TWI577995B - Electronic parts conveyor and electronic parts inspection device - Google Patents

Description

Electronic component conveying device and electronic component inspection device

The present invention relates to an electronic component conveying device and an electronic component inspection device.

For example, an electronic component inspection device for inspecting electrical characteristics of an electronic component such as an IC (Integrated Circuit) device has been known, and an electronic component inspection device is assembled to transfer an IC device to an inspection. The electronic component conveying device of the holding portion of the unit. When the IC device is inspected, the IC device is placed in the holding portion, and the plurality of probes provided in the holding portion are brought into contact with the respective terminals of the IC device.

The inspection of such an IC device has a case where the IC device is cooled to a specific temperature. In this case, the arrangement member in which the IC device is disposed is cooled to cool the IC device, and the humidity of the gas atmosphere around the above-mentioned arrangement member is made in such a manner that condensation or ice formation does not occur (in the device) Humidity) is reduced.

Further, in the electronic component transporting apparatus, when jamming occurs, for example, when condensation or icing occurs on the arranging member, it is necessary to temporarily stop the operation of the electronic component conveying device and eliminate Block or remove condensation or ice. When a worker has a problem such as clogging, condensation, or ice formation, the operator presses a specific operation button to temporarily stop the operation of the electronic component conveying device, and performs a specific operation.

In the conventional electronic component conveying apparatus, when the operation button is pressed, the operation is stopped, and the following processing is performed.

First, the electronic component conveying device stops the cooling of the arrangement member, starts heating the arrangement member, and stands by until it reaches normal temperature. Thereby, condensation or icing occurs on the configuration member In the case of this, the condensation or icing is removed. Then, the electronic component conveying device unlocks the key of the door after waiting until the internal oxygen concentration becomes a sufficient concentration. The operator opens the door and confirms that the condensation or icing has been removed in the event of condensation or icing. Further, the operator moves the IC device to an appropriate position in the event of a jam.

When the job is completed, the operator presses the action start button. Thereby, the electronic component conveying device stops the heating of the arranging member, and waits for a predetermined period of time. When the internal humidity is sufficiently lowered, the cooling of the arranging member is started. Then, the electronic component transport apparatus starts (starts again) after the standby until the temperature of the arrangement member is sufficiently lowered.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. Hei 11-111802

However, in the prior electronic component conveying apparatus, if the specific operation button is pressed, the temperature of the disposition member is uniformly restored to the case where the clogging is eliminated or when dew condensation or icing is removed. Normal temperature. In the case of removing condensation or icing, it is necessary to restore the temperature of the arranging member to normal temperature, but it is not necessary to restore the temperature of the arranging member to normal temperature in the case of eliminating clogging. Therefore, in the conventional electronic component conveying apparatus, when the clogging is eliminated, it is necessary to take the time required to restore the temperature of the arranging member to the normal temperature, and the temperature of the arranging member is completed after the completion of the operation. It takes a long time to cool down to a specific temperature.

In the case of the case where the substrate processing apparatus is automatically stopped during the automatic operation, the related content of the automatic operation is restarted. However, Patent Document 1 cannot solve the above-mentioned problems.

The object of the present invention is to provide a situation in which a specific operation can be performed. The electronic component transport apparatus and the electronic component inspection apparatus are in a state in which the operation of the electronic component is performed while cooling the electronic component, and the operation is stopped until the operation is resumed.

The present invention has been made to solve at least a part of the above problems, and can be realized as the following aspects or application examples.

[Application Example 1]

The electronic component conveying apparatus of the present invention is characterized by comprising: a cooling heating member configurable with an electronic component, and at least one of cooling or heating; and an operation portion selectively stopping the cooling of the cooling heating member The first operation mode and a second operation mode in which the cooling of the cooling heating member is stopped and the cooling heating member is heated.

In this way, the operation of the electronic component conveying device that operates while cooling the cooling heating member is temporarily stopped, for example, the operation of eliminating clogging, the removal of dew condensation or icing, and the like, and the elimination of clogging are performed. When the heating operation is not required, by selecting the first operation mode, it is possible to shorten the time from when the cooling heating member is cooled to the front side until the operation is stopped, the work is performed, and the operation is restarted.

[Application Example 2]

In the electronic component conveying apparatus of the present invention, it is preferable that the cooling and heating member has at least one of a conveying unit that conveys the electronic component and an arrangement portion that arranges the electronic component.

In this case, when the transporting unit and the arranging unit are required to perform the work of eliminating clogging, removing dew condensation or icing, or the like, and eliminating the clogging, the first operation mode can be shortened by selecting the first operation mode. The state in which the transport unit and the arranging unit are operated while cooling, until the operation is stopped, the work is performed, and the operation is resumed. time.

[Application Example 3]

In the electronic component conveying apparatus of the present invention, the first operation mode is preferably selected when the electronic component is not disposed at a specific position.

Therefore, when the electronic component is placed in a specific position when the electronic component is not disposed at a specific position, the state in which the cooling member is cooled while facing the cooling member can be shortened until the electronic component is cooled. The time until the action is stopped, the job is performed, and the action is restarted.

[Application Example 4]

In the electronic component conveying apparatus of the present invention, the first operation mode is preferably selected when the member disposed inside the electronic component conveying device is adjusted.

Therefore, when the member disposed inside the electronic component conveying device is adjusted, it is possible to shorten the state in which the cooling heating member is operated while being cooled, until the operation is stopped, the work is performed, and the operation is restarted. time.

[Application 5]

In the electronic component conveying apparatus of the present invention, the second operation mode is preferably selected when the cooling and heating member is dew condensation or icing.

