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TWI596215B - A fine tantalum powder and its preparation method - Google Patents

A fine tantalum powder and its preparation method Download PDF

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TWI596215B
TWI596215B TW104140950A TW104140950A TWI596215B TW I596215 B TWI596215 B TW I596215B TW 104140950 A TW104140950 A TW 104140950A TW 104140950 A TW104140950 A TW 104140950A TW I596215 B TWI596215 B TW I596215B
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powder
tantalum powder
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fine
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TW201643264A (en
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李仲香
程越偉
馬躍忠
陳學清
王葶
師德軍
李霞
童澤堃
張洪剛
趙忠環
魏軍祥
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寧夏東方鉭業股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00Making metallic powder or suspensions thereof
    • B22F9/02Making metallic powder or suspensions thereof using physical processes
    • B22F9/04Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling

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Description

一種微細鉭粉及其製備方法 Microfine powder and preparation method thereof

本發明涉及稀有金屬冶煉領域,涉及鉭粉末的加工技術,特別地涉及微細鉭粉末的製作方法。 The invention relates to the field of rare metal smelting, relates to the processing technology of bismuth powder, and in particular to a method for preparing fine bismuth powder.

近年來,半導體技術飛躍發展,開發出了各種各樣的電子裝置。半導體技術要求電子裝置的小型化,使集成程度提高,在很多工序中需要採用薄膜形成製程。鉭用作濺射膜的需求量也相應地逐漸增加,特別是在積體電路中在矽和銅導體之間作為擴散阻擋層。濺射靶的生產方法包括錠冶金法(I/M法)和粉末冶金法(P/M法)。常用的靶一般選用鉭錠製成。但在某些特殊情況(例如要求高的情況)下I/M法不能使用,只能用粉末冶金法做靶。例如:鉭矽合金靶,這是因為鉭和矽的熔點不同及矽化合物的韌性低等原因而不能使用I/M法。與I/M法相比,P/M法熱加工過程不能使晶粒尺寸變細,所以在一開始所用原料就要求具有所希望的晶粒尺寸,而靶中的晶粒越均勻越細得到的膜越均勻。靶的性能直接影響到濺射膜的性能,對於低密度的靶,濺射時不可避免地發生各種問題。例如,從濺射靶飛散出的粒子群集附在晶片上,是晶片上的佈線迴路出現斷路等重大問題的原因。如果靶的密度提高,在濺射時粒子就會大大減少,而要想提高鉭靶的密度,採用原料鉭粉末就應當細微性細,鬆裝密度大。 In recent years, semiconductor technology has developed rapidly and various electronic devices have been developed. Semiconductor technology requires miniaturization of electronic devices to increase integration, and a film formation process is required in many processes. The demand for ruthenium as a sputter film is correspondingly increasing, especially as a diffusion barrier between the ruthenium and the copper conductor in the integrated circuit. The production method of the sputtering target includes an ingot metallurgy method (I/M method) and a powder metallurgy method (P/M method). Commonly used targets are generally made of bismuth ingots. However, in some special cases (such as high requirements), the I/M method cannot be used, and only powder metallurgy can be used as a target. For example, a bismuth alloy target cannot be used because of the difference in melting point of bismuth and bismuth and the low toughness of bismuth compound. Compared with the I/M method, the P/M method can not make the grain size thinner, so the raw materials used at the beginning need to have the desired grain size, and the more uniform and finer the grains in the target are obtained. The more uniform the film. The performance of the target directly affects the performance of the sputtered film, and for low-density targets, various problems inevitably occur during sputtering. For example, the cluster of particles scattered from the sputtering target is attached to the wafer, which is a cause of major problems such as disconnection of the wiring loop on the wafer. If the density of the target is increased, the particles are greatly reduced during sputtering, and in order to increase the density of the target, the raw material 钽 powder should be fine and fine, and the bulk density is large.

一般來說,難熔金屬很難燒結到很高的密度,為了增加燒結體的密度,一種常用的方法是壓力燒結即把金屬粉末裝在包套裡,然後對裝有粉末的包套進行燒結,這對原材料粉末的裝填條件很重要。在熱等靜壓時,增加裝填密度可以增加燒結體的密度,可以減少在燒結中的不規則收縮,產生較少裂紋,提高成品率。換句話說,在進行壓力燒結時,原料粉末裝填密度大而均勻很重要。眾所周知,對於鈉還原的珊瑚狀鉭粉來說, 其粒徑越小,相應的鬆裝密度越小。而對於轟擊錠氫化破碎鉭粉來說,要想得到很小的平均粒徑,在實際生產中是很難做到的。 In general, refractory metals are difficult to sinter to a very high density. In order to increase the density of the sintered body, a common method is to press the metal powder into a jacket by pressure sintering, and then to sinter the powder-containing jacket. This is important for the loading conditions of the raw material powder. In the case of hot isostatic pressing, increasing the packing density can increase the density of the sintered body, can reduce irregular shrinkage during sintering, generate less cracks, and improve the yield. In other words, when pressure sintering is performed, it is important that the raw material powder is densely packed and uniform. As is well known, for sodium-reduced coral-like meal, The smaller the particle size, the smaller the corresponding bulk density. For bombardment ingots, it is difficult to achieve a small average particle size in actual production.

例如,中國專利CN102909365A、CN103447544A揭露的鉭粉,其選用經過氫化的鉭錠經過破碎、分級得到,其D50>10μm。由於其選用轟擊鉭錠為原料,所得粉末粒子形貌為緻密的球形,進一步細化粒徑比較困難,且生產成本大幅度提高。 For example, the tantalum powder disclosed in the Chinese patents CN102909365A and CN103447544A is obtained by crushing and classifying a hydrogenated tantalum ingot, and has a D50 of >10 μm. Since the bombardment of the ingot is used as the raw material, the obtained powder particles have a dense spherical shape, and it is difficult to further refine the particle size, and the production cost is greatly improved.

