TWI582367B - A hot plate and a method for manufacturing the same - Google Patents

Description

Soaking plate and manufacturing method thereof

The present invention relates to an element for heat dissipation, and more particularly to a thin heat equalizing plate having a loop type capillary groove therein and a method of manufacturing the same.

The heat equalizing plate is a commonly used heat conducting element that utilizes the principles of heat conduction and phase change to achieve heat dissipation. Generally, the soaking plate is formed of a material having a high thermal conductivity such as metal, and a vacuum closed chamber is disposed therein, and a working fluid is disposed in the cavity. The vacuum state in the cavity causes the boiling point of the working fluid in the cavity to decrease. Therefore, when a point of the soaking plate is heated, the liquid in the cavity will quickly evaporate into vapor, and the vapor will be from the soaking plate under a slight pressure difference. The hot spot flows to other locations. The vapor releases heat and recondenses into a liquid after flowing to the unheated cooling position of the soaking plate, and is returned to the heated end of the soaking plate by capillary action along the capillary structure in the cavity. Through the circulating convection of the working fluid between the heated end and the cooling end of the soaking plate, the soaking plate can transfer heat from one end to the other end, so that the surface exhibits a fast uniform temperature characteristic and achieves the purpose of heat transfer.

With the advancement of technology, the size of devices such as smart phones and laptops, which are hot plates, is getting smaller and smaller. Therefore, the demand for thin heat spreaders in the industry has also increased. Most of the conventional soaking plates are formed by flattening the tubes, and thus cannot be applied to designs with large heat dissipation areas or high power requirements.

Based on the above reasons, an object of the present invention is to provide a heat equalizing plate which can improve the heat transfer performance of the heat equalizing plate as a whole by the internal multi-circuit type capillary structure, and achieve self-adjusting function, and can be applied to a multi-heat source heat dissipation design. .

Another object of the present invention is to provide a heat equalizing plate which can be applied to a large heat dissipating area and a large size by increasing the area size of the entire heat equalizing plate and the number of closed loops formed by the internal capillary structure. The design of heat dissipation power requirements.

In order to achieve the foregoing object, the present invention provides a heat equalizing plate comprising: an upper cover metal plate having a cover recess on one surface thereof; and a lower cover metal plate having a surface corresponding to the upper cover groove a cover groove, wherein a bottom surface of the lower cover groove is provided with at least two capillary grooves, and the two capillary grooves communicate with each other at opposite ends of the lower cover groove to form at least one first closed circuit . Wherein, the upper cover metal plate and the lower cover metal plate are fixed to each other such that the upper cover groove, the lower cover groove and the capillary grooves form a vacuum chamber for accommodating a working fluid. There is a wall between each two capillary grooves in the lower cover metal plate, and each of the partition walls is provided with at least a lower support structure. In addition, at least one upper support structure corresponding to at least the lower support structure is disposed in the upper cover groove of the upper cover metal plate. When the upper cover metal plate and the lower cover metal plate are fixed to each other, the at least one lower support structure and the at least one upper support structure are in contact with each other.

According to an embodiment of the invention, the heat equalizing plate further comprises a capillary structure composed of a metal mesh. The capillary structure is disposed in the lower cover groove to cover the capillary grooves. The capillary structure is provided with at least one perforation corresponding to the at least one upper support structure and at least the lower support structure and is located between the upper cover groove and the capillary grooves.

According to an embodiment of the invention, the upper cover metal plate and the lower cover metal plate are fixed to each other by thermal diffusion bonding.

According to an embodiment of the invention, the thickness of the upper cover metal plate and the lower cover metal plate is 0.15 mm-0.5 mm, and the overall thickness of the heat equalization plate is between 0.3 mm and 1.0 mm, and each of the capillary grooves The width of the cover is between 0.045 mm and 0.055 mm, and the overall thickness of the cover (without the groove) is between 0.08 and 0.2 mm, and the groove height is between 0.015 and 0.05 mm.

According to an embodiment of the present invention, each of the capillary grooves is further provided with at least two second capillary grooves, and the second capillary grooves communicate with each other at both ends of the capillary groove, and are formed At least one second closed loop.

It is still another object of the present invention to provide a manufacturing method which can automate and mass-produce the above-described soaking plate.

