TWI590285B - An ion source with vaporizer - Google Patents
An ion source with vaporizer Download PDFInfo
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- TWI590285B TWI590285B TW104104302A TW104104302A TWI590285B TW I590285 B TWI590285 B TW I590285B TW 104104302 A TW104104302 A TW 104104302A TW 104104302 A TW104104302 A TW 104104302A TW I590285 B TWI590285 B TW I590285B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/48—Ion implantation
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Description
本發明係有關於一種離子源,特別是有關於一種具有蒸發器(vaporizer)的離子源,此蒸發器使用熱絕緣體以減少熱能散失及/或使用具有高熱傳導性之輻射遮罩以導熱,使得蒸發器內溫度分布可更均勻,亦特別是有關於一種具有蒸發器的離子源,此蒸發器使用具有多個開孔的中空擴散器以將已蒸發材料自蒸發器內之容器傳送至電弧室。 The present invention relates to an ion source, and more particularly to an ion source having a vaporizer that uses a thermal insulator to reduce heat loss and/or use a radiation mask having high thermal conductivity to conduct heat, such that The temperature distribution within the evaporator can be more uniform, and in particular relates to an ion source having an evaporator that uses a hollow diffuser having a plurality of openings to transfer the vaporized material from the vessel in the evaporator to the arc chamber .
離子佈植對於現代元件製造技術,例如半導體元件製造或平面面板製造技術而言,係屬必須但卻昂貴的製程。離子佈植主要是用於將化學活躍材料物摻雜-引入例如通常是矽之半導體材料的工作件內。在多數的情況下並無可替代離子佈植的其他製程。離子佈植在其他應用方面亦有增加的趨勢,例如元件上關鍵區域的定義以及工作件內摻質遷移率(mobility)的控制。 Ion implantation is a must-have but expensive process for modern component fabrication techniques, such as semiconductor component fabrication or planar panel fabrication techniques. Ion implantation is primarily used to dope a chemically active material into a workpiece such as a semiconductor material that is typically tantalum. In most cases there are no other processes that can replace ion implantation. Ion implantation also has an increasing trend in other applications, such as the definition of critical areas on components and the control of dopant mobility within the workpiece.
目前主流使用中的離子佈植機為離子束線型(beam-line type)離子佈植機,其中電漿係於一電弧室內生成與維持,且其中大量的離子被連續地自電弧室中抽離接著在一工作件被佈植前被調整成為一具有所需種類離子的離子束。很明顯地當離子被連續地自電弧室中抽離時,具有所需種類離子的材料必續被連續地供應至電弧室內以維持電漿。 At present, the ion implanter in mainstream use is a beam-line type ion implanter, wherein the plasma is generated and maintained in an arc chamber, and a large amount of ions are continuously extracted from the arc chamber. It is then adjusted to an ion beam of the desired type of ion before the workpiece is implanted. It is apparent that as ions are continuously withdrawn from the arc chamber, materials having the desired species of ions must be continuously supplied to the arc chamber to maintain the plasma.
一般而言,當一具有一特定種類離子之氣體狀態材料可在室溫下存在時,為了簡化硬體與操作,此氣體狀態材料係儲存於電弧室外接著被傳送至電弧室,使一具有此特定種類離子之電漿可被維持。例如被廣泛使用以用於提供磷的磷化氫(PH3)氣體、被廣泛使用以用於提供砷的砷化氫(AsH3)氣體以及被廣泛使用以用於提供硼的三氟化硼(BF 3)氣體。不過對於某些其他特別種類離子而言,並無可用的氣體狀態材料,至少並無商業化氣體狀態材料。例如銻(Sb)、銦(In)與鋁(Al)對於半導體製程而言係有價值的材料,但尚沒有商業化販售的氣體狀態材料。舉例來說,這些元素材料的佈植為一新發展的課題,但大部分的此種元素材料係以化合物的形式存在,例如室溫下的金屬氧化物。 In general, when a gaseous state material having a particular type of ion is present at room temperature, in order to simplify the hardware and operation, the gaseous state material is stored outside the arc chamber and then transferred to the arc chamber, so that one has The plasma of a particular type of ion can be maintained. For example, phosphine (PH3) gas which is widely used for supplying phosphorus, arsine (AsH3) gas which is widely used for supplying arsenic, and boron trifluoride (BF) which is widely used for supplying boron 3) Gas. However, for some other special types of ions, there are no gaseous state materials available, at least no commercial gas state materials. For example, bismuth (Sb), indium (In), and aluminum (Al) are valuable materials for semiconductor processes, but there are no commercially available gas state materials. For example, the implantation of these elemental materials is a new development topic, but most of these elemental materials exist in the form of compounds, such as metal oxides at room temperature.
很常見的是當一特定種類離子在室溫下無法由氣體狀態材料提供時,一鄰近一電弧室的蒸發器被廣泛用於承載一具有此特定種類離子的固態或液態材料,使得已蒸發之材料能自蒸發器傳送至附近的電弧室。 It is very common that when a particular type of ion is not available from a gaseous state material at room temperature, an evaporator adjacent to an arc chamber is widely used to carry a solid or liquid material having this particular type of ion such that it has evaporated. Material can be transferred from the evaporator to a nearby arc chamber.
第一A圖顯示一常見離子源結構。一蒸發器10設置於一電弧室16之鄰近並具有一外殼11、一容器12與一通道元件13。容器12,例如一箱型或一管形容器,係位於外殼11內並用於儲存將蒸發的固態或液態材料,而通道元件13,例如一具有開孔之噴嘴及/或金屬管,係機械連接至容器12以使被蒸發的材料可自容器12經通道元件13傳送至電弧室16。由於電弧室的溫度通常至少達攝氏數百度,且由於電弧室16與外殼11之間的距離並不遠,電弧室16形同作為一熱源,提供熱能進入容器12以蒸發儲存的材料。請注意一材料的蒸發溫度可由低於攝氏五十度至高於攝氏一千度。 Figure 1A shows a common ion source structure. An evaporator 10 is disposed adjacent an arc chamber 16 and has a housing 11, a container 12 and a channel member 13. The container 12, such as a box or a tubular container, is located within the outer casing 11 and is used to store solid or liquid material to be vaporized, while the channel member 13, such as a nozzle and/or metal tube having an opening, is mechanically coupled. To the container 12, the evaporated material can be transferred from the container 12 to the arc chamber 16 via the channel member 13. Since the temperature of the arc chamber is typically at least a few hundred degrees Celsius, and since the distance between the arc chamber 16 and the outer casing 11 is not far, the arc chamber 16 acts as a heat source, providing thermal energy into the container 12 to vaporize the stored material. Please note that the evaporation temperature of a material can range from less than 50 degrees Celsius to more than one thousand degrees Celsius.
第一B圖顯示另一常見離子源結構。一蒸發器10具有一外殼11、一容器12、一通道元件13與一加熱器14。容器12,例如一箱型或一管形容器,係位於外殼11內並用於儲存待蒸發的固態或液態材料。由於外殼11直接與電弧室16接觸,使被蒸發的材料可直接傳送至電弧室16。加熱器14,例如一烤箱或一些加熱線圈,係位於外殼11內並鄰近容器12,以加熱儲存於容器12內的固態或液態材料。在此結構中待蒸發的材料至少由加熱器14加熱。因此當加熱器14溫度夠高,蒸發溫度高於電弧室16溫度的材料仍可由加熱器14加以蒸發。 The first B diagram shows another common ion source structure. An evaporator 10 has a housing 11, a container 12, a channel member 13 and a heater 14. A container 12, such as a box or a tubular container, is located within the outer casing 11 and is used to store solid or liquid material to be evaporated. Since the outer casing 11 is in direct contact with the arc chamber 16, the evaporated material can be directly transferred to the arc chamber 16. A heater 14, such as an oven or some heating coil, is located within the outer casing 11 adjacent the container 12 to heat the solid or liquid material stored in the container 12. The material to be evaporated in this structure is heated by at least the heater 14. Therefore, when the temperature of the heater 14 is sufficiently high, the material having an evaporation temperature higher than the temperature of the arc chamber 16 can be evaporated by the heater 14.
此外仍有其他一些常見離子源結構。舉例來說,如第一C圖所示,一可選擇的離子源結構變化為第一A圖與第一B圖離子源結構的組合,其中外殼11與電弧室16分離但仍鄰近電弧室16,且通道元件13用於連接電弧室16至由外殼11內加熱器14加熱的容器12。舉例來說,如第一D圖所示,一可選擇的離子源結構變化為一熱遮罩15設置於電弧室16與外殼11之間以阻擋至少一部分來自電弧室16的熱輻射,並主要以加熱器14加熱儲存在容器12內的材料。 There are still other common ion source structures. For example, as shown in FIG. C, an alternative ion source configuration is a combination of a first A map and a first B graph ion source structure, wherein the outer casing 11 is separated from the arc chamber 16 but still adjacent to the arc chamber 16 And the channel element 13 is used to connect the arc chamber 16 to the vessel 12 heated by the heater 14 in the outer casing 11. For example, as shown in FIG. D, an alternative ion source configuration is changed such that a thermal shield 15 is disposed between the arc chamber 16 and the outer casing 11 to block at least a portion of the thermal radiation from the arc chamber 16, and primarily The material stored in the container 12 is heated by the heater 14.
儘管如此,上述離子源結構仍有一些缺點。 Nevertheless, the above ion source structure still has some disadvantages.
首先不同材料通常具有不同蒸發溫度,甚至含有相同種類離子的不同材料亦具有不同蒸發溫度,但電弧室16的溫度通常無法特別調整至所需的蒸發溫度,因為此溫度不可避免會影響電弧室內的電漿,接著不可避免地會影響取自電漿的離子數量。因此,材料的蒸發,例如容器12內材料的蒸發速率在電弧室16為熱源時通常並非為最佳化,無論加熱器14是否作為熱源,即使熱遮罩15被用來減少電弧室16的效應。 First, different materials usually have different evaporation temperatures, and even different materials containing the same kind of ions have different evaporation temperatures, but the temperature of the arc chamber 16 is usually not particularly adjustable to the required evaporation temperature, because this temperature inevitably affects the arc chamber. The plasma, in turn, inevitably affects the amount of ions taken from the plasma. Thus, evaporation of material, such as the rate of evaporation of material within the vessel 12, is generally not optimized when the arc chamber 16 is a heat source, whether or not the heater 14 acts as a heat source, even though the heat shield 15 is used to reduce the effects of the arc chamber 16. .
其次,由於實際操作的限制,電弧室的溫度可能起伏變動,即便電弧室16內的電漿溫度並未動態調整來提供具有不同能量/密度的離子。因此自電弧室16傳送至容器12的熱能不可避免地並不穩定。此外,加熱器14提供的熱亦可能由於實際操作的限制而不穩定或不平均。因此,蒸發器10內的材料蒸發過成以及已蒸發材料自蒸發器10傳送至電弧室16的流速往往是不穩定的,其不可避免地影響電弧室16內的電漿。 Second, due to practical limitations, the temperature of the arc chamber may fluctuate, even if the plasma temperature within the arc chamber 16 is not dynamically adjusted to provide ions having different energies/densities. Therefore, the heat energy transferred from the arc chamber 16 to the container 12 is inevitably unstable. In addition, the heat provided by the heater 14 may also be unstable or uneven due to limitations of actual operation. Thus, the evaporation of material within the evaporator 10 and the flow rate of the vaporized material from the evaporator 10 to the arc chamber 16 tend to be unstable, which inevitably affects the plasma within the arc chamber 16.
