TWI593331B - Device and method for detaching protective foils - Google Patents
Device and method for detaching protective foils Download PDFInfo
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- TWI593331B TWI593331B TW104125394A TW104125394A TWI593331B TW I593331 B TWI593331 B TW I593331B TW 104125394 A TW104125394 A TW 104125394A TW 104125394 A TW104125394 A TW 104125394A TW I593331 B TWI593331 B TW I593331B
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- Prior art keywords
- protective film
- printed circuit
- circuit board
- drum
- air nozzle
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- 230000001681 protective effect Effects 0.000 title claims description 126
- 238000000034 method Methods 0.000 title claims description 16
- 239000011888 foil Substances 0.000 title 1
- 230000000153 supplemental effect Effects 0.000 claims description 19
- 238000000926 separation method Methods 0.000 claims description 16
- 239000000758 substrate Substances 0.000 description 49
- 230000000694 effects Effects 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 239000012528 membrane Substances 0.000 description 9
- 230000032258 transport Effects 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000011151 fibre-reinforced plastic Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1858—Handling of layers or the laminate using vacuum
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
本發明係有關一種用於自印刷電路板剝離保護膜之裝置及方法。 The present invention relates to an apparatus and method for peeling a protective film from a printed circuit board.
印刷電路板(德文亦稱Leiterkarte、Platine或gedruckte Schaltung;英文為printed circuit board,PCB)乃電子組件之載體。其作用在於機械固定與電性連接。印刷電路板由電絕緣材料及附著於其上之導電連接(印刷導線)組成。絕緣材料一般採用纖維強化塑膠。 Printed circuit boards (also known as Leiterkarte, Platine or gedruckte Schaltung; printed circuit boards in English) are the carriers of electronic components. Its role lies in mechanical fixation and electrical connection. The printed circuit board consists of an electrically insulating material and an electrically conductive connection (printed wire) attached thereto. Insulating materials are generally made of fiber reinforced plastic.
先前技術藉由所謂的截片層壓機(Cut-Sheet-Laminator)在銅包印刷電路板基板上全自動雙面層壓具有保護膜之光聚合物層。其中將具有距邊緣一定距離之保護膜的截切光聚合物層覆蓋於銅包印刷電路板基板上。該膜較佳具有介於0.5mm與3mm間之邊距。但在加工程序期間須再度自印刷電路板上移除保護膜。 The prior art fully automatic double-sided lamination of a photopolymer layer having a protective film on a copper clad printed circuit board substrate by a so-called Cut-Sheet-Laminator. A cut photopolymer layer having a protective film at a distance from the edge is overlaid on the copper clad printed circuit board substrate. The film preferably has a margin between 0.5 mm and 3 mm. However, the protective film must be removed from the printed circuit board again during the processing procedure.
現有之全自動設備既能層壓具有保護膜之光聚合物層,亦能再度移除該保護膜。然而總是無法取得良好的膜移除效果。在所用之印刷電路板基板(厚度不超過12.5μm)及銅包層(厚度約為9μm,部分銅厚至多為數μm)愈來愈薄的情況下,曝光程序後 較難自光聚合物層上剝離保護膜。在此過程中,銅包印刷電路板基板有可能因例如彎折而受損。 The existing fully automatic device can laminate the photopolymer layer with the protective film and can remove the protective film again. However, good film removal is never achieved. In the case where the printed circuit board substrate (thickness not exceeding 12.5 μm) and the copper clad layer (thickness of about 9 μm, part of the copper thickness is at most several μm) are getting thinner and thinner, after the exposure process It is more difficult to peel off the protective film from the photopolymer layer. During this process, the copper clad printed circuit board substrate may be damaged by, for example, bending.
另,此等層壓-曝光-剝離-顯影及剝除程序係在線速最高為9m/min之自動設備中進行。迄今為止,習知裝置在如此之高的速度下尚未取得過良好的膜分離效果。 In addition, such lamination-exposure-peel-developing and stripping procedures are carried out in automated equipment having a line speed of up to 9 m/min. To date, conventional devices have not achieved good membrane separation at such high speeds.
EP215397B1揭露一種用於自銅包印刷電路板基板雙面剝離保護膜之裝置。其係一用於剝離附著於板體上之薄膜的裝置,其中用壓力零件向附著於板件上之薄膜的前表面施加壓力並在此區域利用液體噴射裝置自板體上剝離薄膜。 EP 215 397 B1 discloses a device for peeling off a protective film from a copper clad printed circuit board substrate. It is a device for peeling off a film attached to a plate body, wherein a pressure member applies pressure to a front surface of a film attached to the plate member and a film is peeled from the plate body by a liquid ejecting device in this region.
US20140076501A1揭露一種用於自基板剝離薄膜之設備。該設備為此而具有用於傳送基板之傳送模組及剝離模組。例如雙面設有具保護作用之薄膜的OLED顯示器。 US 20140076501 A1 discloses an apparatus for stripping a film from a substrate. For this purpose, the device has a transport module for transporting the substrate and a stripping module. For example, an OLED display having a protective film on both sides is provided.
DE4221703C2揭露一種特別用於自銅包印刷電路板單面或雙面剝離保護膜之方法與裝置。印刷電路板上附著有保護膜,其中先在印刷電路板邊緣處用由中空針構成之劃吹單元剝脫保護膜並噴氣以掀起保護膜。在繼續推進印刷電路板之過程中,保護膜沿中空針之針背成銳角地被抬升到板狀導引鰭片上並由運送機構送去盤捲。該保護膜與先前已剝離之保護膜熱連接,其中在此區域設有用於導引印刷電路板之板狀導引鰭片。導引鰭片間相隔一定距離,即便彎曲的印刷電路板亦能沿程序流程方向穿過導引鰭片間之間隙。 DE 42 21 703 C2 discloses a method and a device for stripping a protective film on a single or double side from a copper clad printed circuit board. A protective film is attached to the printed circuit board, wherein the protective film is first peeled off at the edge of the printed circuit board by a blowing unit composed of a hollow needle and jetted to lift the protective film. In the process of continuing to advance the printed circuit board, the protective film is lifted to the plate-shaped guide fins at an acute angle along the needle back of the hollow needle and sent to the coil by the transport mechanism. The protective film is thermally connected to the previously peeled protective film, wherein a plate-shaped guide fin for guiding the printed circuit board is provided in this region. The guide fins are separated by a certain distance, even if the curved printed circuit board can pass through the gap between the guide fins in the direction of the program flow.
