TWI578351B - Button structure and input device - Google Patents
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- TWI578351B TWI578351B TW104118372A TW104118372A TWI578351B TW I578351 B TWI578351 B TW I578351B TW 104118372 A TW104118372 A TW 104118372A TW 104118372 A TW104118372 A TW 104118372A TW I578351 B TWI578351 B TW I578351B
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Description
本發明一般係關於一種按鍵結構,具體而言,本發明係關於一種具有力傳導路徑設計的按鍵結構及具有此按鍵結構的輸入裝置。 The present invention generally relates to a button structure, and more particularly to a button structure having a force conduction path design and an input device having the button structure.
隨著電子裝置的薄型化要求日益增高,適用的按鍵結構高度顯著縮小。因此,習知按壓行程較大的機械式按鍵結構已逐漸為小行程按鍵或觸碰式按鍵所取代。然而,隨著行程的縮小或採用觸碰式輸入,使用者通常難以感受到按壓回饋,導致使用者無法確認按壓操作是否完成,造成操作上的困擾。 As the requirements for thinning of electronic devices are increasing, the applicable key structure is significantly reduced. Therefore, the mechanical button structure with a large pressing stroke has been gradually replaced by a small stroke button or a touch button. However, as the stroke is reduced or the touch input is used, it is often difficult for the user to feel the feedback, so that the user cannot confirm whether the pressing operation is completed, causing operational troubles.
目前已有以震動器產生震動以提供使用者按壓回饋的設計,但此設計通常是在既有的按鍵結構加設震動器,或是震動器與按鍵結構的整合具有複雜的電路及支撐設計,不利於薄型化。再者,行動裝置,例如平板電腦或智慧型手機之螢幕鍵盤,在手指觸碰時雖然會提供震動回饋,提示使用者已完成按壓操作。然而,此類提供震動回饋的裝置通常是使整個裝置一起震動,或是使裝置的某個面震動,無法提供獨立與局部的回饋,不利於操作確認。 At present, there is a design that generates vibration by a vibrator to provide feedback by the user. However, this design usually adds a vibrator to the existing button structure, or the integration of the vibrator and the button structure has a complicated circuit and support design. Not conducive to thinning. Furthermore, a mobile device, such as a screen keyboard of a tablet or a smart phone, provides vibration feedback when the finger is touched, prompting the user to complete the pressing operation. However, such a device that provides vibration feedback usually causes the entire device to vibrate together or shakes a certain surface of the device, failing to provide independent and partial feedback, which is not conducive to operational confirmation.
此外,由於此類鍵盤在使用者按壓時並無有效的力傳遞路徑,常導致下方感應區因未感受到按壓力而無法有效地被觸發。另一方面,感應區內之感應線路亦有可能因上述震動器或其他機構的加入,卻在不應 該被觸發時被觸發了,而產生了錯誤的觸發訊號。 In addition, since such a keyboard does not have an effective force transmission path when the user presses, it often causes the lower sensing area to be unable to be effectively triggered because the pressing force is not felt. On the other hand, the sensing circuit in the sensing area may also be due to the addition of the above vibrator or other mechanism, but it should not This is triggered when triggered, and an incorrect trigger signal is generated.
本發明之一目的在於提供一種按鍵結構及具有此按鍵結構之輸入裝置,其具有多層式薄膜結構,有效縮小按鍵尺寸,增加可應用性。 An object of the present invention is to provide a button structure and an input device having the same, which has a multi-layer film structure, which effectively reduces the size of the button and increases the applicability.
本發明之一目的在於提供一種按鍵結構及具有此按鍵結構之輸入裝置,其具有力傳導單元及對應形狀之感應單元,有效增加力傳導的效果及降低誤觸機會。 An object of the present invention is to provide a button structure and an input device having the same, which has a force transmission unit and a corresponding shape sensing unit, thereby effectively increasing the force transmission effect and reducing the chance of accidental touch.
本發明之一目的在於提供一種具有觸覺回饋功能的按鍵結構及具有此按鍵結構之輸入裝置,以提供獨立及局部的按壓回饋,提升使用者的使用經驗。 An object of the present invention is to provide a button structure having a tactile feedback function and an input device having the button structure to provide independent and partial press feedback, thereby improving user experience.
於一實施例,本發明提供一種按鍵結構,其包含鍵帽層、支撐層、力傳導單元、感應單元及控制電路。鍵帽層具有鍵帽區;支撐層設置於鍵帽層下方,並具有開口。力傳導單元至少部分設置於支撐層下方,且具包含膜片部及突出部。膜片部具有通孔,而突出部則自通孔周圍延伸而出;其中通孔及突出部均位於支撐層的開口內。感應單元設置於力傳導單元下方,當感應單元被觸發時可輸出觸發訊號。當外界施加按壓力時,該按壓力透過力傳導單元向下傳遞,突出部之底面壓迫感應單元以觸發感應單元,使感應單元輸出觸發訊號。 In one embodiment, the present invention provides a button structure including a keycap layer, a support layer, a force transmission unit, a sensing unit, and a control circuit. The keycap layer has a keycap region; the support layer is disposed below the keycap layer and has an opening. The force conducting unit is at least partially disposed below the support layer and includes a diaphragm portion and a protruding portion. The diaphragm portion has a through hole, and the protruding portion extends from the periphery of the through hole; wherein the through hole and the protruding portion are located in the opening of the support layer. The sensing unit is disposed below the force transmission unit, and outputs a trigger signal when the sensing unit is triggered. When a pressing force is applied from the outside, the pressing force is transmitted downward through the force transmitting unit, and the bottom surface of the protruding portion presses the sensing unit to trigger the sensing unit, so that the sensing unit outputs the trigger signal.
於另一實施例,本發明提供一種輸入裝置,其包含鍵帽層、支撐層、力傳導單元及感應單元。鍵帽層具有複數個鍵帽區;支撐層設置於鍵帽層下方,並具有複數個開口分別對應於各鍵帽區;力傳導單元包含有膜片部及複數個突出部,膜片部具有複數個通孔,而每一突出部則設置 於每一通孔的周圍,且通孔及突出部分別位於開口內;感應單元設置於力傳導單元下方,感應單元被觸發時可輸出觸發訊號。當外界施加按壓力於複數按鍵區其中一個時,按壓力透過力傳導單元向下傳遞,藉由突出部之底面壓迫感應單元,使感應單元輸出觸發訊號。 In another embodiment, the present invention provides an input device including a keycap layer, a support layer, a force transmission unit, and a sensing unit. The key cap layer has a plurality of key cap regions; the support layer is disposed under the key cap layer, and has a plurality of openings respectively corresponding to the respective key cap regions; the force transmission unit includes a diaphragm portion and a plurality of protruding portions, and the diaphragm portion has a plurality of through holes, and each protrusion is set Around each of the through holes, the through holes and the protruding portions are respectively located in the openings; the sensing unit is disposed under the force transmitting unit, and the triggering signal is output when the sensing unit is triggered. When the pressing force is applied to one of the plurality of button zones, the pressing force is transmitted downward through the force transmitting unit, and the sensing unit is pressed by the bottom surface of the protruding portion to output the trigger signal.
10‧‧‧輸入裝置 10‧‧‧Input device
100、100’‧‧‧按鍵結構 100, 100’‧‧‧ button structure
110、210‧‧‧鍵帽層 110, 210‧‧‧ keycap
111、211‧‧‧區域界定符 111, 211‧‧‧ regional delimiters
112、212‧‧‧鍵帽區 112, 212‧‧‧ keycap area
112a‧‧‧字符或圖案 112a‧‧ character or pattern
114、214‧‧‧周邊區 114, 214‧‧‧ surrounding area
120、220‧‧‧電路層 120, 220‧‧‧ circuit layer
122、222‧‧‧第一線路 122, 222‧‧‧ first line
122a、222a‧‧‧第一接點 122a, 222a‧‧‧ first joint
124、224‧‧‧第二線路 124, 224‧‧‧ second line
124a、224a‧‧‧第二接點 124a, 224a‧‧‧second junction
130、230‧‧‧觸覺產生器 130, 230‧‧‧ haptic generator
140、240‧‧‧支撐層 140, 240‧‧‧ support layer
140a、240a‧‧‧開口 140a, 240a‧‧‧ openings
150、250‧‧‧力傳導單元 150, 250‧‧‧ force transmission unit
150a、250a‧‧‧容置空間 150a, 250a‧‧‧ accommodating space
152、252‧‧‧膜片部 152, 252‧‧ ‧ Diaphragm Department
152a‧‧‧容置區 152a‧‧‧Receiving area
154、254‧‧‧突出部 154, 254‧‧ ‧ protruding parts
155‧‧‧底面 155‧‧‧ bottom
156、256‧‧‧延伸部 156, 256‧‧‧ extensions
158‧‧‧頂面 158‧‧‧ top surface
160、262‧‧‧感應單元 160, 262‧‧‧ sensing unit
170、270‧‧‧控制電路 170, 270‧‧‧ control circuit
180、280‧‧‧黏著層 180, 280‧‧ ‧ adhesive layer
260‧‧‧感應層 260‧‧‧Sense layer
D‧‧‧驅動訊號 D‧‧‧Drive Signal
F‧‧‧按壓力 F‧‧‧ Press pressure
T‧‧‧觸發訊號 T‧‧‧ trigger signal
圖1A為本發明一實施例之按鍵結構之爆炸圖;圖1B為圖1A之截面示意圖;圖1C為圖1A之按鍵結構之作動示意圖;圖2為感應單元之實施例爆炸圖;圖3A為本發明另一實施例之按鍵結構之爆炸圖;圖3B為本發明另一實施例之按鍵結構之電路層、觸覺產生器、支撐層及力傳導單元之配置示意圖;圖3C為圖3A之截面示意圖;圖3D為圖3A之按鍵結構之作動示意圖;圖3E為本發明另一實施例之按鍵結構之電路層、觸覺產生器、支撐層及力傳導單元之配置示意圖;圖4A及圖4B分別為本發明一實施例之輸入裝置之爆炸圖及組合圖;圖5A為圖4A之鍵帽層之示意圖;圖5B為圖4A之電路層之示意圖;圖5B-1為圖5B之電路層之第一線路之配置示意圖; 圖5B-2為圖5B之電路層之第二線路之配置示意圖;圖5C為圖4A之支撐層之示意圖;圖5D為圖4A之力傳導單元之示意圖;以及圖6為本發明另一實施例之輸入裝置之鍵帽層及黏著層之配置示意圖。 1A is an exploded view of a button structure according to an embodiment of the present invention; FIG. 1B is a schematic cross-sectional view of FIG. 1A; FIG. 1C is a schematic view of the operation of the button structure of FIG. 1A; FIG. 2 is an exploded view of an embodiment of the sensing unit; FIG. 3B is a schematic view showing the arrangement of the circuit layer, the tactile sensator, the support layer and the force transmission unit of the button structure according to another embodiment of the present invention; FIG. 3C is a cross section of FIG. 3A 3D is a schematic diagram of the operation of the button structure of FIG. 3A; FIG. 3E is a schematic view showing the arrangement of the circuit layer, the tactile generator, the support layer and the force transmission unit of the button structure according to another embodiment of the present invention; FIG. 4A and FIG. 4B respectively FIG. 5A is a schematic diagram of a key cap layer of FIG. 4A; FIG. 5B is a schematic diagram of a circuit layer of FIG. 4A; FIG. 5B-1 is a circuit layer of FIG. 5B. Schematic diagram of the configuration of the first line; 5B is a schematic view showing the arrangement of the second line of the circuit layer of FIG. 5B; FIG. 5C is a schematic view of the support layer of FIG. 4A; FIG. 5D is a schematic diagram of the force transmission unit of FIG. 4A; For example, the configuration of the keycap layer and the adhesive layer of the input device.
