TWI586227B - Wireless charging circuit board and method for manufacturing wireless charging circuit board - Google Patents
Wireless charging circuit board and method for manufacturing wireless charging circuit board Download PDFInfo
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- TWI586227B TWI586227B TW103132879A TW103132879A TWI586227B TW I586227 B TWI586227 B TW I586227B TW 103132879 A TW103132879 A TW 103132879A TW 103132879 A TW103132879 A TW 103132879A TW I586227 B TWI586227 B TW I586227B
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- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000000034 method Methods 0.000 title claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 41
- 229910052802 copper Inorganic materials 0.000 claims description 41
- 239000010949 copper Substances 0.000 claims description 41
- 239000011347 resin Substances 0.000 claims description 30
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011241 protective layer Substances 0.000 claims description 16
- 230000006698 induction Effects 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000000084 colloidal system Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Charge And Discharge Circuits For Batteries Or The Like (AREA)
Description
本發明係關於無線充電領域，尤其涉及一種無線充電電路板及其製作方法。 The present invention relates to the field of wireless charging, and in particular, to a wireless charging circuit board and a manufacturing method thereof.
先前技術中，在製作無線充電電路板時，通常由雙面厚銅板蝕刻出雙面線路製作而成或由兩片單面厚銅板蝕刻出線路後通過導電膠黏結而成，由以上製作方法形成的無線充電電路板厚度均較厚，且難以實現線路之間線距的小型化。 In the prior art, when a wireless charging circuit board is fabricated, it is usually formed by etching a double-sided line by a double-sided thick copper plate or by etching a line with two single-sided thick copper plates, and then bonding by a conductive adhesive, which is formed by the above manufacturing method. The thickness of the wireless charging circuit board is thick, and it is difficult to achieve miniaturization of the line spacing between lines.
有鑑於此，有必要提供一種厚度較小的無線充電電路板及一種無線充電電路板的製作方法。 In view of the above, it is necessary to provide a wireless charging circuit board having a small thickness and a method of fabricating a wireless charging circuit board.
一種無線充電電路板，包括第一連接端子、第二連接端子、連接線路、感應線路及樹脂。該無線充電電路板具有一上表面。該感應線路環繞該第一連接端子盤旋成螺旋狀，該第二連接端子位於該感應線路外側。該感應線路包括第一感應線路區及第二感應線路區。該第一感應線路區為該感應線路位於該第一連接端子與該第二連接端子之間的部分，該感應線路的其餘部分為第二感應線路區。該第一連接端子、該第二連接端子及該感應線路朝向該上表面的一側齊平，該第一感應線路區的厚度比該第二感應線路區 的厚度小。該連接線路位於該第一感應線路區背離該上表面的一側。該連接線路跨過該第一感應線路區以橋接該第一連接端子及該第二連接端子。該樹脂填充於該第一連接端子、該第二連接端子及該連接線路與該感應線路之間的間隙並填充於該感應線路盤旋成螺旋狀時自身所形成的間隙中。 A wireless charging circuit board includes a first connection terminal, a second connection terminal, a connection line, an induction line, and a resin. The wireless charging circuit board has an upper surface. The sensing line is spiraled around the first connection terminal, and the second connection terminal is located outside the sensing line. The sensing line includes a first sensing line area and a second sensing line area. The first sensing line region is a portion of the sensing line between the first connecting terminal and the second connecting terminal, and the remaining portion of the sensing line is a second sensing line region. The first connection terminal, the second connection terminal and a side of the sensing line facing the upper surface are flush, and the thickness of the first sensing line region is greater than the second sensing line region The thickness is small. The connection line is located on a side of the first sensing line region that faces away from the upper surface. The connecting line spans the first sensing line region to bridge the first connecting terminal and the second connecting terminal. The resin is filled in the first connection terminal, the second connection terminal, and a gap between the connection line and the sensing line, and is filled in a gap formed by the induction line when it is spiraled.