WO2011035932A2描述一種特別用於分離膜與印刷電路板之裝置與方法。該裝置具有包含分離邊之板體,該分離邊局部呈楔形且可嵌入印刷電路板與膜之間。分離邊尖端設有出氣點。 透過吹入空氣而在分離邊區域將膜與印刷電路板分離。 WO2011035932A2 describes an apparatus and method, in particular for separating membranes from printed circuit boards. The device has a plate body with discrete edges that are partially wedge-shaped and can be embedded between the printed circuit board and the film. The outlet tip has an outlet point. The film is separated from the printed circuit board in the separated side region by blowing in air.
前述所有的習知裝置及方法皆無法自上面層壓有聚合物層之極薄印刷電路板基板上分離保護膜而不致印刷電路板受損。印刷電路板多數情況下會彎折。 None of the above conventional devices and methods are capable of separating the protective film from the extremely thin printed circuit board substrate on which the polymer layer is laminated without impairing the printed circuit board. Printed circuit boards are bent in most cases.
因此,本發明之目的在於提供一種能在較高線速下自極薄的銅包印刷電路板基板分離保護膜而不致印刷電路板基板受損之裝置及方法。 SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an apparatus and method for separating a protective film from an extremely thin copper-clad printed circuit board substrate at a relatively high line speed without damaging the printed circuit board substrate.
主要特徵在於,在剝離單元之進料區設有至少一補充空氣噴嘴,該補充空氣噴嘴為滾筒加載空氣流並使保護膜之已鬆脫部分沿滾筒貼附。 The main feature is that at least one supplemental air nozzle is provided in the feed zone of the stripping unit, the supplemental air nozzle loading the drum with an air flow and attaching the released portion of the protective film along the roller.
本發明之特徵在於,作為吸住保護膜之已分離末端的第一步驟,不使用設於滾筒中之真空抽吸器,而是採用更弱之抽吸效應。 The present invention is characterized in that, as a first step of sucking the separated end of the protective film, a vacuum aspirator provided in the drum is not used, but a weaker suction effect is employed.
先前技術並非如此處理,因為先前技術總是使用具強抽吸功能之吸氣嘴。 The prior art does not treat this as the prior art always uses a suction nozzle with a strong suction function.
其缺點在於,設於滾筒中的真空抽吸器雖能吸住保護膜之已分離末端並將其保持在滾筒周邊,但與此同時,抽吸空氣流強烈到非期望地一併吸起印刷電路板,致使印刷電路板彎折或以其他方式嚴重受損。 The disadvantage is that the vacuum aspirator provided in the drum can suck the separated end of the protective film and keep it at the periphery of the drum, but at the same time, the suction air flow is strongly and undesirably sucked up and printed together. The board causes the printed circuit board to bend or otherwise be severely damaged.
根據本發明,保護膜之已分離末端的起點並非被吸嘴吸住,而是先透過柯安達效應貼附於滾筒外周,而後隨滾筒旋轉一定角度,直至設於滾筒中之吸嘴截住已分離末端並將其運離。 According to the present invention, the starting point of the separated end of the protective film is not sucked by the suction nozzle, but is attached to the outer circumference of the drum through the Coanda effect, and then rotated by a certain angle with the drum until the nozzle provided in the drum intercepts The ends are separated and transported away.
藉此確保保護膜之已分離末端最初係透過極弱之抽 吸效應貼附於滾筒外周,後期由吸嘴產生更強之抽吸效應,而此時該吸嘴已與印刷電路板隔開足夠距離,發揮作用時無法再損壞印刷電路板。 Thereby ensuring that the separated end of the protective film is initially transmitted through the weak pump The suction effect is attached to the outer circumference of the drum, and a stronger suction effect is generated by the suction nozzle at a later time. At this time, the suction nozzle is separated from the printed circuit board by a sufficient distance, and the printed circuit board can no longer be damaged when it functions.
根據本發明之第一實施例,該依照柯安達原理產生較弱之抽吸效應的補充空氣噴嘴設於該滾筒上游,以便在滾筒外周形成切線空氣流。根據第二實施例,該補充空氣噴嘴整合於該滾筒中,具體設於形成於該處之槽隙區域。若下文中以單數形式描述補充空氣噴嘴,則此描述不具限制性,因為實際操作時可並接設置數個補充空氣噴嘴。 According to a first embodiment of the invention, the supplemental air nozzle which produces a weaker suction effect in accordance with the Coanda principle is provided upstream of the drum to form a tangential air flow over the outer circumference of the drum. According to a second embodiment, the supplemental air nozzle is integrated in the drum, in particular in the slot region formed there. If the supplementary air nozzle is described singular in the following, this description is not restrictive since several supplementary air nozzles may be provided in parallel in actual operation.
根據第一較佳實施例,基本上沿旋轉上滾筒及/或下滾筒之槽切線地吹入空氣,且該空氣將中間區域已輕微剝脫之保護膜與印刷電路板分離。透過滾筒之旋轉以及將保護膜保持於滾筒表面,將已剝脫之膜柔和地與易彎的薄印刷電路板分離。 According to the first preferred embodiment, air is blown tangentially along the slots of the upper and/or lower rollers, and the air separates the protective film which has been slightly peeled off from the intermediate portion from the printed circuit board. The peeled film is gently separated from the pliable thin printed circuit board by the rotation of the drum and by holding the protective film on the surface of the drum.
本發明之裝置對柯安達效應加以利用,其特點在於,柯安達流(Coanda-Strömung)順著凸壁流動且不脫離此表面。因此,所產生之空氣噴流會沿滾筒之凸出柱面流動。由此形成之空氣流使保護膜吸附在柱面上且隨滾筒一起旋轉。由此在槽區形成負壓,保護膜在該負壓作用下幾乎360°附著於滾筒表面。 The apparatus of the present invention utilizes the Coanda effect, which is characterized in that Coanda-Strömung flows along the convex wall without departing from the surface. Therefore, the generated air jet flows along the convex cylinder of the drum. The air flow thus formed causes the protective film to adhere to the cylinder surface and rotates with the drum. Thereby, a negative pressure is formed in the groove region, and the protective film adheres to the drum surface almost 360° under the action of the negative pressure.