第三,已蒸發材料可能在容器12至電弧室16的傳送路徑上凝結,這是因為通道元件13二端可能被熱源,例如電弧室16與加熱器14,非直接地加熱。 Third, the evaporated material may condense on the transport path of the vessel 12 to the arc chamber 16 because both ends of the channel member 13 may be indirectly heated by a heat source, such as the arc chamber 16 and the heater 14.
第四,自容器12散失的熱通常不均勻,甚至有些無法控制,這是因為容器12、外殼11與蒸發器10其他部分實際結構的限制。因此,不僅容器12內材料的蒸發速率因散熱而下降,同時容器12內材料的蒸發速率也因而不均勻。因此蒸發器10的功能因實際散熱而衰減。 Fourth, the heat dissipated from the container 12 is generally not uniform, or even somewhat uncontrollable, due to the limitations of the actual structure of the container 12, the outer casing 11 and other portions of the evaporator 10. Therefore, not only is the evaporation rate of the material in the container 12 lowered due to heat dissipation, but the evaporation rate of the material in the container 12 is also uneven. Therefore, the function of the evaporator 10 is attenuated due to actual heat dissipation.
第五,容器12內待蒸發材料的分布也可能不均勻,特別是儲存材料之分佈與通道元件13之間的相對幾何關係。因此,氣態之已蒸發材料的產生亦可能不均勻。 Fifth, the distribution of the material to be evaporated in the container 12 may also be uneven, particularly the relative geometric relationship between the distribution of the storage material and the channel member 13. Therefore, the generation of vaporized material in the gaseous state may also be uneven.
第六,使用蒸發器不可避免地增加離子源的成本與複雜性,特別是當使用不同材料時蒸發器的某些部份也可以更換時。 Sixth, the use of an evaporator inevitably increases the cost and complexity of the ion source, especially when certain parts of the evaporator can be replaced when different materials are used.
因此,需要發展一新穎的離子源蒸發器以更均勻及更穩定地蒸發材料與輸送已蒸發材料。 Therefore, there is a need to develop a novel ion source evaporator to more efficiently and more stably evaporate materials and transport evaporated materials.
本發明提供一用於離子佈植機之具有蒸發器的離子源,其中蒸發器係設置用於調整儲存於其內之材料如何被加熱蒸發以及被蒸發之材料如何被傳輸。蒸發器可使用以下一或多個方法:熱絕緣體設置鄰近容器的至少一部份,熱絕緣體圍繞容器與加熱器以加熱容器,具高導熱係數的輻射遮罩設置於外殼之外或甚至在已蒸發材料的傳輸路徑上。 The present invention provides an ion source having an evaporator for an ion implanter, wherein the evaporator is arranged to adjust how the material stored therein is evaporated by heating and how the material being evaporated is transported. The evaporator may use one or more of the following methods: the thermal insulator is disposed adjacent to at least a portion of the container, the thermal insulator surrounds the container and the heater to heat the container, and the radiation mask having a high thermal conductivity is disposed outside the outer casing or even Evaporating material on the transport path.
本發明的一些較佳實施例係關於一具有蒸發器的離子源,其中一或更多的熱絕緣體設置鄰近於容器及/或外殼。因此,與傳統無熱絕緣體設置鄰近於容器或至少鄰近外殼的蒸發器相比,這些實施例可以減少自容器或外殼散失的熱能以增加存儲在容器內待蒸發材料的蒸發速率。此外,當加熱源通常位於靠近容器的一特別部分,容器內的溫度差異可藉由設置熱絕緣體於鄰近容器之其他部分而減少。此處,熱絕緣體並不限定是否與容器直接接觸。事實上,熱絕緣體的數量與幾何分佈,甚至其他相關參數是可選擇的,且應由不同的實用設計決定。 Some preferred embodiments of the invention relate to an ion source having an evaporator wherein one or more thermal insulators are disposed adjacent to the container and/or housing. Thus, these embodiments can reduce the amount of thermal energy lost from the container or housing to increase the rate of evaporation of the material to be evaporated stored in the container as compared to conventional heatless insulators disposed adjacent to or at least adjacent to the outer casing. Moreover, when the heat source is typically located near a particular portion of the container, the temperature difference within the container can be reduced by providing a thermal insulator adjacent to other portions of the container. Here, the thermal insulator is not limited to whether it is in direct contact with the container. In fact, the number and geometric distribution of thermal insulators, and even other relevant parameters, are optional and should be determined by different practical designs.
本發明的一些較佳實施例係關於一具有蒸發器的離子源,其中一或更多的熱絕緣體設置同時圍繞容器與用於加熱容器的加熱器。因此,與傳統只使用來自電弧室的熱能加熱容器的蒸發器以及傳統只用加熱器加熱容器的蒸發器相比,這些實施例可藉由調整加熱器的操作更靈活且有效地加熱容器,亦可藉由調整熱絕緣體與加熱器的數量與分佈減少容器內溫差。請注意熱絕緣體可減少自加熱器散失的熱能,然後增加自加熱器傳送到容器的熱量,進而提高儲存之待蒸發材料的蒸發。同時請注意熱絕緣體可減少自電弧室傳輸至容器與加熱器組合的熱能,然後可減少來自電弧室不穩定熱能所造成的蒸發擾動。 Some preferred embodiments of the invention relate to an ion source having an evaporator wherein one or more thermal insulators are disposed to surround the container simultaneously with the heater for heating the container. Thus, these embodiments can more flexibly and efficiently heat the container by adjusting the operation of the heater compared to conventional evaporators that only use thermal energy from the arc chamber to heat the vessel and conventional evaporators that only heat the vessel with a heater. The temperature difference within the vessel can be reduced by adjusting the number and distribution of thermal insulators and heaters. Please note that the thermal insulator reduces the amount of heat lost from the heater and then increases the amount of heat transferred from the heater to the vessel, thereby increasing the evaporation of the material to be evaporated stored. Also note that the thermal insulator reduces the heat transfer from the arc chamber to the combination of the vessel and the heater, and then reduces the evaporation disturbance caused by the unstable thermal energy from the arc chamber.
本發明的一些較佳實施例係關於一具有蒸發器的離子源,其中一中空通道元件被設置機械連接外殼內空間至電弧室,且一具有高導熱係數的輻射遮罩設置鄰近於外殼與通道元件的組合的至少一部份。因此,由於輻射遮罩能將熱引導通過設置輻射遮罩的部分,可減少外殼及/或通道元件內的溫差。特別是因為輻射遮罩可設置於鄰近可能無法被電弧室及/或容器有效地加熱的部分,可減少通道元件內已蒸發材料的凝結,使得容器內待蒸發材料可更有效地被蒸發與被傳輸,這是因為外殼內的平均溫度與溫度分佈被改善,同時已蒸發材料通過通道元件的傳輸也更均勻。 Some preferred embodiments of the present invention relate to an ion source having an evaporator, wherein a hollow channel member is mechanically coupled to the inner space of the outer casing to the arc chamber, and a radiation mask having a high thermal conductivity is disposed adjacent to the outer casing and the passage At least a portion of a combination of components. Thus, since the radiation mask can direct heat through the portion in which the radiation mask is disposed, the temperature difference within the outer casing and/or channel member can be reduced. In particular, because the radiation shield can be placed adjacent to a portion that may not be effectively heated by the arc chamber and/or the container, condensation of the evaporated material within the channel member can be reduced, so that the material to be evaporated within the container can be more efficiently evaporated and Transmission, because the average temperature and temperature distribution within the outer casing is improved, while the transport of evaporated material through the channel elements is more uniform.
本發明更提供一具有蒸發器的離子源以有效地將已蒸發材料傳輸進入電弧室,其中蒸發器之設置係著重在待蒸發材料如何置放於容器內以及已蒸發材料如何自容器傳輸離開。 The present invention further provides an ion source having an evaporator for efficiently transporting vaporized material into the arc chamber, wherein the arrangement of the evaporator focuses on how the material to be evaporated is placed in the container and how the vaporized material is transported away from the container.
本發明的一些較佳實施例係關於一具有蒸發器的離子源,其中一擴散器至少部分位於容器內,擴散器為於容器內具有至少一開孔的中空結構。因此,容器內的已蒸發材料可依序擴散通過開孔與中空擴散器內部空間直到抵達電弧室。合理地,因為經由商售可獲得的待蒸發材料通常是由材料供應商而非離子佈植機供應商決定的粉末狀材料,開孔的尺寸與數量可根據粉末狀材料的尺寸與蒸發溫度調整。因此,可減少已蒸發材料凝結且可調整已蒸發材料的流速。此外,擴散器可具有一橫越擴散器軸方向與容器內一端的板結構(plate structure)。因此,容器內儲存材料的崩滑(landside)可被板結構阻擋,而且已蒸發材料可擴散至位於擴散器其他部分的開孔。 Some preferred embodiments of the invention relate to an ion source having an evaporator, wherein a diffuser is at least partially located within the container, the diffuser being a hollow structure having at least one opening in the container. Thus, the evaporated material within the container can be sequentially diffused through the opening and the interior of the hollow diffuser until it reaches the arc chamber. Reasonably, since the material to be evaporated which is commercially available is usually a powdery material determined by the material supplier rather than the ion implanter supplier, the size and number of openings can be adjusted according to the size and evaporation temperature of the powdered material. . Therefore, the evaporation of the evaporated material can be reduced and the flow rate of the evaporated material can be adjusted. Additionally, the diffuser can have a plate structure that traverses the direction of the diffuser axis and the inner end of the container. Thus, the landside of the stored material within the container can be blocked by the plate structure and the evaporated material can diffuse to the openings in other portions of the diffuser.
10‧‧‧蒸發器 10‧‧‧Evaporator
11‧‧‧外殼 11‧‧‧Shell
12‧‧‧容器 12‧‧‧ Container
13‧‧‧通道元件 13‧‧‧channel components
14‧‧‧加熱器 14‧‧‧heater
15‧‧‧熱遮罩 15‧‧‧Hot mask
16‧‧‧電弧室 16‧‧‧Arc chamber
20‧‧‧蒸發器 20‧‧‧Evaporator
21‧‧‧外殼 21‧‧‧ Shell
22‧‧‧容器 22‧‧‧ Container
23‧‧‧通道元件 23‧‧‧Channel components
235‧‧‧擴散器 235‧‧‧Diffuser
24‧‧‧熱絕緣體 24‧‧‧ Thermal Insulators
25‧‧‧加熱器 25‧‧‧heater
26‧‧‧遮罩 26‧‧‧ mask
27‧‧‧附加遮罩 27‧‧‧Additional mask
28‧‧‧開孔 28‧‧‧Opening
29‧‧‧電弧室 29‧‧‧Arc chamber
第一A圖至第一D圖分別為常見傳統離子源蒸發器結構的截面圖。 The first to the first D are respectively sectional views of the structure of a conventional conventional ion source evaporator.
第二A圖與第二L圖分別為本發明所提出離子源的一些實施例的截面圖。 The second A and second L views are respectively cross-sectional views of some embodiments of the proposed ion source of the present invention.