本發明提供一種具有力傳導單元的按鍵結構及具有此按鍵結構之輸入裝置。具體而言,本發明之輸入裝置可為任何具有按鍵結構的輸入裝置,例如獨立的鍵盤裝置、整合於電子產品的輸入裝置(例如行動裝置、平板電腦等配備之按鍵或鍵盤等),但不以此為限。於後以鍵盤為例,參考圖式詳細說明本發明實施例之按鍵結構及輸入裝置之細節。 The invention provides a button structure with a force transmission unit and an input device having the same. Specifically, the input device of the present invention can be any input device having a button structure, such as a separate keyboard device, an input device integrated in an electronic product (such as a mobile device, a tablet or the like, or the like), but not This is limited to this. Hereinafter, the keyboard structure and the input device of the embodiment of the present invention are described in detail with reference to the drawings.
如圖1A至圖1B所示,於一實施例,本發明之按鍵結構100係具有多層式薄膜結構,其包含鍵帽層110、支撐層140、力傳導單元150、感應單元160及控制電路170(見圖1B)。於此實施例,鍵帽層110具有鍵帽區112,係作為使用者按壓按鍵結構100之介面層。支撐層140係設置於鍵帽層110及力傳導單元150之間,以作為按鍵結構100的主要支撐結構層,並具有開口140a。力傳導單元150設置於鍵帽層110與感應單元160之間,係作為傳導按壓力至感應單元160之力傳導路徑。感應單元160設置於力傳導單元150下方,且感應單元160被觸發時可輸出觸發訊號T。控制電路170耦接於感應單元160與電路層120,且可依據實際應用需求設置於任何合宜的位置。控制電路170係用以接收感應單元160之觸發訊號T以產生感應訊號及驅動觸覺產生器130之驅動訊號D。 As shown in FIG. 1A to FIG. 1B , in an embodiment, the button structure 100 of the present invention has a multi-layer film structure including a key cap layer 110 , a support layer 140 , a force transmission unit 150 , a sensing unit 160 , and a control circuit 170 . (See Figure 1B). In this embodiment, the keycap layer 110 has a keycap region 112 as an interface layer for the user to press the button structure 100. The support layer 140 is disposed between the key cap layer 110 and the force transmission unit 150 to serve as a main support structure layer of the button structure 100 and has an opening 140a. The force conducting unit 150 is disposed between the key cap layer 110 and the sensing unit 160 as a force conducting path for conducting the pressing force to the sensing unit 160. The sensing unit 160 is disposed under the force transmitting unit 150, and the triggering signal T is output when the sensing unit 160 is triggered. The control circuit 170 is coupled to the sensing unit 160 and the circuit layer 120, and can be disposed at any convenient location according to actual application requirements. The control circuit 170 is configured to receive the trigger signal T of the sensing unit 160 to generate the sensing signal and drive the driving signal D of the haptic generator 130.
具體而言,力傳導單元150係用以傳遞自鍵帽層110傳遞下來 的按壓力,當外界施加按壓力時,按壓力透過力傳導單元150向下傳遞以觸發感應單元160。感應單元160係為開關式感應單元,當感應單元160被按壓觸發時,感應單元160可輸出觸發訊號T,進而使控制電路170產生(1)使用者輸入字元或指令的感應訊號。 Specifically, the force transmission unit 150 is configured to be transmitted from the keycap layer 110. When the pressing force is applied from the outside, the pressing force is transmitted downward through the force transmitting unit 150 to trigger the sensing unit 160. The sensing unit 160 is a switching sensing unit. When the sensing unit 160 is pressed and triggered, the sensing unit 160 can output a trigger signal T, thereby causing the control circuit 170 to generate (1) a sensing signal input by the user or a command.
如圖1A至圖1B所示,鍵帽層110係覆蓋於支撐層140上,且鍵帽層110具有鍵帽區112及周邊區114,其中周邊區114係鄰接於鍵帽區112之周圍。鍵帽區112係作為供使用者按壓的區域,且周邊區114係用於與相鄰按鍵連接。於此實施例,周邊區114係環繞鍵帽區112設置,且鍵帽區112可具有字符或圖案112a,以指示按鍵結構100所輸入的對應指令或字符。再者,於鍵帽區112周圍可具有區域界定符111,以定義鍵帽區112的範圍,讓使用者輕易辨識鍵帽區112的位置,提高按壓的正確性。換言之,區域界定符111係設置於鍵帽區112及周邊區114之交界處,以界定出鍵帽區112及周邊區114。於此實施例,區域界定符111可為突起的框形圖案,且於框形圖案內定義為鍵帽區112,於框形圖案外定義為周邊區114。當使用者進行盲打時,可藉由鍵帽區112周圍突起的區域界定符111辨識鍵帽區112的位置,有助於提升輸入的速度及正確性。再者,區域界定符111及字符或圖案112a可藉由印刷、壓印、黏貼、雷射等方式形成於鍵帽層110之上表面,且區域界定符111及字符或圖案112a可具有不同形式,不以實施例所示為限。 As shown in FIGS. 1A-1B , the key cap layer 110 is overlaid on the support layer 140 , and the key cap layer 110 has a key cap region 112 and a peripheral region 114 , wherein the peripheral region 114 is adjacent to the periphery of the key cap region 112 . The keycap area 112 serves as an area for the user to press, and the peripheral area 114 is used to connect with adjacent keys. In this embodiment, the perimeter region 114 is disposed around the keycap region 112, and the keycap region 112 can have characters or patterns 112a to indicate corresponding instructions or characters entered by the button structure 100. Furthermore, a region delimiter 111 may be provided around the keycap region 112 to define a range of the keycap region 112, so that the user can easily recognize the position of the keycap region 112 and improve the correctness of the pressing. In other words, the region delimiter 111 is disposed at the junction of the keycap region 112 and the peripheral region 114 to define the keycap region 112 and the peripheral region 114. In this embodiment, the region delimiter 111 may be a raised frame-shaped pattern, and is defined as a keycap region 112 within the frame-shaped pattern and as a peripheral region 114 outside the frame-shaped pattern. When the user performs a blind hit, the position of the keycap area 112 can be recognized by the raised area delimiter 111 around the keycap area 112, which helps to improve the speed and correctness of the input. Furthermore, the area delimiter 111 and the character or pattern 112a may be formed on the upper surface of the keycap layer 110 by printing, imprinting, pasting, laser, etc., and the area delimiter 111 and the character or pattern 112a may have different forms. , not limited to the examples.
鍵帽層110的厚度較佳為0.075~2mm,且較佳為軟性材質,以增加使用者按壓按鍵結構100的舒適感。當使用者按壓鍵帽區112時,軟性材質可具有相對較低的硬度以提升按壓舒適感,且在按壓點的徑向上具有較小的能量損失。此外,軟性材質因為鍵帽區112的按壓撓曲對於接受觸 覺回饋亦可提供較佳的效應。當鍵帽區112的按壓撓曲越大時,鍵帽區112對應按壓點之厚度越小,使得將能量傳遞至使用者(例如手指)的路徑越短,有利於減少觸覺產生器130發生震動時的動能損耗。鍵帽層110之材料可包含例如聚酯(PU)、熱塑聚酯(TPU)、皮革、織物、矽膠等。 The thickness of the keycap layer 110 is preferably 0.075 to 2 mm, and is preferably a soft material to increase the user's comfort in pressing the button structure 100. When the user presses the keycap region 112, the soft material may have a relatively low hardness to enhance the press comfort and have a small energy loss in the radial direction of the pressing point. In addition, the soft material is deflected due to the pressing of the keycap region 112. The feedback feedback can also provide better effects. When the pressing deflection of the keycap region 112 is larger, the smaller the thickness of the keycap region 112 corresponding to the pressing point, the shorter the path for transmitting energy to the user (for example, a finger), which is advantageous for reducing the vibration of the tactile sensator 130. Kinetic energy loss. The material of the keycap layer 110 may include, for example, polyester (PU), thermoplastic polyester (TPU), leather, fabric, silicone, and the like.