Thereby, dew condensation and icing can be removed by selecting the second operation mode.

[Application Example 6]

In the electronic component conveying apparatus of the present invention, preferably, in the second operation mode, when the cooling heating member is icing, the energy of heating the cooling heating member is greater than when the cooling heating member is dew condensation. The energy of the above cooling heating member is heated.

Thereby, condensation and icing can be removed efficiently and efficiently.

[Application Example 7]

In the electronic component transport device of the present invention, the operation unit preferably has a touch The panel is configured to select a display for the first operation mode and the second operation mode, and an input for selecting the first operation mode and the second operation mode.

Thereby, the first operation mode and the second operation mode can be easily selected.

[Application Example 8]

In the electronic component transport apparatus of the present invention, the operation unit preferably includes a display unit that can display a display for selecting the first operation mode and the second operation mode, and an input unit that can be used for The input of the first operation mode and the second operation mode described above is selected.

Thereby, the first operation mode and the second operation mode can be easily selected.

[Application Example 9]

In the electronic component transport apparatus of the present invention, preferably, the display position for selecting the first operation mode is higher in the vertical direction than the display position for selecting the second operation mode.

Thereby, the first operation mode with a high frequency of use can be selected easily and quickly.

[Application Example 10]

The electronic component inspection apparatus of the present invention is characterized by comprising: a cooling heating member configurable with an electronic component, and at least one of cooling or heating; and an operation portion for selectively stopping cooling of the cooling heating member An operation mode, a second operation mode for stopping cooling of the cooling heating member and heating the cooling heating member, and an inspection unit for inspecting the electronic component.

In this way, the operation of the electronic component inspection device that operates while cooling the cooling heating member is temporarily stopped. For example, it is not necessary to eliminate the clogging operation, remove dew condensation or icing, and eliminate the clogging. When heating, by selection When the first operation mode is selected, it is possible to shorten the time from when the cooling heating member is cooled to the state, until the operation is stopped, the work is performed, and the operation is restarted.

[Application Example 11]

In the electronic component inspection device of the present invention, the cooling and heating member preferably includes at least one of: a transfer unit that transports the electronic component; an arrangement portion that arranges the electronic component; and a holding portion that faces the electronic component The electronic component is held while the component is inspected, and the abutting portion abuts the electronic component to the holding portion.

In this way, the transporting unit, the arranging unit, the holding unit, and the abutting unit are selected by, for example, performing a work of eliminating clogging, removing dew condensation or icing, removing clogging, and the like without heating. In the first operation mode, it is possible to shorten the time from when the front side conveyance unit, the arrangement portion, the holding portion, and the contact portion are operated while cooling, until the operation is stopped, the work is performed, and the operation is resumed.

1‧‧‧Inspection device (electronic parts inspection device)

6‧‧‧Operation Department

11A‧‧‧Tray transport mechanism

11B‧‧‧Tray transport mechanism

12‧‧‧Temperature adjustment unit (soaking plate)

13‧‧‧Device Transfer Head

14‧‧‧Device Supply Department (Supply Shuttle)

15‧‧‧Tray transport mechanism

16‧‧‧Inspection Department

17‧‧‧Device transfer head

18‧‧‧Device Recycling Department (Recycling Shuttle)

19‧‧‧Recycling tray

20‧‧‧Device Transfer Head

21‧‧‧Tray transport mechanism

22A‧‧‧Tray transport mechanism

22B‧‧‧Tray transport mechanism

41‧‧‧Temperature Sensor

42‧‧‧Humidity sensor

43‧‧‧Oxygen concentration sensor

51‧‧‧ heating mechanism

52‧‧‧Cooling mechanism

53‧‧‧Dry air supply mechanism

61‧‧‧ Input Department

62‧‧‧Display Department

80‧‧‧Control Department

90‧‧‧IC devices

200‧‧‧Tray

621‧‧‧ screen

622‧‧‧ box

623‧‧‧1st action mode selection button

624‧‧‧2nd action mode selection button

625‧‧‧Cancel button

1‧‧‧Tray supply area

A2‧‧‧Device supply area (supply area)

A3‧‧‧ inspection area

A4‧‧‧Device recycling area (recycling area)

A5‧‧‧Tray removal area

S101‧‧‧Steps

S102‧‧‧Steps

S103‧‧‧Steps

S104‧‧‧Steps

S105‧‧‧Steps

S106‧‧‧Steps

S107‧‧‧Steps

S108‧‧‧Steps

S109‧‧‧Steps

S110‧‧‧Steps

S111‧‧‧Steps

S112‧‧‧Steps

S113‧‧‧ steps

S114‧‧‧Steps

S115‧‧‧Steps

S116‧‧‧Steps

S117‧‧‧Steps

S118‧‧‧Steps

S119‧‧‧Steps

S120‧‧‧ steps

S121‧‧‧Steps

S122‧‧‧Steps

S123‧‧‧Steps

S124‧‧‧Steps

S125‧‧‧Steps

S126‧‧‧Steps

S127‧‧‧ steps

S128‧‧‧Steps

S129‧‧‧Steps

S130‧‧‧Steps

S131‧‧‧Steps

S132‧‧‧Steps

S133‧‧‧Steps

S134‧‧‧Steps

S135‧‧‧Steps

S136‧‧‧Steps

X‧‧‧ axis (direction)

Y‧‧‧ axis (direction)

Z‧‧‧ axis (direction)

Fig. 1 is a schematic plan view showing an embodiment of an electronic component inspection device according to the present invention.