本發明的詳細描述將藉由以下的實施例討論,這些實施例並非用於限制本發明的範圍,而且可適用於其他應用中。圖示揭露了一些細節,必須理解的是揭露元件的設計的細節可不同於已透露者,除非是明確限制元件的特徵的情形。 The detailed description of the present invention will be discussed by the following examples, which are not intended to limit the scope of the invention, and are applicable to other applications. The drawings disclose some details, and it must be understood that the details of the design of the disclosed elements may differ from those disclosed, unless the features of the elements are explicitly limited.
本發明一實施例之離子源如第二A圖與第二B圖所示,一蒸發器20設置鄰近於一相鄰電弧室29使得蒸發器20內待蒸發材料,無論是固態或液態材料,可被蒸發並接著被傳送至電弧室29內以使電弧室29內具有大量所需種類離子之電漿。此外,蒸發器20至少具有一鄰近電弧室29的外殼21、一設置於外殼21內並用於置放待蒸發材料的容器22以及一將容器22機械連接至電弧室29的通道元件23,以使已蒸發材料可自容器22經通道元件23擴散至電弧室29,以及一設置鄰近於外殼21的熱絕緣體24。在此,第二A圖顯示熱絕緣體24與容器22直接機械接觸電弧室29的情況,而第二B圖顯示熱絕緣體24與容器22相互分離的情況。此外,第二A圖與第二B圖均顯示容器22一端面對電弧室29而另一端面對熱絕緣體24的情況,且均顯示熱絕緣體24位於外殼21內的情況 An ion source according to an embodiment of the present invention is shown in FIGS. 2A and 2B. An evaporator 20 is disposed adjacent to an adjacent arc chamber 29 such that the material to be evaporated in the evaporator 20, whether solid or liquid, It can be vaporized and then transferred into the arc chamber 29 to have a large amount of plasma of the desired species of ions within the arc chamber 29. Further, the evaporator 20 has at least one outer casing 21 adjacent to the arc chamber 29, a container 22 disposed in the outer casing 21 for placing the material to be evaporated, and a passage member 23 for mechanically connecting the container 22 to the arc chamber 29 so that The evaporated material can diffuse from the container 22 through the channel member 23 to the arc chamber 29, and a thermal insulator 24 disposed adjacent to the outer casing 21. Here, the second A diagram shows the case where the thermal insulator 24 directly mechanically contacts the arc chamber 29 with the container 22, and the second B diagram shows the case where the thermal insulator 24 and the container 22 are separated from each other. In addition, both the second A diagram and the second B diagram show the case where one end of the container 22 faces the arc chamber 29 and the other end faces the thermal insulator 24, and both of them show that the thermal insulator 24 is located inside the casing 21.
合理地,由於熱絕緣體24鄰近容器22,自容器22離開的熱能可能減少,不論是經由輻射損失、傳導損失及/或對流損失。容器22與熱絕緣體24之間重疊 的部分越大,熱能的損失減少的越多。容器22與熱絕緣體24之間的距離越短,熱能的損失減少的越多。此外,熱絕緣體24的熱傳導率越小,熱能的損失減少的越多。因此,藉由使用熱絕緣體24,由於熱能散失總量的減少,容器22內的待蒸發材料之蒸發過程可被改進。 Reasonably, since the thermal insulator 24 is adjacent to the container 22, the thermal energy exiting the container 22 may be reduced, whether via loss of radiation, loss of conduction, and/or loss of convection. The container 22 overlaps with the thermal insulator 24 The larger the part, the more the loss of heat energy is reduced. The shorter the distance between the container 22 and the thermal insulator 24, the more the loss of thermal energy is reduced. Further, the smaller the thermal conductivity of the thermal insulator 24, the more the loss of thermal energy is reduced. Therefore, by using the thermal insulator 24, the evaporation process of the material to be evaporated in the container 22 can be improved due to the reduction in the total amount of heat energy loss.
此外,為了達到使用熱絕緣體24以減少熱能散失與溫度差,本發明對熱絕緣體24之細節保持彈性,亦對用於加熱容器22之熱源的細節保持彈性。 Moreover, in order to achieve the use of thermal insulator 24 to reduce thermal energy dissipation and temperature differential, the present invention remains resilient to the details of thermal insulator 24 and also maintains resiliency to the details of the heat source used to heat vessel 22.
舉例來說,在第二A圖與第二B圖中所示的情況中,當熱絕緣體24鄰近容器22的後端而容器22的前端面向電弧室29,容器22的二端溫差可因熱絕緣體24顯著地減少容器22的後端附近的熱能散失而減少。因此,容器22內的待蒸發材料可被均勻地加熱而且待蒸發材料的蒸發亦可更穩定。 For example, in the case shown in the second A and second B, when the thermal insulator 24 is adjacent to the rear end of the container 22 and the front end of the container 22 faces the arc chamber 29, the temperature difference between the two ends of the container 22 may be due to heat. The insulator 24 significantly reduces the loss of thermal energy near the rear end of the container 22 and reduces it. Therefore, the material to be evaporated in the container 22 can be uniformly heated and the evaporation of the material to be evaporated can be more stable.
舉例來說,在一些未圖示的實施例中,當容器22一端面對電弧室29而另一端遠離電弧室29時,熱絕緣體24係設置以環繞整個容器22或僅靠近容器22的側壁。同時,熱絕緣體24可由任何具有低導熱係數的材料構成,本發明並不限制熱絕緣體24的材料。此外,當熱絕緣體24與容器22係機械性地分離,熱絕緣體24與容器22之間的距離為可調整的變數。同時,當熱絕緣體24與容器22之間的相對關係為關鍵時,熱絕緣體24可設置在外殼21內部及/或外部。 For example, in some embodiments not shown, when one end of the container 22 faces the arc chamber 29 and the other end is away from the arc chamber 29, the thermal insulator 24 is disposed to surround the entire container 22 or only the side wall of the container 22. Meanwhile, the thermal insulator 24 may be composed of any material having a low thermal conductivity, and the present invention does not limit the material of the thermal insulator 24. Further, when the thermal insulator 24 is mechanically separated from the container 22, the distance between the thermal insulator 24 and the container 22 is an adjustable variable. Meanwhile, when the relative relationship between the thermal insulator 24 and the container 22 is critical, the thermal insulator 24 may be disposed inside and/or outside the outer casing 21.
此外,當容器22的材料,特別是容器22外殼的材料,也會影響熱能如何自容器22散失時,可以選擇性地改變容器22的形狀。舉例來說,當熱絕緣體24係設置靠近容器22的一端時,可選擇讓容器22的這一端具有較厚的外殼使得熱絕緣體24與容器22直接接觸,但亦可選擇讓容器22的這一端具有較薄的外殼以使熱絕緣體24機械性地遠離容器22。此處容器22的外殼厚度可影響熱能如何 被傳導離開,熱絕緣體24與容器22外殼之間的距離可影響熱能如何自被輻射離開。亦可選擇不同容器22的變化型式以平衡由離子源不同結構及/或不同種類及/或數量之待蒸發材料所造成的不同熱能散失。 Moreover, the shape of the container 22 can be selectively varied when the material of the container 22, particularly the material of the outer casing of the container 22, also affects how thermal energy is lost from the container 22. For example, when the thermal insulator 24 is disposed adjacent one end of the container 22, the end of the container 22 can be selected to have a thicker outer casing such that the thermal insulator 24 is in direct contact with the container 22, but the end of the container 22 can also be selected. There is a thinner outer casing to mechanically move the thermal insulator 24 away from the container 22. Here the thickness of the outer casing of the container 22 can affect how the heat is Being conducted away, the distance between the thermal insulator 24 and the outer casing of the container 22 can affect how the thermal energy is radiated away. Variations of different containers 22 may also be selected to balance different thermal energy losses caused by different structures of the ion source and/or different types and/or quantities of material to be evaporated.
舉例來說,在一些未圖示的實施例中,可選擇將一圓柱狀烤箱設置於外殼21內以藉由將容器22置於圓柱狀烤箱內加熱容器22,且亦可選擇在圓柱狀烤箱側壁上安裝一些加熱線圈以藉由在加熱線圈內導入電流加熱容器22。圓柱狀烤箱與加熱線圈的使用係十分有利,因容器22可藉由彈性調整圓柱狀烤箱與加熱線圈的操作與結構配置而被精確加熱。 For example, in some embodiments not shown, a cylindrical oven may be optionally disposed within the outer casing 21 to heat the container 22 by placing the container 22 in a cylindrical oven, and may also be selected in a cylindrical oven. Some heating coils are mounted on the side walls to heat the vessel 22 by introducing electrical current into the heating coils. The use of a cylindrical oven and a heating coil is advantageous because the container 22 can be precisely heated by elastically adjusting the operational and structural configuration of the cylindrical oven and the heating coil.
此外,當熱絕緣體的位置不受限制時,當容器22的某些部分較靠近加熱源時,可選擇藉由將熱絕緣體24設置鄰近於容器22的其它部分以減少容器22內溫度差。換句話說,容器22內待蒸發材料的蒸發,例如蒸發速率,可藉由使用熱絕緣體24以減少熱能散失而更均勻,特別是減少自位於遠離加熱源之部分容器22散失的熱能。在此,加熱源可為電弧室29、上述烤箱與加熱線圈、及/或任何商售可獲得產品。 Moreover, when the position of the thermal insulator is not limited, when certain portions of the container 22 are closer to the heating source, the temperature difference within the container 22 can be reduced by providing the thermal insulator 24 adjacent to other portions of the container 22. In other words, the evaporation of the material to be evaporated in the vessel 22, such as the rate of evaporation, can be more uniform by using the thermal insulator 24 to reduce heat loss, particularly to reduce heat loss from a portion of the vessel 22 located remotely from the source of heat. Here, the heating source can be an arc chamber 29, the above described oven and heating coil, and/or any commercially available product.
此外,雖然在第二A圖與第二B圖中所示的情況中具有通道元件23,上述熱絕緣體24與加熱器25的討論不受通道元件23的限制,但前提是通道元件23不能被阻擋。因此,在一些未圖示的實施例中,外殼21與電弧室29直接接觸且一開孔位於外殼21與電弧室29之間以使已蒸發材料能進行擴散。在一些未圖示的實施例中,其中無通道元件23且開孔並未被加熱器25與熱絕緣體24阻擋。換句話說,可選擇熱絕緣體24是否鄰近開孔。 Further, although having the channel member 23 in the case shown in the second A diagram and the second B diagram, the above discussion of the thermal insulator 24 and the heater 25 is not limited by the channel member 23, provided that the channel member 23 cannot be Block. Thus, in some embodiments not shown, the outer casing 21 is in direct contact with the arc chamber 29 and an opening is located between the outer casing 21 and the arc chamber 29 to enable diffusion of the vaporized material. In some embodiments not shown, there are no channel elements 23 and the openings are not blocked by the heater 25 and the thermal insulator 24. In other words, it is possible to choose whether the thermal insulator 24 is adjacent to the opening.