為此,較佳地該裝置在滾筒之槽隙區域具有所謂的上下(補充)空氣噴嘴,該等(補充)空氣噴嘴沿滾筒表面保持住保護膜之已鬆脫部分。此種柔和的膜保持效果係透過柯安達效應(或伯努利效應或流體動力學佯謬)而實現。補充空氣噴嘴所產生之氣體噴流乃空間上較窄之流,其明顯有別於(大多靜止的)周圍環境。 To this end, preferably the device has so-called up and down (supplement) air nozzles in the slot region of the drum which hold the released portion of the protective film along the surface of the drum. This gentle membrane retention is achieved by the Coanda effect (or Bernoulli effect or hydrodynamic enthalpy). The gas jet produced by the supplemental air nozzle is a spatially narrow stream that is distinctly different from the (mostly stationary) surrounding environment.
較佳在成功分離膜與印刷電路板後啟動真空抽吸 器,該真空抽吸器繼續將膜保持於滾筒表面。成功轉移後切斷空氣噴嘴。 Preferably, vacuum suction is initiated after successful separation of the membrane from the printed circuit board The vacuum aspirator continues to hold the membrane to the surface of the drum. The air nozzle is cut off after successful transfer.
該保護膜較佳在滾筒旋轉90°時便已被本發明之裝置保持住,而後被轉移給整合式真空抽吸器。 The protective film is preferably held by the apparatus of the present invention when the drum is rotated 90° and then transferred to the integrated vacuum aspirator.
根據較佳實施例,該剝離裝置具有唯一一個設有補充空氣槽之旋轉滾筒。此實施例用於分離印刷電路板基板其中一面之膜。 According to a preferred embodiment, the stripping device has a single rotating drum with a supplemental air slot. This embodiment is for separating a film on one side of a printed circuit board substrate.
但本發明不限於設置一個旋轉滾筒。本發明亦可設置數個包含補充空氣槽之旋轉滾筒。 However, the invention is not limited to providing a rotating drum. The present invention can also be provided with a plurality of rotating drums including supplemental air slots.
根據另一較佳實施例,該剝離裝置具有兩個沿垂直方向隔開設置之旋轉滾筒。在此實施例中,印刷電路板基板從該等旋轉滾筒之間穿過,從而完成印刷電路板基板頂面與底面之兩膜的分離程序。 According to another preferred embodiment, the stripping device has two rotating drums spaced apart in a vertical direction. In this embodiment, the printed circuit board substrate is passed between the rotating rollers to complete the separation process of the two films of the top and bottom surfaces of the printed circuit board substrate.
先將下保護膜運入收料容器為有益之舉。上滾筒旋轉360°,其中在上下滾筒之接觸區將膜由上滾筒轉移至下滾筒。而後將膜由下滾筒放入收料容器。其優點主要在於僅需設置一個收料容器,此點會對必要的空間需求產生有益影響。 It is beneficial to first transport the lower protective film into the receiving container. The upper drum is rotated 360°, wherein the film is transferred from the upper drum to the lower drum in the contact zone of the upper and lower drums. The film is then placed in the receiving container by the lower roller. The main advantage is that only one receiving container needs to be set, which has a beneficial effect on the necessary space requirements.
較佳在將膜轉移至下滾筒時切斷真空抽吸器,從而使保護膜脫離滾筒表面並落入收料容器。作為補充或替代方案,亦可藉由輕微施加壓縮空氣及/或透過機械式剝離裝置元件來實現膜之分離。 Preferably, the vacuum aspirator is cut off when the film is transferred to the lower drum, so that the protective film is detached from the surface of the drum and falls into the receiving container. Additionally or alternatively, the separation of the membranes can also be achieved by the slight application of compressed air and/or by mechanical peeling device elements.
由於所有保護膜皆被存放於保護膜剝離裝置下方之共用收料容器,僅形成較小之空氣擾流,故此類設備亦可在無塵室內操作。 Since all protective membranes are stored in a common receiving container below the protective film stripping device, only a small air turbulence is formed, so that such equipment can also be operated in a clean room.
根據另一較佳實施例,本發明之保護膜剝離裝置可在生產線上全自動操作。其原因在於本發明之裝置能達到極高的無錯分離率。 According to another preferred embodiment, the protective film peeling device of the present invention can be fully automated on a production line. The reason for this is that the apparatus of the present invention achieves an extremely high error-free separation rate.
此外,該保護膜剝離裝置極為緊湊且節省空間。其優點主要在於,該裝置能以儘可能短的線長整合到包含曝光機、剝除機及顯影模組之生產線中。 In addition, the protective film peeling device is extremely compact and space-saving. The main advantage is that the device can be integrated into the production line including the exposure machine, the stripper and the developing module with as short a line length as possible.
本發明之發明目的不僅包含個別請求項之目的,亦包含個別請求項之組合。 The object of the invention is to include not only the purpose of the individual claims but also the combination of individual claims.
文件(包括發明摘要)中所揭露之全部資訊與特徵,尤其是圖式中所示之空間構造,凡單獨或組合視之相對於先前技術具新穎性者,皆應當被視作本發明之創新點。 All the information and features disclosed in the document (including the abstract of the invention), especially the spatial construction shown in the drawings, should be considered as innovations of the present invention, whether individually or in combination with the novelty of the prior art. point.
以下參照圖式及其所示之若干實施途徑詳細闡述本發明。本發明其他構成創新點之特徵與優點包含於圖式及相關說明中。 The invention is explained in detail below with reference to the drawings and several embodiments thereof shown. The features and advantages of other constituent innovations of the present invention are included in the drawings and the associated description.
