TWI583748B - Circuit printing apparatus, circuit printing method and printed circuit structure - Google Patents

Description

Line printing device, line printing method, and wiring structure manufactured by printing method

The present disclosure relates to a printing apparatus, a printing method, and a structure manufactured by a printing method, and more particularly to a line printing apparatus, a line printing method, and a wiring structure manufactured by a printing method.

With the rapid development of the digital industry, Wired Board is becoming more and more widely used in digital products, such as smart phones, tablets, notebook computers, desktop computers and digital cameras. There is a circuit board, so it can be said that the circuit board has long been filled with products around our lives. Since today's circuit boards have been trending toward large typesetting and high wiring density design, both printed wiring boards and loading boards have the characteristics of high wiring density and fine line width.

In the metal fine line printing technology, compared with other common fine line printing technologies, the roll-to-roll gravure printing process is relatively easy to achieve extremely thin line width printing and excellent printing quality, and is one-step printing, which has a higher Production speed is one of the printing methods with the potential for mass production. However, the rheological properties and material particle sizes of the gravure inks required to print intaglios of different line widths vary. In such a case, if two line grooves of different line widths exist simultaneously on one intaglio plate, it is quite difficult to achieve one printing, which makes it difficult to push the vector in one printing.

The present disclosure provides a line printing apparatus and a line printing method which can print a wiring structure having two different line widths using conductive ink of the same material particle size.

The present disclosure provides a wiring structure fabricated by a printing method, the line pattern of which may have at least two different line widths.

A line printing method of the present disclosure includes the following steps. A printing cylinder is provided wherein the printing cylinder comprises a groove pattern. The groove pattern includes a first groove pattern and a second groove pattern connected to each other, wherein a first width of the first groove pattern is greater than a second width of the second groove pattern. Next, the printing cylinder is rolled on a substrate in a printing direction. The first conductive ink, the second conductive ink, and the third conductive ink blended with the first conductive ink and the second conductive ink are selectively sprayed or coated according to the groove pattern in the printing direction. In the groove pattern, wherein the first conductive ink and the second conductive ink are the same as a solid material and a solvent material, and a percentage by weight of the solvent material in the second conductive ink is greater than the solvent material in the first conductive ink One weight percent. Next, the first conductive ink, the second conductive ink, and the third conductive ink in the groove pattern are transferred onto the substrate.

A wiring structure manufactured by the printing method of the present disclosure includes a substrate and a patterned wiring layer. The patterned circuit layer is disposed on the substrate and includes a first line pattern and a second line pattern connected to each other. The patterned circuit layer is integrally formed, wherein a material of the first line pattern and the second line pattern has the same particle size, and a first width of the first line pattern is greater than a second width of the second line pattern.

A line printing device of the present disclosure includes a printing cylinder, an ink supply unit, and a control unit. The printing cylinder includes a printing surface and a groove pattern. The groove pattern is disposed on the printing surface and includes a first groove pattern and a second groove pattern connected to each other, wherein a first width of the first groove pattern is greater than a second width of the second groove pattern, The printing cylinder is adapted to roll in a printing direction. The ink supply unit is movably disposed above the printing cylinder and includes a first supply tank, a second supply tank, a blender and a discharge unit. The first supply tank houses a first conductive ink. The second feeding tank accommodates a second conductive ink, wherein the first conductive ink is the same as a solid material and a solvent material of the second conductive ink, and a weight percentage of the solvent material in the second conductive ink is greater than the solvent material One weight percent of the first conductive ink. The blender connects the first feed tank and the second feed tank, and is adapted to blend the first conductive ink and the second conductive ink into a third conductive ink. The discharge unit is connected to the blender to spray or coat the first conductive ink, the second conductive ink or the third conductive ink. The control unit is coupled to the ink supply unit to control the movement of the ink supply unit according to the groove pattern and spray or coat the first conductive ink, the second conductive ink or the third conductive ink on the groove pattern through the discharge unit.

The above described features and advantages of the present invention will be more apparent from the following description.