因此與傳統未使用熱絕緣體的離子源比較,本發明這些實施例具有至少一些主要優點:當加熱源的操作未改變時,因藉由熱絕緣體24的存在而使容器22內溫差減少,使容器22內待蒸發材料的蒸發速率在容器22內可更均勻,同時因藉由熱絕緣體24的存在而使自容器22散失的熱減少,可使容器22內待蒸發材料的蒸發速率增加。 Thus, these embodiments of the present invention have at least some major advantages over conventional ion sources that do not use thermal insulators: when the operation of the heat source is not altered, the temperature difference within the vessel 22 is reduced by the presence of the thermal insulator 24, The rate of evaporation of the material to be evaporated within 22 can be more uniform within the vessel 22, while at the same time the heat lost from the vessel 22 is reduced by the presence of the thermal insulator 24, which can increase the rate of evaporation of the material to be evaporated within the vessel 22.
本發明一些實施例之離子源如第二C圖、第二D圖與第二E圖所示,一蒸發器20設置鄰近於一相鄰電弧室29使得蒸發器20內材待蒸發料可被蒸發接著可被傳送至電弧室29內以使電弧室29內具有大量所需種類離子之電漿。此外,蒸發器20至少具有一鄰近電弧室29的外殼21,設置於外殼21內並用於置放待蒸發材料的容器22,一將容器22機械連接至電弧室29的通道元件23,以使已蒸發材料可自容器22經通道元件23擴散至電弧室29,以及一設置至少鄰近於容器22一部分的加熱器25。在此,第二C圖顯示加熱器25包含整個容器22且熱絕緣體24設置鄰近於加熱器25的側壁的情況,第二D圖顯示加熱器25環繞容器22側壁且熱絕緣體24設置鄰近於加熱器25的側壁的情況,而第二E圖顯示熱絕緣體245設置鄰近於容器22面向電弧室29的一端且加熱器25設置鄰近於容器22的側壁與另一端的情況。 The ion source of some embodiments of the present invention is as shown in the second C diagram, the second D diagram and the second E diagram. An evaporator 20 is disposed adjacent to an adjacent arc chamber 29 so that the evaporator 20 material to be evaporated can be Evaporation can then be transferred into the arc chamber 29 to provide a plasma of a large amount of ions of the desired species within the arc chamber 29. Furthermore, the evaporator 20 has at least one outer casing 21 adjacent to the arc chamber 29, a container 22 disposed in the outer casing 21 for placing the material to be evaporated, and a mechanical connection of the container 22 to the channel member 23 of the arc chamber 29 so that The evaporative material can diffuse from the container 22 through the channel member 23 to the arc chamber 29, and a heater 25 disposed at least adjacent to a portion of the container 22. Here, the second C-picture shows that the heater 25 includes the entire container 22 and the thermal insulator 24 is disposed adjacent to the side wall of the heater 25, and the second D-graph shows that the heater 25 surrounds the side wall of the container 22 and the thermal insulator 24 is disposed adjacent to the heating. The case of the side wall of the device 25, while the second E diagram shows that the thermal insulator 245 is disposed adjacent to the end of the container 22 facing the arc chamber 29 and the heater 25 is disposed adjacent to the side wall and the other end of the container 22.
合理地,由於加熱器25設置鄰近於容器22,特別是比電弧室29更靠近容器22,加熱器25可有效地加熱容器22,。特別是,加熱器25的結構與運作可根據容器22內蒸發需求而調整,因為加熱器25是獨立於通常結構與運作無法調整以滿足容器22內蒸發需求的電弧室29之外。 Reasonably, since the heater 25 is disposed adjacent to the container 22, particularly closer to the container 22 than the arc chamber 29, the heater 25 can effectively heat the container 22. In particular, the structure and operation of the heater 25 can be adjusted based on the evaporation requirements within the vessel 22 because the heater 25 is external to the arc chamber 29 that is not tunable to meet the evaporation requirements within the vessel 22, as is conventional structure and operation.
合理地,熱絕緣體24可以減少自容器22與加熱器25散失的熱,無論是熱絕緣體24直接接近容器22或靠近加熱器25。特別是,熱絕緣體24的分佈限制熱能是如何自容器22與加熱器25傳送離開,甚至限制熱能是如何傳送通過包圍熱絕緣體24的空間。在此,透過適當方式設置熱絕緣體24與加熱器25於容器22周圍,容器22內的溫度分佈可更加均勻。 Reasonably, the thermal insulator 24 can reduce the heat dissipated from the container 22 and the heater 25, whether the thermal insulator 24 is in direct proximity to the vessel 22 or near the heater 25. In particular, the distribution of the thermal insulator 24 limits how thermal energy is transferred away from the vessel 22 and the heater 25, and even limits how heat is transferred through the space surrounding the thermal insulator 24. Here, the thermal insulator 24 and the heater 25 are disposed around the container 22 in a suitable manner, and the temperature distribution in the container 22 can be more uniform.
此外,使用熱絕緣體24與加熱器25的目的是提高溫度均勻性,甚至是減少散熱,本發明對熱絕緣體24與加熱器25的細節保持彈性,也對如何設置熱絕緣體24與加熱器25的細節保持彈性。 In addition, the purpose of using the thermal insulator 24 and the heater 25 is to improve temperature uniformity and even reduce heat dissipation. The present invention maintains elasticity of the details of the thermal insulator 24 and the heater 25, as well as how to provide the thermal insulator 24 and the heater 25. The details remain flexible.
例如,在一些未圖示的實施例中,加熱器25位於外殼21之外並靠近外殼21,或貼附於外殼21表面,雖然加熱器25通常位於外殼21內並靠近容器22以更有效地加熱容器22。請注意加熱器25所產生的熱能可平衡熱能散失,而加熱器25的分佈可影響容器22內的溫度分佈。因此,為了改進容器22內的溫度分佈,可選擇加熱器25包含整個容器22或至少環繞容器22的整個側壁。對於前者而言,加熱器25可為一烤箱而容器22設置於其內。對於後者而言,加熱器25可為一些分佈接近容器22側壁的加熱線圈,特別是均勻分佈鄰近容器22的側壁。因此,這兩種情況均可減少容器22內的溫度變化,至少減少沿容器22徑向方向的溫度變化。 For example, in some embodiments not shown, the heater 25 is located outside of the housing 21 and adjacent to the housing 21, or attached to the surface of the housing 21, although the heater 25 is typically located within the housing 21 and adjacent to the container 22 for more efficient operation. The vessel 22 is heated. Note that the thermal energy generated by the heater 25 balances the loss of thermal energy, and the distribution of the heater 25 can affect the temperature distribution within the vessel 22. Accordingly, to improve the temperature profile within the container 22, the heater 25 can be selected to include the entire container 22 or at least the entire sidewall of the container 22. For the former, the heater 25 can be an oven with the container 22 disposed therein. For the latter, the heater 25 can be some of the heating coils distributed adjacent the side walls of the container 22, particularly evenly distributed adjacent the side walls of the container 22. Thus, both of these conditions can reduce temperature variations within the vessel 22, at least reducing temperature variations in the radial direction of the vessel 22.
當然,加熱器25也可只設置僅鄰近容器22的一部分。例如,如果容器22相對二端溫度較低,而容器22的其他部分溫度較高,在沒有熱絕緣體24靠近容器22及/或外殼21的情況下,可選擇將加熱器25貼附在容器22相對的二端。如此,接近容器22相對二端的熱散失可由加熱器25所產生的熱量所平衡,而可減 少容器22內的溫度差。一個相關的選項是加熱器25也貼附在鄰近容器22相對二端的容器22側壁的一部分,以進一步縮小容器22內的溫度差。當然,還有其他官於加熱器25的配置選擇。例如,除了容器22面向電弧室29的一端之外,加熱器25可位於大部分容器22的周圍,以使容器22每個部分與每個表面可分別由加熱器25及/或電弧室29加熱。 Of course, the heater 25 can also be provided only adjacent to a portion of the container 22. For example, if the temperature of the container 22 is relatively low relative to the two ends and the temperature of other portions of the container 22 is relatively high, the heater 25 may optionally be attached to the container 22 without the thermal insulator 24 approaching the container 22 and/or the outer casing 21. The opposite end. Thus, the heat loss near the two ends of the container 22 can be balanced by the heat generated by the heater 25, and can be reduced. The temperature difference within the container 22 is small. A related option is that the heater 25 is also attached to a portion of the side wall of the container 22 adjacent the opposite ends of the container 22 to further reduce the temperature differential within the container 22. Of course, there are other options for the configuration of the heater 25. For example, in addition to the end of the vessel 22 facing the arc chamber 29, the heater 25 can be located around most of the vessel 22 such that each portion and each surface of the vessel 22 can be heated by the heater 25 and/or the arc chamber 29, respectively. .
此外,任何商售可獲得的加熱器可作為加熱器25。烤箱與上述的加熱線圈僅為二個範例。此外,加熱器25的數目是可選擇的,雖然所需加熱器25的數量可能與當加熱器25不存在或未通電時容器22內溫度不均勻的程度成正比。 In addition, any commercially available heater can be used as the heater 25. The oven and the heating coil described above are only two examples. Moreover, the number of heaters 25 is optional, although the number of heaters 25 required may be proportional to the extent to which the temperature within the vessel 22 is not uniform when the heater 25 is not present or is not energized.
例如,在一些未圖示的實施例中,熱絕緣體24被設置於環繞整個容器22與整個加熱器25。請注意到熱絕緣體25的存在可能會減低散熱且熱絕緣體25的分佈可能會影響散熱如何減少。因此,在這些實施例中,幾乎所有加熱器25所產生的熱能都可用於加熱容器22,且容器22的每個部分可能幾乎都被均等加熱。如此,可增加容器22的溫度而可降低容器22內的溫差。 For example, in some embodiments not shown, the thermal insulator 24 is disposed around the entire container 22 and the entire heater 25. Please note that the presence of thermal insulators 25 may reduce heat dissipation and the distribution of thermal insulators 25 may affect how heat dissipation is reduced. Thus, in these embodiments, almost all of the thermal energy generated by the heater 25 can be used to heat the vessel 22, and each portion of the vessel 22 may be heated almost equally. As such, the temperature of the container 22 can be increased to reduce the temperature differential within the container 22.
當然,在其他一些未圖示的實施例中,熱絕緣體24可設置於僅環繞容器22的一部分、僅環繞加熱器25的一部分或環繞容器22不直接靠近加熱器25的所有部分。舉例來說,當加熱器25是一組鄰近容器22側壁某些部分的加熱線圈,可選擇熱絕緣體24位於鄰近容器22的一端或複數端,以直接減少自容器22一端或複數端散失的熱能,也可選擇熱絕緣體24位於鄰近容器22側壁的其他部分,以直接減少自容器22的其他部分散失的熱能。 Of course, in other embodiments not shown, the thermal insulator 24 can be disposed to surround only a portion of the container 22, only a portion of the surrounding heater 25, or all portions of the surrounding container 22 that are not directly adjacent to the heater 25. For example, when the heater 25 is a set of heating coils adjacent portions of the side wall of the container 22, the optional thermal insulator 24 can be located adjacent one or more ends of the container 22 to directly reduce heat loss from one or more ends of the container 22. Alternatively, the thermal insulator 24 can be located adjacent other portions of the sidewall of the container 22 to directly reduce thermal energy lost from other portions of the container 22.
