function. In addition, through the arrangement of the accommodating space 31, the wafer module 41 and the battery 42 are located at the center of the golf ball 1, so that the center of gravity of the golf ball 1 can coincide with the centroid without being offset, and the flight time is maintained. Stability.

In summary, the wafer module 41 and the battery 42 are covered by the core 3, which can be prevented from being directly damaged by the high temperature plastic during the manufacturing process, and can be insulated to prevent the battery 42 from being overheated. High and mutated, it is indeed possible to achieve the object of the present invention.

However, the above is only the embodiment of the present invention, and the scope of the invention is not limited thereto, and all the equivalent equivalent changes and modifications according to the scope of the patent application and the patent specification of the present invention are still The scope of the invention is covered.

1‧‧‧ golf
21‧‧‧Preparation steps
22‧‧‧ Filling steps
23‧‧‧First molding step
24‧‧‧Second molding step
3‧‧‧ ball heart
31‧‧‧ accommodating space
32‧‧‧ slitting
41‧‧‧ wafer module
42‧‧‧Battery
5‧‧‧First molding die
51‧‧‧First upper phantom
52‧‧‧First lower phantom
53‧‧‧First thimble
54‧‧‧First guide channel
55‧‧‧First molding space
6‧‧‧sphere layer
7‧‧‧Second molding die
71‧‧‧Second upper phantom
72‧‧‧Second lower phantom
73‧‧‧Second thimble
74‧‧‧Second guide channel
75‧‧‧Second molding space
8‧‧‧Spherical shell

The other features and advantages of the present invention will be apparent from the embodiments of the present invention. FIG. 1 is a flow chart illustrating an embodiment of a method of manufacturing a golf ball of the present invention; FIG. 2 is a cross-sectional view. A preparation step in the embodiment is illustrated; FIG. 3 is a schematic view showing a filling step in the embodiment; FIG. 4 is a schematic view showing a first molding step in the embodiment; FIG. A second molding step in the present embodiment will be described; and Fig. 6 is a cross-sectional view showing the golf ball produced by the manufacturing method.

21‧‧‧Preparation steps

22‧‧‧ Filling steps

23‧‧‧First molding step

24‧‧‧Second molding step

Claims (9)

A method for manufacturing a golf ball, comprising: a preparation step of preparing a spherical core, the spherical core surrounding an accommodating space, and forming a slit connecting the accommodating space on the surface; Inserting a chip module and a battery electrically connected to the chip module into the accommodating space through a slit of the center of the ball; a first forming step of placing the center of the ball in a first molding die, and Forming a spherical layer outside the spherical core; and a second forming step of placing the spherical core coated with the spherical layer in a second molding die, and forming a spherical shell layer outside the spherical layer. To make a golf ball. The method of manufacturing a golf ball according to claim 1, wherein in the first molding step, a melting point of the spherical layer is lower than the center of the sphere. The method of manufacturing a golf ball according to claim 1, wherein in the filling step, the center of gravity of the center of the core, the wafer module, and the center of the battery coincide with the centroid of the center of the ball. The method of manufacturing a golf ball according to claim 1, wherein in the preparing step, the material of the center of the sphere is selected from the group consisting of epoxy resin or rubber. The method of manufacturing a golf ball according to claim 1, wherein in the first molding step, the material of the spherical layer is selected from a rubber or a polymeric material. The method of manufacturing a golf ball according to claim 1, wherein in the second molding step, the material of the spherical shell layer is selected from a polymeric material or a thermoplastic polyurethane. The method of manufacturing a golf ball according to claim 1, wherein in the second molding step, a plastic is heated to a semi-fluid shape, and then injected into the second molding die to coat the spherical layer to form a plastic ball. The spherical shell layer. A golf ball manufactured by the manufacturing method of claim 1, comprising: a ball center surrounding an accommodating space; a wafer module disposed in the accommodating space of the ball center; a battery disposed on the ball The core is disposed in the space and electrically connected to the wafer module; a spherical layer covering the center of the sphere; and a spherical shell covering the spherical layer. The golf ball according to claim 8, wherein the center of the sphere, the wafer module, and the center of gravity of the battery coincide with the centroid of the center of the sphere.