由卡伯特公司申請的專利CN1223695A《製造尺寸分佈可控的鉭金屬粉末的方法及用該法製成的產物》中揭露了一種將鉭粉製成一定尺寸的方法。即將含有單個粉末的顆粒組成的基本部分團塊的鉭的基本粉末粉碎,其所形成的中間產物尺寸為0.01-20μm。但該專利技術所製造的鉭粉用於鉭電解電容器陽極塊生產。因為鉭電解電容器陽極塊要求多孔狀結構,所以鉭粉也希望具有盡可能大的多孔狀結構,此結構鉭粉鬆裝密度較小,一般小於2.0g/cm3。同時,由於其未經過高溫處理,鈉還原過程中帶入的鹼金屬如K、Na等雜質較高。在半導體裝置中,K、Na等鹼金屬對金屬-氧化物-半導體(MOS)的介面性能有很壞的影響。由於其最終產品用於生產電容器電極,要求鉭粉具有好的流動性,同時,鉭粉顆粒內部具有較大的孔隙,以便用其製作的電容器具有好的電器性能,所以該專利選擇對中間產物採用了較高的熱處理溫度(大於1200℃)處理,其最終產品的粒徑明顯增大,D50>100μm,不適用於濺射靶。 A method for producing a certain size of tantalum powder is disclosed in the patent CN1223695A, "Method for Producing Size-Controllable Base Metal Powder and Product Made by the Method", filed by Cabot Corporation. The base powder of the crucible consisting of a substantial portion of the agglomerates of particles comprising a single powder is comminuted to form an intermediate product having a size of from 0.01 to 20 μm. However, the tantalum powder manufactured by the patented technology is used for the production of anode blocks for tantalum electrolytic capacitors. Since the anode block of the tantalum electrolytic capacitor requires a porous structure, it is desirable to have a porous structure as large as possible, and the structure has a small bulk density, generally less than 2.0 g/cm 3 . At the same time, since it has not been subjected to high temperature treatment, impurities such as K and Na which are carried in the sodium reduction process are high. In semiconductor devices, alkali metals such as K and Na have a very bad influence on the interface properties of metal-oxide-semiconductor (MOS). Since the final product is used for the production of capacitor electrodes, it is required that the powder has good fluidity, and at the same time, the powder particles have large pores inside, so that the capacitor made thereof has good electrical properties, so the patent selects the intermediate product. With a higher heat treatment temperature (greater than 1200 ° C) treatment, the particle size of the final product is significantly increased, D50> 100 μm, which is not suitable for sputtering targets.

另外,考慮到其處理方法,是對鈉還原後的鉭粉末未進行高溫處理而直接進行了粉碎。正如專利中所述的鈉還原技術得到的鉭粉末尺寸分佈寬且呈多分散分佈,這就導致部分超細粉顆粒(“超細顆粒”是指細微性小於100nm的顆粒)存在,由於其活性較高,在處理過程中容易發生鉭粉著火,存在一定的安全隱患。 Further, in consideration of the treatment method, the cerium powder after sodium reduction is directly pulverized without being subjected to high temperature treatment. As the sodium reduction technique described in the patent, the size distribution of the tantalum powder is broad and polydisperse, which results in the presence of some ultrafine powder particles ("ultrafine particles" refers to particles having a fineness of less than 100 nm) due to their activity. Higher, it is prone to smashing powder during the process, and there are certain safety hazards.

綜上所述,隨著濺射薄膜對原料粉末細微性的要求向微細化、均勻化方向發展,傳統鉭粉的生產製程已經不能滿足生產的要求。 In summary, as the sputter film develops in the direction of miniaturization and homogenization of the fineness of the raw material powder, the production process of the conventional tantalum powder can no longer meet the requirements of production.

本發明的目的在於克服上述缺陷中的一種或多種,提供性能更好的鉭粉及其生產方法。 It is an object of the present invention to overcome one or more of the above disadvantages and to provide a better performance tantalum powder and a method of producing the same.

本發明提供一種微細鉭粉末,其特徵是平均粒徑D50<5μm,較佳D50<4.5μm,同時其鬆裝密度為2-6g/cm3,較佳2.2-4.5g/cm3The present invention provides a fine bismuth powder characterized by an average particle diameter D50 < 5 μm, preferably D50 < 4.5 μm, and a bulk density of 2-6 g/cm 3 , preferably 2.2-4.5 g/cm 3 .

較佳地,該鉭粉的K+Na含量不高於20ppm,較佳不高於15ppm,更佳不高於10ppm;任選地氧含量不高於6000ppm,較佳不高於4000ppm,更佳不高於3500ppm。 Preferably, the niobium powder has a K+Na content of not more than 20 ppm, preferably not more than 15 ppm, more preferably not more than 10 ppm; optionally, the oxygen content is not higher than 6000 ppm, preferably not higher than 4000 ppm, more preferably Not higher than 3500ppm.

特別地,為了降低處理過程中鉭粉著火的風險,本發明提供一種生產該粉末的方法。具體地,該方法依次包括:1)提供鉭粉原料;2)將該原料進行高溫燒結,得到燒結塊;3)對燒結塊進行氫化破碎以得到氫化鉭粉;4)對氫化鉭粉進行脫氫降氧、酸洗、烘乾和過篩。 In particular, in order to reduce the risk of powder fire during processing, the present invention provides a method of producing the powder. Specifically, the method comprises: 1) providing a tantalum powder raw material; 2) sintering the raw material at a high temperature to obtain a sintered block; 3) hydrocracking the sintered compact to obtain a hydrogenated tantalum powder; 4) removing the hydrogenated tantalum powder Hydrogen oxygenation, pickling, drying and sieving.

較佳地,該高溫燒結是在高真空條件,例如10-2-10-5Pa,較佳約10-3Pa下進行的。 Preferably, the high temperature sintering is carried out under high vacuum conditions, for example, 10 -2 -10 -5 Pa, preferably about 10 -3 Pa.

較佳地,該高溫燒結的燒結溫度為1400-2000℃,較佳地,在燒結溫度下的保溫時間為1-5小時,較佳2-3小時。 Preferably, the sintering temperature of the high-temperature sintering is 1400 to 2000 ° C, and preferably, the holding time at the sintering temperature is 1-5 hours, preferably 2-3 hours.

所述的鉭粉原料可以例如來自於電容器用鉭粉生產過程中回收的廢鉭粉,也可以是特意生產的鉭粉,例如採用鈉還原鉭粉。應理解,電容器用鉭粉一般也是用鈉還原法生產的。 The powdered raw material may be, for example, derived from waste tantalum powder recovered during the production of tantalum powder for capacitors, or may be specially produced tantalum powder, for example, sodium reduced tantalum powder. It should be understood that tantalum powder for capacitors is also generally produced by sodium reduction.

應理解,鈉還原鉭粉是指用金屬鈉還原氟鉭酸鉀製程得到的鉭粉,該製程為目前最常用的製備鉭粉的製程之一。在本發明中,如果採用電容器用鉭粉的生產過程中產生的廢鉭粉,特別是電容器用高比容鉭粉的生產過程中產生廢鉭粉作為原料,可以顯著降低生產成本。 It should be understood that sodium reduced niobium powder refers to tantalum powder obtained by reducing sodium fluoroantimonate by a metal sodium process, which is one of the most commonly used processes for preparing tantalum powder. In the present invention, if waste tantalum powder produced in the production process of tantalum powder for capacitors is used, in particular, waste tantalum powder is produced as a raw material in the production process of high specific volume tantalum powder for capacitors, the production cost can be remarkably reduced.

在本發明中,所述的高溫燒結是將原料鉭粉在真空(真空度一般為10-2Pa-10-5Pa,較佳為約10-3Pa)下加熱到1200-2000℃(例如1400℃、1500℃、1800℃)保溫1-5小時(例如2小時、3小時、4小時),燒結結束後進行降溫、鈍化處理得到鉭燒結塊。 In the present invention, the high-temperature sintering is performed by heating the raw material tantalum powder to 1200-2000 ° C under vacuum (a vacuum degree is generally 10 -2 Pa - 10 -5 Pa, preferably about 10 -3 Pa) (for example). 1400 ° C, 1500 ° C, 1800 ° C) 1-5 hours (for example, 2 hours, 3 hours, 4 hours), after the end of sintering, cooling, passivation treatment to obtain a bismuth agglomerate.

