TWI578491B - Optical sensing device and method of manufacturing optical device - Google Patents

Description

Optical sensing device and method of manufacturing optical device

The present invention relates to an optical sensing device and a method of manufacturing the optical device, and more particularly to an optical sensing device having a light transmitting colloid and a light-tight colloid and a method of manufacturing an optical device that simplifies a processing procedure.

Various optical sensors are often installed in electronic products (such as televisions), so that the electronic products can sense changes in the ambient light source through the optical sensor or receive light of a specific wavelength, and then the electronic product performs a specific function in response. (such as changing the brightness of the screen, or switching channels, etc.).

Since different optical sensors are independent components, it is not convenient to install the optical sensors one by one in the electronic product, which is easy to increase the installation time. In addition, the manufacturing process of the optical sensor is also inconvenient, for example, requiring multiple cutting steps, which increases the manufacturing time of the optical sensor; other optical devices have similar problems.

There are ships here, how to improve at least one of the above-mentioned shortcomings is a problem to be solved in the industry.

An object of the present invention is to provide an optical sensing device and a method of manufacturing the optical device, which at least simplifies the assembly or manufacturing steps of the optical device (optical sensing device).

To achieve the above objective, the optical sensing device disclosed in the present invention comprises a circuit board, an invisible light receiving module, a visible light sensor, a light emitting element, a light transmitting colloid and a light-tight colloid. The invisible light receiving module is disposed on the circuit board for receiving an invisible light and converting into an invisible light signal output. The visible light sensor is disposed on the circuit board for receiving a visible light and converted into a visible light signal output. The light emitting component is disposed on the circuit board for displaying the light according to the invisible light signal or the visible light signal. The light-transmitting gel is disposed on the circuit board to cover the light-emitting component and the visible light sensor. The opaque colloid is disposed on the circuit board to cover the invisible light receiving module, and blocks visible light from penetrating and allows invisible light to penetrate. Wherein, the light-tight adhesive system and the light-transmitting colloid are in contact with each other or separated.

In order to achieve the above object, a method of manufacturing an optical device disclosed by the present invention includes the following steps. First, a circuit board is provided which has a plurality of electronic component setting areas. Next, a set of electronic components are disposed in each of the electronic component setting regions, wherein each of the electronic components includes a first electronic component and a second electronic component. Then, performing a first molding to form one or more sets of transparent packaging structures and covering the first electronic components, wherein the transparent packaging structure has a connecting portion, and the connecting portion is located between each two electronic component setting regions. . Then, a second molding is performed to form one or more sets of opaque package structures and cover the second electronic components, wherein the opaque package structure covers the connections. Then, the circuit board, the light-transmissive package structure, and the opaque package structure are cut to separate the electronic component setting regions, and a plurality of electronic component structures are formed. The electronic component structure includes a first electronic component, a second electronic component, one or more sets of transparent colloids, and one or more sets of opaque colloids, and the transparent colloid and the opaque adhesive system respectively cover the first electronic component and the first The two electronic components, the light transmissive colloid has an extension, and the side of the extension is substantially coplanar with the side of the opaque colloid.

To achieve the above objective, the optical sensing device disclosed in the present invention comprises a circuit board, an invisible light receiving module, a visible light sensor, a light emitting component, a light transmitting colloid, a first coating layer, and a first Two coating layers and a shielding structure. The invisible light receiving module is disposed on the circuit board for receiving an invisible light and converting into an invisible light signal output. The visible light sensor is disposed on the circuit board for receiving a visible light and converted into a visible light signal output. The light emitting component is disposed on the circuit board for displaying the light according to the invisible light signal or the visible light signal. The transparent colloid is disposed on the circuit board to cover the invisible light receiving module, the light emitting component, and the visible light sensor. The first coating layer is disposed on the invisible light receiving module and is located in the transparent gel body for blocking visible light and allowing invisible light to pass. The second coating layer is disposed on the visible light sensor and is located in the transparent gel body for blocking invisible light and allowing visible light to pass. The shielding structure is disposed around the invisible light receiving module and is located in the transparent glue body to isolate electromagnetic waves from the external environment to avoid interference of the invisible light receiving module.

To achieve the above objective, the optical sensing device disclosed in the present invention comprises a circuit board, an invisible light receiving module, a light emitting component and a light-tight colloid. The invisible light receiving module is disposed on the circuit board for receiving an invisible light and converting into an invisible light signal output. The light emitting component is disposed on the circuit board for displaying the light according to the invisible light signal. The opaque colloid is disposed on the circuit board to cover the invisible light receiving module, and blocks visible light from penetrating and allows invisible light to penetrate. Wherein, the light-tight colloid has a groove for accommodating the light-emitting element.

