TWI595956B - Processing equipment - Google Patents

Description

Processing Equipment

This invention relates to a processing apparatus, and more particularly to a processing apparatus for laser cutting and trimming.

With the advancement of display and touch technology, human life has become more convenient, and current display and touch devices are moving toward a thin and light trend to facilitate carrying and use. Glass cutting is one of the most important processes in the production of displays and touch panels. In the past, after the glass having a thickness of more than 500 μm was cut, the micro-defects caused by the glass cutting process could be removed by mechanical edging. However, under the trend of thinner and lighter display panels, the thickness of the glass is getting thinner and thinner, and the requirements for the quality of the glass trimming are becoming more stringent. The general ultra-thin glass can not achieve the purpose of defect removal by the traditional mechanical edging method, because the traditional mechanical edging method will cause the rupture of the ultra-thin glass.

In order to achieve the trimming quality of conventional glass on ultra-thin glass, the current feasible way is to achieve thermal cracking. However, the difficulty of processing in the form of thermal cracking is extremely high, and it is required to cooperate with a multi-layer cutting and edge thermal cracking process, which is generally referred to as a trimming process. Therefore, how to integrate the multi-layer cutting and trimming technology process and The purpose of mass production is an important issue.

The present invention provides a processing apparatus that can be simultaneously applied to the cutting and trimming of a multilayer stack structure.

The processing apparatus of the present invention includes a first stage, a first processing unit, a conveyor, and a second processing unit. The first stage has a bearing surface for carrying the sheet material. The area of the bearing surface is set to be smaller than the area of the sheet such that the outer edge of the sheet protrudes beyond the first stage. The first processing device separates the workpiece from the sheet. A conveyor is used to move the workpiece from the first position to the second position and expose the sides of the workpiece. The second processing device is used to machine the side of the workpiece in the second position.

Based on the above, the processing apparatus of the present invention has a first processing apparatus and a second processing apparatus, and the first processing apparatus can separate the workpiece from the sheet material on the bearing surface of the first stage. Additionally, the workpiece can be moved from the original first position to the second position via the transfer of the conveyor to expose the sides of the workpiece. Furthermore, the second processing device can process the sides of the workpiece. Therefore, the processing apparatus of the present invention can separate the workpiece from the panel, and can simultaneously perform subsequent processing on the side of the separated workpiece.

Based on the above, the processing apparatus of the present invention has a first processing apparatus and a second processing apparatus, and the first processing apparatus can separate the workpiece from the sheet material on the first stage. Additionally, the workpiece can be moved from the original first position to the second position via the transfer of the conveyor to expose the sides of the workpiece. Furthermore, the second processing device can process the sides of the workpiece. Therefore, the processing apparatus of the present invention can be separated from the board The workpiece and the subsequent processing of the side of the separated workpiece can be performed simultaneously. Through the aforementioned separation of the workpiece of the present invention, the first processing apparatus can separate the workpiece having the multilayer stack structure. At the same time, the second processing device can trim the side of the workpiece to achieve the trimming quality of the near crack-free defect. Furthermore, the processing apparatus of the present invention can integrate the above-described two-process mechanism of workpiece separation and trimming to increase the process speed, thereby improving the mass production of the process.

In order to make the above-described features of the present invention more comprehensible, the following detailed description of the embodiments will be described in detail below.