Figure 2 is a block diagram of the electronic component inspection apparatus shown in Figure 1.

Fig. 3 is a view showing a display screen of a display unit of the electronic component inspection device shown in Fig. 1;

Fig. 4 is a flow chart showing the control operation of the electronic component inspection device shown in Fig. 1.

Fig. 5 is a flow chart showing the control operation of the electronic component inspection device shown in Fig. 1.

Fig. 6 is a flow chart showing the control operation of the electronic component inspection device shown in Fig. 1.

Hereinafter, the electronic of the present invention will be described in detail based on the embodiment shown in the accompanying drawings. The parts transfer device and the electronic component inspection device will be described.

<Embodiment>

Fig. 1 is a schematic plan view showing an embodiment of an electronic component inspection device according to the present invention. Figure 2 is a block diagram of the electronic component inspection apparatus shown in Figure 1. Fig. 3 is a view showing a display screen of a display unit of the electronic component inspection device shown in Fig. 1; 4 to 6 are flowcharts showing the control operations of the electronic component inspection device shown in Fig. 1, respectively.

In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are defined as an X-axis, a Y-axis, and a Z-axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X-axis is also referred to as "X-direction", the direction parallel to the Y-axis is also referred to as "Y-direction", and the direction parallel to the Z-axis is also referred to as "Z-direction". Further, the direction of the arrow of each of the X-axis, the Y-axis, and the Z-axis is referred to as a positive side, and the direction opposite to the arrow is referred to as a negative side. Further, the upstream side of the transport direction of the electronic component is also simply referred to as "upstream side", and the downstream side is also simply referred to as "downstream side". Further, the "level" in the specification of the present application is not limited to a complete level, and includes a state of being slightly inclined (for example, less than about 5 degrees) with respect to the horizontal as long as it does not interfere with the conveyance of the electronic component.

The inspection device (electronic component inspection device) 1 shown in FIG. 1 is used, for example, for an IC device such as a BGA (Ball Grid Array) package or an LGA (Land Grid Array) package. Inspection and testing of electrical characteristics of electronic components such as LCD (Liquid Crystal Display), CIS (CMOS (Complementary Metal Oxide Semiconductor) Image Sensor, CMOS image sensor) (hereinafter referred to as "inspection" ")s installation. In the following, for convenience of explanation, the case where the IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as "IC device 90".

As shown in Fig. 1, the inspection apparatus 1 is divided into a tray supply area A1, a device supply area (hereinafter simply referred to as "supply area") A2, an inspection area A3, a device collection area (hereinafter simply referred to as "recycling area") A4, and a tray. Area A5 is removed. Moreover, the IC device 90 is supplied from the tray. The area A1 to the tray removal area A5 are sequentially passed through the above-mentioned areas, and are inspected in the inspection area A3 on the way. Therefore, the inspection apparatus 1 is an electronic component transport apparatus including the control unit 80, and an inspection unit 16 that performs inspection in the inspection area A3, and an inspection control unit (not shown). Further, in the inspection apparatus 1, the electronic component transport apparatus is configured by a configuration other than the inspection unit 16 and the inspection control unit.

The tray supply area A1 is supplied with an area of the tray 200 on which a plurality of IC devices 90 in an unchecked state are arranged. In the tray supply area A1, a plurality of trays 200 can be stacked.

The supply area A2 supplies a plurality of IC devices 90 from the tray 200 of the tray supply area A1 to the area of the inspection area A3. Further, the tray transport mechanisms 11A and 11B that transport the tray 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

In the supply region A2, a temperature adjustment unit (soak plate) 12, a device transfer head (transport member) 13, and a tray transfer mechanism 15 as arrangement portions of the IC device 90 are provided.

The temperature adjustment unit 12 heats or cools a plurality of IC devices 90 to adjust (control) the IC device 90 to a temperature suitable for inspection. That is, the temperature adjustment unit 12 is a cooling heating member that can dispose the IC device 90 and can perform at least one of cooling and heating of the IC device 90. In the configuration shown in FIG. 1, two temperature adjustment portions 12 are disposed and fixed in the Y direction. Further, the IC device 90 on the tray 200 carried in (transferred) from the tray supply area A1 by the tray transport mechanism 11A is transported and placed on any one of the temperature adjustment units 12.

The device transfer head 13 is movably supported within the supply area A2. Thereby, the device transfer head 13 can be responsible for the transfer of the IC device 90 between the tray 200 and the temperature adjustment unit 12 carried in from the tray supply area A1, and the IC device 90 between the temperature adjustment unit 12 and the device supply unit 14 described below. Transfer. Furthermore, the device transfer head 13 has a plurality of solids holding the IC device 90 In the holding portion (not shown), each of the holding portions includes a suction nozzle, and is held by the adsorption IC device 90.

The tray transport mechanism 15 is a mechanism that transports the empty tray 200 in a state in which all of the IC devices 90 have been removed in the X direction. Then, after the conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, a device supply unit (supply shuttle) 14 as an electronic component transport unit for transporting the IC device 90, an inspection unit 16, a device transfer head (abutment portion) 17, and a device recovery unit are provided. Recycling shuttle) 18.

The device supply unit 14 transports the temperature-adjusted (temperature-controlled) IC device 90 to a device in the vicinity of the inspection unit 16. The device supply unit 14 is supported to be movable in the X direction between the supply area A2 and the inspection area A3. Further, in the configuration shown in FIG. 1, two device supply units 14 are disposed in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported and placed on any one of the device supply units 14. Further, in the device supply unit 14, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection. That is, the device supply unit 14 is a cooling heating member that can dispose the IC device 90 and can perform at least one of cooling and heating of the IC device 90.

