TWI588002B - Splitting jig and cutting method for brittle substrate - Google Patents

Description

Split fixture and cutting method for brittle substrate

The present invention relates to a split jig and a cutting method, and more particularly to a split jig and a cutting method for cutting a brittle glass substrate.

Referring to FIG. 1 , in a conventional cutting technique of a glass or ceramic substrate, the brittle substrate 1 has a thickness t and a first surface 11 . The method of cutting a brittle substrate 1 is first to form a scribe opening 13 on the first surface 11 of the brittle substrate 1 along a predetermined cutting line, wherein the depth of one of the scribe openings 13 is less than the thickness t of the brittle substrate.

Referring to FIG. 2, after forming the scribe opening 13, the conventional method of splitting the brittle substrate 1 is to bend the brittle substrate 1 along the axial direction A of the substantially parallel scribed opening 13 (in the direction of the arrow in the figure) to scribe The opening 13 extends through the thickness t of the brittle substrate to form an opening 30 after stretching, thereby splitting the brittle substrate 1 into a plurality of glass substrate products.

However, referring to FIG. 3A, when the plurality of scribe openings 131, 132 are formed on the first surface 11 of the brittle substrate 1 along a plurality of predetermined cutting lines, the conventional method of splitting the brittle substrate 1 causes a number of defects. The causes are detailed below.

As shown in FIG. 3A, the brittle substrate 1 as an experiment has a length L of 80 mm, a width W of 46 mm, and a thickness t of 0.7 mm. A first scribed opening 131 is formed on the first surface 11 of the brittle substrate 1 along a plurality of predetermined cutting lines, and a second scribed opening 132 is formed by the reticle forming, wherein the second scribed opening 132 is away from the brittle substrate 1 one edge has 40mm One of the distances is W1, and the other edge of the brittle substrate 1 has a distance W2 of 8 mm. Under the experimental conditions, the cross-sectional view of the first scribe opening 131 at the intersection 133 of the first scribe opening 131 and the second scribe opening 132 will generally be as illustrated in FIG. 3B, or other cross-sectional shapes may be fixed. A phenomenon occurs, and a cross-sectional view of the second scribe opening 132 at the intersection 133 of the first scribe opening 131 and the second scribe opening 132 is as shown in FIG. 3C. As shown in FIG. 3B, when the second scribe opening 132 is formed, the first scribe opening 131 is fixed at the intersection 133 of the first scribe opening 131 and the second scribe opening 132, so that the A portion of the first scribed opening 131 that is first scored disappears at the intersection 133 of the first scribed opening 131 and the second scribed opening 132. However, as shown in FIG. 3C, the second scribe opening 132 formed after the first scribe opening 131 is not fixed at the intersection 133 of the first scribe opening 131 and the second scribe opening 132. The second scribe opening 132 remains intact at the intersection 133 of the first scribe opening 131 and the second scribe opening 132 without partially disappearing.

Because of the above-mentioned fixing phenomenon, the split brittle substrate 1 needs to apply a larger force, and the first surface 11 of the brittle substrate 1 is first scored to form one or a plurality of first scribe openings 131 by a conventional method, and the scribe is formed. One or more second scribe openings 132, after splitting the brittle substrate 1, viewed from above the brittle substrate 1, will result in a lobes 301 as shown in FIG. 4A, a slanted angle 302 as shown in FIG. 4B, and/or The probability of defects such as the bevel 303 shown in Fig. 4C becomes large.

In view of this, how to avoid the above-mentioned many defects and split the brittle substrate 1 is an urgent problem to be solved in the industry.

SUMMARY OF THE INVENTION An object of the present invention is to provide a splitting jig and a cutting method capable of preventing a brittle substrate from causing a fixing phenomenon at the intersection of the scribed openings, thereby causing many defects in the brittle substrate after the splitting.

Wherein the brittle substrate has a thickness and a first surface and is scored on the first surface of the brittle substrate along a predetermined cutting line to form a scribed opening, wherein the depth of one of the scribed openings is less than The thickness of the brittle substrate.

