TWI593293B - Smart microphone with voice control function - Google Patents

Description

Smart microphone with voice control

The invention relates to a microphone, in particular to a smart microphone with sound control function.

Devices that used to transmit sound, such as cell phones, computers, personal digital assistants (PDAs), voice over internet protocol (VoIP) devices, MP3 players, game consoles, headsets, portable satellite navigation devices (GPS), or Other similar electronic devices have microphone technology for receiving audio signals on a circuit board inside or inside the electronic device.

After the built-in microphone is installed in the electronic device, in order to improve the sound processing performance of the microphone, it is usually focused on how to effectively suppress noise, remove wind noise, eliminate echo, and satisfy miniaturization and high power demand. Therefore, the related art includes the Republic of China Patent Publication No. 1279155, No. I298984, No. I298984, No. M335900, and U.S. Patent Nos. 20080167516, No. 20080166000, and No. 20080165996. In the general related art, a microphone is used to convert sound waves into electrical signals, that is, to provide only a single function of sound to electrical energy conversion.

However, the Republic of China No. M333740 proposes a microphone that can illuminate and change the color of light, which uses a light-transmitting material as the outer casing of the microphone, and is equipped with a light-emitting diode (LED) or a variable inside the microphone. Illumination of light diodes, tubes, bulbs or lamps The source is used to generate illuminating and discoloring effects in response to different forms of application. However, this patented technology is a wired or wireless microphone that is independent of the electronic device and is used for direct transmission by the user for transmitting sound. In other words, this patented technology cannot be miniaturized, but directly as a mobile phone, computer, personal digital assistant (PDA), Internet Voice Protocol (VoIP) device, MP3 player, multimedia player, game console, earphone, portable A microphone in a satellite navigation device, or other similar electronic device.

It can be seen that the microphone in the general electronic device only has a single sound function transmission, and other functions depend on other components of the electronic device. Therefore, how to provide a microphone that can integrate different functions in an electronic device is a matter for those in the field to be explored.

Therefore, the main object of the present invention is to provide a smart microphone, and a sound pressure conversion component is built in the microphone to receive the microphone output audio signal for environmental volume monitoring or voice control application to achieve a voice microphone with voice control function. .

Another object of the present invention is to provide a smart microphone with design flexibility and to make it smaller in size.

A further object of the present invention is that at least one sensor is built into the smart microphone for sensing various environments, creatures, position heights, directions, angles or speeds.

To achieve the above objective, the present invention provides a smart microphone having a voice control function, comprising: a carrier, a microphone member, a sound pressure conversion component, at least one sensor, and at least one integrated component. The carrier has opposite first and second surfaces, and a plurality of pads disposed on the first surface and the second surface to electrically connect the first surface and the pads of the second surface. The microphone member is disposed on the first surface and electrically connected to at least one of the plurality of pads. The sound pressure conversion component is disposed on the first surface and is located inside the microphone component and electrically connected to at least one of the plurality of pads. The at least one sensor is disposed on the first surface and is located inside the microphone component and electrically connected Connecting at least one of the plurality of pads. The at least one integrated component is disposed on the first surface and located inside the microphone component and electrically connected to at least one of the plurality of pads.

In an embodiment of the invention, the carrier is one of a substrate and a circuit board.

In an embodiment of the invention, the integrated component is electrically connected by a wire and a pad.

In an embodiment of the invention, the carrier further includes an electrical connection structure for electrically connecting the plurality of pads through the carrier.

In an embodiment of the invention, the electrical connection structures are at least one of a through hole, a blind hole, and a buried hole.

In an embodiment of the invention, the sensor is an inertial sensor, a biosensor, a temperature sensor, a humidity sensor, and a barometric sensor.

In an embodiment of the invention, the inertial sensor is an accelerator, a gyroscope or a gyroscope.

In an embodiment of the invention, the sensor and the integrated component are integrated into an integrated component.

In an embodiment of the invention, the microphone member includes a housing having a sound hole on the surface thereof and a bottom portion having a joint portion for engaging the carrier, a first spacer and a first portion disposed inside the housing a spacer, a diaphragm disposed between the first spacer and the second spacer, and a cavity disposed between the second spacer and the joint of the outer casing, and the cavity An inductive backplane for sensing vibration of the diaphragm is interposed between the second spacers, and an electrical connection post located in the cavity for contacting the inductive backplane.

