TWI592271B - Scratch the brittle substrate with the rule of the substrate, the method of characterization and breaking method - Google Patents

Description

Fixing tool for scribing material substrate, scribing method and breaking method

The present invention relates to a substrate for a brittle material such as a semiconductor wafer, and a plurality of functional regions (also referred to as element regions) which are formed in a vertical direction and a lateral direction, and are scribed at each functional region. Use fixtures, scribing methods and breaking methods.

A semiconductor wafer is manufactured by dividing an element region formed in a semiconductor wafer at a boundary position of a region thereof. Conventionally, in the case where the wafer is divided into wafers, the cutting blade is rotated by a die singulation device, and the semiconductor wafer is cut into small pieces by cutting.

However, in the case of using a cutting device, it is necessary to discharge the discharge chips caused by the cutting, and to protect the semiconductor wafer in such a manner that the water or the discharge chips do not adversely affect the performance of the semiconductor wafer, A washing step of washing the water or the discharged chips becomes necessary. Therefore, there are disadvantages that the steps become complicated, the cost cannot be reduced, or the processing time is shortened. In addition, problems such as film peeling, defect generation, and the like occur due to cutting using a cutting blade. Further, in the MEMS substrate having a minute mechanical structure, since the surface tension of water causes damage to the structure, there is a problem that water cannot be used and it is impossible to break by cutting.

Patent Document 1 mentions a substrate cracking device that scribes a semiconductor wafer along a predetermined line of scribe and that is broken by a rupturing device. A plurality of functional regions are formed in a row on the semiconductor wafer to be cracked. In the case of breaking, first of all, The semiconductor wafer is formed with scribe lines at equal intervals in the longitudinal direction and the lateral direction at functional regions. Thereafter, the surface on which the score line is formed is placed as a lower surface and placed on a bed knife, and the blade is pressed down along the scribe line from directly above the scribed substrate to thereby break.

Patent Document 1: Japanese Laid-Open Patent Publication No. 2004-39931

However, in the case of scribing a brittle material substrate such as a semiconductor wafer, it is not only required to be scribed from the back surface of the functional region but also to be reversed from the back surface and then to be broken. Figure 1 (a) is a cross-sectional view of a semiconductor wafer placed on a scoring apparatus prior to scoring in such a situation. As shown in the figure, when scribing from the substrate side of the semiconductor wafer 101, when the scribe line is formed between the functional regions 102 on the semiconductor wafer 101 and between the functional regions 102a and 102b, The functional surface of the functional area is in contact with the adsorption stage 103 to hold the semiconductor wafer 101. However, once a given load is applied to the scoring wheel 104 and rotated, there is a problem that pressure is applied to the functional regions 102a, 102b to cause damage.

Further, as shown in FIG. 1(b), in the case where the functional surface is attached to the dicing tape 105 and disposed on the adsorption stage 103, there is a pressure not only applied at the time of scoring but also from the dicing tape 105. When it goes, it may cause damage to the functional area on the semiconductor wafer.

The present invention has been made in view of such a problem, and an object thereof is to provide a stencil for marking a semiconductor wafer so as not to apply a force to a functional region of a semiconductor wafer, and to use the same Scoring method and breaking method.

In order to solve this problem, the method for scribing a brittle material substrate according to the present invention is to perform a functional material having a plurality of functional regions formed in a vertical direction and a lateral direction, and a brittle material substrate on the other substrate surface. The scribing method is used in the brittle material The scribe line of the substrate surface of the substrate surface is a flat-shaped knives having a protective hole larger than the functional area at a center position of each of the lattice-shaped regions of the same pitch, and the brittleness is formed The functional area of the material substrate is included in the protective hole of the scribing tool such that the functional surface of the brittle material substrate is in contact with the scoring jig, and the scribing from the substrate surface of the brittle material substrate The predetermined line forms a score line in a lattice shape.

In order to solve this problem, the jig for scribing of the present invention is characterized in that a functional surface having a plurality of functional regions formed in a longitudinal direction and a lateral direction is formed, and a brittle material substrate on the other surface of the substrate is scribed. The jig is used in the form of a flat plate, and has a protective hole which is larger than the functional region at a central position of each of the regions which are at the same pitch as the predetermined line of the lattice-shaped sculpt of the brittle material substrate.

Here, a plurality of holders for holding the brittle material substrate such that the functional regions of the functional surfaces of the brittle material substrate are included in the respective protective holes may be further provided.