In order to achieve the above object, the present invention provides a method for manufacturing a heat equalizing plate, comprising the steps of: preparing a first metal substrate having a flat surface and a second metal substrate; and forming a groove, Forming a plurality of groove groups and a first closed circuit corresponding to each other on a surface of the first metal substrate and the second metal substrate, wherein each groove group includes a plurality of support structures; a groove formation a method of forming at least two trenches in each of the groove groups of the second metal substrate, and at least two trenches are connected to each other at opposite ends of each of the groove groups to be in each of the groove groups Forming at least one second closed loop, wherein a wall is formed between each of the two trenches, the support structures are distributed on the partition walls; a bonding step, the first metal substrate and the second After the groove groups of the metal substrate are aligned facing each other, the first metal substrate and the second metal substrate are fixed to each other by thermal diffusion bonding; and a cutting step is performed to fix the bonding. First metal And a second metal sheet The substrate is cut along the shape of the groove group into a plurality of tubes having an injection port; a vacuum injecting step, after injecting a working fluid into each of the tubes from the inlet, the tubes are The body is evacuated; and a mouth step is performed to seal each of the tubes that are evacuated from the injection port to form a plurality of soaking plates.

According to an embodiment of the invention, the method of manufacturing a heat spreader further includes a capillary structure setting step. In the capillary structure setting step, a plurality of capillary structures composed of a metal mesh material are prepared, each of the capillary structures having a shape corresponding to each groove group, and each of the capillary structures is provided with A plurality of perforations corresponding to the support structures, and each of the capillary structures is laid in each of the groove sets of the second metal substrate. The capillary structure setting step is performed after the groove forming step.

According to an embodiment of the invention, the groove forming step further comprises the step of: applying a mask to a surface of the first metal substrate and the second metal substrate through a mask having a plurality of hollow portions Coating a photoresist layer; and, in an etching step, etching the first metal substrate and the second metal substrate to respectively not coat the photoresist layer on the first metal substrate and the second metal substrate The portions form the set of grooves.

According to an embodiment of the invention, the soaking plate manufacturing method further includes a cutting step. In the cutting step, a bottom surface of each of the groove groups is cut into a flat surface by using a computer numerical control (CNC) machine tool, wherein the cutting step is in the groove forming step. After execution.

According to an embodiment of the invention, the trench forming step further comprises the step of: embossing the second metal substrate through an embossing head to emboss each groove group of the second metal substrate a photoresist layer is formed on the bottom surface of the bottom portion; and an etching step is performed to etch the second metal substrate to be on the second metal substrate The portions not coated with the photoresist layer form the trenches and the first closed loop.

According to an embodiment of the invention, the soaking plate manufacturing method performs the pin cutting step, the imprinting step, and the etching step again after the trench forming step is completed, to each of the trenches in the group of grooves At least two second grooves are formed on the bottom surface of the person. Wherein at least two second trenches are in communication with each other at opposite ends of each of the trenches and form at least one second closed loop.

According to an embodiment of the invention, the method of manufacturing a heat spreader further includes a cleaning step of cleaning all of the photoresist layers on the first metal substrate and the second metal substrate. Wherein the washing step is performed before the bonding step.