此外,於一實施例,鍵帽層110可僅覆蓋於支撐層140上作為按鍵結構100的最上層;此時按鍵結構100可選擇性具有將各元件整合的殼體,使得各元件設置於殼體中且裸露出鍵帽層110供使用者操作。再者,按鍵結構100可選擇性包含基底層(未圖示),其中基底層係設置於感應單元160下方,以增進按鍵結構100之整體結構強度。基底層較佳為相對剛性較大的材質(例如金屬板材,硬質塑料或聚合物層),以維持按鍵結構100的強度而不至於彎折損壞。上述殼體亦可與基底層整合在一起,使得殼體的底部係作為基底層。於另一實施例,鍵帽層110可作為包覆按鍵結構100之整體元件的包覆層,但不以此為限。 In addition, in an embodiment, the key cap layer 110 may only cover the support layer 140 as the uppermost layer of the button structure 100; at this time, the button structure 100 may selectively have a housing for integrating the components, so that the components are disposed on the shell. The keycap layer 110 is exposed and exposed to the user for operation. Moreover, the button structure 100 can optionally include a base layer (not shown), wherein the base layer is disposed under the sensing unit 160 to enhance the overall structural strength of the button structure 100. The base layer is preferably a relatively rigid material (e.g., sheet metal, rigid plastic or polymer layer) to maintain the strength of the button structure 100 without bending damage. The housing may also be integrated with the base layer such that the bottom of the housing acts as a base layer. In another embodiment, the key cap layer 110 can serve as a coating for covering the integral components of the button structure 100, but is not limited thereto.
如圖1A至圖1B所示,力傳導單元150至少部分設置於支撐層140下方。具體而言,力傳導單元150包含膜片部152及突出部154,其中膜片部152具有容置區152a,突出部154係設置於容置區152a周圍並自膜片部152突起,以定義容置空間150a。於此實施例,膜片部152具有通孔以作為容置區152a。換言之,突出部154係設置於通孔152a周圍並自膜片部152上表面朝鍵帽層110突起,以形成容置空間150a,使得突出部154之頂面158係高於膜片部152之上表面。在此需注意,於此實施例,雖以通孔作為膜片部152之容置區152a,但不以此為限。於其他實施例,膜片部152之容置區152a可為膜片部152之部分表面區域或凹陷區域。此外,容置區152a較佳係對應於 鍵帽區112,且可依據按鍵實際需求設計,而不限於圖1A所示的矩形。於其他實施例(未圖示),容置區152a可為圓形、橢圓形或任何合宜形狀。對應於容置區152a的形狀,突出部154可僅環繞容置區152a的部分周邊或實質環繞容置區152a的所有周邊。舉例而言,如圖1A所示,當容置區152a對應鍵帽區112為矩形時,突出部154可環繞容置區152a的三個側邊設置。於此實施例,突出部154較佳為連續的突出結構,但不以此為限。於其他實施例,突出部154亦可為不連續的突出結構,即突出部154可由複數個凸柱或凸塊沿容置區152a之周圍設置所構成。 As shown in FIGS. 1A-1B, the force conducting unit 150 is at least partially disposed below the support layer 140. Specifically, the force transmitting unit 150 includes a diaphragm portion 152 and a protruding portion 154. The diaphragm portion 152 has a receiving portion 152a. The protruding portion 154 is disposed around the receiving portion 152a and protrudes from the diaphragm portion 152 to define The accommodation space 150a. In this embodiment, the diaphragm portion 152 has a through hole as the accommodating portion 152a. In other words, the protruding portion 154 is disposed around the through hole 152a and protrudes from the upper surface of the diaphragm portion 152 toward the keycap layer 110 to form the accommodating space 150a such that the top surface 158 of the protruding portion 154 is higher than the diaphragm portion 152. Upper surface. It should be noted that in this embodiment, the through hole is used as the receiving area 152a of the diaphragm portion 152, but is not limited thereto. In other embodiments, the receiving area 152a of the diaphragm portion 152 may be a partial surface area or a recessed area of the diaphragm portion 152. In addition, the accommodating area 152a preferably corresponds to The keycap area 112 can be designed according to the actual needs of the button, and is not limited to the rectangle shown in FIG. 1A. In other embodiments (not shown), the receiving area 152a can be circular, elliptical or any suitable shape. Corresponding to the shape of the accommodating area 152a, the protrusion 154 may surround only a part of the circumference of the accommodating area 152a or substantially surround all the circumferences of the accommodating area 152a. For example, as shown in FIG. 1A, when the accommodating area 152a corresponds to the keycap area 112 being rectangular, the protrusion 154 may be disposed around the three sides of the accommodating area 152a. In this embodiment, the protruding portion 154 is preferably a continuous protruding structure, but is not limited thereto. In other embodiments, the protrusion 154 may also be a discontinuous protruding structure, that is, the protrusion 154 may be formed by a plurality of protrusions or bumps disposed along the circumference of the accommodating area 152a.
力傳導單元150,特別是突出部154,較佳係由硬度70A以下的緩衝材,更佳係由硬度10A~60A之緩衝材,藉由雷射或熱壓模技術所製成。於一實施例,力傳導單元150係由例如矽膠材料所製成。亦即,力傳導單元150可為軟性材料,以免設置於感應單元160上時會因其自身的重量而使感應單元160在鍵帽層110未被按壓的情況下產生誤觸訊號。如上所述,力傳導單元150係用以傳遞按壓力至其下方的感應單元160,以觸發感應單元160輸出觸發訊號T。於此實施例,按壓力可透過鍵帽層110及突出部154傳遞;當鍵帽區受壓迫時,突出部154之底面155即壓迫感應單元160而產生觸發訊號T。於一實施例,如圖1B所示,突出部154之外側壁較佳係實質對準鍵帽區112之邊界,或略大於鍵帽區112之邊界,藉此當使用者按壓於鍵帽區112之邊界時,亦可有效透過突出部154向下傳遞按壓力,但不以此為限。 The force transmitting unit 150, particularly the protruding portion 154, is preferably made of a cushioning material having a hardness of 70 A or less, more preferably a cushioning material having a hardness of 10 A to 60 A, by laser or hot stamping technique. In one embodiment, the force transmitting unit 150 is made of, for example, a silicone material. That is, the force transmission unit 150 may be a soft material so that the sensing unit 160 may generate a false touch signal when the keycap layer 110 is not pressed due to its own weight when disposed on the sensing unit 160. As described above, the force transmission unit 150 is configured to transmit the pressing force to the sensing unit 160 below it to trigger the sensing unit 160 to output the trigger signal T. In this embodiment, the pressing force can be transmitted through the key cap layer 110 and the protruding portion 154; when the key cap region is pressed, the bottom surface 155 of the protruding portion 154 presses the sensing unit 160 to generate the trigger signal T. In one embodiment, as shown in FIG. 1B, the outer sidewall of the protrusion 154 is preferably substantially aligned with the boundary of the keycap region 112, or slightly larger than the boundary of the keycap region 112, whereby the user presses the keycap region. At the boundary of 112, the pressing force can also be effectively transmitted downward through the protruding portion 154, but not limited thereto.
如圖1A至圖1B所示,支撐層140係設置於膜片部152上且具有開口140a,使得突出部154係位於開口140a。亦即,開口140a較佳係對應 鍵帽層110之鍵帽區112且範圍涵蓋環繞容置區152a之突出部154,而使得支撐層140設置於膜片部152上時,突出部154係位於開口140a中(如圖1B所示)。於此實施例,支撐層140之硬度較佳係大於力傳導單元150的硬度。換言之,支撐層140的設置可確保使用者按壓鍵帽層110時不會因為力傳導單元150的硬度太低而變形壓縮容置空間150a。 As shown in FIGS. 1A-1B, the support layer 140 is disposed on the diaphragm portion 152 and has an opening 140a such that the protrusion 154 is located at the opening 140a. That is, the opening 140a preferably corresponds to The keycap region 112 of the keycap layer 110 and the range encompasses the protrusion 154 surrounding the receiving area 152a, such that when the support layer 140 is disposed on the diaphragm portion 152, the protrusion 154 is located in the opening 140a (as shown in FIG. 1B). ). In this embodiment, the hardness of the support layer 140 is preferably greater than the hardness of the force transmission unit 150. In other words, the arrangement of the support layer 140 ensures that the user does not deform the compression accommodating space 150a because the hardness of the force transmission unit 150 is too low when the user presses the key cap layer 110.