The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90, that is, holds the holding portion of the IC device 90 when the IC device 90 is inspected. The inspection unit 16 is provided with a plurality of probes electrically connected to the terminals of the IC device 90 while the IC device 90 is held. Moreover, the terminals of the IC device 90 are electrically connected (contacted) to the probe, and the inspection of the IC device 90 is performed via the probe. The inspection of the IC device 90 is performed based on the program stored in the memory unit of the inspection control unit included in the tester (not shown) connected to the inspection unit 16. Further, in the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection. That is, the inspection unit 16 can configure the IC device 90 and can perform at least one of cooling and heating of the IC device 90. Cooling the heating element.

The device transfer head 17 is movably supported within the inspection area A3. Thereby, the device transfer head 17 can transport and mount the IC device 90 on the device supply unit 14 carried in from the supply region A2 to the inspection unit 16. Further, when the IC device 90 is inspected, the device transfer head 17 presses the IC device 90 toward the inspection portion 16, whereby the IC device 90 is brought into contact with the inspection portion 16. Thereby, as described above, the terminal of the IC device 90 is electrically connected to the probe of the inspection portion 16. Further, the device transfer head 17 has a plurality of holding portions (not shown) for holding the IC device 90, and each of the holding portions includes a suction nozzle and is held by the adsorption IC device 90. Further, in the device transfer head 17, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection. That is, the device transfer head 17 is a cooling heating member that can dispose the IC device 90 and can perform at least one of cooling and heating of the IC device 90.

The device recovery unit 18 is a device that transports the IC device 90 that has been inspected by the inspection unit 16 to the collection area A4. The device recovery unit 18 is supported to be movable between the inspection area A3 and the collection area A4 along the X direction. Further, in the configuration shown in FIG. 1, the device recovery unit 18 is disposed in the Y direction in the same manner as the device supply unit 14, and the IC device 90 on the inspection unit 16 is transported and placed in either of them. Device recovery unit 18. This transfer is performed by the device transfer head 17.

The recovery area A4 is the area where the IC device 90 of the inspection is completed. In the collection area A4, a collection tray 19, a device transfer head (transport member) 20, and a tray conveyance mechanism 21 are provided. Further, in the collection area A4, the empty tray 200 is also prepared.

The recovery tray 19 is fixed in the collection area A4, and in the configuration shown in Fig. 1, three collection trays 19 are arranged along the X direction. Further, the empty trays 200 are also arranged in three along the X direction. Then, the 1C device 90 that has moved to the device recovery unit 18 of the recovery area A4 is transported and placed on any of the recovery trays 19 and the empty trays 200. Thereby, the IC device 90 is recovered and classified for each inspection result.

The device transfer head 20 is movably supported within the recovery area A4. Thereby, the device The transfer head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. Further, the device transfer head 20 has a plurality of holding portions (not shown) for holding the IC device 90, and each of the holding portions includes a suction nozzle and is held by the adsorption IC device 90.

The tray transport mechanism 21 is a mechanism that transports the empty tray 200 carried in from the tray removal area A5 in the X direction. Further, after the transfer, the empty tray 200 is placed at the position where the IC device 90 is collected, that is, it can be one of the above three empty trays 200.

The tray removal area A5 collects and removes the area of the tray 200 of the plurality of IC devices 90 in which the inspection has been completed. A plurality of trays 200 may be stacked in the tray removal area A5.

Further, the tray transport mechanisms 22A and 22B that transport the tray 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a mechanism that transports the tray 200 on which the IC device 90 that has completed the inspection is carried out from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a mechanism that transports the empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

The inspection control unit of the above-described tester checks the electrical characteristics and the like of the IC device 90 disposed in the inspection unit 16 based on, for example, a program stored in a memory unit (not shown).

Further, the control unit 80 controls, for example, the first tray transport mechanism 11A, the second tray transport mechanism 11B, the temperature adjustment unit 12, the first device transport head 13, the device supply unit 14, the third tray transport mechanism 15, the inspection unit 16, and the first The driving of each of the device transfer head 17, the device recovery unit 18, the third device transfer head 20, the sixth tray transfer mechanism 21, the fourth tray transfer mechanism 22A, and the fifth tray transfer mechanism 22B.

Further, the inspection apparatus 1 is configured to allow a low-humidity air, a gas such as nitrogen gas (hereinafter also referred to as dry air) to be circulated (supplied) to a specific portion. When the IC device 90 is cooled to a specific temperature and inspected, the necessary portions are cooled accordingly. However, by allowing the dry air to flow to the necessary portions, dew condensation and ice formation (ice accretion) can be prevented. Furthermore, in the present embodiment, the dry air flows through the temperature adjustment unit 12, the device supply unit 14, and the inspection unit 16. And device recycling unit 18.

Further, as described above, in the present embodiment, the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the device transfer head 17 are provided, and the IC device 90 is contacted to cool the IC device 90. In the following description, the case where the temperature adjustment unit 12 is a cooling heating member will be described as a representative, and the device supply unit 14, the inspection unit 16, and the device transfer head 17 are cooled. The case of the heating member is the same as that of the temperature adjustment unit 12, and the description thereof will be omitted.