1200-2000℃的溫度是較佳的,因為這既可避免因過高的熱處理溫度而可能造成的鉭粉與坩堝燒結粘連,導致難以剝離,增加勞動強度,降低坩堝使用壽命,增加成本,又可避免因過低的熱處理溫度可能導 致的部分超細顆粒團化不徹底,在破碎過程中出現一些活性較高的超細粉末重新凝聚而不利於粉末微細化粉碎或發生著火物料損失。 The temperature of 1200-2000 ° C is preferred because it can avoid the adhesion of tantalum powder and tantalum sintering which may be caused by excessive heat treatment temperature, resulting in difficulty in peeling, increasing labor intensity, reducing the service life of tantalum and increasing the cost. It can be avoided that the heat treatment temperature may be too low. Some of the ultrafine particles are not completely agglomerated, and some ultra-fine powders with higher activity appear to re-agglomerate during the crushing process, which is not conducive to micro-fine grinding or loss of ignition materials.

步驟3)中的氫化破碎是指將步驟2)得到的燒結塊加熱、吸氫,得到具有良好氫脆性的鉭塊,然後採用機械方法破碎制粉,得到完全能通過100目篩的鉭粉,然後較佳進一步採用如球磨、衝擊、擠壓等方法進行破碎,使其進一步降低細微性,例如達到D50<5μm。任選地,還對鉭粉進行酸洗(例如採用HNO3和HF的混合酸)以去除金屬雜質。 The hydrocracking in the step 3) means that the agglomerate obtained in the step 2) is heated and hydrogen is absorbed to obtain a crucible having good hydrogen embrittlement, and then the powder is crushed by a mechanical method to obtain a crucible powder which can pass through a 100 mesh sieve. Then, it is preferably further crushed by a method such as ball milling, impact, extrusion, etc. to further reduce the fineness, for example, to reach D50 < 5 μm. Optionally, the tantalum powder is also pickled (for example with a mixed acid of HNO 3 and HF) to remove metallic impurities.

對氫化後的鉭塊的氫含量不加限制。然而,意外發現,如果氫化後的鉭塊氫含量不低於4000ppm,則是較佳的。因為如果氫含量過低,雖然也能實現本發明的目的,但氫脆性不夠好,球磨破碎過程中不易進行微細破碎,由於其存在一定得延展性而使其變成扁平狀鉭粉,這對D50的控制是不利的。 There is no restriction on the hydrogen content of the hydrogenated clam block. However, it has been unexpectedly found that it is preferred if the hydrogen content of the ruthenium block after hydrogenation is not less than 4,000 ppm. Because if the hydrogen content is too low, although the object of the present invention can also be achieved, the hydrogen embrittlement is not good enough, and it is difficult to perform fine crushing during the ball mill crushing process, and since it has a certain ductility, it becomes a flat powder, which is D50. The control is unfavorable.

氫化破碎過程中的破碎方式較佳是在採用機械方法破碎到能通過100目篩後使用濕式攪拌球磨,例如以氧化鋯球為球磨媒介,以水或有機溶劑為分散媒介,連續球磨直到D50<5μm。已發現,0.5-4h(例如1-3h)的球磨時間已經可以滿意地實現D50<5μm。由於氫化鉭粉硬度較高,採用一般的不銹鋼球研磨會造成對不銹鋼球的嚴重磨損,使大量的金屬雜質混入物料中,導致雜質含量偏高。為了提高最終產品的純度,較佳採用硬度較高的氧化鋯球而非不銹鋼球進行研磨。 The crushing method in the hydrogenation crushing process is preferably mechanically crushed to pass through a 100 mesh sieve, and then wet milled ball mill is used, for example, a zirconia ball is used as a ball milling medium, and water or an organic solvent is used as a dispersion medium, and continuously ball milled until D50. <5 μm. It has been found that a ball milling time of 0.5-4 h (e.g., 1-3 h) can satisfactorily achieve a D50 < 5 m. Due to the high hardness of the yttrium yttrium powder, the use of ordinary stainless steel ball grinding causes severe wear on the stainless steel ball, and a large amount of metal impurities are mixed into the material, resulting in a high impurity content. In order to improve the purity of the final product, it is preferred to use a higher hardness zirconia ball instead of a stainless steel ball for grinding.

為了得到更細更均勻的細微性分佈,選用較小的磨介球進行研磨。其原因是直徑小的研磨媒介在研磨腔中的充填量大,增加了研磨媒介的衝擊作用和摩擦作用,同時增大了研磨媒介的接觸面積,研磨面積增大,也有助於微細化粉碎。意外地發現,直徑為1-5mm,較佳2-4mm的磨介球能實現較好的研磨效果。 In order to obtain a finer and more uniform fineness distribution, a smaller grinding medium ball is used for the grinding. The reason is that the grinding medium with a small diameter has a large filling amount in the grinding chamber, which increases the impact and friction of the grinding medium, and increases the contact area of the grinding medium, and the grinding area is increased, which also contributes to fine grinding. It has been unexpectedly found that a grinding ball having a diameter of 1-5 mm, preferably 2-4 mm, can achieve a better grinding effect.

本發明要求得到細微性較細(D50<5μm)的產品,但球磨過程中可能難以避免產生細微性小於0.1μm超細粉末,它們常常容易氧化甚至自燃,嚴重影響粉末的性能,導致生產無法正常進行。同時,由於粉末細微性越細,其表面積越大,表面自由能亦越大,導致顆粒重新團聚,不利於微細化粉碎。出於方便粉碎的目的,較佳地在分散媒介中添加表面 活性劑作為助磨劑。因為表面活性劑可以附著於鉭粉顆粒表面,形成一層保護層,使物料顆粒在微細化球磨的同時實現表面鈍化,可以有效抑制超細粉末在球磨及後續處理過程中的氧化,保證產品品質。較佳的助磨劑是丁酮和/或異丙醇。更佳地,助磨劑的添加量是鉭粉重量的0.5-5%,較佳1-4%,更佳1.8-3.6%。 The invention requires obtaining finer fineness (D50<5μm) products, but it may be difficult to avoid ultrafine powders with fineness less than 0.1μm during ball milling, which are often easily oxidized or even spontaneously ignited, seriously affecting the performance of the powder, resulting in abnormal production. get on. At the same time, the finer the fineness of the powder, the larger the surface area and the larger the surface free energy, resulting in re-agglomeration of the particles, which is not conducive to micro-fine grinding. For the purpose of facilitating pulverization, it is preferred to add a surface to the dispersion medium. The active agent acts as a grinding aid. Because the surfactant can be attached to the surface of the tantalum powder particles to form a protective layer, the material particles can be surface passivated while miniaturizing the ball mill, which can effectively inhibit the oxidation of the ultrafine powder during ball milling and subsequent processing to ensure product quality. Preferred grinding aids are butanone and/or isopropanol. More preferably, the grinding aid is added in an amount of from 0.5 to 5%, preferably from 1 to 4%, more preferably from 1.8 to 3.6% by weight based on the weight of the powder.