於一實施例,當力傳導單元150之突出部154穿設於支撐層140的開口140a時,支撐層140的頂面較佳係實質等於或略高於突出部154的頂面158,以供支撐鍵帽層110,且減少誤觸發生的機會,但不限於此。於一實施例,支撐層140之開口140a較佳係對應鍵帽區112,亦即開口140a的形狀、大小、位置較佳與鍵帽區112對應,以使得使用者按壓於鍵帽區112時可確保藉由力傳導單元150之力傳遞部分(例如突出部154)傳遞按壓力至感應單元160。 In one embodiment, when the protrusion 154 of the force transmission unit 150 is disposed through the opening 140a of the support layer 140, the top surface of the support layer 140 is preferably substantially equal to or slightly higher than the top surface 158 of the protrusion 154 for The keycap layer 110 is supported, and the chance of occurrence of a false touch is reduced, but is not limited thereto. In one embodiment, the opening 140a of the support layer 140 preferably corresponds to the keycap region 112, that is, the shape, size, and position of the opening 140a preferably correspond to the keycap region 112, so that when the user presses the keycap region 112. It is ensured that the pressing force is transmitted to the sensing unit 160 by the force transmitting portion (for example, the protruding portion 154) of the force transmitting unit 150.
如圖1C所示,當外界施加按壓力F時,按壓力F透過力傳導單元150向下傳遞以觸發感應單元160,使得感應單元160輸出觸發訊號T到控制電路170。亦即,當使用者按壓按鍵結構100時(例如按壓於鍵帽層110之鍵帽區112時),藉由力傳導單元150的結構特性(例如突出部154的底面155壓迫感應單元160),按壓力係透過上述的途徑向下傳遞以觸發感應單元160發出觸發訊號T,觸發訊號T較佳係作為操作按鍵結構100以輸入相應的字元或指令的感應訊號。 As shown in FIG. 1C, when the pressing force F is applied from the outside, the pressing force F is transmitted downward through the force transmitting unit 150 to trigger the sensing unit 160, so that the sensing unit 160 outputs the trigger signal T to the control circuit 170. That is, when the user presses the button structure 100 (eg, when pressed against the keycap region 112 of the keycap layer 110), by the structural characteristics of the force conducting unit 150 (eg, the bottom surface 155 of the protrusion 154 presses the sensing unit 160), The pressing force is transmitted downward through the above-mentioned way to trigger the sensing unit 160 to send the trigger signal T. The trigger signal T is preferably used as the sensing signal for operating the button structure 100 to input the corresponding character or command.
再者,感應單元160之感應線路較佳係對應於力傳導單元150之力傳遞部分(例如突出部154之155)設置,以使得按壓力僅藉由上述途徑傳遞,而不會透過支撐層140傳遞,進而降低誤觸鄰近按鍵之感應區165的可 能性。具體而言,感應單元160係為薄膜式開關(membrane),如圖1A所示。作為感應單元160的薄膜式開關具有感應區165,其形狀較佳與突出部154的形狀近似,例如與突出部154的底面155形狀對應。如圖1A所示,由於突出部154係圍繞著一矩形空間的三邊設置而形成類似U字形,因此感應區165之形狀亦隨之為圍繞矩形空間的三邊設置,而形成類似U字形的形狀。然而在不同實施例中,由於突出部154亦可形成為環形或其他形狀,因此感應區165亦可隨之改變分佈的形狀。 Furthermore, the sensing circuit of the sensing unit 160 is preferably disposed corresponding to the force transmitting portion of the force transmitting unit 150 (for example, 155 of the protruding portion 154), so that the pressing force is transmitted only by the above-mentioned route without passing through the supporting layer 140. Passing, thereby reducing the possibility of accidentally touching the sensing area 165 of the adjacent button Capability. Specifically, the sensing unit 160 is a membrane switch as shown in FIG. 1A. The membrane switch as the sensing unit 160 has a sensing area 165 whose shape is preferably similar to the shape of the protrusion 154, for example, corresponding to the shape of the bottom surface 155 of the protrusion 154. As shown in FIG. 1A, since the protrusions 154 are formed in a U-shape around the three sides of a rectangular space, the shape of the sensing area 165 is also arranged around the three sides of the rectangular space to form a U-shaped shape. shape. However, in various embodiments, since the protrusions 154 may also be formed in a ring shape or other shape, the sensing area 165 may also change the shape of the distribution.
如圖2所示,作為感應單元160的薄膜式開關係由第一薄膜161、第二薄膜162及間隔層168疊合而成,其中間隔層168係夾設於第一薄膜161及第二薄膜162之間。第一薄膜161及第二薄膜162上分別形成有金屬線路163,而形成感應區165內的開關線路。如圖2B所示,第一薄膜161上的金屬線路163與第二薄膜162上的金屬線路163係呈交錯設置,因此所組成的開關線路從上方俯看即形成為一網格形狀。 As shown in FIG. 2, the film opening relationship of the sensing unit 160 is formed by laminating the first film 161, the second film 162 and the spacer layer 168, wherein the spacer layer 168 is sandwiched between the first film 161 and the second film. Between 162. A metal line 163 is formed on each of the first film 161 and the second film 162 to form a switching line in the sensing region 165. As shown in FIG. 2B, the metal lines 163 on the first film 161 and the metal lines 163 on the second film 162 are staggered, so that the formed switching lines are formed into a grid shape when viewed from above.
如圖3A至圖3C所示,為本發明之另一實施例。在此實施例中,按鍵結構100進一步包含電路層120及至少一觸覺產生器130。於此實施例,電路層120設置於鍵帽層110下方,係作為提供驅動觸覺產生器130之訊號傳遞途徑的電路徑層及載置觸覺產生器130之基板層。至少一觸覺產生器130設置於電路層120下方並電連接電路層120,以作為按壓後之觸覺回饋層。控制電路170耦接於感應單元160與電路層120,且可依據實際應用需求設置於任何合宜的位置。當控制電路170係用以接收感應單元160之觸發訊號T時,即產生感應訊號及驅動觸覺產生器130之驅動訊號D。 3A to 3C, another embodiment of the present invention. In this embodiment, the button structure 100 further includes a circuit layer 120 and at least one haptic generator 130. In this embodiment, the circuit layer 120 is disposed under the keycap layer 110 as an electrical path layer for providing a signal transmission path for driving the haptic generator 130 and a substrate layer for mounting the haptic generator 130. At least one haptic generator 130 is disposed under the circuit layer 120 and electrically connected to the circuit layer 120 as a haptic feedback layer after pressing. The control circuit 170 is coupled to the sensing unit 160 and the circuit layer 120, and can be disposed at any convenient location according to actual application requirements. When the control circuit 170 is configured to receive the trigger signal T of the sensing unit 160, the sensing signal is generated and the driving signal D of the haptic generator 130 is driven.
具體而言,力傳導單元150具有容置空間150a供容置觸覺產 生器130。電路層120用以電連接觸覺產生器130,並提供驅動觸覺產生器130的電路徑,使得控制電路170可透過電路層120電連接觸覺產生器130。如上所述,感應單元160較佳為開關式感應單元,當感應單元160被按壓觸發時,感應單元160可輸出觸發訊號T,進而使控制電路170產生(1)使用者輸入字元或指令的感應訊號,及(2)驅動觸覺產生器130震動之驅動訊號D。電路層120之下表面對應鍵帽區112具有至少一第一接點122a及至少一第二接點124a,其中第一接點122a係與第二接點124a電性隔離。至少一觸覺產生器130係位於力傳導單元150之容置空間150a中,且電連接第一接點部122a及第二接點124a。感應單元160被觸發時可輸出觸發訊號T,而控制電路170於接收觸發訊號T後,會輸出驅動訊號D給觸覺產生器130,以驅動觸覺產生器130發生震動(詳見圖3D之相關說明)。 Specifically, the force transmission unit 150 has an accommodation space 150a for accommodating the tactile production. The generator 130. The circuit layer 120 is used to electrically connect the haptic generator 130 and provide an electrical path for driving the haptic generator 130 such that the control circuit 170 can electrically connect the haptic generator 130 through the circuit layer 120. As described above, the sensing unit 160 is preferably a switch sensing unit. When the sensing unit 160 is pressed and triggered, the sensing unit 160 can output a trigger signal T, thereby causing the control circuit 170 to generate (1) a user input character or instruction. The sensing signal, and (2) the driving signal D for driving the haptic generator 130 to vibrate. The lower surface of the circuit layer 120 corresponding to the keycap region 112 has at least one first contact 122a and at least one second contact 124a, wherein the first contact 122a is electrically isolated from the second contact 124a. The at least one haptic generator 130 is located in the accommodating space 150a of the force transmitting unit 150, and electrically connects the first contact portion 122a and the second contact 124a. When the sensing unit 160 is triggered, the trigger signal T can be output, and after receiving the trigger signal T, the control circuit 170 outputs the driving signal D to the haptic generator 130 to drive the haptic generator 130 to vibrate (see FIG. 3D for details). ).
再者,本發明於此所述之「觸覺產生器」係泛指可受驅動訊號D驅動而提供觸覺回饋(例如震動)的元件。觸覺產生器可包含,例如但不限於:壓電致動器(piezoelectric actuator)、聲圈致動器(voice coil actuator)、震動馬達(pager motor)、電磁震動器(solenoid)或其他類型的觸覺產生器。壓電致動器具有非常薄且小的優點,因此非常適合用於多層式薄膜結構的按鍵結構。於後,以壓電致動器為例,說明本發明之按鍵結構各元件的細部結構及相互作用。 Furthermore, the term "tactile generator" as used herein refers to an element that can be driven by a drive signal D to provide tactile feedback (eg, vibration). The haptic generator can include, for example but not limited to: a piezoelectric actuator, a voice coil actuator, a pager motor, a solenoid, or other type of tactile sensation. Generator. Piezoelectric actuators have the advantage of being very thin and small, and are therefore well suited for use in button structures for multilayer film structures. Hereinafter, the detailed structure and interaction of each element of the key structure of the present invention will be described by taking a piezoelectric actuator as an example.