In an embodiment of the invention, the cavity has a chamber that houses the sensor, the integrated component, and the sound pressure conversion component.

1‧‧‧Smart microphone

11‧‧‧ Carrier Board

111‧‧‧ first surface

113‧‧‧ second surface

115‧‧‧ solder pads

117‧‧‧Electrical connection structure

119‧‧‧Integral components

121‧‧‧Sound pressure conversion element

13‧‧‧Microphone components

131‧‧‧Shell

1311‧‧‧ sound hole

1312‧‧‧ joint

132‧‧‧First gasket

1321‧‧‧ Front space

133‧‧‧second gasket

134‧‧‧Vibration film

135‧‧‧ cavity

1351‧‧‧ Cavity

136‧‧‧Inductive backplane

137‧‧‧Electrical connection column

15‧‧‧ Sensor

4‧‧‧ main board

5‧‧‧Sensor data collection module

6‧‧‧Optical Control Module

7‧‧‧Environmental volume monitoring or voice control application module

FIG. 1 is a top plan view showing the appearance of a smart microphone with voice control function according to the present invention.

2 is a side elevational view showing the appearance of a smart microphone with voice control function of the present invention.

Figure 3 is a bottom plan view showing the appearance of the smart microphone with voice control function of the present invention.

4 is an exploded perspective view of the smart microphone with voice control function of the present invention.

Figure 5 is a side cross-sectional view showing the smart microphone with voice control function of the present invention.

FIG. 6 is a circuit block diagram of a smart microphone with voice control function according to the present invention.

The technical content and detailed description of the present invention are now described with reference to the following figures: Please refer to FIG. 1 to FIG. 3, which are schematic views of the appearance, side view and bottom view of the smart microphone with voice control function of the present invention. As shown in the figure, the smart microphone 1 having the voice control function of the present invention mainly includes: a carrier 11 having opposite first and second surfaces 111 and 113, and a first surface 111 and The plurality of pads 115 of the two surfaces 113 are electrically connected to the pads 115 between the first surface 111 and the second surface 113. The microphone member 13 is disposed on the first surface 111 and electrically connected thereto. On one of the pads 115; at least one sensor 15 is disposed on the first surface 111 and located inside the microphone member 13 and electrically connected to one of the pads 115 by SMT or a wire or the like; An integrated component 119 is disposed on the first surface 111, which is also located inside the microphone member 13, and is also electrically connected to one of the pads 115 by means of SMT or wires; and a sound pressure conversion component The 121 is disposed on the first surface 111 and is located inside the microphone member 13 and electrically connected to one of the pads 115 by means of SMT or a wire. Further, the sensor 15 and the integrated component 119 are The sound pressure conversion element 121 is covered in the microphone member 13 , Member 13 complete with microphone electrical conduction, which is protected by a microphone member 13, and effectively reduce the volume of the microphone.

The carrier board 11 is configured to carry the microphone member 13, the sensor 15, the integrated component 119, and the sound pressure conversion component 121, and is coupled to the smart microphone by the pad 115 of the second surface 113. To the inside of the electronic device (not shown), in the embodiment, the carrier 11 can be a general substrate, a circuit board or other equivalent components. In this case, a substrate or a circuit board with a simple circuit design is selected as the carrier board 11. A substrate or a circuit board having a complicated circuit design may be used as needed to complete electrical connection with the electronic device to transmit signals to Electronic devices, not limited to this.

At the same time, in this embodiment, a plurality of pads 115 between the first surface 111 and the second surface 113 are used, and the first surface 111 is provided with an electrical connection structure 117 extending through the carrier 11 (see FIG. 5). The hole, the blind hole, the buried hole or other electrical connection structure can be electrically connected to the pad 115 on the second surface 113 by the electrical connection structure 117 for the microphone component 13, the sensor 15, and the product. The body element 119 and the sound pressure conversion element 121 are electrically connected to corresponding elements inside the electronic device via the pad 115.