本發明中所用脫氫降氧可以是常規的脫氫降氧。例如,可以通過如下方式進行:一般地,在鉭粉中混入少量與氧的親和力大於鉭與氧的親和力的還原劑,如鹼土金屬、稀土金屬及其氫化物,最常用的是在鉭粉中混入占鉭粉重量0.2-6.0%的金屬鎂粉,然後在真空下或惰性氣體保護(較佳惰性氣體)下進行加熱,在800-900℃下保溫1-3小時,然後再抽真空,然後在真空條件下再保溫2-6小時。然後降溫、鈍化,得到不含氫的鉭粉。 The dehydrogenation and oxygen reduction used in the present invention may be conventional dehydrogenation and oxygen reduction. For example, it can be carried out by generally adding a small amount of a reducing agent having an affinity for oxygen to the affinity of oxygen, such as an alkaline earth metal, a rare earth metal and a hydride thereof, in the tantalum powder, and the most common one is in the tantalum powder. Mixing metal magnesium powder with 0.2-6.0% by weight of niobium powder, heating under vacuum or inert gas protection (preferably inert gas), holding at 800-900 ° C for 1-3 hours, then vacuuming, then Heat for 2-6 hours under vacuum. Then, the temperature is lowered and passivated to obtain a powder containing no hydrogen.

應理解,酸洗除雜可以降低鉭粉中的雜質例如氧、碳、鐵、鎳、鉻等。例如,可通過如下方式酸洗鉭粉:用品質百分比10%的HNO3混合,鉭粉與HNO3的固液比為1:1,攪拌10-90min,溶解鉭粉中的雜質金屬例如還原性金屬及其氧化物,然後過濾除去廢酸液,再分盤烘乾、過篩。 It should be understood that pickling and decontamination can reduce impurities such as oxygen, carbon, iron, nickel, chromium, and the like in the tantalum powder. For example, the following manner may be pickled tantalum powder: 10% by mixing with a quality of HNO 3, HNO tantalum powder and the solid-liquid ratio of 3 to 1: 1, stirred for 10-90min, to dissolve the metal impurities in the tantalum powder, for example, reductive The metal and its oxide are then filtered to remove the spent acid solution, which is then dried and sieved.

本發明中鬆裝密度按照GB/T 1479《金屬粉末鬆裝密度的測定》第1部分“漏斗法”進行測量。 The bulk density in the present invention is measured in accordance with GB/T 1479 "Determination of the bulk density of metal powders", Part 1, "Funnel method".

氣體及金屬雜質含量按照GB/T 15076《鉭鈮化學分析方法》進行測量。 Gas and metal impurity content is measured in accordance with GB/T 15076 "Chemical Analysis Methods".

本發明制得的粉末的細微性分佈及中值粒徑(D50)是採用瑪律文儀器的Mastersizer 2000測得的。 The fineness distribution and median diameter (D50) of the powder produced by the present invention were measured using a Mastersizer 2000 from Malvern Instruments.

意外地發現,本發明所述的高溫燒結帶來了很多優勢:例如1).由於對原料鉭粉(鈉還原鉭粉)採用高溫熱處理,因此細小的顆粒發生凝結、粘連、長大,並趨於均勻化,從而降低鉭粉活性,大大減小了後續機械破碎過程中著火的危險。同時,由於鉭粉活性的降低,降低了在後期破碎過程中顆粒重新團聚的可能,有利於微細研磨。2).通過高溫燒結使鉭粉顆粒緻密化程度增加,有利於最終氧含量的控制,相應的其鬆裝密度大大增加。3).通過高溫燒結,使鈉還原過程中帶入的鹼金屬如K、Na等逸出, 達到提純的目的。如本領域技術人員所知,在半導體裝置中,K、Na等鹼金屬對金屬-氧化物-半導體(MOS)的介面性能有很壞的影響。4)通過高溫燒結,可以除去鉭粉表面吸附的氣體雜質、水份,同時使鉭粉表面的氧化膜活化,可以增大氫氣的滲透性,增加氫化效果,避免了由於氫化不徹底導致後續破碎過程中出現的大顆粒不易被破碎,造成細微性分佈分散,出現“尾巴”的情況。大顆粒的存在會造成沉積膜厚度的不均勻,可靠性下降。 Surprisingly, it has been found that the high-temperature sintering described in the present invention brings many advantages: for example, 1). Since the raw material tantalum powder (sodium-reduced tantalum powder) is subjected to high-temperature heat treatment, fine particles are coagulated, adhered, grown, and tend to Homogenization reduces the activity of the powder and greatly reduces the risk of fire during subsequent mechanical crushing. At the same time, due to the decrease in the activity of the powder, the possibility of re-agglomeration of the particles during the late crushing process is reduced, which is advantageous for fine grinding. 2). The degree of densification of the tantalum powder particles is increased by high-temperature sintering, which is beneficial to the control of the final oxygen content, and the corresponding bulk density is greatly increased. 3). By high-temperature sintering, the alkali metal such as K, Na, etc. brought in during the sodium reduction process escapes, To achieve the purpose of purification. As is known to those skilled in the art, in semiconductor devices, alkali metals such as K, Na, etc. have a very bad influence on the interface properties of metal-oxide-semiconductor (MOS). 4) By high-temperature sintering, the gas impurities and moisture adsorbed on the surface of the tantalum powder can be removed, and the oxide film on the surface of the tantalum powder can be activated to increase the permeability of hydrogen gas, increase the hydrogenation effect, and avoid subsequent crushing due to incomplete hydrogenation. The large particles appearing in the process are not easily broken, resulting in a fine distribution and a "tail". The presence of large particles causes uneven thickness of the deposited film and decreases reliability.

本文所述的鬆裝密度是指在不振動、不加壓的特定條件下,金屬粉末自由填充單位容積的品質。 The bulk density described herein refers to the quality of metal powder freely filled per unit volume under specific conditions of no vibration or no pressure.

概言之,本發明具有以下優點中的一項或多項:可以採用電容器用高比容鉭粉的生產過程中產生的廢鉭粉為原料,資源利用合理、成本低,對原料的適應能力強;設備投資小;工作效率高;製程路線短;和處理過程安全係數高。 In summary, the present invention has one or more of the following advantages: the waste crucible powder produced in the production process of the capacitor with high specific volume powder can be used as a raw material, the resource utilization is reasonable, the cost is low, and the adaptability to the raw material is strong. Equipment investment is small; work efficiency is high; process route is short; and process safety factor is high.

出於說明而非限定的目的,提供如下實施例。為了突出本發明的有益效果,對原料中的雜質含量及鬆裝密度進行了測量,然而應理解,一般的鈉還原鉭粉即可充當本發明的原料。 The following examples are provided for purposes of illustration and not limitation. In order to highlight the advantageous effects of the present invention, the impurity content and bulk density in the raw material are measured, however, it is understood that a general sodium reduced niobium powder can serve as a raw material of the present invention.