1‧‧‧剝離裝置 1‧‧‧ peeling device
2‧‧‧印刷電路板基板 2‧‧‧Printed circuit board substrate
3‧‧‧上光聚合物層 3‧‧‧Uplighting polymer layer
4‧‧‧下光聚合物層 4‧‧‧ Lower photopolymer layer
5‧‧‧保護膜 5‧‧‧Protective film
6‧‧‧保護膜 6‧‧‧Protective film
7‧‧‧剝離單元 7‧‧‧ peeling unit
8‧‧‧剝離單元 8‧‧‧ peeling unit
9‧‧‧進料區 9‧‧‧feeding area
10‧‧‧出料區 10‧‧‧Drawing area
11‧‧‧進料區之感測器 11‧‧‧Sensor in the feed zone
12‧‧‧送料輥 12‧‧‧Feed roller
13‧‧‧補充空氣噴嘴 13‧‧‧Additional air nozzle
14‧‧‧真空抽吸器 14‧‧‧Vacuum aspirator
14a‧‧‧上真空抽吸器 14a‧‧‧Upper vacuum aspirator
14b‧‧‧下真空抽吸器 14b‧‧‧Under vacuum aspirator
15‧‧‧滾花輪 15‧‧‧Rolling wheel
16‧‧‧滾花輪 16‧‧‧ knurling wheel
17‧‧‧預備空氣噴嘴 17‧‧‧Prepared air nozzle
18‧‧‧預備空氣噴嘴 18‧‧‧Prepared air nozzle
19‧‧‧鰭片 19‧‧‧Fins
20‧‧‧鰭片 20‧‧‧Fins
21‧‧‧主空氣噴嘴 21‧‧‧Main air nozzle
22‧‧‧主空氣噴嘴 22‧‧‧Main air nozzle
23‧‧‧上出料輥 23‧‧‧Upper discharge roller
24‧‧‧下出料輥 24‧‧‧Under discharge roller
25‧‧‧滾筒 25‧‧‧Roller
26‧‧‧滾筒 26‧‧‧Roller
27‧‧‧補充空氣噴嘴槽隙 27‧‧‧Additional air nozzle slot
28‧‧‧補充空氣噴嘴槽隙 28‧‧‧Additional air nozzle slot
29‧‧‧收料容器 29‧‧‧ receiving container
30‧‧‧抽吸區 30‧‧‧Sucking area
31‧‧‧已分離末端 31‧‧‧Separated ends
圖1為保護膜剝離裝置及位於進料區之銅包印刷電路板基板的剖面示意圖;圖2為剝離裝置俯視示意圖;圖3為剝離裝置進料區在偵測到印刷電路板基板前緣時之剖面示意圖;圖4為剝離裝置在將滾花輪放置到印刷電路板基板前緣上時之剖面示意圖;圖5為剝離裝置在將保護膜放置到鰭片尖端上時之剖面示意 圖;圖6為剝離裝置在保護膜前緣到達兩鰭片末端時之剖面示意圖;圖7為剝離裝置在啟動補充空氣噴嘴時之剖面示意圖;圖8為保護膜剝離裝置及銅包印刷電路板基板在下保護膜與滾筒表面分離及上滾筒繼續運送保護膜時之剖面示意圖;圖9為保護膜剝離裝置及銅包印刷電路板基板在將下保護膜存放於存放容器及上保護膜前緣到達上滾筒與下滾筒之接觸位置時的剖面示意圖;圖10為保護膜剝離裝置及銅包印刷電路板基板在透過由上真空抽吸器切換為下真空抽吸器抽真空而將上保護膜由上滾筒轉移至下滾筒(26)時之剖面示意圖;圖11為保護膜剝離裝置及銅包印刷電路板基板在下滾筒將上保護膜運離上滾筒及下滾筒旋轉約90°後鬆開保護膜時之剖面示意圖;圖12為保護膜剝離裝置及銅包印刷電路板基板在將上保護膜存放於存放容器時之剖面示意圖。 1 is a schematic cross-sectional view of a protective film peeling device and a copper clad printed circuit board substrate located in a feeding zone; FIG. 2 is a top plan view of the peeling device; and FIG. 3 is a peeling device feed zone when detecting a leading edge of the printed circuit board substrate Figure 4 is a schematic cross-sectional view of the stripping device when the knurling wheel is placed on the leading edge of the printed circuit board substrate; Figure 5 is a schematic cross-sectional view of the stripping device when the protective film is placed on the tip of the fin Figure 6 is a schematic cross-sectional view of the peeling device when the leading edge of the protective film reaches the end of the two fins; Figure 7 is a schematic cross-sectional view of the peeling device when the supplementary air nozzle is activated; Figure 8 is a protective film peeling device and a copper clad printed circuit board The cross-sectional view of the substrate when the lower protective film is separated from the surface of the drum and the upper drum continues to transport the protective film; FIG. 9 is the protective film peeling device and the copper-clad printed circuit board substrate are stored in the storage container and the front edge of the upper protective film. FIG. 10 is a schematic cross-sectional view of the upper roller and the lower roller in contact with each other; FIG. 10 is a protective film peeling device and a copper-clad printed circuit board substrate. The upper protective film is removed by being vacuumed by the upper vacuum aspirator to the lower vacuum aspirator. FIG. 11 is a schematic cross-sectional view showing the protective film peeling device and the copper-clad printed circuit board substrate. After the lower roller rotates the upper protective film away from the upper roller and the lower roller by about 90°, the protective film is released. FIG. 12 is a schematic cross-sectional view showing the protective film peeling device and the copper clad printed circuit board substrate when the upper protective film is stored in the storage container.
圖1為剝離裝置1及位於進料區之印刷電路板基板2的剖面示意圖。印刷電路板基板2例如由FR4、5聚醯亞胺(PI)、液晶聚合物(LCP)構成且雙面具有厚度為9μm至35μm之銅。 1 is a schematic cross-sectional view of a stripping device 1 and a printed circuit board substrate 2 located in a feed zone. The printed circuit board substrate 2 is made of, for example, FR4, 5 polyimine (PI), liquid crystal polymer (LCP), and has copper having a thickness of 9 μm to 35 μm on both sides.
該剝離裝置具有至少一用於分離保護膜5之剝離單元7、8。根據圖1所示,兩圓柱形滾筒25、26沿垂直方向相隔設置。但本發明不限於將剝離單元7、8實施為圓柱形,而是包括所 有幾何形狀如矩形、三角形、橢圓形或類似形狀。 The stripping device has at least one stripping unit 7, 8 for separating the protective film 5. According to Fig. 1, the two cylindrical rollers 25, 26 are spaced apart in the vertical direction. However, the invention is not limited to the implementation of the stripping units 7, 8 as cylindrical, but rather includes There are geometric shapes such as rectangles, triangles, ellipses, or the like.
保護膜5設於上光聚合物層3上,或者設於下光聚合物層4上。但亦可在上下光聚合物層3、4上皆設置保護膜5。保護膜5乃極薄之金屬片或塑膠片。該保護膜較佳例如由厚度約為12μm、15μm或21μm之聚酯(PET膜)構成。 The protective film 5 is provided on the glossing polymer layer 3 or on the lower photopolymer layer 4. However, a protective film 5 may be provided on both the upper and lower photopolymer layers 3 and 4. The protective film 5 is an extremely thin metal piece or a plastic piece. The protective film is preferably composed of, for example, a polyester (PET film) having a thickness of about 12 μm, 15 μm or 21 μm.