Therefore, the optical sensing device and the optical device manufacturing method of the present invention provide at least the following beneficial effects: 1. Different electronic components (for example, a visible light sensor and an invisible light receiving module) are disposed in the same package, Can be installed into an electronic product in one step; 2. Different electronic components are respectively covered by different colloids, for example, the light-emitting elements or visible light sensors are covered by the same or separate transparent transparent colloids, and the non-visible receiving elements are covered by a light-tight colloid, which can avoid at least one The electronic component is disturbed by light of an undesired wavelength; 3. In the manufacturing process of the optical device (optical sensing device), only one cutting step is required, so that the optical device is made faster or easier to manufacture.

In order to make the above objects, technical features and technical effects more comprehensible, the following detailed description will be made in conjunction with the preferred embodiments.

S101~S111‧‧‧Steps

1, 2, 3, 4‧‧‧ optical sensing devices

4a, 5a, 6a‧‧‧Method of manufacturing optical devices

11, 21, 21'‧‧‧ boards

111, 211‧‧‧ upper surface

113, 213‧‧‧ circuit pattern

115‧‧‧ pin

12‧‧‧Lighting elements

13‧‧‧Invisible light receiving module

131‧‧‧Light receiving components

132‧‧‧Optical signal processing components

14‧‧‧ Visible light sensor

15, 15a, 15b, 15c, 23', 33', 43' ‧ ‧ light colloid

151‧‧‧ side

152, 232’‧‧‧ Extension

153‧‧‧First light transmission department

154‧‧‧Second light transmission department

155‧‧‧The third light transmission department

16, 16a, 16b, 16c, 24', 34', 44'‧‧‧ opaque colloid

161‧‧‧Lens Department

162, 241‧‧ ‧ shading department

17, 17a‧‧‧ metal casing

20, 30, 40‧‧‧ Electronic component structure

212‧‧‧Electronic component setting area

22‧‧‧Each set of electronic components

22a‧‧‧First electronic component

22b‧‧‧Second electronic components

22c‧‧‧ Third electronic component

23, 33, 43‧‧‧Light transmission package structure

23a, 43a‧‧‧First light-transmissive package

23b, 43b‧‧‧Second light-transmissive package

23c‧‧‧The third transparent package

232‧‧‧Connecting Department

24, 34, 44‧‧‧ opaque package structure

Fig. 1 is a perspective view of an optical sensing device according to a first embodiment of the present invention.

Fig. 2 is a cross-sectional view showing an optical sensing apparatus according to a first embodiment of the present invention.

3A and 3B are a perspective view and a cross-sectional view of an optical sensing device according to a second embodiment of the present invention.

4A and 4B are a perspective view and a cross-sectional view of an optical sensing device according to a third embodiment of the present invention.

5 and 6 are a perspective view and a cross-sectional view of an optical sensing device according to a fourth embodiment of the present invention.

Figure 7 is a flow chart showing the steps of a method of manufacturing an optical device according to a fifth embodiment of the present invention.

Fig. 8 is a view showing the solid crystal of the manufacturing method according to the fifth embodiment of the present invention.

Figure 9 is a schematic view of a bonding wire according to a manufacturing method of a fifth embodiment of the present invention.

Figure 10 is a first schematic view showing the manufacturing method of the fifth embodiment according to the present invention.

Figure 11 is a schematic view showing the second molding of the manufacturing method according to the fifth embodiment of the present invention.

Figure 12 is a schematic view showing the cutting method of the fifth embodiment of the present invention.

Figure 13 is a first schematic view showing the manufacturing method of the optical device according to the sixth embodiment of the present invention.

Figure 14 is a second schematic view showing the manufacturing method of the optical device according to the sixth embodiment of the present invention.

Figure 15 is a schematic view showing the cutting method of the optical device according to the sixth embodiment of the present invention.

Figure 16 is a first schematic view showing the manufacturing method of the optical device according to the seventh embodiment of the present invention.

Figure 17 is a second schematic view showing the manufacturing method of the optical device according to the seventh embodiment of the present invention.

Figure 18 is a schematic view showing the cutting method of the optical device according to the seventh embodiment of the present invention.

Please refer to FIG. 1 and FIG. 2, which are perspective and cross-sectional views of an optical sensing device according to a first embodiment of the present invention.

In the first embodiment, the optical sensing device 1 can include a circuit board 11, a light-emitting component 12, an invisible light receiving module 13, a visible light sensor 14, a light-transmitting colloid 15 and a light-tight colloid 16 . The technical content of each component will be described as follows.

The circuit board 11 can have an upper surface 111 and a circuit pattern 113 disposed on the upper surface 111, and the light emitting element 12 can be disposed on the upper surface 111 of the circuit board 11 and the circuit pattern 113 electrical connection. The light-emitting element 12 can emit visible light, such as white light, red light or yellow light, such as visible light colored light, and the light-emitting element 12 can be one or more light-emitting diode crystal grains and pass through the light-emitting element 12 to the epitaxial structure electrode. The layer design method is disposed on the upper surface 111 by means of solid crystal and wire bonding such as single-strand, double-strand or flip chip.