一種無線充電電路板的製作方法，包括：提供一銅板，該銅板包括第一表面及與該第一表面相背的第二表面；蝕刻該銅板的第一表面以形成與一第一連接端子、一第二連接端子及一感應線路對應的凸起圖案，對應該第一連接端子、對應該第二連接端子及對應該感應線路的凸起圖案對應該第一表面的一側齊平，對應該感應線路的凸起圖案環繞對應該第一連接端子的凸起圖案盤旋成螺旋狀，對應該第二連接端子的凸起圖案位於對應該感應線路的凸起圖案的外側；在該銅板的第一表面的一側填充樹脂；蝕刻該銅板的第二表面以形成相互獨立的該第一連接端子、該第二連接端子及該感應線路，該感應線路包括第一感應線路區及第二感應線路區，該第一感應線路區為該感應線路位於該第一連接端子及該第二連接端子之間的部分，該感應線路的其餘部分為第二感應線路區，該第一感應線路區的厚度比該第二感應線路區的厚度小；在對應該銅板的第二表面的一側形成一連接線路使該連接線路跨過該第一感應線路區以橋接該第一連接端子及該第二連接端子， 該連接線路與該感應線路絕緣；及在對應該銅板的第二表面的一側填充樹脂以形成該無線充電電路板。 A method for fabricating a wireless charging circuit board, comprising: providing a copper plate, the copper plate comprising a first surface and a second surface opposite to the first surface; etching the first surface of the copper plate to form a first connection terminal, a second connecting terminal and a convex pattern corresponding to the sensing line, corresponding to the first connecting terminal, corresponding to the second connecting terminal and corresponding to the convex pattern of the sensing line, corresponding to the side of the first surface, corresponding to The convex pattern of the sensing line is spirally spiraled around the convex pattern corresponding to the first connection terminal, and the convex pattern corresponding to the second connection terminal is located outside the convex pattern corresponding to the sensing line; the first in the copper plate One side of the surface is filled with a resin; the second surface of the copper plate is etched to form the first connection terminal, the second connection terminal and the sensing line independent of each other, and the sensing line includes a first sensing line region and a second sensing line region The first sensing line area is a portion of the sensing line between the first connecting terminal and the second connecting terminal, and the rest of the sensing line is second In the line area, the thickness of the first sensing line area is smaller than the thickness of the second sensing line area; forming a connecting line on a side corresponding to the second surface of the copper plate so that the connecting line crosses the first sensing line area Bridging the first connection terminal and the second connection terminal, The connection line is insulated from the sensing line; and a side of the second surface corresponding to the copper plate is filled with a resin to form the wireless charging circuit board.
本發明提供的該無線充電電路板及該無線充電電路板的製作方法利用一個銅板經過相背的兩個表面的蝕刻形成該第一連接端子、該第二連接端子、該第一感應線路區及該第二感應線路區，該第一連接端子、該第二連接端子及該感應線路朝向該上表面的一側齊平，且該第一感應線路區的厚度小於該第二感應線路區的厚度，而該第一感應線路區位於該第一連接端子與該第二連接端子之間，如此，便可以在該第一感應線路區背離該上表面的一側設置該連接線路，使得跨過該第一感應線路區連接該第一連接端子及該第二連接端子的該連接線路不會過多的增加厚度。因此，本發明提供的該無線充電電路板的厚度較小。 The wireless charging circuit board and the wireless charging circuit board provided by the invention form a first connecting terminal, the second connecting terminal, the first sensing line region and a copper plate through etching of opposite surfaces In the second sensing line region, the first connecting terminal, the second connecting terminal and a side of the sensing line facing the upper surface are flush, and the thickness of the first sensing line region is smaller than the thickness of the second sensing line region And the first sensing line region is located between the first connecting terminal and the second connecting terminal, so that the connecting line can be disposed on a side of the first sensing line region facing away from the upper surface, so that the The connection line connecting the first connection line region to the first connection terminal and the second connection terminal does not increase the thickness excessively. Therefore, the wireless charging circuit board provided by the present invention has a small thickness.