當然,在其他一些未圖示的實施例中,熱絕緣體24與容器22可位於加熱器25的不同側,甚至可位於加熱器25的相對二側。因此,加熱器25所產生但 並非直接傳輸到容器22的熱能可由熱絕緣體24阻擋,然後可被重新導向至容器22。顯然,不僅加熱器25所產生且傳輸到容器22的熱能部分可增加,同時也可改變加熱器25所產生的熱能如何在容器22內分佈。如此,透過適當調整容器22、熱絕緣體24與加熱器25之間的幾何關係,可減少容器22內的溫差並且可增加容器22的溫度。在此,對於本發明而言,容器22、熱絕緣體24與加熱器24之間可用幾何關係並不限於以上與以下圖示與未圖示的實施例。 Of course, in other embodiments not shown, the thermal insulator 24 and the container 22 may be located on different sides of the heater 25, even on opposite sides of the heater 25. Therefore, the heater 25 is generated but Thermal energy that is not directly transferred to the container 22 can be blocked by the thermal insulator 24 and can then be redirected to the container 22. It will be apparent that not only the portion of the thermal energy generated by the heater 25 but also transferred to the vessel 22 can be increased, but also how the thermal energy generated by the heater 25 can be distributed within the vessel 22. As such, by appropriately adjusting the geometric relationship between the container 22, the thermal insulator 24, and the heater 25, the temperature difference within the container 22 can be reduced and the temperature of the container 22 can be increased. Here, for the present invention, the geometrical relationship between the container 22, the thermal insulator 24 and the heater 24 is not limited to the above and the following illustrated and unillustrated embodiments.
此外,在其他一些未圖示的實施例中,熱絕緣體24可似密集地分佈於電弧室29與容器22之間,無論熱絕緣體24係位於容器22與外殼21之間或熱絕緣體24是鄰近外殼21的外表面。如此,熱絕緣體22本質上可阻止熱能從電弧室29傳送至容器22,而使得由不可避免的電弧室29內電漿擾動所引發的蒸發擾動可被減少,甚至最小化。 Moreover, in other embodiments not shown, the thermal insulator 24 may be densely distributed between the arc chamber 29 and the container 22, whether the thermal insulator 24 is located between the container 22 and the outer casing 21 or the thermal insulator 24 is adjacent. The outer surface of the outer casing 21. As such, the thermal insulator 22 essentially prevents thermal energy from being transferred from the arc chamber 29 to the vessel 22, such that evaporation disturbances caused by plasma disturbances in the unavoidable arc chamber 29 can be reduced or even minimized.
此外,雖然第二C圖至第二E圖所示的情況有通道元件23,上述關於熱絕緣體24與加熱器25的討論是不受通道元件23限制,除了通道元件25不應被阻擋之外。因此,在一些未圖示的實施例中,外殼21與電弧室29係直接接觸,一開孔係位於外殼21與電弧室29之間以使已蒸發材料能擴散。對於住些非圖示的實施例而言,並沒有通道元件而且開孔並不配加熱器25與熱絕緣體24所擋住。換句話說,開孔是否鄰近熱絕緣體24及/或加熱器25是可選擇的。 Further, although the case shown in the second C to the second E has the channel member 23, the above discussion regarding the thermal insulator 24 and the heater 25 is not restricted by the channel member 23 except that the channel member 25 should not be blocked. . Thus, in some embodiments not shown, the outer casing 21 is in direct contact with the arc chamber 29, and an opening is located between the outer casing 21 and the arc chamber 29 to allow the evaporated material to diffuse. For the non-illustrated embodiment, there are no channel elements and the openings are not blocked by the heater 25 and the thermal insulator 24. In other words, whether the aperture is adjacent to the thermal insulator 24 and/or the heater 25 is optional.
因此,與未同時使用熱絕緣體24與加熱器25的傳統離子源相比較,本發明的這些實施例具有至少一些主要的優點:容器22內待蒸發材料在容器22內的蒸發率可更均勻也可增加,這是因為加熱器25可提供熱能進入容器22,而熱絕緣體24可減少自容器22散失的熱能,同時容器22內待蒸發材料的蒸發也可更 精確地控制,這是因為容器22可只由加熱器25加熱,而加熱器25的操作可僅根據蒸發所需的溫度與熱能調整。 Thus, these embodiments of the present invention have at least some major advantages over conventional ion sources that do not use thermal insulator 24 with heater 25 at the same time: the evaporation rate of the material to be evaporated within vessel 22 within vessel 22 can be more uniform. This can be increased because the heater 25 can provide thermal energy into the container 22, while the thermal insulator 24 can reduce the heat energy lost from the container 22, while the evaporation of the material to be evaporated in the container 22 can be more This is precisely controlled because the container 22 can be heated only by the heater 25, and the operation of the heater 25 can be adjusted only according to the temperature and thermal energy required for evaporation.
本發明的一些實施例之離子源如第二F圖與第二G圖所示,一蒸發器20設置鄰近於一相鄰電弧室29使得蒸發器20內待蒸發材料可被蒸發與傳送至電弧室29內以使電弧室29內具有大量所需種類離子之電漿。此外,蒸發器20至少具有一鄰近電弧室29的外殼21,設置於外殼21內並用於置放待蒸發材料的容器22,一將容器22機械連接至電弧室29的通道元件23,以使已蒸發材料可自容器22經通道元件23擴散至電弧室29,以及一設置鄰近於外殼21與通道元件23的組合之外表面的輻射遮罩。在此,第二F圖顯示具有高導熱係數的輻射遮罩為一設置於外殼21一部分上的遮罩26的情況,以將熱能傳遞通過外殼用於設置遮罩的部分,第二G圖顯示具有高導熱係數的輻射遮罩為一設置於通道元件23以及位於外殼21與電弧室29之間的特別部分上的附加遮罩27的情況,以將熱能自外殼21傳遞至通道元件23的一特別部分。 An ion source according to some embodiments of the present invention, as shown in the second F and second G diagrams, an evaporator 20 disposed adjacent to an adjacent arc chamber 29 such that material to be evaporated in the evaporator 20 can be vaporized and transferred to the arc Within the chamber 29 is a plasma having a large amount of ions of the desired type within the arc chamber 29. Furthermore, the evaporator 20 has at least one outer casing 21 adjacent to the arc chamber 29, a container 22 disposed in the outer casing 21 for placing the material to be evaporated, and a mechanical connection of the container 22 to the channel member 23 of the arc chamber 29 so that The evaporative material can diffuse from the container 22 through the channel member 23 to the arc chamber 29, and a radiation shield disposed adjacent the outer surface of the combination of the outer casing 21 and the channel member 23. Here, the second F diagram shows a case where the radiation mask having a high thermal conductivity is a mask 26 disposed on a portion of the outer casing 21 to transfer thermal energy through the outer casing for setting a portion of the mask, the second G diagram showing A radiation mask having a high thermal conductivity is a case of an additional mask 27 disposed on the channel member 23 and on a particular portion between the outer casing 21 and the arc chamber 29 to transfer thermal energy from the outer casing 21 to one of the channel members 23. Special part.
合理地,設置在外殼21的遮罩26可傳遞熱能通過外殼21用於設置遮罩的部分。因此,當遮罩26設置於外殼21的一特別部分,外殼21之特別部分內的溫度分佈可能會更加均勻,這是因為抵達特別部分的任何熱能可被傳輸通過外殼21之特別部分,無論熱能係自容器22、外殼21之內部空間及/或外殼21之其他部分轉移而來。因此,對於外殼21內溫度分佈不均勻而且已蒸發材料有時傾向於凝結在低溫部分的離子源而言,本發明可簡單藉由將遮罩設置於外殼21的至少低溫部分而改進這些離子源。 Reasonably, the mask 26 disposed in the outer casing 21 can transfer heat energy through the outer casing 21 for the portion where the mask is disposed. Thus, when the mask 26 is disposed in a particular portion of the outer casing 21, the temperature distribution within a particular portion of the outer casing 21 may be more uniform because any thermal energy that reaches the particular portion may be transmitted through a particular portion of the outer casing 21, regardless of thermal energy. It is transferred from the inner space of the container 22, the outer casing 21 and/or other parts of the outer casing 21. Therefore, for an ion source in which the temperature distribution in the outer casing 21 is uneven and the evaporated material sometimes tends to condense in the low temperature portion, the present invention can improve these ion sources simply by disposing the mask on at least the low temperature portion of the outer casing 21. .
合理地,設置在通道元件23的額外遮罩27可傳送熱能通過通道元件23設置額外遮罩的部分。因此,當附加遮罩27係位於通道元件23之位於外殼21與電弧室29之間一特別部份,通道元件23的特別部分內的溫度分佈可能更加均勻 ,這是因為任何抵達特別部分的熱能均可藉由通道元件23的特別部分傳送,無論熱能是從外殼21、電弧室29或其它熱源傳送而來。 It is reasonable that the additional mask 27 provided on the channel element 23 can convey the portion of the thermal energy that is provided through the channel element 23 to provide an additional mask. Thus, when the additional mask 27 is located at a particular portion of the channel member 23 between the outer casing 21 and the arc chamber 29, the temperature distribution within the particular portion of the channel member 23 may be more uniform. This is because any thermal energy that reaches a particular portion can be transferred by a particular portion of the channel member 23, whether the thermal energy is transferred from the outer casing 21, the arc chamber 29, or other source of heat.
此外,為了使用具有高導熱係數的輻射遮罩以增加溫度均勻性並防止已蒸發材料凝結的目的,本發明對遮罩26與附加遮罩27的細節保持彈性,也對遮罩26與附加遮罩27之間關係的細節保持彈性。 Furthermore, in order to use a radiation mask having a high thermal conductivity to increase temperature uniformity and prevent condensation of the evaporated material, the present invention maintains elasticity of the details of the mask 26 and the additional mask 27, as well as the mask 26 and additional masking. The details of the relationship between the covers 27 remain resilient.
舉例來說,遮罩26的構型是可變化的。當第二F圖顯示遮罩26長度約為外殼21長度的三分之二的情況時,其他未顯示的實施例之遮罩26可能有不同的構型。例如,於加熱器25位於外殼21中心部分的情況,可選擇遮罩26僅位於外殼21相對二端附近,而遮罩26長度不大於外殼21長度的五分之一。舉例來說,當通道元件23僅機械連接到外殼21一端,或僅連接到容器22一端,可選擇遮罩26僅設置在部分外殼21,或鄰近容器22一端,以維持通道元件23與外殼21一端或容器22一端之間界面的溫度,而降低其間已蒸發材料凝結的風險。 For example, the configuration of the mask 26 is variable. When the second F-picture shows that the length of the mask 26 is about two-thirds of the length of the outer casing 21, the masks 26 of other embodiments not shown may have different configurations. For example, in the case where the heater 25 is located at the central portion of the outer casing 21, the optional mask 26 is located only near the opposite ends of the outer casing 21, and the length of the mask 26 is not more than one fifth of the length of the outer casing 21. For example, when the channel member 23 is only mechanically coupled to one end of the housing 21, or only to one end of the container 22, the optional mask 26 can be disposed only in the portion of the housing 21, or adjacent one end of the container 22, to maintain the channel member 23 and the housing 21 The temperature at the interface between one end or one end of the vessel 22 reduces the risk of condensation of evaporated material therebetween.