如圖3A至圖3C所示,鍵帽層110係覆蓋於電路層120上,且鍵帽層110具有鍵帽區112及周邊區114,其中周邊區114係鄰接於鍵帽區112之周圍。鍵帽區112係對應觸覺產生器130並作為供使用者按壓的區域,且周邊區114係用於連接下方的電路層120。 As shown in FIGS. 3A-3C , the key cap layer 110 covers the circuit layer 120 , and the key cap layer 110 has a key cap region 112 and a peripheral region 114 , wherein the peripheral region 114 is adjacent to the periphery of the key cap region 112 . The keycap region 112 corresponds to the haptic generator 130 and serves as a region for the user to press, and the peripheral region 114 is used to connect the underlying circuit layer 120.
鍵帽層110的厚度較佳為0.075~2mm,且較佳為軟性材質,軟性材質因為鍵帽區112的按壓撓曲對於接受觸覺回饋亦可提供較佳的效應。當鍵帽區112的按壓撓曲越大時,鍵帽區112對應按壓點之厚度越小,使得將能量傳遞至使用者(例如手指)的路徑越短,有利於減少觸覺產生器130發生震動時的動能損耗。鍵帽層110之材料可包含例如聚酯(PU)、熱塑聚酯(TPU)、皮革、織物、矽膠等。 The thickness of the key cap layer 110 is preferably 0.075~2 mm, and is preferably a soft material. The soft material can also provide a better effect by receiving the tactile feedback because the pressing deflection of the key cap region 112. When the pressing deflection of the keycap region 112 is larger, the smaller the thickness of the keycap region 112 corresponding to the pressing point, the shorter the path for transmitting energy to the user (for example, a finger), which is advantageous for reducing the vibration of the tactile sensator 130. Kinetic energy loss. The material of the keycap layer 110 may include, for example, polyester (PU), thermoplastic polyester (TPU), leather, fabric, silicone, and the like.
電路層120較佳為相對較硬的材料所構成的薄片形式,以作為載置觸覺產生器130的基板。電路層120的厚度較佳為0.05~0.5mm,且電路層120可由絕緣層及設置於絕緣層的導電路徑線路所構成,其中絕緣層可由例如聚對苯二甲酸乙二酯(Polyethylene Terephthalate,PET)所構成。換言之,電路層120之硬度係大於鍵帽層110之硬度,且電路層120之厚度較佳係小於鍵帽層110之厚度。如圖3A及圖3B所示,電路層120設置於鍵帽層110下方,其中電路層120之下表面對應鍵帽區112具有電隔離的至少一第一接點122a及至少一第二接點124a,以供電連接觸覺產生器130。具體而言,電路層120具有提供驅動訊號D傳遞至觸覺產生器130的第一電路徑122及第二電路徑124,其中第一電路徑122及第二電路徑124係電隔離地設置於電路層120的下表面,且分別包含第一接點122a及第二接點124a。亦即,第一電路徑122及第二電路徑124係設置於電路層120背向於鍵帽層110的一側(即下側),以使得觸覺產生器130及鍵帽層110係分別設置電路層120的兩相對側。 The circuit layer 120 is preferably in the form of a sheet of relatively hard material to serve as a substrate on which the tactile generator 130 is placed. The thickness of the circuit layer 120 is preferably 0.05-0.5 mm, and the circuit layer 120 may be composed of an insulating layer and a conductive path line disposed on the insulating layer, wherein the insulating layer may be, for example, polyethylene terephthalate (PET). ) constitutes. In other words, the hardness of the circuit layer 120 is greater than the hardness of the key cap layer 110, and the thickness of the circuit layer 120 is preferably less than the thickness of the key cap layer 110. As shown in FIG. 3A and FIG. 3B, the circuit layer 120 is disposed under the keycap layer 110, wherein the lower surface of the circuit layer 120 corresponds to at least one first contact 122a and at least one second contact electrically separated from the keycap region 112. 124a, the tactile generator 130 is connected to the power supply. Specifically, the circuit layer 120 has a first electrical path 122 and a second electrical path 124 that provide a driving signal D to the haptic generator 130. The first electrical path 122 and the second electrical path 124 are electrically isolated from the circuit. The lower surface of the layer 120 includes a first contact 122a and a second contact 124a, respectively. That is, the first electrical path 122 and the second electrical path 124 are disposed on a side of the circuit layer 120 facing away from the keycap layer 110 (ie, the lower side) such that the tactile sensitizer 130 and the keycap layer 110 are respectively disposed. Two opposite sides of circuit layer 120.
於此實施例,觸覺產生器130係由壓電材料所構成,且較佳為片狀形式,其中壓電材料可包含例如壓電單晶體、壓電多晶體(壓電陶瓷)、壓電聚合物、或壓電複合材料,但不以此為限。觸覺產生器130設置 於電路層120下方,且電連接第一電路徑122之第一接點122a及第二電路徑124之第二電接點124a,使得驅動訊號D可經由電路徑122、124傳遞,以驅動觸覺產生器130產生應變而提供觸覺回饋(例如震動)。在此需注意,觸覺產生器130較佳僅藉由第一接點122a及第二電接點124a實體連接於電路層120,以使得觸覺產生器130具有較大震動效應。亦即,觸覺產生器130可藉由例如銀膠、焊錫等電連接材料連接第一接點122a及第二電接點124a,進而達到實體連接電路層120,使得觸覺產生器130未連接電路層120的部分具有較大的震動效應。然而,於其他實施例,除了藉由第一接點122a及第二電接點124a外,觸覺產生器130可藉由其他黏著方式加強與電路層120的實體連接,以防止觸覺產生器130自電路層120脫離但仍保有預期的觸覺回饋效應。再者,觸覺產生器130相對於電路層120的震動方向可包含例如上/下蝶式震動或水平伸縮式震動,且振動方式可包含例如連續震動或脈衝式震動,但不以此為限。 In this embodiment, the haptic generator 130 is composed of a piezoelectric material, and is preferably in the form of a sheet, wherein the piezoelectric material may include, for example, a piezoelectric single crystal, a piezoelectric polycrystalline (piezoelectric ceramic), a piezoelectric polymer. Or piezoelectric composite materials, but not limited to this. Haptic generator 130 setting Under the circuit layer 120, and electrically connecting the first contact 122a of the first electrical path 122 and the second electrical contact 124a of the second electrical path 124, the driving signal D can be transmitted via the electrical paths 122, 124 to drive the tactile sense. Generator 130 produces strain to provide tactile feedback (eg, vibration). It should be noted that the haptic generator 130 is preferably physically connected to the circuit layer 120 only by the first contact 122a and the second electrical contact 124a, so that the haptic generator 130 has a large vibration effect. That is, the haptic generator 130 can connect the first contact 122a and the second electrical contact 124a with an electrical connection material such as silver paste, solder, etc., thereby reaching the physical connection circuit layer 120, so that the haptic generator 130 is not connected to the circuit layer. The portion of 120 has a large vibration effect. However, in other embodiments, in addition to the first contact 122a and the second electrical contact 124a, the haptic generator 130 can enhance the physical connection with the circuit layer 120 by other adhesive means to prevent the haptic generator 130 from Circuit layer 120 is detached but still retains the expected haptic feedback effect. Furthermore, the direction of vibration of the haptic generator 130 relative to the circuit layer 120 may include, for example, an up/down butterfly vibration or a horizontally telescopic vibration, and the vibration mode may include, for example, continuous vibration or pulsed vibration, but is not limited thereto.
如圖3A至圖3C所示,力傳導單元150設置於電路層120下方,_且力傳導單元150具有容置空間150a,其中觸覺產生器130係位於容置空間150a中。具體而言,力傳導單元150包含膜片部152及突出部154,其中膜片部152具有容置區152a,突出部154係設置於容置區152a周圍並自膜片部152突起,以定義容置空間150a供容置觸覺產生器130。於此實施例,膜片部152具有通孔以作為容置區152a。換言之,觸覺產生器130係容納於通孔中。如圖3A及圖3B所示,當容置區152a對應鍵帽區112為矩形時,突出部154可環繞容置區152a的三個側邊設置,僅保留設置第一接點122a及第二接點124a之側邊未設置突出部154。於其他實施例,當容置區152a對應鍵帽區112 為圓形時,除對應第一接點122a及第二接點124a的位置外,突出部154可實質環繞容置區152a的所有周邊。 As shown in FIG. 3A to FIG. 3C, the force transmission unit 150 is disposed under the circuit layer 120, and the force transmission unit 150 has an accommodation space 150a, wherein the tactile sensor 130 is located in the accommodation space 150a. Specifically, the force transmitting unit 150 includes a diaphragm portion 152 and a protruding portion 154. The diaphragm portion 152 has a receiving portion 152a. The protruding portion 154 is disposed around the receiving portion 152a and protrudes from the diaphragm portion 152 to define The accommodating space 150a is for accommodating the haptic generator 130. In this embodiment, the diaphragm portion 152 has a through hole as the accommodating portion 152a. In other words, the haptic generator 130 is housed in the through hole. As shown in FIG. 3A and FIG. 3B, when the accommodating area 152a is rectangular corresponding to the keycap area 112, the protruding portion 154 can be disposed around the three sides of the accommodating area 152a, and only the first contact 122a and the second are reserved. A protrusion 154 is not provided on the side of the contact 124a. In other embodiments, when the accommodating area 152a corresponds to the keycap area 112 When it is circular, the protrusion 154 may substantially surround all the circumferences of the accommodating area 152a except for the positions corresponding to the first contact 122a and the second contact 124a.