100‧‧‧無線充電電路板 100‧‧‧Wireless charging circuit board
101‧‧‧上表面 101‧‧‧ upper surface
10‧‧‧第一連接端子 10‧‧‧First connection terminal
20‧‧‧第二連接端子 20‧‧‧Second connection terminal
30‧‧‧感應線路 30‧‧‧Induction lines
40‧‧‧連接線路 40‧‧‧Connected lines
50‧‧‧樹脂 50‧‧‧Resin
60‧‧‧導電膠體 60‧‧‧ Conductive colloid
70‧‧‧第一保護層 70‧‧‧ first protective layer
75‧‧‧第二保護層 75‧‧‧Second protective layer
32‧‧‧第一感應線路區 32‧‧‧First sensing line area
34‧‧‧第二感應線路區 34‧‧‧Second sensing line area
80‧‧‧銅板 80‧‧‧ copper plate
82‧‧‧第一表面 82‧‧‧ first surface
84‧‧‧第二表面 84‧‧‧ second surface
39‧‧‧凹槽 39‧‧‧ Groove
13‧‧‧第一凸起圖案 13‧‧‧First raised pattern
23‧‧‧第二凸起圖案 23‧‧‧second raised pattern
33‧‧‧第三凸起圖案 33‧‧‧third raised pattern
332‧‧‧第一凸起區域 332‧‧‧First raised area
334‧‧‧第二凸起區域 334‧‧‧second raised area
圖1為本發明實施方式提供的無線充電電路板的俯視示意圖。 FIG. 1 is a schematic top view of a wireless charging circuit board according to an embodiment of the present invention.
圖2為圖1中無線充電電路板沿線II-II的剖面示意圖。 2 is a cross-sectional view of the wireless charging circuit board of FIG. 1 taken along line II-II.
圖3為圖1中無線充電電路板沿線III-III的剖面示意圖。 3 is a cross-sectional view of the wireless charging circuit board of FIG. 1 taken along line III-III.
圖4~圖8為本發明實施方式提供的無線充電電路板製作方法的示意圖。 4 to 8 are schematic diagrams showing a method of fabricating a wireless charging circuit board according to an embodiment of the present invention.
下面結合附圖將對本發明實施方式作進一步的詳細說明。 The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.
請參閱圖1~圖3，為本發明實施方式提供的一種無線充電電路板100的俯視示意圖。該無線充電電路板100包括第一連接端子10、 第二連接端子20、感應線路30、連接線路40及樹脂50。本實施方式中，該無線充電電路板100還包括導電膠體60、第一保護層70及第二保護層75。該無線充電電路板100還具有一上表面101。本實施方式中，該上表面101為該樹脂50的表面。 Please refer to FIG. 1 to FIG. 3 , which are schematic top views of a wireless charging circuit board 100 according to an embodiment of the present invention. The wireless charging circuit board 100 includes a first connection terminal 10, The second connection terminal 20, the induction line 30, the connection line 40, and the resin 50. In this embodiment, the wireless charging circuit board 100 further includes a conductive paste 60, a first protective layer 70, and a second protective layer 75. The wireless charging circuit board 100 also has an upper surface 101. In the present embodiment, the upper surface 101 is the surface of the resin 50.
請參閱圖1，該感應線路30環繞該第一連接端子10盤旋成螺旋狀，該第二連接端子20位於該感應線路30的外側。該感應線路30與該第一連接端子10及該第二連接端子20絕緣。該第一連接端子10、該第二連接端子20及該感應線路30朝向該上表面101的一側齊平。 Referring to FIG. 1 , the sensing line 30 is spirally wound around the first connecting terminal 10 , and the second connecting terminal 20 is located outside the sensing line 30 . The sensing line 30 is insulated from the first connection terminal 10 and the second connection terminal 20. The first connection terminal 10, the second connection terminal 20, and the sensing line 30 are flush toward a side of the upper surface 101.
