TWI598017B - Housing of electronic product and manufacturing method thereof - Google Patents

Description

Electronic product housing and method of manufacturing same

The invention relates to a product housing, in particular to an electronic product housing and a manufacturing method thereof.

According to the current society, with the rapid development of electronic technology, various electronic products, such as hand-held products and wearable products, are constantly being updated. Accordingly, accessories used in electronic products are constantly being improved to meet the development needs of electronic products. As we all know, the electronic product housing is one of the important accessories for electronic products. An existing electronic product housing includes a base body and a base. After the base body is injection molded, electroplating is further performed to form a metal plating layer on the surface of the substrate. The base body and the base are integrally combined by a bonding process.

However, the electronic product casing is integrated by the bonding process to reduce the waterproof performance. At the same time, the substrate is made of a plastic material, and the metal plating layer is difficult to form on the surface of the substrate. Therefore, the surface of the electronic product casing has worse wear resistance and corrosion resistance, thereby affecting the appearance gloss of the electronic product casing.

The main object of the present invention is to provide an electronic product casing having a good appearance gloss and a method of manufacturing the same, in view of the above-mentioned drawbacks of the prior art.

To achieve the above object, the present invention provides an electronic product housing and a method of manufacturing the electronic product housing. The electronic product housing includes a base body and a metal plating layer. The base body includes an upper cover, a lower cover and a metal ring. The upper cover and the lower cover are welded together by an ultra high frequency technique, and the metal ring is implanted between the upper cover and the lower cover. The metal plating layer is formed on the surface of the substrate. The metal plating layer comprises a chemical nickel layer formed on the surface of the substrate, a copper layer formed on the chemical nickel layer, a nano nickel layer formed on the copper layer, and a surface formed on the nano nickel layer. Decorative layer.

The method of manufacturing the electronic product housing is applied to manufacturing an electronic product housing. The manufacturing method of the electronic product casing comprises the steps of: arranging a metal ring between the upper cover and the lower cover; the upper cover and the lower cover are welded together by ultra-high frequency technology, and the metal ring is embedded in the metal ring Between the upper cover and the lower cover; electroless plating of the electroless nickel layer of the metal plating on the surface of the substrate to metallize the substrate; electroplating the copper layer of the metal plating on the electroless nickel layer; and plating the metal layer formed of the nano nickel particles The nano nickel layer is electroplated on the copper layer; the surface decorative layer of the metal plating layer is plated on the nano nickel layer; and the substrate having the metal plating layer is cut into at least one mounting hole by laser cutting technology.

In summary, the electronic product casing of the present invention fuses the upper cover and the lower cover into one body by ultra-high frequency technology, so that the upper cover and the lower cover are completely tightly combined to enhance the waterproof performance of the base body, and at the same time, the metal ring is implanted. Between the upper cover and the lower cover, the current conduction characteristics of the substrate can be enhanced, so that the metal plating layer is easily formed on the surface of the substrate. Moreover, the metal plating layer comprises a nano nickel layer formed of nano nickel particles, so that the surface of the electronic product casing is denser and has better wear resistance and corrosion resistance, so as to ensure that the electronic product casing has an integral molding. The appearance of the electronic product housing has a good appearance gloss.

100‧‧‧Electronic product housing 10‧‧‧Base 11‧‧‧Top cover 111‧‧‧First storage trough 112‧‧‧Window area 12‧‧‧Under cover 121‧‧‧Second storage trough 122‧‧‧ Mounting hole 13‧‧‧Metal ring 14‧‧‧Enclosed space 20‧‧‧Metal plating 200‧‧‧Electronic device 201‧‧‧Key 21‧‧‧Chemical nickel layer 22‧‧‧ Copper layer 23‧‧‧ Rice nickel layer 24‧‧‧ surface decorative layer 30‧‧‧ plating bath

The first figure is a perspective view of the electronic product housing of the present invention.
The second figure is a partial exploded view of the electronic product housing shown in the first figure.
The third figure is a cross-sectional view of the electronic product housing shown in the first figure.
The fourth figure is a schematic view of the electronic product housing shown in the first figure placed in the plating tank.
The fifth figure is a schematic view of the metal plating of the electronic product casing shown in the first figure formed on the substrate.
The sixth figure is a perspective view of the electronic product housing shown in the first figure applied to an electronic device.

In order to explain the technical contents, structural features, objects and effects of the present invention in detail, the embodiments are described in detail below with reference to the drawings.

