TWI590033B - Heat dissipation module and electronic device - Google Patents

Description

Thermal module and electronic equipment

The invention relates to a temperature control device and an electronic system, and in particular to a heat dissipation module and an electronic device.

With the advancement of technology, portable electronic products such as smart phones and tablets have been widely used in human life. For these portable electronic products, high performance has always been one of the main improvement directions. However, while improving performance, processing chips such as the Central Processing Unit (CPU) tend to generate more during operation. More heat, so a good heat sink is needed to help dissipate heat.

In order to provide a good heat dissipation technology, a two-phase thermosyphon cooling system has been developed in the prior art, which is an evaporator including an evaporator, a condenser, and a copper tube connecting the two. Vacuum system. The heat dissipation system described above generates heat dissipation by the heat absorbed by the fluid as the phase changes. That is, the heat is absorbed by the evaporation of the fluid in the evaporator, and then the heat is released by the condensation of the fluid in the condenser. However, the above liquid phase and gas phase fluids are in circulation. It is necessary to assist by gravity. When the copper tube, the evaporator and the condenser are placed on the same plane, the heat dissipation efficiency is often reduced due to the fluid not being able to circulate smoothly.

The invention provides a heat dissipation module adapted to provide good heat dissipation efficiency.

The present invention provides an electronic device that is adapted to maintain good heat dissipation efficiency and operational effectiveness after flipping to various directions.

The heat dissipation module of the present invention comprises a heat conducting strip, an annular heat dissipating component and a heat dissipating fluid. The heat conducting strip comprises two heat dissipating ends and a heat absorbing section, wherein the heat absorbing section is located between the two heat dissipating ends, and the heat absorbing section is in contact with a heat source. The annular heat dissipating component comprises two unidirectional evaporation chambers and two heat dissipation pipelines, and the heat dissipation ends are respectively connected to the two unidirectional evaporation chambers. The one-way evaporation chamber includes an output port, an input port and a backstop unit, and the backstop unit is disposed between the input port and the output port. The heat dissipation line connects one of the outlets of the one-way evaporation chamber to the input of the other one of the one-way evaporation chambers. The two unidirectional evaporation chambers have a drop in one direction, and the distance between the two output ports in the above direction is greater than the distance between the two input ports. The heat dissipation fluid is disposed in the annular heat dissipating component and is configured to flow between the two unidirectional evaporation chambers and the two heat dissipation pipelines.

The electronic device of the present invention includes a processing unit, a housing, and the heat dissipation module. The heat absorption section is in contact with the processing unit, and the heat dissipation pipeline includes a heat dissipation section, and the heat dissipation section contacts the housing.

In an embodiment of the invention, the backstop unit divides the unidirectional evaporation chamber into an output cavity and an input cavity, and the output port is formed in the output cavity, and the input port shape Formed in the input cavity, wherein the output cavity, the backstop unit, and the input cavity are arranged along the direction.

In an embodiment of the invention, the heat conducting strip is coupled to the two input chambers.

In an embodiment of the invention, the output chamber has a slope, and the slope connects the output port and the backstop unit.

In an embodiment of the invention, the backstop unit comprises an elastic film and a partition. The separator has a plurality of openings, and the elastic film is disposed on a side of the separator facing the output chamber and covers the openings.

In an embodiment of the invention, the annular heat dissipating element surrounds the heat source along a plane, and the openings have a drop along another direction perpendicular to the plane.

In an embodiment of the invention, the heat conducting strip is a heat pipe.

In an embodiment of the invention, the internal volume of the unidirectional evaporation chamber is greater than the internal volume of the heat pipe.

In an embodiment of the invention, the unidirectional evaporation chamber is a vacuum.

In an embodiment of the invention, the material of the annular heat dissipating component is made of a metal material.

Based on the above, the heat dissipation module of the embodiment of the present invention can absorb the heat of the heat source by the unidirectional evaporation chamber, and the annular heat dissipation component formed by the unidirectional evaporation cavity and the heat dissipation pipeline can circulate the heat dissipation fluid and provide good heat dissipation. The effect is also unaffected by the angle at which the annular heat dissipating element is flipped. The electronic device of the embodiment of the invention has the above-mentioned heat dissipation module, so that a good heat dissipation effect can be maintained at all angles.