20, 24, 50, 60, 70 ‧ ‧ focus points

22, 26, 62‧ ‧ path

80‧‧‧ plates

82, 92‧‧‧ first substrate

82a, 92a‧‧‧ first surface

84, 94‧‧ ‧ adhesive layer

86, 96‧‧‧ second substrate

86a, 96a‧‧‧ third surface

90‧‧‧Workpiece

90-1‧‧‧Circular workpiece

90-2‧‧‧Rectangular workpiece

90-3‧‧‧Conductor rectangular workpiece

90-4‧‧‧ Irregular workpiece

90a, 90b, 90c, 90d‧‧‧ side

92-1‧‧‧First circular substrate

92-2‧‧‧First rectangular substrate

92-3‧‧‧First lead angle substrate

92-4‧‧‧First irregular shaped substrate

94-1‧‧‧round rubber layer

94-2‧‧‧Rectangular layer

94-3‧‧‧Guided rectangular rubber layer

94-4‧‧‧ irregular rubber layer

96-1‧‧‧Second circular substrate

96-2‧‧‧Second rectangular substrate

96-3‧‧‧Second angle rectangular substrate

96-4‧‧‧Second irregular shaped substrate

100‧‧‧Processing equipment

102‧‧‧Human Machine Interface Unit

104‧‧‧Control terminal unit

106‧‧‧Processing unit

106a‧‧‧First processing unit

106b‧‧‧Second processing unit

107‧‧‧ Edge-finding device

108‧‧‧First stage

108a‧‧‧ bearing surface

109‧‧‧Conveyor belt

110‧‧‧Detection unit

112‧‧‧Transportation device

113a‧‧‧Exit agency

113b‧‧‧ Grab institutions

114‧‧‧Second stage

114a‧‧‧second bearing surface

115‧‧‧Carriage

119‧‧‧ alignment mark

1042‧‧‧Signal transmission/conversion unit

1044‧‧‧Acoustic signal unit

1044-2‧‧‧Processing light source intensity control unit

1044-4‧‧‧Processing light source frequency control unit

1044-6‧‧‧Processing light source position control unit

1044-8‧‧‧First stage control unit

1044-10‧‧‧Vibration lens control unit

1044-12‧‧‧Transmission device control unit

1044-14‧‧‧Second stage control unit

1046‧‧‧Return arithmetic unit

1062‧‧‧Processing light source unit

1062-2‧‧‧Processing light source signal transmission/conversion unit

1062-4‧‧‧The first processing light source moving axis

1062-6‧‧‧First processing light source

1062-8‧‧‧Second processing light source moving axis

1062-10‧‧‧Second processing light source

1064‧‧‧Light source adjustment unit

1064-2‧‧‧ galvanometer signal transmission/conversion unit

1064-4‧‧‧ galvanometer axial movement axis

1064-6‧‧‧ galvanometer first dimension moving axis

1064-8‧‧‧ galvanometer second dimension moving axis

1064-10‧‧‧ galvanometer group

1080-2‧‧‧First stage signal transmission/conversion unit

1080-4‧‧‧First stage first dimension moving axis

1080-6‧‧‧First stage second dimension moving axis

1080-8‧‧‧First stage body

1100-2‧‧‧Detection signal transmission/conversion unit

1100-4‧‧‧Sensor

1120-2‧‧‧Transfer unit signal transmission/conversion unit

1120-6‧‧‧First moving axis

1120-8‧‧‧Second moving axis

1120-10‧‧‧vacuum pump

1140-2‧‧‧Second stage signal transmission/conversion unit

1140-4‧‧‧Second stage first dimension moving axis

1140-6‧‧‧Second stage second dimension moving axis

1140-8‧‧‧Second stage body

A1‧‧‧ area

P1‧‧‧ first position

P2, P2’‧‧‧ second position

T1, t2‧‧‧ time

L1, L2‧‧‧ width

D1‧‧‧ scan distance

D2‧‧‧ distance

1 is a schematic illustration of a processing apparatus in accordance with an embodiment of the present invention.

2 is a block diagram of the system of the processing apparatus of FIG. 1.

3A is a schematic illustration of a processing apparatus in accordance with another embodiment of the present invention.

3B is a schematic illustration of an embodiment of the second stage of FIG. 3A.

4 is a block diagram of the system of the processing apparatus of FIGS. 3A and 3B.

Figure 5 is a schematic illustration of a sheet of a processing apparatus in accordance with an embodiment of the present invention.

6A is a schematic diagram of a scan path of a first processing light source, in accordance with an embodiment of the present invention.

Figure 6B is a top plan view of the scan path of the first processing light source of Figure 6A.

7A is a schematic diagram of a scan path of a first processing light source in accordance with another embodiment of the present invention.

Figure 7B is a top plan view of the scan path of the first processing light source of Figure 7A.

8A to 8D are schematic views of the workpieces of Figs. 6A, 6B and Figs. 7A, 7B.

Figure 9 is a schematic illustration of a processing apparatus in accordance with another embodiment of the present invention.

10A and 10B are schematic views of a processing mode of the processing apparatus of Fig. 9.

Figure 11 is a schematic illustration of another processing of the processing apparatus of Figure 9.

Figure 12 is a schematic illustration of another processing of the processing apparatus of Figure 9.

13A, 13B, and 13C are schematic views of a stacking manner of a workpiece according to another embodiment of the present invention.