1‧‧‧Overlay metal plate

1a‧‧‧First metal substrate

11‧‧‧ Cover groove

11a‧‧‧ Groove group

151‧‧‧Upper support structure

2‧‧‧Under the metal sheet

2a‧‧‧Second metal substrate

21‧‧‧Under the groove

21a‧‧‧ Groove group

22‧‧‧Capillary grooves

23‧‧‧Second capillary groove

25‧‧‧ partition

251‧‧‧lower support structure

3‧‧‧Capillary structure

351‧‧‧Perforation

4‧‧‧ tube body

41‧‧‧Injection

5‧‧‧Indentation head

51‧‧‧Indentation Department

52‧‧‧Protruding

T1, T2‧‧‧ thickness

R, R2‧‧‧ photoresist layer

S11‧‧‧Preparation steps

S12‧‧‧ Groove forming steps

S121‧‧‧ Coating step

S122‧‧‧One etching step

S13‧‧‧ trench forming steps

S131‧‧‧ cutting steps

S132‧‧‧ Imprinting step

S133‧‧‧Secondary etching step

S14‧‧‧ cleaning steps

S15‧‧‧Capillary structure setting steps

S16‧‧‧ bonding step

S17‧‧‧ cutting steps

S18‧‧‧Vacuum injection step

S19‧‧‧ Sealing steps

1 is an exploded perspective view showing a heat equalizing plate according to a first embodiment of the present invention; and FIG. 2 is a plan view showing a lower cover metal plate of a heat equalizing plate according to a first embodiment of the present invention; A cross-sectional view of the cover metal plate along the AA cross-sectional line in the second figure; the third B is a cross-sectional view of the cover metal plate below the BB cross-sectional view in the second figure; and the fourth A is a view according to the present invention. A transverse cross-sectional view of the soaking plate of the first embodiment at a cross-sectional line AA in the second drawing; and a fourth B-figure showing a lateral view of the soaking plate according to the first embodiment of the present invention at a section BB of the second figure 5A is a transverse cross-sectional view showing a heat equalizing plate according to a second embodiment of the present invention at a cross-sectional line AA in the second figure; and FIG. 5B is a view showing a second embodiment according to the present invention; Hot plate in the second picture a transverse cross-sectional view at the B-B section line; The sixth drawing is a flow chart for the production of the soaking plate of the present invention; and the seventh to seventh Lth drawings are schematic diagrams showing the manufacturing process of the soaking plate of the present invention.

The embodiments of the present invention will be described in more detail below with reference to the drawings and the <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt;

The first figure is an exploded perspective view showing a heat equalizing plate according to a first embodiment of the present invention. As shown in the first figure, the heat equalizing plate according to the first embodiment of the present invention mainly comprises: an upper cover metal plate 1, a lower cover metal plate 2, and a capillary structure 3.

As shown in the first figure, an upper cover recess 11 is provided on a surface of the upper cover metal plate 1. As shown in the first, second, third and third B, a cover recess 21 having a corresponding shape to the upper cover recess 11 is provided on a surface of the lower cover metal plate 2, and the lower cover A plurality of capillary grooves 22 are provided on a bottom surface of the cover recess 21. In the first embodiment of the present invention, each of the capillary grooves 22 communicates with each other at opposite ends of the lower cover groove 21 to form a plurality of closed loops as indicated by broken lines in the second figure. Further, in the lower cover metal plate 2, a plurality of lower support structures 251 are provided on the partition wall 25 between each of the two capillary grooves 22, and the upper cover grooves 11 are at positions corresponding to the lower support structures 251. A plurality of upper support structures 151 are provided. The number of the above-mentioned capillary grooves 22 can be adjusted according to the actual heat dissipation requirement. When the heat source area of the heat dissipation is large and the power of the heat source is high, the sizes of the upper and lower cover metal plates 1 and 2 can be increased, and the capillary grooves 22 can be increased. The number is increased to improve the overall heat dissipation efficiency of the heat equalizing plate. It is worth mentioning that at least two capillary grooves 22 forming a closed loop are provided in the lower cover recess 21 of the heat equalizing plate provided by the present invention.

Since the use of the heat equalizing plate is for heat conduction, the upper cover metal plate 1 and the lower cover metal plate 2 are made of metal having good thermal conductivity. In the first embodiment of the present invention, the upper cover metal plate 1 and the lower cover metal plate 2 are made of copper metal. In addition, preferably, the thicknesses T1 and T2 of the upper and lower cover metal plates 1 and 2 indicated in FIG. 4A are between 0.15 mm and 0.5 mm, and the thickness of the entire heat equalizing plate is less than or equal to 1 mm; in the first embodiment of the invention, both T1 and T2 are 0.5 mm.

The above-mentioned capillary structure 3 may be a copper mesh having a shape corresponding to the lower cover groove 21, and the capillary structure 3 is provided with a plurality of corresponding to the upper support structure 151 and the lower support structure 251. Perforation 351. Preferably, the mesh of the copper mesh is at least 325 mesh.

The upper cover metal plate 1, the capillary structure 3, and the lower cover metal plate 2 having the above-described structure are sequentially bonded and fixed to each other in the manner shown in the first figure. More specifically, the capillary structure 3 is disposed in the lower cover recess 21 and covers the capillary grooves 22, and the lower support structure 251 in the lower cover metal plate 2 is passed through the through holes of the capillary structure 3. 351. The capillary structure 3 may be disposed in the lower cover recess 21 in a manner of being directly placed in the lower cover recess 21 or may be fixed in the lower cover recess 21 by sintering. After the capillary structure 3 is disposed, the upper cover metal plate 1 and the lower cover metal plate 2 can be bonded to each other through thermal diffusion bonding, so that the upper cover groove 11, the lower cover groove 21, and the capillary grooves 22 are formed. A vacuum chamber for accommodating a working fluid, and the upper support structure 151 and the lower support structure 251 are fixedly coupled to each other, as shown in FIG. 4A and FIG. 4B. When the upper cover metal plate 1 and the lower cover metal plate 2 are fixed to each other, the capillary structure 3 is located between the upper cover groove 11 and the capillary grooves 22.