To achieve the above object, the splitting jig for cutting a brittle substrate of the present invention comprises a first clamping portion and a second clamping portion. The first clamping portion has a first clamping surface, wherein the first clamping surface is curved about an axial extension. The second clamping portion has a second clamping surface, wherein the second clamping surface is curved about an axial extension. The axial extension direction of the first clamping surface and the axial extension direction of the second clamping surface are disposed substantially perpendicular to the scribed opening and parallel to the first surface of the brittle substrate. The first clamping surface of the first clamping portion and the second clamping surface of the second clamping portion are used for clamping the brittle substrate such that the brittle substrate extends in the axial direction of the scribing opening around the first clamping surface The axial direction of the second clamping surface is curved to cause the brittle substrate to split along the scribed opening.

To achieve the above object, the present invention for cutting a brittle substrate comprises the steps of: (a) scribing a scribed opening on a first surface of the brittle substrate along a predetermined cutting line, the depth of one of the scribed openings being less than the brittle substrate (b) one of the first clamping surfaces provided in a curved shape and one of the axially extending directions and one of the curved second clamping surfaces is substantially perpendicular to the scribed opening and fragile The first surface of the substrate is parallel; and (c) the brittle substrate is sandwiched by the first clamping surface and the second clamping surface such that the brittle substrate extends in the axial direction of the first clamping surface and the second in the scribed opening The axial extension of the clamping surface is curved to cause the frangible substrate to split along the scribed opening.

1‧‧‧Bare substrate

11‧‧‧ first surface

12‧‧‧ second surface

13‧‧‧Scratch opening

131‧‧‧ first scribe opening

132‧‧‧second scribe opening

133‧‧‧Intersection

14‧‧‧ edge

L‧‧‧ length

T‧‧‧thickness

W‧‧‧Width

W1‧‧‧ distance

W2‧‧‧ distance

30‧‧‧Expanded openings after extension

301‧‧‧ lobes

302‧‧‧Necked corner

303‧‧‧ Angled

A‧‧‧Axial

5‧‧‧ split fixture

50‧‧‧Expanding openings after extension

51‧‧‧First clamping part

510‧‧‧First clamping surface

52‧‧‧Second clamping part

520‧‧‧Second clamping surface

A1‧‧‧ axial extension direction

A2‧‧‧ axial extension direction

1 is a schematic view showing a state in which a fragile substrate is scribed to form a scribed opening; FIG. 2 is a schematic view showing a conventional method of splitting a brittle group; FIG. 3A is a schematic view showing a complex intersecting scribed opening after sculpt of a brittle substrate. Figure 3B is a cross-sectional view of the first scribe opening at the intersection of the first scribe opening and the second scribe opening; Figure 3C is a second scribe opening in the first scribe opening and the second scribe opening Sectional view of the intersection; 4A to 4C are top plan views showing defects of a brittle substrate due to a conventional splitting method; FIG. 5A is a schematic view showing a splitting jig for cutting a brittle substrate according to the present invention; and FIG. 5B is a schematic view showing a curved substrate of the present invention; Figure 5C is a schematic illustration of the splitting of a brittle substrate in accordance with the present invention.

Referring to FIG. 1 , the brittle substrate 1 to be cut has a thickness t and a first surface 11 , and a scratched opening 13 is formed on the first surface 11 of the brittle substrate 1 along a predetermined cutting line. One of the slit openings 13 has a depth smaller than the thickness t of the brittle substrate 1.