實施例1:採用如表1所示的原料鉭粉-1.。將該鉭粉在10-3Pa真空下加熱到1400℃保溫180分鐘、冷卻、鈍化、出爐得到燒結塊。將上述燒結塊加熱到800℃後冷卻進行氫化處理,得到具有良好氫脆性的鉭塊,然後破碎制粉,得到完全能通過100目篩的鉭粉。將上述鉭粉以無水乙醇為球磨媒介,以丁酮作為助磨劑(丁酮的添加量為鉭粉重量的0.5%),進行濕式攪拌球磨0.5h後用HNO3和HF的混合酸酸洗去除金屬雜質,烘乾過200目篩得到氫化鉭粉。在氫化鉭粉中加入2%的鎂屑,在密閉的爐中在氬氣氣氛下加熱到850℃保溫2小時,然後再抽真空,在抽真空條件下再 保溫3小時後降溫、鈍化,得到脫氫降氧的鉭粉。將脫氫降氧後的鉭粉用濃度為10品質%的HNO3混合,鉭粉與HNO3的固液品質比為1:1,攪拌60min,溶解鉭粉中的鎂及氧化鎂,然後過濾除去廢酸液,再分盤烘乾,過篩,得到本發明的鉭粉樣品1-1。其主要雜質含量、鬆裝密度及尺寸分佈見表1。 Example 1: Raw material bismuth powder-1 as shown in Table 1 was used. The tantalum powder was heated to 1400 ° C under vacuum for 10 -3 Pa for 180 minutes, cooled, passivated, and baked to obtain a sintered mass. The agglomerate was heated to 800 ° C, cooled and subjected to hydrogenation treatment to obtain a crucible having good hydrogen embrittlement, and then the powder was crushed to obtain a crucible powder which was completely passed through a 100 mesh sieve. The above-mentioned glutinous rice powder was treated with anhydrous ethanol as a ball milling medium and methyl ethyl ketone as a grinding aid (the amount of methyl ethyl ketone added was 0.5% by weight of the cerium powder), and the mixed acid of HNO 3 and HF was mixed after wet-grinding for 0.5 h. The metal impurities were washed and dried, and dried through a 200 mesh sieve to obtain a cesium hydride powder. 2% magnesium powder was added to the yttrium yttrium powder, heated in an airtight atmosphere at 850 ° C for 2 hours in a closed oven, and then vacuumed again, and then kept under vacuum for 3 hours, then cooled and passivated. Dehydrogenation and oxygen reduction. The tantalum powder with reduced oxygen concentration is dehydrogenated in 10% HNO 3 mixed quality, quality of tantalum powder and the solid-liquid ratio of HNO 3 to 1: 1, stirred for 60min, tantalum powder was dissolved in magnesium and magnesium oxide, and then filtered The spent acid solution was removed, dried in a tray, and sieved to obtain a tantalum powder sample 1-1 of the present invention. The main impurity content, bulk density and size distribution are shown in Table 1.

實施例2:仍採用如表1所示的原料鉭粉-1。將該鉭粉在10-3Pa真空下加熱到1600℃保溫120分鐘、冷卻、鈍化、出爐得到燒結塊。將上述燒結塊加熱到800℃後冷卻進行氫化處理,得到具有良好氫脆性的鉭塊,然後破碎制粉,得到完全能通過100目篩的鉭粉。將上述鉭粉以無水乙醇為球磨媒介,以丁酮和異丙醇作為助磨劑(丁酮的添加量為鉭粉重量的0.5%,異丙醇酮的添加量為鉭粉重量的2.0%),進行濕式攪拌球磨1.5h後用HNO3和HF的混合酸酸洗去除金屬雜質,烘乾過200目篩得到氫化鉭粉。在氫化鉭粉中加入2%的鎂屑,在密閉的爐裡氬氣氣氛裡加熱到850℃保溫2小時,然後再抽真空,然後在真空條件下再保溫3小時後降溫、鈍化,得到脫氫降氧的的鉭粉。將脫氫降氧後的鉭粉用品質百分比10%的HNO3混合,鉭粉與HNO3的固液比為1:1,攪拌60min,溶解鉭粉中的鎂及氧化鎂,然後過濾除去廢酸液,再分盤烘乾,過篩,得到本發明的鉭粉樣品1-2。其主要雜質含量、鬆裝密度及尺寸分佈見表1。 Example 2: Raw material bismuth powder-1 as shown in Table 1 was still used. The tantalum powder was heated to 1600 ° C for 10 minutes under vacuum of 10 -3 Pa, cooled, passivated, and baked to obtain a sintered mass. The agglomerate was heated to 800 ° C, cooled and subjected to hydrogenation treatment to obtain a crucible having good hydrogen embrittlement, and then the powder was crushed to obtain a crucible powder which was completely passed through a 100 mesh sieve. The above-mentioned tantalum powder was made into anhydrous water ethanol as a ball milling medium, and methyl ethyl ketone and isopropanol were used as grinding aids (the amount of methyl ethyl ketone added was 0.5% by weight of yttrium powder, and the amount of isopropyl alcohol ketone added was 2.0% by weight of yttrium powder). ), after the wet agitating ball mill mixing sour 1.5h with HNO 3 and HF removal of metal impurities washing, drying over a 200 mesh sieve to obtain a hydrogenated tantalum powder. Add 2% magnesium chips to the yttrium yttrium powder, heat it to 850 ° C for 2 hours in a closed oven, then vacuum again, then keep it under vacuum for 3 hours, then cool down and passivate. Hydrogen-lowering powder. The dehydrogenated and dehydrated niobium powder was mixed with 10% by mass of HNO 3 , the solid-liquid ratio of niobium powder to HNO 3 was 1:1, stirred for 60 min, the magnesium and magnesium oxide in the niobium powder were dissolved, and then the waste was removed by filtration. The acid solution was dried and sieved to obtain a powder sample 1-2 of the present invention. The main impurity content, bulk density and size distribution are shown in Table 1.

對比例1.:仍採用如表1所示的原料鉭粉-1。將該鉭粉不經過熱處理直接進行濕式攪拌球磨1.5h,後用HNO3和HF的混合酸酸洗去除金屬雜質,烘乾過200目篩得到氫化鉭粉。在氫化鉭粉中加入2%的鎂屑,在密閉的爐裡氬氣氣氛裡加熱到850℃保溫3小時,然後再抽真空,在抽真空條件下再保溫3小時後降溫、鈍化,得到不含氫的鉭粉。將脫氫降氧後的鉭粉用品質百分比10%的HNO3混合,鉭粉與HNO3的固液比為1:1,攪拌60min,溶解鉭粉中的鎂及氧化鎂,然後過濾除去廢酸液,再分盤烘乾,過篩,得到對比的鉭粉對比樣1-1。其主要雜質含量、鬆裝密度及尺寸分佈見表1。 Comparative Example 1. Raw material bismuth powder-1 as shown in Table 1 was still used. The tantalum powder was directly subjected to wet agitating ball milling for 1.5 hours without heat treatment, and then the metal impurities were removed by acid pickling with HNO 3 and HF, and dried to a 200 mesh sieve to obtain a hydrogenated tantalum powder. Add 2% magnesium chips to the yttrium yttrium powder, heat it to 850 ° C for 3 hours in an argon atmosphere in a closed oven, then vacuum again, and then heat-cool for 3 hours, then cool down and passivate under vacuum conditions. Hydrogen-containing strontium powder. The dehydrogenated and dehydrated niobium powder was mixed with 10% by mass of HNO 3 , the solid-liquid ratio of niobium powder to HNO 3 was 1:1, stirred for 60 min, the magnesium and magnesium oxide in the niobium powder were dissolved, and then the waste was removed by filtration. The acid solution was dried and sieved to obtain a comparative powder sample 1-1. The main impurity content, bulk density and size distribution are shown in Table 1.