It should be noted that although the plurality of pads 115 of the present embodiment are rectangular, they may be changed to a ring shape, a circular shape or other geometric shapes in other embodiments. Furthermore, when the pad 115 is designed to be annular, and the size of the pad 115 can be greater than, equal to, or even smaller than the electrical connection structure 117, the first surface 111 and the second surface 113 can be electrically connected. In addition, since the electrical connection structure 117 can select one or at least one of a through hole, a blind hole, and a buried hole, that is, the carrier 11 has both a through hole, a blind hole, and/or a buried hole. Depending on the layout of the carrier board 11 itself. In other words, the description in the embodiments is merely illustrative and not intended to limit the creation.

Furthermore, since the design of the electrical connection structure 117 such as a via hole, a blind via hole, and a buried via hole, and the structure and specific structure of the pad 115 are conventional techniques, the bonding principle using surface adhesion technology such as soldering is also well known. Therefore, the detailed description and drawings are omitted here.

Please refer to FIG. 4, FIG. 5 and FIG. 6, which are exploded, side cross-sectional and circuit block diagrams of the smart microphone with voice control function of the present invention. As shown in the figure: the aforementioned microphone member 13 uses a general microphone, or the same member as a general MEMS microphone. For example, the microphone member 13 includes a casing 131 having a sound hole 1311 and a bottom on the surface thereof. The first portion 132 and the second spacer 133 are disposed on the inner surface of the outer casing 131, and the diaphragm 134 is disposed between the first spacer 132 and the second spacer 133. A cavity 135 is disposed between the lower portion 133 and the joint portion 1312 of the outer casing 131, and an inductive back plate 136 for sensing the vibration of the vibration mold 134 is interposed between the cavity 135 and the second gasket 133, and The electrical connection post 137 is located in the cavity 135 for contacting the inductive backplane 136. The front space 1321 between the outer casing 131 and the first gasket 132 is formed with a cavity 1351 for accommodating the sensor 15, the integrated element 119 and the sound pressure conversion element 121. At the same time, the sensor 15, the integrated component 119, and the sound pressure conversion element 121 are located in the cavity 1351, and the carrier 11 is directly bonded to the main circuit board 4 of the electronic device without a gap. It should be understood that this is an exemplary embodiment of the microphone component 13 of the present invention, and is not intended to limit the present invention.

The sensor 15 is coupled to the pad 115 by SMT or wire to complete electrical connection with the microphone member 13 and electrically connected to the internal components of the electronic device. In this embodiment, the sensor 15 is an inertial sensor, such as an accelerometer, a gyroscope, or a gyrometer, or a general humidity sensor or a barometric sensor. And so on. As shown in FIG. 6, the sensor 15 is electrically connected to the sensing data collection module 5 of the electronic device, so that the sensing data collection module 5 receives the signal sensed by the sensor 15 for subsequent operation. Processing; and the microphone member 13 is electrically connected to the electronic device The audio control module 6 is further processed by the audio control module 6; the sound pressure conversion component 121 is electrically connected to the ambient volume monitoring or voice control application module 7 of the electronic device, and receives the microphone at the sound pressure conversion component 121. The audio signal output by the component 13 is then processed by the ambient volume monitoring or voice control application module 7. Here, the sensor 15 can be used to sense single axis (for example, X axis or Y axis), dual axis (X, Y axis), and three axes (X, Y, Z axis) such as tilting motion, acceleration motion, rotation, Various actions, such as vibration, jumping, impact, and left and right movement, to sense the position, direction (displacement), and/or posture of the electronic device. Therefore, when it is applied to an electronic device that performs corresponding operations using position, direction (displacement), and/or posture, such as a game machine, a mobile phone, or other device having a microphone, the smart microphone of the present embodiment can be used. Provide a relative output signal to the electronic device.

For example, the mobile phone user can replace the button operation by tilting, rotating, moving the mobile phone left or right, or the like, or using the posture of the game machine instead of the switch, button, scroll wheel, etc. of the game machine; or, stepping The function of the device is integrated in the microphone of the sports MP3/PMP earphone, sensing the action state of the human body to calculate the running distance and the calories burned; or, it can be integrated into the electronic device such as mobile phone, camera, video camera and the like for image stabilization. The detected sensor is in the smart microphone of the present invention.

In other words, the conventional electronic device is provided with a sensor 15 such as an inertial sensor on a main circuit board (for example, the main circuit board 4 of the embodiment). In a preferred embodiment of the present invention, the integrated device is integrated. In the smart microphone 1. Not only can the smart microphone 1 be modularized, but the configuration space used on the main circuit board can be reduced, and the saved configuration space can be used to set components with other functions, and the function of the electronic device can be expanded.