Referring to the first and fifth figures, the electronic product housing 100 of the present invention includes a base 10 and a metal plating layer 20. The metal plating layer 20 is formed on the surface of the substrate 10. The metal plating layer 20 includes a chemical nickel layer 21 formed on the surface of the substrate 10, a copper layer 22 formed on the chemical nickel layer 21, a nano nickel layer 23 formed on the copper layer 22, and a layer formed on the copper layer 22. A surface decorative layer 24 on the nano nickel layer 23.

Referring to the first, second and third figures, the substrate 10 is made of electroplated acrylonitrile-butadiene-Styrene (ABS) plastic material. The base 10 includes an upper cover 11, a lower cover 12 and a metal ring 13. The metal ring 13 is a closed copper ring. A first receiving slot 111 is defined in the middle of the upper cover 11 . A second receiving slot 121 is defined in the middle of the lower cover 12 . The upper cover 11 and the lower cover 12 are disposed opposite to each other, and the first receiving slot 111 and the second receiving slot 121 form an accommodating space 14 . The metal ring 13 is sleeved on the upper portion of the periphery of the lower cover 12. The upper cover 11 is disposed above the lower cover 12 and covers the lower cover 12 such that the metal ring 13 is disposed between the upper cover 11 and the lower cover 12. The upper cover 11 and the lower cover 12 are integrally welded by the ultra-high frequency technology, so that the upper cover 11 and the lower cover 12 are completely adhered to enhance the waterproof performance of the base 10, and the metal ring 13 is embedded in the upper cover 11 and the lower cover 12 Between the covers 12, the current conduction characteristics of the substrate 10 can be enhanced.

Referring to the sixth figure, the electronic product housing 100 can be applied to an electronic device 200. The electronic device 200 has at least one button 201. The electronic device 200 can be a handheld product or a wearable product. The lower cover 12 defines at least one mounting hole 122. Specifically, one side wall of the lower cover 12 is provided with two mounting holes 122 disposed in front and rear. The mounting holes 122 may be disposed in different shapes. Preferably, the two mounting holes 122 are respectively disposed in a circular shape and a rectangular shape. The button 201 is disposed in the mounting hole 122. The upper cover 11 is provided with a window area 112 for mounting a screen (not shown) of the electronic device 200.

Referring to the first and fifth figures, the chemical nickel layer 21 is formed on the surface of the substrate 10 by electroless plating to metallize the substrate 10. Specifically, the substrate 10 is brought into contact with an electroless nickel plating solution containing a metal salt and a reducing agent. The metal salt may be one or more of a water-soluble hydrochloride salt and a sulfate salt of a metal. The water-soluble hydrochloride salt is preferably nickel chloride. The sulfate is preferably nickel sulfate. The reducing agent may be one or more of hypophosphite and borohydride. The hypophosphite is preferably a mixture of sodium hypophosphite, potassium hypophosphite or sodium hypophosphite and potassium hypophosphite. The borohydride is preferably sodium borohydride.

Referring to the first and fifth figures, the copper layer 22 is plated on the chemical nickel layer 21. Specifically, the substrate 10 having the chemical nickel layer 21 is immersed in a copper plating solution as a cathode, metallic copper or other insoluble material is used as an anode, and after a direct current power source is turned on, copper ions are reduced on the surface of the chemical nickel layer 21 of the substrate 10. Copper layer 22. The copper plating solution is a solution containing copper ions.

Referring to the first, fourth and fifth figures, the nano nickel layer 23 is electroplated on the copper layer 22. The nano nickel layer 23 is formed of nano nickel particles, which can make the surface of the electronic product casing 100 denser and have better wear resistance and corrosion resistance on the surface, and the nanometer The diameter of the nickel particles is nanometer. Specifically, the substrate 10 having the chemical nickel layer 21 and the copper layer 22 is plated in a plating bath 30 with a bath, wherein the substrate 10 having the chemical nickel layer 21 and the copper layer 22 serves as the plating bath 30. The cathode, the pure nickel target is used as the anode of the plating tank 30, and the bath in the plating tank 30 is a solution containing nickel ions, and the bath temperature can be 40-80 ° C. During the electroplating process, the pure nickel target of the anode is electrolyzed. The sized nickel ions are deposited on the surface of the copper layer 22 of the base 10 of the cathode, and are sequentially arranged in a layered nano nickel layer 23. The nano nickel layer 23 of the metal plating layer 20 provides the electronic product housing 100 with an integrally formed appearance.