1 is a schematic illustration of a processing apparatus in accordance with an embodiment of the present invention. 2 is a block diagram of the system of the processing apparatus of FIG. 1. Referring to Figures 1 and 2, the processing apparatus 100 of the present embodiment is, for example, a cutting device for performing the cutting of the sheet 80. The processing apparatus 100 includes a first stage 108, a first processing apparatus 106a, a conveyor apparatus 112, and a second processing apparatus 106b, wherein the first processing apparatus 106a and the second processing apparatus 106b may collectively constitute a processing unit 106. The first stage 108 has a bearing surface 108a for carrying the sheet material 80. Additionally, the first processing device 106a can be a laser exit device that can be used to cut and separate the workpiece 90 from the sheet 80. Further, the transfer device 112 can move the cut workpiece 90 in a direction perpendicular to the bearing surface 108a. For example, the transfer device 112 includes an exit mechanism 113a, and the exit mechanism 113a is, for example, a Z-axis ejection mechanism that is disposed on the first stage 108. The exit mechanism 113a can vertically cut the cut workpiece 90 from the first position P1 originally located on the bearing surface 108a. The direction of the carrier surface 108a is moved to a second position P2 also located on the first stage 108 to expose the side 90a of the workpiece 90. Furthermore, the second processing device 106b can perform a subsequent processing step, such as trimming, on the side 90a of the workpiece 90 in the direction of the side 90a of the workpiece 90. It is worth mentioning that in the present embodiment, the area of the bearing surface 108a can be set smaller than the area of the plate 80 so that the outer edge of the plate 80 protrudes outside the first stage 108. For example, the width L2 of the sheet 80 in FIG. 1 is greater than the width L1 of the bearing surface 108a such that the sheet 80 protrudes from the bearing surface 108a. In other embodiments, each side of the sheet 80 may be sized larger than the size of the load bearing surface 108a such that the area of the sheet 80 is greater than the area of the load bearing surface 108a and such that each side of the sheet 80 protrudes from the load bearing surface 108a. In the present embodiment, the length of the sheet 80 projecting surface 108a is, for example, 5 mm. The present embodiment can prevent the heat source such as the laser light from being focused on the first stage 108 via the foregoing configuration, which causes heat loss due to heat conduction of the stage and affects the processing effect.

3A is a schematic illustration of a processing apparatus in accordance with another embodiment of the present invention. In the present embodiment, the processing apparatus 100 may additionally include a second stage 114 to carry the cut workpiece 90, and the cut workpiece 90 is moved by the transfer device 112 from the first position P1 on the first stage 108. To the second position P2' of the second stage 114. In the present embodiment, the conveyor 112 may include a gripping mechanism 113b for gripping the workpiece 90 positioned at the first position P1. For example, the gripping mechanism 113b can be a robotic arm that grasps the workpiece 90 from the first stage 108 and places the workpiece 90 on the second position P2' of the second stage 114. In the present embodiment, the cut workpiece 90 can expose the side 90a of the workpiece 90 for the second through the aforementioned transfer. The processing device 106b performs subsequent processing. Further, in the present embodiment, the processing apparatus 100 may include an edge finding device 107. The edge finding device 107 is disposed, for example, on the second processing device 106b and on one side of the second position P2' of the second stage 114. In the present embodiment, the edge finding device 107 detects the position of the side surface 90a of the workpiece 90 in the form of, for example, infrared rays, so that the second processing device 106b can process the workpiece 90 more accurately.

In addition, a conveyor belt 109 may be disposed on the bearing surface 108a of the first stage 108 of the present embodiment to translate the sheet 80 along the bearing surface 108a. Accordingly, the uncut portion of the sheet 80 described above can be moved to the first position P1 such that the first processing device 106a can cut the remainder of the sheet 80 and separate the other workpieces 90. In addition, the second stage 114 may have a second bearing surface 114a, and a conveyor belt (not shown) may be disposed on the second bearing surface 114a to translate the workpiece 90 that completes the side trimming away from the second. At position P2', other workpieces 90 are moved into the second position P2' for subsequent processing.

Further, the second stage 114 can include a carrier 115 to carry a plurality of workpieces 90 separated from the sheet 80. For example, as shown in FIG. 3A. In this embodiment, the carrier 115 of the second stage 114 can carry a plurality of cut workpieces 90 (three pieces are illustrated in FIG. 3A). When a plurality of workpieces 90 are simultaneously stacked on the second stage 114 by the carrier 115, the second processing apparatus 106b can simultaneously process the side faces 90a of the plurality of workpieces 90 simultaneously to save processing time and improve processing efficiency.

3B is a schematic illustration of an embodiment of the second stage of FIG. 3A. In this embodiment, the second stage body 1140-8 of the second stage 114 can drive the workpiece 90 by The second stage second dimension moving axis 1140-6 rotates relative to the second stage 114. As shown in FIG. 3B, by the rotation of the second stage body 1140-8, the second processing device 106b can trim the different sides 90a, 90b, 90c, 90d of the workpiece 90, respectively.