當力傳導單元150作為電路層120之支撐結構層時,突出部154的厚度較佳係大於觸覺產生器130的厚度。當觸覺產生器130於容置空間150a震動時,突出部154的厚度係足以提供觸覺產生器130適當的震動空間(即觸覺產生器130的下方具有足夠空間)。此外,支撐層140之厚度較佳大於觸覺產生器130之厚度,以確保觸覺產生器130震動的空間。換言之,支撐層140的設置可確保使用者按壓鍵帽層110時使觸覺產生器130具有足夠的震動空間,而不會因為力傳導單元150的硬度太低而變形壓縮容置空間150a,進而使得觸覺產生器130壓抵感應單元160而無法發生震動回饋。具體而言,支撐層140的厚度係取決於觸覺產生器130的厚度及震動空間的高度。舉例而言,當震動空間的高度大於例如0.8mm時,觸覺產生器130會具有較佳的震動效果。因此,支撐層140的厚度較佳設計為大於觸覺產生器130的厚度且在按壓時能於觸覺產生器130下方保有高度大於0.8mm的震動空間。 When the force conducting unit 150 is used as the supporting structure layer of the circuit layer 120, the thickness of the protruding portion 154 is preferably greater than the thickness of the tactile finder 130. When the haptic generator 130 vibrates in the accommodating space 150a, the thickness of the protrusion 154 is sufficient to provide a suitable vibration space of the haptic generator 130 (ie, there is sufficient space below the haptic generator 130). In addition, the thickness of the support layer 140 is preferably greater than the thickness of the haptic generator 130 to ensure a space in which the haptic generator 130 vibrates. In other words, the arrangement of the support layer 140 can ensure that the tactile sensator 130 has sufficient vibration space when the user presses the key cap layer 110 without deforming the compression accommodating space 150a because the hardness of the force transmission unit 150 is too low, thereby The haptic generator 130 is pressed against the sensing unit 160 so that vibration feedback cannot occur. Specifically, the thickness of the support layer 140 depends on the thickness of the tactile sensator 130 and the height of the vibration space. For example, when the height of the vibration space is greater than, for example, 0.8 mm, the haptic generator 130 has a better vibration effect. Therefore, the thickness of the support layer 140 is preferably designed to be larger than the thickness of the tactile generator 130 and to maintain a vibration space having a height greater than 0.8 mm below the tactile generator 130 when pressed.
再者,於一實施例,力傳導單元150更具有延伸部156,其中延伸部156係自突出部154朝容置空間150a內側延伸,且延伸部156之頂面低於突出部154之頂面。如圖3C所示,當觸覺產生器130容置於容置空間150a時,觸覺產生器130較佳部分重疊延伸部156或抵靠於延伸部156。換言之,延伸部154之頂面較佳係高於膜片部152的上表面且低於觸覺產生器130之底面,且延伸部154較佳係朝容置空間150a內側延伸至部分觸覺產生器130下方。藉此,力傳導單元150向上突起的突出部154係於鍵帽層110下方提供 觸覺產生器130震動的空間(例如150a),且延伸部156提供觸覺產生器130發生震動時的局部支撐,以免觸覺產生器130壓抵感應單元160。 Furthermore, in an embodiment, the force transmission unit 150 further has an extension portion 156, wherein the extension portion 156 extends from the protrusion portion 154 toward the inside of the accommodating space 150a, and the top surface of the extension portion 156 is lower than the top surface of the protrusion portion 154. . As shown in FIG. 3C, when the haptic generator 130 is received in the accommodating space 150a, the haptic generator 130 preferably partially overlaps the extension 156 or abuts the extension 156. In other words, the top surface of the extending portion 154 is preferably higher than the upper surface of the diaphragm portion 152 and lower than the bottom surface of the tactile generator 130, and the extending portion 154 preferably extends toward the inner side of the receiving space 150a to the partial tactile generator 130. Below. Thereby, the protruding portion 154 of the force transmitting unit 150 protruding upward is provided under the keycap layer 110. The space in which the haptic generator 130 vibrates (eg, 150a), and the extension 156 provides local support when the haptic generator 130 vibrates to prevent the haptic generator 130 from pressing against the sensing unit 160.
再者,於一實施例,如圖3C所示,按鍵結構100更包含黏著層180,其中黏著層180係設置於鍵帽層110下表面且位於鍵帽區112之外,以黏著鍵帽層110及電路層120。具體而言,黏著層180係僅設置於鍵帽層110對應於周邊區114的下表面。換言之,黏著層180並未設置於鍵帽層110對應於鍵帽區112的下表面,使得鍵帽區112及電路層120對應鍵帽區112的部分不黏著在一起(或有空隙)。藉此,當觸覺產生器130受到驅動訊號D的驅動而震動時,可以減少觸覺產生器130發生震動時的動能損耗。亦即,若電路層120與鍵帽層110全部都黏起來時,觸覺產生器130的「負載」加重,不易產生震動,而使得動能損耗加大。於此實施例,黏著層180的厚度較佳小於0.5mm,但不以此為限。再者,按鍵結構100的其餘元件(例如電路層120、力傳導單元150、感應單元160等)之間亦可藉由黏著方式固定,以定位各元件間的相對位置。 Furthermore, in an embodiment, as shown in FIG. 3C, the button structure 100 further includes an adhesive layer 180, wherein the adhesive layer 180 is disposed on the lower surface of the keycap layer 110 and outside the keycap region 112 to adhere the keycap layer. 110 and circuit layer 120. Specifically, the adhesive layer 180 is disposed only on the lower surface of the key cap layer 110 corresponding to the peripheral region 114. In other words, the adhesive layer 180 is not disposed on the lower surface of the keycap layer 110 corresponding to the keycap region 112, such that the portions of the keycap region 112 and the circuit layer 120 corresponding to the keycap region 112 are not adhered together (or have voids). Thereby, when the haptic generator 130 is vibrated by the driving of the driving signal D, the kinetic energy loss when the haptic generator 130 vibrates can be reduced. That is, if the circuit layer 120 and the key cap layer 110 are all adhered, the "load" of the tactile generator 130 is aggravated, and vibration is less likely to occur, and the kinetic energy loss is increased. In this embodiment, the thickness of the adhesive layer 180 is preferably less than 0.5 mm, but is not limited thereto. Furthermore, the remaining components of the button structure 100 (eg, the circuit layer 120, the force transmitting unit 150, the sensing unit 160, etc.) may also be fixed by adhesion to locate the relative positions between the components.
如圖3D所示,當外界施加按壓力F時,按壓力F透過力傳導單元150向下傳遞以觸發感應單元160,使得感應單元160輸出觸發訊號T到控制電路170。控制電路170接收觸發訊號T而可輸出驅動訊號D給觸覺產生器130進而驅動觸覺產生器130發生震動。亦即,當使用者按壓按鍵結構100時(例如按壓於鍵帽層110之鍵帽區112時),支撐層140在按壓力的作用下使觸覺產生器130仍有足夠的震動空間,且藉由力傳導單元150的結構特性(例如突出部154、延伸部156),按壓力係透過上述的兩種途徑向下傳遞以觸發感應單元160發出觸發訊號T,觸發訊號T一方面係作為操作按鍵結構100以 輸入相應的字元或指令的感應訊號,同時亦作為產生驅動訊號D的指示訊號,使得控制電路170接收觸發訊號T而發出驅動訊號D。當觸覺產生器130經由電路層120的電路徑(例如第一電路徑122及第二電路徑124)接收到來自控制電路170的驅動訊號D時,觸覺產生器130可於容置空間150a中產生震動,以提供使用者確認按壓的震動回饋。 As shown in FIG. 3D, when the pressing force F is applied from the outside, the pressing force F is transmitted downward through the force transmitting unit 150 to trigger the sensing unit 160, so that the sensing unit 160 outputs the trigger signal T to the control circuit 170. The control circuit 170 receives the trigger signal T and can output the driving signal D to the haptic generator 130 to drive the haptic generator 130 to vibrate. That is, when the user presses the button structure 100 (for example, when pressing the keycap region 112 of the keycap layer 110), the support layer 140 causes the haptic generator 130 to have sufficient vibration space under the action of the pressing force, and borrows The structural characteristics of the force transmitting unit 150 (for example, the protruding portion 154 and the extending portion 156) are transmitted downward through the above two ways to trigger the sensing unit 160 to emit the trigger signal T, and the trigger signal T is used as an operation button. Structure 100 The sensing signal of the corresponding character or command is input, and also serves as an indication signal for generating the driving signal D, so that the control circuit 170 receives the trigger signal T and issues the driving signal D. When the haptic generator 130 receives the driving signal D from the control circuit 170 via the electrical path of the circuit layer 120 (for example, the first electrical path 122 and the second electrical path 124), the haptic generator 130 can be generated in the accommodating space 150a. Vibrate to provide feedback to the user to confirm the vibration of the press.
再者,於前述實施例中,延伸部156係為沿突出部154朝容置空間150a內側連續延伸的形式。然而,於其他實施例,如圖3E所示,延伸部156’可為沿突出部154’朝容置空間150a內側不連續延伸的形式,以配合實際需求增加按鍵結構的設計彈性。 Furthermore, in the foregoing embodiment, the extending portion 156 is continuously extended along the protruding portion 154 toward the inner side of the accommodating space 150a. However, in other embodiments, as shown in FIG. 3E, the extending portion 156' may be discontinuously extending along the protruding portion 154' toward the inner side of the accommodating space 150a to increase the design flexibility of the button structure in accordance with actual needs.