In order to solve the problem, the method for dividing a brittle material substrate according to the present invention is to perform a functional material having a plurality of functional regions formed in a vertical direction and a lateral direction, and a brittle material substrate on the other substrate surface. The method of dividing and dividing the partitioning method is formed by using a central portion of each of the grid-shaped regions having the same pitch as the predetermined line of the grid-like surface of the substrate surface of the brittle material substrate. The flat-shaped sculpt of the protective hole of the large protective hole is such that the functional area of the brittle material substrate is included in the protective hole of the scribing tool to make the functional surface of the brittle material substrate and the scribing tool Contacting, and forming a score line in a lattice shape along the planned surface of the brittle material substrate in a lattice shape, inverting the scored brittle material substrate, and cracking along the formed score line Break and use this to break.

According to the invention having such a feature, since the protective hole of the jig is used for scribing The functional area of the brittle material substrate is positioned and scored in a corresponding manner, so that the functional area is not in contact with the fixture or platform during scoring. Therefore, the brittle material substrate can be scored along the score line without damage to the functional area. Further, the brittle material substrate thus scribed in this manner is reversed and cracked, whereby the breaking can be performed without damaging the functional surface.

10‧‧‧Semiconductor wafer

10A‧‧‧ functional surface

10B‧‧‧ substrate surface

11‧‧‧ functional area

S _x1 ~S _xm ,S _y1 ~S _yn ‧‧‧Scratch line

20‧‧‧Scratch

21‧‧‧Protection hole

22-1~22-4‧‧‧Holding

30‧‧‧ platform

31‧‧‧Scratch cutter wheel

Figure 1 is a cross-sectional view showing a state in which a conventional semiconductor wafer is scribed.

Fig. 2 is a view showing an example of a semiconductor wafer to be scribed as an embodiment of the present invention.

Fig. 3 is a cross-sectional view showing a front view of the jig for use in scribing and a portion A of amplifying a chain line in the embodiment of the present invention.

Fig. 4 is a front view showing a state in which a semiconductor substrate is positioned in a jig for scoring.

Fig. 5 is a cross-sectional view showing a state in which a semiconductor wafer is scribed by using a dicing jig in the embodiment.

Next, an embodiment of the present invention will be described. In the semiconductor of this embodiment, the substrate to be cracked is a germanium semiconductor wafer. 2(a) shows the functional surface of the substantially circular germanium semiconductor wafer 10, and FIG. 2(b) shows the surface on the back side, that is, the substrate side. In the manufacturing process of the semiconductor wafer 10, a plurality of functional regions 11 are formed in a lattice shape along the line parallel to the X-axis and the Y-axis on the functional surface 10A. The functional regions 11 are generally disposed at equal intervals between certain distances, for example, MEMS functional regions in which mechanical components, inductors, actuators, and the like are incorporated. Further, since each functional region is divided into semiconductor wafers, as shown in FIG. 2(b), the surface 10B on the substrate side where the functional region is not formed is indicated by a dotted line, and is thus used by the scribing device. The scribed lines S _y1 to S _{yn are} formed in the longitudinal direction, and the scribe lines S _x1 to S _{xm are} formed in the lateral direction. The scribed lines are formed in a lattice shape, and a plurality of rectangular regions are formed therebetween. Further, a functional area 11 is disposed on the functional surface 10A side in the center of the rectangular region.

In the present embodiment, the jig 20 for scribing is used when scribing the semiconductor wafer 10. The scoring jig 20 is a metal jig of a square flat plate as shown in the front view of FIG. 3(a) and the enlarged cross-sectional view of the area indicated by A in FIG. 3(b), for example, the thickness is set. It is about a few mm. The jig 20 is formed with a plurality of rectangular protective holes 21 arranged in a row along the x-direction and the y-direction along a line corresponding to each of the functional regions including the semiconductor wafer 10. The protective hole 21 is set to be larger than the functional region 11 so as not to apply a force to the functional region 11 of the semiconductor wafer 10 at the time of scribing, and is referred to as a through hole.

Further, as shown in FIG. 3, on one surface of the jig 20, a holder for fixing a substrate is provided at four locations along the periphery thereof. The holders 22-1 to 22-4, as shown in FIG. 4, are held around the semiconductor wafer 10 and positioned when the fixture 20 is mounted with the semiconductor wafer 10, and are used to prevent the semiconductor wafer 10 from moving. The holder. The holders 22-1 to 22-4 may have an L-shaped cross section as shown in Fig. 3(b), or may be formed of a member having elasticity.