The light-emitting element 12 can also optionally be one or more light-emitting diode packages (not shown). Specifically, the LED package structure includes a light emitting diode die and a package structure. The LED package structure can be tested before being disposed on the upper surface 111 to ensure that the LED structure is in accordance with user specifications. In addition, the light emitting diode package structure may further comprise a phosphor powder. In addition, the light emitting element 12 may be a laser die or a laser package structure, and the laser package structure includes a laser die.

The invisible light receiving module 13 can be disposed on the upper surface 111 of the circuit board 11. The invisible light receiving module 13 can receive an invisible light and output an invisible light signal. The invisible light refers to light of a specific wavelength that is hard to be observed by the naked eye, such as infrared rays, far infrared rays, ultraviolet rays, and the like.

Preferably, the invisible light receiving module 13 can include a light receiving component 131 and a photoelectric signal processing component 132. The light receiving component 131 is coupled to the photoelectric signal processing component 132. The light receiving component 131 is configured to receive invisible light, and the photoelectric signal processing component 132 can be a wafer having a signal processing function. When the light receiving element 131 receives the invisible light, it outputs an invisible light receiving signal. The photoelectric signal processing component 132 is configured to receive the invisible light receiving signal output from the light receiving component 131, and thereby convert the invisible light signal into an invisible light signal and output the light. The invisible light receiving module 13 may also include the light receiving component 131 and the photoelectric signal processing component 132 integrated into a single component (not shown), that is, the single component has the light receiving component 131 and the photoelectric The function of signal processing component 132. The above component may be an Application-specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA), or a Complex Programmable Logic Device (CPLD).

The visible light sensor 14 can also be disposed on the upper surface 111 of the circuit board 11 for receiving a visible light, which is a light of a specific wavelength that is easily observed by the naked eye. When the visible light sensor 14 receives the visible light, the visible light can be converted into a visible light signal output. Wherein, the visible light sensor can be an ambient light sensor.

In detail, when the invisible light receiving module 13 and/or the visible light sensor 14 senses light of a specific wavelength and converts it into an invisible light signal and/or a visible light signal output, the light emitting element 12 can be based on the invisible light signal and / or visible light signal display. Preferably, the visible light sensor 14 and the light-emitting element 12 can be controlled by brightness feedback and compensation, that is, the light-emitting element 12 can be based on the ambient light intensity detected by the visible light sensor 14 or the light-emitting brightness of the light-emitting element 12. Used to adjust the light to show different brightness.

For example, when the visible light sensor 14 performs the brightness feedback and compensation control according to the light emitting brightness of the light emitting element 12, the light emitting element 12 may be disposed near the visible light sensor 14 or within the sensing range. In detail, when the light-emitting element 12 has a problem of luminance attenuation due to the lifetime or temperature factor, the visible light sensor 14 can sense the luminance attenuation of the light-emitting element 12 and perform brightness feedback control; then, the light-emitting element 12 compensates The way of control is to give more power in time to emit light with a predetermined brightness.

When the optical sensing device 1 is used as a backlight module, the brightness feedback and compensation control mode is such that when the ambient light source is bright, the light emitted by the light-emitting element 12 is higher; When the ambient light source is dark, the light emitted by the light-emitting element 12 is lower. The optical sensing device 1 further includes a driving control circuit for receiving the visible light signal of the visible light sensor 12, and further determining whether a brightness compensation mechanism is needed for the light emitting element 12.

The light transmissive gel 15 can cover the light emitting element 12 and the visible light sensor 14. "Overlay" may mean that the light-transmitting colloid 15 closely adheres to the light-emitting element 12 and the visible light sensor 14, or covers the light-emitting element 12 and the visible light sensor 14 (that is, the light-transmitting gel 15 does not interact with the light-emitting element 12 and the visible light The detector 14 is in contact, but still surrounds the light-emitting element 12 and the periphery and above of the visible light sensor 14).

The light-transmitting colloid 15 can allow at least visible light to pass through, and can also allow invisible light to pass through, and the transparent colloid 15 can be made of a material having such light-transmitting properties such as epoxy resin, acrylic, PPA, silicone or the like. The light-transmitting colloid 15 may be a polygonal cylinder, a cylinder or an elliptical cylinder (not shown), and the opaque colloid 16 of the present embodiment is exemplified by a polygonal cylinder having a rectangular cross section.

The opaque colloid 16 can cover (ie, closely fit or cover) the invisible light receiving module 13. The opaque colloid 16 can block at least visible light penetration and allow the invisible light receiving module 13 to sense the invisible light. The non-transparent colloid 16 can be made of epoxy resin, acrylic, or the like. PPA, silicone and opaque dyes, such as Carbon Black or fillers, such as titanium dioxide (TiO ₂ ), have such opaque properties. In other words, the opaque colloid 16 can have the function of filtering visible light, and can increase the accuracy of the invisible light receiving module 13 receiving the invisible light.