The foregoing and other technical features, features, and advantages of the present invention will be apparent from the Detailed Description of the Detailed Description. The directional terms mentioned in the following embodiments, such as "upper", "lower", "front", "back", "left", "right", etc., are only directions referring to the additional schema. Therefore, the directional terminology used is for the purpose of illustration and not limitation. Also, in the following embodiments, the same or similar elements will be given the same or similar reference numerals.

1 is a cross-sectional view of a line printing apparatus in accordance with an embodiment of the present disclosure. 2 is a schematic diagram of a line printing apparatus in accordance with an embodiment of the present disclosure. 3 is a schematic diagram of a scenario of a printed circuit of a line printing device in accordance with an embodiment of the present disclosure. Referring to FIG. 1 to FIG. 3 simultaneously, the line printing apparatus 100 of the present embodiment can be used to print a line structure including a printing cylinder 110, an ink supply unit 120, and a control unit 140. The printing cylinder 110 is adapted to roll in a printing direction D1 as shown in FIG. 2, and may include a printing surface 112 and a groove pattern 114 as shown in FIG. 3, wherein the groove pattern 114 is disposed on the printing surface 112 and The first groove pattern 114a and the second groove pattern 114b are connected to each other, and a first width W1 of the first groove pattern 114a is larger than the first groove pattern 114a. A second width W2 of the two groove pattern 114b. For example, the first width W1 may be substantially between about 20 micrometers (μm) and 100 micrometers, and the second width W2 may be substantially between about 1 micrometer and 10 micrometers. Of course, this embodiment only By way of example, the disclosure does not specifically limit the width range of the groove pattern.

4 is a partially enlarged schematic view of a groove pattern in accordance with an embodiment of the present disclosure. Referring to FIG. 4 , in detail, the groove pattern 114 further includes a transition groove pattern 114c connected between the first groove pattern 114a and the second groove pattern 114b. The transition groove pattern 114c includes an opposite first end E1 and a second end E2. The first end E1 is connected to the first groove pattern 114a, the second end E2 is connected to the second groove pattern 114b, and the transition groove pattern 114c is The three width W3 is between the first width W1 and the second width W2. Furthermore, the third width W3 of the transition groove pattern 114c may be reduced from the first end E1 to the second end E2.

In the present embodiment, the ink supply unit 120 is movably disposed above the printing cylinder 110 as shown in FIG. In detail, the ink supply unit 120 may move in the ink supply direction D2 perpendicular to the printing direction D1 in addition to the movement of the printing cylinder 110 in the printing direction D1. The ink supply unit 120 can include a first supply tank 122, a second supply tank 124, a blender 126, and a discharge unit 128 as shown in FIG. The first supply tank 122 houses a first conductive ink I1. The second feeding tank 124 accommodates a second conductive ink I2, wherein the first conductive ink I1 and the second conductive ink I2 have the same solid material and solvent material, and the solvent material in the second conductive ink I2 is greater than the solvent. The weight percentage of the material in the first conductive ink I1. That is, the composition of the solid material in the first conductive ink I1 is the same as the composition of the solid material in the second conductive ink I2, and the composition of the solvent material in the first conductive ink I1 and the composition of the solvent material in the second conductive ink I2 are also The same, except that the solvent material in the second conductive ink I2 accounts for a large proportion.

For example, the materials of the first conductive ink I1 and the second conductive ink I2 are the same, and the solid material thereof may include silver or copper, and the solid materials thereof have the same particle diameter. Further, the particle diameter of the solid material in the first conductive ink I1 and the second conductive ink I2 may be substantially between about 0.2 μm and 1 μm. In this embodiment, the first conductive ink I1 accommodated in the first supply tank 122 may be a thick or undiluted conductive ink, and the second conductive tank 124 receives the second conductive Ink I2 can be a conductive ink diluted by a solvent material. For example, the weight percentage of the solvent material in the second conductive ink I2 may be different from the weight percentage of the solvent material in the first conductive ink I1 by about 2.5 to 5 wt%. Of course, this embodiment is only for exemplification, and the disclosure Not limited to this.