Referring to FIG. 5A, the present invention employs a jig in the process of cutting a brittle substrate. The splitting jig 5 for cutting the brittle substrate 1 includes a first clamping portion 51 and a second clamping portion 52. The first clamping portion 51 has a first clamping surface 510, wherein the first clamping surface 510 is curved about an axial extending direction A1, which may be a radius of curvature centered on A1, or a plurality of radii of curvature The arc that is connected. The second clamping portion 52 has a second clamping surface 520, wherein the second clamping surface 520 is curved about an axial extending direction A2, which may be a radius of curvature centered on A2, or a plurality of radii of curvature The arc that is connected. Wherein, the first clamping surface 510 protrudes toward the surface of the brittle substrate, and the second clamping surface 520 is concave relative to the surface of the brittle substrate to be clamped. The brittle substrate 1 is interposed between the first clamping portion 51 and the second clamping portion 52. The axial extension direction A1 of the first clamping surface 510 and the axial extension direction A2 of the second clamping surface 520 are disposed substantially perpendicular to the scribed opening 13 and parallel to the first surface 11 of the brittle substrate 1.

The first clamping surface 510 of the first clamping portion 51 and the second clamping surface 520 of the second clamping portion 52 are used to clamp the brittle substrate 1 so that the brittle substrate 1 is at least scribed as shown in FIG. 5B. The 13 position and its vicinity form a shape that is curved around the axial extension direction A1 of the first clamping surface 510 and the axial extension direction A2 of the second clamping surface 520.

When the scribe opening 13 extends around the axial direction A1 of the first clamping surface 510 and the second clip When the axial extension direction A2 of the surface 520 is bent, the scribe opening 13 grows and penetrates the thickness t of the brittle substrate 1 and extends to reach the edge 14, and becomes an extended scribed opening 50 to split the brittle substrate 1, such as Figure 5C shows.

Among them, the brittle substrate 1 has a second surface 12 opposite to the first surface 11. In an embodiment, the first clamping surface 510 of the first clamping portion 51 has a first curvature and is used to clamp the first surface 11 on which the scribe opening 13 is formed. The second clamping surface 520 of the second clamping portion 52 has a second curvature and serves to grip the second surface 12 at a position corresponding to the first surface 11 being clamped. The first curvature is greater than the second curvature, that is, the first clamping surface 510 of the first clamping portion 51 is more curved than the second clamping surface 520 of the second clamping portion 52. In another embodiment, the first clamping surface 510 and the second clamping surface 520 are substantially cylindrical surfaces.

Referring to FIGS. 3A and 5A, the brittle substrate 1 is scribed on the first surface 11 of the brittle substrate 1 along a first predetermined cutting line to form a first scribe opening 131, and along a second predetermined cutting line on the brittle substrate 1. The first surface 11 is scored to form a second scribe opening 132. The first scoring opening 131 intersects the second scoring opening 132. In most cases, the first scoring opening 131 is substantially perpendicular to the second scoring opening 132.

If the first scribe opening 131 is first scribed and then the second scribe opening 132 is formed, the first scribe opening 131 will occur at the intersection 133 of the first scribe opening 131 and the second scribe opening 132. As shown in FIG. 3B, a portion of the first scribe opening 131 at the intersection 133 of the first scribe opening 131 and the second scribe opening 132 disappears. By using the splitting jig 5 of the present invention, it is possible to suppress the first scribing opening 131 as shown in FIG. 2 from extending after the scoring opening 30 is opened from the center, and by concentrating the stress on the first scribing opening 131 and the second engraving The intersection 133 of the opening 132 is drawn, that is, the position where the first scribe opening 131 partially disappears due to the fixation phenomenon as shown in FIG. 3B, so that the first scribe opening 131 extends and passes through the first scribe opening 131. The disappearing portion shown in FIG. 3B, which further causes the brittle substrate 1 to split from the first scribed opening 131, can effectively prevent the conventional split brittle substrate 1 from being cut. The cut brittle substrate 1 has defects such as a lobe 301 as shown in FIG. 4A, a notch 302 as shown in FIG. 4B, and/or an oblique angle 303 as shown in FIG. 4C.

If the brittle substrate 1 is to be split along the first scribing opening 131, the user needs to set the axial extending direction A1 of the first clamping surface 510 and the axial extending direction A2 of the second clamping surface 520 to be substantially the same. The first scribed opening 131 shown in 3A is perpendicular and parallel to the first surface 11 of the brittle substrate 1. When the first clamping surface 510 of the first clamping portion 51 and the second clamping surface 520 of the second clamping portion 52 sandwich the brittle substrate 1 , the brittle substrate 1 surrounds the first clamping layer 131 in the first clamping opening 131 . When the axial extension direction A1 of the holding surface 510 and the axial extension direction A2 of the second clamping surface 520 are curved, the brittle substrate 1 will be split along the first scribed opening 131.