The opaque colloid 16 optionally has a lens portion 161 which may be a convex lens and is located above the invisible light receiving module 13. Therefore, when the invisible light enters the lens portion 161, it can be collected by the lens portion 161 to the invisible light receiving module 13 so that the invisible light is connected. The receiving module 13 is more susceptible to sensing invisible light.

The light-transmitting colloid 15 and the light-impermeable colloid 16 can be in contact with each other or separated. When in contact with each other, at least one side of the light-transmitting colloid 15 and the opaque colloid 16 are in contact with each other; and when separated from each other, the light-transmitting colloid 15 and the opaque colloid 16 have no side surfaces in contact with each other. Preferably, the transparent colloid 15 and the opaque colloid 16 are in contact with each other, and the opaque colloid 16 may surround at least a portion of the side 151 of the transparent colloid 15. More preferably, the opaque colloid 16 surrounds all of the side 151 of the transparent colloid 15 (as shown in FIG. 1), and only exposes the upper surface of the transparent colloid 15; thus, visible light can only be obtained from the transparent colloid The upper surface of 15 passes and cannot pass through the side of the light-transmitting colloid 15 (because it is blocked by the opaque colloid 16).

Further, when the optical sensing device 1 of the present embodiment is manufactured by the manufacturing method of the optical device in the embodiment described later, the light transmitting colloid 15 may have an extending portion 152 (as shown in FIG. 1), and the extending portion 152 The sides and the sides of the opaque colloid 16 are substantially coplanar. The manner in which the extensions 152 are formed will be described in detail in subsequent processes.

In addition, the circuit board 11 optionally includes a plurality of pins 115 disposed on the upper surface 111 and electrically connected to the invisible light receiving module 13, the light emitting component 12, and the visible light sensor. 14. The pins 115 extend beyond the opaque colloid 16 and/or the transparent colloid 15 so as not to be covered by the opaque colloid 16 and/or the transparent colloid 15 . In this manner, other electronic devices or electronic components can be electrically connected to the invisible light receiving module 13 , the light emitting component 12 , and the visible light sensor 14 through the pins 115 , and the invisible light receiving module 13 and the visible light sensor 14 can be The invisible light signal and the visible light signal are output through the pins 115, and the light emitting element 12 can receive the control signal from the outside through the pins 115.

Please refer to FIG. 3A and FIG. 3B , which are the second embodiment according to the present invention. A perspective view and a cross-sectional view of an optical sensing device. In the second embodiment, the optical sensing device 2 is similar to the optical sensing device 1 of the first embodiment, so that the technical contents of both can be referred to each other.

The first light transmitting portion 153 and the second light transmitting portion 154 are separated by the first light transmitting portion 153 and the second light transmitting portion 154. The light-emitting element 12 and the visible light sensor 14 are respectively disposed. The light-shielding portion 16a has a light-shielding portion 162. The light-shielding portion 162 is disposed between the first light-transmitting portion 153 and the second light-transmitting portion 154. The opaque colloid 16a surrounds the first light transmitting portion 153 and the second light transmitting portion 154.

The light shielding portion 162 is for blocking the light emitted by the light emitting element 12 so that the light is not sensed by the visible light sensor 14. As such, the visible light sensor 14 can accurately sense light in the external environment without being disturbed by light emitted by the light-emitting element 12.

Please refer to FIGS. 4A and 4B, which are perspective and cross-sectional views of the optical sensing device 3 according to the third embodiment of the present invention. The optical sensing device 3 of the present embodiment is different from the optical sensing device 2 of the second embodiment in that the transparent colloid 15b further includes a third transparent portion 155 and a third portion than the transparent colloid 15b of the second embodiment. The light transmitting portion 155 covers the invisible light receiving module 13 , and the non-light transmitting colloid 16 b covers the third light transmitting portion 155 . Thus, the opaque colloid 16b does not directly cover the invisible light receiving module 13, and the opaque colloid 16b can be prevented from directly covering the invisible light receiving module 13 and the invisible light receiving module 13 may be damaged.

Please refer to FIG. 5 and FIG. 6, which are perspective and cross-sectional views of the optical sensing device 4 according to the fourth embodiment of the present invention.

In the fourth embodiment, the optical sensing device 4 is similar to the optical sensing device 1 of the first embodiment, so that the technical contents of both can be referred to each other. The light transmitting colloid 15c included in the optical sensing device 4 further includes a third light transmitting portion 155 than the light transmitting colloid 15 of the first embodiment. The third light transmitting portion 155 can cover the invisible light receiving module 13 in advance, and the opaque colloid 16c covers the third light transmitting portion 155. Thus, the opaque colloid 16c does not directly cover the invisible light receiving module 13, and the opaque colloid 16c can be prevented from directly covering the invisible light receiving module 13 and the invisible light receiving module 13 may be damaged.