In the above, the blender 126 is connected to the first supply tank 122 and the second supply tank 124, and is configured to blend the thicker first conductive ink I1 and the diluted second conductive ink I2 into a third conductive ink. I3. In this embodiment, the blender 126 may include a stirring unit, a heating unit, a vibration unit, a gas pressure control unit, or any combination thereof, to reconcile the first conductive ink I1 and the first through stirring, heating, vibration, and the like. Two conductive inks I2. The discharging unit 128 is connected to the blender 126 to spray or apply the first conductive ink I1, the second conductive ink I2 or the blended third conductive ink I3 onto the printing cylinder 110. The control unit 140 is coupled to the ink supply unit 120 to control the movement of the ink supply unit 120 according to the groove pattern 114 of the printing cylinder 110, and to pass the first conductive ink I1, the second conductive ink I2 or the third conductive through the discharging unit 128. The ink I3 is sprayed or coated on the groove pattern 114.

In detail, the line printing device 100 further includes a scraper module 130 as shown in FIG. 1 , which is disposed on the printing cylinder 110 and is in contact with the printing surface 112 to be rolled when the printing cylinder 110 rolls in the printing direction D1. The first conductive ink I1, the second conductive ink I2, or the third conductive ink I3 is uniformly applied in the groove pattern 114 by sliding over the printing surface 112. Further, the blade module 130 can include a first blade 132 and a second blade 134 as shown in FIG. 1 , wherein the first blade 132 is located between the ink supply unit 120 and the second blade 134 to A conductive ink I1, a second conductive ink I2 or a third conductive ink I3 is coated in the groove pattern 114, and the second blade 134 is configured to scrape off the first conductive ink I1 located outside the groove pattern 114. Two conductive inks I2 or third conductive inks I3.

FIG. 5 is a top plan view of a printing cylinder in accordance with an embodiment of the present disclosure. 6 is a top plan view of a printing cylinder coated conductive ink in accordance with an embodiment of the present disclosure. Referring to FIG. 5 and FIG. 6 simultaneously, as described above, the method for printing a line by using the above-described line printing apparatus 100 may, for example, first provide the aforementioned printing cylinder 110, and let the printing cylinder 110 be on a substrate in the printing direction D1. scroll. As the printing cylinder 110 moves in the printing direction D1, the control unit 140 controls the movement rate or movement trajectory of the ink supply unit 120 in accordance with the scrolling rate of the printing cylinder 110 rolling in the printing direction D1 and the distribution position of the groove pattern 114. For example, the thin dotted line area of FIG. 5 may be an area to be transferred onto the substrate, and the groove pattern 114 is distributed thereon, and the control unit 140 may depend on the rolling rate of the printing cylinder 110 and the distribution position of the groove pattern 114. The ink supply unit 120 is controlled to move in the direction of the arrow in FIG. 5 to spray or coat the first conductive ink I1, the second conductive ink I2 or the third conductive ink I3 on the groove pattern 114.

It should be noted that the thick broken line in FIG. 5 may be a route in which the ink supply unit 120 moves only without supplying ink. Moreover, the control unit 140 can control the ink supply unit 120 to spray or apply the first conductive ink I1, the second conductive ink I2 or the third conductive ink I3 on the groove pattern 114 according to the width of the groove pattern 114. For example, the line width of the edge region of the substrate (the range enclosed by the thin broken line in FIG. 5) is relatively thick, so the control unit 140 can control the ink supply unit 120 to spray or coat the first conductive ink I1. The groove pattern 114 of the edge region of the substrate. The line width of the central portion of the substrate is relatively thin, so the control unit 140 can control the ink supply unit 120 to spray or coat the second conductive ink I2 on the groove pattern 114 located in the central region of the substrate.