The above described features and advantages of the invention will be apparent from the following description.

D1, k1, k2‧‧‧ direction

S1, S2‧‧‧ falls

50‧‧‧heat source

100‧‧‧ Thermal Module

110‧‧‧heat strip

112A, 112B‧‧‧ heat sink

114‧‧‧heat absorption section

200, 200A‧‧‧ annular heat dissipating components

210A, 210B, 210C, 210D‧‧‧ unidirectional evaporation chamber

212A, 212B‧‧‧ input port

214A, 214B‧‧‧ output

220A, 220B, 220C, 220D‧‧‧ heat dissipation pipeline

222A, 222B‧‧‧heat section

230B‧‧‧ input cavity

240, 240A, 240B‧‧‧ backstop unit

241‧‧‧Baffle

242, 244, 242B, 244B‧‧‧ openings

246, 246B‧‧‧ elastic film

250B‧‧‧Output cavity

252B‧‧‧ Bevel

300A, 300B, 310A, 310B‧‧‧ areas

400‧‧‧Electronic devices

410‧‧‧shell

420‧‧‧Processing unit

1 is a schematic view of a heat dissipation module in accordance with a first embodiment of the present invention.

2A is a partial enlarged view of a region A according to FIG. 1.

2B is a side view of the unidirectional evaporation module of FIG. 2A.

3A and 3B are schematic views of a backstop unit used in the first embodiment of the present invention.

Figure 4 is a side elevational view of the unidirectional evaporation chamber in a horizontal state in the first embodiment of the present invention.

Figure 5 is a schematic illustration of an electronic device in a second embodiment of the present invention.

1 is a schematic view of a heat dissipation module in accordance with a first embodiment of the present invention. Referring to FIG. 1 , in the first embodiment of the present invention, the heat dissipation module 100 includes a heat conducting strip 110 , an annular heat dissipating component 200 , and a heat dissipating fluid (not labeled), wherein the heat dissipating fluid is disposed on the annular heat dissipating component 200 . in. The heat conducting strip 110 includes a heat radiating end 112A, a heat radiating end 112B and a heat absorbing section 114. The heat absorbing section 114 is located between the heat radiating end 112A and the heat radiating end 112B. The heat absorption section 114 is in contact with a heat source 50. The annular heat dissipating component 200 includes a unidirectional evaporation chamber 210A, a unidirectional evaporation chamber 210B, a heat dissipation pipeline 220A, and a heat dissipation pipeline 220B. The heat dissipation end 112A is connected to the unidirectional evaporation chamber 210A, and the heat dissipation end 112B is connected to the unidirectional evaporation chamber 210B.

2A is a partial enlarged view of a region A according to FIG. 1. Please refer to Figure 1 2A, in the present embodiment, the unidirectional evaporation chamber 210A includes an output port 214A, an input port 212A, and a backstop unit 240A. The backstop unit 240A is disposed between the input port 212A and the output port 214A. The one-way evaporation chamber 210B includes an output port 214B, an input port 212B, and a backstop unit 240B. The backstop unit 240B is disposed between the input port 212B and the output port 214B. The heat dissipation line 220A connects the output port 214A to the input port 212B. The heat dissipation line 220B connects the output port 214B to the input port 212A. The unidirectional evaporation chamber 210A and the unidirectional evaporation chamber 210B have a drop S1 in a direction d1, and the distance between the output port 214A and the output port 214B in the direction S1 is greater than the distance between the input port 212A and the input port 212B. distance. The heat dissipating fluid flows between the one-way evaporation chambers 210A, 210B and the heat dissipation lines 220A, 220B. That is to say, the annular heat dissipating component 200 of the heat dissipation module 100 not only has two unidirectional evaporation chambers 210A, 210B to enhance its heat dissipation efficiency, but also the heat dissipation fluid therein provides a good heat dissipation effect.