Preferably, the optical sensing device 1 of the present embodiment may further include a shielding structure, such as a metal casing 17, which covers at least a portion of the opaque colloid 16 (in this embodiment, the metal The outer casing 17 covers the three sides and the upper surface of the opaque colloid 16. The metal casing 17 can block the invisible light from the side of the opaque colloid 16 from entering the opaque colloid 16, and can also isolate electromagnetic waves and the like from the external environment to prevent the invisible light receiving module 13 from being disturbed. In another preferred embodiment, optionally, the metal casing 17a included in the optical sensing device 3 of FIG. 4A may cover one side and an upper surface of the opaque colloid 16b. In another preferred embodiment, optionally, the metal casing may be disposed in the light-tight adhesive body or in the light-transmitting gel body (not shown). In another preferred embodiment, optionally, the lower surface of the metal casing may be coplanar with the ground line of the bottom surface of the circuit board, and one side of the casing may be coplanar with the ground line on the side of the circuit board, so that the optical sensing device is applied in positive In the case of a top view or a side view, the metal casing can be grounded to achieve electromagnetic shielding. In a preferred embodiment, the metal casing can be replaced by a conductive paste or a metal film, and the electromagnetic shielding function can also be achieved.

The above is an illustration of optical sensing devices according to various embodiments of the present invention, and such optical sensing devices provide at least the following beneficial effects:

1. The visible light sensor, the invisible light receiving module and the light emitting component are disposed on the same circuit board, so that it can be installed into other electronic products by only one step;

2. The light-emitting element or the visible light sensor can be covered by the light-transmitting colloid without the visible light receiving element Can be covered by a opaque gel to prevent the two from being disturbed by light of unintended wavelengths;

3. The optical sensing device can have the functions of “brightness feedback” and “brightness compensation”.

4. The opaque colloid may be disposed to surround at least a portion of the side surface of the transparent colloid, so that the visible light is blocked by the opaque colloid, and the visible colloid cannot enter the transparent colloid from the side of the opaque colloid.

5. The opaque colloid may have a light shielding portion disposed between the first light transmitting portion and the second light transmitting portion such that the light emitting elements and the visible light sensors located in the two light transmitting portions do not interfere with each other.

Next, a method of manufacturing an optical device according to various embodiments of the present invention will be described.

Referring to Fig. 7, there is shown a flow chart of the steps of the method of fabricating the optical device according to the fifth embodiment of the present invention. In the present embodiment, an optical device manufacturing method 4a is proposed, which can at least manufacture the optical sensing devices 1 to 4 in the above embodiments, and thus the technical contents of the optical sensing devices 1 to 4 can be used as a manufacturing method of the optical device. 4a implementation reference. In other words, the following technical contents of the optical device manufacturing method 4a can also be used as a reference for the realization of the optical sensing devices 1 to 4.

It is not limited to the optical sensing devices 1 to 4, and the optical device manufacturing method 4a can also manufacture other optical devices including a light-transmitting colloid and a light-tight colloid. The respective steps of the manufacturing method 4a of the optical device will be described below in order, but the execution of each step is not limited to the order of explanation.

Specifically, the manufacturing method 4a of the optical device may start in step S101. Referring to FIG. 8 , in step S101 , a circuit board 21 is provided, and the circuit board 21 can be any plastic substrate, a ceramic substrate, a flexible substrate or a glass substrate, and any circuit pattern can be formed ( The plate structure of the figure is not shown). The circuit board 21 has a plurality of electronic component setting regions 212 (two are exemplified) disposed on the upper surface 211. The electronic component mounting regions 212 can be arranged in a horizontally and vertically continuous manner, and can also be horizontally, vertically, or Interlaced in a continuous matrix arrangement.

Next, in step S103, a set of electronic components 22 are disposed in each of the electronic component setting regions 212, and each of the electronic components 22 includes at least a first electronic component 22a, a second electronic component 22b, and a third Electronic component 22c. For example, in the fifth embodiment, the first electronic component 22a of each electronic component 22 can be a light emitting component (for example, a visible light emitting diode die or a light emitting diode package), and the second electronic component 22b can be An invisible light receiving module (for example comprising a light receiving component and a photoelectric signal processing component), the third electronic component 22c can be a visible light sensor (for example, an ambient light sensor).

The electronic components 22a-22c and the circuit board 21 can be electrically connected in various ways, such as wire bonding, flip chip bonding, eutectic bonding, gold ball or bump bonding, silver paste or solder paste bonding.

For example, as shown in FIG. 9 , the wire bonding connection is taken as an example. Each of the electronic components 22 includes a first electronic component 22 a , a second electronic component 22 b , and a third electronic component 22 c that pass through the bonding wire and the circuit board 21 . The circuit patterns (not shown) are electrically connected so that the respective electronic components 22a-22c in the electronic component mounting region 212 can be electrically connected to each other.