Similarly, if the brittle substrate 1 is to be split along the second scribing opening 132, the user needs to set the axial extension direction A1 of the first clamping surface 510 and the axial extension direction A2 of the second clamping surface 520 to be substantially The upper surface is perpendicular to the second scribing opening 132 and parallel to the first surface 11 of the brittle substrate 1. When the first clamping surface 510 of the first clamping portion 51 and the second clamping surface 520 of the second clamping portion 52 sandwich the brittle substrate 1 , the brittle substrate 1 surrounds the first clamping layer at the second scribed opening 132 . When the axial extension direction A1 of the holding surface 510 and the axial extension direction A2 of the second clamping surface 520 are curved, the brittle substrate 1 will be split along the second scribed opening 132.

The brittle substrate 1 split by the splitting jig 5 of the present invention may be a strengthened glass substrate, an unreinforced glass substrate or a ceramic substrate. When the brittle substrate 1 is a tempered glass substrate, the brittle substrate 1 comprises a tensile layer and at least one compression layer formed on the tensile layer, the tensile layer has tensile internal stress, and the compression layer has compressive internal stress and has a thickness. . At this time, the depth of the scribe opening 13 needs to be larger than the thickness of the compression layer to facilitate the scribe opening 13 to extend.

The scribed opening 13 of the brittle substrate 1 can be formed by scoring using a laser or a cutting blade. The scribed opening 13 of the fragile substrate 1 is preferably formed by carbon dioxide (CO2) laser scribing. When the scribing opening 13 is formed by laser scoring, the first scribing opening 131 occurs at the intersection 133 of the first scoring opening 131 and the second scoring opening 132 as shown in FIG. 3B. The image will be more obvious. This fixation can also occur when using a cutter wheel.

Referring to FIGS. 5A and 5B, the splitting jig 5 of the present invention can smoothly extend the scribing opening 13 to the edge 14 and split the brittle substrate 1 in the case where both ends of the scribing opening 13 are separated from all the edges 14 of the brittle substrate 1. Further, in the case where the brittle substrate 1 is formed by laminating a plurality of brittle substrates, the splitting jig 5 of the present invention can smoothly spread the scribing opening 13 and split the brittle substrate 1.

The cutting method for cutting the brittle substrate 1 of the present invention comprises the following steps: (a) forming a scribe opening 13 on the first surface 11 of the brittle substrate 1 along a predetermined cutting line as shown in FIG. One of the openings 13 has a depth smaller than the thickness t of the brittle substrate 1; (b) as shown in FIG. 5A, a splitting jig 5 is provided to have a curved shape, one of the first clamping surfaces 510 extending axially in the direction A1 and presenting One of the curved second clamping surfaces 520 has an axial extension direction A2 substantially perpendicular to the scribed opening 13 and parallel to the first surface 11 of the brittle substrate 1, and compared to the first surface 11 of the brittle substrate 1, The first clamping surface 510 is convex and the second clamping surface 520 is concave; and (c) the first clamping surface 510 of the splitting fixture 5 is used to clamp the brittle substrate 1 with the second clamping surface 520, so that The brittle substrate 1 is bent around the axial extension direction A1 of the first clamping surface 510 and the axial extension direction A2 of the second clamping surface 520 at the position of the scribed opening 13 and its vicinity (as shown in FIG. 5B), so that The scribe opening 13 extends toward the substrate edge 14 and the depth direction of the substrate to form an elongated scribed opening 50 Split into (in FIG. 5C).