請結合圖3，該感應線路30包括第一感應線路區32及第二感應線路區34。該第一感應線路區32為該感應線路30位於該第一連接端子10與該第二連接端子20之間的部分，該感應線路30的其餘部分為該第二感應線路區34。該第一感應線路區32的厚度小於該第二感應線路區34的厚度。本實施方式中，該第一感應線路區32與該第一連接端子10及該第二連接端子20的厚度相同，即該第一感應線路區32、該第一連接端子10及該第二連接端子20背離該上表面101的一側與該第二感應線路區34背離該上表面101的一側具有高度差。 Referring to FIG. 3, the sensing circuit 30 includes a first sensing line region 32 and a second sensing line region 34. The first sensing line region 32 is a portion of the sensing line 30 between the first connecting terminal 10 and the second connecting terminal 20, and the remaining portion of the sensing line 30 is the second sensing line region 34. The thickness of the first sensing line region 32 is less than the thickness of the second sensing line region 34. In the embodiment, the first sensing line region 32 has the same thickness as the first connecting terminal 10 and the second connecting terminal 20, that is, the first sensing line region 32, the first connecting terminal 10, and the second connection. The side of the terminal 20 facing away from the upper surface 101 has a height difference from the side of the second sensing line region 34 that faces away from the upper surface 101.
該連接線路40位於該第一感應線路區32背離該上表面101的一側。該連接線路40跨過該第一感應線路區32電性橋接該第一連接端子10及該第二連接端子20。本實施方式中，該連接線路40進一步延伸至位於該第一連接端子10及該第二連接端子20背離該上表面101的一側。另外，本實施方式中，無線充電電路板100在該第一連接端子10與該連接線路40之間及該第二連接端子20與該連接線 路40之間設置導電膠體60，由於該第一感應線路區32的厚度與該第一連接端子10及該第二連接端子20的厚度相同，且該第一感應線路區32位於該第一連接端子10與該第二連接端子20之間，如此該連接線路40能夠與該感應線路30絕緣。可以理解的是，在其它實施方式中，如果該第一連接端子10及該第二連接端子20的厚度大於該第一感應線路區32的厚度，也可以不設置該導電膠體60，而使該連接線路40直接與該第一連接端子10及該第二連接端子20背離該上表面101的一側連接或使該連接線路40直接連接該第一連接端子10與該第二連接端子20相互面對的兩側，而無需使該連接線路延伸至位於該第一連接端子10及該第二連接端子20背離該上表面101的一側。 The connection line 40 is located on a side of the first sensing line region 32 that faces away from the upper surface 101. The connecting line 40 electrically bridges the first connecting terminal 10 and the second connecting terminal 20 across the first sensing line region 32. In this embodiment, the connection line 40 further extends to a side of the first connection terminal 10 and the second connection terminal 20 that faces away from the upper surface 101. In the present embodiment, the wireless charging circuit board 100 is between the first connection terminal 10 and the connection line 40 and the second connection terminal 20 and the connection line. The conductive adhesive body 60 is disposed between the roads 40. The thickness of the first sensing circuit region 32 is the same as the thickness of the first connecting terminal 10 and the second connecting terminal 20, and the first sensing circuit region 32 is located at the first connection. Between the terminal 10 and the second connection terminal 20, the connection line 40 can be insulated from the induction line 30. It can be understood that, in other embodiments, if the thickness of the first connection terminal 10 and the second connection terminal 20 is greater than the thickness of the first sensing line region 32, the conductive paste 60 may not be disposed. The connecting line 40 is directly connected to the side of the first connecting terminal 10 and the second connecting terminal 20 facing away from the upper surface 101 or the connecting line 40 is directly connected to the first connecting terminal 10 and the second connecting terminal 20 The two sides of the pair do not need to extend the connecting line to a side of the first connecting terminal 10 and the second connecting terminal 20 facing away from the upper surface 101.