實施例3:採用如表1所述的原料鉭粉-2作為原料。將該鉭粉在10-3Pa真空下加熱到1800℃保溫120分鐘、冷卻、鈍化、出爐得到燒結塊。將上述燒結塊加熱到800℃後冷卻進行氫化處理,得到具有良好氫脆 性的鉭塊,然後破碎制粉,得到完全能通過100目篩的鉭粉。將上述鉭粉以無水乙醇為球磨媒介,以丁酮和異丙醇作為助磨劑(丁酮的添加量為鉭粉重量的1.0%,異丙醇酮的添加量為鉭粉重量的3.0%),進行濕式攪拌球磨1.5h後用HNO3和HF的混合酸酸洗去除金屬雜質,烘乾過200目篩得到氫化鉭粉。在氫化鉭粉中加入2%的鎂屑,在密閉的爐裡氬氣氣氛裡加熱到830℃保溫2小時,然後再抽真空,在抽真空條件下再保溫3小時後降溫、鈍化,得到脫氫降氧後的鉭粉。將脫氫降氧後的鉭粉用品質百分比10%的HNO3混合,鉭粉與HNO3的固液比為1:1,攪拌60min,溶解鉭粉中的鎂及氧化鎂,然後過濾除去廢酸液,再分盤烘乾,過篩,得到本發明的鉭粉樣品2-1。其主要雜質含量、鬆裝密度及尺寸分佈見表1。 Example 3: Raw material tantalum powder-2 as described in Table 1 was used as a raw material. The tantalum powder was heated to 1800 ° C under vacuum for 10 -3 Pa for 120 minutes, cooled, passivated, and baked to obtain a sintered mass. The agglomerate was heated to 800 ° C, cooled and subjected to hydrogenation treatment to obtain a crucible having good hydrogen embrittlement, and then the powder was crushed to obtain a crucible powder which was completely passed through a 100 mesh sieve. The above-mentioned glutinous powder was made into anhydrous water ethanol as a ball milling medium, and methyl ethyl ketone and isopropyl alcohol were used as grinding aids (the amount of methyl ethyl ketone added was 1.0% by weight of cerium powder, and the amount of isopropyl alcohol ketone added was 3.0% by weight of cerium powder). After performing wet-stirred ball milling for 1.5 hours, the metal impurities were removed by acid pickling with HNO 3 and HF, and dried under a 200 mesh sieve to obtain a cesium hydride powder. 2% magnesium powder was added to the yttrium yttrium powder, heated in an argon atmosphere in a closed oven to 830 ° C for 2 hours, then vacuumed, and then vacuumed for 3 hours, then cooled, passivated, and obtained The powder after hydrogen reduction. The dehydrogenated and dehydrated niobium powder was mixed with 10% by mass of HNO 3 , the solid-liquid ratio of niobium powder to HNO 3 was 1:1, stirred for 60 min, the magnesium and magnesium oxide in the niobium powder were dissolved, and then the waste was removed by filtration. The acid solution was again dried in a tray and sieved to obtain a tantalum powder sample 2-1 of the present invention. The main impurity content, bulk density and size distribution are shown in Table 1.

對比例2:仍採用如表1所述的原料鉭粉-2作為原料。將該鉭粉不經過熱處理直接加熱到800℃後冷卻進行氫化處理,得到氫化鉭粉末,然後採用濕式攪拌球磨1.5h,然後用HNO3和HF的混合酸酸洗去除金屬雜質,烘乾過200目篩得到氫化鉭粉。在氫化鉭粉中加入2%的鎂屑,在密閉的爐裡氬氣氣氛裡加熱到830℃保溫2小時,然後再抽真空,在抽真空條件下再保溫3小時後降溫、鈍化,得到脫氫降氧的鉭粉。將脫氫降氧後的鉭粉用品質百分比10%的HNO3混合,鉭粉與HNO3的固液比為1:1,攪拌60min,溶解鉭粉中的鎂及氧化鎂,然後過濾除去廢酸液,再分盤烘乾,過篩,得到本發明的鉭粉對比樣2-1。其主要雜質含量、鬆裝密度及尺寸分佈見表1。 Comparative Example 2: Raw material tantalum powder-2 as described in Table 1 was still used as a raw material. The heat treated tantalum powder is not directly heated to 800 ℃ for cooling hydrotreatment, hydrogenation to obtain the tantalum powder, and wet milling was stirred 1.5h, then treated with HF and HNO 3 mixed sour wash remove metal impurities, dried over A 200 mesh sieve gave a cesium hydride powder. 2% magnesium powder was added to the yttrium yttrium powder, heated in an argon atmosphere in a closed oven to 830 ° C for 2 hours, then vacuumed, and then vacuumed for 3 hours, then cooled, passivated, and obtained Hydrogen-lowering niobium powder. The dehydrogenated and dehydrated niobium powder was mixed with 10% by mass of HNO 3 , the solid-liquid ratio of niobium powder to HNO 3 was 1:1, stirred for 60 min, the magnesium and magnesium oxide in the niobium powder were dissolved, and then the waste was removed by filtration. The acid solution was dried and sieved to obtain a bismuth powder comparative sample 2-1 of the present invention. The main impurity content, bulk density and size distribution are shown in Table 1.