Referring to FIG. 10, in step S105, a first molding is performed to form a light transmissive package structure 23. Specifically, the circuit board 21 and each set of electronic components 22 can be placed in a mold (not shown), and then the raw material (not shown) of the light-transmitting package structure 23 can be molded in the mold to A light transmissive package structure 23 is formed on the upper surface 211. After the transparent package structure 23 is formed, at least the first electronic component 22a in each of the electronic component mounting regions 212 can be covered, and the second and third electronic components 22b and 22c can be selectively covered; in other words, all the electronic components. 22a-22c can be covered by the light transmissive package structure 23.

According to the covered electronic components 22a-22c, the transparent package structure 23 can be defined as A first light-transmissive package portion 23a, a second light-transmissive package portion 23b, and a third light-transmissive package portion 23c, and the first light-transmissive package portion 23a covers the first electronic component 22a and the second light-transmissive package portion 23b. The third electronic component 22c is covered, and the third transparent package portion 23c covers the second electronic component 22b.

In addition, the first transparent encapsulating portion 23a and the second transparent encapsulating portion 23b are integrally formed in contact with each other, and the third transparent encapsulating portion 23c is opposite to the first transparent encapsulating portion 23a and the second transparent encapsulating portion. 23b phase separation. The top surfaces of the first light-transmissive encapsulating portion 23a and the second light-transmitting encapsulating portion 23b may also be higher than the top surface of the third light-transmissive encapsulating portion 23c; however, it is also possible that the three are contoured.

After the light-transmissive package structure 23 is formed, the light-transmitting package structure 23 further has a connecting portion 232, and the connecting portion 232 is located between each of the two electronic component setting regions 212, which is filled with the glue flow through the mold for the stamper. The material in the road.

Referring to FIG. 11, then in step S107, a second molding is performed to form an opaque package structure 24. Similar to step S105, the circuit board 21 and each set of electronic components 22 can be placed in another mold (not shown), and then the raw material (not shown) of the opaque package structure 24 can be molded by the mold. Type to form an opaque package structure 24 on the upper surface 211. After the opaque package structure 24 is formed, the second electronic component 22b and the connecting portions 232 are covered. In addition, the opaque package structure 24 also covers the third transparent package portion 23c of the transparent package structure 23. . The opaque package structure 24 further includes a lens portion 161.

Preferably, the opaque package structure 24 surrounds at least a portion of the side surface of the transparent package structure 23, and more preferably, the first light-transmissive package portion 23a and the second light-transmissive package portion 23b of the transparent package structure 23 are completely completed. The side. In addition, the opaque package structure 24 can be aligned with the first light-transmissive package portion 23a and the second light-transmissive package portion 23b of the light-transmitting package structure 23.

Referring to FIG. 12, in step S109, the circuit board 21 is cut, The transparent package structure 23 and the opaque package structure 24 are used to separate the plurality of electronic component mounting regions 212, and then form a plurality of independent electronic component structures 20.

The electronic component structure 20 can correspond to the optical sensing device 4 in the above embodiment, and includes a circuit board 21', a first electronic component 22a, a second electronic component 22b, a third electronic component 22c, and a light-transmissive colloid (ie, after cutting The light package structure 23' and a light-tight colloid (ie, the opaque package structure after cutting) 24'. Further, the light-transmitting colloid 23' has an extending portion 232' which is formed by cutting the connecting portion 232, so that the side surface of the extending portion 232' is substantially coplanar with the side surface of the opaque colloid 24'.

Next, in step S111, a metal casing 17 (see FIG. 5) or a metal plating film is provided to cover at least a portion of the opaque colloid 24' of each electronic component structure 20 to protect the second electronic component 22b from External electromagnetic waves or noise interference.

The above is a description of a method of manufacturing an optical device according to a fifth embodiment of the present invention, and a method of manufacturing the optical device according to the sixth and seventh embodiments of the present invention will be described next.

Referring to FIGS. 13 to 15, the manufacturing method 5a of the optical device according to the sixth embodiment of the present invention is similar to the manufacturing method 4a of the optical device of the fifth embodiment (so the technical contents of the two should be mutually relevant) Steps S101 to S111 (as shown in FIG. 7) may be included, and steps S105 to S109 included in the manufacturing method 5a of the optical device are different, and the specific description is as follows.

As shown in FIG. 13, in the step S105, when the first molding is performed to form a light-transmitting package structure 33, the light-transmitting package structure 33 covers the first electronic component 22a in each of the electronic component setting regions 212. And the third electronic component 22c, but does not cover the second electronic component 22b. In other words, the light-transmitting package structure 33 does not have the third light-transmissive package portion 23c as shown in FIG. Provincial materials. At this time, the opaque package structure 33 also has a connecting portion 232 between every two electronic component mounting regions 212.

As shown in FIG. 14, in step S107, a second molding is performed to form an opaque package structure 34. In the foregoing step S105, the transparent package structure 33 covers only the first electronic component 22a and the third electronic component 22c. Therefore, when the opaque package structure 34 is formed, the opaque package structure 34 directly covers the second Electronic component 22b. The opaque package structure 34 further includes a lens portion 161.