Further, as shown in FIG. 2, the inspection apparatus 1 has a temperature sensor 41 for detecting temperature, a humidity sensor 42 for detecting humidity, an oxygen concentration sensor 43 for detecting oxygen concentration, and a heating mechanism 51 for heating the temperature adjustment portion 12. The cooling mechanism 52 of the cooling temperature adjustment unit 12, the dry air supply unit 53 that supplies dry air to a specific portion inside the inspection apparatus 1, and the operation unit 6 that performs each operation of the inspection apparatus 1. The temperature sensor 41, the humidity sensor 42 and the oxygen concentration sensor 43 are respectively disposed at specific positions inside the inspection device 1 by the temperature sensor 41, the humidity sensor 42, and the oxygen concentration sensor. 43, the temperature, humidity, and oxygen concentration inside the inspection device 1 can be detected separately.

Further, the operation unit 6 includes an input unit 61 that performs each input, and a display unit 62 that displays an image. The input unit 61 is not particularly limited, and examples thereof include a keyboard, a mouse, and the like. In addition, the display unit 62 is not particularly limited, and examples thereof include a liquid crystal display panel, an organic EL (Electroluminescence) display panel, and the like. Further, some or all of the operation buttons displayed on the display unit 62 may be provided as a mechanical operation button such as a push button. In addition, the operation unit 6 is not limited thereto, and examples thereof include a device that can input and display an image such as a touch panel.

Further, the heating mechanism 51 is not particularly limited, and examples thereof include a heater and the like. In addition, the cooling mechanism 52 is not particularly limited, and examples thereof include a device that cools a refrigerant (for example, a low-temperature gas) to a tube disposed in the vicinity of the object to be cooled, and a device such as a Peltier element. Furthermore, in the present embodiment, the cooling mechanism 52 uses the above The means for circulating the refrigerant to the inside of the tube disposed in the vicinity of the object to be cooled is cooled, and nitrogen gas obtained by vaporizing the liquid is used as the refrigerant.

Further, in the case where the dry air used in the dry air supply means 53 is being cooled by the cooling means 52, the dry air used in the cooling mechanism 52 is nitrogen and low humidity air after use in the cooling mechanism 52. The gas is mixed, and when the above cooling has been stopped, it is only the above-mentioned low humidity air. Therefore, the oxygen concentration inside the inspection apparatus 1 is low when it is being cooled by the cooling mechanism 52, and is gradually increased when the cooling is stopped.

The inspection device 1 includes a first operation mode (LN2 stop mode) and a second operation mode (defrost mode), and is configured as an operation mode (maintenance mode), and is configured to selectively set the first operation mode and the second operation mode. Action mode.

Each of the first operation mode and the second operation mode is an operation mode set in a case where the IC device 90 is inspected while cooling the IC device 90, that is, a temperature adjustment portion facing the inspection device 1 ( When the cooling and heating member 12 is cooled and dehumidified inside the inspection apparatus 1 and is operated, the operation of the inspection apparatus 1 is temporarily stopped, for example, a specific operation such as maintenance is performed. The first operation mode and the second operation mode can be selected by an operator (operator) operating the input unit 61 of the operation unit 6.

The first operation mode is selected in the case where the clogging is performed, the operation of eliminating the clogging is performed, and the adjustment of the specific member disposed inside the inspection apparatus 1 is performed, and the temperature of the temperature adjustment unit 12 is not required. Temporarily restored to normal temperature.

The above clogging is, for example, the IC device 90 is not disposed at a specific position (appropriate position) or the like.

In addition, as an adjustment of the specific member, for example, adjustment of the position, posture, light receiving sensitivity, and the like of the photosensor that detects whether or not the temperature adjustment unit 12 is disposed with the IC device 90 is provided, and the device has a light-emitting portion and a light-receiving portion. Adjustment of the holding force (adsorption force) of the holding portion of the transfer head 13 and the like.

In the first operation mode, the cooling of the temperature adjustment unit 12 of the inspection apparatus 1 is temporarily stopped, but the process of returning the temperature of the temperature adjustment unit 12 to the normal temperature is not performed.

Further, the second operation mode is selected, for example, in the inside of the inspection apparatus 1, for example, the temperature adjustment unit 12, condensation or ice formation (accumulation) occurs, and the condensation or icing is removed. In the second operation mode, the processing of the temperature adjustment unit 12 of the inspection apparatus 1 is temporarily stopped, and the temperature adjustment unit 12 of the inspection apparatus 1 is heated to temporarily return the temperature of the temperature adjustment unit 12 to the normal temperature. . Thereby, the above condensation or icing is removed.

Next, the control operation of the inspection device 1 will be described.

Further, in the present embodiment, the operation of the operation unit 6 of the worker is completed, for example, by operating the input unit 61 to move the cursor to the position of each operation button (icon) displayed on the display unit 62. Select (click), and this operation is also referred to as "pressing the operation button". In addition, as described above, the case where the temperature adjustment unit 12 cools the heating member will be described as a representative, and the device supply unit 14, the inspection unit 16, and the device transfer head 17 are cooled and heated, respectively, and the temperature adjustment unit 12 The situation is the same, so the description is omitted.

As shown in FIGS. 4 to 6, the inspection device 1 is operated by the control unit 80 while cooling the temperature adjustment unit 12 by the cooling mechanism 52 and supplying dry air by the dry air supply unit 53. Further, the temperature t cooled by the cooling mechanism 52 is set to the temperature t1. Also, the shutter of the inspection device 1 has been locked. First, in this operation, the control unit 80 determines whether or not the operation is stopped (step S101).

As described above, for example, in the case where the clogging is performed to eliminate the clogging, the specific member disposed inside the inspection device 1 is adjusted, condensation or icing occurs in the temperature adjusting portion 12, and the condensation is removed or In the case of icing or the like, the operator presses the operation stop button to temporarily stop the operation of the inspection device 1.