Thereafter, the first doctor blade 132 smoothly passes over the printing surface 112 of the printing cylinder 110 to uniformly apply the first conductive ink I1, the second conductive ink I2 or the third conductive ink I3 to the printing surface as shown in FIG. 112 and the groove pattern 114, after which the second blade 134 is further drawn across the printing surface 112 to scrape off the first conductive ink I1, the second conductive ink I2 or the third conductive ink I3 located outside the groove pattern 114. . Thus, as the printing cylinder 110 rolls on the substrate along the printing direction D1, the first conductive ink I1, the second conductive ink I2 or the third conductive ink I3 in the groove pattern 114 can be transferred onto the substrate. A wiring structure corresponding to the groove pattern 114 is formed on the substrate.

In this embodiment, the control unit 140 selectively sprays or applies the first conductive ink I1, the second conductive ink I2 or the third conductive ink I3 to the groove according to the width of the groove pattern 114 on the printing cylinder 110. On the pattern 114. For example, the control unit 140 may select to spray or apply the thicker first conductive ink I1 on the first groove pattern 114a having a wider width, and spray or coat the adjusted third conductive ink I3 on the width. Between the intermediate transition groove pattern 114c, and spraying or coating the thinner second conductive ink I2 or the third conductive ink I3 modulating the second conductive ink I2 into the second groove having a narrow width On the pattern 114b. The present embodiment is for illustrative purposes only, and the disclosure is not limited thereto. In other embodiments, the control unit 140 may also spray the third conductive ink I3, which has a larger proportion of the first conductive ink I1, onto the first groove pattern 114a having a wider width, and the second conductive ink I2 may be blended. The third conductive ink I3 having a larger proportion is sprayed on the second groove pattern 114b having a narrower width. The control unit 140 can control the supply amount of the first conductive ink I1 and the supply amount of the second conductive ink I2 according to the width of the groove pattern 114 to adjust the provided first conductive ink I1 and the second conductive ink I2 to make out The material unit 128 can spray or coat a third conductive ink I3 of a suitable thickness. In short, the supply amount of the second conductive ink I2 increases as the width of the groove pattern 114 decreases. In this manner, the line printing device 100 can smoothly adjust the conductive ink to an appropriate consistency by using the transition groove pattern 114c connected between the first groove pattern 114a and the second groove pattern 114b.

7 to FIG. 9 are schematic diagrams showing changes in rheological properties and printing quality of a conductive ink provided by a conventional ink supply unit and an ink supply unit of the present embodiment, wherein the vertical axes of FIGS. 7 and 8 are printed by conductive ink. The line width is shown, and the vertical axis of Fig. 9 is the resistance value of the conductive ink, and the horizontal axis of Figs. 7 to 9 represents the number of sheets printed. It should be noted that FIG. 7 is a line width actually printed when the conductive ink is used to print a wide-width line such as a line located in an edge region of the substrate. In this embodiment, the predetermined print line width is between about 24 microns and 30 microns. It can be seen from Fig. 7 that as the number of printed sheets increases, the solvent in the conductive ink gradually evaporates to increase the consistency. Therefore, in the prior art, the line width printed by using only the original conductive ink increases with the number of printed sheets. It gradually decreases and gradually falls below the requirement of the predetermined print line width. In contrast, the conductive ink provided by the ink supply unit 120 of the present embodiment controls the consistency and rheological properties thereof by modulating it with the relatively thin second conductive ink I2. Therefore, the ink supply unit 120 of the present embodiment. The printed line width does not change significantly as the number of printed sheets increases. Therefore, the line printing apparatus 100 of the present embodiment can effectively maintain the stability of printing quality.