The block diagrams of the systems of Figures 2 and 4 correspond to the schematic diagrams of the processing apparatus of Figures 1 and 3A, respectively. The processing apparatus 100 of the present embodiment is other than the processing unit 106, the first stage 108, the second stage 114, and the transfer unit 112 described above. The processing device 100 may further include a control terminal unit 104, a human interface unit 102, and a detecting unit 110 that senses an external signal, which control the above components. Further, the processing unit 106 of the present embodiment includes a processing light source unit 1062, and the processing light source unit 1062 includes a processing light source signal transmission/conversion unit 1062-2. In addition, the processing light source unit 1062 further includes first processing light sources 1062-6 and second processing light sources 1062-10 respectively disposed at the first and second processing devices 106a, 106b, and controlling the first and second processing light sources 1062-6 The first processing light source moving axis 1062-4 in the moving direction of 1062-10 and the second processing light source moving axis 1062-8.

In this embodiment, the first and second processing light sources 1062-6 and 1062-10 may be the same or different processing light sources. For example, the first processing light source 1062-6 can be a diode-pumped soild-state laser (DPSSL) having a range of between 1 watt (W) and 100 watts. Average power, and pulse width in the nano-seconds or pico-second range. Additionally, the processing rate of the first processing light source 1062-6 is between 1 cm/sec and 1000 cm/sec. In the present embodiment, the first processing light source 1062-6 may also be a CO ₂ laser, which may have an average power between 1 watt and 300 watts and a pulse width in the nanosecond range. Additionally, the carbon dioxide laser can have a processing rate between 1 cm/sec and 1000 cm/sec. In addition, the second processing light source 1062-10 of the embodiment may also be a carbon dioxide laser. Moreover, the first and second light source moving axes 1062-4, 1062-8 can be the same group or a different set of moving shaft members.

In addition, the processing unit 106 of the present embodiment further includes a light source adjusting unit 1064, wherein the light source adjusting unit 1064 can be coupled to the second processing light source 1062-10 to adjust the light beam emitted by the second processing light source 1062-10. The direction and the light beam emitted by the second processing light source 1062-10 is transmitted to the second carrier 114. In this embodiment, the light source adjusting unit 1064 can be a galvanometer unit, and the light emitting direction of the processing light source of the embodiment can be changed by moving the direction of the adjusting galvanometer. In addition, the light source adjusting unit 1064 may include a galvanometer group 1064-10 coupled to the galvanometer signal transmission/conversion unit 1062-4, the galvanometer axial movement axis 1064-4, and the galvanometer first dimension moving axis 1064-6. And the galvanometer second dimension moving axis 1064-8. In the present embodiment, the signal from the control terminal unit 104 is converted by the galvanometer signal transmission/conversion unit 1064-2 and transmitted to the galvanometer first dimension moving axis 1064-6 and the galvanometer second dimension moving axis 1064-8. The movement of the galvanometer group 1064-10 is controlled to control the light exiting direction of the second processing light source 1062-10.

Further, the first stage 108 may include a first stage signal transmission/conversion unit 1080-2, a first stage first dimension moving axis 1080-4, a first stage second dimension moving axis 1080-6, and a first Stage body 1080-8. In this embodiment, the first stage The first dimension of the first dimension moving axis 1080-4 includes upper and lower (Z), left and right (X), or front and rear (Y), and the second dimension of the first stage second dimension moving axis 1080-6 is the first dimension The central axis of the stage body 1080-8 is rotationally moved. Further, the first stage signal transmission/conversion unit 1080-2 can receive the control signal from the control terminal unit 104, and converts to the first stage first dimension moving axis 1080-4 and the first stage second dimension moving axis The 1080-6 receivable signal controls the movement of the first stage body 1080-8 in the first dimension and the second dimension.

On the other hand, as shown in the embodiment of FIG. 3A and FIG. 4, the second stage 114 may include a second stage signal transmission/conversion unit 1140-2, a second stage first dimension movement axis 1140-4, and a second stage. The second stage has a second dimension moving axis 1140-6 and a second stage body 1140-8. In this embodiment, the first dimension of the second stage first dimension moving axis 1140-4 includes upper and lower (Z), left and right (X), or front and rear (Y), and the second stage has a second dimension moving axis. The second dimension of 1140-6 is rotationally moved by the central axis of the second stage body 1140-8. Further, the second stage signal transmission/conversion unit 1140-2 can receive the control signal from the control terminal unit 104 and converts to the second stage first dimension moving axis 1140-4 and the second stage second dimension moving axis. The 1140-6 receivable signal controls the movement of the second stage body 1140-8 in the first dimension and the second dimension.