請參閱圖3，本實施方式中，該第一連接端子10、該第二連接端子20及該第一感應線路區32內的該感應線路30在沿垂直於該上表面101方向上的截面為梯形，該第二感應線路區34的該感應線路30在沿垂直於該上表面101方向上的截面為底邊相連的梯形與倒梯形。 Referring to FIG. 3, in the embodiment, the first connection terminal 10, the second connection terminal 20, and the sensing line 30 in the first sensing line region 32 are in a direction perpendicular to the upper surface 101. The trapezoidal shape, the sensing line 30 of the second sensing line region 34 has a trapezoidal and inverted trapezoidal shape with a bottom section connected in a direction perpendicular to the upper surface 101.
該樹脂50填充於該第一連接端子10、該第二連接端子20及該連接線路40與該感應線路30之間的間隙並填充於該感應線路30盤旋成螺旋狀時自身所形成的間隙中。該感應線路30與該第一連接端子10及該第二連接端子20之間通過該樹脂50絕緣，該感應線路30與該連接線路40之間也通過該樹脂50絕緣。 The resin 50 is filled in the first connection terminal 10, the second connection terminal 20, and a gap between the connection line 40 and the sensing line 30, and is filled in a gap formed by the sensing line 30 when it is spiraled. . The sensing line 30 is insulated from the first connecting terminal 10 and the second connecting terminal 20 by the resin 50, and the sensing line 30 and the connecting line 40 are also insulated by the resin 50.
該第一保護層70及該第二保護層75分別位於該無線充電電路板100的兩側且覆蓋該樹脂50。具體地，該第一保護層70覆蓋該上表面101，該第二保護層75覆蓋該樹脂50與該上表面101相背的表 面。 The first protective layer 70 and the second protective layer 75 are respectively located on both sides of the wireless charging circuit board 100 and cover the resin 50. Specifically, the first protective layer 70 covers the upper surface 101, and the second protective layer 75 covers the surface of the resin 50 opposite to the upper surface 101. surface.
請參閱圖4~圖8並結合圖3，本發明實施方式提供的製作上述無線充電電路板100的方法主要包括如下步驟。 Referring to FIG. 4 to FIG. 8 and FIG. 3, the method for manufacturing the wireless charging circuit board 100 provided by the embodiment of the present invention mainly includes the following steps.
請參閱圖4，第一步，提供一銅板80，該銅板80包括一個第一表面82及一個第二表面84。該第一表面82與該第二表面84位於該銅板80相背的兩側。 Referring to FIG. 4, in a first step, a copper plate 80 is provided. The copper plate 80 includes a first surface 82 and a second surface 84. The first surface 82 and the second surface 84 are located on opposite sides of the copper plate 80.
請參閱圖5，第二步，蝕刻該銅板80的第一表面82，以形成與該第一連接端子對應的第一凸起圖案13、與該第二連接端子對應的第二凸起圖案23及與該感應線路對應的第三凸起圖案33。該銅板80在該第一表面82的一側對應該第一凸起圖案13、該第二凸起圖案23及該第三凸起圖案33形成有凹槽39。該第一凸起圖案13、該第二凸起圖案23及該第三凸起圖案33對應該第一表面82的一側齊平。該第三凸起圖案33環繞該第一凸起圖案13盤旋成螺旋狀，該第二凸起圖案23位於盤旋成螺旋狀的該第三凸起圖案33的外側。 該第三凸起圖案33包括第一凸起區域332及第二凸起區域334。該第一凸起區域332為該第三凸起圖案33位於該第一凸起圖案13及該第二凸起圖案23之間的部分，該第三凸起圖案33的其餘部分為該第二凸起區域334。本實施方式中，該第一凸起圖案13該第二凸起圖案23及該第三凸起圖案33沿垂直於該第一表面82方向上的截面為梯形。 Referring to FIG. 5, in a second step, the first surface 82 of the copper plate 80 is etched to form a first protrusion pattern 13 corresponding to the first connection terminal, and a second protrusion pattern 23 corresponding to the second connection terminal. And a third raised pattern 33 corresponding to the sensing line. The copper plate 80 is formed with a groove 39 corresponding to the first convex pattern 13 , the second convex pattern 23 and the third convex pattern 33 on one side of the first surface 82 . The first raised pattern 13, the second raised pattern 23, and the third raised pattern 33 are flush with a side of the first surface 82. The third convex pattern 33 is spirally spiraled around the first convex pattern 13 , and the second convex pattern 23 is located outside the third convex pattern 33 spirally spiraled. The third raised pattern 33 includes a first raised area 332 and a second raised area 334. The first raised area 332 is a portion of the third raised pattern 33 between the first raised pattern 13 and the second raised pattern 23, and the remaining portion of the third raised pattern 33 is the second Raised area 334. In this embodiment, the second raised pattern 23 and the third raised pattern 33 have a trapezoidal shape in a cross section perpendicular to the first surface 82.