As shown in FIG. 15, in step S109, the circuit board 21, the light-transmissive package structure 33, and the opaque package structure 34 are cut to separate the electronic component mounting regions 212, and then a plurality of independent electronic components are formed. Structure 30. The electronic component structure 30 can correspond to the optical sensing device 1 in the above embodiment, and includes a circuit board 21', a first electronic component 22a, a second electronic component 22b, a third electronic component 22c, and a light-transmissive colloid (ie, after cutting The light package structure 33' and a light-tight colloid (ie, the opaque package structure after cutting) 34'. Further, the light-transmitting colloid 33' has an extending portion 232' which is formed by cutting the connecting portion 232, so that the side surface of the extending portion 232' is substantially coplanar with the side surface of the opaque colloid 34'.

Next, a method of manufacturing the optical device of the seventh embodiment of the present invention will be described.

Referring to FIGS. 16 to 18, the manufacturing method 6a of the optical device according to the seventh embodiment of the present invention is similar to the manufacturing methods 4a and 5a of the optical device (so the technical contents of the three should be mutually referenced), Steps S101 to S111 may be included, and steps S105 to S109 included in the manufacturing method 6a of the optical device are different, and the specific description is as follows.

As shown in FIG. 16, in the step S105, when the first molding is performed to form a first light-transmissive package portion 43, the light-transmitting package structure 43 may have a separation without contact. A light-transmissive package portion 43a and a second light-transmissive package portion 43b, and the first light-transmissive package portion 43a and the second light-transmissive package portion 43b cover the first electronic component 22a and the third electronic component 22c, respectively.

As shown in FIG. 17, in step S107, when a second molding is performed to form an opaque package structure 44, the first light-transmissive package portion 43a and the second light-transmissive package portion 43b are The opaque package structure 44 is formed between the first light-transmissive package portion 43a and the second light-transmissive package portion 43b to form a light-shielding portion 241. The opaque package structure 44 further includes a lens portion 161.

As shown in FIG. 18, in step S109, the circuit board 21, the light-transmissive package structure 43, and the opaque package structure 44 are cut to separate the electronic component mounting regions 212, and then a plurality of independent electronic component structures are formed. 40. The electronic component structure 40 can correspond to the optical sensing device 2 in the above embodiment, and includes a circuit board 21', a first electronic component 22a, a second electronic component 22b, a third electronic component 22c, and a transparent colloid (ie, a transparent after cutting). The light package structure 43' and a light-tight colloid (ie, the opaque package structure after cutting) 44'. Further, the light-transmitting colloid 43' has an extending portion 232' which is formed by cutting the connecting portion 232, so that the side surface of the extending portion 232' is substantially coplanar with the side surface of the opaque colloid 44'.

In the manufacturing method of the optical device according to other embodiments (not shown), each set of electronic components may not include the third electronic component, so the light transmitting package structure will cover only the first electronic component. Further, in the manufacturing method of the optical device of the respective embodiments (not shown), the step of providing the metal casing may be omitted depending on the application state or environment of the finished product. Alternatively, a metal outer casing may be formed to protect the second electronic component prior to the second molding step. Then, the opaque package structure of the second molding step can cover the metal casing.

The above is a description of a method of manufacturing an optical device according to various embodiments of the present invention, The following benefits are provided: after the end of the first molding and the second molding step, only one cutting step can be performed, that is, only one cutting step is required in the entire manufacturing method. In this way, the time required for the processing of the finished product can be greatly reduced, and the cutting amount of the cutting does not need special control (that is, as long as the circuit board, the light-transmissive package structure and the opaque package structure can be cut).

In an embodiment, above the light-emitting element 12, the light-transmitting colloid further includes a lens portion, which may be a convex lens. In another embodiment, above the visible light sensor 14, the light transmissive colloid further includes a lens portion, which may be a convex lens.

In an embodiment, the invisible light receiving module 13 can be coated with a coating layer for blocking visible light and allowing invisible light to pass. In another embodiment, the visible light sensor 14 can be applied with a coating layer to block invisible light and pass visible light. Among them, the visible light wavelength is 380~820 nanometers (nm), and the remaining wavelength bands are invisible wavelengths.

The embodiments described above are only intended to illustrate the embodiments of the present invention, and to explain the technical features of the present invention, and are not intended to limit the scope of protection of the present invention. Any changes or equivalents that can be easily made by those skilled in the art are within the scope of the invention. The scope of the invention should be determined by the scope of the claims.