此外,遮罩26的形狀、數量與材料保持彈性。舉例來說,當外殼21為一圓柱結構,遮罩26可為設置在與通道元件23直接接觸的外殼21一端的二半弧形夾件。例如,當外殼21面向電弧室29之一端為圓柱狀時,遮罩26可為一位於外殼21之外且鄰近此端的圓形夾件。舉例來說,當遮罩26的功能是抽取熱量通過外殼21的設置部分時,遮罩26可由金屬或任何具有高導熱係數的材料構 成。因此,熱能可有效地自外殼21的其他部分轉移至整個外殼21的設置部分,同時直接從加熱器26傳送到外殼21設置部分任何一處的熱量也可有效轉移到整個外殼21的設置部分。 In addition, the shape, number, and material of the mask 26 remain elastic. For example, when the outer casing 21 is of a cylindrical configuration, the mask 26 can be a two-half curved clip disposed at one end of the outer casing 21 in direct contact with the channel member 23. For example, when the outer casing 21 is cylindrical toward one end of the arc chamber 29, the mask 26 may be a circular clip located outside the outer casing 21 and adjacent to the end. For example, when the function of the mask 26 is to extract heat through the disposed portion of the outer casing 21, the mask 26 may be constructed of metal or any material having a high thermal conductivity. to make. Therefore, heat energy can be efficiently transferred from the other portion of the outer casing 21 to the disposed portion of the entire outer casing 21, and heat transferred directly from the heater 26 to any portion of the outer portion of the outer casing 21 can be efficiently transferred to the disposed portion of the entire outer casing 21.
此外,遮罩26在外殼21之位置,通常係位於當沒有輻射遮罩時外殼21上溫度低於其他部分的部分。因此,在一些未圖示的實施例中可具有一或更多位於外殼21之外與鄰近遮罩26的額外加熱器,使外殼21的設置部分可進一步加熱。因此,藉由適當地調整額外加熱器的操作與分佈,可適當地減少外殼21不同部份之間的溫差。 In addition, the mask 26 is located at the location of the outer casing 21, typically in the portion of the outer casing 21 where the temperature is lower than the other portions when there is no radiation mask. Thus, in some embodiments not shown, there may be one or more additional heaters located outside of the outer casing 21 and adjacent the shroud 26 such that the disposed portion of the outer casing 21 may be further heated. Therefore, the temperature difference between different portions of the outer casing 21 can be appropriately reduced by appropriately adjusting the operation and distribution of the additional heater.
舉例來說,附加遮罩27的構形是可變化的。當第二G圖所示的情況是遮罩26的長度等於通道元件23在外殼21與電弧室29之間特殊部分的長度時,其他未顯示的實施例中可能有不同的附加遮罩27配置。例如,對於通道元件23的特殊部分由電弧室29與外殼21間接加熱的情況,可選擇附加遮罩27設置於只鄰近通道元件23特殊部分的中心部分。如此,即使通道元件23特別部分的長度夠大,使整個通道元件23的特殊部分無法由電弧室29與外殼21均勻地加熱,附加遮罩27仍可自通道元件23的特殊部分的二端汲取熱能到通道元件23特殊部分的中心部分。因此,已蒸發材料在通道元件23內部凝結的風險可被減少,這是因為通道元件23的中心部分的溫度可能因附加遮罩27的存在而不會明顯低於電弧室29的溫度及/或外殼21的溫度。 For example, the configuration of the additional mask 27 is variable. When the second G diagram shows the case where the length of the mask 26 is equal to the length of the particular portion of the channel member 23 between the outer casing 21 and the arc chamber 29, there may be different additional mask 27 configurations in other embodiments not shown. . For example, where a particular portion of the channel member 23 is indirectly heated by the arc chamber 29 and the outer casing 21, an optional additional mask 27 can be selected to be disposed adjacent only the central portion of the particular portion of the channel member 23. Thus, even if the length of the particular portion of the channel member 23 is sufficiently large that a particular portion of the entire channel member 23 cannot be uniformly heated by the arc chamber 29 and the outer casing 21, the additional mask 27 can still be drawn from the two ends of the particular portion of the channel member 23. The heat is applied to the central portion of the particular portion of the channel member 23. Therefore, the risk of condensation of the evaporated material inside the channel member 23 can be reduced because the temperature of the central portion of the channel member 23 may not be significantly lower than the temperature of the arc chamber 29 due to the presence of the additional mask 27 and/or The temperature of the outer casing 21.
此外,附加遮罩27的形狀、數量與材料均可以彈性變化。例如,當通道元件23為一中空的圓柱狀結構,附加遮罩27可為設置在位於電弧室29與外殼21之間的通道元件23特殊部分的一圓形夾件或二半圓弧形夾件。例如,當通 道元件23為一中空的立方體結構,附加遮罩27可為設置在位於電弧室29與外殼21之間的通道元件23特殊部分的四個矩形夾件。例如,當附加遮罩27的功能是導引熱量通過通道元件23的設置部分以維持設置部分的溫暖時,附加遮罩27可由金屬或任何具有高導熱係數的材料構成。因此,熱能可有效地自外殼21及/或電弧室29轉移至整個通道元件23的設置部分,甚至直接從容器22導引至通道元件23其他部分的熱能可轉移至整個外殼21的設置部分。 In addition, the shape, number, and material of the additional mask 27 can be elastically varied. For example, when the channel member 23 is a hollow cylindrical structure, the additional mask 27 may be a circular clip or a semi-circular clip disposed in a special portion of the channel member 23 between the arc chamber 29 and the outer casing 21. . For example, when The track element 23 is a hollow cube structure and the additional mask 27 can be four rectangular clips disposed at a particular portion of the channel element 23 between the arc chamber 29 and the outer casing 21. For example, when the function of the additional mask 27 is to guide heat through the disposed portion of the channel member 23 to maintain the warmth of the set portion, the additional mask 27 may be composed of metal or any material having a high thermal conductivity. Therefore, thermal energy can be efficiently transferred from the outer casing 21 and/or the arc chamber 29 to the disposed portion of the entire passage member 23, and even the thermal energy directly guided from the container 22 to other portions of the passage member 23 can be transferred to the disposed portion of the entire outer casing 21.
此外,由於附加遮罩27通常位於在若未安裝輻射遮罩時溫度低於外殼21與電弧室29溫度的部分通道元件23,一些未顯示的實施例可具有一或更多位於部分通道元件23之外與鄰近附加遮罩27的額外加熱器。因此,通道元件23的設置部分可被進一步地加熱,因此部分通道元件23的溫差可以藉由適當調整額外加熱器的操作與分佈而減少。 Moreover, since the additional mask 27 is typically located in a portion of the channel member 23 having a lower temperature than the temperature of the outer casing 21 and the arc chamber 29 if the radiation mask is not installed, some embodiments not shown may have one or more portions of the channel member 23 An additional heater is provided adjacent to the adjacent mask 27. Therefore, the disposed portion of the channel member 23 can be further heated, so that the temperature difference of the portion of the channel member 23 can be reduced by appropriately adjusting the operation and distribution of the additional heater.
當然,遮罩26與附加遮罩27可一併使用。例如,在一些未顯示的實施例中,附加遮罩27以良好接觸方式置入遮罩26內,使熱能可有效從遮罩26轉移到附加遮罩27。這些例子對於未使用輻射遮罩時已蒸發材料通常凝結在外殼21與通道元件23之間界面的情況是特別有用。因此,當通道元件23位於外殼21與電弧室29之間的第一部分可由電弧室29加熱,但通道元件23由外殼21覆蓋及/或鄰近外殼21的第二部分可能無法適當地由電弧室29及/或容器22加熱時,遮罩26與附加遮罩27的組合可以有效地將熱能傳送至通道元件23的第二部分,這是因為附加遮罩27是設置於或鄰近於通道元件23的第二部分。 Of course, the mask 26 and the additional mask 27 can be used together. For example, in some embodiments not shown, the additional mask 27 is placed into the mask 26 in good contact so that thermal energy can be effectively transferred from the mask 26 to the additional mask 27. These examples are particularly useful where the vaporized material typically condenses at the interface between the outer casing 21 and the channel member 23 when no radiation mask is used. Thus, when the first portion of the channel member 23 between the outer casing 21 and the arc chamber 29 can be heated by the arc chamber 29, the channel member 23 is covered by the outer casing 21 and/or adjacent the second portion of the outer casing 21 may not be properly used by the arc chamber 29. And/or when the container 22 is heated, the combination of the mask 26 and the additional mask 27 can effectively transfer thermal energy to the second portion of the channel member 23 because the additional mask 27 is disposed adjacent to or adjacent to the channel member 23. the second part.
此外,當具有高導熱係數的輻射遮罩可藉由增加通道元件23溫度及/或減少通道元件23的溫差增加通道元件23熱傳導性,一提高通道元件23熱傳導 性的等效途徑是增加通道元件23的內直徑以降低通道元件23內所需的溫度。其背後的物理是通道元件23增加的熱傳導性相應地降低自容器22產生相同的流速所需的溫度。例如,對於通道元件23內直徑為L1的特殊情況而言,電弧室溫度與容器溫度可為650℃,而通道元件23的溫度可能為600℃,這是因為通道元件23係位於二者之間。接著,當只有通道元件23的內直徑增加時,即使容器22的溫度降到500℃,通道元件23仍可達到相同的熱傳導性。如此,電弧室29溫度仍可維持在650℃,然後通道元件的溫度可降至650℃與500℃之間,例如550。℃。其結果是溫度自容器22逐漸增加至電弧室29,而相應的結果是已蒸發材料並不會在其擴散路徑中發生凝結。 In addition, when a radiation mask having a high thermal conductivity can increase the thermal conductivity of the channel member 23 by increasing the temperature of the channel member 23 and/or reducing the temperature difference of the channel member 23, the heat conduction of the channel member 23 is improved. An equivalent path is to increase the inner diameter of the channel member 23 to reduce the temperature required within the channel member 23. The physics behind it is that the increased thermal conductivity of the channel element 23 correspondingly reduces the temperature required to produce the same flow rate from the container 22. For example, for the special case where the diameter of the channel member 23 is L1, the arc chamber temperature and the container temperature may be 650 ° C, and the temperature of the channel member 23 may be 600 ° C because the channel member 23 is located between the two. . Then, when only the inner diameter of the channel member 23 is increased, even if the temperature of the container 22 is lowered to 500 ° C, the channel member 23 can achieve the same thermal conductivity. As such, the arc chamber 29 temperature can still be maintained at 650 ° C, and then the temperature of the channel element can be lowered between 650 ° C and 500 ° C, such as 550. °C. As a result, the temperature gradually increases from the vessel 22 to the arc chamber 29, and the corresponding result is that the evaporated material does not condense in its diffusion path.
舉例來說,一增加通道元件23內直徑以降低通道元件23所需的溫度的可選擇標準是一通道元件23特別部分的內直徑與容器22截面積直徑二者的比值係與容器22中待蒸發材料的蒸發溫度成正比,其中通道元件23的特別部分是位於外殼21與電弧室29之間。 For example, a selectable criterion for increasing the inner diameter of the channel member 23 to reduce the temperature required for the channel member 23 is that the ratio of the inner diameter of the particular portion of the channel member 23 to the cross-sectional diameter of the container 22 is the same as the container 22 The evaporation temperature of the evaporating material is proportional, with a particular portion of the channel element 23 being located between the outer casing 21 and the arc chamber 29.