根據圖1所示,剝離裝置1在剝離單元7、8前面具有例如包含輸送台或輥式/帶式輸送裝置之進料區9。待加工之印刷電路板基板2經進料區9被送入剝離單元7、8。根據較佳實施例,進料區9設有用於偵測板體起點之感測器11及用於將板體送入剝離單元7、8之送料輥12。 According to Fig. 1, the stripping device 1 has, in front of the stripping units 7, 8, for example a feed zone 9 comprising a transport station or a roller/belt conveyor. The printed circuit board substrate 2 to be processed is fed into the stripping units 7, 8 via the feed zone 9. According to a preferred embodiment, the feed zone 9 is provided with a sensor 11 for detecting the starting point of the plate body and a feed roller 12 for feeding the plate body to the stripping units 7, 8.
進料區9更設有至少一補充空氣噴嘴13,其為該至少一剝離單元7、8加載(空氣)氣體流。補充空氣噴嘴13較佳位於送料輥12與剝離單元7、8間。 The feed zone 9 is further provided with at least one supplementary air nozzle 13 which loads the (air) gas stream for the at least one stripping unit 7, 8. The supplemental air nozzle 13 is preferably located between the feed roller 12 and the stripping units 7, 8.
剝離單元7、8呈圓柱形且沿垂直方向隔開設置。該垂直方向間距使得待加工之印刷電路板基板2能從上剝離單元7與下剝離單元8間穿過。 The peeling units 7, 8 are cylindrical and spaced apart in the vertical direction. This vertical direction spacing allows the printed circuit board substrate 2 to be processed to pass between the upper peeling unit 7 and the lower peeling unit 8.
剝離單元7、8或滾筒25、26在其外表面區域具有真空抽吸器14或用於真空抽吸器14之出口。藉此可在剝離單元7、8之表面的至少一分區內形成真空流並藉此吸住或保持住保護膜5。 The stripping unit 7, 8 or the drums 25, 26 have a vacuum aspirator 14 or an outlet for the vacuum aspirator 14 in its outer surface area. Thereby, a vacuum flow can be formed in at least one section of the surface of the stripping units 7, 8, and thereby the protective film 5 can be sucked or held.
在滾筒25、26具有最小垂直方向間距之區域設有至少一上滾花輪15及/或至少一下滾花輪16。藉由滾花輪15、16在剝離單元7、8內部推進印刷電路板基板2。此外由滾花輪15、16向印刷電路板2及保護膜5施加明確壓力。藉此打開保護膜5之邊緣以取得部分分離之效果。 At least one upper knurling wheel 15 and/or at least one lower knurling wheel 16 is provided in the region of the drums 25, 26 having the smallest vertical spacing. The printed circuit board substrate 2 is advanced inside the peeling units 7, 8 by the knurling wheels 15, 16. Further, a clear pressure is applied to the printed circuit board 2 and the protective film 5 by the knurling wheels 15, 16. Thereby, the edge of the protective film 5 is opened to obtain a partial separation effect.
沿水平方向在滾花輪15、16後面設有至少一預備空氣噴嘴17、18,其為保護膜5在滾花輪15、16作用下與光聚合物層(3、4)初步分離提供支持。較佳分別在待加工之印刷電路板2的頂面側設置預備空氣噴嘴17並在其底面側設置預備空氣噴嘴18。 At least one preliminary air nozzle 17, 18 is provided behind the knurling wheels 15, 16 in the horizontal direction, which provides support for the protective membrane 5 to be initially separated from the photopolymer layer (3, 4) by the knurling wheels 15, 16. Preferably, a preliminary air nozzle 17 is provided on the top surface side of the printed circuit board 2 to be processed, and a preliminary air nozzle 18 is provided on the bottom surface side thereof.
在預備空氣噴嘴17、18後面設有至少一鰭片19、20,該鰭片以分離邊嵌入保護膜5與印刷電路板基板2之間以將保護膜5與印刷電路板基板2分離。此種鰭片19、20亦稱運膜板。較佳在印刷電路板基板2之頂面側設置鰭片19並在其底面側設置鰭片20。鰭片19、20具有直的分離邊,該分離邊在整個寬度上嵌入印刷電路板基板2之光聚合物層3、4與保護膜5之間。 At least one fin 19, 20 is disposed behind the preliminary air nozzles 17, 18, and the fin is interposed between the protective film 5 and the printed circuit board substrate 2 with a separation edge to separate the protective film 5 from the printed circuit board substrate 2. Such fins 19, 20 are also referred to as transport sheets. Preferably, the fins 19 are provided on the top surface side of the printed circuit board substrate 2, and the fins 20 are provided on the bottom surface side thereof. The fins 19, 20 have straight separating edges which are interposed between the photopolymer layers 3, 4 of the printed circuit board substrate 2 and the protective film 5 over the entire width.
根據另一較佳實施例,鰭片19、20被建構成使得最初僅尖端嵌入保護膜5與印刷電路板基板2之間,而後鰭片19、20在印刷電路板基板2與保護膜5間之嵌入寬度逐漸變大。其優點在於能以更高速度工作,從而加速保護膜5與印刷電路板基板2之分離。 According to another preferred embodiment, the fins 19, 20 are constructed such that only the tip is initially embedded between the protective film 5 and the printed circuit board substrate 2, and the rear fins 19, 20 are between the printed circuit board substrate 2 and the protective film 5. The embedding width gradually becomes larger. This has the advantage of being able to operate at a higher speed, thereby accelerating the separation of the protective film 5 from the printed circuit board substrate 2.
鰭片19、20自印刷電路板基板2剝離保護膜5,其中保護膜5沿鰭片表面繼續推進。 The fins 19, 20 peel off the protective film 5 from the printed circuit board substrate 2, wherein the protective film 5 continues to advance along the surface of the fin.
在鰭片19、20後面設有至少一主空氣噴嘴21、22,其中較佳在印刷電路板基板2之頂面側設置主空氣噴嘴21並在其底面側設置主空氣噴嘴22。主空氣噴嘴21、22之空氣流將已被剝脫之保護膜5抬升到鰭片19、20上,以便該鰭片能實施分離程序。 At least one main air nozzle 21, 22 is provided behind the fins 19, 20. Preferably, a main air nozzle 21 is provided on the top surface side of the printed circuit board substrate 2, and a main air nozzle 22 is provided on the bottom surface side thereof. The air flow of the main air nozzles 21, 22 lifts the peeled protective film 5 onto the fins 19, 20 so that the fin can perform the separation process.