如圖4A及圖4B所示,於另一實施例,本發明提供一種包含多個前述實施例之按鍵結構的輸入裝置10。在此需注意,於此實施例,輸入裝置10係以鍵盤裝置為例進行說明,但於其他實施例,輸入裝置可包含一個以上的按鍵結構且以任何合宜的方式配置,不以實施例所示為限。再者,於此實施例,輸入裝置10係以圖3A之按鍵結構為例說明,但不以此為限。 As shown in FIG. 4A and FIG. 4B, in another embodiment, the present invention provides an input device 10 including a plurality of key structures of the foregoing embodiments. It should be noted that in this embodiment, the input device 10 is described by taking a keyboard device as an example. However, in other embodiments, the input device may include more than one button structure and configured in any convenient manner, not by way of example. Shown as a limit. Moreover, in this embodiment, the input device 10 is described by taking the button structure of FIG. 3A as an example, but is not limited thereto.
具體而言,如圖4A所示,輸入裝置10包含鍵帽層210、電路層220、複數觸覺產生器230、力傳導單元250、感應層260及控制電路270(參見4B)。此外,輸入裝置10進一步可選擇性包含支撐層240。於此實施例,鍵帽層210具有複數個鍵帽區212。電路層220設置於鍵帽層210下方,且電路層220之下表面對應各鍵帽區212具有電隔離的至少一第一接點222a及至少一第二接點224a。力傳導單元250設置於電路層220下方,且力傳導單元250對應複數個鍵帽區212具有複數容置空間250a,以供容置複數觸覺產生 器230。感應層260設置於力傳導單元250下方,且感應層260包含複數感應單元262分別對應複數鍵帽區212。換言之,當多個按鍵結構整合成輸入裝置10(例如鍵盤)時,各按鍵結構的元件可對應整合成單一部件層。 Specifically, as shown in FIG. 4A, the input device 10 includes a keycap layer 210, a circuit layer 220, a plurality of haptic generators 230, a force transmission unit 250, a sensing layer 260, and a control circuit 270 (see 4B). Additionally, the input device 10 can further optionally include a support layer 240. In this embodiment, the keycap layer 210 has a plurality of keycap regions 212. The circuit layer 220 is disposed under the key cap layer 210, and the lower surface of the circuit layer 220 corresponds to each of the key cap regions 212 having at least one first contact 222a and at least one second contact 224a electrically isolated. The force transmission unit 250 is disposed under the circuit layer 220, and the force transmission unit 250 has a plurality of keycap regions 212 having a plurality of accommodating spaces 250a for accommodating a plurality of haptic sensations. The device 230. The sensing layer 260 is disposed under the force conducting unit 250, and the sensing layer 260 includes a plurality of sensing units 262 corresponding to the plurality of keycap regions 212, respectively. In other words, when a plurality of key structures are integrated into the input device 10 (eg, a keyboard), the elements of each key structure can be integrated into a single component layer.
舉例而言,如圖4A及圖5A所示,複數個鍵帽區212可藉由周邊區214相互連接形成單一鍵帽層210。具體而言,鍵帽層210可依據各按鍵配置的位置於其上表面形成複數個區域界定符211,以界定出對應的鍵帽區212,而鍵帽區212之間的空間及周邊部分即形成周邊區214。類似於上述,各鍵帽區212具有對應的字符或圖案(未圖示),以指示各按鍵結構所輸入的對應指令或字符。於此實施例,鍵帽層210可具有與上述鍵帽層110類似的特性,例如材質、厚度等,於此不再贅述。 For example, as shown in FIGS. 4A and 5A, a plurality of keycap regions 212 may be interconnected by a peripheral region 214 to form a single keycap layer 210. Specifically, the keycap layer 210 can form a plurality of area delimiters 211 on the upper surface thereof according to the positions of the respective button configurations to define corresponding key cap regions 212, and the space and the peripheral portion between the keycap regions 212 are A peripheral zone 214 is formed. Similar to the above, each keycap region 212 has a corresponding character or pattern (not shown) to indicate the corresponding command or character entered by each key structure. In this embodiment, the key cap layer 210 may have similar characteristics to the above-described key cap layer 110, such as material, thickness, etc., and details are not described herein.
如圖4A及圖5B所示,電路層220設置於鍵帽層210下方,且電路層220之下表面對應各鍵帽區212具有電隔離的至少一第一接點222a及至少一第二接點224a,供電連接對應的觸覺產生器230。亦即,複數觸覺產生器230係對應複數鍵帽區212設置於電路層220下方且分別電連接對應的第一接點222a及第二接點224a。在此需注意,觸覺產生器230具有類似於上述觸覺產生器130的特性,且其與電路層220之連接方式亦可參考上述圖1A實施例之相關說明,於此不再贅述。具體而言,電路層220包含複數條第一線路222及複數條第二線路224,以分別提供驅動對應觸覺產生器230的電路徑。於一實施例,如圖5B-1所示,第一線路222的數目係對應複數觸覺產生器130的數目且複數第一線路222各具有一個第一接點222a,以分別電連接對應的觸覺產生器130。如圖5B-2所示,第二線路224的數目較佳少於觸覺產生器230的數目,且複數條第二線路224各具有一個以上的第二接點 224a,以使第二接點224a的數目對應觸覺產生器230的數目,以分別電連接對應的觸覺產生器130。於此實施例,第一線路222係作為驅動觸覺產生器230的驅動路徑,而第二路徑224係作為驅動觸覺產生器230的接地路徑。換言之,複數個觸覺產生器230的接地路徑(即第二線路224)較佳分組連接在一起,使得單一條第二線路224具有一個或至少兩個的第二接點224a,且所有第二線路224所包含的第二接點224a的總數量係與觸覺產生器230的數量相同,以達到簡化電路徑的布局,減少所需的布局面積,進而縮小輸入裝置的尺寸。 As shown in FIG. 4A and FIG. 5B, the circuit layer 220 is disposed under the keycap layer 210, and the lower surface of the circuit layer 220 corresponds to each of the keycap regions 212 having at least one first contact 222a and at least one second connection electrically isolated. Point 224a, the power supply is connected to the corresponding haptic generator 230. That is, the plurality of haptic generators 230 are disposed under the circuit layer 220 corresponding to the plurality of keycap regions 212 and electrically connected to the corresponding first and second contacts 222a, 224a, respectively. It should be noted that the haptic generator 230 has characteristics similar to those of the haptic generator 130 described above, and the manner of connection with the circuit layer 220 can also refer to the related description of the foregoing embodiment of FIG. 1A, and details are not described herein again. Specifically, the circuit layer 220 includes a plurality of first lines 222 and a plurality of second lines 224 to respectively provide an electrical path for driving the corresponding haptic generator 230. In one embodiment, as shown in FIG. 5B-1, the number of the first lines 222 corresponds to the number of the plurality of haptic generators 130 and the plurality of first lines 222 each have a first contact 222a to electrically connect the corresponding tactile senses. Generator 130. As shown in FIG. 5B-2, the number of second lines 224 is preferably less than the number of haptic generators 230, and the plurality of second lines 224 each have more than one second contact. 224a, such that the number of second contacts 224a corresponds to the number of tactile generators 230 to electrically connect the corresponding tactile generators 130, respectively. In this embodiment, the first line 222 serves as a drive path for driving the haptic generator 230, and the second path 224 serves as a ground path for driving the haptic generator 230. In other words, the ground paths of the plurality of haptic generators 230 (i.e., the second lines 224) are preferably grouped together such that the single strip second line 224 has one or at least two second contacts 224a, and all of the second lines The total number of second contacts 224a included in 224 is the same as the number of haptic generators 230, so as to simplify the layout of the electrical paths, reduce the required layout area, and thereby reduce the size of the input device.
如圖4A及圖5C所示,支撐層240係設置於電路層220及力傳導單元250之間,其中支撐層240具有複數開口240a分別對應複數鍵帽區212,且複數開口240a係供複數突出部254分別穿設於其中。類似於上述,支撐層240之硬度係大於力傳導單元250的硬度,且支撐層250之厚度係大於觸覺產生器230之厚度,以提供觸覺產生器230震動的空間。 As shown in FIG. 4A and FIG. 5C, the support layer 240 is disposed between the circuit layer 220 and the force transmission unit 250. The support layer 240 has a plurality of openings 240a corresponding to the plurality of key cap regions 212, and the plurality of openings 240a are for the plurality of protrusions. The portions 254 are respectively disposed therein. Similar to the above, the hardness of the support layer 240 is greater than the hardness of the force conducting unit 250, and the thickness of the support layer 250 is greater than the thickness of the haptic generator 230 to provide room for the haptic generator 230 to vibrate.