The brittle substrate 1 has a second surface 12 opposite to the first surface 11, and the step (c) is formed by the first clamping surface 510 of the splitting jig 5 having a first curvature and is formed with a scribe opening. The first surface 11 of the first surface 11 is held by a second clamping surface 520 having a second curvature. The first curvature is greater than the second curvature, that is, the first clamping surface 510 of the first clamping portion 51 is more curved than the second clamping surface 520 of the second clamping portion 52. In an embodiment, the first clamping surface 510 and the second clamping surface 520 are substantially cylindrical surfaces.

Referring to FIG. 3A, in step (a), a first scribed opening 131 is formed on the first surface 11 of the brittle substrate 1 along a first predetermined cutting line, and the first scribed opening 131 is formed on the brittle substrate 1. A second scribe opening 132 is formed on a surface 11 along a second predetermined cutting line, and the first scribe opening 131 intersects the second scribe opening 132. In most cases, the first scoring opening 131 is substantially perpendicular to the second scoring opening 132.

Referring to FIG. 5A, in order to split the brittle substrate 1 along the first scribing opening 131, in the step (b), the axial extension direction A1 of the first clamping surface 510 and the axial extension of the second clamping surface 520 are disposed. The direction A2 is substantially perpendicular to the first scribed opening 131 shown in FIG. 3A and parallel to the first surface 11 of the brittle substrate 1. In the step (c), the brittle substrate 1 is sandwiched by the first clamping surface 510 and the second clamping surface 520, so that the brittle substrate 1 surrounds the first clamping surface 510 at the first scribed opening 131. The axial extension direction A1 is curved with the axial extension direction A2 of the second clamping surface 520 to split the brittle substrate 1 along the first scribed opening 131.

Similarly, if the brittle substrate 1 is to be split along the second scribing opening 132, in the step (b), the axial extending direction A1 of the first clamping surface 510 and the axial extending direction of the second clamping surface 520 are disposed. A2 is substantially perpendicular to the second scribed opening 132 shown in FIG. 3A and parallel to the first surface 11 of the brittle substrate 1. In the step (c), the brittle substrate 1 is sandwiched by the first clamping surface 510 and the second clamping surface 520, so that the brittle substrate 1 surrounds the first clamping surface 510 at the second scribed opening 132. The axial extension direction A1 is curved with the axial extension direction A2 of the second clamping surface 520 to split the brittle substrate 1 along the second scribed opening 132.

As described above, in a case where the first scribed opening 131 is formed earlier than the second scribed opening 132, the first scribed opening 131 is at the intersection 133 of the first scribed opening 131 and the second scribed opening 132. A fixation phenomenon as shown in FIG. 3B occurs, and a portion of the first scribe opening 131 at the intersection 133 of the first scribe opening 131 and the second scribe opening 132 disappears. By using the cutting method of the present invention, the first scoring opening 131 can be inhibited from extending from the center after the stretching of the first scribing opening 131 as shown in FIG. 2, and the stress is concentrated on the first scoring opening 131 and the second scribing. The intersection 133 of the opening 132, that is, due to the fixation phenomenon as shown in FIG. 3B The first scribe opening 131 is partially extended, and the first scribe opening 131 is extended and passed through the first scribe opening 131 as shown in FIG. 3B, thereby causing the brittle substrate 1 to open from the first scribe opening. When the splitting starts, the lobes 301 as shown in FIG. 4A, the notched corners 302 as shown in FIG. 4B, and/or the oblique angles 303 as shown in FIG. 4C, etc., which are caused by the conventional method of splitting the brittle substrate 1, can be effectively prevented. defect.

The brittle substrate 1 which can be cut by the cutting method of the present invention can be a strengthened glass substrate, an unreinforced glass substrate or a ceramic substrate. When the brittle substrate 1 is a tempered glass substrate, the brittle substrate 1 comprises a tensile layer and at least one compression layer formed on the tensile layer, the tensile layer has tensile internal stress, and the compression layer has compressive internal stress and has a thickness. . At this time, the depth of the scribe opening 13 needs to be larger than the thickness of the compression layer to facilitate the scribe opening 13 to extend.