The upper cover metal plate 1, the capillary structure 3, and the lower cover metal plate 2 are combined and fixed in the above manner to form the thin heat soak for heat conduction provided by the present invention. board. As shown in FIG. 4A and FIG. 4B, the capillary groove 22 of the lower cover metal plate 2 and the capillary structure 3 together constitute a capillary channel of the working fluid in the vacuum chamber, which has high capillary force and low return resistance. It can be used to transport the working fluid; and the upper cover groove 11 above the capillary structure 3 provides a vapor passage for the working fluid to be evaporated by heat. In addition, the upper and lower support structures 151, 251 can support the structure of the heat equalizing plate as a whole in the vacuum chamber, thereby improving the overall mechanical strength of the heat equalizing plate, preventing surface depression or expansion between the upper and lower covers due to an increase in internal pressure. , surface swelling and other issues, improve the overall reliability of the soaking plate.

When the soaking plate is in contact with the heat source, the working fluid located inside the capillary channel 22 becomes vaporized by heat and passes through the capillary structure 3 into the vapor passage formed by the upper cover groove 11. When the vapor moves to the cooling end of the heat equalizing plate, it will change into a liquid due to condensation, and the capillary structure 3 formed by the copper mesh through the capillary action and the capillary groove 22 forming the plurality of closed loops are transmitted to All over the heat board. Since each of the capillary grooves 22 has a heat transfer characteristic similar to that of a single heat sink, the designer can increase the heat transfer capacity of the heat equalizing plate as a whole by increasing the number of the capillary grooves 22; The grooves 22 communicate with each other at opposite ends of the lower cover groove 21, and therefore, the transfer of the working fluid and the vapor inside the respective passages can be adjusted to each other, so that the heat equalizing plate has self-adjusting characteristics. Furthermore, the structural characteristics of the multi-circuit type capillary channel 22, such as the heat dissipating fins, such as the heat dissipating fins, can be arbitrarily adjusted at the position of the surface of the soaking plate, so that the soaking plate can be applied to the heat dissipation design of multiple heat sources, and A heat dissipation effect with a small temperature difference is achieved.

As described above, the heat equalizing plate of the present invention can increase the overall heat dissipation effect by increasing the area size of the upper and lower cover metal plates 1, 2 and the number of internal capillary grooves 22, so that it can be applied to high power. Large area of heat dissipation design. In addition to increasing the number of capillary grooves on the soaking plate, it is also possible to use the respective capillary grooves 22 The bottom surface of the inner surface is further provided with a plurality of capillary grooves to enhance the heat conduction effect of the entire heat equalizing plate.

5A is a transverse cross-sectional view showing a section of the heat shield in accordance with the second embodiment of the present invention, taken along a section line AA in the second diagram; and FIG. 5B is a view showing a second embodiment according to the present invention. After the combination of the soaking plates is completed, a transverse cross-sectional view at section line BB in the second figure. As shown in FIGS. 5A and 5B, in this embodiment, the heat equalizing plate is also composed of an upper cover metal plate 1, a capillary structure 3, and a lower cover metal plate 2 in the same manner as described in the first embodiment. The way is fixed. Different from the first embodiment, the first closed loop is formed in each of the capillary grooves 22 in this embodiment, and the second bottom surface is further provided with two second capillary grooves 23, and the second capillary grooves 23 are respectively The opposite ends of the capillary groove 22 communicate with each other to form a second closed loop in each of the capillary grooves 22. With this configuration, the adjustment and heat conduction effect of the heat equalizing plate can be further improved without increasing the size of the heat equalizing plate. It is worth mentioning that the number of the second capillary grooves 23 in each of the capillary grooves 22 can also be adjusted according to requirements, and the other capillary grooves can be further disposed in the second capillary groove 23.

Since the soaking plate of the present invention fixes the upper and lower cover metal plates 1 and 2 by means of thermal diffusion bonding, the present invention is more conventional than the conventional method of flattening the round pipe. The hot plate can be made thinner and its shape is not limited.