請參閱圖6，第三步，在該銅板80的第一表面82的一側填充樹脂50，該樹脂50填充於形成該第一凸起圖案13、該第二凸起圖案23及第三凸起圖案33時所形成的凹槽39內並使該樹脂50覆蓋該銅板80第一表面82的一側。該樹脂50對應該第一表面82的一側具有該 上表面101。本實施方式中，還進一步在該銅板80的該第一表面82的一側形成該第一保護層70。該第一保護層70在該第一表面82的一側覆蓋該樹脂50，即覆蓋該上表面101。 Referring to FIG. 6, in a third step, a resin 50 is filled on one side of the first surface 82 of the copper plate 80, and the resin 50 is filled in the first protrusion pattern 13, the second protrusion pattern 23, and the third protrusion. The groove 39 formed in the pattern 33 is formed and the resin 50 covers one side of the first surface 82 of the copper plate 80. The resin 50 has the side corresponding to the first surface 82 Upper surface 101. In the present embodiment, the first protective layer 70 is further formed on one side of the first surface 82 of the copper plate 80. The first protective layer 70 covers the resin 50 on one side of the first surface 82, that is, covers the upper surface 101.
請參閱圖7，第四步，蝕刻該銅板80的第二表面84以貫穿形成該第一凸起圖案13、該第二凸起圖案23及第三凸起圖案33時形成的凹槽39，以形成相互獨立的該第一連接端子10、該第二連接端子20及該感應線路30。該銅板80第二表面84的一側對應該第一凸起區域332在垂直於該第二表面84的方向上被部分蝕刻了。本實施方式中，該銅板80第二表面84的一側對應該第一凸起圖案13及該第二凸起圖案23在垂直於該第二表面84的方向上也被部分蝕刻了。該第一凸起區域332對應形成該感應線路30的該第一感應線路區32，該第二凸起區域334對應形成該感應線路30的該第二感應線路區34。該第一感應線路區32的厚度小於該第二感應線路區34的厚度。本實施方式中，該第一感應線路區32的厚度與該第一連接端子10及該第二連接端子20的厚度相同。具體地，該感應線路30、該第一連接端子10及該第二連接端子20對應該第一表面82的一側齊平，而該第一感應線路區32、該第一連接端子10及該第二連接端子20對應該第二表面84的一側與該第二感應線路區34對應該第二表面84的一側具有高度差。本實施方式中，該第一連接端子10、該第二連接端子20及該第一感應線路區32內的該感應線路30在沿垂直於該第一表面82方向上的截面為梯形，該第二感應線路區34的該感應線路30在沿垂直於該第一表面82方向上的截面為底邊相連的梯形與倒梯形。 Referring to FIG. 7, in a fourth step, the second surface 84 of the copper plate 80 is etched to penetrate the recess 39 formed when the first protrusion pattern 13, the second protrusion pattern 23 and the third protrusion pattern 33 are formed. The first connection terminal 10, the second connection terminal 20, and the sensing line 30 are formed independently of each other. One side of the second surface 84 of the copper plate 80 is partially etched in a direction perpendicular to the second surface 84 corresponding to the first raised region 332. In this embodiment, one side of the second surface 84 of the copper plate 80 corresponds to the first protrusion pattern 13 and the second protrusion pattern 23 is also partially etched in a direction perpendicular to the second surface 84. The first raised area 332 corresponds to the first sensing line area 32 forming the sensing line 30, and the second raised area 334 corresponds to the second sensing line area 34 forming the sensing line 30. The thickness of the first sensing line region 32 is less than the thickness of the second sensing line region 34. In the embodiment, the thickness of the first sensing line region 32 is the same as the thickness of the first connection terminal 10 and the second connection terminal 20. Specifically, the sensing circuit 30, the first connecting terminal 10 and the second connecting terminal 20 are flush with a side of the first surface 82, and the first sensing line region 32, the first connecting terminal 10, and the The second connection terminal 20 has a height difference corresponding to a side of the second surface 84 and a side of the second sensing line region 34 corresponding to the second surface 84. In this embodiment, the first connection terminal 10, the second connection terminal 20, and the sensing line 30 in the first sensing line region 32 are trapezoidal in a cross section perpendicular to the first surface 82. The sensing line 30 of the two sensing line region 34 has a trapezoidal and inverted trapezoidal shape with a bottom section connected in a direction perpendicular to the first surface 82.