實施例4:仍採用如表1所述的原料鉭粉-2作為原料。將該鉭粉在10-3Pa真空下加熱到1950℃保溫120分鐘、冷卻、鈍化、出爐得到燒結塊。將上述燒結塊加熱到800℃後冷卻進行氫化處理,得到具有良好氫脆性的鉭塊,然後破碎制粉,得到完全能通過100目篩的鉭粉。將上述鉭粉以無水乙醇為球磨媒介,以異丙醇作為助磨劑(異丙醇酮的添加量為鉭粉重量的5.0%),進行濕式攪拌球磨3h後用HNO3和HF的混合酸酸洗去除金屬雜質,烘乾過200目篩得到氫化鉭粉。在氫化鉭粉中加入2%的鎂屑,在密閉的爐裡氬氣氣氛裡加熱到830℃保溫2小時,然後再抽真空,在抽真空條件下再保溫3小時後降溫、鈍化,得到脫氫降氧的鉭粉。將脫氫降氧 後的鉭粉用品質百分比10%的HNO3混合,鉭粉與HNO3的固液比為1:1,攪拌60min,溶解鉭粉中的鎂及氧化鎂,然後過濾除去廢酸液,再分盤烘乾,過篩,得到本發明的鉭粉樣品2-2。其主要雜質含量、鬆裝密度及尺寸分佈見表1 Example 4: The raw material tantalum powder-2 as described in Table 1 was still used as a raw material. The tantalum powder was heated to 1950 ° C for 120 minutes under vacuum of 10 -3 Pa, cooled, passivated, and baked to obtain a sintered cake. The agglomerate was heated to 800 ° C, cooled and subjected to hydrogenation treatment to obtain a crucible having good hydrogen embrittlement, and then the powder was crushed to obtain a crucible powder which was completely passed through a 100 mesh sieve. The above-mentioned glutinous rice powder was prepared by using anhydrous ethanol as a ball milling medium and isopropyl alcohol as a grinding aid (the amount of isopropanol ketone added was 5.0% by weight of cerium powder), and mixing with HNO 3 and HF after wet stirring ball milling for 3 hours. The acid pickling removes the metal impurities and is dried over a 200 mesh sieve to obtain a cesium hydride powder. 2% magnesium powder was added to the yttrium yttrium powder, heated in an argon atmosphere in a closed oven to 830 ° C for 2 hours, then vacuumed, and then vacuumed for 3 hours, then cooled, passivated, and obtained Hydrogen-lowering niobium powder. The dehydrogenated and dehydrated niobium powder was mixed with 10% by mass of HNO 3 , the solid-liquid ratio of niobium powder to HNO 3 was 1:1, stirred for 60 min, the magnesium and magnesium oxide in the niobium powder were dissolved, and then the waste was removed by filtration. The acid solution was dried in a tray and sieved to obtain a tantalum powder sample 2-2 of the present invention. The main impurity content, bulk density and size distribution are shown in Table 1.

對比例3:仍採用如表1所述的原料鉭粉-2為原料。將該鉭粉不經過熱處理直接加熱到800℃後冷卻進行氫化處理,得到氫化鉭粉末,然後採用濕式攪拌球磨3h,後用HNO3和HF的混合酸酸洗去除金屬雜質,烘乾出料時發生著火,物料未進行後續處理。為了方便對比,在表中仍以對比樣2-2表示。 Comparative Example 3: The raw material tantalum powder-2 as described in Table 1 was still used as a raw material. The tantalum powder is directly heated to 800 ° C without heat treatment, and then subjected to hydrogenation treatment to obtain a hydrogenated cerium powder, which is then ball milled by wet stirring for 3 hours, and then washed with a mixed acid of HNO 3 and HF to remove metal impurities, and dried. There was a fire and the material was not processed. For convenience of comparison, it is still indicated by the comparison sample 2-2 in the table.

實施例5:採用如表1所述的原料鉭粉-3作為原料。將該鉭粉在10-3Pa真空下加熱到1500℃保溫180分鐘、冷卻、鈍化、出爐得到燒結塊。將上述燒結塊加熱到800℃後冷卻進行氫化處理,得到具有良好氫脆性的鉭塊,然後破碎制粉,得到完全能通過100目篩的鉭粉。將上述鉭粉以無水乙醇為球磨媒介,以丁酮作為助磨劑(丁酮的添加量為鉭粉重量的1.5%),進行濕式攪拌球磨2.0h後用HNO3和HF的混合酸酸洗去除金屬雜質,烘乾過200目篩得到氫化鉭粉。在氫化鉭粉中加入2%的鎂屑,在密閉的爐裡氬氣氣氛裡加熱到850℃保溫2小時,然後再抽真空,在抽真空條件下再保溫3小時後降溫、鈍化,得到脫氫降氧後的鉭粉。將脫氫降氧後的鉭粉用品質百分比10%的HNO3混合,鉭粉與HNO3的固液比為1:1,攪拌60min,溶解鉭粉中的鎂及氧化鎂,然後過濾除去廢酸液,再分盤烘乾,過篩,得到本發明的鉭粉樣品3-1。其主要雜質含量、鬆裝密度及尺寸分佈見表1。 Example 5: Raw material tantalum powder-3 as described in Table 1 was used as a raw material. The tantalum powder was heated to 1500 ° C under vacuum for 10 -3 Pa for 180 minutes, cooled, passivated, and baked to obtain a sintered mass. The agglomerate was heated to 800 ° C, cooled and subjected to hydrogenation treatment to obtain a crucible having good hydrogen embrittlement, and then the powder was crushed to obtain a crucible powder which was completely passed through a 100 mesh sieve. The above-mentioned glutinous rice powder was treated with anhydrous ethanol as a ball milling medium and methyl ethyl ketone as a grinding aid (the amount of methyl ethyl ketone added was 1.5% by weight of the cerium powder), and the mixed acid of HNO 3 and HF was used after wet stirring ball milling for 2.0 hours. The metal impurities were washed and dried, and dried through a 200 mesh sieve to obtain a cesium hydride powder. Add 2% magnesium chips to the yttrium yttrium powder, heat it to 850 ° C for 2 hours in an argon atmosphere in a closed oven, then vacuum it, and then heat it for 3 hours under vacuum to cool down and passivate. The powder after hydrogen reduction. The dehydrogenated and dehydrated niobium powder was mixed with 10% by mass of HNO 3 , the solid-liquid ratio of niobium powder to HNO 3 was 1:1, stirred for 60 min, the magnesium and magnesium oxide in the niobium powder were dissolved, and then the waste was removed by filtration. The acid solution was again dried in a tray and sieved to obtain a tantalum powder sample 3-1 of the present invention. The main impurity content, bulk density and size distribution are shown in Table 1.

對比例4:仍採用表1中的原料鉭粉-3作為原料。將該鉭粉不經過熱處理直接進行濕式攪拌球磨2.0h,後用HNO3和HF的混合酸酸洗去除金屬雜質,烘乾過200目篩得到氫化鉭粉。在氫化鉭粉中加入2%的鎂屑,在密閉的爐裡氬氣氣氛裡加熱到850℃保溫3小時,然後再抽真空,在抽真空條件下再保溫3小時後降溫、鈍化,得到脫氫降氧的鉭粉。將脫氫降氧後的鉭粉用品質百分比10%的HNO3混合,鉭粉與HNO3的固液比為1:1,攪拌60min,溶解鉭粉中的鎂及氧化鎂,然後過濾除去廢酸液,再分盤烘乾,過篩,得到對比的鉭粉對比樣3-1。其主要雜質含量、鬆裝密度 及尺寸分佈見表1。 Comparative Example 4: The raw material 钽 powder-3 in Table 1 was still used as a raw material. The tantalum powder was directly subjected to wet agitating ball milling for 2.0 hours without heat treatment, and then the metal impurities were removed by acid pickling with HNO3 and HF, and dried to a 200 mesh sieve to obtain a hydrogenated tantalum powder. Add 2% magnesium chips to the yttrium yttrium powder, heat it to 850 ° C for 3 hours in a closed oven, then vacuum, then heat for 3 hours under vacuum, then cool down and passivate. Hydrogen-lowering niobium powder. The dehydrogenated and dehydrated niobium powder is mixed with HNO3 with a mass percentage of 10%, the solid-liquid ratio of niobium powder to HNO3 is 1:1, stirred for 60 min, the magnesium and magnesium oxide in the niobium powder are dissolved, and then the waste acid solution is removed by filtration. Then, dry and sieve, and compare the sample 3-1. Its main impurity content, bulk density And the size distribution is shown in Table 1.