Similarly, FIG. 8 is a line width actually printed when a conductive ink is used to print a narrow-width line such as a touch line located in a central region of the substrate. In this embodiment, the predetermined print line width is between about 4 microns and 6 microns. As can be seen from Fig. 8, in the prior art, the line width printed by using only the original conductive ink is also gradually decreased as the number of printed sheets is increased, and is gradually lower than the predetermined printing line width. In contrast, the conductive ink provided by the ink supply unit 120 of the present embodiment is printed by the ink supply unit 120 of the present embodiment because it is permeable to the thinner second conductive ink I2 to control its consistency and rheological properties. The line width that comes out does not change significantly as the number of printed sheets increases. In addition, as can be seen from FIG. 9, as the number of printed sheets increases, the resistance of the printed circuit of the conventional conductive ink also increases greatly, and the resistance of the line printed by the ink supply unit 120 of the present embodiment is reflected. It is very stable. Therefore, the line printing apparatus 100 of the present embodiment has stable and good printing quality and electrical performance regardless of whether it is a printed wide line or a thin line.

Table 1 below shows the change in viscosity of the conventional conductive ink and the conductive ink provided by the ink supply unit 120 of the present embodiment. As can be seen from Table 1, the viscosity of the conventional conductive ink increased by 54.7% per hour, and the viscosity of the conductive ink provided by the ink supply unit 120 of the present embodiment increased only slightly by 8.9% per hour. Therefore, the line printing apparatus 100 of the present embodiment can effectively control the rheological characteristics and printing quality of the conductive ink. Table 1         <TABLE border="1" borderColor="#000000" width="_0002"><TBODY><tr><td> Conductive Ink</td><td> η_initial</td> <td> η_final</td></tr><tr><td> Conventional Conductive Ink</td><td> 528.8pa∙s </td><td> 1180pa∙s(+54.7%/hr) </td></tr><tr><td> Conductive ink blended with 5wt.% solvent</td><td> 648.0pa∙s </td><td> 777.6pa∙s(+8.9%/hr) </td></tr></TBODY></TABLE>

Therefore, the control unit 140 of the present embodiment can freely dispense a suitable concentration of conductive ink according to the width of the groove pattern 114 for printing, thereby preventing the conductive ink from being too thick and causing the ink to dry prematurely in the groove pattern 114. The problem of disconnection or uneven linearity can also avoid the problem that the conductive ink is too thin and the printed line width is too wide to cause a short circuit, and the printing flaw caused by the easy overflow of the ink can be avoided. Therefore, the present disclosure can effectively achieve one-time printing, simplify the process steps of line printing, and effectively improve the process yield and printing quality of the line.

FIG. 10 is a partial top plan view of a line structure in accordance with an embodiment of the present disclosure. 11 is a partial cross-sectional view of a line structure in accordance with an embodiment of the present disclosure. Referring to FIG. 10 and FIG. 11 simultaneously, the circuit structure 200 manufactured by the above printing method may include a substrate 210 and a patterned circuit layer 220 as shown in FIG. The patterned circuit layer 220 is disposed on the substrate 210 and includes a first line pattern 222 and a second line pattern 224 connected to each other. The patterned circuit layer 220 is integrally formed, that is, the patterned circuit layer 220 is formed by one-time transfer of the printing roller 110, wherein the materials of the first line pattern 222 and the second line pattern 224 are the same, and the material The particle size is also the same. Specifically, the material diameter of the first line pattern 222 and the second line pattern 224 may be substantially between about 0.2 micrometers and 1 micrometer. The first line pattern 222 and the second line pattern 224 respectively correspond to the first groove pattern 114a and the second groove pattern 114b. Therefore, the first width W1 of the first line pattern 222 is also larger than the second line pattern. The second width W2 of 224.

In addition, since the material diameters of the conductive inks for printing the thicker lines and the thinner lines are the same, the surface roughness of the line structure printed in this embodiment can be relatively smooth. Specifically. The surface roughness of the first line pattern 222 may be substantially between about 1.5 microns and 3 microns, and the surface roughness of the second line second line pattern may be substantially less than or equal to 1 micron.