Further, in the case where the semiconductor wafer 10 is scribed using the scribing jig 20, the scribing jig 20 is placed on a platform of a scribing device (not shown). Further, as shown in FIG. 4, the functional surface 10A of the semiconductor wafer 10 is placed in contact with the scribing jig 20, and the functional region 11 of the semiconductor wafer 10 is completely included in the scribing treatment. The positioning is performed in the manner of a protective hole 21 of 20. Moreover, by holding the holders 22-1~22-4, the semiconductor wafer 10 is not displaced. The way to position correctly. 5 is a cross-sectional view in such a manner that all of the functional regions 11 become positions corresponding to the protective holes 21 so as not to be in direct contact with the scoring jig 20. The platform of the scoring device can also be a general platform, and can also be an adsorption platform for holding a jig or a semiconductor wafer by attracting air.

In this manner, after the positioning is performed, once the scribing cutter wheel 31 is rotated and scored on the substrate surface 10B by the scribing device, as shown in FIG. 5, although a load is applied to the semiconductor wafer 10, The corresponding portion of the functional area 11 is provided with a protective hole 21, so that the functional area 11 is also not damaged when it is scored. Thus, the scribe line can be formed by scribing the semiconductor wafer 10 along the scribed lines S _x1 to S _xm , S _y1 to S _yn .

Then, the semiconductor wafer 10 is reversed, and is broken along all the scribe lines by a cracking device (not shown). Accordingly, a plurality of MEMS wafers each containing a functional region can be separated.

Further, in this embodiment, the plurality of protective holes 21 of the jig 20 may be provided as through holes to protect the functional region 11 of the semiconductor wafer. However, if the functional region 11 of the semiconductor wafer 10 is not scribed at the time of scribing The jig 20 can be directly contacted, and therefore can be a non-through hole, and can be set to a hole of any depth.

Further, in this embodiment, the holder for scoring is provided with an L-shaped holder. However, the functional area of the semiconductor wafer can be accurately positioned and held by the protective hole of the jig, and is not limited to this shape. Further, the platform is an adsorption platform, and in the case where the semiconductor wafer can be reliably adsorbed and fixed by sucking air through the protective hole, the holder may not be provided. Further, even in a general platform, if the periphery of the semiconductor wafer is held by the protective tape or the like after being positioned in the jig 20, the holder may not necessarily be provided.

Further, in this embodiment, the semiconductor wafer as the substrate will be described. However, the present invention is also applicable to various brittle material substrates such as a tantalum carbide substrate (SiC substrate), a sapphire substrate, and an LTCC substrate.

When the brittle material substrate is scribed on the back surface of the functional surface to be protected, the present invention can be applied to the substrate on which the functional region is formed because it can be scribed without damaging the functional region. Scribe device.

10‧‧‧Semiconductor wafer

10A‧‧‧ functional surface

10B‧‧‧ substrate surface

11‧‧‧ functional area

21‧‧‧Protection hole

30‧‧‧ platform

31‧‧‧Scratch cutter wheel

Claims (4)

A method for scribing a brittle material substrate is characterized in that a brittle material substrate having a functional surface of a plurality of functional regions formed in a longitudinal direction and a lateral direction and having a surface layer on the other surface is characterized is characterized in that: In the center position of each of the lattice-shaped regions of the substrate surface of the brittle material substrate in which the predetermined line is scribed at the same pitch, a flat-shaped scriber having a protective hole larger than the functional area is formed. And a functional surface of the brittle material substrate is included in the protective hole of the scribing tool to contact the functional surface of the brittle material substrate with the jig; from the substrate surface of the brittle material substrate, along The scribed line is formed in a lattice shape to form a score line. A scribing jig is characterized in that the substrate surface having a functional surface having a plurality of functional regions formed in a longitudinal direction and a lateral direction and having a brittle material substrate on the other surface of the substrate is characterized. : a flat plate shape, and having a protective hole provided at a central position of each of the regions at the same pitch as the lattice-shaped scribed line of the brittle material substrate; the dicing jig is The functional region of the brittle material substrate is brought into contact with the functional surface of the brittle material substrate so as to be included in the protective hole. The jig for the characterization of the second aspect of the patent application, further comprising a plurality of holders for holding the brittle material substrate such that a functional region of the functional surface of the brittle material substrate is included in each of the protective holes. A method for breaking a brittle material substrate, comprising: a functional surface having a plurality of functional regions formed in a longitudinal direction and a lateral direction, and a brittle material substrate on the other substrate surface The line is scribed and divided, and is characterized in that a center position of each of the grid-shaped regions having the same pitch as the predetermined line of the lattice-shaped substrate surface of the brittle material substrate is formed to be larger than the functional area. The flat-shaped knives of the protective holes are formed such that the functional surface of the brittle material substrate is included in the protective hole of the scribing tool to contact the functional surface of the brittle material substrate with the scoring jig Forming a scribe line from the substrate surface of the brittle material substrate in a lattice shape along the scribed line; inverting the scribed hard material substrate and breaking along the formed scribe line This is used to break.