因此,與未於凝結經常發生的區域使用具有高導熱係數輻射遮罩的傳統離子源比較,本發明的這些實施例具有至少一些主要的優點:外殼21內的溫差以及通道元件23位於外殼21與電弧室29之間特殊部分的溫差均可降低,進而減少已蒸發材料發生凝結的風險。此外,當輻射遮罩可傳送熱能並維持設相對應置部分的溫度,外殼21的所需溫度可以降低(或視為容器22所需溫度可以較低),這是因為不需要透過增加帚個外殼21及/或整個容器22的溫度,以防止已蒸發材料在溫度低於外殼21及/或容器22溫度的位置發生凝結。 Thus, these embodiments of the present invention have at least some major advantages over conventional ion sources having a high thermal conductivity radiation mask in areas where condensation does not occur, the temperature difference within the outer casing 21 and the channel element 23 being located in the outer casing 21 The temperature difference between the special portions of the arc chamber 29 can be reduced, thereby reducing the risk of condensation of the evaporated material. In addition, when the radiation mask can transfer thermal energy and maintain the temperature of the corresponding portion, the required temperature of the outer casing 21 can be lowered (or the temperature required for the container 22 can be lower) because there is no need to increase The temperature of the outer casing 21 and/or the entire container 22 is such as to prevent condensation of the evaporated material at a location below the temperature of the outer casing 21 and/or the container 22.
作為一簡短的摘要,上述實施例分別使用三個不同的方法來減少容器22內的溫差及/或減少自容器22至電弧室29傳輸路徑內的溫差。在此,這三種方法包含熱絕緣體24的使用、熱絕緣體24與加熱器25的同時使用以及包含遮罩26及/或附加遮罩27之輻射遮罩的使用。因此容器22內的蒸發可更加有效,且可減少已蒸發材料在傳輸路徑上的凝結。特別是,每種方法的硬體與操作都是獨立於另它方法的硬體與操作。因此,本發明的其它實施例可以使用任意一種、任意二種甚至是所有三種方法,雖然並未特別說明二個或多個方法如何一起使用。 As a brief summary, the above embodiments use three different methods to reduce the temperature differential within the vessel 22 and/or to reduce the temperature differential from the vessel 22 to the arc chamber 29 transport path. Here, the three methods include the use of thermal insulator 24, the simultaneous use of thermal insulator 24 with heater 25, and the use of a radiation mask comprising mask 26 and/or additional mask 27. Thus evaporation within the vessel 22 can be more efficient and can reduce condensation of the vaporized material on the transport path. In particular, the hardware and operation of each method are independent of the hardware and operation of the other method. Thus, other embodiments of the invention may use any, any two, or even all three methods, although not specifically illustrated how two or more methods may be used together.
本發明還提供有效傳輸已蒸發材料到電弧室29的離子源,其中蒸發器具有一擴散器以直接將已蒸發材料從容器22傳送至電弧室29。此處,擴散器是設計成有效地收集容器22內的已蒸發材料,並減少已蒸發材料擴散被阻擋的風險。顯然,此處所描述的擴散器可為上述的通道元件23,當通道元件23為允許已蒸發材料擴散的中空結構。 The present invention also provides an ion source that efficiently transports evaporated material to the arc chamber 29, wherein the evaporator has a diffuser to directly transfer the vaporized material from the vessel 22 to the arc chamber 29. Here, the diffuser is designed to effectively collect the evaporated material within the container 22 and reduce the risk of diffusion of the evaporated material being blocked. It will be apparent that the diffuser described herein can be the channel element 23 described above, when the channel element 23 is a hollow structure that allows the evaporated material to diffuse.
本發明一些實施例之離子源如第二H圖、第二I圖與第二J圖所示,一蒸發器20設置鄰近於一相鄰電弧室29使得蒸發器20內待蒸發材料可被蒸發接著可被傳送至電弧室29內以使電弧室29內具有大量所需種類離子之電漿。此外,蒸發器20至少具有一鄰近電弧室29的外殼21,設置於外殼21內並用於置放待蒸發材料的容器22,一將容器22機械連接至電弧室29的擴散器235,以使已蒸發材料可擴散通過。此處,第二H圖顯示擴散器235為一在容器22內有一些開孔28的中空的結構的情況。第二I圖顯示擴散器235為一在容器22與外殼21間有一些開孔28的中空的結構的情況。第二J圖顯示擴散器235為一在容器22內有一些開孔28與一T形端的中空結構的情況。 The ion source of some embodiments of the present invention, as shown in the second H, second, and second J, is disposed adjacent to an adjacent arc chamber 29 such that the material to be evaporated in the evaporator 20 can be evaporated. It can then be transferred into the arc chamber 29 to provide a large amount of plasma of the desired species of ions within the arc chamber 29. Further, the evaporator 20 has at least one outer casing 21 adjacent to the arc chamber 29, a container 22 disposed in the outer casing 21 for placing the material to be evaporated, and a diffuser 235 for mechanically connecting the container 22 to the arc chamber 29 so that The evaporated material can diffuse through. Here, the second H diagram shows that the diffuser 235 is a hollow structure having a plurality of openings 28 in the container 22. The second I diagram shows the diffuser 235 as a hollow structure with a plurality of openings 28 between the container 22 and the outer casing 21. The second J diagram shows that the diffuser 235 is a hollow structure having a plurality of openings 28 and a T-shaped end in the container 22.
合理地,擴散器235外殼上的開孔28允許已蒸發材料的擴散。因此,當開孔28位於一空間中,例如容器22的內部空間或外殼21與容器22之間的空間,已蒸發材料可擴散通過開孔28進入擴散器235並擴散通過擴散器235進入電弧室29。很明顯地,至少開孔28的數量、截面積與分佈會影響已蒸發材料如何擴散通過開孔28,例如,已蒸發材料傳送進入電弧室29的速率。 Reasonably, the opening 28 in the outer casing of the diffuser 235 allows diffusion of the evaporated material. Thus, when the opening 28 is in a space, such as the interior of the container 22 or the space between the outer casing 21 and the container 22, the evaporated material can diffuse through the opening 28 into the diffuser 235 and diffuse through the diffuser 235 into the arc chamber. 29. It will be apparent that at least the number, cross-sectional area and distribution of the apertures 28 will affect how the evaporated material diffuses through the apertures 28, for example, the rate at which the evaporated material is transferred into the arc chamber 29.
合理地,當待蒸發材料為固態,例如粉末形式,擴散器235的T形端可減少開孔28被待蒸發材料至少部分阻擋然然後減少已蒸發材料的擴散或甚至完全阻擋的風險。當容器22水平放置時,如果待蒸發材料的數量頗大,使得容器22內儲存的待蒸發材料高度高於開孔的高度,待蒸發材料可能會崩滑而阻擋開孔。在這種情況下,如果T形末端的高度高於存儲之待蒸發材料的高度,擴散器235的T形末端可能會阻止這些待蒸發材料的崩滑。一般情況下,蒸發器20的結構受限於電弧室29的結構與管線的配置及/或連接到電弧室29設備,並且待蒸發材料通常是以商售方式提供的粉末狀材料。因此,蒸發器20有時可能無法水平地放置,而使得存儲之待蒸發材料覆蓋開孔28的風險無法被忽略。 Reasonably, when the material to be evaporated is in a solid state, such as a powder form, the T-shaped end of the diffuser 235 may reduce the risk that the opening 28 is at least partially blocked by the material to be evaporated and then reduces the spread or even complete blocking of the evaporated material. When the container 22 is placed horizontally, if the amount of material to be evaporated is relatively large, so that the height of the material to be evaporated stored in the container 22 is higher than the height of the opening, the material to be evaporated may collapse and block the opening. In this case, if the height of the T-shaped end is higher than the height of the material to be evaporated stored, the T-shaped end of the diffuser 235 may prevent the collapse of the material to be evaporated. In general, the structure of the evaporator 20 is limited by the configuration of the arc chamber 29 and the configuration of the pipeline and/or to the arc chamber 29 equipment, and the material to be evaporated is typically a powdered material that is commercially available. Therefore, the evaporator 20 may sometimes not be placed horizontally, so that the risk of storing the material to be evaporated covering the opening 28 cannot be ignored.
此外,為了使用擴散器235之開孔28與T形端以使已蒸發材料擴散進入電弧室29並避免阻擋擴散,本發明對開孔28、擴散器235之T形端的細節甚至是擴散器235的幾何結構保持彈性。 Furthermore, in order to use the opening 28 and the T-shaped end of the diffuser 235 to diffuse the evaporated material into the arc chamber 29 and to avoid blocking diffusion, the details of the T-shaped end of the opening 28, the diffuser 235 of the present invention are even the diffuser 235 The geometry remains elastic.
舉例來說,容器22內擴散器235之T形端可有一中空的管狀結構與一板結構。在此,中空管狀結構直接機械連接板結構,且板結構橫越中空管狀結構的軸方向。因此,參考第二J圖所示,很明顯板結構的尺寸可決定容器22內待蒸 發材料可以儲存之不會發生滑移的最高高度。例如,當中空管狀結構位於容器22截面積中心時,最高高度即是板結構半徑與容器22截面積半徑的加總。 For example, the T-shaped end of the diffuser 235 in the container 22 can have a hollow tubular structure and a plate structure. Here, the hollow tubular structure directly mechanically connects the plate structure, and the plate structure traverses the axial direction of the hollow tubular structure. Therefore, referring to the second J diagram, it is obvious that the size of the plate structure can determine the inside of the container 22 to be steamed. The hair material can be stored at the highest height where slippage does not occur. For example, when the hollow tubular structure is centered on the cross-sectional area of the container 22, the highest height is the sum of the radius of the plate structure and the radius of the cross-sectional area of the container 22.
此外,當板結構用於阻擋粉末形式的材料,可選擇板結構上無開孔28以使粉末可被整個板結構阻擋。此外,因為不同材料的粉末形式可能有不同的直徑,可選擇板結構上設置一或多個開孔28,如果開孔28直徑小於存放在容器22內粉末形式材料的直徑。 Moreover, when the panel structure is used to block materials in powder form, the optional panel structure has no openings 28 to allow the powder to be blocked by the entire panel structure. In addition, because the powder forms of the different materials may have different diameters, the optional plate structure may be provided with one or more openings 28 if the diameter of the openings 28 is less than the diameter of the powder form material stored in the container 22.
舉例來說,開孔28可位於板結構(具有開孔28的板結構可視為一網格(grid)),也可位於中空管狀結構的側壁上。此外,容器22內開孔28的存在,使得容器22內產生成的已蒸發材料可直接流過開孔28進入擴散器235然後再擴散進入電弧室29。此外,若已蒸發材料自容器22傳送進入外殼21與容器22之間空間的數量是不可忽略的,可選擇擴散器235在外殼21與容器22之間空間也具有開孔28,如第二I圖所示。 For example, the apertures 28 can be located in a plate structure (the plate structure having the apertures 28 can be viewed as a grid) or on the sidewalls of the hollow tubular structure. In addition, the presence of apertures 28 in the container 22 allows the vaporized material produced within the container 22 to flow directly through the apertures 28 into the diffuser 235 and then into the arc chamber 29. Moreover, if the amount of evaporating material transported from the container 22 into the space between the outer casing 21 and the container 22 is not negligible, the optional diffuser 235 also has an opening 28 in the space between the outer casing 21 and the container 22, such as the second I. The figure shows.