Referring to the first and fifth figures, the surface decoration layer 24 is plated on the nano nickel layer 23. The surface decoration layer 24 may be a white chromium layer, a black chromium layer, a gold layer, a palladium layer, a nickel layer or a ternary alloy layer. Wherein, the ternary alloy is an alloy of copper, tin and zinc.

Referring to the first and fifth figures, when the white chromium layer is plated on the nano nickel layer 23, the substrate 10 having the nano nickel layer 23 is immersed in a white chromium plating solution as a cathode, and the insoluble material can serve as an anode. After the DC power source is turned on, the chromium ions are reduced on the surface of the nano nickel layer 23 of the substrate 10 to form a white chromium plating layer. The white chromium plating solution is a solution containing chromium ions.

Referring to the first and fifth figures, when the black chrome layer is plated on the nano nickel layer 23, the substrate 10 having the nano nickel layer 23 is immersed in a black chrome plating solution as a cathode, and the insoluble material can serve as an anode. After the DC power source is turned on, chromium ions or the like are reduced on the surface of the nano nickel layer 23 of the substrate 10 to form a black chrome plating layer. The black chrome plating solution may be a chromic acid-acetic acid type plating solution, a chromic acid-fluoride type plating solution or other types of plating liquid. Among them, the plating solution in other types is preferably a chromic acid-nitrate-boric acid type plating solution.

Referring to the first and fifth figures, when the gold layer is electroplated on the nano nickel layer 23, the substrate 10 having the nano nickel layer 23 is immersed in a gold plating solution as a cathode, and the insoluble material can be used as an anode. After passing through the DC power source, monovalent gold ions are reduced on the surface of the nano nickel layer 23 of the substrate 10 to form a gold plating layer. The gold plating solution is a solution containing monovalent gold ions.

Referring to the first and fifth figures, when the palladium layer is electroplated on the nano nickel layer 23, the substrate 10 having the nano nickel layer 23 is immersed in a palladium plating solution as a cathode, and the metal titanium coated ruthenium The alloy plate can be used as an anode. After the DC power source is turned on, palladium ions are reduced on the surface of the nano nickel layer 23 of the substrate 10 to form a palladium plating layer. The palladium plating solution may be a solution containing palladium ions.

Referring to the first and fifth figures, when the nickel layer is electroplated on the nano nickel layer 23, after the nano nickel layer 23 is activated with a dilute acid, the substrate 10 having the nano nickel layer 23 is immersed in the nickel plating solution. As a cathode, metallic nickel or an insoluble material can be used as an anode. After the direct current power source is turned on, nickel ions are reduced on the surface of the nano nickel layer 23 of the substrate 10 to form a nickel plating layer. The nickel plating solution may be a solution containing nickel ions.

Referring to the first and fifth figures, when the ternary alloy layer is electroplated on the nano nickel layer 23, the substrate 10 having the nano nickel layer 23 is immersed in the ternary alloy plating solution as a cathode, and the insoluble material may be As the anode, after the DC power source is turned on, copper ions, tin ions, and zinc ions are reduced on the surface of the nano nickel layer 23 of the substrate 10 to form a ternary alloy plating layer. The ternary alloy plating solution may be a solution containing copper ions, tin ions, and zinc ions.

The surface of the metal plating layer 20 can reach a hardness of 2H. The metal plating layer 20 has a thickness of 25 μm.

Referring to FIG. 1 to FIG. 6 , a manufacturing method of an electronic product casing is applied to manufacturing an electronic product casing 100. The manufacturing method of the electronic product casing includes the following steps:

The metal ring 13 is disposed between the upper cover 11 and the lower cover 12;

The upper cover 11 and the lower cover 12 are integrally welded by an ultra-high frequency technology, and the metal ring 13 is embedded between the upper cover 11 and the lower cover 12;

Electroless nickel layer 21 of metal plating layer 20 is electrolessly plated on the surface of substrate 10 to metallize substrate 10;

The copper layer 22 of the metal plating layer 20 is electroplated on the chemical nickel layer 21;

Depositing a nano nickel layer 23 of the metal plating layer 20 formed of nano nickel particles on the copper layer 22;

The surface decoration layer 24 of the metal plating layer 20 is plated on the nano nickel layer 23;

The substrate 10 having the metal plating layer 20 is cut into at least one mounting hole 122 by a laser cutting technique.