It should be noted that although the preferred embodiment is provided with a sensor 15 disposed inside the microphone member 13 as an example, a plurality of sensors 15 may be provided; for example, combining inertial sensors, biological Sensors for other functions such as sensors, temperature sensors, humidity sensors, or barometric sensors, which can be used to monitor physiological changes in the user's operation (eg, pulse, blood pressure, and even body temperature) or Monitor the humidity or position height of the environment. Moreover, the sensors 15 can be integrated into the integrated component 119 through the design of the integrated circuit 119, which not only reduces the manufacturing cost, but also effectively reduces the volume.

Since the configurable sensors 15 are numerous and can be understood and implemented by those of ordinary skill in the art, they will not be described herein.

In summary, the present invention is to design a modular smart microphone 1 with voice control function, so that the smart microphone 1 with voice control function not only has a sound transmission function, but also integrates the sound pressure conversion component 121 for environmental volume monitoring, The voice control application and the different sensors 15 are used to direct the corresponding functions to the applied electronic device. At the same time, the present invention has design flexibility based on the aforementioned sensor 15 being any sensor 15 having different functions.

The above is only the preferred embodiment of the present invention and is not intended to limit the scope of the present invention. That is, the equal changes and modifications made by the patent application scope of this creation are covered by the scope of the creation patent.

1‧‧‧Smart microphone

11‧‧‧ Carrier Board

111‧‧‧ first surface

113‧‧‧ second surface

115‧‧‧ solder pads

117‧‧‧Electrical connection structure

119‧‧‧Integral components

121‧‧‧Sound pressure conversion element

13‧‧‧Microphone components

131‧‧‧Shell

1311‧‧‧ sound hole

1312‧‧‧ joint

132‧‧‧First gasket

1321‧‧‧ Front space

133‧‧‧second gasket

134‧‧‧Vibration film

135‧‧‧ cavity

1351‧‧‧ Cavity

136‧‧‧Inductive backplane

137‧‧‧Electrical connection column

15‧‧‧ Sensor

4‧‧‧ main board

Claims (9)

A smart microphone with voice control function, comprising: a carrier board having opposite first and second surfaces, and a plurality of pads disposed on the first surface and the second surface, such that the first surface is The second surface of the pad is electrically conductive; a microphone member is disposed on the first surface and electrically connected to at least one of the plurality of pads, the microphone member includes a casing on a surface of the casing Having a sound hole and a bottom portion having a joint portion for engaging the carrier plate, a first gasket and a second gasket disposed inside the outer casing, and a first sandwiching portion between the first gasket and the second gasket a vibrating membrane is disposed between the second gasket and the joint portion of the outer casing, and a cavity is formed between the cavity and the second gasket, and an inductive back plate for sensing the vibration of the vibrating membrane is disposed between the cavity and the second gasket. And an electrical connection column located in the cavity for contacting the inductive backplane; a sound pressure conversion component disposed on the first surface and located inside the microphone component and electrically connected to at least one of the plurality of pads At least one sensor disposed on the first surface And being disposed inside the microphone member and electrically connecting at least one of the plurality of pads; at least one integrated component disposed on the first surface and located inside the microphone member and electrically connected to the plurality of pads At least one of them. The smart microphone with voice control function according to claim 1, wherein the carrier is one of a substrate and a circuit board. The smart microphone with voice control function according to claim 1, wherein the integrated component is electrically connected by a wire and a solder pad. The smart microphone with voice control function according to claim 1, wherein the carrier further comprises an electrical connection structure for electrically connecting the plurality of pads through the carrier. The smart microphone with voice control function according to claim 4, wherein the electrical connection structures are at least one of a through hole, a blind hole, and a buried hole. The smart microphone with voice control function as claimed in claim 1, wherein the sensor is an inertial sensor, a biosensor, a temperature sensor, a humidity sensor, and a barometric sensor. . The smart microphone with voice control function as claimed in claim 6, wherein the inertial sensor is an accelerator, a gyroscope or a gyroscope. A smart microphone having a voice control function according to claim 1, wherein the sensor and the integrated component are integrated into an integrated component. The smart microphone with voice control function according to claim 1, wherein the cavity has a chamber for accommodating the sensor, the integrated component and the sound pressure conversion component.