在主空氣噴嘴21、22後面設有至少一出料輥23、24,其將經加工之印刷電路板基板2朝出口區10方向運離剝離單元7、8。 Behind the main air nozzles 21, 22 are provided at least one discharge roller 23, 24 which transports the processed printed circuit board substrate 2 away from the stripping units 7, 8 towards the exit zone 10.
圖2為本發明剝離裝置1之進料區9的剖面示意圖。由該圖所繪示之俯視圖可清楚看到補充空氣噴嘴13在剝離單元7、8區域之佈置方式。補充空氣噴嘴13在此較佳設於自有的補充空氣噴嘴槽隙27、28內,該等補充空氣噴嘴槽隙位於剝離單元7、8之滾筒25、26的表面區域。 2 is a schematic cross-sectional view of the feed zone 9 of the stripping device 1 of the present invention. The arrangement of the supplementary air nozzles 13 in the area of the stripping units 7, 8 can be clearly seen from the top view of the figure. The supplemental air nozzles 13 are here preferably provided in their own supplementary air nozzle slots 27, 28 which are situated in the surface area of the rollers 25, 26 of the stripping units 7, 8.
由進料區9出發,沿加工方向依次設有感測器11、送料輥12、補充空氣噴嘴13、真空抽吸器14、鰭片19、20、預備空氣噴嘴17、18、主空氣噴嘴21、22及出料輥23、24。 Starting from the feed zone 9, a sensor 11, a feed roller 12, a supplemental air nozzle 13, a vacuum aspirator 14, fins 19, 20, preliminary air nozzles 17, 18, and a main air nozzle 21 are sequentially disposed in the machine direction. 22 and the discharge rollers 23, 24.
圖3為剝離裝置進料區在偵測到印刷電路板基板前緣時之剖面示意圖。用進料感測器11偵測印刷電路板基板2。感測器11之訊號啟動送料輥12,該些送料輥將印刷電路板基板同步。 Figure 3 is a schematic cross-sectional view of the stripping device feed zone when the leading edge of the printed circuit board substrate is detected. The printed circuit board substrate 2 is detected by the feed sensor 11. The signal from sensor 11 activates feed rolls 12 that synchronize the printed circuit board substrate.
圖4示出在將滾花輪15、16放置到印刷電路板基板2之前緣上時的剝離裝置1。透過滾花輪15、16之壓力將保護膜5之邊緣打開,從而取得保護膜5與印刷電路板基板2初步分離之效果。此分離程序得到預備空氣噴嘴17、18之空氣流的支持。 Fig. 4 shows the peeling device 1 when the knurling wheels 15, 16 are placed on the front edge of the printed circuit board substrate 2. The edge of the protective film 5 is opened by the pressure of the knurling wheels 15, 16 to obtain the effect of the preliminary separation of the protective film 5 from the printed circuit board substrate 2. This separation procedure is supported by the air flow of the preliminary air nozzles 17, 18.
圖5示出將保護膜5放置到鰭片尖端19、20上之時間點。在保護膜5之膜邊到達鰭片尖端之前,藉由主空氣噴嘴21、22之空氣流將保護膜5抬升到鰭片尖端上。 FIG. 5 shows the point in time at which the protective film 5 is placed on the fin tips 19, 20. The protective film 5 is lifted up to the fin tip by the air flow of the main air nozzles 21, 22 before the film edge of the protective film 5 reaches the fin tip.
根據圖6所示,保護膜5在抽吸區30被揭離印刷電路板基板2。透過印刷電路板2之推進,保護膜5被鰭片19剝離印刷電路板基板2。已分離末端31因柯安達效應而吸附於滾筒25之外周。當已分離末端31到達真空抽吸器14時,該真空抽吸器啟動並承擔沿滾筒25繼續導引並保持保護膜5之任務。要點在於,在抽吸區30內真空抽吸器14不產生吸力,而是已分離末端31僅透 過柯安達效應貼附於滾筒25之外周。藉此亦能在印刷電路板更薄之情況下剝離保護膜5、6,而習知裝置尚無法辦到。 According to FIG. 6, the protective film 5 is exposed from the printed circuit board substrate 2 in the suction region 30. The protective film 5 is peeled off by the printed circuit board 2 by the fins 19 by the advancement of the printed circuit board 2. The separated end 31 is adsorbed to the outer circumference of the drum 25 due to the Coanda effect. When the separated end 31 reaches the vacuum aspirator 14, the vacuum aspirator activates and assumes the task of continuing to guide and hold the protective film 5 along the drum 25. The point is that the vacuum aspirator 14 does not generate suction in the suction zone 30, but the separated end 31 is only transparent. The Coanda effect is attached to the outer circumference of the drum 25. Thereby, the protective films 5, 6 can be peeled off even if the printed circuit board is thinner, and conventional devices are not yet available.
根據先前技術之實施方式始終存在以下缺點:滾筒25、26相對於鰭片19、20之空間佈置方式使得已分離末端31遠離真空抽吸器14,以至於真空流吸不住保護膜5。無法更早啟動真空流之原因在於,這樣會使更薄的印刷電路板被一併吸住。 According to prior embodiments of the prior art, there is always the disadvantage that the spatial arrangement of the rollers 25, 26 relative to the fins 19, 20 is such that the separated end 31 is remote from the vacuum aspirator 14 so that the vacuum flow cannot hold the protective film 5. The reason why the vacuum flow cannot be started earlier is that this causes the thinner printed circuit board to be sucked together.
本發明藉由在進料區9設置補充空氣噴嘴13以解決上述難題。補充空氣噴嘴13為滾筒25加載切線空氣流,從而在抽吸區30內引發柯安達效應並使保護膜5之已分離末端31吸附於滾筒周邊。 The present invention solves the above problems by providing a supplemental air nozzle 13 in the feed zone 9. The makeup air nozzle 13 loads the drum 25 with a tangential air flow, thereby inducing a Coanda effect in the suction zone 30 and adsorbing the separated end 31 of the protective film 5 to the periphery of the drum.