Furthermore, the transfer device 112 of the processing apparatus 100 in the embodiment of FIGS. 3A and 4 described above may include, in addition to the gripping mechanism 113b, such as a robot arm, the transfer device 112 further includes a transfer unit signal transmission/conversion unit 1120- 2, and it can be used to receive signals from the control terminal unit 104. In addition, the conveyor 112 also has a first axis of movement 1120-6 and a second axis of movement 1120-8. First moving axis 1120-6 The moving direction includes upper and lower (Z), left and right (X), and front and rear (Y), and the second moving axis 1120-8 is a direction including rotational movement. When the transfer unit signal transmission/conversion unit 1120-2 receives the signal from the control terminal unit 104, the gripping mechanism 113b may control via the received signal via the first moving axis 1120-6 or the second moving axis 1120. -8 actuation produces movement. Additionally, the conveyor 112 can also include a vacuum pump 1120-10 to pick up the workpiece 90 stacked on the second stage 114.

Referring to FIG. 2 and FIG. 4 again, the human interface unit 102 can be used to input various processing parameters, such as the shape and size of the workpiece to be cut, the laser moving speed, the laser output frequency and power, the laser focus position, and Galvanometer strokes, etc. In addition, the human interface unit 102 can also be used to zero or activate the system of the processing apparatus 100, display processed images immediately, and emergency stop processing.

In addition, as shown in the system block diagrams of FIGS. 2 and 4, the control terminal unit 104 of the present embodiment may include a signal transmission/conversion unit 1042, an actuation signal unit 1044, and a feedback operation unit 1046. The function of signal transmission/conversion unit 1042 is to receive information input by human interface unit 102 and convert to a signal pattern that can be received by actuation signal unit 1044, such as digital/analog conversion. In addition, the actuation signal unit 1044 may include a processing light source intensity control unit 1044-2 that controls the intensity of the processing light source, a processing light source frequency control unit 1044-4 that controls the processing light source frequency, and a processing light source position control unit 1044-6 that controls the processing light source position. And an oscillating lens control unit 1044-10 that controls the galvanometer. In addition, the processing apparatus 100 in the embodiment of FIGS. 3A and 4 further includes a transmission device control unit 1044-12 that controls the transmitting device 112, and controls the first and second stages 108, 114 and respectively coupled to the first, Second station letter The first and second stage control units 1044-8, 1044-14, and the like of the number transmission/conversion units 1080-2, 1140-2. Further, the processing light source intensity control unit 1044-2, the processing light source frequency control unit 1044-4, and the processing light source position control unit 1044-6 are commonly coupled to the processing light source transmission/conversion unit 1062-2 of the processing light source unit 1062. In other words, the processing light source transmission/conversion unit 1062-2 can simultaneously receive, convert, and transmit signals from the processing light source intensity control unit 1044-2, the processing light source frequency control unit 1044-4, and the processing light source position control unit 1044-6. Furthermore, the oscillating lens control unit 1044-10 is coupled to the galvanometer signal transmission/conversion unit 1064-2 to convert and transmit the signals to the galvanometer group 1064-10 to control the direction of motion of the galvanometer group 1064-10.

Moreover, as shown in FIG. 2 and FIG. 4, the detecting unit 110 of the processing device 100 includes a detecting signal transmission/conversion unit 1100-2 and a sensor 1100-4. In the present embodiment, the sensor 1100-4 is, for example, a distance sensor for detecting a distance. In addition, the detection signal transmission/conversion unit 1100-2 is coupled to the feedback operation unit 1046 of the control terminal unit 104 to feedback and adjust the respective component devices of the coupling control terminal unit 104, for example, adjusting the intensity, frequency, or The position, or the position of the first and second stages 108, 114.

Referring again to Figures 1 and 3A, in accordance with the above, the processing apparatus 100 of the present invention can perform the cutting of the sheet 80, wherein the sheet 80 is, for example, a multi-layer stack. Further, the processing apparatus 100 may trim the side of the workpiece 90 formed after the sheet 80 is cut, so that the bending stress of the workpiece 100 may be, for example, 300 MPa or more. Controlled by the control terminal unit 104 as described in the above embodiment The first stage body 1080-8, and the workpiece 80 cut by the partial first stage 108 is ejected upward through the ejecting mechanism 113a, or transmitted to the second stage 114 by the grasping mechanism 113b. Next, the processing unit 106, the first stage 108, and/or the second stage 114 are adjusted in accordance with the structural shape and size to be formed by the human interface unit 102. Further, the undulation of the side surface 90a of the workpiece 90 is sensed by the detecting unit 110. Then, the position of the processing light source unit 1062 or the first stage 108 and/or the second stage 114 is adjusted by the feedback arithmetic unit 1046. Moreover, the processing apparatus 100 can further adjust and change the light exit path of the second processing light source 1062-10 via the auxiliary of the galvanometer group 1064-10 to complete the trimming of the workpiece 90.