In detail, in the embodiment, the heat dissipation module 100 is provided by the heat conduction strip 110 The heat absorption channel of the heat source 50 unidirectionally evaporates the chambers 210A, 210B, and the heat dissipating fluid flowing in from the input port 212B, for example, after evaporating in the unidirectional evaporation chamber 210B, can flow from the output port 214B to the heat dissipating portion 222B of the heat dissipating line 220B to dissipate heat. The condensed heat-dissipating fluid flows into the unidirectional evaporation chamber 210A from the input port 212A, absorbs heat, and then discharges from the output port 214A to the heat-dissipating line 220A and dissipates heat to the heat-dissipating portion 222A of the heat-dissipating line 220A to the input port 212B. On the other hand, by the difference S1 between the unidirectional evaporation chamber 210A and the unidirectional evaporation chamber 210B, the heat dissipation module 100 can further assist the heat dissipation fluid in the ring by the gravitational potential difference caused by the drop S1 when standing upright. Heat sink The flow of 200. Therefore, the annular heat dissipating component 200 provides a good environment for the heat dissipation fluid to circulate, thereby improving the efficiency of heat absorption and heat dissipation, and the heat dissipation module 100 has good heat dissipation efficiency. The heat dissipating fluid described above is, for example, water or a refrigerant, and the material of the annular heat dissipating member 200 is, for example, a metal material, but the present invention is not limited thereto. In other embodiments, the heat dissipating fluid may be other mixed liquid suitable for evaporation and condensation, and the annular heat dissipating component may be other materials suitable for heat conduction.

2B is a side view of the unidirectional evaporation module of FIG. 2A. The following will be one way The evaporation chamber 210B is taken as an example to illustrate the detailed structure of the unidirectional evaporation chamber in the embodiment of the present invention, and the unidirectional evaporation chamber 210A is similar to the unidirectional evaporation chamber 210B. Referring to FIG. 2A and FIG. 2B, in the first embodiment of the present invention, the backstop unit 240B divides the unidirectional evaporation chamber 210B into an output chamber 250B and an input chamber 230B, and the output port 214B is formed in the output chamber 250B. The port 212B is formed in the input cavity 230B, wherein the output cavity 250B, the backstop unit 240B, and the input cavity 230B are arranged along the direction d1. That is, the backstop unit 240B is blocked between the input chamber 230B and the output chamber 250B so that the heat transfer fluid can flow in only one direction in the direction d1.

Referring to Figures 1, 2A and 2B, in the present embodiment, the unidirectional evaporation chamber 210A, The inside of 210B is a vacuum, and the boiling point of the heat radiating fluid is also lowered, so that the heat absorbing efficiency to the heat radiating ends 112A, 112B can be improved. Further, taking the unidirectional evaporation chamber 210B as an example, the heat conducting strip 110 is connected to the input cavity 230B, so that the heat radiating fluid flowing from the input port 212B can be more easily evaporated by heat, so that the heat radiating end 112B has good heat dissipation efficiency. On the other hand, the heat conducting strip 110 of the embodiment is, for example, a heat pipe, and the internal volume of the one-way evaporation chambers 210A, 210B is much larger than that of the heat pipe 110. The internal volume, therefore, the unidirectional evaporation chambers 210A, 210B have a larger heat capacity than the heat pipes 110, and the heat generated by the heat source 50 can be more efficiently transferred to the unidirectional evaporation chambers 210A, 210B via the heat pipes 110.

3A and 3B are the backstops used in the first embodiment of the present invention. Schematic diagram of the unit. The similar backstop units 240A, 240B will be described together with the backstop unit 240 illustrated in FIGS. 3A and 3B, and will not be described again. Referring to FIG. 2B and FIG. 3A, in the first embodiment of the present invention, the backstop unit 240 includes an elastic film 246 and a partition 241. The partition 241 has openings 242, 244, and an elastic film 246 is disposed on a side of the partition 241 facing the output chamber 250B and covers the openings 242, 244. That is, since the fluid flowing in the direction k1 causes the elastic film 246 to be pressed against the openings 242, 244, the backstop unit 240 can block the fluid flowing in the direction k1 by covering the elastic film 246 of the openings 242, 244. .

Referring to FIG. 3B, the fluid flowing in the direction k2 will have an elastic film 246. The holes 242, 244 are pushed away so that the heat transfer fluid can flow through the openings 242, 244 to the output chamber 250B. Therefore, the backstop unit 240 allows the heat radiating fluid flowing in the direction k2 and blocks the heat radiating fluid flowing in the direction k1, providing a good backstop effect.