Preferably, in the method of manufacturing the electronic product casing of the present invention, before the metallization of the substrate 10, a step of pretreating the surface of the substrate 10 is further included. The pretreatment includes degreasing, roughening, neutralization, and activation.

The degreasing system scrubs the surface of the substrate 10 with a degreasing liquid to remove dirt such as oil traces on the surface of the substrate 10, and ensures that the surface of the substrate 10 is clean and free of oil, thereby facilitating uniform roughening of the surface of the substrate 10, and extending the subsequent coarseness. The service life of the roughening liquid used in the chemical step.

The purpose of the roughening is to increase the hydrophilicity of the surface of the substrate 10 and to form a microporous surface on the surface of the substrate 10 to ensure proper roughness of the surface of the substrate 10 to ensure good adhesion of the metal plating layer 20. The degreased substrate 10 is immersed in a roughening liquid for roughening. The roughening liquid may be a mixture of chromic anhydride and sulfuric acid in an appropriate ratio to form a strongly corrosive chromic acid. The roughening temperature can be from 60 to 70 °C.

The neutralization function is to remove the coarsening liquid remaining on the surface of the substrate 10 to prolong the service life of the subsequently used activation liquid. The neutralization can be carried out using various acid solutions, and the neutralization temperature can be room temperature.

The activation system provides a catalytic support for subsequent electroless nickel plating in order to uniformly adsorb the activator colloid on the surface of the microporous substrate 10 after roughening. The activation includes a pre-dip, a colloidal palladium activation, and a degumming step, and the pre-dip and colloidal palladium activation steps can be combined.

The prepreg is immersed in the prepreg, the prepreg can remove some impurities on the substrate 10, buffer the activation liquid, and prevent the hydrochloric acid in the activation solution from being diluted after activation. The destructive hydrolysis caused by the colloid on the surface of the substrate 10 directly contacting the neutral water on the surface of the substrate 10. The prepreg may be a mixed solution of a tin salt and hydrochloric acid, and the tin salt may be stannous chloride, stannous sulfate or a mixture of stannous chloride and stannous sulfate. The prepreg temperature can be room temperature.

The colloidal palladium activation system directly immerses the pre-impregnated substrate 10 into an activation solution, which may be a mixed solution of palladium chloride, hydrochloric acid and a tin salt in the prepreg. The temperature of the activation liquid may be 35 to 45 °C.

The core of the colloid adsorbed on the surface of the substrate 10 is a metal palladium and a cluster of divalent tin. In the case of water washing, it is easy to hydrolyze the divalent tin into a gel, and the palladium is tightly wrapped therein so that the catalytic action of palladium is not reflected. Therefore, the purpose of the degumming is to remove the pre-dip salt bis-valent tin remaining on the surface of the micelle, and expose the activator palladium to become a catalytic active point of electroless nickel plating. The degumming solution is generally an aqueous solution of hydrochloric acid, and the degumming temperature may be 35 to 45 °C.

Preferably, after each step described above, the electroplating method of the present invention may further comprise a step of washing to remove a solution remaining on the surface of the substrate 10, the water used in the water washing step may be deionized water, distilled water, purified water, or A mixture of deionized water, distilled water, and purified water.

Preferably, the window region 112 of the electronic device 200 can be defined before the upper cover 11 and the lower cover 12 are welded together.

In summary, the electronic product casing 100 of the present invention integrally integrates the upper cover 11 and the lower cover 12 by ultra-high frequency technology, so that the upper cover 11 and the lower cover 12 are completely adhered to enhance the waterproof performance of the base 10, and at the same time, The metal ring 13 is embedded between the upper cover 11 and the lower cover 12 to enhance the current conduction characteristics of the substrate 10 so that the metal plating layer 20 is easily formed on the surface of the substrate 10. Moreover, the metal plating layer 20 includes a nano nickel layer 23 formed of nano nickel particles to make the surface of the electronic product casing 100 denser and has better wear resistance and corrosion resistance to ensure the electronic product casing 100. It has an appearance as an integral molding, so that the electronic product casing 100 has a good appearance gloss.