注意,對比樣2-1的D50雖為4.967μm,但其鬆裝密度為1.22,故不在本發明範圍內。 Note that the D50 of Comparative Example 2-1 was 4.967 μm, but its bulk density was 1.22, and thus was not within the scope of the present invention.

由上述資料可以看出,採用本發明的方法所處理鉭粉末的細微性分佈範圍集中、且尺寸小,D50<5μm,同時具有低的O、K、Na雜質含量和大的鬆裝密度。 It can be seen from the above data that the fineness distribution of the tantalum powder treated by the method of the present invention is concentrated and small in size, D50<5 μm , and has low O, K, Na impurity content and large bulk density. .

本申請中所涉及的各個參數的分析設備及型號如下表所示 The analysis equipment and model of each parameter involved in this application are shown in the following table.

Claims (20)

一種微細鉭粉末,其D50<5μm,其特徵是鬆裝密度為2.0-6.0g/cm3A fine tantalum powder having a D50 < 5 μm and characterized by a bulk density of 2.0-6.0 g/cm 3 . 如申請專利範圍第1項所述的微細鉭粉末,其D50<4.5μm。 The fine tantalum powder according to claim 1, which has a D50 of <4.5 μm. 如申請專利範圍第1或2項所述的微細鉭粉末,其中該鬆裝密度為2.2-4.5g/cm3The fine tantalum powder according to claim 1 or 2, wherein the bulk density is 2.2 to 4.5 g/cm 3 . 如申請專利範圍第1或2項所述的微細鉭粉末,其中該微細鉭粉末的K+Na含量不高於20ppm,氧含量不高於6000ppm。 The fine tantalum powder according to claim 1 or 2, wherein the fine tantalum powder has a K+Na content of not more than 20 ppm and an oxygen content of not more than 6000 ppm. 如申請專利範圍第4項所述的微細鉭粉末,其中該微細鉭粉末的K+Na含量不高於15ppm;該氧含量不高於4000ppm。 The fine tantalum powder according to claim 4, wherein the fine tantalum powder has a K+Na content of not more than 15 ppm; and the oxygen content is not higher than 4000 ppm. 一種製備如申請專利範圍第1-4項任一項所述的微細鉭粉末的方法,該方法依次包括:1)提供鉭粉原料;2)將該原料進行高溫燒結,得到燒結塊;3)對燒結塊進行氫化破碎,以得到氫化鉭粉末,和4)對氫化鉭粉末進行脫氫降氧、酸洗、烘乾並過篩。 A method for preparing the fine tantalum powder according to any one of claims 1 to 4, which method comprises: 1) providing a raw material of the tantalum powder; 2) sintering the raw material at a high temperature to obtain a sintered mass; 3) The agglomerate is subjected to hydrogenation crushing to obtain a hydrazine hydride powder, and 4) the hydrazine hydride powder is subjected to dehydrogenation, oxygenation, pickling, drying, and sieving. 如申請專利範圍第6項所述的方法,其中在氫化破碎過程中將氫化後的粉末用機械方法破碎到能通過100目篩,然後採用濕式攪拌球磨進行研磨直到其D50<5μm,然後進行酸洗除雜。 The method of claim 6, wherein the hydrogenated powder is mechanically crushed in a hydrogenation crushing process to pass through a 100 mesh sieve, and then ground using a wet agitating ball mill until its D50 < 5 μm, and then Pickling and removing impurities. 如申請專利範圍第7項所述的方法,其中在球磨過程中所使用的研磨媒介中添加表面活性劑,其加入量是鉭粉原料重量的0.5-5%。 The method of claim 7, wherein a surfactant is added to the grinding media used in the ball milling process in an amount of from 0.5 to 5% by weight based on the weight of the powder. 如申請專利範圍第8項所述的方法,其中所述表面活性劑為丁酮和/或異丙醇。 The method of claim 8, wherein the surfactant is methyl ethyl ketone and/or isopropanol. 如申請專利範圍第6-9項中任一項所述的方法,其中高溫燒結是在高真空條件下進行的。 The method of any one of claims 6-9, wherein the high temperature sintering is carried out under high vacuum conditions. 如申請專利範圍第10項所述的方法,其中高溫燒結是在10-2-10-5Pa下進行的。 The method of claim 10, wherein the high temperature sintering is performed at 10 -2 -10 -5 Pa. 如申請專利範圍第6-9項中任一項所述的方法,其中鉭粉原料是鈉還原鉭粉末。 The method of any one of claims 6-9, wherein the powdered raw material is a sodium reduced cerium powder. 如申請專利範圍第6-9項中任一項所述的方法,其中鉭粉原料是用鉭粉的生產過程中產生的廢鉭粉末。 The method of any one of claims 6-9, wherein the powdered raw material is waste tantalum powder produced during the production of tantalum powder. 如申請專利範圍第6-9項中任一項所述的方法,其中鉭粉原料是電容器用高比容鉭粉末的生產過程中產生的廢鉭粉末作為原料。 The method according to any one of claims 6 to 9, wherein the powdered raw material is a waste tantalum powder produced in the production process of a high specific volume tantalum powder for a capacitor as a raw material. 如申請專利範圍第6-9項中任一項所述的方法,其中高溫燒結的燒結溫度為1400-2000℃,在燒結溫度下的保溫時間為1-5小時。 The method according to any one of claims 6 to 9, wherein the sintering temperature for the high temperature sintering is 1400 to 2000 ° C, and the holding time at the sintering temperature is 1-5 hours. 如申請專利範圍第15項所述的方法,其中在燒結溫度下的保溫時間為2-3小時。 The method of claim 15, wherein the holding time at the sintering temperature is 2-3 hours. 如申請專利範圍第7-9項中任一項所述的方法,其中以直徑為1-5mm的氧化鋯球為球磨媒介,以水或有機溶劑為分散媒介,連續球磨0.5-4h使其D50<5μm。 The method according to any one of claims 7-9, wherein a zirconia ball having a diameter of 1-5 mm is used as a ball milling medium, and water or an organic solvent is used as a dispersion medium, and the ball is continuously milled for 0.5-4 hours to make a D50. <5 μm. 如申請專利範圍第7-9項中任一項所述的方法,其中以直徑為2-4mm的氧化鋯球為球磨媒介,以水或有機溶劑為分散媒介,連續球磨1-3h使其D50<5μm。 The method according to any one of claims 7-9, wherein a zirconia ball having a diameter of 2-4 mm is used as a ball milling medium, and water or an organic solvent is used as a dispersion medium, and continuously ball milled for 1-3 hours to make D50 <5 μm. 如申請專利範圍第17項所述的方法,其中有機溶劑為酒精。 The method of claim 17, wherein the organic solvent is alcohol. 一種如申請專利範圍第1-5項中任一項所述的微細鉭粉末在半導體和/或表面噴塗中的用途。 Use of the fine tantalum powder according to any one of claims 1 to 5 in the semiconductor and/or surface coating.
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