Figure 4 is a view showing the unidirectional evaporation chamber in a horizontal state in the first embodiment of the present invention Side view. In detail, referring to FIG. 4, in the present embodiment, when the backstop unit 240B is in the horizontal state, the liquid heat dissipation fluid flows from the heat dissipation line 220A to the area 300A and the area 300B of the unidirectional evaporation chamber 210B. In the present embodiment, the output chamber 250B has a slope 252B that connects the output port 214B and the backstop unit 240B. Referring again to FIG. 1, the annular heat dissipating component 200 surrounds the heat source 50 along a plane B. The openings 242B, 244B have a drop S2 along a direction perpendicular to the plane B. Therefore, the inclined surface 252B allows the heat dissipation fluid to easily increase the height in the region 300A and presses the portion of the elastic film 246B located beside the opening 244B and covers the opening 244B. The heat-dissipating fluid located in the region 300B is heated by the heat-conducting strip 110 and evaporated to the region 310B, and proceeds to the region 310A via the opening 242B to the region 310A and flows out to the heat-dissipating line 220B through the output port 214B. Therefore, the heat dissipation module 100 of the present embodiment can ensure that the annular heat dissipation element 200 has a good circulating heat dissipation effect when horizontally by the backstop function provided by the backstop units 240A, 240B in the one-way evaporation chambers 210A, 210B.

Figure 5 is a schematic illustration of an electronic device in a second embodiment of the present invention. in order to The corresponding positions of the heat dissipation module and the electronic device are clearly illustrated, and some of the components in FIG. 5 are shown in a perspective manner. Referring to FIG. 5 , in the second embodiment of the present invention, the electronic device 400 includes a processing unit 420 , a housing 410 , and the same heat dissipation module as the heat dissipation module 100 . The heat conducting strip 110A is in contact with the processing unit 420 with the heat absorption section, and the heat radiating section 222C of the heat dissipation pipeline 220C contacts the housing 410, and the heat radiating section 222D of the heat dissipation pipeline 220D contacts the housing 410. That is, the processing unit 420 corresponds to the heat source 50 described above. In detail, the processing unit 420 in the electronic device 400 of the present embodiment is, for example, a central processing unit wafer, and the generated heat is conducted to the unidirectional evaporation chamber 210C of the annular heat dissipating member 200A by the heat conducting strip 110A and unidirectional evaporation. The cavity 210D, and the heat dissipating fluid in the annular heat dissipating component 200A flows to the heat dissipating section 222C or 222D to dissipate heat to the housing 410. Therefore, the electronic device 400 can maintain a good heat dissipation effect regardless of whether it is in an upright state or a horizontal state.

In summary, the heat dissipation module of the embodiment of the present invention can be evaporated by one-way The cavity absorbs the heat of the heat source, wherein the annular heat dissipating component formed by the unidirectional evaporation cavity and the heat dissipating pipeline can ensure that the heat dissipating fluid continuously circulates therein, thereby allowing the heat dissipating fluid to maintain good heat absorption and heat dissipating efficiency, and is also free from ring heat dissipation. The angle at which the component is flipped. On the other hand, since the annular heat dissipating member has two unidirectional evaporation chambers at the same time, the heat absorbing efficiency can be improved. The electronic device of the embodiment of the invention has the above-mentioned heat dissipation module, wherein the annular heat dissipation element can maintain good heat dissipation effect and efficiency at various angles.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

D1‧‧‧ direction

S1‧‧‧ falls

50‧‧‧heat source

100‧‧‧ Thermal Module

110‧‧‧heat strip

112A, 112B‧‧‧ heat sink

114‧‧‧heat absorption section

200‧‧‧Ring heat sink

210A, 210B‧‧‧ unidirectional evaporation chamber

212A, 212B‧‧‧ input port

214A, 214B‧‧‧ output

220A, 220B‧‧‧ heat dissipation pipeline

222A, 222B‧‧‧heat section

240A, 240B‧‧‧ backstop unit

Claims (20)