Figure 5 is a schematic illustration of a sheet of a processing apparatus in accordance with an embodiment of the present invention. In the present embodiment, the sheet material 80 may have a multi-layered structure, and the sheet material 80 includes a first substrate 82, a second substrate 86, and a glue layer 84. The first substrate 82 can be disposed, for example, on the first stage 108 bearing surface 108a. Further, the second substrate 86 may be disposed on the first substrate 82, and the hardness of the second substrate 86 is smaller than the hardness of the first substrate 82. Furthermore, the glue layer 84 is disposed between the first substrate 82 and the second substrate 86. For example, the first substrate 82 is, for example, a hard and brittle material layer composed of ultra-thin glass, and the second substrate 86 is, for example, a polymer formed of polyethylene terephthalate (PET). Polymer layer. In addition, the glue layer 84 is composed of, for example, optical clear adhesion (OCA).

6A is a schematic diagram of a scan path of a first processing light source, in accordance with an embodiment of the present invention. Figure 6B is a top plan view of the scan path of the first processing light source of Figure 6A. Please refer to FIG. 6A and FIG. 6B, when the first processing light source of the first processing device 106a is used. When the plate 80 is cut 1062-6, the second substrate 86 faces the first processing light source 1062-6, and the focus point 20 of the first processing beam emitted by the first processing light source 1062-6 is located at the first of the first substrate 82. Surface 82a, and first surface 82a is adjacent to glue layer 84. In the present embodiment, focusing the focus point 20 on the first surface 82a of the first substrate 82 composed of a hard and brittle material layer can achieve a narrower cut width and stronger cutting energy. Further, as shown in FIG. 6B, a top view of the cutting path of the first processing light source 1062-6 is shown as path 22. The cutting mode of this embodiment is to perform scanning by scanning left and right along the cutting path 22, wherein the number of scanning is related to the thickness of the workpiece 80.

7A is a schematic diagram of a scan path of a first processing light source in accordance with another embodiment of the present invention. Figure 7B is a top plan view of the scan path of the first processing light source of Figure 7A. Referring to FIGS. 7A and 7B, in the present embodiment, when the sheet 80 is cut along the processing path 26 by the first processing light source 1062-6 of the first processing device 106a, the second substrate 86 faces the first processing light source 1062- 6. The focus point 24 of the first processing light source 1062-6 is located outside of the sheet 80 and at a distance from the third surface 86a of the second substrate 86, wherein the focus point 24 is spaced from the third surface 86a by a distance of 0 microns. Between 1000 microns. The third surface 86a and the glue layer 84 are respectively located on opposite sides of the second substrate 86. As noted above, the focus point 24 of the first processing light source 1062-6 is focused over the surface of the sheet 80, i.e., the sheet 80 is cut in a so-called lower defocusing manner to complete a partial offset cut. As shown in Fig. 7A and Fig. 7B, the portion of the area A1 in the figure is the portion selectively cut. The lower defocusing mode can achieve a larger line width to improve the removal efficiency and make the focus point 24 away from the first base. The plate 82 avoids damaging the surface of the first substrate 82. That is, the cutting method of the present embodiment can avoid damage such as the surface of the glass substrate.

Further, the workpiece 90 cut through the cutting method of the above embodiment is, for example, the circular workpiece 90-1 in Fig. 8A, the rectangular workpiece 90-2 in Fig. 8B, or the irregular shaped workpiece 90-4 in Fig. 8D. In addition, in the processing step of forming the rectangular workpiece 90-2, a galvanometer group 1064-10 having a higher focusing depth of field may be additionally used, and in the case of constant processing of the focal length of the light source, a rectangular guide as shown in FIG. 8C The corner regions are machined to form a tapered rectangular workpiece 90-3. In the present embodiment, the circular workpiece 90-1 of FIG. 8A includes a first circular substrate 92-1, a circular rubber layer 94-1, and a second circular substrate 96-1. The rectangular workpiece 90-2 of FIG. 8B includes a cut first rectangular substrate 92-2, a rectangular adhesive layer 94-2, and a second rectangular substrate 96-2. The lead-angle rectangular workpiece 90-3 of FIG. 8C includes a cut-out first lead-angle rectangular substrate 92-3, a lead-angle rectangular adhesive layer 94-3, and a second lead-angle rectangular substrate 96-3. Further, the irregular shaped workpiece 90-4 of FIG. 8D includes the cut first irregular shaped substrate 92-4, the irregular shaped adhesive layer 94-4, and the second irregular shaped substrate 96-4. Of course, the shape of the workpiece 90 formed by the processing steps of the present invention is not limited to the aforementioned shape. In this embodiment, the desired workpiece shape can be formed by processing the light source and adjusting the position of the workpiece.