In detail, the patterned circuit layer 220 further includes a transition line pattern 226 connected between the first line pattern 222 and the second line pattern 224. The transition line pattern 226 is the same as the material of the first line pattern 222 and the second line pattern 224 and the material particle diameter thereof. Moreover, the transition line pattern 226 includes opposite first ends and second ends. The first end is connected to the first line pattern 222, the second end is connected to the second line pattern 224, and the width of the transition line pattern 226 is from the first end to the first end. The two ends are reduced, and the minimum width of the transition line pattern 226 is greater than or equal to the second width W2, and the maximum width of the transition line pattern 226 is less than or equal to the second width W2. Further, the surface roughness of the transition line pattern 226 may be substantially between about 1 micrometer and 1.5 micrometers.

In this embodiment, the second line pattern 224 may include a plurality of grid electrodes as shown in FIG. 10, which may be, for example, a touch line of the central region R2 of the substrate 210, and the first line pattern 222 is disposed on the substrate. The peripheral region R1 of 210 is connected to the second line pattern 224 as a connection line of the peripheral region R1 of the substrate. The transition line pattern 226 is then connected between the first line pattern 222 and the second line pattern 224. In addition, as can be seen from FIG. 11, the line width of the patterned wiring layer 220 is gradually reduced by the first line pattern 222, the transition line pattern 226, and the second line pattern 224, and is formed by the first line pattern 222 and the second line. The cross-section of the pattern 224 and the transition line pattern 226 shows that the first line pattern 222, the second line pattern 224, and the intersection of the top surface of the transition line pattern 226 and the corresponding side surface are in a lead angle (arc shape), and The angle between the bottom surface of the line pattern 222, the second line pattern 224, and the transition line pattern 226 and the corresponding side surface is an acute angle.

In summary, the line printing device and the line printing method of the present disclosure can freely dispense a suitable concentration of conductive ink for printing according to the width of the groove pattern on the printing roller, and thus can be printed through a one-time printing process. A line structure having at least two different line widths. Moreover, the circuit structure of the present disclosure can avoid the problem that the conductive ink is too thick to cause disconnection or linearity unevenness, and can avoid the problem that the conductive ink is too thin and the printed line width is too wide to cause a short circuit, and the ink can be easily avoided. Printing defects caused by overflow. Therefore, the present disclosure can effectively achieve one-time printing, simplify the process steps of line printing, and effectively improve the process yield and printing quality of the line.

The present disclosure has been disclosed in the above embodiments, but it is not intended to limit the disclosure, and any person skilled in the art can make some changes and refinements without departing from the spirit and scope of the disclosure. The scope of protection of this disclosure is subject to the definition of the scope of the appended claims.

100‧‧‧Line printing device
110‧‧‧Printing roller
112‧‧‧Printed surface
114‧‧‧ Groove pattern
114a‧‧‧First groove pattern
114b‧‧‧second groove pattern
114c‧‧‧Transition groove pattern
120‧‧‧ ink supply unit
122‧‧‧First feed trough
124‧‧‧Second feed trough
126‧‧‧Conditioner
128‧‧‧Drawing unit
140‧‧‧Control unit
130‧‧‧ scraper module
132‧‧‧First scraper
134‧‧‧second scraper
200‧‧‧Line structure
210‧‧‧Substrate
220‧‧‧ patterned circuit layer
222‧‧‧First line pattern
224‧‧‧second line pattern
226‧‧‧Transition line pattern
D1‧‧‧Printing direction
D2‧‧‧Ink supply direction
E1‧‧‧ first end
E2‧‧‧ second end
I1‧‧‧First conductive ink
I2‧‧‧Second conductive ink
I3‧‧‧third conductive ink
R2‧‧‧Central Area
R1‧‧‧ Peripheral area
W1‧‧‧ first width
W2‧‧‧ second width
W3‧‧‧ second width

1 is a cross-sectional view of a line printing apparatus in accordance with an embodiment of the present disclosure. 2 is a schematic diagram of a line printing apparatus in accordance with an embodiment of the present disclosure. 3 is a schematic diagram of a scenario of a printed circuit of a line printing device in accordance with an embodiment of the present disclosure. 4 is a partially enlarged schematic view of a groove pattern in accordance with an embodiment of the present disclosure. FIG. 5 is a top plan view of a printing cylinder in accordance with an embodiment of the present disclosure. 6 is a top plan view of a printing cylinder coated conductive ink in accordance with an embodiment of the present disclosure. 7 to 9 are schematic diagrams showing changes in rheological properties and printing quality of a conductive ink provided by a conventional ink supply unit and the ink supply unit of the present embodiment. FIG. 10 is a partial top plan view of a line structure in accordance with an embodiment of the present disclosure. 11 is a partial cross-sectional view of a line structure in accordance with an embodiment of the present disclosure.