The soaking plate provided by the invention passes through the combination of the upper and lower metal sheets and the loop type capillary groove in the internal vacuum chamber, in addition to improving the heat transfer performance of the heat equalizing plate as a whole, and the heat equalizing plate is self-adjusting. In addition to the function, the size of the heat equalizing plate as a whole can be made thinner, and there can be more different shapes of applications. In addition, due to the characteristics of the multi-circuit type capillary groove, heat dissipating components such as heat dissipation fins can be arbitrarily designed on the surface of the heat equalizing plate, so that the heat equalizing plate can be applied to the heat dissipation design of multiple heat sources.

Fig. 6 is a flow chart showing the manufacturing method of the soaking plate of the present invention. As shown in the sixth figure, the method for manufacturing a soaking plate according to the present invention mainly comprises the following steps: a preparation step S11, a groove forming step S12, a groove forming step S13, a cleaning step S14, and a capillary structure setting. Step S15, a bonding step S16, a cutting step S17, a vacuum injecting step S18, and a step S19. Hereinafter, the manner of manufacturing the heat equalizing plate of the present invention will be described in detail with reference to FIGS. 7A to 7L.

First, in the preparation step S11, a first metal substrate 1a and a second metal substrate 2a having a flat surface are prepared as shown in FIG. Since the use of the heat equalizing plate is for heat conduction, the first metal substrate 1a and the second metal substrate 2a are preferably made of a metal having good thermal conductivity. In the embodiment of the present invention, copper metal is selected as the material of the first metal substrate 1a and the second metal substrate 2a, and further, preferably, the thickness of the first metal substrate 1a and the second metal substrate 2a It is between 0.15mm and 0.5mm.

After the substrate for manufacturing the heat equalizing plate is prepared, the groove forming step S12 can be started to form a plurality of groove groups 11a on the first metal substrate 1a and the second metal substrate 2a, respectively. 21a. Each of the groove sets 11a and 21a includes an upper cover groove 11 or a lower cover groove 21 and a plurality of support structures 151, 251, respectively. In the present invention, the groove forming step S12 is performed by etching, and therefore, the groove forming step S12 further includes a coating step S121 and an etching step S122. In the coating step S121, a photoresist layer is coated on one surface of the first metal substrate 1a and the second metal substrate 2a through a mask having a plurality of hollow portions (not shown). R. The hollow portion on the mask corresponds to a region other than the position at which the upper cover groove 11 and the lower cover groove 21 are to be formed on the substrate, so that the first metal substrate 1a and the second metal substrate 2a are predetermined. To form the upper cover groove 11 and the lower cover concave The portion of the trench 21 forms a plurality of blank regions not coated with the photoresist layer R, as shown in FIG. Here, the photoresist layer R may be formed of an ink that blocks light. After the photoresist layer R is formed, the first metal substrate 1a and the second metal substrate 2a may be etched to be uncoated on the first metal substrate 1a and the second metal substrate 2a, respectively. The portion of the resist layer R forms a plurality of groove groups 11a, 21a having a certain depth as shown in the seventh C.

After the groove forming step S12, the groove forming step S13 may be performed to form a plurality of capillary grooves 22 on the bottom surface of the lower cover groove 21 of the second metal substrate 2a, respectively. In a preferred embodiment of the present invention, the trench forming step S13 further includes a cutting step S131, an imprinting step S132, and a second etching step S133. Since the shape of the bottom portion of the lower cover recess 21 formed by the etching method is an uneven circular arc shape, as shown in FIG. 7D, therefore, before performing the imprinting step S132, the cutting step S131 must be performed first, using a computer. The numerical control machine tool flattens the bottom of each of the grooves and cuts the boundary of the lower cover groove 21 and the support structure 251 into a right angle to facilitate the subsequent steps. After the bottoms of the lower cover recesses 21 are flattened, the embossing step S132 can be performed. When performing the embossing step S132, it is necessary to prepare an embossing head 5 having embossing portions 51 corresponding to the shapes of the capillary grooves 21 on the second metal substrate 2a, and the embossing portion A plurality of projections 52 for dipping the ink are formed on the 51. When the second metal substrate 2a is embossed using the embossing head 5, the embossed portions 51 are aligned with the corresponding groove groups 21a and the support structure 251, and then pressed down, as shown in FIG. Show. When the stamping head 5 is embossed to the second metal substrate 2a, the protrusions 52 imprint the ink in the lower cover recesses 21 to form a position other than the capillary grooves and form the seventh. F is a photoresist layer R2. After the photoresist layer R2 is formed, the second metal substrate 2a may be etched to form a capillary groove 22 having a depth on a portion of the bottom of each of the capillary grooves 21 where the photoresist layer R2 is not embossed. As shown in the seventh G diagram.