A heat dissipating module includes: a heat conducting strip comprising: two heat dissipating ends and a heat absorbing section, wherein the heat absorbing section is located between the two heat dissipating ends, and the heat absorbing section is in contact with a heat source; and an annular heat dissipating component comprises: Each of the one-way evaporation chambers includes an output port, an input port, and a backstop unit, and the backstop unit is disposed between the input port and the output port, wherein the two heat dissipating ends are respectively connected to the a two-way evaporation chamber; and two heat dissipation pipelines, each of the heat dissipation pipelines connecting one of the outlets of the one-way evaporation chamber to an input port of the other of the one-way evaporation chambers, and the two one-way evaporation chambers Having a drop in a direction in which the distance between the two output ports is greater than a distance between the two input ports; and a heat dissipating fluid disposed in the annular heat dissipating component and used in the two-way Flow between the evaporation chamber and the two heat dissipation lines. The heat dissipation module of claim 1, wherein the backstop unit divides the one-way evaporation chamber into an output chamber and an input chamber, the output port is formed in the output chamber, and the input port is formed in the An input cavity, wherein the output cavity, the backstop unit, and the input cavity are aligned in the direction. The heat dissipation module of claim 2, wherein the heat conduction strip is connected to the two input chambers. The heat dissipation module of claim 2, wherein the output cavity has a slope, the slope connecting the output port and the backstop unit. The heat dissipation module of claim 2, wherein the backstop unit comprises an elastic film and a partition, the partition has a plurality of openings, and the elastic film is disposed on the partition facing the output cavity One side and cover the openings. The heat dissipation module of claim 5, wherein the annular heat dissipating member surrounds the heat source along a plane, and the openings have a drop along another direction perpendicular to the plane. The heat dissipation module of claim 1, wherein the heat conduction strip is a heat pipe. The heat dissipation module of claim 7, wherein the internal volume of the one-way evaporation chamber is larger than the internal volume of the heat pipe. The heat dissipation module of claim 1, wherein the two unidirectional evaporation chambers are vacuumed. The heat dissipation module according to claim 1, wherein the annular heat dissipation component is made of a metal material. An electronic device includes a processing unit, a housing, and a heat dissipation module, comprising: a heat conducting strip comprising two heat dissipating ends and a heat absorbing section, wherein the heat absorbing section is located between the two heat dissipating ends, and the heat absorbing section Contacting the processing unit; an annular heat dissipating component comprising: two unidirectional evaporation chambers, each of the one-way evaporation chambers including an output port, An input port and a backstop unit, wherein the backstop unit is disposed between the input port and the output port, wherein the two heat dissipating ends are respectively connected to the two unidirectional evaporation chambers; and two heat dissipating lines, each of the heat dissipating lines a heat dissipating section is disposed, the heat dissipating section is in contact with the housing, and each of the heat dissipating pipelines connects one of the output ports of the one-way evaporation chamber to an input port of the other of the one-way evaporation chambers, and the two-way evaporation a cavity having a drop in a direction in which the distance between the two output ports is greater than a distance between the two input ports; and a heat dissipating fluid disposed in the annular heat dissipating component and used in the second A unidirectional evaporation chamber and a flow between the two heat dissipation lines. The electronic device of claim 11, wherein the backstop unit divides the unidirectional evaporation chamber into an output chamber and an input chamber, the output port being formed in the output chamber, the input port being formed at the input a cavity, wherein the output cavity, the backstop unit, and the input cavity are aligned along the direction. The electronic device of claim 12, wherein the heat conducting strip is connected to the two input cavities. The electronic device of claim 12, wherein the output cavity has a slope, the slope connecting the output port and the backstop unit. The electronic device of claim 12, wherein the backstop unit comprises an elastic film and a partition, the partition having a plurality of openings, the elastic film being disposed on the partition facing the output cavity Side and cover the openings. The electronic device of claim 15, wherein the annular heat dissipating member surrounds the processing unit along a plane, and the openings have a drop along another direction perpendicular to the plane. The electronic device of claim 11, wherein the heat conducting strip is a heat pipe. The electronic device of claim 17, wherein the internal volume of the one-way evaporation chamber is greater than the internal volume of the heat pipe. The electronic device of claim 11, wherein the two unidirectional evaporation chambers are vacuum. The electronic device according to claim 11, wherein the annular heat dissipating component is made of a metal material.