In step S101, when the action stop button has been pressed, it is determined as Stop the action.

Further, as described above, the temperature adjustment unit 12 is provided with a photo sensor (not shown) that detects the IC device 90. With the photosensor, whether or not the IC device 90 transported from the tray 200 to the temperature adjustment unit 12 by the device transfer head 13 is disposed in the temperature adjustment unit 12 is detected. Then, when the IC device 90 is not detected, it is determined that clogging has occurred, and in step S101, it is determined that the operation is stopped. Therefore, there is a case where it is determined that the operation is stopped even when the operator does not press the operation stop button.

When it is determined in step S101 that the operation is stopped, the device transfer heads 13, 17, 20, the device supply unit 14, the device recovery unit 18, the tray transport mechanisms 11A, 11B, 15, 21, 22A, 22B, etc. are caused. The operation is stopped (step S102). However, the cooling of the temperature adjusting unit 12 by the cooling mechanism 52 and the supply of the dry air by the dry air supply unit 53 are continued without stopping.

Then, on the display unit 62, the image shown in FIG. 3 is displayed (step S103).

The image shown in FIG. 3 has a display for selecting the first operation mode and the second operation mode. Specifically, first, it is displayed as "stopped" on the upper left side of FIG. 3 of the screen 621 of the display unit 62. Further, in the rectangular frame 622 of the central portion of the screen 621, a first operation mode selection button 623 described as "LN2 stop mode", a second operation mode selection button 624 described as "defrosting mode", and The cancel button 625 is described as "cancel".

When the input unit 61 is operated and input, and the first operation mode selection button 623 is pressed, the first operation mode is selected, and the operation mode is set to the first operation mode.

When the input unit 61 is operated and input, and the second operation mode selection button 624 is pressed, the second operation mode is selected, and the operation mode is set to the second operation mode.

When the input unit 61 is operated and input is pressed, and the cancel button 625 is pressed, the cancel is selected, and the operation mode is not set to any of the first operation mode and the second operation mode, and the image of the display unit 62 is changed to the first. 1 operation mode selection button 623, second operation mode Other images that are not displayed by the selection button 624 and the cancel button 625 are selected.

Here, the first operation mode selection button 623 and the second operation mode selection button 624 are arranged in the vertical direction (the upper and lower directions in FIG. 3). Further, the first operation mode selection button 623 is disposed above the second operation mode selection button 624 in the vertical direction. That is, the display position for selecting the first operation mode is higher in the vertical direction than the display position for selecting the second operation mode. The position of the operation button is easier to operate in the vertical direction than in the lower direction, and the frequency of use of the first operation mode is higher than that in the second operation mode. Therefore, the first operation mode selection button 623 is disposed in the second operation mode. The selection button 624 is further above the vertical direction, and the first operation mode selection button 623 that selects the first operation mode having a high frequency of use can be easily and quickly operated.

Further, the first operation mode selection button 623 can be displayed more emphasized than the second operation mode selection button 624. Thereby, the position of the first operation mode selection button 623 can be grasped easily and quickly. As an emphasis display, for example, an enlarged size (size), an increase in brightness, and the like can be cited. In other words, the size of the first operation mode selection button 623 is larger than the size of the second operation mode selection button 624, or the brightness of the first operation mode selection button 623 is higher than the brightness of the second operation mode selection button 624.

Then, it is determined whether or not the first operation mode has been selected (step S104). When it is determined that the first operation mode has been selected, the operation mode is set to the first operation mode, and the process proceeds to step S107.

Further, when it is determined in step S104 that the first operation mode is not selected, it is determined whether or not the second operation mode has been selected (step S105), and when it is determined that the second operation mode has been selected, the operation is performed. The mode is set to the second operation mode, and the process proceeds to step S120.

Further, when it is determined in step S105 that the second operation mode is not selected, it is determined whether or not the cancellation has been selected (step S106), and when it is determined that the cancellation has been selected, the operation mode is not set to the first. Any one of the action mode and the second action mode, On the other hand, the image of the display unit 62 is changed to a specific image, and the process proceeds to the next step. In addition, the description of the subsequent operation will be omitted.

Moreover, if it is determined in step S106 that the cancel is not selected, the process returns to step S104, and the steps from step S104 onward are executed again.

When the operation mode is set to the first operation mode, first, the driving of the cooling mechanism 52 is stopped, and the cooling of the temperature adjustment unit 12 is stopped (step S107). Thereby, the dry air supplied by the dry air supply means 53 becomes air containing only low humidity, and the oxygen concentration inside the inspection apparatus 1 gradually increases.

Then, the oxygen concentration a inside the inspection apparatus 1 is detected by the oxygen concentration sensor 43 (step S108), and it is judged whether or not the oxygen concentration a is equal to or greater than the threshold value α (step S109), and it is determined that the oxygen concentration a is not the threshold value. In the case of α or more, the process returns to step S108, and the steps subsequent to step S108 are executed again.

Moreover, when it is determined in step S109 that the oxygen concentration a is equal to or greater than the threshold value α, the door of the inspection device 1 is unlocked (step S110). Thereby, the oxygen-deficient state inside the inspection apparatus 1 is eliminated, and work can be performed inside. The operator opens the door to perform a specific job. Further, after the work is completed, the operator presses the operation start button.

Further, the threshold α is not particularly limited and may be appropriately set according to each condition, but is preferably set in a range of 16% or more and 20% or less, and more preferably in a range of 17% or more and 19% or less. . Then, whether or not the action start button has been pressed is determined (step S111), and when it is determined that the action start button has been pressed, the current temperature is detected by the temperature sensor 41 (step S112), by the humidity sensor 42 detects the current humidity RH (step S113).