Figure 9 is a schematic illustration of a processing apparatus in accordance with another embodiment of the present invention. 10A and 10B are schematic views of a scanning path of the second processing light source of Fig. 9. The processing apparatus 100 of the present embodiment is different from the above embodiment in that the second processing light source 1062-10 of the second processing device 106b can be disposed on the side of the second position P2' as shown in FIG. The second processing light source 1062-10 can be disposed at the second position P2' Above, the front side of the workpiece 90 is trimmed. In addition, as shown in FIGS. 10A and 10B, in the present embodiment, when the second processing light source 1062-10 trims the workpiece 90, the second substrate 96 faces the second processing light source 1062-10, and the second processing The focus point 60 of the second processing beam emitted by the light source 1062-10 is located on the first surface 92a of the first substrate 92, and the first surface 92a is adjacent to the glue layer 94. When the focus point 60 of the second processing light source 1062-10 is focused on the first surface 92a of the first substrate 92 composed of a hard and brittle material layer, a narrower trimming width can be achieved and a stronger light source trimming can be achieved. energy. In addition, as shown in FIG. 10B, a top view of the trimming scan path of the second processing light source 1062-10 is shown as path 62. The manner of trimming in this embodiment is to scan left and right along the trimming path 62 to complete the trimming, and the number of scans is related to the thickness of the workpiece 90.

Figure 11 is a schematic illustration of another processing of the processing apparatus of Figure 9. In the present embodiment, when the workpiece 90 is moved to the second position P2', the first substrate 92 faces the second processing light source 1062-10, and the focus point 64 of the second processing beam of the second processing light source 1062-10 is located The second surface 92b of the first substrate 92. In addition, the second surface 92b and the glue layer 94 are respectively located on opposite sides of the first substrate 92.

Further, Fig. 12 is a schematic view showing another processing mode of the processing apparatus of Fig. 9. In the present embodiment, when the workpiece 90 is moved to the second position P2', the second substrate 96 faces the second processing light source 1062-10, and the focus point 70 of the second processing light source 1062-10 is located on the second substrate 96. Third surface 96a. In addition, the third surface 96a and the glue layer 94 are respectively located on opposite sides of the second substrate 96.

According to the trimming method in the above embodiment, when the processing apparatus 100 is initially scanned After the shape of the workpiece 90 has been cut and cut, as shown in the embodiment of FIG. 12, a process of directly performing the front side trimming directly with the processing light source can be selected. Alternatively, as shown in the embodiment of FIG. 11, the edge of the workpiece 90 is first partially selectively cut to remove the high molecular polymer and the glue layer 94 included in the second substrate 96 to avoid the second substrate 96. The high molecular polymer and the rubber layer 94 absorb the processing beam and affect the trimming effect.

13A, 13B, and 13C are schematic views of a stacking method of a workpiece according to another embodiment of the present invention. As shown in FIG. 13A, when the plurality of workpieces 90 (three layers are illustrated in FIG. 13A) are stacked together, since the focus point 50 of the second processing light source 1062-10 is increased by the scanning distance d1 when trimming, thereby increasing The second processing light source 1062-10 scans the path and time and causes heat loss during scanning trimming. In other words, when the workpiece 90 of the top or bottom end is scanned, the heat of the workpiece 90 at the other end has been lost. Therefore, when the number of stacked workpieces 90 is increased, it is necessary to reduce the scanning interval time t1, t2 between the workpieces 90. That is, the speed at which the second processing light source 1062-10 is scanned is further increased to slow the side heat loss of the workpiece 90. In addition, as shown in FIG. 13B, when the plurality of workpieces 90 are stacked together, the focus point 50 of the second processing light source 1062-10 can be continuously scanned and trimmed by the workpiece 90 of the upper layer toward the workpiece 90 below. Better trimming effect.

As shown in FIG. 13C, when the second processing light source 1062-10 performs front trimming on the workpiece 90, a plurality of alignment marks 119 may be disposed around the workpiece 90 to improve the accuracy of the workpiece 90 alignment. And the second processing light source 1062-10 can more accurately trim the workpiece 90. In detail, in the embodiment, the alignment mark 119 and the workpiece 90 may have a distance d2, so that the second processing light source When the workpiece 90 is trimmed by the 1062-10, the trimming distance around the workpiece 90 can be fixed.