很明顯地,當開孔28是開孔28的內部空間與容器22內空間之間的界面,或甚至是外殼21與容器22之間的界面,開孔28的尺寸與數量甚至形狀都在某種程度上是本發明的重要變數。 Obviously, when the opening 28 is the interface between the internal space of the opening 28 and the space inside the container 22, or even the interface between the housing 21 and the container 22, the size, number and even shape of the opening 28 are some To a certain extent, it is an important variable of the present invention.
舉例來說,可選擇每個開孔28的直徑與待蒸發材料的蒸發溫度成正比。因此,高蒸發溫度意謂著已蒸發材料較少,較大面積的開孔28可收集更多蒸發材料。此外,為了避免開孔28被材料阻擋的風險,可選擇至少一開孔的直徑與存儲在容器22內粉末狀材料的直徑成正比。因此,即使擴散器235端不是T形或甚至擴散器235的T形端不夠大到以阻止所有存儲材料的滑移,仍可降低此種風險。 For example, the diameter of each opening 28 can be selected to be proportional to the evaporation temperature of the material to be evaporated. Thus, a high evaporation temperature means that there is less evaporated material and a larger area of opening 28 can collect more evaporating material. Moreover, to avoid the risk of the opening 28 being blocked by material, the diameter of the at least one opening can be selected to be proportional to the diameter of the powdered material stored in the container 22. Thus, even if the end of the diffuser 235 is not T-shaped or even the T-shaped end of the diffuser 235 is not large enough to prevent slippage of all of the stored material, this risk can be reduced.
舉例來說,可選擇開孔28數量與待蒸發材料的蒸發溫度成正比,也可選擇開孔28直徑與待蒸發材料的蒸發溫度成正比。請注意開孔28的數量與直徑的可決定已蒸發材料流路的傳導性。因此,對於蒸發溫度較高的材料而言,例如不易蒸發的材料,使用較大數量及/或大直徑開孔28較佳,以使得任何已蒸發材料都可很容易傳輸通過擴散器235至電弧室29。相反的是,蒸發溫度較低的材料或換言之容易蒸發的材料,使用較少數量及/或較小直徑開孔28較佳以限制已蒸發材料的流動,藉以避免過大壓力。 For example, the number of openings 28 can be selected to be proportional to the evaporation temperature of the material to be evaporated, or the diameter of the opening 28 can be selected to be proportional to the evaporation temperature of the material to be evaporated. Please note that the number and diameter of the openings 28 determine the conductivity of the evaporated material flow path. Thus, for materials having a higher evaporation temperature, such as materials that are less susceptible to evaporation, it is preferred to use larger numbers and/or large diameter openings 28 so that any evaporated material can be easily transported through the diffuser 235 to the arc. Room 29. Conversely, a material that evaporates at a lower temperature or, in other words, a material that evaporates easily, preferably uses a smaller number and/or smaller diameter opening 28 to limit the flow of evaporated material to avoid excessive pressure.
舉例來說,當待蒸發材料為氯化鋁(AlCl3),擴散器235側壁上可具有三個開孔28,每個開孔28直徑是0.5毫米。舉例來說,當待蒸發材料為鐿(Yb),擴散器235側壁上可具有十八個開孔28,每個開孔28直徑為1.6毫米。舉例來說,對於其他種類的元素而言,擴散器235可具有八個開孔28,每個開孔28直徑為2毫米。在此,第二K圖與第二L圖分別顯示二可選擇的具有不同數量與不同直徑開孔28的擴散器235。擴散器235的一板結構位於容器22內以阻止存儲材料崩滑,且相對的板結構可附加到電弧室29側壁或連接到電弧室29的噴嘴邊界。 For example, when the material to be evaporated is aluminum chloride (AlCl3), the diffuser 235 may have three openings 28 in its side walls, each opening 28 having a diameter of 0.5 mm. For example, when the material to be evaporated is ytterbium (Yb), the diffuser 235 may have eighteen openings 28 in its side walls, each opening 28 having a diameter of 1.6 mm. For example, for other types of elements, the diffuser 235 can have eight apertures 28, each aperture 28 having a diameter of 2 millimeters. Here, the second K map and the second L map respectively show two selectable diffusers 235 having different numbers and different diameter openings 28. A plate structure of the diffuser 235 is located within the container 22 to prevent the storage material from collapsing, and the opposing plate structure can be attached to the sidewall of the arc chamber 29 or to the nozzle boundary of the arc chamber 29.
此外,擴散器235可直接連接到電弧室29,亦可機械地連接到一直接與電弧室29連接的噴嘴。事實上,主要關鍵是允許已蒸發材料傳輸的開孔28與阻擋容器22內存儲之待蒸發材料崩滑的擴散器235的T形端,擴散器235的其他細節是可選擇的,包含擴散器235的截面積、擴散器235的長度、擴散器235的材料、擴散器235的噴嘴或其他的元件是否將擴散器235連接到電弧室29等。 Additionally, the diffuser 235 can be directly coupled to the arc chamber 29 or mechanically coupled to a nozzle that is directly coupled to the arc chamber 29. In fact, the primary key is to allow the opening 28 of the vaporized material to be transported and the T-shaped end of the diffuser 235 that blocks the material to be evaporated stored in the barrier container 22, and other details of the diffuser 235 are optional, including the diffuser The cross-sectional area of 235, the length of the diffuser 235, the material of the diffuser 235, the nozzle of the diffuser 235, or other components connect the diffuser 235 to the arc chamber 29 or the like.
此外,因為具有不同開孔28的不同擴散器235適用於不同的待蒸發材料,無論不同的元素種類或不同的粉末形式,本發明可選擇擴散器235為蒸發器 20中可更換的元件。同樣地,當擴散器235可連接到直接連接電弧室29的噴嘴,可選擇噴嘴也是可更換的元件。尤其是當已蒸發材料可能在擴散器235及/或噴嘴上凝結,可選擇擴散器235與噴嘴為可分別更換的元件。 Furthermore, since different diffusers 235 having different openings 28 are suitable for different materials to be evaporated, regardless of different element types or different powder forms, the present invention may select diffuser 235 as an evaporator. 20 replaceable components. Likewise, when the diffuser 235 can be connected to a nozzle that directly connects the arc chamber 29, the optional nozzle is also a replaceable element. In particular, when the evaporated material may condense on the diffuser 235 and/or the nozzle, the diffuser 235 and the nozzle may be selected as separately replaceable components.
因此,與使用傳統通道元件23使已蒸發材料於容器22與電弧室29之間擴散的傳統離子源相比,本發明的此種實施例具有至少一些主要的優點:已蒸發材料可以有效地傳輸到擴散器235,然後擴散通過擴散器進入電弧室29,擴散器235之T形端可降低待蒸發材料擋住擴散器235的風險。 Thus, such an embodiment of the present invention has at least some major advantages over conventional ion sources that use conventional channel elements 23 to diffuse evaporated material between vessel 22 and arc chamber 29: the vaporized material can be efficiently transported To the diffuser 235, which then diffuses through the diffuser into the arc chamber 29, the T-shaped end of the diffuser 235 reduces the risk of the material to be vaporized blocking the diffuser 235.
此外,上述任何具有擴散器235的實施例可與任何具有至少一個熱絕緣體24、加熱器25、遮罩26與附加遮罩27的實施例結合。 Moreover, any of the embodiments described above with diffuser 235 can be combined with any embodiment having at least one thermal insulator 24, heater 25, mask 26 and additional shroud 27.
舉例來說,上述擴散器235與輻射遮罩使用的組合可防止已蒸發材料凝結。重要的是,具有高導熱係數的輻射遮罩設置於擴散器及/或噴嘴可能會增加設置部分的溫度,使此處保持溫暖足以避免已蒸發材料凝結。相反的是,對於沒有此種輻射遮罩的傳統離子源而言,待蒸發材料於容器內蒸發但氣態之已蒸發材料有時當其到達溫度略低於容器及/或電弧室29溫度的擴散器及/或噴嘴時會發生凝結。此外,使用前述擴散器235與熱絕緣體24的組合也可防止已蒸發材料凝結。請注意熱絕緣體24的圍繞擴散器及/或噴嘴可維持溫度均勻,使已蒸發材料可均勻地傳送通過。 For example, the combination of the diffuser 235 described above and the use of a radiation mask prevents condensation of the evaporated material. Importantly, the placement of a radiation mask with a high thermal conductivity in the diffuser and/or nozzle may increase the temperature of the set portion, keeping it warm enough to avoid condensation of the evaporated material. Conversely, for a conventional ion source without such a radiation mask, the material to be evaporated evaporates in the container but the gaseous evaporated material sometimes spreads slightly below the temperature of the container and/or arc chamber 29 when it reaches a temperature. Condensation occurs when the device and/or nozzle are used. Furthermore, the combination of the aforementioned diffuser 235 and the thermal insulator 24 also prevents condensation of the evaporated material. Please note that the heat insulator 24 surrounds the diffuser and/or the nozzle to maintain a uniform temperature so that the evaporated material can pass uniformly.
舉例來說,設置輻射遮罩鄰近於額外加熱器的概念可適用於應用一或更多額外加熱器圍繞擴散器及/或噴嘴,即使擴散器及/或噴嘴可能無法由電弧室29及/或外殼21適當地加熱時,仍可充分地加熱擴散器及/或噴嘴。因此,當擴散 器及/或噴嘴可由額外加熱器加熱,就無需使電弧室29極度運轉以加熱擴散器及/或噴嘴,可為操作提供更多的自由度。 For example, the concept of providing a radiation mask adjacent to an additional heater may be suitable for applying one or more additional heaters around the diffuser and/or nozzle, even though the diffuser and/or nozzle may not be accessible from the arc chamber 29 and/or When the outer casing 21 is properly heated, the diffuser and/or the nozzle can still be sufficiently heated. Therefore, when spreading The heaters and/or nozzles can be heated by an additional heater, which eliminates the need to operate the arc chamber 29 to heat the diffuser and/or the nozzle, providing more freedom of operation.
雖然本發明已透過較佳的實施例進行說明,可被理解的是其他不超出本發明如申請專利範圍所主張之精神與範圍所做的修改與變化均可達成,而被本發明所涵蓋。 While the invention has been described in terms of the preferred embodiments, it is understood that modifications and variations can be made without departing from the spirit and scope of the invention as claimed.
20‧‧‧蒸發器 20‧‧‧Evaporator
21‧‧‧外殼 21‧‧‧ Shell
22‧‧‧容器 22‧‧‧ Container
23‧‧‧通道元件 23‧‧‧Channel components
24‧‧‧熱絕緣體 24‧‧‧ Thermal Insulators
25‧‧‧加熱器 25‧‧‧heater
29‧‧‧電弧室 29‧‧‧Arc chamber
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| TW104104302A TWI590285B (en) | 2015-02-09 | 2015-02-09 | An ion source with vaporizer |
| CN201510961990.XA CN105862006B (en) | 2015-02-09 | 2015-12-21 | ion source with evaporator |
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