As shown in the seventh G diagram, in the present invention, a wall 25 is formed between each of the two capillary grooves 22, and the support structures 251 are evenly distributed on the respective partition walls 25. Further, all the capillary grooves 22 are respectively communicated with each other at opposite ends of the respective groove groups 21a to form a plurality of closed loops in the respective groove groups 21a, respectively.

It is worth mentioning that the trench forming step S13 is a step of elasticity. If the designer believes that the heat dissipation capability of the capillary trench 22 is insufficient to cope with the heat dissipation requirement of the heat source, the trench forming step S13 may be repeatedly performed to The bottoms of the deepest capillary grooves in the depth direction of the substrate form the second and third capillary grooves again.

After the capillary groove 22 is formed, the cleaning step S14 can be performed to clean all the photoresist layers on the first metal substrate 1a and the second metal substrate 2a. Next, the capillary structure setting step S15 can be performed. In the capillary structure setting step S15, first, a plurality of capillary structures 3 having shapes corresponding to the respective groove groups 11a, 21a are prepared. In the present invention, a copper mesh is selected as the capillary structure 3 of the heat equalizing plate, and the capillary structure 3 is provided with a plurality of perforations corresponding to the supporting structure 251. After the copper mesh is cut to correspond to the shape of each of the capillary grooves 21, the copper meshes may be respectively laid in the respective groove groups 21a of the second metal substrate 2a, as shown in FIG. The perforations 351 of the capillary structure 3 are passed through the corresponding support structure 251. The capillary structure 3 can be fixed in the groove group 21a by sintering or directly in the groove group 21a. In the present invention, the arrangement in which the capillary structure 3 is directly placed in the groove group 21a is employed.

Then, the bonding step S16 is performed to align the groove group 11a of the first metal substrate 1a and the groove group 21a corresponding to the second metal substrate 2a in a manner of facing each other, and then through the thermal diffusion bonding. The first metal substrate 1a and the second metal substrate 2a are fixed to each other such that the groove group 11a and the groove group 21a form a plurality of closed chambers. Room, as shown in Figure VII. After the first metal substrate 1a and the second metal substrate 2a are bonded to each other, the cutting step S17 can be performed, and a width is reserved along the shape of the groove groups or the chamber to be the first metal base. The material 1a and the second metal substrate 2a are cut into a plurality of tubes 4 having an injection port 41, as shown in Fig. Then, the vacuum injecting step S18 can be performed, and a working fluid is injected into each of the tubes 4 from the injection port 41 of each of the tubes 4, and then the tubes 4 are evacuated, as shown in FIG. Show. Finally, the sealing step S19 can be performed by welding by means of a welding torch, and the respective tubes 4 drawn into a vacuum state are sealed from the injection port to complete the fabrication of the multiple heat pipe circuits, as shown in the seventh L diagram.

Through the method of manufacturing the soaking plate provided by the invention, the soaking plate can be mass-produced in an automated manner, in addition to greatly improving the efficiency of the soaking plate process, and replacing the habit by thermally diffusing the two substrates. Knowing that the round tube is bent and flattened, the thickness of the soaking plate can be further reduced, and the application range of the soaking plate can be increased, which is in line with the trend of thinning development of various devices in the future.

The above description of the embodiments of the present invention and the application examples thereof are not intended to limit the scope of the present invention, and any improvement and variation that can be accomplished by those skilled in the art based on the contents of the present invention should be considered. It is intended to be included within the scope of the appended claims. Any equivalent structure that is achieved by the use of the contents of the present invention and the accompanying drawings, whether directly or indirectly applied to the art or other related art, is considered to be within the scope of the present invention.