The scribed opening 13 of the brittle substrate 1 can be formed by scoring using a laser or a cutting blade. The scribed opening 13 of the fragile substrate 1 is preferably formed by carbon dioxide (CO2) laser scribing. When the scribing opening 13 is formed by laser scoring, the fixing action of the first scribing opening 131 at the intersection 133 of the first scribing opening 131 and the second scoring opening 132 occurs as shown in FIG. 3B. More obvious, it also happens when using a cutter wheel.

Referring to FIGS. 5A and 5B, the dicing opening 13 formed in the step (a) of the cutting method of the present invention can leave all the edges 14 of the brittle substrate 1. In this case, the cutting method of the present invention can also smoothly extend the scribe opening 13 to the edge 14 and rupture the brittle substrate 1 in the step (c). Furthermore, in the case where the brittle substrate 1 is formed by stacking a plurality of fragile substrates, the dicing opening 13 can also smoothly spread and sever the brittle substrate 1.

Since the fixation phenomenon occurs at the intersection of the scribe openings, the use of the split jig and the cutting method of the present invention can effectively prevent many defects of the brittle substrate after splitting caused by the conventional method of splitting the brittle substrate.

1‧‧‧Bare substrate

11‧‧‧ first surface

12‧‧‧ second surface

13‧‧‧Scratch opening

14‧‧‧ edge

T‧‧‧thickness

5‧‧‧ split fixture

51‧‧‧First clamping part

510‧‧‧First clamping surface

52‧‧‧Second clamping part

520‧‧‧Second clamping surface

A1‧‧‧ axial extension direction

A2‧‧‧ axial extension direction

Claims (24)