1‧‧‧Optical sensing device

11‧‧‧ boards

111‧‧‧Upper surface

113‧‧‧ circuit pattern

12‧‧‧Lighting elements

13‧‧‧Invisible light receiving module

131‧‧‧Light receiving components

132‧‧‧Optical signal processing components

14‧‧‧ Visible light sensor

15‧‧‧Translucent colloid

151‧‧‧ side

16‧‧‧opaque colloid

161‧‧‧Lens Department

17‧‧‧Metal casing

Claims (21)

[Item 1] An optical sensing device comprising:
a circuit board;
An invisible light receiving module is disposed on the circuit board for receiving an invisible light and converting to an invisible light signal output;
a visible light sensor disposed on the circuit board for receiving a visible light and converted into a visible light signal output;
a light-emitting element disposed on the circuit board for displaying light;
a transparent colloid disposed on the circuit board for covering the light emitting component and the visible light sensor; and a light-tight colloid disposed on the circuit board to cover the invisible light receiving module The visible light is blocked from penetrating and the invisible light is penetrated, wherein the opaque adhesive system is in contact with or separated from the light transmitting colloid. [Item 2] The optical sensing device of claim 1, wherein the visible light sensor and the light emitting element are controllable by brightness feedback or compensation. [Item 3] The optical sensing device of claim 1, wherein the opaque colloid surrounds at least a portion of a side of the light transmissive colloid. [Item 4] The optical sensing device of claim 1, wherein the opaque colloid has a lens portion, the lens portion being located on the invisible light receiving module. [Item 5] The optical sensing device of claim 1, wherein the transparent colloid has a first light transmitting portion and a second light transmitting portion, and the first light transmitting portion and the second light transmitting portion are respectively Covering the light emitting element and the visible light sensor. [Item 6] The optical sensing device of claim 5, wherein the opaque colloid further has a light shielding portion disposed between the first light transmitting portion and the second light transmitting portion. [Item 7] The optical sensing device of claim 1, wherein the transparent colloid further comprises a third light transmitting portion, the third light transmitting portion covers the invisible light receiving module, and the opaque adhesive system covers the The third light transmitting portion. [Item 8] The optical sensing device of claim 1, wherein the transparent adhesive system is a polygonal cylinder, a cylinder or an elliptical cylinder. [Item 9] The optical sensing device of claim 1, wherein the invisible light receiving module comprises a light receiving component and a photoelectric signal processing component. [Item 10] The optical sensing device of claim 1, wherein the light emitting element comprises a light emitting diode die or a light emitting diode package structure. [Item 11] The optical sensing device of claim 1, wherein the transparent colloid has an extension, and a side of the extension is substantially coplanar with a side of the opaque colloid. [Item 12] The optical sensing device of claim 1, further comprising a metal casing covering at least a portion of the opaque colloid. [Item 13] The optical sensing device of claim 1, wherein the circuit board further comprises a plurality of pins electrically connected to the invisible light receiving module, the light emitting element and the visible light sensor, and the like The pin system extends to the opaque gel and/or the light transmissive gel. [Item 14] A method of manufacturing an optical device, comprising:
Providing a circuit board having a plurality of electronic component setting areas;
Providing a set of electronic components in each of the electronic component setting regions, wherein the set of electronic components includes a first electronic component and a second electronic component;
Performing a first molding to form a light-transmissive package structure and covering the first electronic components, wherein the light-transmissive package structure has a connecting portion between each two electronic component setting regions;
Performing a second molding to form an opaque package structure and covering the second electronic components, wherein the opaque package structure covers the connection portions; and cutting the circuit board, the transparent package structure And the opaque package structure for separating the electronic component mounting regions and forming a plurality of electronic component structures, wherein the electronic component structure comprises the first electronic component, the second electronic component, a transparent colloid, and a The light-transmitting colloid and the opaque adhesive system respectively cover the first electronic component and the second electronic component, and the transparent colloid has an extending portion, the side of the extending portion and the opaque colloid The sides are substantially coplanar and the extension is formed by the connection being cut. [Item 15] The method of fabricating an optical device according to claim 14, wherein the opaque package structure surrounds at least a portion of a side surface of the light transmissive package structure during the second molding. [Item 16] The method of manufacturing an optical device according to claim 14, wherein the electronic component further comprises a third electronic component, wherein the transparent packaging structure covers the third electronic component when the first molding is performed. . [Item 17] The method of manufacturing the optical device of claim 16, wherein the light-transmissive package structure has a first light-transmissive package portion and a second light-transmissive package portion, and the first And the second transparent package portion covers the first and third electronic components, respectively. [Item 18] The method of manufacturing an optical device according to claim 17, wherein the first electronic component is a light emitting component, the third electronic component is a visible light sensor, and the second electronic component is an invisible light. Receive module. [Item 19] The method of manufacturing an optical device according to claim 17, wherein the opaque package structure is formed between the first and second light-transmissive package portions during the second molding. [Item 20] The method of manufacturing the optical device of claim 17, wherein the light transmissive package structure has a third light transmissive package portion, the third light transmission when the first molding is performed to form the light transmissive package structure The encapsulation portion covers the second electronic component, and when the second molding is performed to form the opaque package structure, the opaque package structure further covers the third transparent package portion. [Item 21] The method of fabricating the optical device of claim 14, further comprising: providing a metal outer casing to cover at least a portion of the opaque colloid.