Then, the relative humidity RHS is obtained (step S114).

The method of calculating the relative humidity RHS in the step S114 is not particularly limited, and examples thereof include the following methods.

First, the following (Formula 1) is used, based on the temperature detected in step S112, and The humidity RH detected in step S113 is calculated by calculating the amount M of water vapor contained in the current gas inside the inspection apparatus 1.

The amount of water vapor M = (the saturated water vapor amount of the current temperature MN) × (humidity RH / 100) ... (Formula 1)

In addition, the saturated water vapor amount MN and the saturated water vapor amount ML at the specific temperature t1 described below are obtained by, for example, a calibration curve stored in advance in a memory portion of the control unit 80 or a calculation formula.

Next, the relative humidity RHS at the time of cooling to the specific temperature t1 is calculated using the following (Formula 2).

Relative humidity RHS=(water vapor amount M/saturated water vapor amount ML at a specific temperature t1)×100... (Formula 2)

Furthermore, in theory, when cooling to the above specific temperature t1, if the relative humidity RHS is 100%, condensation or icing will occur, and if the relative humidity RHS is less than 100%, condensation or icing will not occur. .

Then, it is determined whether or not the relative humidity RHS is equal to or less than the threshold value β (step S115). When it is determined that the relative humidity RHS is not equal to or less than the threshold value β, the process returns to step S112, and the steps from step S112 onward are performed again.

When it is determined in step S115 that the relative humidity RHS is equal to or less than the threshold value β, the cooling mechanism 52 is driven to start cooling of the temperature adjustment unit 12 (step S116). Thereby, condensation or icing can be prevented from occurring when cooling to a specific temperature t1.

In addition, the threshold value β is not particularly limited as long as it does not cause dew condensation or icing when it is cooled to the temperature t1, and may be appropriately set according to each condition, but is preferably set to 50% or more and less than 100%. In the range, it is more preferably set to 80% or more and less than 100%, and further preferably set to 80% or more and 90% or less.

Then, the temperature t inside the inspection device 1 is detected by the temperature sensor 41 (step S117), and it is determined whether the temperature t is equal to or lower than the temperature (threshold value) t1 (step S118). When it is judged that the temperature t is not equal to or lower than the temperature t1, the process returns to step S117, and the steps subsequent to step S117 are performed again. Further, in the first operation mode, the heating of the temperature adjustment unit 12 in the second operation mode described below is not performed, so that the time when the temperature t is equal to or lower than the temperature t1 is shorter than the second operation mode.

Further, when it is determined in step S118 that the temperature t is equal to or lower than the temperature t1, the shutter is locked, and the device transfer heads 13, 17, 20, the device supply portion 14, the device recovery portion 18, and the tray transfer are started (restarted). The operations of the mechanisms 11A, 11B, 15, 21, 22A, 22B, etc. (step S119), and the migration to the next step. In addition, the description of the subsequent operation will be omitted.

Next, a case where the operation mode is set to the second operation mode will be described, but the description of the same items as the above-described first operation mode will be omitted.

When the operation mode is set to the second operation mode, first, the driving of the cooling mechanism 52 is stopped, and the cooling of the temperature adjustment unit 12 is stopped (step S120). Thereby, the dry air supplied by the dry air supply means 53 becomes air containing only low humidity, and the oxygen concentration inside the inspection apparatus 1 gradually increases.

Then, the heating mechanism 51 is driven to start heating of the temperature adjustment unit 12 (step S121). Thereby, the temperature inside the inspection apparatus 1 also rises together with the temperature of the temperature adjustment part 12. Thereby, when condensation or icing occurs in the temperature adjustment portion 12, the condensation or icing is removed.

Here, it is preferable to change the energy of the heating temperature adjusting unit 12 when the temperature adjusting unit 12 is condensed with the temperature adjusting unit 12 when condensation occurs. That is, when the temperature adjusting portion 12 is icing, the energy of the heating temperature adjusting portion 12 is preferably larger than the energy of the heating temperature adjusting portion 12 when the temperature adjusting portion 12 is dew condensation. Thereby, condensation and icing can be removed efficiently and efficiently.

Then, the oxygen concentration a inside the inspection apparatus 1 is detected by the oxygen concentration sensor 43 (step S122), and it is judged whether or not the oxygen concentration a is equal to or greater than the threshold α (steps) S123), when it is determined that the oxygen concentration a is not equal to or greater than the threshold value α, the process returns to step S122, and the steps from step S122 onward are performed again.

When it is determined in step S123 that the oxygen concentration a is equal to or greater than the threshold value α, the temperature t inside the inspection device 1 is detected by the temperature sensor 41 (step S124). Thereby, the oxygen-deficient state inside the inspection apparatus 1 is eliminated, and work can be performed inside.

Then, it is judged whether or not the temperature t is equal to or higher than the temperature (threshold value) t2 (step S125), and when it is determined that the temperature t is not higher than the temperature t2, the process returns to step S124, and the steps from step S124 onward are performed again.

Moreover, when it is determined in step S125 that the temperature t is equal to or higher than the temperature t2, the shutter of the inspection device 1 is unlocked (step S126). The operator opens the door to perform a specific job. Further, when the operator dew condensation or icing occurs in the temperature adjustment unit 12, the operator confirms that the condensation or icing has been removed. After the work is completed, the operator presses the action start button.