1‧‧‧Overlay metal plate

11‧‧‧ Cover groove

151‧‧‧Upper support structure

2‧‧‧Under the metal sheet

22‧‧‧Capillary grooves

25‧‧‧ partition

251‧‧‧lower support structure

3‧‧‧Capillary structure

351‧‧‧Perforation

Claims (5)

A heat equalizing plate comprising: an upper cover metal plate, one surface of which is provided with an upper cover groove, wherein a plurality of supporting structures are disposed inside the groove; and a lower cover metal plate is provided with a groove on a surface thereof Corresponding cover recesses, wherein a plurality of support structures are disposed inside the recesses, corresponding to the upper cover plate, wherein at least two capillary grooves are disposed on a bottom surface of the lower cover recesses, the two capillary grooves Connecting at opposite ends of the lower cover groove to form at least one first closed circuit; a capillary structure, a capillary structure composed of a metal mesh, the capillary structure being disposed in the lower cover groove to cover the same a capillary groove, and the capillary structure is provided with at least one perforation corresponding to the at least one upper support structure and the at least one lower support structure; wherein the upper cover metal plate and the lower cover metal plate are fixed to each other such that the upper cover The recess, the lower cover recess, and the capillary grooves form a vacuum chamber for receiving a working fluid; wherein each of the capillary grooves is further provided with at least two second a fine groove, the second capillary grooves communicate with each other at both ends of the capillary groove, and form at least one second closed circuit; wherein each of the two capillary channels in the lower cover metal plate has a wall, each of the partition walls is provided with at least one lower support structure, and the upper cover recess of the upper cover metal plate is provided with at least one upper support structure corresponding to the at least one lower support structure, when the upper cover metal plate is The lower cover metal When the plates are fixed to each other, the at least one lower support structure and the at least one upper support structure are in contact with each other. The heat equalizing plate according to claim 1, wherein the upper cover metal plate and the lower cover metal plate are fixed to each other by thermal diffusion bonding. A method for manufacturing a soaking plate, comprising the steps of: preparing a first metal substrate having a flat surface and a second metal substrate; and forming a groove on the first metal substrate and Forming a plurality of groove groups corresponding to each other on a surface of the second metal substrate, wherein each of the groove groups includes a plurality of support structures, and the groove forming step comprises the following steps: a coating step, Applying a photoresist layer on a surface of the first metal substrate and the second metal substrate through a mask having a plurality of hollow portions; and an etching step, the first metal substrate and the second The metal substrate is etched to form the first groove group and the first closed circuit on the first metal substrate and the portion of the second metal substrate not coated with the photoresist layer; a forming step of forming at least two grooves in each of the groove groups of the second metal substrate, and the at least two grooves are connected to each other at opposite ends of each of the groove groups to each Medium shape of the groove group At least one closed loop, wherein each line is formed between the two grooves has a partition wall, such a support structure between the walls of such distributed system, the step of forming said trenches comprises the steps of: a cutting step of cutting a bottom surface of each of the groove groups into a flat surface using a computer numerical control (CNC) machine tool; an imprinting step, through a pressure Stamping the second metal substrate to form a photoresist layer on a bottom surface of each of the groove groups of the second metal substrate; and an etching step of the second metal substrate Etching treatment to form the trenches on portions of the second metal substrate not coated with the photoresist layer, and forming at least two on the bottom surface of each of the trenches in the recess groups a second trench, the at least two second trenches communicating with each other at opposite ends of each of the trenches and forming at least one second closed loop; a bonding step of the first metal base And aligning the groove groups of the second metal substrate with each other in a manner of facing each other, fixing the first metal substrate and the second metal substrate to each other by thermal diffusion bonding; a step of bonding the first metal substrate that is fixed and completed The two metal substrates are cut along the shape of the groove groups into a plurality of tubes having an injection port; a vacuum injecting step, after injecting a working fluid into each of the tubes from the inlet, The tubes are evacuated; and a port step is performed to seal each of the tubes that are evacuated from the inlet to form a plurality of soaking plates. The method for manufacturing a heat equalizing plate according to claim 3, further comprising a capillary structure setting step performed after the groove forming step, wherein in the capillary structure setting step, Forming a plurality of capillary structures, each of the capillary structures having a shape corresponding to each of the sets of grooves, each of the plurality of perforations being provided with a plurality of perforations corresponding to the support structures And each of the capillary structures is laid in each of the sets of grooves of the second metal substrate. The method for manufacturing a soaking plate according to claim 3, further comprising a cleaning step of cleaning the first metal substrate and all the photoresist layers on the second metal substrate, wherein the cleaning The steps are performed prior to the bonding step.