請參閱圖8，第五步，在該第一連接端子10及該第二連接端子20 對應該銅板第二表面84的一側塗布該導電膠體60，並在該第一連接端子10及該第二連接端子20之間填充樹脂50。 Please refer to FIG. 8 , the fifth step, at the first connection terminal 10 and the second connection terminal 20 . The conductive paste 60 is applied to one side of the second surface 84 of the copper plate, and the resin 50 is filled between the first connection terminal 10 and the second connection terminal 20.
第六步，在對應該銅板80的第二表面84的一側形成該連接線路40，使該連接線路40跨過該第一感應線路區32橋接該第一連接端子10及該第二連接端子20，該導電膠體60電性連接在該第一連接端子10與該連接線路40及該第一連接端子10與該連接線路40之間。 In a sixth step, the connecting line 40 is formed on a side corresponding to the second surface 84 of the copper plate 80, so that the connecting line 40 bridges the first connecting terminal 10 and the second connecting terminal across the first sensing line region 32. The conductive paste 60 is electrically connected between the first connection terminal 10 and the connection line 40 and the first connection terminal 10 and the connection line 40.
可以理解的是，在蝕刻該銅板80的第二表面84時，如果使得該第一連接端子10及該第二連接端子20的厚度大於該第一感應線路區32的厚度，那麼也可以不在該第一連接端子10及該第二連接端子20對應該銅板第二表面84的一側塗布導電膠體，而在該第一連接端子10及該第二連接端子20之間填充樹脂50後形成該連接線路40而使該連接線路40直接與該第一連接端子10及該第二連接端子20連接或使該連接線路40直接連接該第一連接端子10與該第二連接端子20相互面對的兩側。 It can be understood that when the second surface 84 of the copper plate 80 is etched, if the thickness of the first connection terminal 10 and the second connection terminal 20 is made larger than the thickness of the first sensing line region 32, the The first connection terminal 10 and the second connection terminal 20 are coated with a conductive paste on a side corresponding to the second surface 84 of the copper plate, and the connection is formed after the resin 50 is filled between the first connection terminal 10 and the second connection terminal 20 The connecting line 40 is directly connected to the first connecting terminal 10 and the second connecting terminal 20 or the connecting line 40 is directly connected to the two facing the first connecting terminal 10 and the second connecting terminal 20 side.
第七步，請結合圖3，在對應該銅板80的該第二表面84的一側填充樹脂50，並在對應該銅板80的該第二表面84的一側形成該第二保護層75。該第二保護層75在該第二表面84的一側覆蓋該樹脂50。 In the seventh step, in conjunction with FIG. 3, the resin 50 is filled on one side of the second surface 84 corresponding to the copper plate 80, and the second protective layer 75 is formed on the side of the second surface 84 corresponding to the copper plate 80. The second protective layer 75 covers the resin 50 on one side of the second surface 84.