A splitting fixture for cutting a brittle substrate having a thickness and a first surface and scribing a first scribe line on the first surface of the brittle substrate along a predetermined cutting line, the scribed opening One of the depths is smaller than the thickness of the brittle substrate, the splitting fixture includes: a first clamping portion having a first clamping surface, wherein the first clamping surface is curved about an axial extension direction; and a second The clamping portion has a second clamping surface, wherein the second clamping surface is curved about another axial extension direction, the other axial extension direction being the same as the axial extension direction with respect to the brittle substrate a side; wherein the axial extending direction of the first clamping surface and the other axial extending direction of the second clamping surface are disposed substantially perpendicular to the scribed opening and the first of the brittle substrate a surface is parallel, and the first clamping surface of the first clamping portion and the second clamping surface of the second clamping portion sandwich the brittle substrate such that the brittle substrate surrounds the scribed opening First clip The direction of the surface of an axially extending bending the extending direction of the other axial surface of the second clamping, so that the brittle substrate along the scribe split opening. The splitting jig according to claim 1, wherein the brittle substrate has a second surface opposite to the first surface, the first clamping surface of the first clamping portion has a first curvature and is formed by clamping The first surface of the second clamping portion has a second curvature and is configured to clamp the second portion corresponding to the position of the first surface to be clamped a surface, and the first curvature is greater than the second curvature. The splitting jig according to claim 2, wherein the brittle substrate is scored on the first surface of the brittle substrate along a first predetermined cutting line to form a first scribed opening, and Forming a second scribe opening on the first surface of the brittle substrate along a second predetermined cutting line, the first scribe opening intersecting the second scribe opening, the first clamping surface An axially extending direction and the other axially extending direction of the second clamping surface are disposed substantially perpendicular to the first scribed opening and parallel to the first surface of the brittle substrate, and the first clamp Holding the brittle substrate between the first clamping surface of the holding portion and the second clamping surface of the second clamping portion, so that the brittle substrate surrounds the first clamping surface at the first scribed opening An axially extending direction is curved with the other axially extending direction of the second clamping surface to cause the frangible substrate to split along the first scribe opening. The splitting jig of claim 3, wherein the first clamping surface and the second clamping surface are substantially cylindrical surfaces. The splitting jig of claim 3, wherein the first scoring opening is substantially perpendicular to the second scoring opening. The split jig of claim 3, wherein the first scoring opening is formed before the second scoring opening. The splitting jig according to claim 1, wherein the brittle substrate comprises a tensile layer and at least one compression layer formed on the tensile layer, the tensile layer having tensile internal stress, the compression layer having compressive internal stress And having a thickness, and the depth of the scribed opening is greater than the thickness of the compression layer. The splitting jig according to claim 1, wherein the scribing opening of the brittle substrate is formed by scoring using a laser or a cutter wheel. The splitting jig of claim 8, wherein the scribed opening of the fragile substrate is formed by carbon dioxide (CO ₂ ) laser scoring. The splitting jig of claim 1, wherein the two ends of the scribing opening exit all edges of the brittle substrate. The splitting jig according to claim 1, wherein the brittle substrate is a reinforced glass base A plate, an unreinforced glass substrate or a ceramic substrate. The splitting jig according to claim 1, wherein the brittle substrate is formed by stacking a plurality of sub-brittle substrates. A cutting method for cutting a brittle substrate having a thickness and a first surface, the cutting method comprising the steps of: (a) scribing on the first surface of the brittle substrate along a predetermined cutting line Forming a scribed opening, the depth of one of the scribed openings being less than the thickness of the brittle substrate; (b) providing one of the first clamping surfaces in a curved shape and extending in the axial direction and one of the curved second clips The other axial extension direction of the holding surface is substantially perpendicular to the scribed opening and parallel to the first surface of the brittle substrate, the other axial extension direction being located with respect to the brittle substrate and the axial extension direction And the (c) sandwiching the brittle substrate with the first clamping surface and the second clamping surface to extend the brittle substrate around the axial direction of the first clamping surface The direction is curved with the other axial extension direction of the second clamping surface to cause the frangible substrate to split along the scribe opening. The cutting method of claim 13, wherein the brittle substrate has a second surface opposite to the first surface, and the step (c) utilizes the first clamping surface having a first curvature and having a curvature The first surface of the scribed opening is clamped and the second surface is clamped by the second clamping surface having a second curvature and the first curvature is greater than the second curvature. The cutting method of claim 14, wherein: in the step (a), the fragile substrate is scribed on the first surface of the brittle substrate along a first predetermined cutting line to form a first scribe opening, And forming a second scribe opening on the first surface of the brittle substrate along a second predetermined cutting line, and the first scribe opening intersects the second scribe opening; in the step (b) Providing the axial extension direction of the first clamping surface and The other axial extension direction of the second clamping surface is substantially perpendicular to the first scribe opening and parallel to the first surface of the frangible substrate; and in the step (c), the first clamp is utilized Holding the brittle substrate between the holding surface and the second clamping surface, so that the brittle substrate is in the axial extending direction of the first scribed opening around the first clamping surface and the second clamping surface The other axial extension direction is curved to cause the fragile substrate to split along the first scribe opening. The cutting method of claim 14, wherein the first clamping surface and the second clamping surface are substantially cylindrical surfaces. The cutting method of claim 14, wherein the first scribe opening is formed in front of the second scribe opening in the step (a). The cutting method of claim 14, wherein the first scribe opening is substantially perpendicular to the second scribe opening in the step (a). The cutting method of claim 13, wherein the brittle substrate comprises a tensile layer and at least one compression layer formed on the tensile layer, the tensile layer having tensile internal stress, the compressed layer having compressive internal stress And having a thickness, and the depth of the scribe opening in the step (a) is greater than the thickness of the compression layer. The cutting method of claim 13, wherein the scribing opening of the brittle substrate is formed by using a laser or a cutting blade in the step (a). The cutting method of claim 20, wherein the scoring opening of the brittle substrate is formed by carbon dioxide (CO ₂ ) laser scoring in the step (a). The cutting method of claim 13, wherein the two ends of the scribing opening exit all edges of the brittle substrate. The cutting method of claim 13, wherein the brittle substrate is a tempered glass substrate, an unreinforced glass substrate or a ceramic substrate. The cutting method of claim 13, wherein the brittle substrate is formed by stacking a plurality of fragile substrates.