110‧‧‧Printing roller

112‧‧‧Printed surface

114‧‧‧ Groove pattern

114a‧‧‧First groove pattern

114b‧‧‧second groove pattern

114c‧‧‧Transition groove pattern

120‧‧‧ ink supply unit

122‧‧‧First feed trough

124‧‧‧Second feed trough

126‧‧‧Conditioner

128‧‧‧Drawing unit

222‧‧‧First line pattern

224‧‧‧second line pattern

226‧‧‧Transition line pattern

I1‧‧‧First conductive ink

I2‧‧‧Second conductive ink

W1‧‧‧ first width

W2‧‧‧ second width

W3‧‧‧ second width

Claims (27)

A circuit printing method comprising: providing a printing cylinder, wherein the printing cylinder comprises a groove pattern comprising a first groove pattern and a second groove pattern connected to each other, wherein the first groove pattern a first width of the pattern is greater than a second width of the second groove pattern; the printing cylinder is rolled on a substrate along a printing direction; and the printing cylinder is moved along the printing direction and selected according to the groove pattern Optionally spraying or coating a first conductive ink, a second conductive ink or a third conductive ink blended by the first conductive ink and the second conductive ink onto the groove pattern, wherein the first The conductive ink is the same as a solid material and a solvent material in the second conductive ink, and a weight percentage of the solvent material in the second conductive ink is greater than a weight percentage of the solvent material in the first conductive ink; And transferring the first conductive ink, the second conductive ink or the third conductive ink in the groove pattern onto the substrate. The line printing method of claim 1, wherein the first conductive ink, the second conductive ink, and the third conductive ink are selectively sprayed or applied to the groove according to the width of the groove pattern. The step of patterning further comprises: spraying or coating the first conductive ink on the first groove pattern, and spraying or coating the second conductive ink or the third conductive ink on the second groove pattern. The line printing method of claim 1, wherein the weight percentage of the solvent material in the second conductive ink differs from the weight percentage of the solvent material in the first conductive ink by 2.5 to 5 wt%. The method of line printing according to claim 1, wherein the method of tempering the first conductive ink and the second conductive ink comprises stirring, heating and/or vibrating the first conductive ink and the second conductive ink. The line printing method of claim 1, wherein the first conductive ink, the second conductive ink, and the third conductive ink are selectively sprayed or applied to the groove according to the width of the groove pattern. The step of patterning further comprises: controlling a discharge unit for spraying or coating the first conductive ink, the second conductive ink and the third conductive ink according to a rolling rate of the printing cylinder and a distribution position of the groove pattern A moving rate or a moving trajectory. The circuit printing method of claim 1, further comprising: removing the first conductive ink, the second conductive ink, and the third conductive ink that are located on the printing cylinder outside the groove pattern. The line printing method of claim 1, wherein the first width is substantially between 20 micrometers and 100 micrometers, and the second width is substantially between 1 micrometer and 10 micrometers. The line printing method according to claim 1, wherein the solid material of the first conductive ink and the second conductive ink has the same particle diameter. The line printing method according to claim 1, wherein the solid material of the first conductive ink and the second conductive ink has a particle diameter substantially between 0.2 μm and 1 μm. The line printing method of claim 1, wherein the groove pattern further comprises a transition groove pattern connected between the first groove pattern and the second groove pattern. The circuit printing method of claim 10, wherein the transition groove pattern comprises a first end and a second end, the first end is connected to the first groove pattern, and the second end is connected The second groove pattern, and a width of the transition groove pattern is reduced from the first end to the second end. The line printing method of claim 10, wherein the first conductive ink, the second conductive ink, and the third conductive ink are selectively sprayed or applied to the groove according to the width of the groove pattern. The step of patterning further comprises: spraying or coating the third conductive ink on the transition groove pattern. The method of claim 10, wherein the method of modulating the first conductive ink and the second conductive ink further comprises: controlling a supply amount of the first conductive ink according to a width of the groove pattern; The second conductive ink is provided in an amount to reconcile the first conductive ink and the second conductive ink. The line printing method according to claim 13, wherein the supply amount of the second conductive ink increases as the width of the groove pattern decreases. A circuit structure manufactured by a printing method, comprising: a substrate; and a patterned circuit layer disposed on the substrate and including a first line pattern and a second line pattern connected to each other, the patterned circuit layer is The first line pattern and the second line pattern have the same material particle size, and a first width of the first line pattern is greater than a second width of the second line pattern. The circuit structure of claim 15, wherein the first width is substantially between 20 micrometers (μm) and 100 micrometers, and the second width is substantially between 1 micrometer and 10 micrometers. The circuit structure of claim 15, wherein the first line pattern and the second line pattern are the same material. The line structure of claim 15, wherein the material has a particle size substantially between 0.2 microns and 1 micron. The circuit structure of claim 15, wherein a surface roughness of the first line pattern is substantially between 1.5 micrometers and 3 micrometers, and a surface roughness of the second line pattern is substantially less than or Equal to 1 micron. The circuit structure of claim 15, wherein the patterned circuit layer further comprises a transition line pattern connected between the first line pattern and the second line pattern. The circuit structure of claim 20, wherein the transition line pattern is the same as the material of the first line pattern and the second line pattern and the material particle diameter thereof. The circuit structure of claim 20, wherein the transition line pattern comprises an opposite first end and a second end, the first end is connected to the first line pattern, and the second end is connected to the second line a line pattern, and a width of the transition line pattern is reduced from the first end to the second end. The circuit structure of claim 20, wherein a surface roughness of the transition line pattern is substantially between 1 micrometer and 1.5 micrometers. The circuit structure of claim 20, wherein a minimum width of the transition line pattern is greater than or equal to the second width and a maximum width of the transition line pattern is less than or equal to the second width. The circuit structure of claim 20, wherein the first line pattern, the second line pattern, and a cross section of the transition line pattern, the first line pattern, the second line pattern, and the transition line pattern The intersection of the top surface and the corresponding side surface is a lead angle, and the angle between the first line pattern, the second line pattern and the bottom surface of the transition line pattern and the corresponding side surface thereof are all acute angles. The circuit structure of claim 15, wherein the second line pattern comprises a plurality of grid electrodes, the first line pattern being disposed in a peripheral region of the substrate and connected to the second line pattern. A line printing device comprising: a printing cylinder comprising a printing surface and a groove pattern disposed on the printing surface and comprising a first groove pattern and a second groove pattern connected to each other, Wherein a first width of the first groove pattern is greater than a second width of the second groove pattern, the printing cylinder is adapted to roll in a printing direction; an ink supply unit movably disposed above the printing cylinder And comprising: a first supply tank for accommodating a first conductive ink; a second supply tank for accommodating a second conductive ink, wherein the first conductive ink and a solid material of the second conductive ink a solvent material is the same, and a weight percentage of the solvent material in the second conductive ink is greater than a weight percentage of the solvent material in the first conductive ink; a blender connecting the first feed tank and the first a feed tank configured to blend the first conductive ink and the second conductive ink into a third conductive ink; and a discharge unit connected to the blender to spray or coat the first conductive An ink, the second conductive ink or the third conductive ink; and a control unit coupled to the ink supply unit to control the movement of the ink supply unit according to the groove pattern and spray or coat the first conductive material through the discharge unit The ink, the second conductive ink or the third conductive ink is on the groove pattern.