如圖4A及圖5D所示,力傳導單元250設置於電路層220下方,其中力傳導單元250對應複數個鍵帽區212具有複數容置空間250a,以供容置複數觸覺產生器230。具體而言,力傳導單元250包含膜片部252及複數突出部254,其中複數個突出部254係藉由膜片部252相互連接成單一力傳導單元250。亦即,類似於上述,膜片部252具有複數容置區(例如複數個通孔),且複數突出部254係分別設置於複數容置區(例如通孔)周圍並自膜片部252朝電路層220突起,以形成複數容置空間250a。類似地,當支撐層240設置於力傳導單元250之膜片部252時,複數突出部254係分別穿設於複數開口254a。再者,力傳導單元250更具有複數延伸部256,其中複數延伸部256係 自複數突出部254朝對應的容置空間250a內側延伸,且各延伸部256之頂面低於各對應突出部254之頂面。再者,延伸部256較佳係延伸於對應觸覺產生器230的下表面,以使得觸覺產生器230係部分重疊對應的延伸部256。 As shown in FIG. 4A and FIG. 5D, the force transmission unit 250 is disposed under the circuit layer 220, wherein the force transmission unit 250 has a plurality of keycap regions 212 having a plurality of accommodating spaces 250a for accommodating the plurality of haptic generators 230. Specifically, the force transmission unit 250 includes a diaphragm portion 252 and a plurality of protrusions 254, wherein the plurality of protrusions 254 are connected to each other by the diaphragm portion 252 to form a single force transmission unit 250. That is, similar to the above, the diaphragm portion 252 has a plurality of accommodating regions (for example, a plurality of through holes), and the plurality of protruding portions 254 are respectively disposed around the plurality of accommodating regions (for example, through holes) and from the diaphragm portion 252 toward The circuit layer 220 is raised to form a plurality of accommodating spaces 250a. Similarly, when the support layer 240 is disposed on the diaphragm portion 252 of the force transmission unit 250, the plurality of protrusions 254 are respectively disposed through the plurality of openings 254a. Furthermore, the force transmission unit 250 further has a plurality of extensions 256, wherein the plurality of extensions 256 are The plurality of protrusions 254 extend toward the inside of the corresponding accommodating space 250a, and the top surfaces of the extensions 256 are lower than the top surfaces of the corresponding protrusions 254. Moreover, the extension 256 preferably extends over the lower surface of the corresponding haptic generator 230 such that the haptic generator 230 partially overlaps the corresponding extension 256.
再者,如圖4A及圖4B所示,複數個感應單元262可整合於感應層260,且可藉由單一控制電路270控制多個按鍵,以簡化製造程序及組裝程序,但不以此為限。 Furthermore, as shown in FIG. 4A and FIG. 4B, a plurality of sensing units 262 can be integrated in the sensing layer 260, and a plurality of buttons can be controlled by a single control circuit 270 to simplify the manufacturing process and the assembly process, but not limit.
類似於圖1C或圖3D所示之作動說明,當外界施加按壓力於複數個鍵帽區212其中一個時,按壓力透過對應的力傳導單元250之力傳遞部分(例如突出部254、延伸部256)經由上述的兩種途徑向下傳遞以觸發對應的感應單元262,使得感應單元262輸出觸發訊號到控制電路270。觸發訊號T一方面係作為操作按鍵結構以輸入相應的字元或指令的感應訊號,同時亦作為產生驅動訊號的指示訊號,使得控制電路270接收觸發訊號而可輸出驅動訊號給對應的觸覺產生器230。當觸覺產生器230經由電路層220的電路徑(例如對應的第一電路徑222及第二電路徑224)接收到來自控制電路270的驅動訊號時,觸覺產生器230可於容置空間250a中產生震動,以提供使用者確認按壓的震動回饋。 Similar to the operation shown in FIG. 1C or FIG. 3D, when a pressing force is applied to one of the plurality of keycap regions 212, the pressing force transmits the force transmitting portion of the corresponding force transmitting unit 250 (for example, the protrusion 254, the extension portion). 256) Passing down through the above two ways to trigger the corresponding sensing unit 262, so that the sensing unit 262 outputs a trigger signal to the control circuit 270. The trigger signal T is used as an operation signal structure to input a corresponding character or an instruction signal, and also serves as an indication signal for generating a driving signal, so that the control circuit 270 receives the trigger signal and outputs a driving signal to the corresponding tactile generator. 230. When the haptic generator 230 receives the driving signal from the control circuit 270 via the electrical path of the circuit layer 220 (eg, the corresponding first electrical path 222 and the second electrical path 224), the haptic generator 230 can be disposed in the accommodating space 250a. Vibration is generated to provide the user with the vibration feedback of the pressing.
再者,如圖6所示,本發明之輸入裝置更包含黏著層280,其中黏著層280係設置於鍵帽層210下表面且位於複數鍵帽區212之外,以黏著鍵帽層210及電路層220。類似於上述,黏著層280係僅設置於鍵帽層210對應於周邊區214的下表面。換言之,黏著層280並未設置於鍵帽層210對應於鍵帽區212的下表面,使得鍵帽區212及電路層220對應鍵帽區212的部分不黏著在一起(或有空隙)。藉此,當觸覺產生器230受到驅動訊號的驅動而震 動時,可以減少觸覺產生器230發生震動時的動能損耗。亦即,若電路層220與鍵帽層210全部都黏起來時,觸覺產生器230的「負載」加重,不易產生震動,而使得動能損耗加大。再者,輸入裝置10的其餘元件(例如電路層220、支撐層240、力傳導單元250、感應單元260等)之間亦可藉由黏著方式固定,以定位各元件間的相對位置。 Furthermore, as shown in FIG. 6 , the input device of the present invention further includes an adhesive layer 280 , wherein the adhesive layer 280 is disposed on the lower surface of the key cap layer 210 and outside the plurality of key cap regions 212 to adhere the key cap layer 210 and Circuit layer 220. Similar to the above, the adhesive layer 280 is disposed only on the lower surface of the keycap layer 210 corresponding to the peripheral region 214. In other words, the adhesive layer 280 is not disposed on the lower surface of the key cap layer 210 corresponding to the key cap region 212, such that the key cap region 212 and the portion of the circuit layer 220 corresponding to the key cap region 212 are not adhered together (or have a gap). Thereby, when the haptic generator 230 is driven by the driving signal, the earthquake When moving, the kinetic energy loss when the tactile generator 230 is vibrated can be reduced. That is, when the circuit layer 220 and the key cap layer 210 are all adhered, the "load" of the tactile generator 230 is increased, vibration is less likely to occur, and the kinetic energy loss is increased. Furthermore, the remaining components of the input device 10 (eg, the circuit layer 220, the support layer 240, the force transmitting unit 250, the sensing unit 260, etc.) may also be fixed by adhesion to locate the relative positions between the components.
相較於習知技術,本發明之按鍵結構及輸入裝置藉由層疊結構達到薄型化的特性,同時藉由觸覺產生器提供按壓的觸覺回饋作為使用者操作提示。再者,本發明之按鍵結構及輸入裝置藉由電路層同時作為觸覺產生器(例如壓電材料)的基板層及電路徑層,且藉由力傳導單元作為力傳導層及支撐結構層,有助於簡化組裝程序且增加可製造性。此外,本發明之按鍵結構及輸入裝置藉由力傳導單元作為力傳導層且藉由支撐層作為支撐結構層,不僅可確保觸覺產生器具有適宜的震動空間,更可減少誤觸發感應單元的可能性。 Compared with the prior art, the button structure and the input device of the present invention are thinned by the laminated structure, and the tactile feedback of the pressing is provided by the tactile generator as a user operation prompt. Furthermore, the key structure and the input device of the present invention are simultaneously used as a substrate layer and an electrical path layer of a tactile generator (for example, a piezoelectric material) by a circuit layer, and the force transmission unit is used as a force transmission layer and a support structure layer. Helps simplify assembly procedures and increase manufacturability. In addition, the button structure and the input device of the present invention can not only ensure the suitable vibration space of the tactile generator but also reduce the possibility of erroneously triggering the sensing unit by using the force conducting unit as the force conducting layer and the supporting layer as the supporting structure layer. Sex.
本發明已由上述實施例加以描述,然而上述實施例僅為例示目的而非用於限制。熟此技藝者當知在不悖離本發明精神下,於此特別說明的實施例可有例示實施例的其他修改。因此,本發明範疇亦涵蓋此類修改且僅由所附申請專利範圍限制。 The present invention has been described by the above embodiments, but the above embodiments are for illustrative purposes only and are not intended to be limiting. It will be apparent to those skilled in the art that the embodiments specifically described herein may have other modifications of the embodiments. Accordingly, the scope of the invention is intended to cover such modifications and are only limited by the scope of the appended claims.
110‧‧‧鍵帽層 110‧‧‧Keycap layer
112‧‧‧鍵帽區 112‧‧‧Keycap area
114‧‧‧周邊區 114‧‧‧The surrounding area
150‧‧‧力傳導單元 150‧‧‧force transmission unit
150a‧‧‧容置空間 150a‧‧‧ accommodating space
152‧‧‧膜片部 152‧‧‧ Diaphragm Department
152a‧‧‧容置區 152a‧‧‧Receiving area
154‧‧‧突出部 154‧‧‧ Highlights
160‧‧‧感應單元 160‧‧‧Sensor unit
170‧‧‧控制電路 170‧‧‧Control circuit
F‧‧‧按壓力 F‧‧‧ Press pressure
T‧‧‧觸發訊號 T‧‧‧ trigger signal
Claims (14)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| TW104118372A TWI578351B (en) | 2015-06-05 | 2015-06-05 | Button structure and input device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104118372A TWI578351B (en) | 2015-06-05 | 2015-06-05 | Button structure and input device |
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| TW201643914A TW201643914A (en) | 2016-12-16 |
| TWI578351B true TWI578351B (en) | 2017-04-11 |
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| TW104118372A TWI578351B (en) | 2015-06-05 | 2015-06-05 | Button structure and input device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI646871B (en) * | 2017-06-15 | 2019-01-01 | 達方電子股份有限公司 | Multi-layer circuit board |
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| US4071718A (en) * | 1976-10-22 | 1978-01-31 | Bowmar Instrument Corporation | Flat keyboard assembly having cover type membrane with protrusions to align switch components |
| CN101477911A (en) * | 2008-01-03 | 2009-07-08 | 宏达国际电子股份有限公司 | Keyboard module and electronic device |
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| TW201643914A (en) | 2016-12-16 |
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