本發明實施方式提供的該無線充電電路板100及製作該無線充電電路板100的方法利用該銅板80經過相背兩個表面的蝕刻形成該第一連接端子10、該第二連接端子20、該第一感應線路區32及該第二感應線路區34，該第一連接端子10、該第二連接端子20及該感應線路30朝向該上表面101的一側(或對應該第一表面82的一側)齊平，且使得該第一感應線路區32的厚度小於該第二感應線 路區34的厚度，如此，便可以在第一感應線路區32背離該上表面101的一側(或對應該第二表面84的一側)設置該連接線路40，使得跨過該第一感應線路區32連接該第一連接端子10及該第二連接端子20的該連接線路40不會過多的增加厚度。因此，本發明實施方式提供的該無線充電電路板100的厚度較小。 The wireless charging circuit board 100 and the method for manufacturing the wireless charging circuit board 100 of the present invention form the first connecting terminal 10 and the second connecting terminal 20 by etching the copper plate 80 through opposite surfaces. The first sensing line region 32 and the second sensing circuit region 34, the first connecting terminal 10, the second connecting terminal 20 and the sensing circuit 30 face the side of the upper surface 101 (or corresponding to the first surface 82) One side) is flush, and the thickness of the first sensing line region 32 is smaller than the second sensing line The thickness of the road zone 34 is such that the connection line 40 can be disposed on the side of the first sensing line region 32 facing away from the upper surface 101 (or the side corresponding to the second surface 84) such that the first sensing is crossed The connection line 40 connecting the first connection terminal 10 and the second connection terminal 20 of the line region 32 does not increase the thickness excessively. Therefore, the wireless charging circuit board 100 provided by the embodiment of the present invention has a small thickness.
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士爰依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
100‧‧‧無線充電電路板 100‧‧‧Wireless charging circuit board
10‧‧‧第一連接端子 10‧‧‧First connection terminal
20‧‧‧第二連接端子 20‧‧‧Second connection terminal
30‧‧‧感應線路 30‧‧‧Induction lines
32‧‧‧第一感應線路區 32‧‧‧First sensing line area
34‧‧‧第二感應線路區 34‧‧‧Second sensing line area
40‧‧‧連接線路 40‧‧‧Connected lines
50‧‧‧樹脂 50‧‧‧Resin
60‧‧‧導電膠體 60‧‧‧ Conductive colloid
70‧‧‧第一保護層 70‧‧‧ first protective layer
75‧‧‧第二保護層 75‧‧‧Second protective layer
101‧‧‧上表面 101‧‧‧ upper surface
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| CN201410460208.1A CN105472862B (en) | 2014-09-11 | 2014-09-11 | The production method of wireless charging circuit plate and wireless charging circuit plate |
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| TW201611666A TW201611666A (en) | 2016-03-16 |
| TWI586227B true TWI586227B (en) | 2017-06-01 |
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| CN111405773A (en) * | 2020-03-19 | 2020-07-10 | 盐城维信电子有限公司 | Circuit board and manufacturing method thereof |
| CN119108858A (en) * | 2020-04-24 | 2024-12-10 | 东莞立讯技术有限公司 | Terminal structure and board-end connector |
| CN113692134A (en) * | 2021-08-27 | 2021-11-23 | 江门市华锐铝基板股份公司 | Etching method for thick copper wire spacing |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8133764B2 (en) * | 2007-02-14 | 2012-03-13 | Npx B.V. | Embedded inductor and method of producing thereof |
| TWM466414U (en) * | 2013-05-20 | 2013-11-21 | Unimicron Technology Corp | Wiring board |
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| JPH09286188A (en) * | 1996-04-23 | 1997-11-04 | Matsushita Electric Works Ltd | Noncontact type ic card |
| JP5078340B2 (en) * | 2006-07-26 | 2012-11-21 | 京セラ株式会社 | Coil built-in board |
| CN203339744U (en) * | 2013-05-31 | 2013-12-11 | 欣兴电子股份有限公司 | circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8133764B2 (en) * | 2007-02-14 | 2012-03-13 | Npx B.V. | Embedded inductor and method of producing thereof |
| TWM466414U (en) * | 2013-05-20 | 2013-11-21 | Unimicron Technology Corp | Wiring board |
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