啟動補充空氣噴嘴13後,保護膜5沿滾筒25、26被吸住並順著其輪廓直至保護膜之已分離末端31被真空抽吸器14之負壓截住。空氣流速愈高,此效應愈佳。在最佳條件下,保護膜5幾乎能360°附著在滾筒25、26上。 After the replenishing air nozzle 13 is activated, the protective film 5 is sucked along the rollers 25, 26 and follows its contour until the separated end 31 of the protective film is intercepted by the vacuum of the vacuum aspirator 14. The higher the air flow rate, the better the effect. Under the optimum conditions, the protective film 5 is attached to the rolls 25, 26 almost 360°.
補充空氣噴嘴13所產生之效應亦稱柯安達效應或“柯安達流”。柯安達流具有異乎尋常的順著凸出滾筒25、26流動而不脫落之能力。故,補充空氣噴嘴13之空氣噴流沿滾筒25、26流動並在分離程序期間使保護膜5吸附在滾筒上。其優點主要在於亦能加工更薄的印刷電路板基板2,因為柯安達流在真正的分離程序之前便已對薄保護膜5產生保持作用。保護膜5一旦與印刷電路板基板2分離便附著於滾筒25、26之周邊並被鰭片19、20揭下。 The effect produced by the supplemental air nozzle 13 is also known as the Coanda effect or the "Keanda flow". The Coanda flow has an unusual ability to flow along the projecting rollers 25, 26 without falling off. Therefore, the air jet of the supplemental air nozzle 13 flows along the rollers 25, 26 and the protective film 5 is attracted to the drum during the separation process. The advantage is mainly that the thinner printed circuit board substrate 2 can also be processed, since the Coanda flow has already retained the protective film 5 before the actual separation process. When separated from the printed circuit board substrate 2, the protective film 5 adheres to the periphery of the rollers 25, 26 and is peeled off by the fins 19, 20.
圖7示出保護膜5之前部區域被揭離印刷電路板基板2並且保護膜5吸附於滾筒25、26之表面。保護膜5一旦貼附於滾筒25、26之表面即啟動真空抽吸器14並停用補充空氣噴嘴13。藉 此將保護膜5由所產生之補充空氣噴嘴流轉移給真空流。 FIG. 7 shows that the front region of the protective film 5 is peeled off from the printed circuit board substrate 2 and the protective film 5 is attracted to the surfaces of the rollers 25, 26. Once the protective film 5 is attached to the surface of the rollers 25, 26, the vacuum aspirator 14 is activated and the makeup air nozzle 13 is deactivated. borrow This transfers the protective film 5 from the generated supplemental air nozzle flow to the vacuum flow.
圖8示出沿相關滾筒25、26表面被運送之已分離保護膜5、6。真空抽吸器14啟動後在滾筒25做旋轉運動期間將上保護膜5保持在滾筒表面。根據圖8所示,下真空抽吸器14被停用而致使下保護膜6與滾筒26之表面分離。 Figure 8 shows the separated protective films 5, 6 carried along the surface of the associated rollers 25, 26. After the vacuum aspirator 14 is activated, the upper protective film 5 is held on the surface of the drum during the rotational movement of the drum 25. According to FIG. 8, the lower vacuum aspirator 14 is deactivated to cause the lower protective film 6 to be separated from the surface of the drum 26.
圖9示出下保護膜6被存放於存放容器29。上保護膜5之前緣到達上滾筒25與下滾筒26之接觸位置後被上真空抽吸器14a保持住。兩滾筒25、26一直定位到上真空抽吸出口14a與下真空抽吸出口14b相對為止。 FIG. 9 shows that the lower protective film 6 is stored in the storage container 29. The leading edge of the upper protective film 5 reaches the contact position of the upper roller 25 and the lower roller 26, and is held by the upper vacuum aspirator 14a. The two rollers 25, 26 are positioned until the upper vacuum suction outlet 14a is opposed to the lower vacuum suction outlet 14b.
圖10示出上保護膜5由上滾筒25被轉移至下滾筒26之時間點。此點係透過由上真空抽吸器14a切換為下真空抽吸器14b抽真空而實現。為此需停用上真空抽吸器14a並啟動下真空抽吸器14b。 FIG. 10 shows the point in time at which the upper protective film 5 is transferred from the upper drum 25 to the lower drum 26. This is achieved by switching from the upper vacuum aspirator 14a to the lower vacuum aspirator 14b. For this purpose, the upper vacuum aspirator 14a is deactivated and the lower vacuum aspirator 14b is activated.
根據較佳實施例,可進一步透過噴氣以支持上保護膜5與滾筒25之分離。 According to a preferred embodiment, the jet can be further passed through to support separation of the upper protective film 5 from the drum 25.
僅為了下滾筒26之短時旋轉運動而啟動下真空抽吸器14b。僅持續到上保護膜5位於收料容器29區域並被存放於該處為止。 The lower vacuum aspirator 14b is activated only for the short-term rotational movement of the lower drum 26. It only lasts until the upper protective film 5 is located in the area of the receiving container 29 and is stored there.
具體參考圖11,該圖主要示出被停用之下真空抽吸器14b及保護膜5與下滾筒26之分離。 Referring specifically to Figure 11, this figure primarily illustrates the separation of the vacuum aspirator 14b and the protective membrane 5 from the lower drum 26 when deactivated.
圖12示出上保護膜5最終被存放於收料容器29。此時剝離裝置1中無物料,可開始加工下一印刷電路板基板2。 FIG. 12 shows that the upper protective film 5 is finally stored in the receiving container 29. At this time, there is no material in the peeling device 1, and the next printed circuit board substrate 2 can be processed.
綜上,藉由在剝離單元7、8之進料區9設置附加補充空氣噴嘴13而產生沿滾筒25、26之表面流動的流,該流早期截 住保護膜5,其中保護膜5、6透過滾筒25、26之旋轉而與印刷電路板基板2分離。補充空氣噴嘴13較佳位於該滾筒之補充空氣噴嘴槽隙27、28內。 In summary, the flow along the surfaces of the drums 25, 26 is generated by providing additional supplemental air nozzles 13 in the feed zone 9 of the stripping units 7, 8, which are early cut The protective film 5 is housed, wherein the protective films 5, 6 are separated from the printed circuit board substrate 2 by the rotation of the rollers 25, 26. The supplemental air nozzles 13 are preferably located within the supplemental air nozzle slots 27, 28 of the drum.