100‧‧‧Electronic housing

20‧‧‧Metal plating

10‧‧‧ base

22‧‧‧ copper layer

21‧‧‧Chemical nickel layer

24‧‧‧Surface decorative layer

23‧‧‧Nano nickel layer

Claims (20)

An electronic product housing comprising:
a substrate comprising an upper cover, a lower cover and a metal ring, wherein the upper cover and the lower cover are integrally welded by an ultra-high frequency technology, and the metal ring is embedded between the upper cover and the lower cover; and a metal plating layer, Formed on the surface of the substrate, the metal plating layer comprises a chemical nickel layer formed on the surface of the substrate, a copper layer formed on the chemical nickel layer, a nano nickel layer formed on the copper layer, and a nano-formed layer formed on the copper layer A decorative layer on the surface of the nickel layer. The electronic product casing of claim 1, wherein the chemical nickel layer is formed on the surface of the substrate by electroless plating to metallize the substrate. The electronic product casing of claim 1, wherein the copper layer is electroplated on the chemical nickel layer. The electronic product casing of claim 1, wherein the nano nickel layer is electroplated on a copper layer, the nano nickel layer is formed of nano nickel particles, and the diameter of the nano nickel particles is Nano class. The electronic product casing of claim 1, wherein the surface decorative layer is plated on the nano nickel layer, and the surface decorative layer may be a white chromium layer, a black chromium layer, a gold layer, a palladium layer, a nickel layer or a ternary alloy layer, wherein the ternary alloy is an alloy of copper, tin and zinc. The electronic product casing according to claim 1, wherein the substrate is an Acrylonitrile-Butadiene-Styrene (ABS) plastic material which can be plated. The electronic product casing of claim 1, wherein the metal ring is a closed copper ring. The electronic product casing of claim 1, wherein the metal plating surface can reach a hardness of 2H. The electronic product casing of claim 1, wherein the metal plating layer has a thickness of 25 μm. The electronic product casing of claim 1, wherein the upper cover has a first receiving groove extending downwardly from the middle of the upper cover, and a second receiving groove is formed through the middle of the lower cover, the upper cover and the lower cover. The first receiving slot and the second receiving slot form an accommodating space. The electronic product casing of claim 1, wherein the electronic product casing is applicable to an electronic device, the electronic device has at least one button, and the lower cover is provided with at least one mounting hole. The button is placed in the mounting hole. A method for manufacturing an electronic product casing is used for manufacturing an electronic product casing, the electronic product casing comprising a base body and a metal plating layer formed on the surface of the base body, the base body comprising an upper cover, a lower cover and a metal ring The manufacturing method of the electronic product casing includes the following steps:
Locating a metal ring between the upper cover and the lower cover;
The upper cover and the lower cover are integrally welded by an ultra-high frequency technology, and the metal ring is embedded between the upper cover and the lower cover;
Electrolessly plating a layer of electroless nickel on the metal plating layer on the surface of the substrate to metallize the substrate;
Electroplating a copper layer of the metal plating on the chemical nickel layer;
Depositing a nano nickel layer of a metal plating layer formed of nano nickel particles on the copper layer;
A surface decorative layer of the metal plating layer is plated on the nano nickel layer; and the substrate having the metal plating layer is cut into at least one mounting hole by a laser cutting technique. The method of manufacturing an electronic product casing according to claim 12, wherein the nano nickel particles have a diameter of a nanometer. The method for manufacturing an electronic product casing according to claim 12, wherein the surface decorative layer may be a white chromium layer, a black chromium layer, a gold layer, a palladium layer, a nickel layer or a third layer. a metaalloy layer, wherein the ternary alloy is an alloy of copper, tin and zinc. The method for manufacturing an electronic product casing according to claim 12, wherein the substrate is an Acrylonitrile-Butadiene-Styrene (ABS) plastic material that can be plated. The method of manufacturing an electronic product casing according to claim 12, wherein the metal ring is a closed copper ring. The method of manufacturing an electronic product casing according to claim 12, wherein the surface of the metal plating layer can reach a hardness of 2H. The method of manufacturing an electronic product casing according to claim 12, wherein the metal plating layer has a thickness of 25 μm. The manufacturing method of the electronic product casing of claim 12, wherein the upper cover has a first receiving groove extending downwardly from the middle portion, and a second receiving groove is formed in the middle of the lower cover. The accommodating space is formed in the first receiving slot and the second receiving slot. The method of manufacturing an electronic product casing according to claim 12, wherein the electronic product casing is applicable to an electronic device, the electronic device has at least one button, and the lower cover is provided with at least one installation. a hole, the button is disposed in the mounting hole.