Further, the temperature t2 is not particularly limited and may be appropriately set according to each condition, but is preferably set in the range of 25 ° C or more and 35 ° C or less, more preferably in the range of 27 ° C % or more and 33 ° C. .

Then, it is determined whether or not the operation start button has been pressed (step S127). When it is determined that the operation start button has been pressed, the driving of the heating mechanism 51 is stopped, and the heating of the temperature adjustment unit 12 is stopped (step S128).

Then, the current temperature is detected by the temperature sensor 41 (step S129), and the current humidity RH is detected by the humidity sensor 42 (step S130), and the relative humidity RHS is obtained (step S131). Further, the calculation method of the relative humidity RHS in the step S131 is not particularly limited, and is, for example, the same as the above-described step S114.

Then, it is determined whether or not the relative humidity RHS is equal to or less than the threshold value β (step S132), and when it is determined that the relative humidity RHS is not equal to or less than the threshold value β, the process returns to the step. In S129, the steps subsequent to step S129 are performed again.

When it is determined in step S132 that the relative humidity RHS is equal to or lower than the threshold value β, the cooling mechanism 52 is driven to start cooling of the temperature adjustment unit 12 (step S133). Thereby, condensation or icing can be prevented from occurring when cooling to a specific temperature t1.

Then, the temperature t inside the inspection apparatus 1 is detected by the temperature sensor 41 (step S134), and it is judged whether the temperature t is equal to or lower than the temperature (threshold value) t1 (step S135), and it is judged that the temperature t is not the temperature t1. In the following case, the process returns to step S134, and the steps subsequent to step S134 are executed again.

Further, when it is determined in step S135 that the temperature t is equal to or lower than the temperature t1, the shutter is locked, and the device transfer heads 13, 17, 20, the device supply portion 14, the device recovery portion 18, and the tray transfer are started (restarted). The operations of the mechanisms 11A, 11B, 15, 21, 22A, 22B, etc. (step S136), and the transition to the next step. In addition, the description of the subsequent operation will be omitted.

As described above, the inspection apparatus 1 temporarily stops the operation of the inspection apparatus 1 that operates the front side cooling temperature adjustment unit 12, and performs, for example, an operation for eliminating clogging and a specific member disposed inside the inspection apparatus 1. In the case of adjustment, dew condensation, or removal of icing, etc., when heating or the like is required to eliminate the clogging operation or the adjustment of the specific member, the first operation mode can be selected to shorten the cooling temperature from the positive side. The state in which the adjustment unit 12 is operated until the operation is stopped, the work is performed, and the operation is resumed.

Although the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention have been described above based on the embodiments shown in the drawings, the present invention is not limited thereto, and the configuration of each unit may be replaced with any configuration having the same function. Further, any other constituents may be added.

Further, in the above embodiment, the cooling and heating members in the electronic component inspection device are the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the device transfer head 17, but In the invention, the present invention is not limited thereto. For example, any one, two, or three of the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the device transfer head 17 may be used.

621‧‧‧ screen

622‧‧‧ box

623‧‧‧1st action mode selection button

624‧‧‧2nd action mode selection button

625‧‧‧Cancel button

Claims (12)

An electronic component conveying apparatus characterized by comprising: a cooling heating member configurable with an electronic component, and at least one of cooling or heating; and an operation portion selectively stopping the cooling of the cooling heating member An operation mode and a second operation mode for stopping the cooling of the cooling heating member and heating the cooling heating member. The electronic component transport apparatus according to claim 1, wherein the cooling and heating member has at least one of a transport unit that transports the electronic component and an arrangement unit that arranges the electronic component. The electronic component transport apparatus according to claim 1 or 2, wherein the first operation mode is selected when the electronic component is not disposed at a specific position. The electronic component conveying apparatus according to claim 1 or 2, wherein the first operation mode is selected when a member disposed in the electronic component conveying device is adjusted. The electronic component transport apparatus according to claim 1 or 2, wherein the second operation mode is selected when the cooling and heating member is dew condensation or icing. The electronic component conveying apparatus according to claim 1 or 2, wherein in the second operation mode, when the cooling heating member is icing, the energy of heating the cooling heating member is greater than when the cooling heating member is dew condensation The energy of the above cooling heating member is heated. The electronic component transport device of claim 1 or 2, wherein the operation unit has a touch panel, wherein the touch panel is configured to select a display of the first operation mode and the second operation mode, and to select the 1 Input mode and input of the above second operation mode. The electronic component transporting apparatus according to claim 1 or 2, wherein the operation unit includes: a display unit that can display a display for selecting the first operation mode and the second operation mode; and an input unit that can be used for The input of the first operation mode and the second operation mode described above is selected. The electronic component transport apparatus according to claim 7, wherein the display position for selecting the first operation mode is higher in the vertical direction than the display position for selecting the second operation mode. The electronic component transporting apparatus of claim 8, wherein the display position for selecting the first operation mode is higher in the vertical direction than the display position for selecting the second operation mode. An electronic component inspection apparatus characterized by comprising: a cooling heating member configurable with an electronic component, and at least one of cooling and heating; and an operation portion for selectively stopping cooling of the cooling heating member An operation mode, a second operation mode for stopping cooling of the cooling heating member and heating the cooling heating member, and an inspection unit for inspecting the electronic component. The electronic component inspection device according to claim 11, wherein the cooling and heating member includes at least one of: a conveyance unit that conveys the electronic component; an arrangement portion that arranges the electronic component; and a holding portion that performs the electronic component In the case of inspection, the electronic component is held; and the abutting portion abuts the electronic component to the holding portion.