1‧‧‧剝離裝置 1‧‧‧ peeling device
2‧‧‧印刷電路板基板 2‧‧‧Printed circuit board substrate
3‧‧‧光聚合物層 3‧‧‧Photopolymer layer
4‧‧‧光聚合物層 4‧‧‧Photopolymer layer
5‧‧‧保護膜 5‧‧‧Protective film
6‧‧‧保護膜 6‧‧‧Protective film
7‧‧‧剝離單元 7‧‧‧ peeling unit
8‧‧‧剝離單元 8‧‧‧ peeling unit
9‧‧‧進料區 9‧‧‧feeding area
10‧‧‧出料區 10‧‧‧Drawing area
11‧‧‧進料區之感測器 11‧‧‧Sensor in the feed zone
12‧‧‧送料輥 12‧‧‧Feed roller
13‧‧‧補充空氣噴嘴 13‧‧‧Additional air nozzle
14‧‧‧真空抽吸器 14‧‧‧Vacuum aspirator
15‧‧‧滾花輪 15‧‧‧Rolling wheel
16‧‧‧滾花輪 16‧‧‧ knurling wheel
17‧‧‧預備空氣噴嘴 17‧‧‧Prepared air nozzle
18‧‧‧預備空氣噴嘴 18‧‧‧Prepared air nozzle
19‧‧‧鰭片 19‧‧‧Fins
20‧‧‧鰭片 20‧‧‧Fins
21‧‧‧主空氣噴嘴 21‧‧‧Main air nozzle
22‧‧‧主空氣噴嘴 22‧‧‧Main air nozzle
23‧‧‧出料輥 23‧‧‧ discharge roller
24‧‧‧出料輥 24‧‧‧ discharge roller
25‧‧‧滾筒 25‧‧‧Roller
26‧‧‧滾筒 26‧‧‧Roller
Claims (10)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014011721.9A DE102014011721B4 (en) | 2014-08-06 | 2014-08-06 | Apparatus and method for stripping protective films |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201613434A TW201613434A (en) | 2016-04-01 |
| TWI593331B true TWI593331B (en) | 2017-07-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104125394A TWI593331B (en) | 2014-08-06 | 2015-08-05 | Device and method for detaching protective foils |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101741632B1 (en) |
| DE (1) | DE102014011721B4 (en) |
| TW (1) | TWI593331B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI671254B (en) * | 2019-01-31 | 2019-09-11 | 景碩科技股份有限公司 | Film peeling device |
| TWI730583B (en) * | 2020-01-08 | 2021-06-11 | 鴻鉑科技有限公司 | Film peeling device |
| TWI828100B (en) * | 2022-03-29 | 2024-01-01 | 鴻鉑科技有限公司 | Partial film peeling structure(2) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101953221B1 (en) | 2017-06-13 | 2019-02-28 | 주식회사 씨에이치티 | Automatic film peeling device for flexible printed circuit board process |
| KR102182083B1 (en) * | 2018-07-03 | 2020-11-23 | 이종일 | Film separator for heat radiation plate of secondary battery |
| CN108974517B (en) * | 2018-07-27 | 2023-07-28 | 江苏云天高胜机器人科技有限公司 | Bottom film tearing device |
| CN109362183A (en) * | 2018-11-27 | 2019-02-19 | 奥士康科技股份有限公司 | A new type of PCB board peeling machine and its use method |
| CN112238992A (en) * | 2019-07-16 | 2021-01-19 | 广东思沃精密机械有限公司 | Film stripping machine |
| CN112238672A (en) * | 2019-07-16 | 2021-01-19 | 广东思沃精密机械有限公司 | Film stripping method and film stripping machine |
| TWI721753B (en) * | 2020-01-08 | 2021-03-11 | 鴻鉑科技有限公司 | Film sucking structure |
| KR102458540B1 (en) * | 2020-10-13 | 2022-10-25 | (주)한빛테크놀로지 | Paper removal device |
| CN115256539B (en) * | 2021-03-31 | 2024-05-17 | 苏州壬和控股有限公司 | Zero damage formula processing equipment of protection film |
| KR102531338B1 (en) * | 2022-07-11 | 2023-05-12 | 주식회사 에이오티 | Film peeling device for substrate |
| DE102022134515A1 (en) | 2022-12-22 | 2024-06-27 | Advanced Engineering Industrie Automation GmbH | Device and method for removing protective films from plate-shaped objects |
| KR102611795B1 (en) * | 2023-06-12 | 2023-12-08 | 이엠알테크 유한회사 | Paper Bag Coating Layer Separation Device Having A Heating Part |
| KR20250068927A (en) * | 2023-11-10 | 2025-05-19 | 주식회사 엘지에너지솔루션 | Film peeling device |
| CN117429077B (en) * | 2023-12-19 | 2024-03-22 | 湖南安泰康成生物科技有限公司 | Electrode patch forming method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0215397B1 (en) * | 1985-09-05 | 1995-01-04 | Somar Corporation | Film peeling apparatus |
| JPH0717309B2 (en) * | 1989-06-04 | 1995-03-01 | ソマール株式会社 | Thin film peeling method |
| DE4221703C2 (en) * | 1992-07-02 | 1996-02-22 | Emco Maier Gmbh | Method and device for removing protective films on one or both sides |
| EP1351806A1 (en) * | 2001-01-16 | 2003-10-15 | Amedeo Candore | Protective film peeling machine for printed circuit boards |
| DE102009043063A1 (en) | 2009-09-28 | 2011-03-31 | Ksl-Kuttler Automation Systems Gmbh | sword |
| KR101929527B1 (en) | 2012-09-17 | 2018-12-17 | 삼성디스플레이 주식회사 | Film peeling apparatus |
-
2014
- 2014-08-06 DE DE102014011721.9A patent/DE102014011721B4/en active Active
-
2015
- 2015-08-05 TW TW104125394A patent/TWI593331B/en active
- 2015-08-06 KR KR1020150111253A patent/KR101741632B1/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI671254B (en) * | 2019-01-31 | 2019-09-11 | 景碩科技股份有限公司 | Film peeling device |
| TWI730583B (en) * | 2020-01-08 | 2021-06-11 | 鴻鉑科技有限公司 | Film peeling device |
| TWI828100B (en) * | 2022-03-29 | 2024-01-01 | 鴻鉑科技有限公司 | Partial film peeling structure(2) |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160017639A (en) | 2016-02-16 |
| KR101741632B1 (en) | 2017-05-30 |
| DE102014011721B4 (en) | 2016-06-23 |
| DE102014011721A1 (en) | 2016-02-11 |
| TW201613434A (en) | 2016-04-01 |
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