In summary, the processing apparatus of the present invention can cut the sheet material and at the same time trim the workpiece separated by the sheet material. Therefore, the cutting and trimming process of the panel can be integrated. Furthermore, in the various embodiments of the invention described above. The processing equipment can change the path of cutting and trimming of the processing light source by adjusting the processing light source and the position of the workpiece to enhance the focusing effect of the light source, and further improve the quality of the board cutting and the trimming process of the workpiece. In addition, the processing light source can be matched with the galvanometer group and the direction and position of the light emitted by the processing light source can be adjusted via the movement of the galvanometer group. Therefore, the processing apparatus of the present invention can simultaneously perform a trimming process of a workpiece such as a multi-layer stacked structure, thereby improving the process efficiency of the overall processing apparatus.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

80‧‧‧ plates

90‧‧‧Workpiece

90a‧‧‧ side

100‧‧‧Processing equipment

106a‧‧‧First processing unit

106b‧‧‧Second processing unit

107‧‧‧ Edge-finding device

108‧‧‧First stage

108a‧‧‧ bearing surface

112‧‧‧Transportation device

113a‧‧‧Exit agency

1062-4‧‧‧The first processing light source moving axis

1062-6‧‧‧First processing light source

1062-10‧‧‧Second processing light source

1080-4‧‧‧First stage first dimension moving axis

1080-6‧‧‧First stage second dimension moving axis

L1, L2‧‧‧ width

P1‧‧‧ first position

P2‧‧‧ second position

Claims (20)

A processing apparatus comprising: a first stage having a bearing surface for carrying a plate, wherein an area of the bearing surface is set to be smaller than an area of the plate, and an outer edge of the plate protrudes from the first a first processing device for separating a workpiece from the plate; a conveying device for moving the workpiece from a first position to a second position and exposing a side of the workpiece; And a second processing device for processing the side of the workpiece in the second position. The processing apparatus of claim 1, wherein the conveying device comprises an ejection mechanism disposed on the first stage for vertically perpendicular to the workpiece after the workpiece is separated from the sheet Move the workpiece up or down in the direction. The processing apparatus of claim 1, wherein the conveying device comprises a gripping mechanism for gripping the workpiece at the first position and moving the workpiece from the first position to the second position. The processing apparatus of claim 1, wherein the first stage is adapted to translate the sheet along the bearing surface, and move the other portion of the sheet to the first position for use by the first processing device Another workpiece is separated from the sheet. The processing apparatus of claim 1, wherein the first location and the second location are both located on the first stage. The processing apparatus of claim 1, further comprising a second stage, wherein the second position is located on the second stage. The processing apparatus of claim 6, wherein the second stage is adapted to translate the workpiece along a second bearing surface. The processing apparatus of claim 6, wherein the second stage comprises a carrier for carrying a plurality of workpieces separated from the plate, and the second processing device is adapted to be stacked on the carrier. The sides of the workpieces are simultaneously processed. The processing apparatus of claim 1, wherein the sheet material has a multi-layer structure, comprising: a first substrate disposed on the bearing surface; a second substrate disposed on the first substrate, and the The hardness of the second substrate is smaller than the hardness of the first substrate; and a glue layer is disposed between the first substrate and the second substrate. The processing apparatus of claim 9, wherein the first processing device comprises a first processing light source located above the first stage. The processing apparatus of claim 10, wherein the second substrate faces the first processing light source, and a focus point of the first processing beam is located on a first surface of the first substrate, the first surface Adjacent to the glue layer. The processing apparatus of claim 10, wherein the second substrate faces the first processing light source, and a focus point of the first processing beam is located And a third surface of the second substrate is separated from the third surface of the second substrate, the third surface and the adhesive layer are respectively located on opposite sides of the second substrate. The processing apparatus of claim 9, wherein the second processing device comprises: a second processing light source for providing a second processing beam to the side of the workpiece; and a light source adjusting unit coupled And the second processing light source is configured to adjust the second processing beam emitted by the second processing source and transmit the second processing beam to the sheet. The processing apparatus of claim 13, wherein the second processing light source is disposed at one side of the second position. The processing apparatus of claim 13, wherein the second processing light source is disposed above the second position. The processing apparatus of claim 13, wherein when the workpiece is moved to the second position, the second substrate faces the second processing light source, and a focus point of the second processing beam is located at the second a first surface of a substrate adjacent the glue layer. The processing apparatus of claim 13, wherein the first substrate faces the second processing light source when the workpiece is moved to the second position, and a focus point of the second processing beam is located at the second a second surface of the substrate, the second surface and the adhesive layer are respectively located on opposite sides of the first substrate. The processing apparatus of claim 13, wherein when the workpiece is moved to the second position, the second substrate faces the second processing light source, and a focus point of the second processing beam is located at the second a third surface of the second substrate, the third surface and the adhesive layer are respectively located on opposite sides of the second substrate. The processing apparatus of claim 13 further comprising a edge finding device disposed on one side of the second position for detecting a position of the side of the workpiece. The processing apparatus of claim 13, wherein the light source adjusting unit comprises a galvanometer module.